JP2010039330A - Liquid crystal device and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid crystal device for lowering the thickness of a spacer in a configuration selectively forming a flatness layer on a reflective display region. <P>SOLUTION: The liquid crystal device 100 includes: a counter substrate 30 arranged by facing an element substrate 10; a liquid crystal layer 40 arranged between the element substrate 10 and the counter substrate 30; a plurality of pixels 4 having a reflective display region R; the spacer 43 positioned between the adjacent pixels 4 and holding a gap between the element substrate 10 and the counter substrate 30; a plurality of pieces of wiring provided on the side of the liquid crystal layer 40 of the element substrate 10 and positioned between the pixels 4; a resin layer 22 covering the plurality of the pieces of the wiring and having an uneven face on a region corresponding to the reflective display region R; a reflection layer 24 formed on the uneven face of the resin layer 22 and having a surface reflecting the uneven face; a flat layer 26 selectively provided on a first region arranged on the side of the liquid crystal layer 40 of the reflection layer 24 and planarly overlapped on the uneven face, and a second region planarly overlapped on the spacer 43. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a liquid crystal device and an electronic apparatus.

  In a liquid crystal device, a photo spacer is used in order to maintain a gap (hereinafter referred to as a gap) between substrates that defines a layer thickness of a liquid crystal layer sandwiched between a pair of substrates. For example, after a spacer material is disposed on the liquid crystal layer side of one substrate, the photo spacer is patterned using a photolithography method and formed in a region between pixels (for example, Patent Document 1).

  On the other hand, a liquid crystal device having a reflective layer that reflects external light incident on the liquid crystal layer and capable of performing reflective display is known. This reflective layer has, for example, an uneven surface provided by being formed on a base layer having an uneven surface. In such a liquid crystal device, since the thickness of the liquid crystal layer is different between the concave and convex portions on the uneven surface, the contrast may be lowered in the reflective display. On the other hand, the structure which fills the recessed part of an uneven surface by providing the planarization layer on a reflection layer is known (for example, patent document 2). According to such a configuration, the uneven surface of the reflective layer is difficult to be reflected on the surface in contact with the liquid crystal layer, so that a reduction in contrast in reflective display can be suppressed.

JP 2001-305552 A JP 2000-206564 A

  By the way, when a concavo-convex surface is formed on the underlayer using, for example, a photolithography method, a step is easily generated between the concavo-convex surface and the surface of the other portion in the underlayer. When a planarizing layer is formed as an upper layer across such a level difference, the leveling layer cannot fill the level difference of the base layer, and a sloped level difference occurs on the surface of the leveling layer. The level difference on the planarization layer surface is reflected on the surface in contact with the liquid crystal layer. When this sloped step reaches the pixel region, a portion where the contrast is lowered is generated in the pixel region. Therefore, it is preferable to selectively form a planarizing layer in a region overlapping the uneven surface of the base layer in a plane, that is, in a reflective display region.

  However, if the planarization layer is selectively formed in the reflective display region, the gap becomes thicker in the region between the pixels where the planarization layer is not formed. This increases the thickness of the spacer that holds the gap in the region between the pixels. As the spacer thickness increases, thickness variations (that is, gap variations) tend to occur between the spacers. As a result, there is a problem that unevenness in contrast and response speed occurs in the liquid crystal device, resulting in a decrease in display quality.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A liquid crystal device according to this application example includes a first substrate, a second substrate disposed to face the first substrate, the first substrate, and the second substrate. The liquid crystal layer disposed between the plurality of pixels, the plurality of pixels having a reflective display region, and the pixels adjacent to each other, and a gap between the first substrate and the second substrate. , A spacer provided on the liquid crystal layer side of the first substrate, and a plurality of wirings arranged between the pixels, covering the plurality of wirings, and corresponding to the reflective display region A base layer having a concavo-convex surface, and a reflective layer having a surface reflecting the concavo-convex surface, formed on the concavo-convex surface of the base layer, and disposed on the liquid crystal layer side of the reflective layer, A first region that planarly overlaps the uneven surface and a first region that planarly overlaps the spacer. Characterized in that it comprises a region, and planarization layer provided selectively in the.

  According to this configuration, since the planarization layer is selectively provided in the first region that overlaps the uneven surface planarly, the uneven surface of the reflective layer is reflected on the surface of the first substrate that contacts the liquid crystal layer. Is suppressed. In addition, even if there is a step on the surface of the base layer between the first region where the flattening layer is provided and the other portion, the flattening layer is not formed across the step. No step is reflected on the surface. Thereby, since the unevenness of the thickness of the liquid crystal layer in the first region that overlaps the uneven surface in a planar manner is suppressed, it is possible to suppress a decrease in contrast in the reflective display region.

  Further, since the planarization layer is selectively provided also in the second region that overlaps the spacer in a planar manner, the thickness of the spacer can be reduced compared to the case where the planarization layer is not disposed. Can be made quite thin. Thereby, the dispersion | variation in the thickness of spacers is suppressed. Therefore, the gap, that is, the gap between the first substrate and the second substrate can be maintained more uniformly. As a result, the display quality of the liquid crystal device can be improved.

  Application Example 2 In the liquid crystal device according to the application example described above, the plurality of wirings include a plurality of scanning lines and a plurality of signal lines arranged so as to intersect with each of the plurality of scanning lines. The spacer may be arranged so as to overlap with at least one of the scanning line and the signal line in a planar manner.

  According to this configuration, since the spacer is disposed in a region overlapping at least one of the scanning line and the signal line and the planarization layer, the thickness of the spacer is further reduced by an amount corresponding to the thickness of at least one of the scanning line and the signal line. it can.

  Application Example 3 In the liquid crystal device according to the application example, the spacer may be disposed so as to overlap the scanning line and the signal line in a planar manner.

  According to this configuration, since the spacer is disposed in the region overlapping the scanning line and the signal line and the planarization layer, the thickness of the spacer can be further reduced by an amount corresponding to the thickness of the scanning line and the signal line.

  Application Example 4 In the liquid crystal device according to the application example described above, the planarizing layer may be formed integrally with the first region and the second region.

  According to this configuration, the portion of the planarizing layer that overlaps the spacer in a plane has a smaller area than the portion that overlaps the uneven surface in a plane. When a planarization layer is formed by using a photolithography method, if such a small area is isolated, it is easy to peel off during development. However, since the planarization layer is integrally formed, peeling in development is difficult. Occurrence is suppressed.

