JP2010032351A - Operation test support device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an operation test support device for efficient and stable debugging in an operation test of a device to be tested performed by a semiconductor integrated circuit tester on the basis of a test program. <P>SOLUTION: First operation test information about a first operation test performed by the semiconductor tester on the basis of the first test program and second operation test information about a second operation test performed on the basis of the second test program obtained by modifying the first test program are stored, and the difference between the first operation test information and the second operation test information is extracted and displayed so as to be visually recognized. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an operation test support apparatus that supports an operation test of a device under test using a semiconductor integrated circuit test apparatus.

  Conventionally, a semiconductor integrated circuit test apparatus (IC tester) has been used as an apparatus for performing an operation test of a semiconductor integrated circuit (device). Such a semiconductor integrated circuit test apparatus performs an operation test on a device under test (DUT (Device Under Test)) based on a test program in which a test procedure according to a test item is described. Japanese Patent Application Laid-Open No. 2004-228561 proposes a technique for creating such a test program as a template and automatically generating a test program according to the parameters for each test item.

  In recent years, competition in the semiconductor market has intensified, and it is desired to shorten the period for developing new device types (TAT (Turn Around Time)) as much as possible. Here, in order to complete the test process for the new device under test, it is necessary to perform a test program based on information obtained by actually operating the semiconductor integrated circuit test apparatus and debugging of the device under test itself. . In such a debugging operation, based on a test result obtained by actually operating a semiconductor integrated circuit test apparatus, a defective portion and a cause of the test program are found and corrected. Such debugging of the test program is also desirably performed in a short period of time.

Here, a new type of device to be a device to be measured often has the same function and a different specification as another type of device that has already undergone an operation test and has been developed. Therefore, in the debugging work of the test program created to test the new device under test, it is possible to check the difference between the test results of the already developed devices of other types and the test program. In many cases, useful information can be obtained for finding the location and cause of the defect. Conventionally, such difference information is generally acquired using a file difference display function provided as an OS (Operating System) function.
JP 2002-148317 A

  However, the difference display function provided as an OS function as described above only shows a portion whose contents are different between the compared test programs. For example, as shown in FIG. 11, when a plurality of files in which a test program is described are compared, the contents of the files having no difference are not displayed, and only the differences are included in the contents of the files having the differences. Generally output. For this reason, in order for the debug operator to grasp the flow of the test procedure before and after the difference of the test program, it is necessary to display the substance of the test program on a separate screen and check the flow of the test procedure. . As described above, it is a burden on the debugging operator to confirm the substance of the test program for each difference portion of the test program, and as a result, the debugging period takes a long time.

  In addition, in the debugging of the test program, in addition to the difference in the operation procedure itself described in the test program, the difference in the status display of the device under test when executing each operation procedure, the difference in the data log of the test result, the test result The information such as the difference between the wafer maps is also a useful clue for the debugging operator to find the fault location and the fault cause. For such difference information, it is possible to find the difference by organizing the information by using the OS difference display function, or by manually pasting the result of the status display to the spreadsheet software by the debug operator. It was general. The difference extraction performed in this way may take a long time, and the procedure and method for finding the differences may vary depending on the experience and tips specific to the debug operator, so it is not always efficient and stable. There were cases where it could not be said that it was possible.

  The present invention has been made in view of such circumstances, and an operation test support apparatus for performing efficient and stable debugging in an operation test of a device under test performed by a semiconductor integrated circuit test apparatus based on a test program. I will provide a.

  In order to solve the above-described problem, the present invention provides a semiconductor integrated circuit test apparatus using a second test program based on a first operation test performed by a semiconductor integrated circuit test apparatus using a first test program created in advance. Is an operation test support apparatus that supports the second operation test performed by the first operation test information storage unit that stores the first operation test information related to the first operation test, and the second operation test. A second operation test information storage unit for storing second operation test information, an operation test information comparison unit for extracting a difference between the first operation test information and the second operation test information, and a first operation The test information and the second operation test information are arranged, and a comparison control unit that generates screen information from which the difference extracted by the operation test information comparison unit can be visually recognized, and an output that outputs the screen information generated by the comparison control unit Part , Characterized in that it comprises a.

