JP2010033006A - Method for producing color filter, and color filter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for producing a color filter having a step in which a resin black matrix is formed on a glass substrate using a photolithographic process, and, next, color material layers with a prescribed pattern are successively formed by prescribed color number using a photolithographic process, the method in which only the square projections of the color material layers caused by the overlapping between the resin black matrix and the color material layers are ground without uniformly grinding the color material layers over the whole face, and also to provide a method for producing a color filter, which reduces the square projections to a degree at which problems are not generated in liquid crystal orientation, and a color filter produced by the method. <P>SOLUTION: A color material layer to be ground by ultraviolet irradiation is used, an ITO film or a photoresist film is formed on the part other than the upper part of the resin black matrix part, and thereafter, the square projections are irradiated with ultraviolet rays and are ground. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for producing a color filter for a liquid crystal display using a photolithography method, and in particular, in a color filter having a black matrix using a black photosensitive resin composition and a color material layer using a colored photosensitive resin composition, The present invention relates to a method of reducing angular protrusions generated at an overlapping portion of a black matrix and a color material layer by polishing.

  A color filter used in a liquid crystal display includes at least a black matrix having an opening formed on a glass substrate and a color material layer as a pixel portion formed in the opening of the black matrix. Manufactured using the law. For the black matrix material, a black photosensitive curable resin composition containing a light-shielding agent is used, and for the color material layer, three kinds of coloring materials each containing red (R), green (G), and blue (B) colorants are used. The colored photosensitive curable resin composition is generally used. Usually, pigments are used for black, red, green and blue colorants.

  In recent years, liquid crystal displays have been used for televisions, and fierce image display quality competition and price competition with various other types of televisions such as CRT, PDP, rear projection, SED, and organic EL have been developed. In addition, there is intense competition among manufacturers of liquid crystal displays for improvement.

  Since color filters used in liquid crystal displays greatly affect image display quality, various characteristics are being improved. For example, the width of the black matrix is narrowed to improve the aperture ratio of the pixel portion, the liquid crystal orientation disturbance is reduced as much as possible to increase the contrast ratio, and the black matrix is shielded to increase the contrast ratio. For example, the color reproduction range (reproduction range) is widened, and variations in color reproduction are reduced.

  Previously, the black matrix was made by using a metal film such as chromium, but at present, the black matrix is mostly made by using a black photosensitive resin composition by using a photolithography method. In the present invention, this black matrix is referred to as a resin black matrix.

  The liquid crystal display has a structure in which liquid crystal is sealed between two substrates facing each other with a predetermined gap. In many cases, one substrate is a substrate on which a color filter is formed, and the other substrate is a substrate on which a thin film transistor array or the like is formed. In the liquid crystal display, the disorder of the orientation of the liquid crystal sealed between both substrates directly reflects the display quality. On the other hand, in the color filter manufactured by the photolithography method, horny protrusions are generated at the overlapping portion of the resin black matrix and the coloring material layer of the colored photosensitive resin composition, and the horny protrusions are disturbed in the alignment of the liquid crystal. This is a problem. (Patent Document 1).

  The process in which the square protrusions are generated will be described below with reference to FIG. 1 in the case where the width of the resin black matrix is wide (usually about 10 μm or more). FIG. 1A is a view showing a state in which a film 2 ′ of a black photosensitive resin composition for a resin black matrix is formed on a glass substrate 1 by a coating method such as a spin coating method or a slit coating method.

FIG. 1B shows a state in which a predetermined resin black matrix pattern 2 is formed using a photolithography method. In the photolithography method, pattern exposure is performed on the photosensitive film 2 ′ through an exposure photomask having a predetermined light-shielding pattern, and thereafter, development and hardening processing are performed on the photosensitive film 2 ′. This is a method of leaving a pattern made of a photosensitive resin in a predetermined portion. The thickness of the black matrix 2 is usually about 1.0 to 1.5 μm.

  FIG. 1 (c): A color material layer of a color filter, for example, a colored photosensitive resin composition film 3 (R) ′ for a red (R) layer was formed by a coating method such as a spin coating method or a slit coating method. It is a figure which shows a state. At this time, a bulge occurs in the portion where the resin black matrix 2 and the color material layer film 3 (R) 'overlap. The height of the rise depends on the thickness of the resin black matrix.

  FIG. 1D is a view showing a state in which the color material layer film 3 (R ′) is formed into a predetermined color material layer shape 3 (R) by photolithography. Usually, in order to prevent light leakage during screen display, the end of the color material layer is overlapped with the resin black matrix. For this reason, a part of the above-described raised portion remains as an end portion of the color material layer, and the color material layer is in a state having a square protrusion 9 (height Δh).

  FIG. 1E is a diagram showing a state in which the other colors, green (G) and blue (B) are also formed into a predetermined shape, 3 (G) and 3 (B) by the same method. The color filter shown in FIG. 1 is in a state where the end portions of the adjacent color material layers do not overlap on the resin black matrix, and each end portion of the color material layer has a square protrusion.

  Since the angular projections 9 cause liquid crystal alignment disorder, various methods for reducing the height have been proposed and implemented. Usually, after the color material layer is formed, an overcoat layer is formed on the resin black matrix and the color material layer (Patent Document 2). Other methods include, for example, reducing the thickness of the resin black matrix, heating and softening to flow and flatten the angular protrusions of the color material layer, and minimizing the overlapping portion of the resin black matrix and the color material layer as much as possible. For example, the angular protrusions are polished and removed. Practically, if the height of the ridges 9 (Δh: the height from the flat portion of the color material layer to the apex of the corner portion) is 0.5 μm or less, the alignment of the liquid crystal is disturbed in the display quality. It can be made less affected.

  Among the above methods, a method of reducing the thickness of the resin black matrix as much as possible and a method of flattening the color material layer by flow due to heat softening are employed in some cases. However, the method of reducing the thickness of the resin black matrix has almost reached the limit because it has to achieve the predetermined optical density required for the resin black matrix (recently, the optical density D = 4.0 or more). ing. In addition, the heat softening method imposes restrictions on the type of resin for the color material layer that can be used.

  The method for reducing the overlapping portion of the resin black matrix and the color material layer as much as possible requires an apparatus and a member for photolithography such as an exposure apparatus and a photomask having high alignment accuracy, and is a large glass substrate for a color filter. For example, in the present situation where a substrate having a side of 2 m or more is used, very expensive equipment and members are required. In addition, the polishing removal method has a problem that it is difficult to uniformly polish the entire surface of the glass substrate, and further, scratches are easily generated, and countermeasures thereof are difficult.

