JP2010032328A - Ultrasonic sensor - Google Patents

Ultrasonic sensor Download PDF

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JP2010032328A
JP2010032328A JP2008194054A JP2008194054A JP2010032328A JP 2010032328 A JP2010032328 A JP 2010032328A JP 2008194054 A JP2008194054 A JP 2008194054A JP 2008194054 A JP2008194054 A JP 2008194054A JP 2010032328 A JP2010032328 A JP 2010032328A
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vibration
ultrasonic sensor
ultrasonic
connecting portion
piezoelectric element
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JP4915597B2 (en
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Koji Urase
浩司 浦瀬
Koji Nagano
康志 永野
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Panasonic Electric Works Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an ultrasonic sensor which suppresses vibration of a housing section where a piezoelectric element for performing only reception of an ultrasonic wave is housed, stabilizes the directivity of the ultrasonic wave more, and improves a reverberation characteristics. <P>SOLUTION: A piezoelectric element 26a is a type of element which transmits an ultrasonic wave whose center frequency is 72 kHz, and the height of a vibration case and a uniting section 23 are set so that the ratio of the height of the vibration case 20 and the thickness of the uniting section 23 becomes 2:1 when the frequency is set. As a result, the vibration of the housing section 21b is suppressed, the directivity of the ultrasonic wave is more stabilized, and the reverberation characteristics are improved. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、車両用障害物検知装置などに用いられる超音波センサに関する。   The present invention relates to an ultrasonic sensor used in a vehicle obstacle detection device and the like.

近年、超音波センサを車両前方又は後方のバンパーに支持するとともに、この超音波センサから所定の超音波パルス信号を送信し、物体からの反射波を受波することにより、前方又は後方に存在する障害物を検知する車両用障害物検知装置が知られている。このような車両用障害物検知装置に用いられる超音波センサには、例えば、特許文献1のような構造のものがある。   In recent years, an ultrasonic sensor is supported on a front or rear bumper of a vehicle, and a predetermined ultrasonic pulse signal is transmitted from the ultrasonic sensor, and a reflected wave from an object is received, thereby existing in front or rear. A vehicle obstacle detection device that detects an obstacle is known. As an ultrasonic sensor used in such a vehicle obstacle detection device, for example, there is one having a structure as disclosed in Patent Document 1.

特許文献1の超音波センサ40は、図9に示すように、1つの金属製の振動ケース50に、有底円筒状の2つの収容部51a,51bが離間して凹設されており、2つの収容部51a,51bは、連結部(平板部)52によって連結されている。なお、特許文献1の超音波センサ40において、連結部52の厚みは、振動ケース50の高さよりもはるかに短く形成されている(例えば、振動ケース50の高さ:連結部52の厚み=10:1)。そして、各収容部51a,51bには、超音波を送受波する圧電素子53a,53bがそれぞれ収容されており、圧電素子53aが超音波の送受波を行う一方で、圧電素子53bが超音波の受波のみを行うようになっている。そして、圧電素子53aが超音波を受波するまでの時間と、圧電素子53bが超音波を受波するまでの時間との差から、障害物が存在する方向や位置を検知することができるようになっている。
特開2004−253911号公報
As shown in FIG. 9, the ultrasonic sensor 40 of Patent Literature 1 has two bottomed cylindrical accommodating portions 51 a and 51 b that are spaced apart and recessed in one metal vibration case 50. The two accommodating portions 51 a and 51 b are connected by a connecting portion (flat plate portion) 52. In the ultrasonic sensor 40 of Patent Document 1, the thickness of the connecting portion 52 is much shorter than the height of the vibrating case 50 (for example, the height of the vibrating case 50: the thickness of the connecting portion 52 = 10). : 1). The accommodating portions 51a and 51b accommodate piezoelectric elements 53a and 53b that transmit and receive ultrasonic waves, respectively. The piezoelectric elements 53a transmit and receive ultrasonic waves, while the piezoelectric elements 53b transmit and receive ultrasonic waves. Only receive the wave. The direction and position where the obstacle exists can be detected from the difference between the time until the piezoelectric element 53a receives the ultrasonic wave and the time until the piezoelectric element 53b receives the ultrasonic wave. It has become.
JP 2004-253911 A

近年では、デザイン性や見た目上の問題などから、超音波センサを小型化することが考えられている。そこで、特許文献1の超音波センサ40を、連結部52の厚みや、振動ケース50の高さなどにおける比率関係を利用し、同じ比率関係のままで超音波センサ40自体を小型化することも考えられる。しかしながら、そのまま、特許文献1の超音波センサ40の小型化を図ると、小型化する前と後では、超音波の指向性や残響波の長さが変わってしまう虞があった。   In recent years, it has been considered to reduce the size of an ultrasonic sensor due to the design and appearance problems. Therefore, the ultrasonic sensor 40 of Patent Document 1 may be miniaturized using the ratio relationship in the thickness of the connecting portion 52, the height of the vibration case 50, and the like, while maintaining the same ratio relationship. Conceivable. However, if the ultrasonic sensor 40 of Patent Document 1 is downsized as it is, there is a possibility that the directivity of the ultrasonic wave and the length of the reverberation wave may change before and after the downsizing.

そして、超音波センサには、超音波の指向性の形状が、検知エリアにそのまま反映するという特性や、残響波が長くなってしまうと、反射波が残響波と重なってしまい、その結果として近くの障害物を検知し難くなるという特性がある。これらの現象は、圧電素子53aを収容する収容部51aの振動が、圧電素子53bを収容する収容部51bに伝播することによって起こるようになっている。しかしながら、超音波センサがどのような大きさ又は形状であっても、超音波の指向性を安定させるとともに、残響波が長くなってしまうことを抑制しなければならない。   And in the ultrasonic sensor, the characteristic that the directivity shape of the ultrasonic wave is reflected in the detection area as it is, or if the reverberation wave becomes long, the reflected wave overlaps with the reverberation wave. It is difficult to detect obstacles. These phenomena are caused by the vibration of the accommodating portion 51a that accommodates the piezoelectric element 53a being propagated to the accommodating portion 51b that accommodates the piezoelectric element 53b. However, regardless of the size or shape of the ultrasonic sensor, it is necessary to stabilize the directivity of the ultrasonic wave and to prevent the reverberant wave from becoming long.

