JP5205163B2 - Terminal crimping state pass / fail judgment device, terminal crimping processing device, terminal crimping state pass / fail judgment method, and terminal crimping state pass / fail judgment program - Google Patents

Terminal crimping state pass / fail judgment device, terminal crimping processing device, terminal crimping state pass / fail judgment method, and terminal crimping state pass / fail judgment program Download PDF

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JP5205163B2
JP5205163B2 JP2008193363A JP2008193363A JP5205163B2 JP 5205163 B2 JP5205163 B2 JP 5205163B2 JP 2008193363 A JP2008193363 A JP 2008193363A JP 2008193363 A JP2008193363 A JP 2008193363A JP 5205163 B2 JP5205163 B2 JP 5205163B2
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哲也 矢野
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Shinmaywa Industries Ltd
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Description

この発明は、電線に端子を圧着する際に端子圧着状態の良否判別を行う技術に関する。   The present invention relates to a technique for determining pass / fail of a terminal crimping state when a terminal is crimped to an electric wire.

端子圧着状態の不良を検出する方法として、特許文献1に開示のものがある。特許文献1では、端子圧着時に検出した圧力の時間的変化波形を、所定の基準波形等と比較することで、圧着状態の良否を判別している。   As a method for detecting a defect in the terminal crimping state, there is a method disclosed in Patent Document 1. In Patent Document 1, the quality of the crimped state is determined by comparing the temporal change waveform of the pressure detected when the terminal is crimped with a predetermined reference waveform or the like.

特開昭63−281071号公報JP-A 63-281071

しかしながら、端子圧着を連続的に行う場合、周辺振動環境を一定とすることは難しい。例えば、端子圧着の際に発生する振動の影響は、次回の端子圧着時にも残存する。この振動は、端子圧着時に検出される圧力波形にも影響を与える。   However, when the terminal crimping is performed continuously, it is difficult to make the surrounding vibration environment constant. For example, the influence of vibration generated during terminal crimping remains even at the next terminal crimping. This vibration also affects the pressure waveform detected during terminal crimping.

このため、端子圧着時に検出される圧力波形は、良品として判別されるべき圧着状態であっても、異なる形を持つ圧力波形として観察され得る。このように圧力波形は周辺振動環境による影響を受けるため、特許文献1に記載のように、単一の基準と比較するだけでは、周辺振動環境に応じて精度よく圧着良否を判別することは困難となる。   For this reason, the pressure waveform detected at the time of terminal crimping can be observed as a pressure waveform having a different shape even in a crimped state to be identified as a non-defective product. As described above, since the pressure waveform is affected by the surrounding vibration environment, as described in Patent Document 1, it is difficult to accurately determine whether the pressure bonding is good or not according to the surrounding vibration environment only by comparing with a single reference. It becomes.

そこで、本発明は、周辺振動環境の影響をなるべく考慮して、精度よく圧着良否判別を行うことを目的とする。   In view of the above, an object of the present invention is to accurately determine whether or not the crimping is performed in consideration of the influence of the surrounding vibration environment as much as possible.

上記課題を解決するため、第1の態様に係る端子圧着状態良否判別装置は、電線に端子を圧着する端子圧着処理を連続的に行う際に、端子の圧着良否判別を行う端子圧着状態良否判別装置であって、端子圧着に伴って検出される圧力波形が入力される圧力波形入力部と、複数の圧着良否判別基準を記憶する記憶部と、前記複数の圧着良否判別基準のうちの一つと前記圧力波形とに基づいて、端子の圧着良否判別を行う良否判別部と、を備え、前記良否判別部は、前記端子圧着処理を行う際の周辺振動環境の変動に応じて、連続的な端子圧着処理の途中で、前記圧着良否判別基準を変更するものである。 In order to solve the above-mentioned problem, the terminal crimping state pass / fail judgment device according to the first aspect performs terminal crimping pass / fail judgment for performing terminal crimping pass / fail judgment when the terminal crimping process for crimping a terminal to an electric wire is continuously performed. A pressure waveform input unit to which a pressure waveform detected along with terminal crimping is input; a storage unit that stores a plurality of crimping quality determination criteria; and one of the plurality of crimping quality determination criteria; A pass / fail discriminating unit that discriminates whether or not the terminal is crimped based on the pressure waveform, and the pass / fail discriminating unit is a continuous terminal according to a change in a surrounding vibration environment when the terminal crimping process is performed. In the middle of the crimping process, the criterion for determining whether or not the crimping is good is changed.

第2の態様は、第1の態様に係る端子圧着状態良否判別装置であって、前記記憶部は、前記複数の圧着良否判別基準として複数の基準波形を記憶し、前記良否判別部は、前記複数の基準波形のうちの一つと前記圧力波形とを比較して、端子の圧着良否判別を行うものである。   A second aspect is a terminal crimping state pass / fail judgment device according to the first aspect, wherein the storage unit stores a plurality of reference waveforms as the plurality of crimp pass / fail judgment criteria, One of a plurality of reference waveforms is compared with the pressure waveform to determine whether the terminal is crimped.

第3の態様は、第1又は第2の態様に係る端子圧着状態良否判別装置であって、前記良否判別部は、端子を供給する端子供給機構部及び電線の端部を処理して供給する電線処理機構部の動作状況に応じて、端子圧着関連動作に応じて前記圧着良否判別基準を変更するものである。 A 3rd aspect is a terminal crimping | compression-bonding state quality determination apparatus which concerns on the 1st or 2nd aspect, Comprising : The said quality determination part processes and supplies the terminal supply mechanism part which supplies a terminal, and the edge part of an electric wire. According to the operation state of the wire processing mechanism section, the crimping pass / fail judgment criterion is changed according to the terminal crimping related operation.

第4の態様は、電線に端子を圧着する端子圧着処理を連続的に行う際に、端子の圧着良否判別を行う端子圧着状態良否判別装置であって、端子圧着に伴って検出される圧力波形が入力される圧力波形入力部と、複数の圧着良否判別基準を記憶する記憶部と、前記複数の圧着良否判別基準のうちの一つと前記圧力波形とに基づいて、端子の圧着良否判別を行う良否判別部と、を備え、前記良否判別部は、連続的な端子圧着処理の途中であって、連続的な端子圧着開始後1回目の端子圧着と2回目以降の端子圧着との間で前記圧着良否判別基準を変更するものである。 A fourth aspect is a terminal crimping state determination device for determining whether a terminal is crimped or not when a terminal crimping process for crimping a terminal to an electric wire is continuously performed, and a pressure waveform detected along with terminal crimping Is determined based on the pressure waveform input unit, a storage unit for storing a plurality of crimping quality determination criteria, and one of the plurality of crimping quality determination criteria and the pressure waveform. A pass / fail discriminator, and the pass / fail discriminator is in the middle of a continuous terminal crimping process , between the first terminal crimping and the second and subsequent terminal crimps after the start of continuous terminal crimping. This is to change the criterion for determining whether or not the bonding is good.

第5の態様は、第4の態様に係る端子圧着状態良否判別装置であって、前記良否判別部は、前記圧力波形入力部を通じて入力される前記圧力波形に基づく端子圧着間隔が所定期間よりも大きいときに1回目の端子圧着が行われたと判断し、前記端子圧着間隔が所定期間よりも小さいときに2回目以降の端子圧着が行われたと判断するものである。   A 5th aspect is a terminal crimping | compression-bonding quality determination apparatus which concerns on a 4th aspect, Comprising: The said quality determination part has a terminal crimping interval based on the said pressure waveform input through the said pressure waveform input part more than predetermined period. When it is larger, it is determined that the first terminal crimping has been performed, and when the terminal crimping interval is smaller than a predetermined period, it is determined that the second and subsequent terminal crimping has been performed.

第6の態様は、端子圧着を行う一対の圧着型と、前記一対の圧着型を相対的に接近及び離隔移動させる圧着駆動部と、前記一対の圧着型に設けられ、端子圧着に伴う圧力波形を検出する圧力検出部と、第1〜第5のいずれかの態様に係る端子圧着状態良否判別装置と、を備えるものである。   A sixth aspect is provided with a pair of crimping dies for terminal crimping, a crimp driving unit that relatively moves the pair of crimping dies closer to and away from each other, and a pressure waveform accompanying the terminal crimping. The pressure detection part which detects this, and the terminal crimping | compression-bonding quality determination apparatus which concerns on any one of the 1st-5th aspect are provided.

第7の態様は、電線に端子を圧着する端子圧着処理を連続的に行う際に、端子の圧着良否判別を行う端子圧着状態良否判別方法であって、(a)端子圧着に伴って検出される圧力波形と圧着良否判別基準とに基づいて端子の圧着良否判別を行うステップと、(b)端子圧着に伴って検出される圧力波形と、前記工程(a)における圧着良否判別基準とは別の圧着良否判別基準とに基づいて、端子の圧着良否判別を行うステップとを、前記端子圧着処理を行う際の周辺振動環境の変動に応じて、連続的な端子圧着処理の途中で変更して実行するものである。 A seventh aspect is a terminal crimping state determination method for determining whether or not a terminal is crimped when a terminal crimping process for crimping a terminal to an electric wire is continuously performed, and is detected along with (a) terminal crimping. The step of determining the crimping quality of the terminal based on the pressure waveform and the crimping quality judgment criterion, (b) the pressure waveform detected along with the terminal crimping, and the crimping quality judgment standard in the step (a). The step of determining whether or not the terminal is crimped based on the crimping criterion for the crimping is changed in the middle of the continuous terminal crimping process according to the fluctuation of the surrounding vibration environment when the terminal crimping process is performed. It is something to execute.