  Further, according to the present invention, the first operation test information and the second operation test information are different from the first measurement item when the semiconductor integrated circuit test apparatus measures the first measurement item. The second measurement value measured for the second measurement item when determining whether or not the first measurement value measured for the measurement item and the measurement result of the first measurement item are within the defined standard value And the operation test information comparison unit extracts a difference between the first measurement value and the second measurement value included in the first operation test information and the second test information.

  In the present invention, the first operation test information and the second operation test information include a determination result as to whether or not the measurement result of the first measurement item is within a predetermined standard value. The operation test information comparison unit extracts a difference between determination results included in the first operation test information and the second test information.

  According to the present invention, the above-described semiconductor integrated circuit test apparatus performs an operation test on a plurality of devices to be measured included in the wafer, and the first operation test information and the second operation test information include a plurality of devices included in the wafer. And the position information indicating the positions of the plurality of devices under measurement on the wafer are included, and the operation test information comparison unit is included in the first operation test information and the second test information. The difference between the determination results is extracted for each corresponding position information, and the comparison control unit arranges the determination results in accordance with the position of the device under measurement on the wafer, and the determination result arrangement diagram in which the difference can be visually recognized for each determination result. Is generated.

  The first operation test information includes a first test program, the second operation test information includes a second test program, and the operation test information comparison unit includes the first operation test information and the second operation test information. The difference between the first test program and the second test program included in the test information is extracted.

  As described above, according to the present invention, the first operation test information related to the first operation test performed by the semiconductor test apparatus based on the first test program, and the first test program in which the first test program is changed. The second operation test information related to the second operation test performed based on the second test program is stored, and the difference between the first operation test information and the second operation test information is extracted and made visible. For example, the difference between the operation test information for the device under test for which the operation test has been completed and the operation test information being debugged is output as a clue to find the defect location and the cause of the defect. It is possible to provide an operation test support apparatus that supports a good operation test.

  Further, according to the present invention, the test program includes an operation procedure for acquiring the measurement value of the device under measurement and an operation procedure for determining whether or not the measurement value is within a predetermined standard value. Because the difference is extracted from the output result of the status display that acquired the measured values of the device under measurement different from the measurement target at both times, the measurement values that are not directly measured are in the test program. It is possible to output a difference as to a state of the state at what point in time as a clue for debugging.

  In addition, according to the present invention, since the difference between the determination results for determining whether or not the measurement value is within the defined standard value is extracted and output, any determination result is different from that of other operation tests. Whether or not they are different can be output as a clue for debugging.

  In addition, according to the present invention, since the difference of the wafer map corresponding to the test result is extracted and output, which part of the wafer map is different from other operation tests is output as a clue for debugging. It becomes possible to do.

  Further, according to the present invention, since the difference of the test program is extracted and output, it is possible to output as a clue for debugging which part of the test program is different from other operation tests. Become.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a block diagram illustrating a configuration of an operation test support apparatus 100 according to the present embodiment. The operation test support apparatus 100 according to the present embodiment compares the test data of the operation test for the device under test performed by the semiconductor integrated circuit test apparatus 50 based on the test program describing the test procedure, and displays the difference. It is. The semiconductor integrated circuit test apparatus 50 uses a plurality of chips of a wafer to be subjected to an operation test as a device to be measured, and performs an operation test on each of the plurality of devices to be measured. The operation test support apparatus 100 includes a first test data storage unit 110, a second test data storage unit 120, an input unit 130, a comparison control unit 140, a reading unit 150, a comparison unit 160, and a GUI display. Unit 170 and a test data acquisition unit 180.

  The first test data storage unit 110 stores first test data performed on a developed device. The first test data includes a TDL (Test Description Language) file 111, a DM (status display) value 112, a data log 113, and a wafer map 114.

