JP2010037411A5 - - Google Patents

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JP2010037411A5
JP2010037411A5 JP2008200553A JP2008200553A JP2010037411A5 JP 2010037411 A5 JP2010037411 A5 JP 2010037411A5 JP 2008200553 A JP2008200553 A JP 2008200553A JP 2008200553 A JP2008200553 A JP 2008200553A JP 2010037411 A5 JP2010037411 A5 JP 2010037411A5
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polyol
cured
mass
meth
acrylate
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JP2008200553A
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JP5224965B2 (en
JP2010037411A (en
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本発明は、ポリイソシアネート（ａ１）と、ポリオール（ａ２）と、ヒドロキシアルキル（メタ）アクリレート（ａ３）との反応により得られるウレタン（メタ）アクリレート（Ａ）２５〜７５質量部、ホモポリマーのＴｇが１００℃以上である含環構造単官能モノマー（Ｂ）２５〜７５質量部の合計１００質量部、および、活性エネルギー線重合開始剤（Ｃ）を含有する活性エネルギー線硬化性樹脂組成物を注型重合により硬化して得られた樹脂硬化物であって、微小押し込み試験によるマルテンス硬さが３０Ｎ／ｍｍ２以上、１７０Ｎ／ｍｍ２以下の範囲内にあり、弾性変形率が６０％以下である樹脂硬化物である。 In the present invention, 25 to 75 parts by mass of urethane (meth) acrylate (A) obtained by reaction of polyisocyanate (a1), polyol (a2), and hydroxyalkyl (meth) acrylate (a3), Tg of homopolymer An active energy ray-curable resin composition containing a total of 100 parts by mass of a ring-containing monofunctional monomer (B) having a temperature of 100 ° C. or higher and 25 to 75 parts by mass and an active energy ray polymerization initiator (C) a cured resin obtained by curing by the mold polymerization, microindentation Martens hardness by testing 30 N / mm 2 or more, located in 170N / mm 2 within the following range, the elastic deformation ratio is 60% or less It is a cured resin.

Claims (3)

ポリイソシアネート（ａ１）と、ポリオール（ａ２）と、ヒドロキシアルキル（メタ）アクリレート（ａ３）との反応により得られるウレタン（メタ）アクリレート（Ａ）２５〜７５質量部、ホモポリマーのＴｇが１００℃以上である含環構造単官能モノマー（Ｂ）２５〜７５質量部の合計１００質量部、および、活性エネルギー線重合開始剤（Ｃ）を含有する活性エネルギー線硬化性樹脂組成物を注型重合により硬化して得られた樹脂硬化物であって、微小押し込み試験によるマルテンス硬さが３０Ｎ／ｍｍ２以上、１７０Ｎ／ｍｍ２以下の範囲内にあり、弾性変形率が６０％以下である樹脂硬化物。 25 to 75 parts by mass of urethane (meth) acrylate (A) obtained by reaction of polyisocyanate (a1), polyol (a2) and hydroxyalkyl (meth) acrylate (a3), Tg of homopolymer is 100 ° C. or higher The active energy ray-curable resin composition containing 25 to 75 parts by mass of the ring-containing monofunctional monomer (B) and the active energy ray polymerization initiator (C) is cured by cast polymerization. a cured resin obtained by, microindentation Martens hardness by testing 30 N / mm 2 or more, located in 170N / mm 2 within the following range, the cured resin is an elastic deformation ratio is 60% or less. ポリオール（ａ２）が、ポリカプロラクトンポリオールまたはポリカーボネートポリオールである請求項１記載の樹脂硬化物。 Polyol (a2) is, according to claim 1 cured resin according polycaprolactone polyol or a polycarbonate polyol. 基材上に、請求項１または請求項２に記載の樹脂硬化物からなる層を有するキーシート。 The key sheet which has a layer which consists of a resin cured material of Claim 1 or Claim 2 on a base material.
JP2008200553A 2008-08-04 2008-08-04 Cured resin and key sheet Active JP5224965B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008200553A JP5224965B2 (en) 2008-08-04 2008-08-04 Cured resin and key sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008200553A JP5224965B2 (en) 2008-08-04 2008-08-04 Cured resin and key sheet

Publications (3)

Publication Number Publication Date
JP2010037411A JP2010037411A (en) 2010-02-18
JP2010037411A5 true JP2010037411A5 (en) 2011-09-15
JP5224965B2 JP5224965B2 (en) 2013-07-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008200553A Active JP5224965B2 (en) 2008-08-04 2008-08-04 Cured resin and key sheet

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JP (1) JP5224965B2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1144249A (en) * 1997-07-28 1999-02-16 Denso Corp Engine control device
US20130063393A1 (en) * 2010-03-04 2013-03-14 Susumu Kurishima Functional laminated plate, and transparent electrically conductive laminated plate for touch panel and touch panel produced using same
JP5610200B2 (en) * 2010-06-10 2014-10-22 三菱レイヨン株式会社 Active energy ray-curable resin composition for casting and optical component
JP2013125317A (en) * 2011-12-13 2013-06-24 Mitsubishi Rayon Co Ltd Image display device with touch panel
JP6087187B2 (en) * 2013-03-27 2017-03-01 第一工業製薬株式会社 Energy ray curable resin composition
JP6132140B2 (en) * 2013-03-29 2017-05-24 Dic株式会社 UV curable adhesive composition and adhesive
JP2015200898A (en) * 2015-05-19 2015-11-12 大日本印刷株式会社 Optical sheet, surface light source device, and liquid crystal display device
JP6565613B2 (en) * 2015-11-05 2019-08-28 日油株式会社 Active energy ray-curable resin composition
JP2021523247A (en) * 2018-06-29 2021-09-02 スリーエム イノベイティブ プロパティズ カンパニー A photopolymerizable composition comprising a polycarbonate diol, an article, and a polyurethane methacrylate polymer prepared using the method.
CN112384188A (en) 2018-06-29 2021-02-19 3M创新有限公司 Orthodontic articles made using polycarbonate diols, polymerizable compositions, and methods of making articles
WO2020005413A1 (en) * 2018-06-29 2020-01-02 3M Innovative Properties Company Orthodontic articles prepared using a polycarbonate diol, and methods of making same
EP3813763A1 (en) 2018-06-29 2021-05-05 3M Innovative Properties Company Orthodontic articles comprising cured free-radically polymerizable composition with improved strength in aqueous environment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH115809A (en) * 1997-04-25 1999-01-12 Oji Paper Co Ltd Electron radiation curing resin composition and sheetlike composite material obtained by using the same
JP2004338214A (en) * 2003-05-15 2004-12-02 Mitsubishi Rayon Co Ltd Manufacturing method of resin molded body
JP4441870B2 (en) * 2005-01-05 2010-03-31 荒川化学工業株式会社 Active energy ray-curable resin composition and cured film obtained from the composition
JP4900685B2 (en) * 2005-09-30 2012-03-21 Ｄｉｃ株式会社 Active energy ray-curable resin composition for shaping, shaping sheet and shaped article
JP2007314715A (en) * 2006-05-29 2007-12-06 Denki Kagaku Kogyo Kk Resin composition and photocuring cast molding method
JP2008088354A (en) * 2006-10-04 2008-04-17 Denki Kagaku Kogyo Kk Resin composition and cast molding method

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