第8の態様は、電線に端子を圧着する端子圧着処理を連続的に行う際に、端子圧着に伴って検出される圧力波形に基づいて端子の圧着良否判別を行うための端子圧着状態良否判別プログラムであって、コンピュータに、(a)端子圧着に伴って検出される圧力波形と圧着良否判別基準とに基づいて端子の圧着良否判別を行う処理と、(b)端子圧着に伴って検出される圧力波形と、前記工程(a)における圧着良否判別基準とは別の圧着良否判別基準とに基づいて、端子の圧着良否判別を行う処理とを、前記端子圧着処理を行う際の周辺振動環境の変動に応じて、連続的な端子圧着処理の途中で変更して行わせる処理を実現させるものである。
In the eighth aspect, when the terminal crimping process for crimping the terminal to the electric wire is continuously performed, the terminal crimping state determination for determining whether the terminal is crimped based on the pressure waveform detected along with the terminal crimping is performed. (A) a process for determining whether or not a terminal is crimped based on a pressure waveform and a criterion for determining whether or not the terminal is crimped, and (b) a process that is detected along with the terminal crimping. And a process for determining whether or not the terminal is crimped based on a pressure waveform and a criterion for determining whether or not the crimp is good in the step (a), and a peripheral vibration environment when performing the terminal crimping process. In accordance with the fluctuations, it is possible to realize a process that is changed in the middle of the continuous terminal crimping process.

第1の態様によると、前記良否判別部は、連続的な端子圧着処理の途中で、圧着良否判別基準を変更する。このため、周辺振動環境の変動に応じて適切な圧着良否判別基準を用いて、圧着良否判別を行うことができ、周辺振動環境の影響をなるべく考慮して、精度よく圧着良否判別を行うことができる。   According to the first aspect, the pass / fail judgment unit changes the crimp pass / fail judgment criteria during the continuous terminal crimping process. For this reason, it is possible to perform the crimping pass / fail judgment using an appropriate crimp pass / fail judgment standard according to the fluctuation of the surrounding vibration environment, and to perform the crimping pass / fail judgment with high accuracy in consideration of the influence of the surrounding vibration environment as much as possible. it can.

第2の態様によると、周辺振動環境の変動に応じた適切な基準波形を用いることで、周辺振動環境の影響をなるべく考慮して、精度よく圧着良否判別を行うことができる。   According to the second aspect, by using an appropriate reference waveform according to the fluctuation of the surrounding vibration environment, it is possible to accurately determine whether or not the crimping is performed in consideration of the influence of the surrounding vibration environment as much as possible.

第3の態様によると、端子圧着関連動作に応じて前記圧着良否判別基準の変更タイミングを決定することで、周辺振動環境の変動に応じて適切なタイミングで圧着良否判別基準を変更することができる。   According to the third aspect, by determining the change timing of the crimping quality determination criterion according to the terminal crimping related operation, the crimping quality determination criterion can be changed at an appropriate timing according to the fluctuation of the surrounding vibration environment. .

第4の態様によると、連続的な圧着開始後1回目の端子圧着と2回目以降の端子圧着との間で前記圧着良否判別基準を変更することで、周辺振動環境の変動に応じた適切なタイミングで、圧着良否判別基準を変更することができる。   According to the fourth aspect, by changing the crimping pass / fail judgment criterion between the first terminal crimping and the second and subsequent terminal crimping after the start of continuous crimping, an appropriate response according to the fluctuation of the surrounding vibration environment At the timing, it is possible to change the criterion for determining whether or not the bonding is good.

第5の態様によると、振動の減衰を考慮した振動影響に変動に応じた適切なタイミングで、圧着良否判別基準を変更することができる。   According to the fifth aspect, it is possible to change the crimping determination criterion at an appropriate timing according to the fluctuation in the vibration effect considering the vibration attenuation.

第6の態様によると、周辺振動環境の変動に応じて適切な圧着良否判別基準を用いて、圧着良否判別を行うことができ、周辺振動環境の影響をなるべく考慮して、精度よく圧着良否判別を行うことができる。   According to the sixth aspect, it is possible to perform crimping quality determination using an appropriate crimping quality determination standard according to changes in the surrounding vibration environment, and accurately determine the bonding quality with consideration of the influence of the surrounding vibration environment as much as possible. It can be performed.

第7の態様によると、周辺振動環境の変動に応じて適切な圧着良否判別基準を用いて、圧着良否判別を行うことができ、周辺振動環境の影響をなるべく考慮して、精度よく圧着良否判別を行うことができる。   According to the seventh aspect, it is possible to perform crimping quality determination using an appropriate crimping quality determination criterion according to changes in the surrounding vibration environment, and to accurately determine the bonding quality based on the influence of the surrounding vibration environment as much as possible. It can be performed.

第8の態様によると、周辺振動環境の変動に応じて適切な圧着良否判別基準を用いて、圧着良否判別を行うことができ、周辺振動環境の影響をなるべく考慮して、精度よく圧着良否判別を行うことができる。   According to the eighth aspect, it is possible to perform crimping quality determination using an appropriate crimping quality determination standard according to changes in the surrounding vibration environment, and accurately determine the bonding quality with consideration of the influence of the surrounding vibration environment as much as possible. It can be performed.

以下、実施の形態に係る端子圧着加工装置について説明する。   Hereinafter, the terminal crimping apparatus according to the embodiment will be described.

図1は端子圧着加工装置10を示す概略正面図であり、図2は端子圧着機構装置20を示す概略側面図である。   FIG. 1 is a schematic front view showing a terminal crimping apparatus 10, and FIG. 2 is a schematic side view showing a terminal crimping mechanism apparatus 20.

この端子圧着加工装置10は、端子圧着機構装置20と端子圧着状態良否判別装置30とを備えている。端子圧着機構装置20は、電線12の端部に端子14を圧着する端子圧着処理を連続的に行う装置であり、端子圧着状態良否判別装置30は端子の圧着良否判別を行う装置である。   The terminal crimping apparatus 10 includes a terminal crimping mechanism device 20 and a terminal crimping state pass / fail discrimination device 30. The terminal crimping mechanism device 20 is a device that continuously performs a terminal crimping process for crimping the terminal 14 to the end of the electric wire 12, and the terminal crimping state pass / fail judgment device 30 is a device that judges the crimping quality of the terminal.

<1.端子圧着機構装置>
端子圧着機構装置20は、横向きにした略U字状の支持部材21と、一対の圧着型22,25と、圧着駆動部26と、圧力検出部24とを備えている。
<1. Terminal crimping mechanism device>
The terminal crimping mechanism device 20 includes a substantially U-shaped support member 21 that is turned sideways, a pair of crimping dies 22 and 25, a crimping drive unit 26, and a pressure detection unit 24.

一対の圧着型22,25は、下側の圧着型22と上側の圧着型25とを有しており、それらの間で端子14を圧着可能に構成されている。   The pair of crimping dies 22, 25 has a lower crimping die 22 and an upper crimping die 25, and the terminal 14 can be crimped between them.

下側の圧着型22は、支持部材21の下部ベース部21a上に上向き突出で取付けられている。また、下部ベース部21aには、下側の圧着型22に隣設して支持台22aが取付けられている。そして、端子14の圧着部14aを下側の圧着型22上に載置すると共に、端子14の他の部分を支持台22a上に載置した状態で、端子14が載置状に支持可能に構成されている。   The lower crimping die 22 is mounted on the lower base portion 21 a of the support member 21 so as to protrude upward. A support base 22a is attached to the lower base portion 21a so as to be adjacent to the lower crimping die 22. And while the crimping | compression-bonding part 14a of the terminal 14 is mounted on the lower crimping | compression-bonding type | mold 22, the terminal 14 can be supported in mounting state in the state which mounted the other part of the terminal 14 on the support stand 22a. It is configured.

また、下部ベース部21a内であって下側の圧着型22の下方に、当該下側の圧着型22と接触した状態で圧力伝達部材23が配設されている。また、圧力伝達部材23の下方に、当該圧力伝達部材23と接触した状態で圧力検出部24が配設されている。そして、端子圧着時に下側の圧着型22に作用する圧力が、圧力伝達部材23を介して圧力検出部24に伝達されるように構成されている。圧力検出部24は、ひずみゲージ、ピエゾ素子、光ファイバ式圧力センサ等、圧力に応じた電気信号を出力するセンサによって構成されている。そして、端子圧着時に生じた圧力が圧力伝達部材23を介して圧力検出部24に伝達されると、圧力検出部24はその圧力変化に応じた圧力波形を電気信号として出力するように構成されている。   In addition, a pressure transmission member 23 is disposed in the lower base portion 21 a and below the lower crimping die 22 in contact with the lower crimping die 22. A pressure detection unit 24 is disposed below the pressure transmission member 23 in contact with the pressure transmission member 23. And it is comprised so that the pressure which acts on the crimping | compression-bonding type | mold 22 of the lower side at the time of terminal crimping may be transmitted to the pressure detection part 24 via the pressure transmission member 23. FIG. The pressure detection unit 24 includes a sensor that outputs an electrical signal corresponding to pressure, such as a strain gauge, a piezoelectric element, or an optical fiber pressure sensor. When the pressure generated during terminal crimping is transmitted to the pressure detection unit 24 via the pressure transmission member 23, the pressure detection unit 24 is configured to output a pressure waveform corresponding to the pressure change as an electrical signal. Yes.