  The TDL file 111 is a file in which a test program to be executed by the semiconductor integrated circuit test apparatus 50 is described. In such a TDL file 111, test procedures corresponding to a plurality of test items determined for each module of the device under measurement are described. The semiconductor integrated circuit test apparatus 50 sequentially executes the test procedure stored in the TDL file 111 from the top, and supplies a test signal based on the test procedure to the device under measurement. The test program described in the TDL file 111 includes, for example, a setting procedure, a measurement procedure, and a determination procedure. The setting procedure is an operation procedure for setting values such as a voltage value, a current value, and a signal delay in each module and terminal of the device under measurement. The measurement procedure is an operation procedure (Measure) for measuring a voltage value or a current value of a module to be measured of the device under measurement and a terminal to obtain a measurement value. The determination procedure is an operation procedure (Judge) for determining whether or not the acquired measurement value is within a predetermined standard value.

  The DM value 112 is each value of the device under measurement acquired by executing a DM (status display) command when the semiconductor integrated circuit test apparatus 50 executes each operation procedure of the test program described in the TDL file 111. Is the output result. The output result of the status display includes measured values and set values other than the items to be measured in the above-described operation procedures. For example, the output result of the status display includes the pin names of multiple modules (functions or circuit modules) included in the device under test, the voltage value and current value of each module, the delay value in measurement, etc. Correspondingly recorded. In this way, the output result obtained by acquiring the terminal status different from the terminal to be measured in each procedure in the test program is useful information for debugging the test program and the device under test according to the operation test. It becomes. For example, when the test result of a specific test item for a device of the type being tested becomes FAIL, it is possible to compare the status display of the device under test in the same test item for the device of the previous type Become. Also, if there is an error in the specification of the setting target terminal in the setting procedure, it can be extracted that a value is set for a terminal different from the expected one. In addition, when a new test item is added to the test program for the previous product, a specific test item is deleted, or the test procedure for the test item is replaced, how is the test procedure after the changed part changed? It is possible to analyze whether the impact has been made. In addition, even if the test result is PASS for the product under test, if there is a value different from the expected value, it is possible to investigate afterwards what judgment value was used It becomes.

  The data log 113 is a data file in which test results of operation tests performed by the test program described in the TDL file 111 are recorded. For example, the data log 113 includes, for each test item, a determination result of either PASS indicating that the measured value is within the standard range or FAIL indicating that the measured value is not within the standard range, and a determination target. Included is information that correlates information such as pin values and pin numbers of the module to be judged, the judgment value that is the measured value, the upper and lower limits of the standard range that became the judgment criterion It is.

  The wafer map 114 includes a determination result of a device to be measured included in a wafer to be measured by the semiconductor integrated circuit test apparatus 50 and position information indicating the position of the device to be measured on the wafer. Here, in the determination result, in addition to the determination result indicating either PASS indicating that the measurement value is within the standard range or FAIL indicating that the measurement value is not within the standard range, for example, FAIL In this case, information indicating a category determined according to the cause or situation may be stored.

  The second test data storage unit 120 stores second test data performed on a new device to be debugged. The second test data storage unit 120 stores a TDL file 121, a DM value 122, a data log 123, and a wafer map 124. The content of each data corresponds to each data stored in the first test data storage unit 110.

The input unit 130 is an input device that receives input information and operation information from the user, and for example, a keyboard or a mouse can be applied.
The comparison control unit 140 displays an operation screen that accepts information input from the user on the GUI display unit 170, and the first test data storage unit 110 and the reading unit 150 based on the operation information input from the input unit 130. Test data is read from the second test data storage unit 120. Further, the comparison control unit 140 causes the comparison unit 160 to compare the test data read from the first test data storage unit 110 and the second test data storage unit 120 by the reading unit 150, and displays a comparison screen based on the comparison result. It is displayed on the GUI display unit 170.
The reading unit 150 reads test data to be compared from which the difference is extracted from the first test data storage unit 110 and the second test data storage unit 120 in accordance with a control command from the comparison control unit 140.

The GUI display unit 170 is a display that outputs and displays a GUI (Graphical User Interface) screen corresponding to the operation of the operation test support apparatus 100.
The test data acquisition unit 180 acquires test data such as a TDL file, a DM value, a data log, and a wafer map from the semiconductor integrated circuit test apparatus 50 according to the operation information input to the input unit 130, and the first data The data is stored in the test data storage unit 110 or the second test data storage unit 120. The test data acquisition unit 180 may receive input of operation information for acquiring test data at an arbitrary timing and acquire test data. For example, if the user gets test data every few hours, every day, and if a problem is introduced into the test program that worked correctly until a few days ago, the problem will be corrected. It is possible to confirm by comparison.