  Application Example 5 In the liquid crystal device according to the application example described above, the planarization layer may be integrally formed across the plurality of pixels.

  According to this configuration, since the planarization layer is integrally formed over a plurality of pixels, the occurrence of peeling during development can be further suppressed when the planarization layer is formed using a photolithography method.

  Application Example 6 In the liquid crystal device according to the application example described above, the planarizing layer may be formed separately in the first region and the second region.

  According to this configuration, the planarly overlapping portion of the planarization layer can be provided at a position away from the reflective display region. Therefore, the degree of freedom of spacer arrangement is increased.

  Application Example 7 In the liquid crystal device according to the application example described above, the pixel may further include a transmissive display region in which the reflective layer and the planarization layer are not disposed.

  According to this configuration, display quality can be improved in a transflective liquid crystal device that performs transmissive display and reflective display.

  Application Example 8 An electronic apparatus according to this application example includes the liquid crystal device described above.

  According to this configuration, the electronic apparatus has the above-described liquid crystal device as a display unit, so that display quality can be improved.

  The present embodiment will be described below with reference to the drawings. In each of the drawings to be referred to, in order to show the configuration in an easy-to-understand manner, the layer thickness, dimensional ratio, angle, and the like of each component are appropriately changed. In each drawing to be referred to, some elements, wiring, connection portions, and the like are omitted.

<Liquid crystal device>
(First embodiment)
First, the configuration of the liquid crystal device according to the first embodiment will be described with reference to FIG. 1, FIG. 2, and FIG. FIG. 1 is a diagram illustrating a configuration of the liquid crystal device according to the first embodiment. Specifically, FIG. 1A is a perspective view, and FIG. 1B is a cross-sectional view taken along line AA ′ in FIG. FIG. 2 is an enlarged plan view showing the display area of the liquid crystal device according to the first embodiment. FIG. 3 is an equivalent circuit diagram illustrating an electrical configuration of the liquid crystal device according to the first embodiment. Note that FIG. 2 shows only the components necessary for the following description of the positional relationship.

  The liquid crystal device according to the present embodiment is an active matrix type liquid crystal device provided with a TFT (Thin Film Transistor) element as a switching element, and an FFS (Fringe-Field Switching) type transflective liquid crystal device. It is. As shown in FIG. 1, the liquid crystal device 100 includes an element substrate 10 as a first substrate, and a counter substrate 30 as a second substrate disposed to face the element substrate 10. The element substrate 10 and the counter substrate 30 are bonded to each other with a frame-shaped sealing agent 41 therebetween. The gap between the element substrate 10 and the counter substrate 30 is held by a spacer 43 (see FIG. 2).

  A liquid crystal layer 40 is enclosed in a space surrounded by the element substrate 10, the counter substrate 30, and the sealing agent 41. A polarizing plate 44 is disposed on the surface of the element substrate 10 opposite to the liquid crystal layer 40, and a polarizing plate 45 is disposed on the surface of the counter substrate 30 opposite to the liquid crystal layer 40. The element substrate 10 is larger than the counter substrate 30 and is bonded in a state where a part of the element substrate 10 protrudes from the counter substrate 30. A driver IC 42 for driving the liquid crystal layer 40 is mounted on the protruding portion. The liquid crystal device 100 performs display in the display area 2 in which the liquid crystal layer 40 is enclosed.

  As shown in FIG. 2, the display area 2 includes pixels 4R, 4G, and 4B that contribute to the display of red (R), green (G), and blue (B) (in the following, when the corresponding colors are not distinguished). Are simply referred to as pixels 4). The pixels 4 are the minimum display unit of the liquid crystal device 100, and are arranged in a matrix along the X axis and the Y axis so that there is a space between the adjacent pixels 4. The planar shape of the pixel 4 is, for example, a rectangular shape. The X axis indicates the row direction of the pixels 4, and the Y axis indicates the column direction of the pixels 4.

  Each pixel 4 has a reflective display region R and a transmissive display region T. The reflective display areas R or the transmissive display areas T are arranged so as to face each other in the direction along the X axis, and the reflective display areas R and the transmissive display areas T face each other in the direction along the Y axis. Is arranged. A pixel group 6 is composed of the pixels 4R, 4G, and 4B. In the liquid crystal device 100, various colors can be displayed by appropriately changing the display brightness of each of the pixels 4R, 4G, and 4B in the pixel group 6.

  Each pixel 4 is provided with a reflective layer 24 corresponding to the reflective display region R. A light shielding layer 32 is disposed between adjacent pixels 4. The light shielding layer 32 has a lattice-like planar shape, and partitions the region of the pixel 4. The light blocking layer 32 plays a role of blocking the light leaking from between the pixels 4 and improving the display contrast.

  A spacer 43 is disposed between the adjacent pixels 4. At least one spacer 43 is provided for each pixel group 6. In the present embodiment, the spacer 43 is provided between each of the pixels 4R, 4G, and 4B.

  As shown in FIG. 3, a plurality of scanning lines 12, a plurality of signal lines 14, and a plurality of common wirings 17 as a plurality of wirings are formed in the display region 2. The plurality of scanning lines 12 and the plurality of common wirings 17 are arranged substantially parallel to each other. The plurality of signal lines 14 are arranged so as to intersect with the plurality of scanning lines 12 and the plurality of common wirings 17, respectively. Pixels 4 are provided corresponding to the intersections of the scanning lines 12 and the common lines 17 and the signal lines 14. In each of the pixels 4, a pixel electrode 16 and a TFT element 20 for controlling the pixel electrode 16 are formed. Each pixel 4 is formed with a common electrode 18 for generating a horizontal electric field with the pixel electrode 16. The common electrode 18 is electrically connected to the common wiring 17.

  The source electrode 20 s (see FIG. 4) of the TFT element 20 is electrically connected to the signal line 14 extending from the signal line driving circuit 13. Data signals S1, S2,..., Sn are supplied to the signal line 14 from the signal line driving circuit 13 in a line sequential manner. The gate electrode 20 g (see FIG. 4) of the TFT element 20 is a part of the scanning line 12 extending from the scanning line driving circuit 15. The scanning signals G1, G2,..., Gm are supplied to the scanning lines 12 from the scanning line driving circuit 15 in a line sequential manner. The drain electrode 20 d (see FIG. 4) of the TFT element 20 is electrically connected to the pixel electrode 16.

