JP2010028983A - Power converter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a power converter in which a wiring inductance is reduced to eliminate a limit on the number of circuit elements to be connected in series, when connecting at least two circuit elements in series. <P>SOLUTION: In the power converter provided with a series circuit having at least two circuit elements S1 to S4 aligned and connected in series, the circuit elements S1 to S4 each form at least a first and second electrode terminals 5, 6 on one face side, and the series circuit connects the second electrode terminal, one of the two adjacent circuit elements, to the first electrode terminal, the other of the circuit elements, with inter-element connection conductors 11, 13. Of the circuit elements at the opposite ends having no adjacent circuit element, a first external connection conductor 12 is connected to the first electrode terminal having no connection partner, and a second external connection conductor 14 is connected to the second electrode terminal having no connection partner, and the inter-element connection conductors have inductance canceling sections 10a, 10b canceling inductance formed with regard to the adjacent other connection conductors. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a power conversion device having a series circuit in which at least two circuit elements are arranged in series and connected in series, and more particularly, to a structure of a connection portion of electrical components of the power conversion device.

As this type of power conversion device, for example, as shown in FIGS. 19 and 20, a power conversion device in which an IGBT (Insulated Get Bipolar Transistor) is applied to a semiconductor switching element is known.
FIG. 19 is an example connection diagram for explaining a conventional power converter, and FIG. 20 is another example connection diagram for explaining a conventional power converter.

  As shown in FIG. 19, the power conversion apparatus includes a DC power supply Ed and a charge / discharge capacitor C10 connected in parallel, and a three-phase inverter IN connected in parallel to the charge / discharge capacitor C10. The three-phase inverter IN includes a first switching arm SA1 in which the semiconductor switching element Q10 and the semiconductor switching element Q11 are connected in series, and a second switching in which the semiconductor switching element Q12 and the semiconductor switching element Q13 are connected in series. The arm SA2, the semiconductor switching element Q14, and the third switching arm SA3 in which the semiconductor switching element Q15 is connected in series are connected in parallel between the positive electrode line P and the negative electrode line N. Furthermore, a U-phase AC terminal AC1 for outputting a U-phase voltage is provided at the midpoint between the semiconductor switching element Q10 and the semiconductor switching element Q11, and a V-phase voltage is output at the midpoint between the semiconductor switching element Q12 and the semiconductor switching element Q13. A V-phase AC terminal AC3 for outputting a W-phase voltage is provided at the midpoint between the semiconductor switching element Q14 and the semiconductor switching element Q15. Diodes D10 to D15 are connected in antiparallel to the semiconductor switching elements Q11 to Q15.

  Then, the operation for one phase of the three-phase inverter IN will be described using the charge / discharge capacitor C10 and the switching arm SA1 as an example. As shown in FIG. 20, the positive charge charged in the charge / discharge capacitor C10 is: When the semiconductor switching element Q10 is in the on state, the positive electrode side (high potential side) of the charge / discharge capacitor C10 passes through the wiring conductor 100 and the semiconductor switching element Q10, and passes through the wiring conductor 101 between the semiconductor switching elements Q10 and Q11. A current path L10 leading to the U-phase AC terminal AC1 is formed.

When the semiconductor switching element Q10 is turned off from this state, the current flowing through the current path L10 decreases. At this time, the voltage due to the inductance of the wiring conductor 100 generated along with the current change is generated in the direction in which the semiconductor switching element Q10 is higher than the charge / discharge capacitor C10.
On the other hand, when the semiconductor switching element Q10 is turned off, the current flowing through the current path L11 from the negative electrode side of the charging / discharging capacitor C10 through the wiring conductor 102 and the semiconductor switching element Q11, through the wiring conductor 101 to the U-phase AC terminal AC1. To increase. For this reason, the voltage due to the inductance of the wiring conductor 102 generated in accordance with the current change is generated in the direction in which the charge / discharge capacitor C10 is higher than the semiconductor switching element Q11.