なお、上記圧力検出部24は、上側の圧着型25側に組込まれていてもよいし、一対の圧着型22,25の双方側に組込まれていてもよい。後者の場合、それぞれで検出される圧力波形のそれぞれに対して後述する圧着良否判別処理を行ってもよいし、それぞれの検出波形の平均波形に対して後述する圧着良否判別処理を行ってもよい。   The pressure detector 24 may be incorporated on the upper crimping die 25 side or on both sides of the pair of crimping die 22 and 25. In the latter case, a crimping pass / fail discrimination process described later may be performed on each of the pressure waveforms detected in each, or a crimp pass / fail discrimination process described later may be performed on the average waveform of each detected waveform. .

また、圧着駆動部26は、トグルリンク機構、エアシリンダ、油圧シリンダ等により構成されており、上記支持部材21の上方支持部分21bに設けられている。圧着駆動部26には、上側の圧着型25が垂下状姿勢で昇降可能に支持されている。この圧着駆動部26の駆動により、上型の圧着型25が下側の圧着型22に対して接近及び離隔移動されるように構成されている。なお、圧着駆動部26は、一対の圧着型22,25を相対的に接近及び離隔移動させる構成であればよい。   The crimp driving unit 26 includes a toggle link mechanism, an air cylinder, a hydraulic cylinder, and the like, and is provided on the upper support portion 21 b of the support member 21. An upper crimping die 25 is supported on the crimping drive unit 26 so as to be lifted and lowered in a hanging posture. The upper crimping die 25 is moved toward and away from the lower crimping die 22 by driving the crimping drive unit 26. In addition, the crimping | compression-bonding drive part 26 should just be the structure which moves a pair of crimping | die crimping | die 22 and 25 relatively and apart.

また、この端子圧着機構装置20には、複数の端子14を連続的に下側の圧着型22に供給する端子供給機構部28と、電線12を予め設定された所定長に切断し、その端部を皮剥ぎして端子14の圧着部14a内に配設する処理を連続的に行う電線処理機構部29とが組込まれている。そして、電線12に端子14を圧着する端子圧着処理を連続的に行えるように構成されている。これらの端子供給機構部28及び電線処理機構部29については、周知構成を含む種々構成を適用可能であるので、詳細な説明は省略する。   Further, the terminal crimping mechanism device 20 includes a terminal supply mechanism unit 28 that continuously supplies the plurality of terminals 14 to the lower crimping die 22, and the electric wire 12 is cut into a predetermined length, and ends thereof An electric wire processing mechanism 29 for continuously performing the process of peeling the part and disposing it in the crimping part 14a of the terminal 14 is incorporated. And it is comprised so that the terminal crimping process which crimps | bonds the terminal 14 to the electric wire 12 can be performed continuously. Since various configurations including known configurations can be applied to the terminal supply mechanism section 28 and the wire processing mechanism section 29, detailed description thereof will be omitted.

<2.端子圧着状態良否判別装置>
図3は端子圧着状態良否判別装置30を示すブロック図である。端子圧着状態良否判別装置30は、上記圧力検出部24で検出された圧力波形を入力可能に当該圧力検出部24に電気的に接続されており、その圧力波形に基づいて端子の圧着良否判別を行うように構成されている。
<2. Terminal crimping condition pass / fail judgment device>
FIG. 3 is a block diagram showing the terminal crimping state pass / fail discrimination device 30. The terminal crimping state pass / fail discrimination device 30 is electrically connected to the pressure detection unit 24 so that the pressure waveform detected by the pressure detection unit 24 can be input, and the terminal crimping pass / fail judgment is made based on the pressure waveform. Configured to do.

より具体的には、端子圧着状態良否判別装置30は、CPU32、内部記憶装置34、外部記憶装置35等がバスライン31を介して相互接続された一般的なコンピュータによって構成されている。内部記憶装置34は、基本プログラム等を格納したROM及びデータを一時的に保持するRAM等を含んでおり、外部記憶装置35はフラッシュメモリ或はハードディスク装置等の不揮発性の記憶装置によって構成されている。外部記憶装置35には、後述する圧着良否判別処理を行うための判別プログラム35aが格納されている。この判別プログラム35aに従って、主制御部としてのCPU32が演算処理を行うことにより、後述するように端子14の圧着良否判別を行う良否判別部等の各種機能が実現されるように構成されている。判別プログラム35aは、通常、予め外部記憶装置35に格納されるものであるが、CD−ROM或はDVD−ROM、フラッシュメモリ等の記録媒体に記録された状態で提供され、或は、ネットワークを介した外部サーバからのダウンロードなどにより提供され、追加的又は交換的に外部記憶装置35に格納されるものであってもよい。   More specifically, the terminal crimping state pass / fail judgment device 30 is configured by a general computer in which a CPU 32, an internal storage device 34, an external storage device 35, and the like are interconnected via a bus line 31. The internal storage device 34 includes a ROM that stores basic programs and the like, and a RAM that temporarily stores data, and the external storage device 35 is configured by a nonvolatile storage device such as a flash memory or a hard disk device. Yes. The external storage device 35 stores a discrimination program 35a for performing a crimping pass / fail discrimination process described later. The CPU 32 as the main control unit performs arithmetic processing in accordance with the determination program 35a, so that various functions such as a pass / fail determination unit for determining the pass / fail determination of the terminal 14 as described later are realized. The discrimination program 35a is normally stored in advance in the external storage device 35, but is provided in a state of being recorded on a recording medium such as a CD-ROM, DVD-ROM, flash memory, or the like. It may be provided by downloading from an external server through the Internet, and may be stored in the external storage device 35 in addition or exchange.

また、上記外部記憶装置35には、複数の圧着良否判別基準として第1基準波形PWb1及び第2基準波形PWb2が記憶されると共に、基準圧着間隔T2が予め設定された値として記憶されている。後述する良否判別処理は、これらの第1基準波形PWb1、第2基準波形PWb2及び基準圧着間隔T2を参照して行われる。なお、第1基準波形PWb1及び第2基準波形PWb2の設定処理については後述する。また、基準圧着間隔T2は、後述する入力部38を通じて予め入力設定された値として記憶される。   The external storage device 35 stores a first reference waveform PWb1 and a second reference waveform PWb2 as a plurality of crimping quality determination criteria, and a reference crimping interval T2 is stored as a preset value. The quality determination process described later is performed with reference to the first reference waveform PWb1, the second reference waveform PWb2, and the reference crimping interval T2. The setting process of the first reference waveform PWb1 and the second reference waveform PWb2 will be described later. The reference crimping interval T2 is stored as a value input and set in advance through the input unit 38 described later.

また、この端子圧着状態良否判別装置30では、圧力波形入力回路部36、信号出力回路部37、入力部38及び表示部39も、バスライン31に接続されている。   In the terminal crimping state pass / fail discrimination device 30, the pressure waveform input circuit unit 36, the signal output circuit unit 37, the input unit 38 and the display unit 39 are also connected to the bus line 31.

圧力波形入力回路部36は、AD変換回路等によって構成されており、圧力検出部24で検出された圧力波形がアナログ信号で入力されると、これをデジタル信号に変換するように構成されている。この圧力波形入力回路部36でデジタル信号に変換された圧力波形は、逐次内部記憶装置34或は外部記憶装置35に記憶され、後述する基準波形生成処理及び圧着良否判別処理に供される。   The pressure waveform input circuit unit 36 is configured by an AD conversion circuit or the like. When the pressure waveform detected by the pressure detection unit 24 is input as an analog signal, the pressure waveform input circuit unit 36 is configured to convert the pressure waveform into a digital signal. . The pressure waveform converted into a digital signal by the pressure waveform input circuit unit 36 is sequentially stored in the internal storage device 34 or the external storage device 35, and used for a reference waveform generation process and a crimping pass / fail determination process described later.

信号出力回路部37は、CPU32による制御下、他の機器への制御信号等を出力する出力回路である。ここでは、後述するように端子圧着機構装置20に対するエラー停止信号及び動作許可信号が、信号出力回路部37を介して出力され、端子圧着機構装置20に与えられる。   The signal output circuit unit 37 is an output circuit that outputs a control signal and the like to other devices under the control of the CPU 32. Here, as will be described later, an error stop signal and an operation permission signal for the terminal crimping mechanism device 20 are output via the signal output circuit unit 37 and given to the terminal crimping mechanism device 20.