  The data signals S1, S2,..., Sn are written to the pixel electrode 16 through the signal line 14 at a predetermined timing by turning on the TFT element 20 for a certain period. The data signal of a predetermined level written in the liquid crystal layer 40 through the pixel electrode 16 in this way is held for a certain period with the common electrode 18. Here, a storage capacitor 19 is formed between the pixel electrode 16 and the common electrode 18, and the voltage of the pixel electrode 16 is held for a time longer than the time when the source voltage is applied, for example. As a result, the charge retention characteristics are improved, and the liquid crystal device 100 can perform display with a high contrast ratio.

  Next, a detailed configuration of the liquid crystal device 100 according to the first embodiment will be described with reference to FIGS. 4 and 5. 4 and 5 are diagrams illustrating the configuration of the pixel 4 of the liquid crystal device 100 according to the first embodiment. Specifically, FIG. 4 is a plan view when viewed from the counter substrate 30 side. FIG. 5 is a sectional view taken along line B-B ′ in FIG. 4. In FIG. 4, the counter substrate 30 is not shown, and the region of the pixel 4 is indicated by a two-dot chain line, but the light shielding layer 32 (see FIG. 2) so as to overlap the region of the pixel 4 in a plane. Is arranged.

  As shown in FIG. 5, the element substrate 10 is configured by using the substrate 11 as a base. On the substrate 11, a TFT element 20, an insulating layer 21, a resin layer 22 as a base layer, a reflective layer 24, and the like. The planarization layer 26, the common wiring 17, the common electrode 18, the insulating layer 28, the pixel electrode 16, and an alignment film (not shown) are provided. The substrate 11 is made of a light-transmitting material, for example, glass. The material of the substrate 11 may be quartz or resin.

A gate electrode 20 g and a common wiring 17 are formed on the liquid crystal layer 40 side of the substrate 11. The gate electrode 20g is a part of the scanning line 12 formed in the same layer. The insulating layer 21 is formed so as to cover the substrate 11, the gate electrode 20 g (scanning line 12), and the common wiring 17. The insulating layer 21 is made of, for example, SiO ₂ (silicon oxide).

  On the insulating layer 21, a semiconductor layer 20a, a source electrode 20s, and a drain electrode 20d are formed. As shown in FIG. 4, the semiconductor layer 20 a is formed at a position that overlaps the scanning line 12 in a planar manner. The semiconductor layer 20a is made of a semiconductor such as amorphous silicon or polysilicon. The source electrode 20s is a portion branched from the signal line 14, and a part thereof is formed so as to cover a part of the semiconductor layer 20a. The drain electrode 20d is formed so as to partially cover the semiconductor layer 20a. The gate electrode 20g, the semiconductor layer 20a, the source electrode 20s, and the drain electrode 20d constitute the TFT element 20.

  The reflective display region R is arranged on the TFT element 20 side in the pixel 4 region. As shown by hatching in FIG. 4, the reflective layer 24 is provided across the reflective display region R and a portion adjacent to the reflective display region R between the pixels 4. A region overlapping the reflection layer 24 in a plan view is referred to as a first region.

  In addition, the spacer 43 is disposed so as to overlap the signal line 14 in a plane in a region between the reflective display regions R. A region overlapping the spacer 43 in plan view is referred to as a second region. The spacer 43 may be disposed so as to overlap the scanning line 12 in a planar manner. The cross-sectional shape of the spacer 43 viewed from the counter substrate 30 side is, for example, a rectangle. The cross-sectional shape of the spacer 43 may be a polygon, a circle, an ellipse, or the like.

  In FIG. 4, the X axis indicates the direction along the extending direction of the scanning line 12, and the Y axis indicates the direction along the extending direction of the signal line 14. The directions of the X axis and Y axis in FIG. 4 are the same as the directions of the X axis and Y axis in FIG. 2, respectively.

  As shown in FIG. 5, the resin layer 22 is formed on the TFT element 20 and the insulating layer 21. The resin layer 22 is made of a translucent resin, for example, a positive photosensitive acrylic resin. The resin layer 22 has an uneven surface in a region corresponding to the reflective display region R on the liquid crystal layer 40 side. The layer thickness of the resin layer 22 is, for example, about 2 μm, and the level difference between the convex portion and the concave portion of the uneven surface is, for example, about 0.5 μm to 1 μm.

  The resin layer 22 is provided, for example, by forming a solid surface using a spin coating method and then forming an uneven surface using a photolithography method. In the method of forming the uneven surface of the resin layer 22, first, the first region of the resin layer 22 is exposed using a mask having an opening pattern in which exposure light is irradiated to a non-projection region of the uneven shape. The exposed portion is removed with a developer. Thereby, a recessed part and a substantially cylindrical protrusion part are formed. Furthermore, an uneven surface is formed by heat-treating the resin layer 22 and causing the upper end surface of the protruding portion to bend.

  In addition, when forming the resin layer 22, if there is a convex portion in the lower layer of the resin layer 22, the shape of the convex portion is easily reflected on the surface of the resin layer 22. For example, in a portion overlapping the wiring such as the scanning line 12 and the signal line 14 and the TFT element 20, a step reflecting the shape of the wiring and the TFT element 20 is generated on the surface of the resin layer 22. Further, since the exposed portion of the surface of the resin layer 22 when the uneven surface is formed is removed, a step is formed between the uneven surface of the resin layer 22 and the surface of the other portion. Therefore, a step is generated on the surface of the resin layer 22 between the reflective display region R and the transmissive display region T.

  The reflective layer 24 is formed on the uneven surface of the resin layer 22 and has an upper surface reflecting the uneven surface of the resin layer 22, that is, an uneven surface. The reflective layer 24 is made of a metal film having light reflectivity, and is made of, for example, aluminum. The material of the reflective layer 24 may be APC (silver-palladium-copper alloy). The reflection layer 24 scatters and reflects light incident from the liquid crystal layer 40 side by having an uneven surface.

  The planarization layer 26 is located on the liquid crystal layer 40 side of the reflection layer 24. As shown in FIG. 4, the planarization layer 26 is selectively provided in a first region that planarly overlaps the reflective layer 24 and a second region that planarly overlaps the spacer 43. In the present embodiment, the planarization layer 26 includes the first portion 26a located in the first region, the second portion 26b located in the second region, the first portion 26a, and the second portion 26b. And a third portion 26c connecting the two. That is, the planarization layer 26 is integrally formed in the first region and the second region so as to be connected to each other.