本発明は、このような実情に鑑みてなされたものであり、その目的は、超音波の受波のみを行う圧電素子が収容された収容部の振動を抑制し、より超音波の指向性を安定させるとともに、残響特性を良化することのできる超音波センサを提供することにある。   The present invention has been made in view of such circumstances, and its purpose is to suppress vibration of the housing portion in which the piezoelectric element that receives only the ultrasonic waves is housed, and to further improve the directivity of the ultrasonic waves. An object of the present invention is to provide an ultrasonic sensor that can stabilize and improve reverberation characteristics.

上記問題点を解決するために、請求項1に記載の発明は、超音波が出射及び入射する入出射面を有し、該入出射面の反対側に底面を有する複数個の収容部が並設された振動ケースと、前記複数個の収容部を連結する連結部と、前記収容部の底面に配設された複数個の圧電素子と、を備え、前記圧電素子のうち少なくとも1つは超音波を送波するために用いられる送波用の圧電素子であって、圧電素子のうち少なくとも2つは超音波を受波するために用いられる受波用の圧電素子である超音波センサにおいて、前記圧電素子は、送波する超音波の中心周波数が72kHzタイプのものであって、その周波数が設定されている場合における前記振動ケースの高さと前記連結部の厚みとの比を、2:1〜3:1の範囲に設定したことを要旨とする。   In order to solve the above-mentioned problems, the invention according to claim 1 is characterized in that a plurality of accommodating portions having an incident / exit surface on which an ultrasonic wave is emitted and incident and a bottom surface on the opposite side of the incident / exit surface are arranged. And a plurality of piezoelectric elements disposed on a bottom surface of the housing portion, wherein at least one of the piezoelectric elements is super In the ultrasonic sensor, which is a piezoelectric element for wave transmission used for transmitting a sound wave, and at least two of the piezoelectric elements are piezoelectric elements for wave reception used for receiving an ultrasonic wave, The piezoelectric element has a center frequency of ultrasonic waves to be transmitted of 72 kHz type, and the ratio between the height of the vibration case and the thickness of the connecting portion when the frequency is set is 2: 1. The gist is that it is set in a range of ˜3: 1.

この発明によれば、超音波の受波のみを行う圧電素子が収容された収容部の振動を抑制し、より超音波の指向性を安定させるとともに、残響特性を良化することができる。
請求項2に記載の発明は、請求項1に記載の超音波センサおいて、前記連結部は、樹脂形成されていることを要旨とする。
According to the present invention, it is possible to suppress the vibration of the housing portion in which the piezoelectric element that only receives ultrasonic waves is housed, to further stabilize the directivity of the ultrasonic waves, and to improve the reverberation characteristics.
The invention according to claim 2 is the ultrasonic sensor according to claim 1, wherein the connecting portion is formed of resin.

請求項3に記載の発明は、請求項1に記載の超音波センサにおいて、前記連結部は、ゴム材で形成されていることを要旨とする。
請求項2及び請求項3に記載の発明によれば、2つの振動ケースを並べるだけで、樹脂やゴム材のような比較的コストのかからない部材によって2つの振動ケースを連結させることができるので、超音波センサの製造にかかるコストを削減することができる。
The gist of the invention described in claim 3 is the ultrasonic sensor according to claim 1, wherein the connecting portion is formed of a rubber material.
According to the invention according to claim 2 and claim 3, since the two vibration cases can be connected by a relatively inexpensive member such as a resin or a rubber material, only by arranging the two vibration cases. The cost for manufacturing the ultrasonic sensor can be reduced.

本発明によれば、超音波の受波のみを行う圧電素子が収容された収容部の振動を抑制し、より超音波の指向性を安定させるとともに、残響特性を良化することができる。   ADVANTAGE OF THE INVENTION According to this invention, the vibration of the accommodating part in which the piezoelectric element which receives only an ultrasonic wave was accommodated can be suppressed, the directivity of an ultrasonic wave can be stabilized more, and a reverberation characteristic can be improved.

以下、本発明を車両用障害物検知装置に用いられる超音波センサに具体化した第1の実施形態を図1〜図7にしたがって説明する。
図1及び図2に示すように、本実施形態の超音波センサ10を構成するハウジング11は、水平方向への断面視が略楕円状をなしている(図2参照)。ハウジング11には、圧電素子26a,26bを収容するための複数個(本実施形態では2個)の収容部21a,21bを長手方向に並べて凹設した金属製の振動ケース20が、ハウジング11の開口部側から挿入されている。
A first embodiment in which the present invention is embodied in an ultrasonic sensor used in an obstacle detection device for a vehicle will be described below with reference to FIGS.
As shown in FIGS. 1 and 2, the housing 11 constituting the ultrasonic sensor 10 of the present embodiment is substantially elliptical in cross-sectional view in the horizontal direction (see FIG. 2). In the housing 11, a metal vibration case 20 in which a plurality (two in this embodiment) of receiving portions 21 a and 21 b for receiving the piezoelectric elements 26 a and 26 b are arranged in the longitudinal direction and recessed is provided on the housing 11. It is inserted from the opening side.

振動ケース20には、各収容部21a,21bと同一方向に開口する仕切り凹部22が、収容部21aと収容部21bの間を仕切るように形成されている。仕切り凹部22の深さは、各収容部21a,21bの深さよりも浅く、本実施形態では振動ケース20の高さの半分の長さに相当する深さで形成されている。そして、振動ケース20において、仕切り凹部22の底面に対応する部位は、収容部21a,21bを連結する連結部23とされている。なお、本実施形態において、連結部23の厚みは、仕切り凹部22の深さと同一長さであって、振動ケース20の高さの半分の長さに相当する厚みで形成されている。また、連結部23は、収容部21a,21bの凹設によって収容部21a,21bよりも底側に形成された残部23a,23bと連結している。本実施形態における振動ケース20は、1つの収容部が形成された振動ケースが、2つ連結されることで形成されているのではなく、1つの振動ケース20に2つの収容部21a,21bが凹設されることで構成されている。なお、連結部23の厚みは、振動ケース20の高さの約半分となっており、振動ケース20の高さと連結部23の厚みとの比は、2:1となっている。   The vibration case 20 is formed with a partition recess 22 that opens in the same direction as the housing portions 21a and 21b so as to partition the housing portion 21a and the housing portion 21b. The depth of the partition recess 22 is shallower than the depths of the accommodating portions 21a and 21b, and is formed to a depth corresponding to half the height of the vibration case 20 in the present embodiment. In the vibration case 20, a portion corresponding to the bottom surface of the partition recess 22 is a connecting portion 23 that connects the accommodating portions 21 a and 21 b. In the present embodiment, the thickness of the connecting portion 23 is the same as the depth of the partition recess 22, and is formed with a thickness corresponding to half the height of the vibration case 20. Moreover, the connection part 23 is connected with the remaining parts 23a and 23b formed in the bottom side rather than the accommodating parts 21a and 21b by the recessed provision of the accommodating parts 21a and 21b. The vibration case 20 in the present embodiment is not formed by connecting two vibration cases in which one housing portion is formed, but two housing portions 21 a and 21 b are provided in one vibration case 20. It is configured by being recessed. In addition, the thickness of the connection part 23 is about half of the height of the vibration case 20, and the ratio between the height of the vibration case 20 and the thickness of the connection part 23 is 2: 1.