入力部38は、各種スイッチ、タッチパネル等により構成されており、基準波形生成開始指示及び圧着良否判別処理開始指示等、本端子圧着状態良否判別装置30に対する諸指示を受付可能に構成されている。   The input unit 38 includes various switches, a touch panel, and the like, and is configured to receive various instructions for the terminal crimping state pass / fail discrimination device 30 such as a reference waveform generation start instruction and a press pass / fail judgment processing start instruction.

表示部39は、液晶表示装置、ランプ等により構成されており、CPU32による制御下、端子圧着の良否判別結果、圧力波形等の諸情報を表示可能に構成されている。   The display unit 39 includes a liquid crystal display device, a lamp, and the like, and is configured to be able to display various information such as a result of determining whether or not the terminal is crimped and a pressure waveform under the control of the CPU 32.

なお、上記端子圧着状態良否判別装置30が行う一部或は全部の機能は、専用の論理回路等でハードウェア的に実現されてもよい。   Note that some or all of the functions performed by the terminal crimping state pass / fail judgment device 30 may be realized by hardware using a dedicated logic circuit or the like.

<3.端子圧着状態良否判別装置の処理>
端子圧着状態良否判別装置30の基準波形生成処理及び端子14の圧着良否判別処理について説明する。
<3. Processing of terminal crimping state pass / fail judgment device>
The reference waveform generation process of the terminal crimping state pass / fail judgment device 30 and the crimp quality judgment process of the terminal 14 will be described.

<3.1.基準波形生成処理>
図4は基準波形生成処理を示すフローチャートである。
<3.1. Reference waveform generation processing>
FIG. 4 is a flowchart showing the reference waveform generation process.

まず、本装置の利用者等が、端子圧着機構装置20に端子圧着開始指示を与えると共に、端子圧着状態良否判別装置30に基準波形生成開始指示を与える。すると、圧力検出部24で検出された圧力波形が、時間tの経過と圧力Pの変化を示す圧力波形情報として圧力波形入力回路部36を通じて入力される。この際の波形は、図5に示すように、比較的小さな上向き凸波形後に比較的大きな上向き凸波形が連なる圧着波形PWS1,PWS2(以下では、このように圧着によって生ずる圧力波形部分を、単に圧着波形ということがある)が、間隔をあけて連続的に連なる波形として観測される。なお、上記圧着波形は、端子14の種類等によって異なるため、必ずしも上記のような波形形状として観測されるわけではない。   First, a user or the like of this apparatus gives a terminal crimping start instruction to the terminal crimping mechanism apparatus 20 and gives a reference waveform generation start instruction to the terminal crimping state pass / fail judgment apparatus 30. Then, the pressure waveform detected by the pressure detection unit 24 is input through the pressure waveform input circuit unit 36 as pressure waveform information indicating the passage of time t and the change in the pressure P. As shown in FIG. 5, the waveforms at this time are the crimp waveforms PWS1 and PWS2 (hereinafter referred to as pressure waveform portions generated by the crimping as described above), in which a relatively large upward convex waveform is connected after a relatively small upward convex waveform. May be observed as a continuous waveform at intervals. In addition, since the said crimping waveform changes with kinds etc. of the terminal 14, it is not necessarily observed as a waveform shape as mentioned above.

端子圧着状態良否判別装置30は、基準波形生成開始指示を受付けると、ステップS1において、1回目の圧着波形PWS1を予め設定されたサンプリング期間TSにおいてサンプリングする。圧着波形PWS1の有無は、例えば、圧力Pが予め設定された基準圧力値Pa以上になったか否か(或は基準圧力値Paよりも大きくなったか否か)をもって判断するとよい。所定の基準圧力値Paは、例えば、過去に行った試行結果に基づき、圧着波形の圧力ピーク値に対する数十%値として決定した値を用いることができる。また、サンプリング期間TSは、例えば、圧力Pが所定の基準圧力値Paになった時間taをサンプリング基準時間taとして、その前の期間TSa及びその後の期間TSbとで規定される期間TSとして設定することができる。その前の期間TSa及びその後の期間TSbは、上記サンプリング基準時間taを基準として圧着良否判別上有効な圧着波形が現れる期間として実験的に或は経験的に判断された値を用いることができる。もっとも、圧力波形の有無及びサンプリング期間の設定は、上記例に限られない。例えば、一定の圧力範囲内でサンプリングしてもよいし、端子圧着機構装置20における圧着動作に連動して所定期間内でサンプリングしてもよい。もっとも、圧力波形の変化に応じてサンプリングを行うことで、端子圧着機構装置20からの動作信号を受けることなくサンプリングを行うことができ、構成の簡易化を図ることができる。   When receiving the reference waveform generation start instruction, the terminal crimping state pass / fail judgment device 30 samples the first crimping waveform PWS1 in a preset sampling period TS in step S1. The presence or absence of the crimp waveform PWS1 may be determined, for example, based on whether or not the pressure P is equal to or higher than a preset reference pressure value Pa (or whether or not it is greater than the reference pressure value Pa). As the predetermined reference pressure value Pa, for example, a value determined as a value of several tens of percent with respect to the pressure peak value of the crimping waveform based on past trial results can be used. Further, the sampling period TS is set as a period TS defined by the preceding period TSa and the subsequent period TSb, for example, with the time ta when the pressure P reaches a predetermined reference pressure value Pa as the sampling reference time ta. be able to. For the previous period TSa and the subsequent period TSb, values determined experimentally or empirically as periods in which a crimping waveform effective for the judgment of crimping quality can be used with reference to the sampling reference time ta. However, the presence / absence of the pressure waveform and the setting of the sampling period are not limited to the above example. For example, sampling may be performed within a certain pressure range, or sampling may be performed within a predetermined period in conjunction with the crimping operation in the terminal crimping mechanism device 20. However, by performing sampling according to the change in the pressure waveform, sampling can be performed without receiving an operation signal from the terminal crimping mechanism device 20, and the configuration can be simplified.

ステップS1終了後、端子圧着状態良否判別装置30は、ステップS2において、2回目の圧着波形PWS2をサンプリングする。圧着波形PWS2の有無及びサンプリング期間TSは、上記と同様に判断或は設定することができる。   After step S1, the terminal crimping state pass / fail discrimination device 30 samples the second crimping waveform PWS2 in step S2. The presence / absence of the crimp waveform PWS2 and the sampling period TS can be determined or set in the same manner as described above.

なお、端子圧着機構装置20における1回目の端子圧着と2回目の端子圧着との間隔、つまり、1回目の圧着波形PWS1と2回目の圧着波形PWS2との間隔T1は、後述する所定期間である基準圧着間隔T2よりも小さくなるように、設定されている。   The interval between the first terminal crimping and the second terminal crimping in the terminal crimping mechanism device 20, that is, the interval T1 between the first crimping waveform PWS1 and the second crimping waveform PWS2 is a predetermined period to be described later. It is set to be smaller than the reference crimping interval T2.

ステップS2終了後、端子圧着状態良否判別装置30は、ステップS3において、ステップS1においてサンプリングされた圧着波形PWS1を第1基準波形PWb1に設定すると共に、ステップS2においてサンプリングされた圧着波形PWS2を第2基準波形PWb2に設定して、それぞれ外部記憶装置35に記憶させる。この後、基準波形生成処理を終了する。   After step S2, the terminal crimping state pass / fail discrimination device 30 sets the crimping waveform PWS1 sampled in step S1 to the first reference waveform PWb1 in step S3 and the second crimping waveform PWS2 sampled in step S2. The reference waveform PWb2 is set and stored in the external storage device 35, respectively. Thereafter, the reference waveform generation process is terminated.

図6は、圧着波形例を示す図である。同図において、1回目の圧着波形PWS1例を実線で、2回目の圧着波形PWS2例を破線で示している。同図に示すように、2回目の圧着波形PWS2例では、1回目の圧着波形PWS1例よりも、凹凸の変化差が大きいことがわかる。この原因は、1回目の圧着時の振動影響が、2回目の圧着時に影響を及しているからであると想定される。そこで、後述するように、実際の連続的な端子圧着処理においても、処理開始後の1回目の圧着に関しては、1回目の圧着波形PWS1を基準波形PWb1として用いて良否判別を行い、2回目以降の圧着に関しては、2回目の圧着波形PWS2を基準波形PWb1として用いて良否判別を行うことで、周辺振動環境に応じた適切な基準波形PWb1,PWb2によって適切な良否判別を行うことができる。   FIG. 6 is a diagram illustrating an example of a crimp waveform. In the figure, an example of the first crimping waveform PWS1 is indicated by a solid line, and an example of the second crimping waveform PWS2 is indicated by a broken line. As shown in the figure, it can be seen that the difference in unevenness is larger in the second crimp waveform PWS2 example than in the first crimp waveform PWS1 example. It is assumed that this is because the vibration effect at the first press bonding has an influence at the second press bonding. Therefore, as will be described later, even in actual continuous terminal crimping processing, regarding the first crimping after the processing is started, pass / fail judgment is performed using the first crimping waveform PWS1 as the reference waveform PWb1, and the second and subsequent times. With respect to the crimping, the pass / fail determination is performed using the second press-bonding waveform PWS2 as the reference waveform PWb1, so that the appropriate pass / fail determination can be performed based on the appropriate reference waveforms PWb1 and PWb2 according to the surrounding vibration environment.