  The second portion 26b overlaps the spacer 43 and the signal line 14 in a planar manner. The area of the second portion 26b is preferably larger than the area of the cross section of the spacer 43 as viewed from the counter substrate 30 side. The width of the third portion 26c in the Y-axis direction is smaller than the width of the second portion 26b in the Y-axis direction. The width of the third portion 26c in the Y-axis direction may be substantially the same as the width of the second portion 26b in the Y-axis direction.

  The planarization layer 26 is made of a light-transmitting resin, for example, a negative photosensitive resin. The material of the planarization layer 26 may be a UV curable resin. The flattening layer 26 (first portion 26 a) substantially flattens the surface on the liquid crystal layer 40 side in the reflective display region R by filling the steps of the uneven surface of the reflective layer 24. Therefore, it is preferable that the material of the planarization layer 26 has a low viscosity. The layer thickness of the planarization layer 26 is, for example, about 1.0 μm to 1.5 μm.

  The planarizing layer 26 is formed in a solid shape using, for example, a spin coat method, and then a portion other than the first portion 26a, the second portion 26b, and the third portion 26c is formed using, for example, a photolithography method. It is formed by removing with a developer. By the way, if a portion having a small area such as the second portion 26b is isolated, it may be peeled off during development. In the present embodiment, the second portion 26b is connected to and integrated with the first portion 26a having a large area by the third portion 26c, so that there is a risk that the second portion 26b is peeled off during development. Can be reduced.

  Here, in the resin layer 22 below the flattening layer 26, there is a step in which convex portions such as wiring and TFT elements 20 are reflected on the surface, or a step between the concave and convex surface and the surface of other portions. is doing. These steps are larger than the step between the concave and convex portions of the concave and convex surface where the reflective layer 24 is located. Therefore, when the planarization layer 26 is formed in a solid shape, the planarization layer 26 cannot fill the steps of the resin layer 22, and the surface of the planarization layer 26 has a slope shape corresponding to the step of the resin layer 22. A step will occur. The sloped step formed on the surface of the planarizing layer 26 is reflected on the surface in contact with the liquid crystal layer 40.

  For example, there is a step between the reflective display region R and the transmissive display region T on the surface of the resin layer 22, and the reflective display region R and the transmissive display are formed on the surface of the planarization layer 26 corresponding to the step. A sloped step is formed so as to straddle the region T. As a result, the layer thickness of the liquid crystal layer 40 varies in each of the reflective display region R and the transmissive display region T. In addition, as for the step on the surface of the resin layer 22 in the portion overlapping the wiring and the TFT element 20, the sloped step on the surface of the planarization layer 26 corresponding to the step may extend into the region of the pixel 4. is there.

  For the reasons described above, the planarizing layer 26 is preferably selectively formed on the uneven surface of the resin layer 22, that is, the first region overlapping the reflective layer 24 in a planar manner. In the present embodiment, the planarization layer 26 (first portion 26a) is selectively formed in the first region, thereby preventing the step of the surface of the resin layer 22 from affecting the pixel 4 region. is doing.

  Further, the second portion 26 b overlaps the spacer 43 and the signal line 14 in a plane. The area of the second portion 26b is preferably larger than the area of the cross section of the spacer 43 as viewed from the counter substrate 30 side. On the other hand, the area of the second portion 26b and the third portion 26c is preferably small for the purpose of preventing the influence of the step of the lower layer from reaching the region of the pixel 4. This is the reason why the third portion 26c is smaller in the present embodiment than the second portion 26b that overlaps the spacer 43 in plan view.

  The common electrode 18 is formed in a solid shape across the reflective display region R and the transmissive display region T. The common electrode 18 is located on the planarization layer 26 in the reflective display region R, and is located on the resin layer 22 in the transmissive display region T. The common electrode 18 overlaps the common wiring 17 in one side in a plane, and is electrically connected to the common wiring 17. The common electrode 18 is formed on the planarizing layer 26 in the reflective display region R, so that the uneven surface of the reflective layer 24 is not reflected and is formed substantially flat. The common electrode 18 is made of a conductive material having translucency, for example, ITO (Indium Tin Oxide).

  The insulating layer 28 is formed so as to cover the resin layer 22, the planarization layer 26, and the common electrode 18. The insulating layer 28 is arranged on the liquid crystal layer 40 side of the flattening layer 26, thereby having a substantially flat surface without reflecting the uneven surface of the reflective layer 24. The insulating layer 28 is made of, for example, SiN (silicon nitride). The layer thickness of the insulating layer 28 is, for example, about 0.1 μm to 0.5 μm.

  The pixel electrode 16 is formed on the insulating layer 28. As shown in FIG. 4, the pixel electrode 16 is formed in a region that substantially overlaps the common electrode 18 in a plan view, and has a plurality of slit-shaped openings 16 a. The pixel electrode 16 is electrically connected to the drain electrode 20 d through the contact hole 29. The contact hole 29 is provided in a first region that overlaps the reflective layer 24 in plan and penetrates the insulating layer 28, the planarizing layer 26, and the resin layer 22. The reflective layer 24 has an opening that is slightly larger than the contact hole 29 so as not to contact the contact hole 29.

  The pixel electrode 16 is made of a light-transmitting conductive material, for example, ITO. The pixel electrode 16 is formed by, for example, forming a solid film using a sputtering method and then patterning a portion corresponding to the outer shape of the pixel electrode 16 and the opening 16a. Since the pixel electrode 16 is formed on the substantially flat insulating layer 28 in which the uneven surface of the reflective layer 24 is not reflected, occurrence of disconnection around the opening 16a is suppressed.

  As shown in FIG. 5, the pixel electrode 16 and the common electrode 18 are opposed to each other with an insulating layer 28 interposed therebetween, and a storage capacitor having the insulating layer 28 as a dielectric film is interposed between the pixel electrode 16 and the common electrode 18. 19 (see FIG. 3) is formed. In the element substrate 10, when a voltage is applied between the pixel electrode 16 and the common electrode 18, a lateral electric field in a direction parallel to the element substrate 10 is generated around the slit-shaped opening 16 a and its periphery. The orientation of the liquid crystal molecules in the liquid crystal layer 40 is controlled by this lateral electric field.