  On the other hand, it is preferable to narrow the width of the resin black matrix because the aperture ratio of the pixels is improved. Therefore, Patent Document 3 discloses a method in which the width of the resin black matrix is narrowed so that the end portions of the adjacent color material layers overlap on the black matrix.

FIG. 2A shows a state in which end portions of adjacent color material layers 3 (R), 3 (G), and 3 (B) are overlapped on the resin black matrix 2. In this case, the height of the square projection 9 reaches the thickness of the resin black matrix. Therefore, the method of heating and increasing the fluidity of the color material layer to flatten the square protrusions cannot be used in practice.

  In Patent Document 3, as a method for flattening the surface of the color filter, a method of forming an overcoat layer covering the resin black matrix and the color material layer is employed. However, the method for forming and flattening the overcoat layer is not practical because the thickness of the overcoat layer needs to be several times the height of the angular protrusions. Therefore, Patent Document 4 discloses a method in which after forming the first overcoat layer, the first overcoat layer is polished and planarized to some extent, and then the overcoat layer is formed again.

  Patent Document 4 discloses a method in which the width of the resin black matrix is 8 μm and the end portions of the adjacent color material layers are overlapped on the resin black matrix. In this method, the square protrusions are polished so that the surface of the color material layer is flat, or at least the height is 0.5 μm or less, as shown in FIG. However, Patent Document 4 does not specifically describe the polishing method.

  Here, the normal polishing method is rotational polishing using an Oscar polishing device or linear polishing using a tape polishing machine. In any case, the height of the square protrusions should be 0.5 μm or less over the entire surface of the substrate. Is quite difficult as a practical matter. The reason is that the polishing rate is largely dependent on the pressure during polishing. It is difficult to polish the entire surface of the glass substrate with a uniform pressure because of unevenness of the thickness of the glass substrate and unevenness of the polishing surface plate. Further, in the rotational polishing, since the peripheral speed is different between the vicinity of the center and the outer peripheral portion, uniform polishing is difficult. Further, in the normal polishing method, the color material layer other than the square projections is also polished, the thickness of the color material layer is changed, and the display performance of the liquid crystal display is deteriorated. Further, the surface of the color material layer is damaged, resulting in a problem that the display quality is lowered.

JP 09-230124 A Japanese Patent Laid-Open No. 02-101404 JP 2000-1111724 A JP-A-9-230124

  An object of the present invention is to find a manufacturing method of a color filter capable of uniformly polishing only a rectangular protrusion over the entire surface of a substrate without polishing a color material layer other than a portion where the rectangular protrusion is generated. . Another object of the present invention is to provide a color filter manufacturing method having a small square projection and no problem in liquid crystal alignment and a color filter manufactured by the method.

  The present inventors reduce the film thickness of the color material layer when irradiated with ultraviolet rays, that is, the color material layer is polished, but an ITO film (mixed oxide of indium oxide and tin oxide) is formed on the color material layer. It has been found that the portion where the conductive film is formed does not decrease the thickness of the color material layer of the portion even when irradiated with ultraviolet rays. Moreover, if the intensity of the ultraviolet rays to be irradiated is uniform, it has been found that the rate of film thickness reduction (polishing rate) is uniform, and as a result of intensive studies, the present invention according to claims 1 to 6 of the present invention has been achieved. It was.

  Further, the present inventors reduce the film thickness of the color material layer when irradiated with ultraviolet rays, that is, the color material layer is polished, but the portion where the photoresist film is formed on the color material layer is exposed to ultraviolet rays. It has been found that the film thickness of the color material layer in the portion does not decrease even when irradiated. Moreover, if the intensity of the ultraviolet rays to be irradiated is uniform, it has been found that the rate of film thickness reduction (polishing rate) is uniform, and as a result of intensive studies, the present invention according to claims 7 to 12 of the present invention has been achieved. It was.

  Furthermore, it is recognized that the UV polishing rate of the color material layer does not differ greatly depending on the type and concentration of the color material in the color material layer, and that the polishing rate changes almost linearly with the irradiation intensity of UV rays. It has been found that a desired place can be polished to a desired degree by adjusting the irradiation intensity and irradiation time of ultraviolet rays in polishing the protrusions.

  That is, in the invention according to claim 1 of the present invention, a resin black matrix is formed on a glass substrate using a photolithography method, and then a color material layer having a predetermined pattern is formed using the photolithography method. In a method for manufacturing a color filter having a step of sequentially forming a predetermined number of colors, the rectangular projections of the color material layer caused by the overlap of the resin black matrix and the color material layer are polished by ultraviolet irradiation. In this color filter manufacturing method, an ITO film is formed on a portion other than the upper portion of the black matrix portion, and then the rectangular projections are polished by irradiating ultraviolet rays.

  According to a second aspect of the present invention, there is provided a method for forming an ITO film on a portion other than the upper portion of the resin black matrix after forming a predetermined number of color material layers having a predetermined pattern on the resin black matrix. And an ITO film is formed so as to cover the color material layer, and then the ITO film above the resin black matrix is removed using a photoetching method. This is a method for manufacturing a color filter.

  The invention according to claim 3 of the present invention is characterized in that the photomask used for the photoetching method for removing the ITO film is a photomask used for forming the resin black matrix. The manufacturing method of the color filter as described in above.

  The invention according to claim 4 of the present invention is characterized in that the ITO film is formed again after polishing by irradiating with ultraviolet rays, and the method for producing a color filter according to any one of claims 1 to 3.

  The invention according to claim 5 of the present invention is such that the color filter has a structure in which the ends of the adjacent color material layers overlap each other on the resin black matrix, and the angular protrusions generated at the overlap of the color material layers are claimed. The color filter which grind | polishes using the method of any one of claim | item 1-4.

  The invention according to claim 6 of the present invention is a color filter having a structure in which the ends of adjacent color material layers do not overlap on the resin black matrix, and the height of the square protrusions of the color material layer is 0.5 μm or less. And a color filter manufactured using the method according to any one of claims 1 to 4.

  In the invention according to claim 7 of the present invention, a resin black matrix is formed on a glass substrate using a photolithography method, and then a color material layer having a predetermined pattern is formed using a photolithography method. In the manufacturing method of a color filter having a step of sequentially forming the number of colors, the rectangular projections of the color material layer generated by the overlap of the resin black matrix and the color material layer are polished by ultraviolet irradiation, and the resin black matrix is prior to polishing. A method of manufacturing a color filter, comprising: forming a photoresist film on a portion other than the upper portion of the portion, and then irradiating ultraviolet rays to polish the square protrusions.