なお、上記第1基準波形PWb1及び第2基準波形PWbは、端子14の種類及び電線12の種類等で特定される端子加工条件に対する圧着良否判別基準として用いられることが好ましい。このため、端子14の種類及び電線12の種類等の端子加工条件が変った場合には、新たに別の第1基準波形PWb1及び第2基準波形PWbをサンプリングすることが好ましい。もっとも、端子14の種類及び電線12の種類変更が、検出されるべき圧力波形に影響を与えない或はあまり影響を与えない程度の変更である場合には、同一の第1基準波形PWb1及び第2基準波形PWbを圧着良否判別基準として用いてもよい。   The first reference waveform PWb1 and the second reference waveform PWb are preferably used as crimping quality determination criteria for terminal processing conditions specified by the type of the terminal 14, the type of the electric wire 12, and the like. For this reason, when terminal processing conditions, such as the kind of terminal 14 and the kind of electric wire 12, change, it is preferable to sample another 1st reference waveform PWb1 and 2nd reference waveform PWb. Of course, when the change in the type of the terminal 14 and the type of the electric wire 12 is such a change that does not affect the pressure waveform to be detected or does not significantly affect it, the same first reference waveform PWb1 and second You may use 2 reference | standard waveform PWb as a crimping | crimped_quality determination criterion.

また、上記基準波形生成処理は端子14の圧着処理を行う度に必ず行う必要はない。例えば、既に行った基準波形生成処理により、特定の端子14及び特定の電線12に関して、第1基準波形PWb1及び第2基準波形PWb2が得られている場合には、当該第1基準波形PWb1及び第2基準波形PWb2を用いて後述する端子14の圧着状態良否判別を行ってもよい。   The reference waveform generation process is not necessarily performed every time the terminal 14 is crimped. For example, when the first reference waveform PWb1 and the second reference waveform PWb2 are obtained for the specific terminal 14 and the specific electric wire 12 by the already performed reference waveform generation processing, the first reference waveform PWb1 and the second reference waveform PWb1 You may perform the crimping | crimped state determination of the terminal 14 mentioned later using 2 reference | standard waveform PWb2.

<3.2.端子の圧着良否判別処理>
端子圧着状態良否判別装置30は、基本的には、第1基準波形PWb1及び第2基準波形PWbのうちの一つと圧力波形とに基づいて、端子14の圧着良否判別を行い、かつ、連続的な端子圧着処理の途中で、基準として用いる第1基準波形PWb1及び第2基準波形PWbを変更する処理を実行する。
<3.2. Terminal crimping judgment process>
The terminal crimping state pass / fail judgment device 30 basically judges the crimping quality of the terminal 14 based on one of the first reference waveform PWb1 and the second reference waveform PWb and the pressure waveform, and continuously. During the terminal crimping process, a process of changing the first reference waveform PWb1 and the second reference waveform PWb used as a reference is executed.

この端子14の圧着良否判別処理について、図7に示すフローチャートを用いてより具体的に説明する。   The crimping quality determination process for the terminal 14 will be described more specifically with reference to the flowchart shown in FIG.

すなわち、利用者等が、端子圧着機構装置20に連続的な端子圧着開始指示を与えると共に、端子圧着状態良否判別装置30に圧着良否判別処理開始指示を与える。すると、圧力検出部24で検出された圧力波形が圧力波形入力回路部36を通じて入力される。この際の圧力波形は、図8に示すように、圧着波形PW(1),PW(2),PW(3)・・・PW(n−1),PW(n),PW(n+1)・・・が、間隔をあけて連続的に連なる波形として観測される。   That is, a user or the like gives a terminal crimping start instruction to the terminal crimping mechanism device 20 and also gives a crimping pass / fail judgment processing start instruction to the terminal crimping state pass / fail judgment device 30. Then, the pressure waveform detected by the pressure detection unit 24 is input through the pressure waveform input circuit unit 36. As shown in FIG. 8, the pressure waveforms at this time are as follows: crimping waveforms PW (1), PW (2), PW (3)... PW (n−1), PW (n), PW (n + 1).・ ・ Is observed as a continuous waveform at intervals.

端子圧着状態良否判別装置30は、圧着良否判別処理開始指示を受付けると、ステップS11において、圧着波形PW(N)(Nは自然数)有りと判断すると、圧着波形PW(N)のサンプリングを行い、その後、ステップS12に進む。圧着波形PW(N)の有無及びサンプリング期間は、上記基準波形生成処理の場合と同様に判断或は設定すればよい。   When the terminal crimping state pass / fail judgment device 30 receives the crimping pass / fail judgment start instruction, if it is judged that there is a crimp waveform PW (N) (N is a natural number) in step S11, the crimping waveform PW (N) is sampled. Thereafter, the process proceeds to step S12. The presence / absence of the crimp waveform PW (N) and the sampling period may be determined or set as in the case of the reference waveform generation process.

ステップS12では、前回圧着波形取得からの経過期間TPが所定の基準圧着間隔T2以上であるか否か(或は基準圧着間隔T2よりも大きいか否か)を判断する。経過期間TPは、端子14の圧着間隔として求められる期間であり、例えば、次のようにして求められる期間である。   In step S12, it is determined whether or not the elapsed period TP from the previous crimping waveform acquisition is equal to or greater than a predetermined reference crimping interval T2 (or greater than the reference crimping interval T2). The elapsed period TP is a period obtained as the crimping interval of the terminals 14 and is, for example, a period obtained as follows.

すなわち、上記したように圧着波形PW(N)のサンプリングを行うので、サンプリング基準時間taを、経過時間TPを求める際の基準時間として考える。つまり、時間的に連続する圧着波形PW(N)間で、時間taの差を、端子14の圧着間隔である経過期間TPとして求める。なお、完全な初期状態からの圧着開始時、つまり、前回の基準時間taの実際の値が不存在である場合には、経過期間TPは、T3(T3>T2である値)として設定されるようにしておけばよい。   That is, since the crimping waveform PW (N) is sampled as described above, the sampling reference time ta is considered as a reference time for determining the elapsed time TP. That is, the difference in time ta between the temporally continuous crimping waveforms PW (N) is obtained as the elapsed period TP that is the crimping interval of the terminals 14. It should be noted that the elapsed period TP is set as T3 (a value satisfying T3> T2) at the time of starting crimping from the complete initial state, that is, when the actual value of the previous reference time ta is absent. Just do it.

もっとも、経過期間TPは、上記例に限らず、圧着波形PW(N)が圧力のピーク値を呈する時間差、或は、端子圧着機構装置20における圧着タイミングを示す信号の出力時間の差等に基づいて求めることもできる。ただし、圧力波形に基づいて経過期間TPを求めることで、端子圧着機構装置20からの動作信号を受けることなく経過期間TPを求めることができ、構成の簡易化を図ることができる。   However, the elapsed period TP is not limited to the above example, and is based on a time difference at which the crimping waveform PW (N) exhibits a peak value of pressure, a difference in output time of signals indicating the crimping timing in the terminal crimping mechanism device 20, or the like. Can also be requested. However, by obtaining the elapsed period TP based on the pressure waveform, the elapsed period TP can be obtained without receiving an operation signal from the terminal crimping mechanism device 20, and the configuration can be simplified.

また、基準圧着間隔T2は、連続的に端子14を圧着する場合に、前回の端子14の圧着による振動影響が、次回の端子14の圧着における圧力波形に大きな影響を与えないと考えられる時間であり、実験的或は経験的に設定される値である。   Further, the reference crimping interval T2 is a time when the terminal 14 is continuously crimped and the vibration effect due to the previous crimping of the terminal 14 does not have a significant effect on the pressure waveform in the next crimping of the terminal 14. Yes, a value set experimentally or empirically.

つまり、このステップS12では、端子14の圧着間隔である経過期間TPが基準圧着間隔T2以上であるときに、1回目の端子14の圧着が行われたと判断し、経過期間TPが基準圧着間隔T2よりも小さいときに、連続的な端子14の圧着作業における2回目以降の端子圧着が行われたと判断している。   That is, in this step S12, when the elapsed period TP that is the crimping interval of the terminal 14 is equal to or greater than the reference crimping interval T2, it is determined that the first crimping of the terminal 14 has been performed, and the elapsed period TP is the reference crimping interval T2. It is determined that the second and subsequent terminal crimping has been performed in the continuous crimping operation of the terminal 14.

ステップS12において、経過期間TPが所定の基準圧着間隔T2以上であると判断されるとステップS13に進み、経過期間TPが所定の基準圧着間隔T2以上ではないと判断されると、ステップS16に進む。   If it is determined in step S12 that the elapsed period TP is greater than or equal to the predetermined reference crimping interval T2, the process proceeds to step S13. If it is determined that the elapsed period TP is not greater than or equal to the predetermined reference crimping interval T2, the process proceeds to step S16. .