  An alignment film is formed on the element substrate 10 on the side in contact with the liquid crystal layer 40. The alignment film is made of a polyimide resin, for example. The surface of the alignment film is subjected to an alignment process such as a rubbing process.

  Next, the counter substrate 30 is located on the observation side of the liquid crystal device 100. The counter substrate 30 is configured with a substrate 31 as a base, and a light shielding layer 32, a color filter layer 34, an overcoat layer 36, a protective layer 38, and an alignment film (not shown) are formed on the substrate 31. I have. The substrate 31 is made of a light-transmitting material, such as glass. The material of the substrate 31 may be quartz or resin.

  The light shielding layer 32 and the color filter layer 34 are formed on the substrate 31. The light shielding layer 32 is disposed in a region between adjacent pixels 4 on the substrate 31. The color filter layer 34 is disposed corresponding to the region of the pixel 4. The color filter layer 34 is made of, for example, acrylic resin and contains color materials corresponding to the R, G, and B colors displayed by the pixels 4. The overcoat layer 36 is formed so as to cover the light shielding layer 32 and the color filter layer 34. The overcoat layer 36 is made of a translucent resin.

  The protective layer 38 is provided on the overcoat layer 36 and is disposed in the reflective display region R. The protective layer 38 is formed across a plurality of adjacent pixels 4 in which the reflective display regions R are opposed to each other. The protective layer 38 is made of the same material as the overcoat layer 36, for example. The protective layer 38 serves as a liquid crystal layer thickness adjusting layer that varies the layer thickness of the liquid crystal layer 40 between the reflective display region R and the transmissive display region T depending on its own layer thickness. The protective layer 38 may be a phase difference layer that gives a predetermined phase difference to the light incident on the protective layer 38, or may include such a phase difference layer.

  An alignment film is formed on the side of the counter substrate 30 that contacts the liquid crystal layer 40. The alignment film is made of a polyimide resin, for example. An alignment process in the same direction as the alignment direction of the alignment film of the element substrate 10 is performed on the surface of the alignment film.

  The liquid crystal layer 40 is disposed between the element substrate 10 and the counter substrate 30. The liquid crystal molecules of the liquid crystal layer 40 are applied to the alignment film of the element substrate 10 and the alignment film of the counter substrate 30 in a state where no electric field is generated between the pixel electrode 16 and the common electrode 18 (off state). Align horizontally along the direction regulated by the alignment treatment. Further, the liquid crystal molecules of the liquid crystal layer 40 are aligned along a direction orthogonal to the extending direction of the opening 16a in a state where an electric field is generated between the pixel electrode 16 and the common electrode 18 (on state). . Therefore, in the liquid crystal layer 40, a phase difference is imparted to the light passing through the liquid crystal layer 40 using birefringence based on the difference in the alignment state of the liquid crystal molecules between the off state and the on state.

  The layer thickness of the liquid crystal layer 40 is defined by the gap between the element substrate 10 and the counter substrate 30 held by the spacer 43 (see FIG. 6). The layer thickness of the liquid crystal layer 40 differs between the reflective display region R and the transmissive display region T. Specifically, the layer thickness in the reflective display region R of the liquid crystal layer 40 is approximately ½ of the layer thickness in the transmissive display region T of the liquid crystal layer 40.

  The surface in contact with the liquid crystal layer 40 of the element substrate 10 in the reflective display region R is a substantially flat surface in which the uneven surface of the reflective layer 24 (resin layer 22) is not reflected by the planarizing layer 26. Thereby, since the variation in the thickness of the liquid crystal layer 40 in the reflective display region R is suppressed, the variation in the modulation state of the light reflected by the reflective layer 24 and passing through the liquid crystal layer 40 is reduced.

  A retardation plate 46 is disposed between the element substrate 10 and the polarizing plate 44. A retardation plate 48 is disposed between the counter substrate 30 and the polarizing plate 45. The phase difference plate 46 and the phase difference plate 48 give a predetermined phase difference, for example, a phase difference corresponding to a quarter wavelength, to the wavelength of incident visible light. The polarizing plate 44 and the retardation plate 46 constitute a circular polarizing plate. Similarly, the polarizing plate 45 and the retardation plate 48 constitute a circular polarizing plate. When the protective layer 38 is a retardation layer, or when the protective layer 38 includes a retardation layer, the retardation plate 46 and the retardation plate 48 may not be disposed.

  The transmission axis of the polarizing plate 44 and the transmission axis of the polarizing plate 45 are provided so as to be substantially orthogonal to each other. Although not shown, a backlight device is disposed on the polarizing plate 44 side so as to face the polarizing plate 44.

  Next, the gap of the liquid crystal device 100 will be described with reference to FIGS. FIG. 6 is a diagram for explaining the gap of the liquid crystal device 100. Specifically, FIG. 5 is a cross-sectional view taken along line C-C ′ in FIG. 4. FIG. 12 is a diagram illustrating a comparative example of the liquid crystal device. Specifically, it is a cross-sectional view showing a case where a planarizing layer is selectively formed in a first region.

  FIG. 6 shows a cross section of the liquid crystal device 100 that extends from the first region that overlaps the reflective layer 24 in a plane and the second region that overlaps the spacer 43 in a plane. As described above, the planarization layer 26 includes the first portion 26a, the second portion 26b, and the third portion 26c. The first portion 26 a is disposed in a first region that overlaps the reflective layer 24 in a planar manner. The second portion 26 b is disposed in a second region that overlaps the spacer 43 in a planar manner. The layer thickness D3 of the planarization layer 26 is, for example, 1.0 μm.

  In the lower layer of the planarization layer 26, a step D4 between the uneven surface (the surface of the reflective layer 24) in the resin layer 22 and the surface without the uneven surface is located. The step D4 is, for example, 0.6 μm. The planarization layer 26 is disposed across the step D4. Therefore, an inclined step is formed on the surface of the planarizing layer 26 corresponding to the step D4. This sloped step is located between the pixels 4 that overlap the light shielding layer 32 in a planar manner.