According to an eighth aspect of the present invention, there is provided a method for forming a photoresist film on a portion other than the upper portion of a resin black matrix after forming a color material layer having a predetermined pattern by a predetermined number of colors, The photoresist film is formed so as to cover the top and the color material layer, and then the photoresist film above the resin black matrix is removed using a photolithography method. 7. A method for producing a color filter according to 7.

  In the invention according to claim 9 of the present invention, the photoresist is a positive photoresist, and a photomask used in a photolithography method for removing f and the resist film is used for forming the resin black matrix. The color filter manufacturing method according to claim 8, wherein the color filter is a photomask.

  The invention according to claim 10 of the present invention is characterized in that after polishing by irradiating with ultraviolet rays, the positive photoresist film is removed by development processing or delamination processing, and then an ITO film is formed over the entire required portion. A method for producing a color filter according to any one of claims 7 to 9.

  According to an eleventh aspect of the present invention, the color filter has a structure in which the ends of the adjacent color material layers overlap each other on the resin black matrix, and requests the angular protrusions generated at the overlapping portions of the color material layers. It is the color filter which grind | polished using the method of any one of claim | item 7-10, and was manufactured by forming an ITO film | membrane.

  The invention according to claim 12 of the present invention is a color filter having a structure in which the ends of adjacent color material layers do not overlap on the resin black matrix, and the height of the square protrusions of the color material layer is 0.5 μm or less. A color filter manufactured using the method according to any one of claims 7 to 10.

  According to the present invention, as a method for polishing and removing only the angular protrusions of the color material layer on the resin black matrix, the color material layer whose film thickness is reduced by irradiation with ultraviolet rays is used, and the portions other than the upper portion of the resin black matrix are used. After forming the ITO film on the substrate, only the angular projections can be polished without polishing the color material layer by using a method of irradiating ultraviolet rays. Further, it is possible to provide a color filter in which the height Δh of the square protrusions of the color material layer is 0.5 μm or less.

  In addition, as a method of forming the ITO film, a resin black matrix is formed by forming an opening pattern in the ITO film by a photoetching method using a photomask used when forming the resin black matrix by a photolithography method. An ITO film can be formed at a portion other than the upper part of the ITO film. In other words, the upper part of the resin black matrix can be exposed from the ITO film. That is, it is not necessary to newly create a photomask in order to form the ITO film with the resin black matrix exposed above.

  In addition, according to the present invention, as a method for polishing and removing only the angular protrusions of the color material layer on the resin black matrix, a color material layer whose film thickness is reduced by irradiation with ultraviolet rays is used, and other than above the resin black matrix. After forming a positive type photoresist film in this portion, by using a method of irradiating with ultraviolet rays, only the square projections can be polished without polishing the color material layer. Further, it is possible to provide a color filter in which the height Δh of the square protrusions of the color material layer is 0.5 μm or less.

Further, a positive photoresist is used as the above-mentioned photoresist, and a photoresist film is formed by using a photomask used when forming a resin black matrix by a photolithography method, and using a positive photo resist by a photolithography method. By forming an opening pattern in the resist film, a positive photoresist film can be formed in a portion other than above the resin black matrix. In other words, the upper part of the resin black matrix can be exposed from the positive photoresist film. That is, it is not necessary to create a new photomask in order to form a positive photoresist film with the upper portion of the resin black matrix exposed.

  Furthermore, for a color filter having a structure in which the ends of adjacent color material layers overlap on the resin black matrix, a color filter is formed by polishing and flattening the square protrusions generated by the overlap of the end portions of the color material layer. Can be provided. In addition, for a color filter having a structure in which the ends of adjacent color material layers do not overlap on the resin black matrix, a color filter in which square protrusions are polished and flattened can be provided.

Cross-sectional explanatory drawing for demonstrating the manufacturing process of a normal color filter, and the production | generation of a square protrusion. Explanatory sectional drawing for demonstrating one manufacturing method of the color filter of a structure where a color material layer overlaps on a resin black matrix. Cross-sectional explanatory drawing explaining an example of the method of manufacturing the color filter of this invention. Cross-sectional explanatory drawing explaining another example of the method of manufacturing the color filter of this invention. Cross-sectional explanatory drawing explaining another example of the method of manufacturing the color filter of this invention. An example of the film thickness reduction rate, that is, the polishing rate, of the color material layer portion and the portion where the ITO film is formed on the color material layer when irradiated with ultraviolet rays. Cross-sectional explanatory drawing explaining another example of the method of manufacturing the color filter of this invention.

  An example of a color filter manufacturing method and a color filter embodiment according to claims 1 to 6 of the present invention will be described below in detail with reference to FIG. Usually, the color material layer of the color filter for liquid crystal is mostly red (R), green (G), and blue (B). The following description also describes the case of three colors. However, recently, color filters having color material layers of other colors have been adopted or proposed. Therefore, the method of the present invention may be used basically regardless of the color of the color material layer, and the present invention is used as long as the color material layer is polished by ultraviolet rays, in other words, the thickness is reduced by ultraviolet rays. be able to.

  FIGS. 3A to 3D are cross-sectional explanatory views for explaining an embodiment of a method for producing a color filter according to the present invention. In FIG. 3A, the resin black matrix 2 is formed on the glass substrate 1 by the above-described photolithography method, and three color material layers 3 (R), 3 (G), and 3 (B) are formed. Indicates the state. As the color material layer, one whose film thickness is reduced by ultraviolet irradiation, that is, one that is polished by ultraviolet irradiation is used. The ends of the adjacent color material layers overlap each other on the resin black matrix. Therefore, the angular protrusion 9 is considerably high. For example, if the thickness of the resin black matrix is 1.5 μm and the thickness of the color material layer is 3 μm, the height of the square protrusion 9 is about 7.5 μm at the maximum in calculation.

FIG. 3B: Next, the ITO film 4 is formed on the portion other than the upper portion of the resin black matrix. As an actual formation method, a photo etching method is used. That is, first, an ITO film is formed on the entire surface so as to cover at least the resin black matrix and the color material layer by using a normal method such as a sputtering method. Next, a photosensitive resin layer is applied and formed on the ITO film.