  The comparison unit 160 performs a process of comparing the test data read by the reading unit 150 from the first test data storage unit 110 and the second test data storage unit 120 and extracting the difference. The comparison unit 160 includes a TDL file comparison unit 161, a DM value comparison unit 162, a data log comparison unit 163, and a wafer map comparison unit 164.

  The TDL file comparison unit 161 compares the TDL file 111 read by the reading unit 150 from the first test data storage unit 110 and the TDL file 121 read from the second test data storage unit 120 for each described line. To extract the difference. FIG. 2 is a diagram illustrating a screen example in which the comparison control unit 140 displays the difference extracted by the TDL file comparison unit 161 on the GUI display unit 170. In the area of FIG. 2A, a tool button for accepting an input from the user is displayed. As the tool button, for example, a “Dataset” button, a “Diff” button, a “Prev” button, a “Next” button, and the like are displayed.

  The “Dataset” button is a button for opening a screen for selecting a data set to be compared and determined. A data set is a unit of information of an operation test performed on a device under test by a semiconductor integrated circuit test apparatus. For example, the data set includes a TDL file, a pattern file, and a device definition file. The pattern file describes a pattern of a test signal to be transmitted from the semiconductor integrated circuit test apparatus 50 to the device under measurement. In the device definition file, the names of the physical channels and pins of the modules included in the device under test are defined and described in association with the logical names. Each name defined in the device definition file is used when a module of a device under measurement to be set or measured is specified in a test program described in a TDL file. Each name defined in the device definition file is a module to be tested, and the DM command described above outputs the pin states for all channels defined in the device definition file.

  FIG. 3 is a diagram illustrating an example of a data set selection screen displayed when the “Dataset” button is pressed. In FIG. 3, data sets such as “test2” and “pt0725” are displayed as data sets to be selected. The operation test support apparatus 100 can cause the user to select a data set to be compared and determined for the test data from among these, and perform a determination comparison process for any data set.

  Returning to FIG. 2, the “Diff” button in the area (a) indicates that the first test data storage unit 110 and the second test data storage unit are read by the reading unit 150 corresponding to the data set selected as the determination comparison target. 120 is a button for inputting a command for causing the comparison unit 160 to execute the comparison determination process of the test data read from 120. The “Prev” button is a button for changing the comparison determination target from the selected data set to the previous data set. The “Next” button is a button for changing the comparison determination target from the selected data set to the next data set.

  In the area of FIG. 2B, a tab for accepting selection of the type of test data to be compared and determined by the comparison unit 160 is displayed. In the example of the present embodiment, the test data to be compared and determined include “Test Program” indicating that the TDL file is to be compared and “DM” indicating that the DM value is to be compared and determined, Tabs of “Data Log” indicating that the data log is a comparison determination target and “Wafer Map” indicating that the wafer map is a comparison determination target are displayed. Further, among the tabs displayed in (b), the characters of the tab of the test data selected as the comparison determination target are displayed in an emphasized manner. In the example of FIG. 2, “Test Program” is highlighted. When any of the tabs is pressed, the selected test data is switched.

  In the area of (c) of FIG. 2, the test data comparison determination result is displayed. A scroll bar is displayed in the area (n) at the right end of the area (c). In the comparison of “Test Program”, the area (c) is vertically divided into a difference display window (d) and an entire display window (e). In the area (d), the difference comparison result between the TDL file of the first test data and the TDL file of the second test data by the OS difference display function is displayed. Here, only the lines that differ in the contents of the TDL file of the first test data and the TDL file of the second test data are displayed. For this reason, the user can visually grasp the amount of lines that have a difference in the contents of the test program. In the area (f) in the difference display window (d), a portion where a difference exists in the file contents to be compared is displayed. When there is no difference in the file contents to be compared, the file contents are not displayed as shown in (g). Here, the difference display displayed in the area (d) by the TDL file comparison unit 161 may output information acquired by the difference display function provided by the OS.