  The spacer 43 overlaps the signal line 14 and the planarization layer 26 (third portion 26c) in a planar manner. The spacer 43 is made of, for example, acrylic resin. As an example of the material of the spacer 43, NN525 or NN803 manufactured by JSR Corporation can be used. The spacer 43 is formed by, for example, forming a solid film on the element substrate 10 using a spin coating method and then removing portions other than the spacer 43 with a developer using a photolithography method. The spacer 43 may be formed on the counter substrate 30.

  The spacer 43 has a thickness corresponding to the gap between the element substrate 10 and the counter substrate 30 in the region where the spacer 43 is disposed. The thickness of the spacer 43 is determined by the thickness of the formed solid film. In order to increase the thickness of the solid film, when the spin coat method is used, a method of reducing the spin coat rotational speed is used. However, when the spin coating speed is further reduced, the film thickness variation in the solid film to be formed becomes larger. Then, since the thicknesses of the spacers 43 vary, the gap between the element substrate 10 and the counter substrate 30 varies. Accordingly, the spacer 43 is preferably thinner.

  In the present embodiment, the gap D1 between the element substrate 10 and the counter substrate 30 in the reflective display region R is, for example, 1.5 μm. In this case, the gap in the transmissive display region T is about 3.0 μm, which is twice the gap D1. Note that the thickness of the alignment film, the insulating layer 28, and the like is ignored. The gap D2 between the element substrate 10 and the counter substrate 30 in the second region overlapping the spacer 43 in plan view is smaller than the gap D1 by an amount corresponding to the step D4. Therefore, the gap D2 is 0.9 μm. As a result, in the liquid crystal device 100, the thickness of the spacer 43 required to hold the gaps D1 and D2 is 0.9 μm. Thus, the thickness of the spacer 43 can be reduced by disposing the planarization layer 26 (second portion 26 b) in the second region that overlaps the spacer 43 in a planar manner.

  Here, assuming that the spacer 43 does not overlap with the signal line 14 in the second region, if the thickness of the signal line 14 is 0.2 μm, the gap D2 is 1.1 μm. Therefore, the gap D2 can be reduced by 0.2 μm by arranging the spacer 43 so as to overlap the signal line 14 in a plane.

  Next, the liquid crystal device 600 and the liquid crystal device 100 illustrated in FIG. The liquid crystal device 600 as a comparative example is different from the liquid crystal device 100 of the present embodiment in that the planarizing layer 66 is selectively formed only in the first region, but the other configurations are the same. It is. Constituent elements common to the liquid crystal device 100 of the present embodiment are denoted by the same reference numerals and description thereof is omitted.

  In the element substrate 60 of the liquid crystal device 600, the planarization layer 66 is selectively formed only in the first region that overlaps the reflection layer 24 (the uneven surface of the resin layer 22) in a planar manner. Therefore, the planarization layer 66 corresponds to the first portion 26 a of the planarization layer 26 in the liquid crystal device 100. The layer thickness of the planarization layer 66 is assumed to be equal to the layer thickness D3 of the planarization layer 26. Since the planarizing layer 66 does not straddle the step D4, the surface of the planarizing layer 66 is a substantially flat surface. With this configuration, it is possible to prevent the lower layer step from affecting the region of the pixel 4.

  On the other hand, since the planarizing layer 66 is not formed in the second region overlapping the spacer 43 in a plane, a step D7 is formed between the surface of the planarizing layer 66 and the surface of the resin layer 22. The level difference D7 is equal to the difference obtained by subtracting the level difference D4 from the layer thickness D3 of the planarizing layer 66, and is 0.4 μm. A gap D8 between the element substrate 60 and the counter substrate 30 in the second region is larger than the gap D1 by an amount corresponding to the step D7. Therefore, the gap D8 is 1.9 μm. Thereby, in the liquid crystal device 600, the thickness of the spacer 43 necessary to hold the gaps D1 and D8 is 1.9 μm. That is, the thickness of the spacer 43 in the liquid crystal device 600 is larger than the thickness of the spacer 43 in the liquid crystal device 100 by the thickness of the planarization layer 66 (planarization layer 26). In other words, in the liquid crystal device 100, the spacer 43 can be reduced in thickness by the layer thickness of the planarization layer 26 by disposing the planarization layer 26 (second portion 26 b) in the second region.

  In the present embodiment, the variation in the thickness of each spacer 43 is reduced by selectively disposing the planarizing layer 26 (second portion 26b) in the second region that overlaps the spacer 43 in plan. Can do. Therefore, the gaps D1 and D2 between the element substrate 10 and the counter substrate 30 can be more uniformly maintained. As a result, unevenness in contrast and response speed in the liquid crystal device 100 can be suppressed, so that the display quality of the liquid crystal device 100 can be improved.

  In addition, when a force is applied to compress the spacer 43 from at least one side of the element substrate 10 and the counter substrate 30, if the spacer 43 is thin, the amount of expansion and contraction of the spacer 43 is reduced. Therefore, when the thickness of the spacer 43 is reduced by the thickness of the planarizing layer 26, the gaps D1 and D2 between the element substrate 10 and the counter substrate 30 can be more stably maintained. As a result, the reliability of the liquid crystal device 100 can be improved.

(Second Embodiment)
Next, the configuration of the liquid crystal device according to the second embodiment will be described with reference to FIGS. 7 and 8 are diagrams illustrating the configuration of the pixel 4 of the liquid crystal device according to the second embodiment. Specifically, FIG. 7 is a plan view when viewed from the counter substrate side. The counter substrate is not shown. FIG. 8 is a cross-sectional view taken along the line DD ′ in FIG. Constituent elements common to the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  The liquid crystal device according to the second embodiment is different from the liquid crystal device according to the first embodiment in that the spacers are arranged so as to overlap the scanning lines and the signal lines in a plane. The configuration of is the same.

  As shown in FIG. 8, the liquid crystal device 200 according to the second embodiment includes an element substrate 50, a counter substrate 30, a liquid crystal layer 40, and a spacer 43. The element substrate 50 is configured using the substrate 11 as a base, and is a flat surface that is selectively provided in a first region that planarly overlaps the reflective layer 24 and a second region that planarly overlaps the spacer 43. An oxidization layer 52 is provided.

  As shown in FIG. 7, in the liquid crystal device 200, the spacer 43 is disposed so as to planarly overlap a portion where the scanning line 12 and the signal line 14 intersect. Therefore, the second region that overlaps the spacer 43 in a planar manner also overlaps the scanning line 12 and the signal line 14 in a planar manner. The planarization layer 52 includes a first portion 52a located in the first region, a second portion 52b located in the second region, and a third portion connecting the first region and the second region. The portion 52c is formed integrally with the first region and the second region.