  Next, pattern exposure is performed on the photosensitive resin layer through an exposure photomask having a predetermined exposure pattern. Next, the photosensitive resin layer that has been subjected to pattern exposure is subjected to development processing and, if necessary, film hardening processing to obtain a photosensitive resin layer that is patterned so that the ITO film portion above the resin black matrix is exposed. .

  Next, the ITO film is etched using a predetermined etching solution. At this time, the patterned photosensitive resin layer becomes an etching-resistant layer, and the ITO film portion covered with the photosensitive resin layer is not etched, and the ITO film portion not covered with the photosensitive resin layer, that is, the resin The ITO film part above the black matrix is selectively etched and removed. Next, the photosensitive resin layer is stripped and removed.

  By performing the above photo-etching method, as shown in FIG. 3 (b), an ITO film covering the portion other than the upper portion of the resin black matrix, that is, an opening portion in the upper portion of the resin black matrix is obtained. It is done.

  As described above, the resin black matrix is formed by a photolithography method using a black photosensitive resin composition as a material and performing pattern exposure and development through an exposure photomask. Therefore, if the exposure photomask used to form the resin black matrix is used during pattern exposure of the photosensitive resin layer formed on the ITO film, the photosensitive resin layer portion located above the resin black matrix is It can be selectively removed.

  In addition, when pattern exposure is performed on the photosensitive resin formed on the ITO film using the exposure photomask used for forming the resin black matrix, the photosensitive method of the photosensitive resin layer formed on the ITO film is resin black. A method opposite to the photosensitive method of the photosensitive resin for forming the matrix may be used. For example, when the photosensitive resin for forming the resin black matrix is a negative type in which a portion exposed to light is cured, the photosensitive resin layer formed on the ITO film may be a positive type. On the contrary, when the photosensitive resin for forming the resin black matrix is a positive type in which a portion not exposed to light remains, the photosensitive resin layer formed on the ITO film may be a negative type.

  FIG. 3C is a diagram showing a state where the ultraviolet ray 5 is irradiated and the square protrusions of the color material layer exposed from the ITO film 4 are being polished. Since the illuminance of ultraviolet rays applied to the angular protrusions is substantially vertical irradiation at the top of the angular protrusions and becomes strong, and as the angle of the side faces of the angular protrusions becomes oblique, the irradiation becomes weaker and becomes weaker. . As a result, as shown in this figure, the angular protrusions are flattened while being polished. Further, if the intensity of the irradiated ultraviolet rays is uniform over the entire surface of the glass substrate, polishing also proceeds uniformly over the entire surface of the glass substrate.

  FIG. 3D: The polishing is finished when the height of the square protrusions of the color material layer decreases and becomes almost flat, or at least when the height of the protrusions is 0.5 μm or less. The ultraviolet irradiation may be terminated while confirming the polishing state, or the irradiation time may be set by a prior experiment. In other words, this is a method in which the polishing speed of the color material layer is obtained in a preliminary experiment, the time for obtaining a predetermined protrusion height (polishing amount) is calculated, and the processing is terminated at the predetermined time. In addition, when irradiation is complete | finished by predetermined time, the height of a square protrusion is measured at the time of completion | finish of irradiation, and in the case of insufficient polishing, additional polishing is performed.

FIG. 3E shows a state where the ITO film 6 is formed on the entire surface while leaving the ITO film 4 formed in FIG. As an actual process, after polishing the square projections of the color material layer to a predetermined height, the substrate is washed and dried as necessary. Next, the ITO layer 6 is formed in a predetermined thickness at a predetermined portion by a usual method, for example, a sputtering method. When the ITO film 6 is overlapped on the ITO film 4 and the adhesion between the two is insufficient, as a method for improving the adhesion, the lower ITO film 4 is first reverse sputtered, and then the normal sputtering method is performed. Alternatively, the method of forming the ITO film 6 may be employed.

  Depending on the specifications of the color filter substrate, the ITO film is not formed after polishing the square protrusions of the color material layer, and the color material layer is exposed from the opening of the ITO film as shown in FIG. A color filter substrate may be used. In addition, the ITO film 6 may be formed only on the ITO film 4 without being formed on the entire surface of the substrate, and the site for forming the ITO film may be selected according to the specification.

  As another method for forming the ITO film 6, a method of forming the ITO film 6 over the entire surface of the substrate after the ITO film 4 is removed by etching or the like may be employed.

  As described above, a color filter having an ITO film formed on the entire surface can be obtained by reducing the height of the square protrusions to 0.5 μm or less over the entire large-area substrate. Therefore, if a color filter substrate manufactured according to the present invention and subjected to alignment treatment is used, alignment defects do not occur even if the liquid crystal is sealed between the substrates to form a liquid crystal display. Even when the width of the resin black matrix is wide, the above method can be used as long as the ends of adjacent color material layers overlap on the resin black matrix.

  FIG. 4 is a cross-sectional explanatory diagram for explaining the method of the present invention in manufacturing a color filter having a structure in which the ends of adjacent color material layers do not overlap on the resin black matrix. FIG. 4A shows the color material except for the portion on the resin black matrix 2 in the color filter substrate in which the color material layer has the square protrusions 9 as described in FIG. The state in which the ITO film 4 is formed on the layers 3 (R), 3 (G), and 3 (B) is shown. As a method for forming the ITO film 4, first, as shown in FIG. 1E, an ITO film is formed on the entire surface. Next, as a photomask, there is a method in which the photomask used when the resin black matrix 2 is formed by photolithography is used, and the ITO film on the resin black matrix is removed by the photoetching method described above.

  FIG. 4B shows a state in which the square protrusions of the color material layer on the resin black matrix are polished by ultraviolet irradiation. In addition, the polishing may be terminated when the height of the angular protrusion becomes 0.5 μm or less, instead of completely removing the angular protrusion.

  Next, the ITO film 4 is removed by a method such as etching. Next, a desired color filter with an ITO film can be obtained by forming the ITO film 6 on the entire surface by a normal method such as sputtering or vapor deposition. The ITO film 4 may be left as it is, and the ITO film 6 may be formed on a predetermined portion of the ITO film 4. Alternatively, the ITO film 6 is not formed, and as shown in FIG. 4B, only the ITO film 4 having an opening may be formed as a color filter formed as an ITO film.