なお、連結部23、及び残部23a,23bの裏面には、振動ケース20の長手方向に離間されて突設された2個の筒状部24が形成されており、筒状部24の内部が収容部21a,21bとなるとともに、筒状部24に挟まれた部位が仕切り凹部22となっている。   In addition, two cylindrical portions 24 that are spaced apart in the longitudinal direction of the vibration case 20 are formed on the back surfaces of the connecting portion 23 and the remaining portions 23a and 23b. The portions sandwiched between the cylindrical portions 24 are the partition recesses 22 as well as the accommodating portions 21a and 21b.

また、各収容部21a,21bの底面25には、超音波を送受波する円盤状の圧電素子26a,26bがそれぞれ配設されている。詳しくは、収容部21aに圧電素子26aが配設されているとともに、収容部21bに圧電素子26bが配設されている。そして、圧電素子26a,26bの一方の電極は、各収容部21a,21bの底面25に接触して振動ケース20とリード線Rとを介して引き出され、他方の電極は、リード線Rを介して引き出され、それぞれ圧電素子26a,26bの出力を解析するための外部の回路に接続され、超音波の受波に用いられる。また、一方の圧電素子26aは、超音波を発生させるための駆動回路にも接続されており、超音波の送波に用いられる。つまり、各圧電素子26a,26bは、超音波を受波するために用いられる受波用の圧電素子であって、さらに、駆動回路に接続された圧電素子26aは、超音波を送波するために用いられる送波用の圧電素子も兼ねている。そして、圧電素子26a,26bが送受波する超音波は、残部23a,23bに形成された底面25の反対側に位置する入出射面27で入射及び出射される。さらに、各収容部21a,21bには、残響を抑制するための緩衝充填材28がそれぞれ充填されている。   In addition, disk-like piezoelectric elements 26a and 26b for transmitting and receiving ultrasonic waves are respectively disposed on the bottom surfaces 25 of the accommodating portions 21a and 21b. Specifically, the piezoelectric element 26a is disposed in the housing portion 21a, and the piezoelectric element 26b is disposed in the housing portion 21b. One of the electrodes of the piezoelectric elements 26a and 26b comes into contact with the bottom surface 25 of each of the accommodating portions 21a and 21b and is drawn out through the vibration case 20 and the lead wire R, and the other electrode is connected through the lead wire R. Are connected to external circuits for analyzing the outputs of the piezoelectric elements 26a and 26b, respectively, and used for receiving ultrasonic waves. One piezoelectric element 26a is also connected to a drive circuit for generating ultrasonic waves, and is used for transmitting ultrasonic waves. That is, each of the piezoelectric elements 26a and 26b is a receiving piezoelectric element used for receiving an ultrasonic wave, and the piezoelectric element 26a connected to the drive circuit further transmits an ultrasonic wave. It also serves as a piezoelectric element for transmission used in the above. The ultrasonic waves transmitted and received by the piezoelectric elements 26a and 26b are incident and output on the incident / exit surface 27 located on the opposite side of the bottom surface 25 formed in the remaining portions 23a and 23b. Furthermore, each accommodating part 21a, 21b is each filled with the buffer filler 28 for suppressing reverberation.

そして、振動ケース20は、ハウジング11の開口から入出射面27を露出させる形でハウジング11に収容されている。その一方で、振動ケース20の開口部側は、ハウジング11の底面と対向するようにハウジング11に収容されている。   The vibration case 20 is accommodated in the housing 11 such that the incident / exit surface 27 is exposed from the opening of the housing 11. On the other hand, the opening side of the vibration case 20 is accommodated in the housing 11 so as to face the bottom surface of the housing 11.

また、ハウジング11と振動ケース20との間には、圧電素子26aが送波する超音波に対する吸音率が、振動ケース20の材料よりも高い弾性材料(例えば、合成ゴム)からなる保持体30が設けられている。保持体30には、保持凹部31が長手方向に2つ並設されている。保持体30の外周の寸法はハウジング11の内周と同程度に形成され、保持凹部31の内周の寸法は、振動ケース20の筒状部24の外周の寸法と同程度に形成されている。そして、振動ケース20の各筒状部24が、それぞれ保持凹部31に圧入されるとともに、保持体30がハウジング11に圧入されることにより、振動ケース20がハウジング11に保持されることになる。したがって、本実施形態における超音波センサ10では、図2に示すように、外側から順に、ハウジング11、保持体30、振動ケース20、緩衝充填材28、圧電素子26a(圧電素子26b)の順に配置されている。   In addition, between the housing 11 and the vibration case 20, a holding body 30 made of an elastic material (for example, synthetic rubber) whose sound absorption coefficient with respect to the ultrasonic wave transmitted by the piezoelectric element 26 a is higher than the material of the vibration case 20. Is provided. The holding body 30 has two holding recesses 31 arranged in parallel in the longitudinal direction. The dimension of the outer periphery of the holding body 30 is formed to be approximately the same as the inner periphery of the housing 11, and the dimension of the inner periphery of the holding recess 31 is formed to be approximately the same as the dimension of the outer periphery of the cylindrical portion 24 of the vibration case 20. . Each cylindrical portion 24 of the vibration case 20 is press-fitted into the holding recess 31, and the holding body 30 is press-fitted into the housing 11, whereby the vibration case 20 is held in the housing 11. Therefore, in the ultrasonic sensor 10 according to this embodiment, as shown in FIG. 2, the housing 11, the holding body 30, the vibration case 20, the buffer filler 28, and the piezoelectric element 26a (piezoelectric element 26b) are arranged in this order from the outside. Has been.