  As shown in FIG. 8, the spacer 43 overlaps the scanning line 12, the signal line 14, and the planarization layer 52 (second portion 52b) in a planar manner. The scanning line 12 is located between the substrate 11 and the insulating layer 21. Further, the signal line 14 is disposed on the insulating layer 21 so as to overlap the scanning line 12. For this reason, the step between the uneven surface (the surface of the reflection layer 24) in the resin layer 22 and the surface without the uneven surface is obtained by adding a step D6 corresponding to the layer thickness of the scanning line 12 to the step D4 in the liquid crystal device 100. It will be a thing. The layer thickness of the planarization layer 52 is assumed to be equal to the layer thickness D3 of the planarization layer 26 in the liquid crystal device 100.

  A gap D5 between the element substrate 50 and the counter substrate 30 is smaller than the gap D1 by an amount corresponding to the step D4 and the step D6. If the step D6, that is, the layer thickness of the scanning line 12 is 0.2 μm, the gap D5 is 0.7 μm. Thereby, in the liquid crystal device 200, the thickness of the spacer 43 required to hold the gaps D1 and D5 is 0.7 μm. Therefore, the spacer 43 can be made thinner than the liquid crystal device 100 by arranging the spacer 43 so as to overlap the scanning line 12 and the signal line 14 in a plane.

  In the present embodiment, the spacer 43 is disposed so as to overlap the scanning line 12 and the signal line 14 in a planar manner, and the planarization layer 52 (second portion 52b) is selected in the second region overlapping the spacer 43 in a planar manner. Therefore, the variation in the thickness of each spacer 43 can be reduced. Therefore, the gaps D1 and D5 between the element substrate 50 and the counter substrate 30 can be more uniformly maintained. As a result, the display quality of the liquid crystal device can be further improved.

  The spacer 43 may be disposed so as to overlap the TFT element 20 in a planar manner. In that case, the second portion 52 b of the planarization layer 52 is disposed so as to overlap the spacer 43 and the TFT element 20 in a planar manner.

(Third embodiment)
Next, the configuration of the liquid crystal device according to the third embodiment will be described with reference to FIG. FIG. 9 is a diagram illustrating a configuration of the pixel 4 of the liquid crystal device according to the third embodiment. Specifically, FIG. 9 is a plan view when viewed from the counter substrate side. The counter substrate is not shown. Constituent elements common to the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  The liquid crystal device according to the third embodiment is different from the liquid crystal device according to the first embodiment and the liquid crystal device according to the second embodiment in that the planarization layer is separately provided in the first region and the second region. However, the other configurations are the same.

  As shown in FIG. 9, in the liquid crystal device 300 according to the third embodiment, a planarizing layer 62 a is selectively provided in a first region that planarly overlaps the reflective layer 24, and the spacer 43 is planar. A planarization layer 62b is selectively provided in the second region overlapping with the first and second regions. That is, the planarization layer 62a and the planarization layer 62b are formed separately.

  In the present embodiment, there is a risk that the planarization layer 62b is peeled off when the planarization layer 62a and the planarization layer 62b are formed, but the planarization layer 62b may be disposed at a position away from the planarization layer 62a. it can. Since the planarization layer 62b is provided in the second region that overlaps the spacer 43 in a planar manner, this increases the degree of freedom in arranging the spacer 43.

  Further, in the present embodiment, the spacer 43 is disposed so as to planarly overlap a portion where the common wiring 17 and the signal line 14 intersect, and is disposed so as to planarly overlap the planarizing layer 62b. ing. When the layer thickness of the common wiring 17 is 0.2 μm, the gap between the element substrate 10 and the counter substrate 30 is 0.7 μm, and the same effect as the liquid crystal device 200 according to the second embodiment can be obtained. The spacer 43 may be disposed so as to overlap the common wiring 17 in a planar manner.

(Fourth embodiment)
Next, the configuration of the liquid crystal device according to the fourth embodiment will be described with reference to FIG. FIG. 10 is a plan view showing a display area of the liquid crystal device according to the fourth embodiment. Constituent elements common to the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  The liquid crystal device according to the fourth embodiment is different from the liquid crystal device according to the first embodiment in that a planarization layer is integrally formed across a plurality of pixels. The same.

  As shown in FIG. 10, in the liquid crystal device 400 according to the fourth embodiment, the planarization layer 64 has a first portion 64 a and a second portion 64 b corresponding to each of the pixels 4. . The first portion 64 a is provided in a first region that overlaps the reflective layer 24 in a planar manner. The second portion 64 b is located in a second region that overlaps the spacer 43 in a plan view, and is provided so as to connect the first portions 64 a corresponding to the adjacent pixels 4. That is, the planarization layer 64 is integrally formed across the plurality of pixels 4.

  In this embodiment, the same effect as the liquid crystal device 100 according to the first embodiment can be obtained. In the present embodiment, since the planarization layer 64 is integrally formed across the plurality of pixels 4, the risk of the second portion 64b peeling off when the planarization layer 64 is formed can be further reduced. Note that in the planarization layer 64, the second portion 64b is selectively provided in the second region overlapping the spacer 43 in a plane, and the first portion 64a and the second portion 64b are connected to each other. The structure which has three parts may be sufficient.

  As described above, when the flattening layer 64 is formed in a solid shape, a stepped surface having a slope corresponding to the step of the lower layer is formed on the surface of the flattening layer 64 and reflected on the surface in contact with the liquid crystal layer 40. Therefore, the planarization layer 64 is not formed in the transmissive display region T. Further, the first portions 64a corresponding to the adjacent pixels 4 are also connected by the second portion 64b having a smaller area. According to this configuration, a region where the planarizing layer 64 is not formed in a slit shape between the adjacent reflective display regions R is formed.

  By the way, the alignment film is formed by applying an uncured alignment resin and then curing the alignment resin. In the case where an alignment film is formed by applying uncured alignment resin on the surface of the element substrate having the above-described configuration on the liquid crystal layer 40 side, the alignment resin accumulates in the transmissive display region T so that the thickness of the alignment film is reduced. Unevenness occurs, and the display quality of the liquid crystal device 400 is lowered. Since the liquid crystal device 400 has a region where the planarizing layer 64 is not formed in a slit shape between the adjacent reflective display regions R, a part of the alignment resin flows into this region, so that the transmissive display region T It is possible to prevent the alignment resin from accumulating.