  FIG. 5 is a cross-sectional explanatory diagram of the case where a material that does not reduce the film thickness even when irradiated with ultraviolet rays, that is, a material having ultraviolet polishing resistance, is used as the resin black matrix 2. FIG. 5A shows a state in which the polishing of the color material layer by the ultraviolet irradiation is completed, and the surface of the resin black matrix 2 and the surface of the ITO film 4 are almost the same height from the surface of the substrate 1. The layer is contained in the pixel portion between the resin black matrix. In this state, the thickness of the resin black matrix 2 and the color material layers 3 (R), 3 (G), so that the upper surface of the ITO film 4 formed on the pixel portion and the upper surface of the resin black matrix coincide with each other. This can be achieved by adjusting the thickness of 3 (B) and the thickness of the ITO film 4. Therefore, when an ITO film is formed on these, the ITO film becomes flat, so that a color filter suitable for an IPS liquid crystal display can be obtained.

  FIG. 5B shows a state in which the ITO film 6 is deposited on the ITO film 4. The surface of the ITO film 6 is flat. The ITO film may be a single layer. That is, the ITO film 4 may be formed on the entire surface after the ITO film 4 is removed by a method such as etching. Moreover, if the difference in height between the resin black matrix 2 and the ITO film 4 is 0.5 μm or less, the ITO film can be formed without overcoating, and can be used as a color filter substrate with little liquid crystal alignment disorder. .

  An advantage of the color filter having the cross-sectional shape shown in FIG. 5 is that the thickness of the resin black matrix can be increased. That is, in the conventional resin black matrix, it is necessary to keep the thickness of the resin black matrix low in order to reduce the height of the square protrusions. The composition has a high content ratio of the agent. Therefore, the electric resistance of the resin black matrix is low, and it is difficult to use for a liquid crystal display that requires a high electric resistance of the resin black matrix, such as an IPS liquid crystal display, and it is usually thick on the color filter. An overcoat layer was formed. However, with the structure shown in FIG. 5, the thickness of the resin black matrix can be increased, and the content ratio of the light-shielding agent can be reduced accordingly. As a result, the electric resistance can be increased, and it can be used for an IPS liquid crystal display without forming an overcoat layer.

  Furthermore, with the structure of FIG. 5, the thickness of the color material layer can also be increased. In the conventional method, when the color material layer is thickened, a step difference between the color material layer surface and the resin black matrix surface becomes large on the resin black matrix, so that the ITO film is easily cracked at the step portion. Therefore, the color material layer could not be thickened. However, in the cross-sectional configuration shown in FIG. 5, this problem does not occur because there is no color material layer on the resin black matrix. Therefore, the color material layer can be thickened. By increasing the thickness of the color material layer, the film thickness accuracy at the time of application can be improved, and thus a color filter with good color reproducibility can be manufactured.

  As the conductive film, a conductive film made of zinc oxide or the like has been proposed instead of the ITO film. If the lower color material layer on which the conductive film is formed does not decrease even when irradiated with ultraviolet rays, another conductive film may be used instead of the ITO film.

  Next, among the cases where a photoresist is used as the film for preventing ultraviolet polishing according to the seventh to twelfth aspects of the present invention, the color filter manufacturing method and the color filter An example of the embodiment will be described below on the basis of a cross-sectional explanatory diagram for explaining the steps in FIG. In FIG. 7A, the black matrix 2 is formed on the glass substrate 1, and the color material layers of the adjacent pixels are overlapped with each other to form square projections as in FIG. 7A. Indicates the state. As the color material layer, a material whose film thickness is reduced by ultraviolet irradiation, that is, a material polished by ultraviolet irradiation is used.

  FIG. 7B: Next, a positive photoresist film 7 is formed on a portion other than the upper portion of the resin black matrix. As an actual formation method, a photolithography method is used. That is, first, a positive photoresist film is formed on the entire surface so as to cover at least the resin black matrix and the color material layer by using a usual method such as a spin coating method.

Next, pattern exposure is performed on the positive photoresist film through an exposure photomask having a pattern for exposing only a portion of the black matrix. Further, development processing is performed on the positive photoresist film subjected to pattern exposure, and the positive photoresist film above the resin black matrix is removed.

  By using the above-described photolithography method, as shown in FIG. 7B, a positive photoresist that covers a portion other than the upper portion of the resin black matrix, that is, has a portion above the resin black matrix as an opening. A membrane is obtained.

  As described above, the resin black matrix is formed by a photolithography method using a black photosensitive resin composition as a material and performing pattern exposure and development through an exposure photomask. Therefore, the resin black matrix can be obtained by using the exposure photomask used for forming the resin black matrix as an exposure photomask having a predetermined exposure pattern during pattern exposure of the positive photoresist formed on the entire surface. Since the portion located above is exposed, the portion located above the resin black matrix can be selectively removed by developing the positive photoresist film.

  FIG. 7C is a diagram showing a state in which the rectangular projections of the color material layer exposed from the positive type photoresist film 7 are being polished by irradiating the ultraviolet ray 5. Since the illuminance of ultraviolet rays applied to the angular protrusions is substantially vertical irradiation at the top of the angular protrusions and becomes strong, and as the angle of the side faces of the angular protrusions becomes oblique, the irradiation becomes weaker and becomes weaker. . As a result, as shown in this figure, the angular protrusions are flattened while being polished. Further, if the intensity of the irradiated ultraviolet rays is uniform over the entire surface of the glass substrate, polishing also proceeds uniformly over the entire surface of the glass substrate. Further, the positive photoresist film 7 is also polished by ultraviolet rays, and the film thickness gradually decreases.

  FIG. 7D: Polishing is completed when the height of the angular protrusions of the color material layer decreases and becomes almost flat, or at least when the height of the protrusions is 0.5 μm or less. The ultraviolet irradiation may be terminated while confirming the polishing state, or the irradiation time may be set by a prior experiment. In other words, this is a method in which the polishing speed of the color material layer is obtained in a preliminary experiment, the time for obtaining a predetermined protrusion height (polishing amount) is calculated, and the processing is terminated at the predetermined time. In addition, when irradiation is complete | finished by predetermined time, the height of a square protrusion is measured at the time of completion | finish of irradiation, and in the case of insufficient polishing, additional polishing is performed. Further, the positive photoresist film remains at the end of the polishing and needs to be in a state that can prevent the underlying colorant layer from being subjected to ultraviolet polishing. The thickness for that depends on the positive photoresist used. In addition, the necessary thickness can be reduced by using a material mixed with an ultraviolet absorber or a black dye. The required thickness is determined by testing.