次に、超音波センサ10による障害物の検知方法について図3に従って説明する。
本実施形態の超音波センサ10は、超音波を検知範囲に送波するとともに、障害物で反射された反射波を受波することによって障害物の存在を検知する。そして、反射波を受波する2つの圧電素子26a,26bの出力を比較することによって障害物の方向を検知することができる。詳述すると、圧電素子26aが検知範囲に向かって超音波パルスを間欠的に送波し、検知範囲に存在する障害物Pに反射された反射波を、圧電素子26a,26bが、それぞれ受波し、超音波を送波してから反射波を受波するまでの時間によって障害物Pまでの相対距離Lを検知することができる。そして、圧電素子26aが超音波を受波するまでの時間と、圧電素子26bが超音波を受波するまでの時間との差から、圧電素子26a,26bが並ぶ方向に沿った直線を法線Hとする平面に対して超音波センサ10と障害物Pとを結ぶ直線Fがなす角度θを検知することができる。そして、角度θに基づいて、障害物Pの方向を検知することができる。
Next, an obstacle detection method using the ultrasonic sensor 10 will be described with reference to FIG.
The ultrasonic sensor 10 of this embodiment detects the presence of an obstacle by transmitting an ultrasonic wave to a detection range and receiving a reflected wave reflected by the obstacle. The direction of the obstacle can be detected by comparing the outputs of the two piezoelectric elements 26a and 26b that receive the reflected wave. Specifically, the piezoelectric element 26a intermittently transmits ultrasonic pulses toward the detection range, and the piezoelectric elements 26a and 26b receive the reflected waves reflected by the obstacle P existing in the detection range. The relative distance L to the obstacle P can be detected based on the time from when the ultrasonic wave is transmitted until the reflected wave is received. A straight line along the direction in which the piezoelectric elements 26a and 26b are arranged is a normal line from the difference between the time until the piezoelectric element 26a receives the ultrasonic wave and the time until the piezoelectric element 26b receives the ultrasonic wave. An angle θ formed by a straight line F connecting the ultrasonic sensor 10 and the obstacle P to the plane H can be detected. Then, the direction of the obstacle P can be detected based on the angle θ.

そして、振動ケース20の高さと連結部23の厚みとの比が、2:1となっている超音波センサ10によれば、図4〜図7に示すような試験結果を得ることができた。
図4は、本実施形態における超音波センサ10の受波の波形を示す。なお、図4では、圧電素子26aにおける出力信号波形を「送受波側」と示し、圧電素子26bにおける出力信号波形を「受波側」と示す。
Then, according to the ultrasonic sensor 10 in which the ratio between the height of the vibration case 20 and the thickness of the connecting portion 23 is 2: 1, the test results as shown in FIGS. 4 to 7 can be obtained. .
FIG. 4 shows a waveform of a wave received by the ultrasonic sensor 10 in the present embodiment. In FIG. 4, the output signal waveform in the piezoelectric element 26 a is indicated as “transmission / reception side”, and the output signal waveform in the piezoelectric element 26 b is indicated as “reception side”.

障害物Pが、圧電素子26bに近い側に存在する場合(図3参照)、図4に示すように、圧電素子26aよりも圧電素子26bが先に反射波を受波することになる。即ち、圧電素子26bは、圧電素子26aから超音波が送波された送波開始時刻T0から受波時間t1経過後に反射波C1を受波する。受波時間t1は、圧電素子26aから超音波が送波されてから障害物Pに反射して圧電素子26bに入射するまでの時間である。圧電素子26aは、圧電素子26bが反射波C1を受波してから受波時間差t2経過後に反射波C2を受波する。なお、反射波と同時に圧電素子26a及び圧電素子26bには、残響波B1,B2が受波される。そして、超音波を送波してから反射波を受波するまでの時間t1,t2によって障害物Pまでの相対距離Lや障害物Pの方向を検知することができる。   When the obstacle P exists on the side close to the piezoelectric element 26b (see FIG. 3), as shown in FIG. 4, the piezoelectric element 26b receives the reflected wave earlier than the piezoelectric element 26a. That is, the piezoelectric element 26b receives the reflected wave C1 after the reception time t1 has elapsed from the transmission start time T0 when the ultrasonic wave is transmitted from the piezoelectric element 26a. The wave reception time t1 is a time from when an ultrasonic wave is transmitted from the piezoelectric element 26a until it is reflected by the obstacle P and enters the piezoelectric element 26b. The piezoelectric element 26a receives the reflected wave C2 after the reception time difference t2 has elapsed since the piezoelectric element 26b received the reflected wave C1. Note that the reverberant waves B1 and B2 are received by the piezoelectric element 26a and the piezoelectric element 26b simultaneously with the reflected wave. Then, the relative distance L to the obstacle P and the direction of the obstacle P can be detected by the times t1 and t2 from when the ultrasonic wave is transmitted until the reflected wave is received.

なお、振動ケースの高さと連結部の厚みとの比が、略10:1のような超音波センサでは、送受波用の圧電素子を収容した収容部の振動が、受波用の圧電素子を収容した収容部に伝播し、その影響を受けて残響波が長くなってしまい、反射波が残響波に重なる虞がある。   In an ultrasonic sensor in which the ratio of the height of the vibration case to the thickness of the connecting portion is approximately 10: 1, the vibration of the housing portion that houses the piezoelectric element for transmitting and receiving the piezoelectric element for receiving the wave There is a possibility that the reverberant wave becomes longer due to propagation to the accommodated accommodating portion, and the reflected wave overlaps the reverberant wave.

一方、図4の結果からも明らかなように、本実施形態の超音波センサ10では、振動ケース20の高さと連結部23の厚みとの比を2:1とすることで、収容部21aの振動が収容部21bに伝播し難くなり、振動ケースの高さと連結部の厚みとの比が略10:1の超音波センサよりも、残響波を短縮することができた。   On the other hand, as is clear from the results of FIG. 4, in the ultrasonic sensor 10 of the present embodiment, the ratio of the height of the vibration case 20 and the thickness of the connecting portion 23 is set to 2: 1. The vibration is less likely to propagate to the accommodating portion 21b, and the reverberation wave can be shortened as compared with the ultrasonic sensor in which the ratio of the height of the vibration case to the thickness of the connecting portion is approximately 10: 1.

つまり、本実施形態の超音波センサ10では、連結部23自体もある程度の厚みを持っているので、図4の結果から、収容部21aの振動が、収容部21bに伝播し難くなり、その結果、残響波B1,B2も短縮されたということが分かる。このことにより、本実施形態の超音波センサ10では、残響波が短縮される(残響特性が良化される)ことによって、残響波と反射波が重なり難くなり、正確な検知範囲を与えることができる。   That is, in the ultrasonic sensor 10 of the present embodiment, since the connecting portion 23 itself has a certain thickness, the vibration of the accommodating portion 21a is difficult to propagate to the accommodating portion 21b from the result of FIG. It can be seen that the reverberation waves B1 and B2 are also shortened. As a result, in the ultrasonic sensor 10 of the present embodiment, the reverberant wave is shortened (the reverberation characteristic is improved), so that the reverberant wave and the reflected wave are difficult to overlap, and an accurate detection range can be provided. it can.