  On the other hand, the contents of both the TDL file of the first test data and the TDL file of the second test data to be compared are displayed side by side in the area of the entire display window of (e). . Here, the contents of the TDL file of the first test data and the TDL file of the second test data are all displayed. For this reason, the user can visually grasp a portion where there is a difference in the contents of the test program. In the area (j) on the left side of the area (e), the test program of the TDL file included in the first test data is displayed. In the area (i) at the left end of the area (j), the line number of the test program displayed in the area (j) is displayed.

  On the other hand, in the area (m) on the right side of the area (e), the test program for the TDL file included in the second test data is displayed. The line number of the test program displayed in the area (m) is displayed in the area (k) at the left end of the area (m). Here, in the data displayed in the area (j) or (m), the text color is displayed in a color different from the other colors for the lines with differences. For example, if data with no difference is displayed in a black font, the text “lcd {lcdrly = on;}” displayed in the area (j) corresponding to line number 1 in (i) is: Displayed in blue font. In addition, the texts “lcd {lcdrly = off;}” and “lcdpin (1001) {conn = open;}” displayed in the area (m) corresponding to the line numbers 1 and 2 in (k) are: Displayed in red font.

  In addition, when a line is added to or deleted from the content of the test program, the TDL file comparison unit 161 displays the display lines in the area (j) and the area (m) in alignment. . For example, a blank line is inserted in the line (j) corresponding to the line number 2 added in (m), and the line number 2 in (j) and the line number 3 in (m) are inserted. Display side by side on the same line. In this way, the user can visually grasp the connection and flow before and after the difference part by displaying not only the part with the difference but also displaying the entire test program and changing the color of the part with the difference. become able to.

  Here, in the area (h) at the left end of the area (e), there is a difference in each line of the test program between the TDL file of the first test data and the TDL file of the second test data. If there is, an alphabetic character indicating the type of difference is displayed. In this embodiment, a line in which the TDL file of the second test data displayed in (m) is changed with respect to the TDL file of the first test data displayed in (j) includes (h) "C" (change) is displayed in the area. “A” (add) is displayed in the line added in the TDL file of the second test data to the TDL file of the first test data. “D” (delete) is displayed in a line deleted in the TDL file of the second test data with respect to the TDL file of the first test data.

  Furthermore, the display of the test program displayed in the area (d) and the display of the test program displayed in the area (e) may be linked. For example, in the difference display window of (d), when the operation information that the mouse is clicked or the return key is pressed is input from the input unit 130 in a state where the mouse cursor is placed at a specific difference position, A line of the test program corresponding to the position of the mouse cursor may be displayed in the entire display window of (e).

  The DM value comparison unit 162 compares the DM value 112 read by the reading unit 150 from the first test data storage unit 110 with the DM value 122 read from the second test data storage unit 120. FIG. 4 is a diagram illustrating a screen example that the comparison control unit 140 displays on the GUI display unit 170 based on the comparison result by the DM value comparison unit 162. When the “DM” tab in the area (b) of FIG. 4 is pressed and the “Diff” button is pressed, the area (c) is switched to a DM value comparison screen as shown in FIG.

  In FIG. 4, the area (c) where the comparison result is displayed includes an area where a test number (TestNo) for identifying a test item is displayed, and an alphabetic character indicating the type of change when the DM value is changed. According to the status display command, an area in which (Index) is displayed, an area in which the location in the test program from which the DM value is acquired is a measurement location (Measure) or a determination location (Judge) And an area for displaying a status display of each module. Here, when each module included in the device under test has a plurality of channels and pins, the states of all channels and pins defined in the device definition file included in the data set are displayed. Here, the information displayed in the area (c) by the DM value comparison unit 162 may be output by using a function of spreadsheet software installed in the operation test support apparatus 100 in advance.

  In each cell displayed in the area (c), the status of the previous type of each module corresponding to the test number is displayed, and there is a difference between the status of the previous type and the status of the type being debugged. The difference is displayed. If there is a difference between the status of the previous product and the product being debugged, the output value of the current status is displayed on the line next to the status display line of the previous product. In the Index area corresponding to an output value having a difference, “c” is displayed for a changed line, “a” is displayed for an added line, and “d” is displayed for a deleted line. . Moreover, the cell which has a difference makes the background color of the cell different from others. For example, if there is a difference, the old test data cell has a green background color, and the test data cell being debugged has a red background color.