When a voltage jump occurs with a change in current during switching, the voltage is added to the DC voltage and applied to the semiconductor switching elements Q10 and Q11, and the voltage value of the semiconductor switching elements Q10 and Q11 is increased. Exceeding the voltage standard causes the semiconductor switching elements Q10 and Q11 to be destroyed.
As a method for suppressing the jump of the voltage accompanying the change of current at the time of switching, the capacitor C10 for charging / discharging → the wiring conductor 100 → the semiconductor switching element Q10 → the wiring conductor 101 → the semiconductor switching element Q11 → the wiring conductor 102 → the capacitor for charging / discharging On the current path of C10, there is a method of canceling out the inductance component by arranging a pair of wiring that increases current when the semiconductor switching element is turned off and wiring that decreases current when the semiconductor switching element is turned off. .

For this reason, by arranging the wiring conductors 100 and 102 as a pair, the magnetic flux generated when the semiconductor switching element Q10 is turned off can be canceled out, the inductance component can be canceled out, and the current change during switching It is possible to suppress the jumping of the voltage associated with.
In a general electric power device such as an electric motor or a transformer, the voltage used for increasing the efficiency is increased as much as possible to reduce the current causing the loss due to heat generation. The same applies to the power converter, but the maximum voltage that can be used for electrical components such as semiconductor switching elements and capacitors is determined for each component and cannot exceed that value. Therefore, in order to use electrical components such as semiconductor switching elements and capacitors at a voltage exceeding the maximum voltage determined by the electrical components, the voltage applied to each electrical component is determined by connecting multiple electrical components in series. There are known power converters that do not exceed the maximum voltage provided.

For example, Patent Document 1 proposes the configuration shown in FIGS. 21 and 22.
In the power converter described in Patent Document 1, as shown in FIGS. 21 and 22, the high potential side terminals t11a, t12a, t13a, and t14a of the capacitors C11 to C14 are connected to the positive side of the power converter by the wiring conductor 103. The low potential side terminals t15b, t16b, t17b, and t18b of the capacitors C15 to C18 are connected to the negative side of the power converter by the wiring conductor 104, and the low potential side terminals t11b and t12b of the capacitors C11 to C14 are connected by the wiring conductor 105. , T13b, t14b and high-potential side elements t15a, t16a, t17a, t18a of capacitors C15 to C18 are connected to form a capacitor group connected in series and in parallel.

By adopting such a configuration, even when capacitors are connected in series, the wiring conductors to which the electrode terminals are connected are arranged facing each other in a flat plate shape, thereby reducing the wiring inductance due to the different direction of current change. ing.
JP 2001-245480 A

  However, in the conventional example described in Patent Document 1, a configuration is shown in which the number of series of capacitors as electrical components is 2 and the number of parallels is 4, but the number of series is increased to 3 or more. However, when the number of parallel connections is further increased, the shape of the wiring conductor on the capacitor side becomes complicated, and there is an unsolved problem that it becomes difficult to connect to the wiring conductor on the semiconductor switching element side. In addition, since the installation space for indispensable fixing materials such as bolts that fix the wiring conductor to the electrode terminals of the electrical parts is not considered, the spacing between the wiring conductors is fixed when applied to an actual device. There is also an unsolved problem that it becomes difficult to make the size smaller than the size of the wire and the wiring inductance cannot be sufficiently reduced. Furthermore, since no consideration is given to the semiconductor elements of other electrical components, there is an unsolved problem that the semiconductor elements cannot be applied when the semiconductor elements are connected in series.

  Therefore, the present invention has been made paying attention to the unsolved problems of the above conventional example, and sufficiently reduces the wiring inductance when arranging at least two circuit elements in an aligned manner and connecting them at least in series. It is an object of the present invention to provide a power conversion device that can apply both electrical components of a semiconductor element and a capacitor that can eliminate the limitation of the number of electrical components that can be connected in series.

  In order to achieve the above object, a power conversion device according to claim 1 is a power conversion device including a series circuit in which at least two circuit elements are arranged in series and connected in series, each of the circuit elements being , At least first and second electrode terminals are formed on the same surface side, and the series circuit connects one second electrode terminal and the other first electrode terminal among the two adjacent circuit elements between the elements. The first external connection conductor is connected to the first electrode terminal having no connection partner, and the second electrode terminal having no connection partner is connected to the first electrode terminal having no connection partner among the circuit elements at both ends where the adjacent circuit elements do not exist. The second external connection conductor is connected, and the inter-element connection conductor is formed with an inductance canceling portion that cancels the inductance with another adjacent connection conductor.