  FIG. 7E: The remaining positive photoresist is irradiated with ultraviolet rays and can be removed using a developer. (E) shows the state after removal.

FIG. 7F shows a state in which the desired color filter is obtained by forming the ITO film 6 on the entire surface.
The ITO film 6 can be formed using a sputtering method or other known methods.

  The positive photoresist that can be used in the present invention is not particularly limited, and a composition comprising a novolac-type phenol resin, a quinonediazide-based photosensitizer, and the like is preferable. Moreover, it can also be appropriately selected from commercially available products such as OFPR-800 (manufactured by Tokyo Ohka Kogyo Co., Ltd.), PF-7400 (manufactured by Sumitomo Chemical Co., Ltd.), and FH-2030 (manufactured by Fuji Hunt Electronics Technology Co., Ltd.). .

In the polishing by ultraviolet rays, when the ultraviolet rays that have passed through the positive photoresist layer will polish the underlying colorant layer, the positive photoresist composition may contain ultraviolet absorbers, black dyes, black pigments, etc. Add one with UV blocking action. The addition amount may be such that the color material layer is not subjected to ultraviolet polishing. When the addition amount is too large, the exposure effect is insufficient at the time of exposure for forming a positive photoresist pattern, and the exposure amount must be increased.

  If desired, the positive photoresist can contain a viscosity modifier, an organic solvent, an adhesion improver, and other known auxiliary agents. As a method for forming the resist layer, a screen printing method, an offset printing method, a roll coating method, a bar coating method, a spin coating method, a slit coating method, or the like can be used. After the application, it is dried by a usual method such as a hot air oven or a hot plate.

  The film thickness of the positive-type photoresist after drying needs to be such a thickness that the angular protrusions of the color material layer remain until they are flattened by UV polishing, and the color material layer underneath is not UV polished. . For example, if the polishing speed of the square protrusions with ultraviolet light is the same as the polishing speed of the positive photoresist with ultraviolet light, the thickness of the positive photoresist is equal to the height of the square protrusions, and the color material layer underneath is the ultraviolet light. Thickness that is not polished is added. The actual thickness required is determined by experiment.

  The optimum wavelength of ultraviolet light used for the exposure of the positive photoresist varies depending on the composition of the positive photoresist, but ultraviolet light generated by an ultrahigh pressure mercury lamp, a metal halide lamp, or the like can be used. Ultraviolet rays having a long wavelength have a small ultraviolet polishing effect.

  The developer used for development after exposure is appropriately selected depending on the type of positive photoresist. Usually, it is appropriately selected from an aqueous solution of sodium hydroxide, sodium carbonate, organic quaternary ammonium salt or the like, or an organic solvent such as ester, ketone, alcohol, ether, chlorinated hydrocarbon or the like. Development, that is, dissolution removal of the exposed portion can be performed by immersion, showering, etc. in about 5 seconds to 20 minutes. If necessary, use rubbing with a brush or woven fabric.

  The ultraviolet ray used for ultraviolet polishing in FIG. 7C may be the same as the ultraviolet ray having the wavelength used in FIG. That is, ultraviolet rays of a low-pressure mercury lamp are preferable because, for example, short wavelength ultraviolet rays have a higher polishing rate. Moreover, in FIG.3 (c) and FIG.7 (c), an ultraviolet-ray is shown as parallel light. Although it may be preferable that it is parallel light, it does not need to be parallel light.

  After the ultraviolet polishing is completed, the positive photoresist is removed. The removal method may be the same as the dissolution removal method during development.

  As described above, by using the polishing action of ultraviolet rays, the color of the entire substrate having a large area is reduced to 0.5 μm or less and the ITO film is formed on the entire surface or a predetermined portion. A filter can be obtained. Therefore, if a color filter substrate manufactured according to the present invention and subjected to alignment treatment is used, alignment defects do not occur even if the liquid crystal is sealed between the substrates to form a liquid crystal display.

  Note that, as described above, a positive photoresist film is used as a film for preventing ultraviolet polishing, and even if the width of the resin black matrix is wide as shown in FIG. It will be understood that the above method can be used as long as the ends of the two layers overlap each other on the resin black matrix. Further, it will be understood that a color filter having the structure shown in FIG. 5 can be created.

It should be noted that, instead of the positive photoresist film, the lower color material layer on which the negative photoresist is formed does not decrease even when irradiated with ultraviolet rays, and the lower photoresist layer is removed when the negative photoresist is removed. As long as there is a film peeling method that does not damage the color material layer, the negative photoresist may be used instead of the positive photoresist film. However, in this case, as a photomask for removing the negative photoresist film on the black matrix, a photomask in which black and white are reversed is used instead of the photomask used when the black matrix is formed.

  The main components of the color material layer are a resin component and a coloring pigment. The color material layer that can be used in the method of the present invention may be any material as long as the resin component is polished by ultraviolet irradiation, that is, the thickness is reduced. The resin that is easily polished by ultraviolet irradiation is basically a resin that easily breaks the bond at the molecular end by ultraviolet irradiation. Acrylic resins are preferred because of their high polishing rate, and various acrylic resins are disclosed and used for the color material layer, but can be used in the present invention.

  On the other hand, those in which the molecular end portion is difficult to be cut are not polished because they are not volatilized even if the central portion of the chain molecule is easily cut. For example, there are polyimide resin and cardo resin. Therefore, as described above, when forming a resin black matrix that is difficult to be polished by ultraviolet irradiation, it is preferable to use a resin component such as a polyimide resin, a cardo resin, or the like whose molecular end is not easily cut by ultraviolet rays. preferable.

  In addition, as long as the square protrusions are large, polishing is performed by a polishing method using an abrasive grain (Oscar polishing method), and after becoming nearly flat, the method can be switched to ultraviolet irradiation polishing using the ITO film described above. Good. When this method is used, it is desirable to partially adjust the irradiation intensity and irradiation time of the ultraviolet rays so that the polishing is finally performed uniformly.

Hereinafter, an example in which a color filter having a resin black matrix width of 8 μm is created will be described with reference to FIG.
(Preparation of black photosensitive resin composition)
Black pigment dispersion ABK-2016 / manufactured by Gokoku Dye Co., Ltd .: 28.9 parts by mass Resin V259-ME (solid content 56.1% by mass) / manufactured by Nippon Steel Chemical Co., Ltd .: 8.08 parts by mass monomer DPHA / Nippon Kayaku Product: 1.761. Mass parts photopolymerization initiator OXE-02 / Ciba Specialty Chemicals: 1.46 parts by mass Solvent propylene glycol monomethyl ether acetate: 54.5 parts by mass Solvent ethyl-3-ethoxypropionate: 43 parts by mass Leveling agent BYK-330 / manufactured by Big Chemie: 10 parts by mass The above materials were mixed and stirred to obtain a black photosensitive resin composition (pigment concentration in solid content: 41.0% by mass).