ステップS13では、端子圧着状態良否判別装置30は、ステップS11でサンプリングされた圧着波形PW(N)と第1基準波形PWb1とを比較する処理を実行する。圧着波形PW(N)と第1基準波形PWb1との比較は、例えば、所定時間区間での傾き比較、所定時間区間での上限値及び下限値の差比較、圧力ピーク値の比較、両波形の近似度合の算出(例えば相関係数の算出等)等により行われる。この後ステップS14に進む。   In step S13, the terminal crimping state pass / fail determination apparatus 30 executes a process of comparing the crimp waveform PW (N) sampled in step S11 with the first reference waveform PWb1. The comparison between the crimp waveform PW (N) and the first reference waveform PWb1 is, for example, a slope comparison in a predetermined time interval, a difference comparison between an upper limit value and a lower limit value in a predetermined time interval, a pressure peak value comparison, This is performed by calculating the degree of approximation (for example, calculating a correlation coefficient). Thereafter, the process proceeds to step S14.

ステップS14では、ステップS13での比較結果を、所定のしきい値等と比較することで、端子14の良否判別を行い、良品であると判断されると、ステップS15に進む。ステップS15では、端子圧着を行う生産継続を続行する旨、端子圧着機構装置20に指示し、その後、ステップS11に戻り、続いてサンプリングされる圧着波形PW(N)に対して、ステップS11以下の処理を繰返す。一方、ステップS14において、不良であると判断されると、ステップS18に進む。   In step S14, the comparison result in step S13 is compared with a predetermined threshold value to determine whether the terminal 14 is good or not. If it is determined that the terminal 14 is good, the process proceeds to step S15. In step S15, the terminal crimping mechanism device 20 is instructed to continue production to perform terminal crimping, and then the process returns to step S11, and the subsequent sampling waveform PW (N) is sampled after step S11. Repeat the process. On the other hand, if it is determined in step S14 that it is defective, the process proceeds to step S18.

ステップS18では、表示部39に不良表示である旨を表示すると共に、端子圧着をエラー停止させる旨の信号を端子圧着機構装置20に与える。これにより、端子圧着機構装置20による端子14の圧着処理は一時的に停止される。この後、ステップS19に進む。   In step S18, the display unit 39 displays that the display is defective, and gives a signal to the terminal crimping mechanism device 20 to stop the terminal crimping error. Thereby, the crimping process of the terminal 14 by the terminal crimping mechanism apparatus 20 is stopped temporarily. Thereafter, the process proceeds to step S19.

ステップS19では、入力部38等を通じた確認リセット指示の入力の有無が判断され、入力無しと判断されるとステップS19の処理を繰返し、入力有りと判断されるとステップS15に進む。すなわち、利用者が、端子14の圧着の不良を認識して、当該不良品の排除、端子圧着機構装置20の状態確認等を行った後、確認リセット指示を入力すると、ステップS19からステップS15に進み、端子圧着処理が再開される。   In step S19, it is determined whether a confirmation reset instruction is input through the input unit 38 or the like. If it is determined that there is no input, the process in step S19 is repeated. If it is determined that there is an input, the process proceeds to step S15. That is, when the user recognizes a defect in crimping of the terminal 14 and eliminates the defective product, confirms the state of the terminal crimping mechanism device 20, etc., and inputs a confirmation reset instruction, the process proceeds from step S19 to step S15. The terminal crimping process is resumed.

また、ステップS12において、経過期間TPが所定の基準圧着間隔T2以上ではないと判断された場合のステップS16では、端子圧着状態良否判別装置30は、ステップS11でサンプリングされた圧着波形PW(N)と第2基準波形PWb2とを比較する処理を実行する。ここでの比較は、ステップS13の場合と同様に行うことができる。この後ステップS17に進む。   In step S16 when it is determined in step S12 that the elapsed period TP is not equal to or greater than the predetermined reference crimping interval T2, the terminal crimping state pass / fail discrimination device 30 determines the crimping waveform PW (N) sampled in step S11. And a process of comparing the second reference waveform PWb2. The comparison here can be performed in the same manner as in step S13. Thereafter, the process proceeds to step S17.

ステップS17では、ステップS16での比較結果に基づいて、端子14の良否判別を行い、良品であると判断されると、ステップS15に進み、端子圧着を続行する。一方、本ステップS17において、不良であると判断されると、ステップS18に進む。そして、ステップS18からステップS19を経てステップS15に進むことで、端子圧着を停止した後、端子圧着処理を再開する。   In step S17, the quality of the terminal 14 is determined based on the comparison result in step S16. If it is determined that the terminal 14 is a non-defective product, the process proceeds to step S15 and terminal crimping is continued. On the other hand, if it is determined in step S17 that it is defective, the process proceeds to step S18. And it progresses to step S15 through step S19 from step S18, and after stopping terminal crimping, the terminal crimping process is restarted.

上記判別処理においては、連続的な端子14の圧着開始後1回目の端子圧着については第1基準波形PWb1を用いて良否判別を行い、連続的な端子14の圧着開始後2回目以降の端子圧着については第2基準波形PWb2を用いて良否判別を行うことになる。つまり、連続的な端子圧着処理の途中、より具体的には、連続的な端子圧着開始後1回目の圧着と2回目以降の圧着との間で圧着良否判別基準である第1基準波形PWb1を第2基準波形PWb2に変更している。   In the discrimination process, the first terminal crimping after the start of the crimping of the continuous terminal 14 is judged using the first reference waveform PWb1, and the second and subsequent terminal crimping after the crimping of the continuous terminal 14 is started. Is determined by using the second reference waveform PWb2. That is, more specifically, the first reference waveform PWb1, which is a criterion for determining whether or not the crimping is performed, is performed during the continuous terminal crimping process, more specifically, between the first crimping and the second and subsequent crimping after the start of the continuous terminal crimping. The second reference waveform PWb2 is changed.

端子圧着状態良否判別装置30の圧着良否判別処理の実際の動作について、図8を参照して説明する。   The actual operation of the crimping pass / fail discrimination process of the terminal crimping state pass / fail discrimination device 30 will be described with reference to FIG.

まず、連続的な端子14の圧着処理開始後、最初の圧着波形PW(1)がサンプリングされると、この圧着波形PW(1)と第1基準波形PWb1とを比較することで、良否判別が行われる。   First, when the first crimping waveform PW (1) is sampled after the start of the crimping process of the continuous terminal 14, the pass / fail judgment is made by comparing the crimping waveform PW (1) with the first reference waveform PWb1. Done.

この後、基準圧着間隔T2よりも小さい経過期間TPaの間隔をあけて圧着波形PW(2)がサンプリングされると、判別基準が第1基準波形PWb1から第2基準波形PWb2に変更され、圧着波形PW(2)と第2基準波形PWb2とを比較することで、良否判別が行われる。   Thereafter, when the crimping waveform PW (2) is sampled with an interval of an elapsed period TPa smaller than the reference crimping interval T2, the discrimination reference is changed from the first reference waveform PWb1 to the second reference waveform PWb2, and the crimping waveform. A pass / fail determination is made by comparing PW (2) with the second reference waveform PWb2.

続いて、同じく基準圧着間隔T2よりも小さい経過期間TPaの間隔をあけて圧着波形PW(3)・・・が順次サンプリングされ、これらについても第2基準波形PWb2と比較することで、良否判別が行われる。   Subsequently, the crimping waveforms PW (3)... Are sequentially sampled at intervals of an elapsed period TPa which is also smaller than the reference crimping interval T2, and these are also compared with the second reference waveform PWb2 to determine whether the quality is good or bad. Done.

(n−1)回目の圧着終了後、一時停止した後、端子14の圧着が再開された場合、(n)回目の圧着波形PW(n)がサンプリングされる。この場合、(n−1)回目の圧着波形PW(n−1)と(n)回目の圧着波形PW(n)との間隔である経過期間TPbは、上記一時停止していた期間分長く、経過期間TPbは基準圧着間隔T2以上であるとする。   When the crimping of the terminal 14 is resumed after the (n-1) th crimping is finished, the (n) -th crimping waveform PW (n) is sampled. In this case, the elapsed period TPb, which is the interval between the (n-1) th crimping waveform PW (n-1) and the (n) th crimping waveform PW (n), is longer by the period of the pause. The elapsed period TPb is assumed to be not less than the reference crimping interval T2.

すると、再度、判別基準が第2基準波形PWb2から第1基準波形PWb1に変更され、圧着波形PW(n)と第1基準波形PWb1とを比較することで、良否判別が行われる。   Then, the discrimination reference is changed again from the second reference waveform PWb2 to the first reference waveform PWb1, and the pass / fail discrimination is performed by comparing the crimp waveform PW (n) with the first reference waveform PWb1.

この後、基準圧着間隔T2よりも小さい経過期間TPaの間隔をあけて圧着波形PW(n+1)がサンプリングされると、判別基準が再度第1基準波形PWb1から第2基準波形PWb2に変更され、圧着波形PW(n+1)と第2基準波形PWb2とを比較することで、良否判別が行われ、以下、同様にして判別処理が行われる。   Thereafter, when the crimping waveform PW (n + 1) is sampled with an interval of an elapsed period TPa smaller than the reference crimping interval T2, the discrimination reference is changed again from the first reference waveform PWb1 to the second reference waveform PWb2, and the crimping is performed. By comparing the waveform PW (n + 1) with the second reference waveform PWb2, the quality determination is performed, and the determination process is performed in the same manner.