  The power conversion device according to claim 2 is a power conversion device having a series circuit in which a plurality of circuit elements are arranged in series and connected in series, and each of the circuit elements is at least first on the same surface side. And the second electrode terminal is formed, and the series circuit includes a first circuit element group and a second circuit element group in which a plurality of circuit elements are connected in series, with an inter-group connection conductor having an external output terminal. The first circuit element group has a configuration in which one second electrode terminal and the other first electrode terminal of two adjacent circuit elements are connected by an inter-element connection conductor. Among the circuit elements at the end where no circuit element exists, the first external connection conductor is connected to the first electrode terminal with no connection partner, and the second circuit element group includes two adjacent circuit elements. Of the two circuit elements, one second electrode terminal and the other first electrode terminal The electrode terminal is connected with an inter-element connection conductor, and the second external connection conductor is connected to the second electrode terminal with no connection partner among the end circuit elements where no adjacent circuit element exists. The inter-group connecting conductor and the inter-element connecting conductor are characterized in that an inductance canceling portion that cancels the inductance between the adjacent connecting conductors is formed.

Furthermore, the power conversion device according to claim 3 is characterized in that, in the invention according to claim 1 or 2, the circuit element is configured by at least one of an active element and a passive component.
Furthermore, a power conversion device according to a fourth aspect is the invention according to any one of the first to third aspects, wherein the inter-element connection conductor includes a pair of opposing side plate portions serving as inductance canceling portions, and the opposing side plates. A connecting plate portion that connects one end of each of the portions, and a mounting flange portion that protrudes inward from the other end of the pair of opposing side plate portions and connects to the electrode terminal of the circuit element.

Still further, according to a fifth aspect of the present invention, in the power conversion device according to the second aspect, the inter-group connection conductor is a connection that connects a pair of opposing side plate portions serving as an inductance canceling portion and one end of these opposing side plate portions. A plate portion and an attachment flange portion that protrudes inward from the other ends of the pair of opposed side plate portions and connects to the electrode terminals of the circuit element are provided.
According to a sixth aspect of the present invention, in the power converter according to any one of the first to fifth aspects, the inter-element connection conductor is detachably fixed to the electrode terminal of the circuit element by a fixing member. It is characterized by being.

Furthermore, the power converter according to claim 7 is the invention according to any one of claims 2 to 5, wherein the inter-group connection conductor is detachably fixed to the electrode terminal of the circuit element by a fixing member. It is characterized by being.
Furthermore, the power converter according to claim 8 is the invention according to any one of claims 1 to 7, wherein the first external connection conductor and the second external connection conductor are arranged in parallel at a predetermined interval. It is characterized by being installed.

  Still further, according to a ninth aspect of the present invention, there is provided a power converter according to any one of the first to eighth aspects, wherein a series circuit in which a semiconductor element is applied as the circuit element and a series circuit in which a capacitor is applied as the circuit element. And are connected in parallel.

  According to the present invention, when at least two circuit elements are aligned and connected at least in series, an inductance canceling portion is provided in a connection conductor connecting adjacent circuit elements, and the adjacent connection in the inductance canceling portion is provided. By making the current direction different from that of the conductor, it is possible to sufficiently reduce the wiring inductance, and it is possible to obtain an effect that it is possible to eliminate the restriction on the number of circuit elements that are aligned and connected at least in series. . Further, as the circuit element, at least one of an active element and a passive component can be applied.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a circuit diagram showing a configuration of a switching arm of a power conversion device according to a first embodiment of the present invention. FIG. 2 is a plan view showing a mechanical connection structure of the power conversion device according to the first embodiment. 3 is a cross-sectional view of the first embodiment taken along the line AA in FIG. 2, and FIG. 4 is an exploded perspective view showing the first embodiment.

  In the figure, reference numeral 1 denotes a switching arm for one phase as a series circuit constituting a voltage converter connected in parallel with a charge / discharge capacitor C, and is connected between a positive electrode line P and a negative electrode line N. As shown in FIG. 1, the switching arm 1 includes an upper arm 2 as a first circuit element group in which two semiconductor switching elements Q1 and Q2 are connected in series, and two semiconductor switching elements Q3 and Q4. The lower arm 3 as a second circuit element group connected in series is connected in series. Then, diodes D1 to D4 are connected in antiparallel to the semiconductor switching elements Q1 to Q4, respectively. Further, an AC external output terminal AC is derived from a connection point between the upper arm 2 and the lower arm 3.