図5(a)は、本実施形態の超音波センサ10で送波される超音波の指向性ビーム形状を示す一方で、図5(b)は、振動ケースの高さと連結部の厚みとの比が略10:1の超音波センサで送波される超音波の指向性ビーム形状を示す。   5A shows the directional beam shape of the ultrasonic wave transmitted by the ultrasonic sensor 10 of the present embodiment, while FIG. 5B shows the height of the vibration case and the thickness of the connecting portion. The directional beam shape of an ultrasonic wave transmitted by an ultrasonic sensor having a ratio of approximately 10: 1 is shown.

図5(b)の結果からも明らかなように、振動ケースの高さと連結部の厚みとの比が略10:1のような超音波センサでは、超音波の指向性ビーム形状が脈動してしまい、超音波センサ10の検知エリアに歪みが生じてしまっていた。   As is clear from the result of FIG. 5B, in the ultrasonic sensor in which the ratio of the height of the vibration case to the thickness of the connecting portion is approximately 10: 1, the ultrasonic directional beam shape pulsates. As a result, the detection area of the ultrasonic sensor 10 is distorted.

一方、図5(a)の結果からも明らかなように、本実施形態の超音波センサ10では、振動ケース20の高さと連結部23の厚みとの比を、2:1とすることで、収容部21aの振動が収容部21bに伝播し難くなり、超音波の指向性ビーム形状の脈動が抑制された。   On the other hand, as is clear from the result of FIG. 5A, in the ultrasonic sensor 10 of the present embodiment, the ratio of the height of the vibration case 20 to the thickness of the connecting portion 23 is 2: 1. The vibration of the accommodating portion 21a is difficult to propagate to the accommodating portion 21b, and the pulsation of the ultrasonic directional beam shape is suppressed.

超音波センサには、超音波の指向性の形状が、検知エリアにそのまま反映するという特性があるので、図5(a),(b)の結果より、振動ケース20の高さと連結部23の厚みとの比を2:1とすることで、超音波の指向性ビーム形状の脈動が抑制され、それによって超音波センサ10の検知エリアを安定化することができるということが分かる。また、収容部21aの振動が収容部21bに伝播しにくくなることで、超音波を送波するために必要な振動エネルギーが減少してしまうことを抑制することができるということが分かる。すなわち、連結部23に厚みを持たせることで、今まで、収容部21bに伝播していた分の振動エネルギーが、収容部21bに伝播しにくくなるので、超音波を送波するために必要な振動エネルギーに加算されることになる。また、収容部21aの振動量の低減による超音波センサ10の感度低下も抑制することができるということが分かる。   Since the ultrasonic sensor has a characteristic that the directivity shape of the ultrasonic wave is reflected as it is in the detection area, the height of the vibration case 20 and the connection portion 23 are determined based on the results of FIGS. It can be seen that by setting the ratio to the thickness to 2: 1, the pulsation of the ultrasonic directional beam shape is suppressed, whereby the detection area of the ultrasonic sensor 10 can be stabilized. Moreover, it turns out that it becomes difficult to reduce the vibration energy required in order to transmit an ultrasonic wave because it becomes difficult to propagate the vibration of the accommodating part 21a to the accommodating part 21b. That is, by providing the connecting portion 23 with a thickness, the vibration energy that has been propagated to the accommodation portion 21b until now becomes difficult to propagate to the accommodation portion 21b, so that it is necessary to transmit ultrasonic waves. It will be added to the vibration energy. Moreover, it turns out that the sensitivity fall of the ultrasonic sensor 10 by reduction of the vibration amount of the accommodating part 21a can also be suppressed.

図6は、本願発明の超音波センサ10における振動の分布と、振動ケースの高さと連結部の厚みとの比が略10:1の超音波センサにおける振動の分布を示している。なお、図6に示す横軸は、振動ケース20の位置を示しており、縦軸は、振動量を示している。また、横軸において「0」と示す値は、振動ケース20の中心を示しており、中心線を挟んでグラフの右側が、収容部21a(送受波)における振動を示す一方で、グラフの左側が、収容部21b(受波)における振動を示している。   FIG. 6 shows the vibration distribution in the ultrasonic sensor 10 of the present invention and the vibration distribution in the ultrasonic sensor in which the ratio of the height of the vibration case to the thickness of the connecting portion is approximately 10: 1. 6 indicates the position of the vibration case 20, and the vertical axis indicates the amount of vibration. The value “0” on the horizontal axis indicates the center of the vibration case 20, and the right side of the graph across the center line indicates the vibration in the accommodating portion 21a (transmission / reception wave), while the left side of the graph. Shows the vibration in the accommodating portion 21b (received wave).

図6の結果から、振動ケースの高さと連結部の厚みとの比が略10:1の超音波センサでは、送受波用の収容部の振動が、受波用の収容部に伝播しやすくなっていることにより、受波用の収容部においても振動が発生したことが分かる。一方、振動ケース20の高さと連結部23の厚みとの比を2:1とした本実施形態の超音波センサ10では、収容部21bでの振動が抑えられるとともに、収容部21aの振動が、振動ケースの高さと連結部の厚みとの比が略10:1の超音波センサにおける振動よりも増大したことが分かる。   From the result of FIG. 6, in the ultrasonic sensor in which the ratio of the height of the vibration case to the thickness of the connecting portion is approximately 10: 1, the vibration of the receiving portion for transmitting and receiving waves easily propagates to the receiving portion for receiving waves. As a result, it can be seen that vibration is also generated in the receiving portion for receiving waves. On the other hand, in the ultrasonic sensor 10 of the present embodiment in which the ratio of the height of the vibration case 20 and the thickness of the connecting portion 23 is 2: 1, vibration in the housing portion 21b is suppressed, and vibration in the housing portion 21a is It can be seen that the ratio between the height of the vibration case and the thickness of the connecting portion is greater than the vibration in the ultrasonic sensor of approximately 10: 1.

図6の結果から、振動ケース20の高さと連結部23の厚みとの比を2:1とすることで、収容部21bでの振動が抑えられ、超音波を送波するために必要な振動エネルギーの減少を抑制することができるということが分かる。また、収容部21aの振動量の低減による超音波センサ10の感度が低下することも抑制できるということが分かる。   From the result of FIG. 6, by setting the ratio of the height of the vibration case 20 and the thickness of the connecting portion 23 to 2: 1, vibration in the housing portion 21b can be suppressed and vibration necessary for transmitting ultrasonic waves. It turns out that the decrease in energy can be suppressed. Moreover, it turns out that it can suppress that the sensitivity of the ultrasonic sensor 10 by the reduction of the vibration amount of the accommodating part 21a falls.