(Formation of resin black matrix)
The black photosensitive resin composition was applied on a glass substrate 1 and dried so that the film thickness after firing was 1.0 μm. This coating film was heated at 90 ° C. for 5 minutes, and then exposed through a photomask for forming a predetermined resin black matrix using an ultrahigh pressure mercury lamp lamp (exposure amount: 100 mJ / cm ² ). Next, the film was developed with 24.degree. C., 2.52 mass% sodium carbonate aqueous solution for 60 seconds, washed well with water, further dried, and then baked at 230.degree. C. for 60 minutes to cure the pattern. 2 was formed.

  As the color material layer, an acrylic resin varnish for color filter manufactured by Toyo Ink Manufacturing Co., Ltd. was used as the resin component, and the following composition was prepared and used.

(Preparation of red pigment dispersion)
C. I. Pigment Red 254 (“Ilgar Forred B-CF” manufactured by Ciba Specialty Chemicals) 18 parts by mass, C.I. I. 2 parts by weight of Pigment Red 177 (“Chromophthal Red A2B” manufactured by Ciba Specialty Chemicals) and 108 parts by weight of an acrylic resin varnish (solid content: 20% by weight) manufactured by Toyo Ink Manufacturing Co., Ltd. were mixed uniformly. Then, the mixture was dispersed with a glass mill for 5 hours with a sand mill, and filtered with a mesh mesh 5.0 μm filter to prepare a red pigment dispersion.

(Preparation of green pigment dispersion)
C. I. Pigment Green 36 (“Lionol Green 6YK6” manufactured by Toyo Ink Co., Ltd.), 16 parts by mass, C.I. I. 8 parts by weight of Pigment Yellow 150 ("Funchon First Yellow Y-5688" manufactured by Bayer) and 102 parts by weight of an acrylic resin varnish (solid content of 20% by weight) manufactured by Toyo Ink Manufacturing Co., Ltd. A green pigment dispersion was prepared in the same manner as the dispersion.

(Preparation of blue pigment dispersion)
C. I. Pigment Blue 15 (“Rearanol Blue ES” manufactured by Toyo Ink Manufacturing Co., Ltd.) 50 parts by mass, C.I. I. 2 parts by weight of Pigment Violet 23 (“Variogen Violet 5890” manufactured by BASF), 6 parts by weight of a dispersant (“Sols Bath 20000” manufactured by Zeneca), acrylic resin varnish manufactured by Toyo Ink Co., Ltd. (solid content 20 (Mass%) 200 parts by mass was mixed, and a blue pigment dispersion was prepared in the same manner as the red pigment dispersion.

(Preparation of red photosensitive resin composition)
Red pigment dispersion: 150 parts by mass monomer TMP3A / Osaka Organic Chemical Co., Ltd .: 13 parts by mass photopolymerization initiator Irgacure 907 / Ciba Specialty Chemicals: 4 parts by mass sensitizer EAB-F / Hodogaya Chemical Co., Ltd .: 2 parts by mass of solvent cyclohexanone: 257 parts by mass The above materials were mixed and stirred so as to be uniform, and then filtered through a filter having a mesh size of 5 μm to obtain a red photosensitive resin composition.

(Preparation of green photosensitive resin composition)
Green pigment dispersion: 126 parts by mass monomer TMP3A / Osaka Organic Chemical Co., Ltd .: 14 parts by mass photopolymerization initiator Irgacure 907 / Ciba Specialty Chemicals: 4 parts by mass sensitizer EAB-F / Hodogaya Chemical Co., Ltd .: 2 parts by mass solvent cyclohexanone: 257 parts by mass The above materials were mixed and stirred so as to be uniform, and then filtered through a filter having a mesh size of 5 μm to obtain a green photosensitive resin composition.

(Preparation of blue photosensitive resin composition)
Blue pigment dispersion: 258 parts by mass monomer TMP3A / Osaka Organic Chemical Co., Ltd .: 19 parts by mass photopolymerization initiator Irgacure 907 / Ciba Specialty Chemicals: 4 parts by mass sensitizer EAB-F / Hodogaya Chemical Co., Ltd .: 2 parts by mass of solvent cyclohexanone: 214 parts by mass The above materials were mixed and stirred so as to be uniform, and then filtered through a filter having a mesh size of 5 μm to obtain a blue photosensitive resin composition.

(Formation of colored layer)
On the board | substrate in which the resin black matrix was formed, the red photosensitive resin composition was apply | coated so that the film thickness after baking might be set to 1.5 micrometers, and it was dried. The coating film was heated at 90 ° C. for 5 minutes, and then exposed using a mask for forming a pixel portion and an ultrahigh pressure mercury lamp lamp as a light source (exposure amount 200 mJ / cm ² ). Next, development was performed with a 2.5 mass% sodium carbonate aqueous solution at 24 ° C. for 40 seconds, thoroughly washed with water after development, and further dried, and then baked at 230 ° C. for 30 minutes to cure the pattern, thereby forming a resin black matrix 2 A red layer 3 (R) was formed on the substrate.

  Similarly, a green layer 3 (G) (thickness after firing: 1.5 μm) was formed at a position adjacent to the red layer. Further, similarly, a blue layer 3 (B) (thickness after firing: 1.5 μm) is formed, and as shown in FIG. 3 (a), the red, green, and blue ends overlap each other on the resin black matrix. A color filter substrate having the pixel coloring layer 3 was prepared. At this time, the height of the rectangular protrusions of the colored layer (coloring material layer) was 2.2 μm at the highest part.

  Next, an ITO film having a thickness of 0.10 μm was formed on the entire surface of the color filter by sputtering. Next, using the photomask for forming the resin black matrix 2 and a positive photoresist, the ITO film on the resin black matrix is removed by the photoetching method described above, and the ITO film having the pattern shown in FIG. 4 (thickness of 0.10 μm) was formed.