As each of the semiconductor switching elements Q1 to Q4, for example, an IGBT (Insulated Gate Bipolar Transistor), a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor), or the like can be used.
A parallel circuit of a set of semiconductor switching elements and diodes that constitute the upper arm 2 and the lower arm 3 is provided in each of the semiconductor elements S1 to S4 as circuit elements. As shown in FIGS. 2 to 4, each of these semiconductor elements S <b> 1 to S <b> 4 has a rectangular parallelepiped casing 4 having at least an upper surface formed of an insulator and including a parallel circuit of a semiconductor switching element and a diode, and the casing. First and second electrode terminals 5 and 6 are provided on the upper surface of the body 4 at predetermined intervals in the longitudinal direction. Here, the collector of the semiconductor switching element and the cathode of the diode are connected to the first electrode terminal 5, and the emitter of the semiconductor switching element and the anode of the diode are connected to the second electrode terminal 6. The first and second electrode terminals 5 and 6 are each formed with a female screw portion 7 at the center of the upper surface.

2 and 4, the upper arm 2 and the lower arm 3 are, as shown in FIGS. 2 to 4, the second electrode terminal 6 of the semiconductor element S2 of the upper arm 2 and the first electrode terminal 5 of the semiconductor element S3 of the lower arm 3. Are connected in series by inter-group connection conductors 10 having electrical conductivity for electrical connection between them.
As shown in FIGS. 2 to 4, the inter-group connection conductor 10 includes a pair of opposing side plate portions 10 a and 10 b that are opposed to each other with a predetermined interval as an inductance canceling portion, and one end of the pair of opposing side plate portions 10 a and 10 b. That is, the connecting plate portion 10c that connects the upper ends, and the mounting flange portions 10d and 10e that are formed so as to protrude inward from the other ends, that is, the lower ends of the pair of opposed side plate portions 10a and 10b, inwardly in parallel with the connecting plate portion 10c. It has. Here, the mounting flange portions 10d and 10e are formed with small diameter insertion holes 10f and 10g through which the male screw portion 16b of the fixing screw 16 is inserted at a substantially central position. Furthermore, large-diameter insertion holes 10h and 10i through which the head 16a of the fixing screw 16 is inserted coaxially with the small-diameter insertion holes 10f and 10g of the mounting flange portions 10d and 10e are formed in the connecting plate portion 10c.

  The mounting flange portions 10d and 10e are fixed to the second electrode terminal 6 of the semiconductor element S2 and the first electrode terminal 5 of the semiconductor element S3 by a fixing screw 16. The center of the small-diameter insertion holes 10f and 10g of the mounting flange portions 10d and 10e so that the opposing side plate portions 10a and 10e do not reach the horizontal center position of the semiconductor elements S2 and S3 when the mounting flange portions 10d and 10e are fixed. And the opposite side plate portions 10a and 10b are set to a length. Similarly, the length of the connecting plate portion 10c in the horizontal direction is such that the adjacent flanges 10d and 10e are fixed to the second electrode terminal 6 of the semiconductor element S2 and the first electrode terminal 5 of the semiconductor element S3. A predetermined heat radiation gap is set between the elements S2 and S3.

Further, the inter-group connection conductor 10 includes an external connection terminal TAC that protrudes forward in a horizontal direction from a substantially central position in the longitudinal direction of the connecting plate portion 10c and serves as an AC external output terminal AC.
On the other hand, as shown in FIGS. 2 to 4, the upper arm 2 has conductivity between the second electrode terminal 6 of the semiconductor element S1 and the first electrode terminal 5 of the semiconductor element S2 that are adjacent to each other with a predetermined interval. The inter-element connection conductor 11 is electrically connected. Further, the first electrode terminal 5 and the positive electrode line P of the semiconductor element S1 having no adjacent semiconductor element and no connection partner are electrically connected by the first external connection conductor 12 having conductivity.