図7は、振動ケース20の高さ及び連結部23の厚みとの比と、収容部21bの振動量との相関を示している。なお、図7に示す横軸は、振動ケース20の高さと連結部23の厚みとの比を示しており、縦軸は、振動量(μm)を示している。なお、本実施形態の超音波センサ10では、圧電素子26aの周波数帯域は、60〜80kHzであって、詳しくは67〜77kHzが好ましく、より最適な値は72kHzである。   FIG. 7 shows a correlation between the ratio between the height of the vibration case 20 and the thickness of the connecting portion 23 and the vibration amount of the housing portion 21b. In addition, the horizontal axis shown in FIG. 7 has shown ratio of the height of the vibration case 20, and the thickness of the connection part 23, and the vertical axis | shaft has shown the vibration amount (micrometer). In the ultrasonic sensor 10 of the present embodiment, the frequency band of the piezoelectric element 26a is 60 to 80 kHz, specifically 67 to 77 kHz is preferable, and a more optimal value is 72 kHz.

図7の結果から明らかなように、振動ケース20の高さと連結部23の厚みとの比が3:1よりも大きい場合、つまり、振動ケース20の高さが連結部23の厚みよりもはるかに長い場合、連結部23の振動量は0.05(μm)よりも大きくなりがちである。しかし、振動ケース20の高さ:連結部23の厚み=2:1〜3:1の範囲内では、連結部23はほとんど振動しない。また、振動ケース20の高さ:連結部23の厚みとの比が2:1よりも小さい場合、つまり、振動ケース20の高さが連結部23の厚みと略同じ高さ、又は振動ケース20の高さよりも連結部23の厚みの方が長い場合であっても、連結部23はほとんど振動しない。   As is apparent from the result of FIG. 7, when the ratio of the height of the vibration case 20 to the thickness of the connecting portion 23 is larger than 3: 1, that is, the height of the vibrating case 20 is much larger than the thickness of the connecting portion 23. In the case of long, the vibration amount of the connecting portion 23 tends to be larger than 0.05 (μm). However, within the range of the height of the vibration case 20: the thickness of the connecting portion 23 = 2: 1 to 3: 1, the connecting portion 23 hardly vibrates. Further, when the ratio of the height of the vibration case 20 to the thickness of the connecting portion 23 is smaller than 2: 1, that is, the height of the vibration case 20 is substantially the same as the thickness of the connecting portion 23 or the vibration case 20. Even when the thickness of the connecting portion 23 is longer than the height of the connecting portion 23, the connecting portion 23 hardly vibrates.

一方、収容部21bでは、振動ケース20の高さと連結部23の厚みとの比が3:1よりも大きい場合、つまり、振動ケース20の高さが連結部23の厚みよりもはるかに長い場合、収容部21bの振動量は0.05(μm)よりも大きくなる。そして、振動ケース20の高さ:連結部23の厚み=2:1〜3:1の範囲内では、収容部21bの振動量が0.05(μm)以下となる。また、振動ケース20の高さ:連結部23の厚み<2:1の場合、つまり、振動ケース20の高さと連結部23の厚みに差がなくなってくると、徐々に、収容部21bの振動量が増加する。そして、振動ケース20の高さ:連結部23の厚み<2:1であって、ある一定の比率に近づくと、徐々に、収容部21bの振動量が減少するが、0.05(μm)以下になることはない。   On the other hand, in the accommodating portion 21b, when the ratio of the height of the vibration case 20 and the thickness of the connecting portion 23 is larger than 3: 1, that is, when the height of the vibrating case 20 is much longer than the thickness of the connecting portion 23. In addition, the vibration amount of the housing portion 21b is larger than 0.05 (μm). And the vibration amount of the accommodating part 21b will be 0.05 (micrometer) or less in the range of the height of the vibration case 20: the thickness of the connection part 23 = 2: 1-3: 1. In addition, when the height of the vibration case 20: the thickness of the connecting portion 23 <2: 1, that is, when the difference between the height of the vibration case 20 and the thickness of the connecting portion 23 disappears, the vibration of the housing portion 21b is gradually increased. The amount increases. The height of the vibration case 20: the thickness of the connecting portion 23 <2: 1, and when approaching a certain ratio, the vibration amount of the housing portion 21b gradually decreases, but 0.05 (μm). It will never be

つまり、図7の結果から、圧電素子26aが送波する超音波の中心周波数が72kHzタイプのものである本実施形態の超音波センサ10では、振動ケース20の高さ:連結部23の厚み=2:1〜3:1の範囲において、連結部23及び収容部21bの振幅量を0.05(μm)以下に抑えることができたというと極めて良好な結果を示すことがわかった。   That is, from the result of FIG. 7, in the ultrasonic sensor 10 of this embodiment in which the center frequency of the ultrasonic wave transmitted by the piezoelectric element 26 a is of the 72 kHz type, the height of the vibration case 20: the thickness of the connecting portion 23 = It was found that in the range of 2: 1 to 3: 1, the amplitude amount of the connecting portion 23 and the accommodating portion 21b could be suppressed to 0.05 (μm) or less, and extremely good results were shown.

上記実施形態によれば、以下に示す効果を得ることができる。
(1)圧電素子26aが送波する超音波の中心周波数が72kHzタイプのものであって、その周波数が設定されている場合における振動ケース20の高さと連結部23の厚みとの比が2:1となるように、振動ケース20の高さ、及び連結部23の厚みを設定するようにした。このことにより、収容部21bの振動を抑制し、より超音波の指向性を安定させるとともに、残響特性を良化することができる。
According to the above embodiment, the following effects can be obtained.
(1) The center frequency of the ultrasonic wave transmitted by the piezoelectric element 26a is of the 72 kHz type, and the ratio between the height of the vibration case 20 and the thickness of the connecting portion 23 when the frequency is set is 2: The height of the vibration case 20 and the thickness of the connecting portion 23 are set so as to be 1. As a result, the vibration of the accommodating portion 21b can be suppressed, the directivity of the ultrasonic wave can be further stabilized, and the reverberation characteristics can be improved.