<Electronic equipment>
The liquid crystal devices 100, 200, 300, and 400 described above can be used by being mounted on a mobile phone 500 as an electronic device, for example, as shown in FIG. The mobile phone 500 includes liquid crystal devices 100, 200, 300, and 400 in the display unit 502. With this configuration, the mobile phone 500 including the display unit 502 has excellent display quality.

  Further, the electronic device may be a mobile computer, a digital camera, a digital video camera, an audio device, or a liquid crystal projector.

  As mentioned above, although embodiment of this invention was described, various deformation | transformation can be added with respect to the said embodiment in the range which does not deviate from the meaning of this invention. As modifications, for example, the following can be considered.

(Modification 1)
The liquid crystal device of the above embodiment is a transflective liquid crystal device in which the pixel electrode is disposed on the liquid crystal layer side of the common electrode by the FFS method, but is not limited to this mode. The liquid crystal device may have a configuration in which the common electrode is disposed closer to the liquid crystal layer than the pixel electrode. The liquid crystal device may be an IPS (In-Plane Switching) type liquid crystal device that controls the alignment of liquid crystal molecules by a horizontal electric field, as in the FFS mode. In these liquid crystal devices, similar effects can be obtained.

(Modification 2)
The liquid crystal device of the above embodiment is an FFS transflective liquid crystal device, but is not limited to this mode. Liquid crystal devices are liquid crystal devices such as a TN (Twisted Nematic) method, a VA (Vertical Alignment) method, an ECB (Electrically Controlled Birefringence) method, which controls the alignment of liquid crystal molecules by a vertical electric field generated between the element substrate and the counter substrate. It may be. The same effect can be obtained in such TN, VA, and ECB liquid crystal devices.

(Modification 3)
The liquid crystal device of the above embodiment is a transflective liquid crystal device, but is not limited to this mode. The liquid crystal device may be a reflective liquid crystal device. The same effect can be obtained in such a reflective liquid crystal device.

1 is a diagram illustrating a configuration of a liquid crystal device according to a first embodiment. The top view which expanded and showed the display area of the liquid crystal device concerning a 1st embodiment. FIG. 2 is an equivalent circuit diagram illustrating an electrical configuration of the liquid crystal device according to the first embodiment. 1 is a diagram illustrating a configuration of a pixel of a liquid crystal device according to a first embodiment. Sectional drawing along the B-B 'line | wire in FIG. Sectional drawing along the C-C 'line | wire in FIG. FIG. 6 is a diagram illustrating a configuration of a pixel of a liquid crystal device according to a second embodiment. Sectional drawing along the D-D 'line in FIG. FIG. 10 is a diagram illustrating a configuration of a pixel of a liquid crystal device according to a third embodiment. The top view which showed the display area of the liquid crystal device which concerns on 4th Embodiment. FIG. 6 illustrates an electronic device in this embodiment. FIG. 10 shows a comparative example of a liquid crystal device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 2 ... Display area, 4 ... Pixel, 6 ... Pixel group, 10, 50, 60 ... Element substrate, 11 ... Substrate, 12 ... Scan line, 13 ... Signal line drive circuit, 14 ... Signal line, 15 ... Scan line drive circuit 16 ... pixel electrode, 16a ... opening, 17 ... common wiring, 18 ... common electrode, 19 ... holding capacitor, 20 ... TFT element, 20a ... semiconductor layer, 20d ... drain electrode, 20g ... gate electrode, 20s ... source electrode , 21 ... insulating layer, 22 ... resin layer, 24 ... reflective layer, 26, 52, 62a, 62b, 64, 66 ... planarization layer, 26a, 52a, 64a ... first part, 26b, 52b, 64b ... first 2 part, 26c, 52c ... 3rd part, 28 ... insulating layer, 29 ... contact hole, 30 ... counter substrate, 31 ... substrate, 32 ... light shielding layer, 34 ... color filter layer, 36 ... overcoat layer, 38 ... protective layer, 40 ... Crystal layer, 41 ... Sealing agent, 42 ... Driver IC, 43 ... Spacer, 44 ... Polarizing plate, 45 ... Polarizing plate, 46 ... Phase difference plate, 48 ... Phase difference plate, 100, 200, 300, 400, 600 ... Liquid crystal Device 500, mobile phone, 502, display.

Claims (8)

A first substrate;
A second substrate disposed opposite the first substrate;
A liquid crystal layer disposed between the first substrate and the second substrate;
A plurality of pixels having a reflective display area;
A spacer that is located between the pixels adjacent to each other, and that holds a gap between the first substrate and the second substrate;
A plurality of wirings provided on the liquid crystal layer side of the first substrate and disposed between the pixels;
A base layer that covers the plurality of wirings and has an uneven surface in a region corresponding to the reflective display region;
A reflective layer formed on the uneven surface of the underlayer, and having a surface reflecting the uneven surface;
Flattening that is disposed on the liquid crystal layer side of the reflective layer and is selectively provided in a first region that planarly overlaps the uneven surface and a second region that planarly overlaps the spacer Layers,
A liquid crystal device comprising: The liquid crystal device according to claim 1,
The plurality of wirings include a plurality of scanning lines and a plurality of signal lines arranged to intersect each of the plurality of scanning lines,
The liquid crystal device, wherein the spacer is arranged to overlap with at least one of the scanning line and the signal line in a plane. The liquid crystal device according to claim 2,
The liquid crystal device, wherein the spacer is disposed so as to overlap the scanning line and the signal line in a planar manner. The liquid crystal device according to any one of claims 1 to 3,
The liquid crystal device according to claim 1, wherein the planarizing layer is formed integrally with the first region and the second region. The liquid crystal device according to claim 4,
The liquid crystal device, wherein the planarization layer is integrally formed over the plurality of pixels. The liquid crystal device according to any one of claims 1 to 3,
The liquid crystal device, wherein the planarizing layer is formed separately in the first region and the second region. The liquid crystal device according to any one of claims 1 to 6,
The liquid crystal device, wherein the pixel further includes a transmissive display region in which the reflective layer and the planarization layer are not disposed.   An electronic apparatus comprising the liquid crystal device according to claim 1.

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