As shown in FIGS. 2 to 4, the inter-element connection conductor 11 has the same configuration as the inter-group connection conductor 10 except that the external connection terminal TAC formed in the connecting plate portion 10 c is omitted. And corresponding parts to the inter-group connection conductor 10 are denoted by the same reference numerals, and detailed description thereof is omitted.
As shown in FIGS. 2 to 4, the first external connection conductor 12 includes a side plate portion 12 a serving as an inductance canceling portion facing the opposing side plate portion 10 a of the inter-element connection conductor 11 at a predetermined interval, and the side plate portion 12 a. The connection plate portion 12b serving as the external connection terminal TP that protrudes to the left at the same height as the connection plate portion 10c of the inter-element connection conductor 11 from the upper end of the connection plate 12 is parallel to the connection plate portion 12b from the lower end of the side plate portion 12a. And a mounting flange portion 12c that protrudes to the left by a predetermined length and is fixed to the first electrode terminal 5 of the semiconductor element S1. Here, the attachment flange portion 12c is formed with a small-diameter insertion hole 12d through which the male screw portion 16b of the fixing screw 16 is inserted at a substantially central position of a portion facing the connection plate portion 12b. Further, the connection plate portion 12b is formed with a large-diameter insertion hole 12e through which the head portion 16a of the fixing screw 16 is inserted coaxially with the small-diameter insertion hole 12d of the mounting flange portion 12c. The length between the center of the small-diameter insertion hole 12d of the mounting flange portion 12c and the side plate portion 12a is fixed to the first electrode terminal 5 of the semiconductor element S1 with the length of the mounting flange portion 12c being between the elements. It is set so as to face the opposing side plate portion 10a of the connection conductor 11 with a predetermined interval. In addition, a narrow external connection terminal TP protruding leftward from the front side is integrally formed at the free end of the connection plate portion 12 b of the first external connection conductor 12.

  As shown in FIGS. 2 to 4, the lower arm 3 includes the second electrode terminal 6 of the adjacent semiconductor element S3 and the first electrode terminal 5 of the semiconductor element S4 that are similar to the inter-element connection conductor 11 described above. Second external connection in which the second electrode terminal 6 of the semiconductor element S4 and the negative electrode line N of the semiconductor element S4 which are electrically connected by the inter-element connection conductor 13 having the configuration and have no adjacent semiconductor element and no connection partner have conductivity. The conductors 14 are electrically connected.

  As shown in FIGS. 2 to 4, the second external connection conductor 14 includes a side plate portion 14 a serving as an inductance canceling portion facing the opposing side plate portion 10 b of the inter-element connection conductor 13 at a predetermined interval, and the side plate portion 14 a. The connection plate portion 10c of the inter-element connection conductor 13, the connection plate portion 10c of the inter-group connection conductor 10, and the connection plate portion 10c of the inter-element connection conductor 11 are provided at predetermined intervals to be connected to the upper ends of the first and second elements. A connection plate portion 14b extending to reach the external connection conductor 12 and a predetermined length projecting from the lower end of the side plate portion 14a in the opposite direction to the connection plate portion 14b are fixed to the second electrode terminal 6 of the semiconductor element S4. And a mounting flange portion 14c. Here, the mounting flange portion 14c is formed with a small-diameter insertion hole 14d through which the male screw portion 16b of the fixing screw 16 is inserted at a substantially central position. The length between the center of the small-diameter insertion hole 14d of the mounting flange portion 14c and the side plate portion 14a is fixed to the second electrode terminal 6 of the semiconductor element S4 so that the side plate portion 14a is between the elements. It is set so as to face the opposing side plate portion 10a of the connection conductor 13 with a predetermined interval. In addition, an external connection terminal TN is integrally formed at the free end of the connection plate portion 14b so as not to overlap with the external connection terminal TP of the first external connection conductor 12 when viewed from the plane.