  The color filter with the ITO film prepared as described above was used as a test sample, irradiated with ultraviolet rays, and the reduction rate (polishing rate) of the color material layer was measured. The ultraviolet irradiation device used is a dry UV cleaning device UV-240Z-22-24 (manufactured by Clean Technology), which is a device using a high-pressure mercury lamp. As a result, it was found that ultraviolet rays having wavelengths of 185 nm and 254 nm are effective for polishing. Therefore, the illuminance at a wavelength of 254 nm was used in a state of 15 mW.

  In addition, the result of the ultraviolet ray (UV) irradiation time in this case and the film thickness change of the color material layer irradiated with the ultraviolet ray are shown for each of (red), (green), and (blue) in FIG. As shown in FIG. 6, all three colors had almost the same polishing rate (0.75 μm polishing by irradiation for 30 minutes). Further, in the portion where the ITO film is formed on the color material layer, the film thickness of the color material layer was hardly reduced even when the ultraviolet ray was irradiated. Based on the test results, the ultraviolet irradiation time was set to 90 minutes.

  Next, the color filter substrate with an ITO film actually prepared as described above was irradiated with ultraviolet rays having a wavelength of 254 nm and an illuminance of 15 mW for 90 minutes. As a result, the height of the angular projections of the color material layer after the ultraviolet irradiation was 0.2 μm at the highest part (FIG. 3D). After the ultraviolet irradiation, the color filter substrate is put in a sputtering apparatus, the ITO film 4 is polished by 0.05 μm by reverse sputtering, and then an ITO film 6 having a thickness of 0.15 μm is formed, and a color filter with an ITO film is formed. Obtained (FIG. 3 (e)).

  In this embodiment, the case where a color filter having a flat color material layer, which can be used for an IPS liquid crystal display device, is shown. On the other hand, if the height of the square protrusion is 0.5 μm or less, it can be used for a normal TN liquid crystal display device. In this case, the time required for the above-described ultraviolet polishing is about 70 minutes.

  In the ultraviolet irradiation apparatus used in this example, it took a long time to polish the horn-shaped projections by ultraviolet irradiation. However, there is a great advantage that uniform polishing can be performed over the entire surface even if the area is large, regardless of the substrate size. In addition, the amount of polishing can be adjusted by partially adjusting the illuminance and the irradiation time.

  In addition, as a method of improving the polishing rate by ultraviolet irradiation, there is a method of increasing the amount of ultraviolet irradiation, increasing the oxygen concentration in the irradiation atmosphere to increase the amount of ozone generated during ultraviolet irradiation, and depending on the oxidizing power of the ozone A method of improving the polishing rate, a method of using a resin that is rapidly polished by ultraviolet irradiation, a method of increasing the ambient temperature, and the like may be mentioned, and they may be used as appropriate.

  As a conductive film, a conductive film made of zinc oxide or the like has been proposed instead of the ITO film. If the lower color material layer on which the conductive film is formed does not decrease even when irradiated with ultraviolet rays, another conductive film may be used instead of the ITO film.

DESCRIPTION OF SYMBOLS 1 ... Glass substrate for color filters 2 ... Resin black matrix 3 (R), 3 (B), 3 (G) ... Color material layer 4 ... ITO film 5 ... Ultraviolet rays 6 ...・ ITO film 7 ... Positive photoresist film 9 ... Square protrusion

Claims (12)

  A color filter having a step of forming a resin black matrix on a glass substrate using a photolithography method and then sequentially forming a color material layer having a predetermined pattern by a predetermined number of colors using the photolithography method In this manufacturing method, the angular projections of the color material layer generated by the overlap of the resin black matrix and the color material layer are polished by ultraviolet irradiation, and an ITO film is formed on the portion other than the upper side of the resin black matrix portion before polishing. After that, the method for producing a color filter is characterized by polishing the square protrusions by irradiating with ultraviolet rays.   The method of forming an ITO film on a portion other than the upper side of the resin black matrix is formed so that a color material layer having a predetermined pattern is formed by a predetermined number of colors, and then coated on the resin black matrix and the color material layer. 2. The method for producing a color filter according to claim 1, wherein the film is formed and then the ITO film above the resin black matrix is removed by using a photoetching method.   The method for producing a color filter according to claim 2, wherein the photomask used for the photoetching method for removing the ITO film is a photomask used for forming the resin black matrix.   4. The method for producing a color filter according to claim 1, wherein the ITO film is formed again after polishing by irradiating with ultraviolet rays.   The color filter has a structure in which ends of adjacent color material layers overlap each other on a resin black matrix, and a rectangular protrusion generated at the overlap of color material layers is described in any one of claims 1 to 4. A color filter which is polished by using the method described above.   It is a color filter of the structure where the edge parts of an adjacent color material layer do not overlap on a resin black matrix, The height of the square protrusion of a color material layer is 0.5 micrometer or less, and Claims 1-4 A color filter manufactured using the method according to any one of the preceding claims.   A color filter having a step of forming a resin black matrix on a glass substrate using a photolithography method and then sequentially forming a color material layer having a predetermined pattern by a predetermined number of colors using the photolithography method In this manufacturing method, the square protrusions of the color material layer generated by the overlap of the resin black matrix and the color material layer are polished by ultraviolet irradiation, and a photoresist film is applied to the portion other than the upper portion of the resin black matrix portion prior to polishing. A method for producing a color filter, characterized in that, after the formation, the rectangular protrusions are polished by irradiating ultraviolet rays.   In the method of forming a photoresist film on a portion other than the upper side of the resin black matrix, after forming a predetermined number of colors of the color material layer having a predetermined pattern, the resin black matrix and the color material layer are covered. 8. The method of manufacturing a color filter according to claim 7, wherein a photoresist film is formed and then the photoresist film above the resin black matrix is removed using a photolithography method.   9. The photoresist is a positive photoresist, and a photomask used for a photolithography method for removing the photoresist film is a photomask used for forming the resin black matrix. The manufacturing method of the color filter as described in any one of. 10. The photoresist film according to claim 7, wherein the photoresist film is removed by a development process or a delamination process after polishing by irradiating with ultraviolet rays, and then an ITO film is formed on the entire surface of the required portion. The manufacturing method of the color filter of description.   The color filter has a structure in which ends of adjacent color material layers overlap each other on a resin black matrix, and square protrusions generated at the overlap of color material layers are described in any one of claims 7 to 10. A color filter manufactured by polishing using the above method and forming an ITO film.   The color filter having a structure in which the ends of adjacent color material layers do not overlap on the resin black matrix, the height of the square protrusions of the color material layer is 0.5 μm or less, and A color filter manufactured using the method according to any one of the preceding claims.