以上のように構成された端子圧着状態良否判別装置、端子圧着各装置、端子圧着状態良否判別方法及び端子圧着状態良否判別プログラムによると、端子14の種類及び電線12の種類等の圧着加工条件が同じ場合でも、連続的な端子14の圧着処理の途中で、圧着良否判別基準としての第1基準波形PWb1,第2基準波形PWb2を変更する。このため、周辺振動環境の変動に応じて適切な基準である第1基準波形PWb1或は第2基準波形PWb2を用いて、圧着良否判別を行うことができる。これにより、周辺振動環境の影響をなるべく排除して、精度よく圧着良否判別を行うことができる。   According to the terminal crimping state pass / fail judgment apparatus, terminal crimping apparatus, terminal crimping state pass / fail judgment method, and terminal crimping state pass / fail judgment program configured as described above, the crimping processing conditions such as the type of terminal 14 and the type of wire 12 are determined. Even in the same case, the first reference waveform PWb1 and the second reference waveform PWb2 as the crimping quality determination criteria are changed during the crimping process of the continuous terminal 14. For this reason, it is possible to determine whether or not the pressure bonding is good by using the first reference waveform PWb1 or the second reference waveform PWb2 which is an appropriate reference according to the fluctuation of the surrounding vibration environment. As a result, it is possible to determine the quality of the crimping with high accuracy by eliminating the influence of the surrounding vibration environment as much as possible.

特に、圧着良否判別基準として実際の周辺振動環境の変動に応じてサンプリングされた圧着波形に基づく第1基準波形PWb1,第2基準波形PWb2を用いるため、周辺振動環境を適切に反映させた基準で、精度よく圧着良否判別を行うことができる。   In particular, since the first reference waveform PWb1 and the second reference waveform PWb2 based on the crimping waveform sampled according to the actual fluctuation of the ambient vibration environment are used as the crimping pass / fail judgment criterion, the reference that appropriately reflects the surrounding vibration environment is used. Therefore, it is possible to accurately determine whether the crimping is good or bad.

ところで、端子圧着によって振動が生じるため、連続的な端子14の圧着開始後2回目以降では、前回の圧着による振動影響が大きい。そこで、連続的な端子14の圧着開始後1回目の端子14の圧着と、2回目以降の端子14の圧着との間で、基準である第1基準波形PWb1,第2基準波形PWb2を変更することで、周辺振動環境の変動の変り目になると予測される適切なタイミングで、第1基準波形PWb1,第2基準波形PWb2を変更することができる。   By the way, since vibration is generated by the terminal crimping, the influence of the vibration by the previous crimping is large in the second and subsequent times after the start of the crimping of the continuous terminal 14. Therefore, the first reference waveform PWb1 and the second reference waveform PWb2 that are the reference are changed between the first crimping of the terminal 14 after the start of the crimping of the continuous terminal 14 and the second and subsequent crimping of the terminal 14. Thus, the first reference waveform PWb1 and the second reference waveform PWb2 can be changed at an appropriate timing that is predicted to be a change in the surrounding vibration environment.

上記の場合、通常、端子14を圧着した後、しばらくは振動による影響が大きく、ある程度の時間が経過すれば、振動は減衰するのでその圧着による振動影響は少なくなる。そこで、端子14の圧着間隔である経過期間TPが所定の基準圧着間隔T2以上であるときに1回目の端子14の圧着が行われたと判断し、経過期間TPが所定の基準圧着間隔T2よりも小さいときに2回目以降の端子14の圧着が行われたと判断すれば、前回の振動影響の減衰を適切に考慮したタイミングで、第1基準波形PWb1,第2基準波形PWb2を変更することができる。   In the above case, after the terminal 14 is usually crimped, the influence of vibration is large for a while, and after a certain amount of time has passed, the vibration is attenuated, so that the influence of vibration due to the crimping is reduced. Therefore, it is determined that the first crimping of the terminal 14 has been performed when the elapsed period TP that is the crimping interval of the terminal 14 is equal to or greater than the predetermined reference crimping interval T2, and the elapsed period TP is greater than the predetermined reference crimping interval T2. If it is determined that the terminal 14 has been crimped for the second time or later when it is small, the first reference waveform PWb1 and the second reference waveform PWb2 can be changed at a timing that appropriately considers the attenuation of the previous vibration effect. .

{変形例}
なお、上記実施形態では、連続的に端子14を圧着する際において、圧着開始後1回目と2回目以降との間で、圧着良否判別基準を変更しているが、必ずしもその必要はない。例えば、端子圧着機構装置20の端子供給機構部28の動作状況(動作の有無等)及び電線処理機構部29の動作状況(動作の有無)等に応じて、別々の圧着良否判別基準を作成しておき、当該端子供給機構28及び電線処理機構部29の動作状況に応じて、圧着良否判別基準を変更してもよい。この場合、端子供給機構28及び電線処理機構部29からそれらの動作状況を示す信号を端子圧着状態良否判別装置30に入力し、端子圧着状態良否判別装置30において当該動作状況を示す信号に基づいて圧着良否判別基準を変更するタイミングを決定すればよい。
{Modifications}
In the above-described embodiment, when the terminal 14 is continuously crimped, the crimping quality determination criterion is changed between the first time after the start of crimping and the second and subsequent times, but this is not necessarily required. For example, separate crimping pass / fail judgment criteria are created according to the operation status (such as presence / absence of operation) of the terminal supply mechanism 28 of the terminal crimping mechanism device 20 and the operation status (presence / absence of operation) of the wire processing mechanism 29. In addition, the crimping quality determination criterion may be changed according to the operation status of the terminal supply mechanism 28 and the wire processing mechanism unit 29. In this case, signals indicating the operation status from the terminal supply mechanism 28 and the wire processing mechanism section 29 are input to the terminal crimping state pass / fail discrimination device 30, and the terminal crimping state pass / fail discrimination device 30 is based on the signal indicating the operation status. What is necessary is just to determine the timing which changes the crimping | crimping quality determination criteria.

また、連続的な圧着波形が周期的に変動することが予測或は観察されている場合等には、周期的に圧着良否判別基準を変更してもよい。   In addition, when it is predicted or observed that the continuous crimping waveform fluctuates periodically, the crimping quality determination criterion may be changed periodically.

要するに、圧着良否判別基準に影響を与える端子圧着を行う動作に関連して、圧着良否判別基準を変更すればよい。   In short, the crimping quality determination criterion may be changed in connection with the operation of performing terminal crimping that affects the crimping quality determination criterion.

また、上記実施形態では、電線12の一端部に端子14を圧着する例で説明したが、電線の両端に端子を圧着する構成であってもよい。この場合、電線12の一端部に対する端子14の圧着良否判別については、電線12の他端部に対する端子14の圧着動作状況に応じて、圧着良否判別基準を変更してもよい。   Moreover, although the example which crimps | bonds the terminal 14 to the one end part of the electric wire 12 was demonstrated in the said embodiment, the structure which crimps | bonds a terminal to the both ends of an electric wire may be sufficient. In this case, regarding the crimping quality determination of the terminal 14 with respect to the one end portion of the electric wire 12, the crimping quality determination criterion may be changed according to the crimping operation state of the terminal 14 with respect to the other end portion of the electric wire 12.

また、上記では、圧着良否判別基準として、サンプリングされた圧着波形に基づく基準波形を用いたが必ずしもその必要はない。圧着良否判別基準は、それぞれの振動環境条件に応じて推測された基準値或は推測された関数曲線等として設定されていてもよい。   In the above description, the reference waveform based on the sampled crimping waveform is used as the criterion for determining whether or not the crimping is good, but this is not always necessary. The crimping quality determination criterion may be set as a reference value estimated according to each vibration environment condition, an estimated function curve, or the like.

なお、上記実施形態及び各変形例で説明した各構成は、相互に矛盾しない限り適宜組合わせることができる。   In addition, each structure demonstrated in the said embodiment and each modification can be suitably combined unless it mutually contradicts.

実施形態に係る端子圧着加工装置を示す概略正面図である。It is a schematic front view which shows the terminal crimping processing apparatus which concerns on embodiment. 端子圧着機構装置を示す概略側面図である。It is a schematic side view which shows a terminal crimping mechanism apparatus. 端子圧着状態良否判別装置を示すブロック図である。It is a block diagram which shows a terminal crimping state quality determination apparatus. 基準波形生成処理を示すフローチャートである。It is a flowchart which shows a reference | standard waveform generation process. 圧着波形の例を示す図である。It is a figure which shows the example of a crimping waveform. 1回目の圧着波形例と2回目の圧着波形例とを示す図である。It is a figure which shows the 1st crimping waveform example and the 2nd crimping waveform example. 端子の圧着良否判別処理を示すフローチャートである。It is a flowchart which shows the crimping | compression-bonding determination process of a terminal. 連続的な端子圧着加工中に現れる圧着波形例を示す図である。It is a figure which shows the example of a crimping waveform which appears during a continuous terminal crimping process.