  The data log comparison unit 163 compares the data log 113 read by the reading unit 150 from the first test data storage unit 110 with the data log 123 read from the second test data storage unit 120. FIG. 5 is a diagram illustrating a screen example that the comparison control unit 140 displays on the GUI display unit 170 based on the comparison result by the data log comparison unit 163. When the “DataLog” tab in the area (b) of FIG. 5 is pressed and the “Diff” button is pressed, the area (c) is switched to a data log comparison screen as shown in FIG.

  In FIG. 5, the area (c) where the comparison result is displayed is associated with the test number (TestNo) for identifying the test item, and the contents of the data log 113 of the first test data are displayed in the area (p). However, the contents of the data log 123 of the second test data are displayed in the area (q). At this time, a cell having a difference between the first test data and the second test data changes the background color of the cell to a different color. For example, if there is a difference, the old test data cell has a green background color, and the test data cell being debugged has a red background color. If test numbers have been added or deleted, insert blank cells at the locations where there are differences so that the display of the test number and test result contents will not be misaligned. Match.

  The wafer map comparison unit 164 compares the wafer map 114 read from the first test data storage unit 110 by the reading unit 150 with the wafer map 124 read from the second test data storage unit 120. FIG. 6 is a diagram illustrating a screen example that the comparison control unit 140 displays on the GUI display unit 170 based on the comparison result by the data log comparison unit 163. When the “WaferMap” tab in the area of FIG. 6B is pressed and the “Diff” button is pressed, the area of FIG. 6C is switched to a wafer map comparison screen as shown in FIG.

  In the area (c) where the comparison result is displayed in FIG. 6, the respective determination results of the devices (chips) acquired from the wafer to be tested are displayed according to the shape of the wafer. A cell is arranged on the wafer map in accordance with the position of the device from which the determination result is obtained, and an alphabetical character indicating the test result of the first test data and the second test data is “:” (colon). ) Are displayed. For example, when the test result is PASS, “0” is displayed, and when the test result is FAIL, an alphabetic character corresponding to the category of FAIL is displayed. When there is a difference between the first test data and the second test data, the cell has a background color different from that of the other cells. Here, when there are a plurality of wafer maps, a plurality of the entire wafer maps may be displayed side by side.

Next, an operation example in which the operation test support apparatus 100 according to the present invention performs a comparison process between the first test data and the second test data will be described.
FIG. 7 is a flowchart illustrating an operation example of a TDL file comparison process performed by the operation test support apparatus 100.
On the screen displayed on the GUI display unit 170 after the operation test support apparatus 100 is activated, the “Test Program” tab is selected in the area (b) in FIG. 2 described above, and “Diff” in the area (a). When the button is pressed (step S11), the comparison control unit 140 transmits a TDL file read command to the reading unit 150 (step S12).

  The reading unit 150 reads the TDL file 111 stored in the first test data storage unit 110 (step S13). Further, the reading unit 150 reads the TDL file 121 stored in the second test data storage unit 120 (step S14). The TDL file comparison unit 161 of the comparison unit 160 compares the TDL file 111 read by the reading unit 150 with the TDL file 121 and extracts a difference (step S15). Then, the comparison control unit 140 causes the GUI display unit 170 to display a difference display screen as shown in FIG.

FIG. 8 is a flowchart illustrating an operation example of a DM value comparison process performed by the operation test support apparatus 100.
On the screen displayed on the GUI display unit 170 of the operation test support apparatus 100, the “DM” tab is selected in the area (b) in FIG. 2 described above, and the “Diff” button in the area (a) is pressed. Then (step S21), the comparison control unit 140 transmits a DM value read command to the reading unit 150 (step S22).