(2)また、連結部23自体がある程度の厚みを持つことで、連結部23が振動しにくくなり、超音波の指向性ビーム形状が脈動し、超音波センサ10の検知エリアに歪みが生じてしまうことを抑制することができる。   (2) Further, since the connecting portion 23 itself has a certain thickness, the connecting portion 23 becomes difficult to vibrate, the ultrasonic directional beam shape pulsates, and the detection area of the ultrasonic sensor 10 is distorted. Can be suppressed.

(3)また、収容部21aの振動を収容部21bに伝播しにくくすることで、超音波の送波に必要な振動エネルギーが減少してしまうことを抑制し、収容部21aの振動量の低減による超音波センサ10の感度が低下することも抑制することができる。   (3) Further, by making it difficult for the vibration of the housing portion 21a to propagate to the housing portion 21b, it is possible to suppress a reduction in vibration energy necessary for ultrasonic transmission, and to reduce the vibration amount of the housing portion 21a. It can also be suppressed that the sensitivity of the ultrasonic sensor 10 is reduced.

(4)収容部21aの振動が、収容部21bに伝播しにくくなって残響波が短縮されることにより、残響波と反射波が重なり難くなることで、正確な検知範囲を与えることができる。   (4) Since the vibration of the accommodating portion 21a is less likely to propagate to the accommodating portion 21b and the reverberant wave is shortened, the reverberant wave and the reflected wave are less likely to overlap, thereby providing an accurate detection range.

(5)振動ケース20の高さと連結部23の厚みとの比が2:1となるように、振動ケース20の高さ及び連結部23の厚みを設定するだけで、収容部21bの振動を抑制するための別部材(例えば、ゴム材)を、収容部21aと収容部21bとの間に新たに設けたりすることなく、収容部21bの振動を抑制することができる。   (5) By simply setting the height of the vibrating case 20 and the thickness of the connecting portion 23 so that the ratio of the height of the vibrating case 20 and the thickness of the connecting portion 23 is 2: 1, the vibration of the housing portion 21b can be reduced. The vibration of the accommodating part 21b can be suppressed without newly providing another member (for example, rubber material) for suppressing between the accommodating part 21a and the accommodating part 21b.

(6)振動ケース20において、圧電素子26aが収容された収容部21aと圧電素子26bが収容された収容部21bとの間に仕切り凹部22が設けられるようにした。このことにより、それぞれ1個の収容部が設けられた複数の振動ケースを用いる場合に比べて見栄えが良くなる上に、部品点数が減少するので、コストを低減することができる。   (6) In the vibration case 20, the partition recess 22 is provided between the accommodating portion 21a accommodating the piezoelectric element 26a and the accommodating portion 21b accommodating the piezoelectric element 26b. As a result, the appearance is improved and the number of parts is reduced as compared with the case where a plurality of vibration cases each provided with one accommodating portion are used, and the cost can be reduced.

(第2の実施形態)
次に、本発明を車両用障害物検知装置に用いられる超音波センサに具体化した第2の実施形態を図8にしたがって説明する。以下に説明する実施形態では、既に説明した実施形態と同様の構成については同一符号を付すなどして、その重複する説明を省略又は簡略する。
(Second Embodiment)
Next, a second embodiment in which the present invention is embodied in an ultrasonic sensor used in a vehicle obstacle detection device will be described with reference to FIG. In the embodiments described below, the same reference numerals are given to the same configurations as those in the already described embodiments, and the overlapping description is omitted or simplified.

本実施形態では、1つの振動ケースに2つの収容部が離間して凹設されているのではなく、収容部21a又は収容部21bが1つだけ形成された有底円筒状の振動ケース20が、水平方向に2つ並設されている。そして、各振動ケース20における収容部21(21a,21b)の底面には、超音波の送受波を行う圧電素子26a、及び超音波の受波のみを行う圧電素子26bが、それぞれ配設されている。そして、水平方向に並設された2つの振動ケースは、樹脂形成された連結部23によって連結されている。   In the present embodiment, the two accommodating portions are not provided to be separated and recessed in one vibrating case, but a bottomed cylindrical vibrating case 20 in which only one accommodating portion 21a or one accommodating portion 21b is formed. Two are arranged in parallel in the horizontal direction. On the bottom surface of the accommodating portion 21 (21a, 21b) in each vibration case 20, a piezoelectric element 26a that transmits and receives ultrasonic waves and a piezoelectric element 26b that only receives ultrasonic waves are disposed. Yes. The two vibration cases arranged in parallel in the horizontal direction are connected by a connecting portion 23 formed of resin.

なお、本実施形態においても、振動ケース20の高さと連結部23の厚みとの比が2:1となっており、本実施形態の超音波センサ10でも図4〜図7に示したような実験結果が得られる。   Also in this embodiment, the ratio of the height of the vibration case 20 to the thickness of the connecting portion 23 is 2: 1, and the ultrasonic sensor 10 of this embodiment is also as shown in FIGS. Experimental results are obtained.

本実施形態によれば、第1の実施形態に記載の効果(1)〜(6)に加えて以下に示す効果を得ることができる。
(7)連結部23を樹脂形成したことにより、2つの振動ケース20を水平方向に並設するだけで、樹脂のような比較的コストのかからない部材によって2つの振動ケース20を連結させることができるので、超音波センサ10の製造にかかるコストを削減することができる。
According to this embodiment, in addition to the effects (1) to (6) described in the first embodiment, the following effects can be obtained.
(7) Since the connecting portion 23 is formed of resin, the two vibrating cases 20 can be connected to each other by a relatively inexpensive member such as resin simply by arranging the two vibrating cases 20 in the horizontal direction. Therefore, the cost for manufacturing the ultrasonic sensor 10 can be reduced.

なお、上記実施形態は以下のように変更してもよい。
○ 第2の実施形態において、連結部23を、例えば、合成ゴム、天然ゴムのようなゴム材や、コイルバネなどのような弾性材料で構成しても良い。
In addition, you may change the said embodiment as follows.
In the second embodiment, the connecting portion 23 may be made of a rubber material such as synthetic rubber or natural rubber, or an elastic material such as a coil spring.

○ 各実施形態において、振動ケース20の高さと連結部23の厚みとの比が3:1となるように、振動ケース20の高さ及び連結部23の厚みを設定しても良い。また、振動ケース20の高さと連結部23の厚みとの比が、2:1〜3:1の範囲内となるように、振動ケース20の高さ及び連結部23の厚みを設定しても良い。   In each embodiment, the height of the vibrating case 20 and the thickness of the connecting portion 23 may be set so that the ratio of the height of the vibrating case 20 to the thickness of the connecting portion 23 is 3: 1. Moreover, even if the height of the vibration case 20 and the thickness of the connection part 23 are set so that the ratio of the height of the vibration case 20 and the thickness of the connection part 23 is in the range of 2: 1 to 3: 1. good.