符号の説明Explanation of symbols

10 端子圧着加工装置
12 電線
14 端子
20 端子圧着機構装置
22,25 圧着型
24 圧力検出部
26 圧着駆動部
30 端子圧着状態良否判別装置
32 CPU
35 外部記憶装置
35a 判別プログラム
36 圧力波形入力回路部
38 入力部
39 表示部
PWb1 第1基準波形
PWb2 第2基準波形
T2 基準圧着間隔
TP,TPa,TPb 経過期間
DESCRIPTION OF SYMBOLS 10 Terminal crimping processing apparatus 12 Electric wire 14 Terminal 20 Terminal crimping mechanism apparatus 22, 25 Crimp type 24 Pressure detection part 26 Crimp drive part 30 Terminal crimping state pass / fail judgment apparatus 32 CPU
35 External storage device 35a Discriminating program 36 Pressure waveform input circuit section 38 Input section 39 Display section PWb1 First reference waveform PWb2 Second reference waveform T2 Reference crimping interval TP, TPa, TPb Elapsed period

Claims (8)

電線に端子を圧着する端子圧着処理を連続的に行う際に、端子の圧着良否判別を行う端子圧着状態良否判別装置であって、
端子圧着に伴って検出される圧力波形が入力される圧力波形入力部と、
複数の圧着良否判別基準を記憶する記憶部と、
前記複数の圧着良否判別基準のうちの一つと前記圧力波形とに基づいて、端子の圧着良否判別を行う良否判別部と、
を備え、
前記良否判別部は、前記端子圧着処理を行う際の周辺振動環境の変動に応じて、連続的な端子圧着処理の途中で、前記圧着良否判別基準を変更する、端子圧着状態良否判別装置。
When the terminal crimping process for crimping the terminal to the electric wire is continuously performed, it is a terminal crimping state pass / fail judgment device that performs crimping judgment of the terminal,
A pressure waveform input unit to which a pressure waveform detected along with terminal crimping is input;
A storage unit for storing a plurality of crimping pass / fail judgment criteria;
Based on one of the plurality of crimping pass / fail judgment criteria and the pressure waveform, a pass / fail judgment unit that performs crimping judgment of the terminal,
With
The terminal crimping state pass / fail judgment device, wherein the pass / fail judgment unit changes the crimping judgment criterion in the middle of the continuous terminal crimping process according to a change in a surrounding vibration environment when the terminal crimping process is performed .
請求項1記載の端子圧着状態良否判別装置であって、
前記記憶部は、前記複数の圧着良否判別基準として複数の基準波形を記憶し、
前記良否判別部は、前記複数の基準波形のうちの一つと前記圧力波形とを比較して、端子の圧着良否判別を行う、端子圧着状態良否判別装置。
The terminal crimping state quality determination device according to claim 1,
The storage unit stores a plurality of reference waveforms as the plurality of crimping quality determination criteria,
The device for determining whether or not the terminal is in a crimped state by comparing the pressure waveform with one of the plurality of reference waveforms.
請求項1又は請求項2記載の端子圧着状態良否判別装置であって、
前記良否判別部は、端子を供給する端子供給機構部及び電線の端部を処理して供給する電線処理機構部の動作状況に応じて、前記圧着良否判別基準を変更する、端子圧着状態良否判別装置。
The terminal crimping state pass / fail discrimination device according to claim 1 or 2,
The pass / fail judgment unit changes the crimping pass / fail judgment criteria according to the operation status of the terminal supply mechanism unit for supplying the terminal and the wire processing mechanism unit for processing and supplying the end of the electric wire. apparatus.
電線に端子を圧着する端子圧着処理を連続的に行う際に、端子の圧着良否判別を行う端子圧着状態良否判別装置であって、
端子圧着に伴って検出される圧力波形が入力される圧力波形入力部と、
複数の圧着良否判別基準を記憶する記憶部と、
前記複数の圧着良否判別基準のうちの一つと前記圧力波形とに基づいて、端子の圧着良否判別を行う良否判別部と、
を備え、
前記良否判別部は、連続的な端子圧着処理の途中であって、連続的な端子圧着開始後1回目の端子圧着と2回目以降の端子圧着との間で前記圧着良否判別基準を変更する、端子圧着状態良否判別装置。
When the terminal crimping process for crimping the terminal to the electric wire is continuously performed, it is a terminal crimping state pass / fail judgment device that performs crimping judgment of the terminal,
A pressure waveform input unit to which a pressure waveform detected along with terminal crimping is input;
A storage unit for storing a plurality of crimping pass / fail judgment criteria;
Based on one of the plurality of crimping pass / fail judgment criteria and the pressure waveform, a pass / fail judgment unit that performs crimping judgment of the terminal,
With
The pass / fail judgment unit is in the middle of continuous terminal crimping processing, and changes the crimp pass / fail judgment criteria between the first terminal crimping and the second and subsequent terminal crimping after the start of the continuous terminal crimping, Terminal crimping state pass / fail discrimination device.
請求項4記載の端子圧着状態良否判別装置であって、
前記良否判別部は、前記圧力波形入力部を通じて入力される前記圧力波形に基づく端子圧着間隔が所定期間よりも大きいときに1回目の端子圧着が行われたと判断し、前記端子圧着間隔が所定期間よりも小さいときに2回目以降の端子圧着が行われたと判断する、端子圧着状態良否判別装置。
The terminal crimping state pass / fail discrimination device according to claim 4,
The pass / fail judgment unit determines that the first terminal crimping has been performed when the terminal crimping interval based on the pressure waveform input through the pressure waveform input unit is greater than a predetermined period, and the terminal crimping interval is a predetermined period. A terminal crimping state pass / fail discrimination device that determines that the second and subsequent terminal crimping has been performed when the terminal crimping is smaller.
端子圧着を行う一対の圧着型と、
前記一対の圧着型を相対的に接近及び離隔移動させる圧着駆動部と、
前記一対の圧着型に設けられ、端子圧着に伴う圧力波形を検出する圧力検出部と、
請求項1〜請求項5のいずれかに記載の端子圧着状態良否判別装置と、
を備える端子圧着加工装置。
A pair of crimping dies for terminal crimping;
A crimp driving unit that relatively moves the pair of crimping molds closer to and away from each other; and
A pressure detector provided in the pair of crimping molds to detect a pressure waveform associated with terminal crimping;
The terminal crimping state pass / fail discrimination device according to any one of claims 1 to 5,
A terminal crimping apparatus comprising:
電線に端子を圧着する端子圧着処理を連続的に行う際に、端子の圧着良否判別を行う端子圧着状態良否判別方法であって、
(a)端子圧着に伴って検出される圧力波形と圧着良否判別基準とに基づいて端子の圧着良否判別を行うステップと、
(b)端子圧着に伴って検出される圧力波形と、前記工程(a)における圧着良否判別基準とは別の圧着良否判別基準とに基づいて、端子の圧着良否判別を行うステップと、
を、前記端子圧着処理を行う際の周辺振動環境の変動に応じて、連続的な端子圧着処理の途中で変更して実行する、端子圧着状態良否判別方法。
When the terminal crimping process for crimping the terminal to the electric wire is continuously performed, it is a terminal crimping state pass / fail judgment method for judging the crimping quality of the terminal,
(A) a step of determining whether or not the terminal is crimped based on a pressure waveform detected in connection with the terminal crimping and a criterion for determining whether or not the terminal is crimped;
(B) a step of determining whether or not the terminal is crimped based on a pressure waveform detected along with the terminal crimping and a crimping quality determination criterion different from the crimping quality determination criterion in the step (a);
The terminal crimping state pass / fail determination method is executed by changing the process in the middle of the continuous terminal crimping process according to the change in the surrounding vibration environment when the terminal crimping process is performed .
電線に端子を圧着する端子圧着処理を連続的に行う際に、端子圧着に伴って検出される圧力波形に基づいて端子の圧着良否判別を行うための端子圧着状態良否判別プログラムであって、コンピュータに、
(a)端子圧着に伴って検出される圧力波形と圧着良否判別基準とに基づいて端子の圧着良否判別を行う処理と、
(b)端子圧着に伴って検出される圧力波形と、前記工程(a)における圧着良否判別基準とは別の圧着良否判別基準とに基づいて、端子の圧着良否判別を行う処理と、
を、前記端子圧着処理を行う際の周辺振動環境の変動に応じて、連続的な端子圧着処理の途中で変更して行わせる処理を実現させるための端子圧着状態良否判別プログラム。
A terminal crimping state pass / fail judgment program for determining whether or not a terminal is crimped based on a pressure waveform detected when the terminal is crimped when a terminal crimping process for crimping a terminal to an electric wire is continuously performed. In addition,
(A) a process for determining whether or not a terminal is crimped based on a pressure waveform detected along with terminal crimping and a crimping quality determination criterion;
(B) a process for determining whether or not a terminal is crimped based on a pressure waveform detected along with terminal crimping and a crimping quality determination criterion different from the crimping quality determination criterion in the step (a);
A terminal crimping state pass / fail judgment program for realizing a process of changing the process in the middle of a continuous terminal crimping process according to a change in the surrounding vibration environment when the terminal crimping process is performed .
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