  The reading unit 150 reads the DM value 112 stored in the first test data storage unit 110 (step S23). Further, the reading unit 150 reads the DM value 122 stored in the second test data storage unit 120 (step S24). The DM value comparison unit 162 of the comparison unit 160 compares the DM value 112 read by the reading unit 150 with the data log 113 and extracts a difference (step S25). Then, the comparison control unit 140 causes the GUI display unit 170 to display a difference display screen as shown in FIG.

FIG. 9 is a flowchart illustrating an operation example of a data log comparison process performed by the operation test support apparatus 100.
On the screen displayed on the GUI display unit 170 of the operation test support apparatus 100, the “DataLog” tab is selected in the area (b) in FIG. 4 described above, and the “Diff” button in the area (a) is pressed. Then (step S31), the comparison control unit 140 transmits a data log read command to the reading unit 150 (step S32).

  The reading unit 150 reads the data log 113 stored in the first test data storage unit 110 (step S33). The reading unit 150 reads the data log 123 stored in the second test data storage unit 120 (step S34). The data log comparison unit 163 of the comparison unit 160 compares the data log 113 and the data log 123 read by the reading unit 150, and extracts a difference (step S35). Then, the comparison control unit 140 causes the GUI display unit 170 to display a difference display screen as shown in FIG.

FIG. 10 is a flowchart illustrating an operation example of wafer map comparison processing performed by the operation test support apparatus 100.
On the screen displayed on the GUI display unit 170 of the operation test support apparatus 100, the “WaferMap” tab is selected in the area (b) in FIG. 5 described above, and the “Diff” button in the area (a) is pressed. Then (step S41), the comparison control unit 140 transmits a wafer map read command to the read unit 150 (step S42).

  The reading unit 150 reads the wafer map 114 stored in the first test data storage unit 110 (step S43). Further, the reading unit 150 reads the wafer map 124 stored in the second test data storage unit 120 (step S44). The wafer map comparison unit 164 of the comparison unit 160 compares the wafer map 114 read by the reading unit 150 with the wafer map 124, and extracts a difference for each chip having the same position in the wafer map (step S45). Then, the comparison control unit 140 causes the GUI display unit 170 to display a difference display screen as shown in FIG.

  In the present embodiment, the first test data storage unit 110 stores test data for a developed device as a comparison target of debug target test data, but the first test data storage unit 110 may store test data of different tests performed on the same product type. For example, the test data of the operation test performed using the test program in which the defect is found is compared with the test data of the operation test performed using the test program in which the defect is corrected, and the difference is extracted and output. Anyway.

Further, even if a new type of device to be measured is the same type, the description contents of the test program for evaluation and the test program for mass production may be slightly different. In such a case, the present invention can also be applied to extract the difference.
In the present embodiment, the GUI display unit 170 has been described as a display. However, for example, the GUI display unit 170 may be a printing unit that prints the comparison result by the comparison unit 160 on paper.

  As described above, according to the present embodiment, the test data that has been previously subjected to the operation test by the semiconductor integrated circuit test apparatus 50 is compared with the data that has been subjected to the operation test on the device under debug. It is possible to provide an operation test support apparatus that can be grasped at a glance without manual work in which the difference is complicated. Furthermore, the difference can be easily grasped by changing the character color of the difference, changing the background color, or displaying them side by side in the same cell. In addition, an arbitrary data set can be designated as a comparison target. In this way, by comparing with the type of test data and the currently debugged state, it is possible to perform debugging with high development efficiency by utilizing the assets and debug state of the previous type.

  In addition, the program for realizing the function of the processing unit in the present invention is recorded on a computer-readable recording medium, and the program recorded on the recording medium is read into the computer system and executed to compare the test data. Processing may be performed. Here, the “computer system” includes an OS and hardware such as peripheral devices. The “computer system” includes a WWW system having a homepage providing environment (or display environment). The “computer-readable recording medium” refers to a storage device such as a flexible medium, a magneto-optical disk, a portable medium such as a ROM and a CD-ROM, and a hard disk incorporated in a computer system. Further, the “computer-readable recording medium” refers to a volatile memory (RAM) in a computer system that becomes a server or a client when a program is transmitted via a network such as the Internet or a communication line such as a telephone line. In addition, those holding programs for a certain period of time are also included.