○ 各実施形態において、収容部21a,21bを、振動ケース20の凹設によって形成したが、収容部21a,21bを、振動ケース20を貫通するように形成し、底面25を別部材で形成して、底面25によって蓋をするように設置しても良い。   In each embodiment, the accommodating portions 21a and 21b are formed by recessing the vibration case 20, but the accommodating portions 21a and 21b are formed so as to penetrate the vibration case 20, and the bottom surface 25 is formed as a separate member. Then, it may be installed so as to be covered with the bottom surface 25.

○ 各実施形態において、振動ケース20に3個以上の収容部を形成し、各収容部に圧電素子を収容しても良い。すなわち、超音波センサが備える圧電素子の個数を3個以上としても良い。   In each embodiment, three or more accommodating portions may be formed in the vibration case 20 and a piezoelectric element may be accommodated in each accommodating portion. That is, the number of piezoelectric elements included in the ultrasonic sensor may be three or more.

次に、上記実施形態及び別例から把握できる技術的思想を以下に追記する。
(イ)前記振動ケースの入出射面の反対面には、送波用の圧電素子が収容される収容部と受波用の圧電素子が収容される収容部との間を仕切る仕切り凹部が設けられており、前記連結部は、前記入出射面と前記仕切り凹部の底面との間に設けられていることを特徴とする請求項1〜請求項3のうちいずれか一項に記載の超音波センサ。
Next, a technical idea that can be grasped from the above embodiment and another example will be added below.
(A) On the opposite surface of the vibration case from the incident / exit surface, there is provided a partition recess for partitioning between the accommodating portion for accommodating the transmitting piezoelectric element and the accommodating portion for accommodating the receiving piezoelectric element. The ultrasonic wave according to claim 1, wherein the connecting portion is provided between the incident / exit surface and a bottom surface of the partition recess. Sensor.

第1の実施形態における超音波センサを示す使用形態における水平方向への断面図。The sectional view to the horizontal direction in the type of use which shows the ultrasonic sensor in a 1st embodiment. 第1の実施形態における超音波センサを示すA−A線断面図。The AA sectional view showing the ultrasonic sensor in a 1st embodiment. 超音波センサが障害物を検知する原理を示す模式図。The schematic diagram which shows the principle in which an ultrasonic sensor detects an obstruction. 第1の実施形態における超音波センサの受波波形を示す模式図。The schematic diagram which shows the received waveform of the ultrasonic sensor in 1st Embodiment. (a)は、第1の実施形態の超音波センサにおける超音波の指向性ビーム形状を示すグラフ、(b)は、振動ケースの高さと連結部の厚みとの比が略10:1の超音波センサにおける超音波の指向性ビーム形状を示すグラフ。(A) is a graph showing the directional beam shape of the ultrasonic wave in the ultrasonic sensor of the first embodiment, and (b) is an ultra-high ratio of the vibration case height to the connecting portion thickness of about 10: 1. The graph which shows the directional beam shape of the ultrasonic wave in a sound wave sensor. 第1の実施形態における超音波センサにおける振動の分布と、振動ケースの高さと連結部の厚みとの比が略10:1の超音波センサにおける振動の分布を示すグラフ。The graph which shows the distribution of the vibration in the ultrasonic sensor in 1st Embodiment, and the distribution of the vibration in the ultrasonic sensor whose ratio of the height of a vibration case and the thickness of a connection part is about 10: 1. 振動ケースの高さ及び連結部の厚みとの比と、受波用の収容部の振動量との相関を示すグラフ。The graph which shows the correlation with the ratio of the height of a vibration case and the thickness of a connection part, and the vibration amount of the accommodating part for receiving waves. 変更例として連結部が樹脂形成された超音波センサを示す断面図。Sectional drawing which shows the ultrasonic sensor by which the connection part was resin-formed as a modification. 従来の超音波センサを示す断面図。Sectional drawing which shows the conventional ultrasonic sensor.

符号の説明Explanation of symbols

B1,B2…残響波、C1,C2…反射波、10…超音波センサ、20…振動ケース、21a,21b…収容部、23…連結部、25…底面(収容部)、26a,26b…圧電素子、27…入出射面。   B1, B2 ... reverberation wave, C1, C2 ... reflected wave, 10 ... ultrasonic sensor, 20 ... vibration case, 21a, 21b ... housing part, 23 ... coupling part, 25 ... bottom face (housing part), 26a, 26b ... piezoelectric Element, 27... Entrance / exit surface.

Claims (3)

超音波が出射及び入射する入出射面を有し、該入出射面の反対側に底面を有する複数個の収容部が並設された振動ケースと、
前記複数個の収容部を連結する連結部と、
前記収容部の底面に配設された複数個の圧電素子と、を備え、
前記圧電素子のうち少なくとも1つは超音波を送波するために用いられる送波用の圧電素子であって、圧電素子のうち少なくとも2つは超音波を受波するために用いられる受波用の圧電素子である超音波センサにおいて、
前記圧電素子は、送波する超音波の中心周波数が72kHzタイプのものであって、その周波数が設定されている場合における前記振動ケースの高さと前記連結部の厚みとの比を、2:1〜3:1の範囲に設定したことを特徴とする超音波センサ。
A vibration case having an incident / exit surface on which ultrasonic waves are emitted and incident, and a plurality of accommodating portions having a bottom surface on the opposite side of the incident / exit surface;
A connecting portion for connecting the plurality of accommodating portions;
A plurality of piezoelectric elements disposed on the bottom surface of the housing portion,
At least one of the piezoelectric elements is a piezoelectric element used for transmitting an ultrasonic wave, and at least two of the piezoelectric elements are used for receiving an ultrasonic wave. In the ultrasonic sensor that is a piezoelectric element of
The piezoelectric element has a center frequency of ultrasonic waves to be transmitted of 72 kHz type, and the ratio between the height of the vibration case and the thickness of the connecting portion when the frequency is set is 2: 1. An ultrasonic sensor characterized by being set in a range of ˜3: 1.
前記連結部は、樹脂形成されていることを特徴とする請求項1に記載の超音波センサ。   The ultrasonic sensor according to claim 1, wherein the connecting portion is formed of a resin. 前記連結部は、ゴム材で形成されていることを特徴とする請求項1に記載の超音波センサ。   The ultrasonic sensor according to claim 1, wherein the connecting portion is formed of a rubber material.
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