  The program may be transmitted from a computer system storing the program in a storage device or the like to another computer system via a transmission medium or by a transmission wave in the transmission medium. Here, the “transmission medium” for transmitting the program refers to a medium having a function of transmitting information, such as a network (communication network) such as the Internet or a communication line (communication line) such as a telephone line. The program may be for realizing a part of the functions described above. Furthermore, what can implement | achieve the function mentioned above in combination with the program already recorded on the computer system, and what is called a difference file (difference program) may be sufficient.

It is a figure which shows the terminal structure of the operation | movement test assistance apparatus by one Embodiment of this invention. It is a figure which shows the example of the TDL file comparison screen by one Embodiment of this invention. It is a figure which shows the example of the data set selection screen by one Embodiment of this invention. It is a figure which shows the example of the DM value comparison screen by one Embodiment of this invention. It is a figure which shows the example of the data log comparison screen by one Embodiment of this invention. It is a figure which shows the example of the wafer map comparison screen by one Embodiment of this invention. It is a flowchart which shows the example of the TDL file comparison process by one Embodiment of this invention. It is a flowchart which shows the example of DM value comparison processing by one Embodiment of this invention. It is a flowchart which shows the example of the data log comparison process by one Embodiment of this invention. It is a flowchart which shows the example of the wafer map comparison process by one Embodiment of this invention. It is a figure which shows the example of the TDL file comparison screen by a prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 50 Semiconductor integrated circuit test apparatus 100 Operation test support apparatus 110 1st test data memory | storage part 111 TDL file 112 DM value 113 Data log 114 Wafer map 120 2nd test data memory | storage part 121 TDL file 122 DM value 123 Data log 124 Wafer Map 130 Input unit 140 Comparison control unit 150 Reading unit 160 Comparison unit 161 TDL file comparison unit 162 DM value comparison unit 163 Data log comparison unit 164 Wafer map comparison unit 170 GUI display unit 180 Test data acquisition unit

Claims (5)

An operation test for supporting a second operation test performed by the semiconductor integrated circuit test apparatus using a second test program based on a first operation test performed by the semiconductor integrated circuit test apparatus using a first test program created in advance. A support device,
A first operation test information storage unit for storing first operation test information related to the first operation test;
A second operation test information storage unit for storing second operation test information related to the second operation test;
An operation test information comparison unit for extracting a difference between the first operation test information and the second operation test information;
A comparison control unit that arranges the first operation test information and the second operation test information, and generates screen information in which the difference extracted by the operation test information comparison unit can be visually recognized,
An output unit for outputting the screen information generated by the comparison control unit;
An operation test support device comprising: The first operation test information and the second operation test information include a second measurement that is different from the first measurement item when the semiconductor integrated circuit test apparatus measures the first measurement item. The second measurement value measured for the second measurement item when determining whether or not the first measurement value measured for the item and the measurement result of the first measurement item are within a predetermined standard value And include
The operation test information comparison unit extracts a difference between the first measurement value and the second measurement value included in the first operation test information and the second test information. Item 3. The operation test support device according to Item 1. The first operation test information and the second operation test information include a determination result as to whether or not the measurement result of the first measurement item is within a defined standard value,
The operation according to claim 1, wherein the operation test information comparison unit extracts a difference between the determination results included in the first operation test information and the second test information. Test support device. The semiconductor integrated circuit test apparatus performs an operation test on a plurality of devices to be measured on a wafer,
The first operation test information and the second operation test information include a determination result of the plurality of devices to be measured included in the wafer and position information indicating positions of the plurality of devices to be measured on the wafer. Contains
The operation test information comparison unit extracts a difference between the determination results for each of the corresponding position information included in the first operation test information and the second test information,
The said comparison control part arrange | positions the said determination result according to the position of the said to-be-measured device on the said wafer, and produces | generates the determination result arrangement | positioning map which can visually recognize the said difference for every said determination result. The operation test support device according to any one of claims 1 to 3. The first operation test information includes the first test program, and the second operation test information includes the second test program,
The operation test information comparison unit extracts a difference between the first test program and the second test program included in the first operation test information and the second test information. The operation test support device according to any one of claims 1 to 4.

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