Each connection conductor 10, 11, 12, 13 and 14 is insulated by an insulating member 15.
2 to 4, the insulating member 15 includes a connection plate portion 12 b of the first external connection conductor 12, a connection plate portion 10 c of the inter-element connection conductor 11, a connection plate portion 10 c of the inter-group connection conductor 10, and A flat plate portion 15a that covers the upper surface of the connecting plate portion 10c of the inter-element connection conductor 13 and partition plate portions 15b to 15e that are suspended from the lower surface of the flat plate portion 15a in parallel with a predetermined distance. Here, the partition plate portion 15 b is inserted between the side plate portion 12 a of the first external connection conductor 12 and the opposing side plate portion 10 a of the inter-element connection conductor 11. Further, the partition plate portion 15 c is inserted between the opposing side plate portion 10 b of the inter-element connection conductor 11 and the opposing side plate portion 10 a of the inter-group connection conductor 10. Further, the partition plate portion 15 d is inserted between the opposing side plate portion 10 b of the inter-group connection conductor 10 and the opposing side plate portion 10 a of the inter-element connection conductor 13. Furthermore, the partition plate portion 15 e is inserted between the opposing side plate portion 10 b of the inter-element connection conductor 13 and the side plate portion 14 a of the second external connection conductor 14. Furthermore, the width of the flat plate portion 15a is the same as the connecting plate portion 10c of the inter-group connecting conductor 10, the connecting plate portion 10c of the inter-element connecting conductors 11 and 13, the connecting plate portion 12b of the first external connecting conductor 12, and the second. The outer connection conductor 14 is formed wider than the width of the connection plate portion 14b.

Next, the operation of the first embodiment will be described.
To assemble the switching arm 1, first, as shown in FIG. 4, the first electrode terminals of the semiconductor elements S <b> 1 to S <b> 4 are arranged on the same plane with the semiconductor elements S <b> 1, S <b> 2, S <b> 3 and S <b> 4 kept in that order. Arrange them on a straight line so that 5 is on the left side and the second electrode terminal 6 is on the right side.
Next, in a state where the connection plate portion 12b of the first external connection conductor 12 is directed to the side opposite to the second electrode terminal 6 side of the semiconductor element S1, on the first electrode terminal 5 of the semiconductor element S1, The mounting flange portion 12c of the first outer connecting conductor 12 is placed with the small diameter insertion hole 12d substantially aligned with the female screw portion 7.

Then, the fixing screw 16 is supported by, for example, a magnet driver, and is inserted into the large-diameter insertion hole 12e from above the connection plate portion 12b, and the male screw portion 16b of the fixing screw 16 is inserted through the small-diameter insertion hole 12d. The first external connection conductor 12 is electrically connected to the first electrode terminal 5 by screwing into the female screw portion 7 of the one electrode terminal 5.
Next, the opposing side plate portion 10a of the inter-element connection conductor 11 is opposed to the side plate portion 12a of the first external connection conductor 12 at a predetermined interval, and the internal thread portion 7 of the second electrode terminal 6 of the semiconductor element S1 is disposed. The mounting flange portion 10d of the inter-element connection conductor 11 and the small diameter insertion hole 10f are substantially matched. In this state, in the same manner as described above, the fixing screw 16 is supported by a driver with a magnet and inserted into the large-diameter insertion hole 10h from above the connecting plate portion 10c of the inter-element connection conductor 11, and the male screw portion 16b is inserted through the small-diameter insertion. The second electrode terminal 6 is screwed into the female screw portion 7 through the hole 10f.

Similarly, the mounting of the upper arm 2 is completed by screwing the mounting flange portion 10e of the inter-element connection conductor 11 to the first electrode terminal 5 of the semiconductor element S2 with the fixing screw 16.
Thereafter, similarly, the inter-group connection conductor 10 is screwed to the second electrode terminal 6 of the semiconductor element S2 and the first electrode terminal 5 of the semiconductor element S3 with the fixing screw 16, respectively, and then the second electrode terminal 6 of the semiconductor element S3 The inter-element connection conductor 13 is screwed with the fixing screw 16 to the second electrode terminal 6 and the first electrode terminal 5 of the semiconductor element S4.

  Thereafter, the first external connection conductor 12, the inter-element connection conductor 11, the inter-group connection conductor 10 and the inter-element connection conductor 13 are insulated by the insulating member 15. Insulation by the insulating member 15 is performed between the first external connection conductor 12 and the inter-element connection conductor 11, between the inter-element connection conductor 11 and the inter-group connection conductor 10, and between the inter-group connection conductor 10 and the inter-element connection conductor. The bottom surface of the flat plate portion 15a of the insulating member 15 is connected to the connection plate portion 12b of the first external connection conductor 12 while the portions 15b to 15d are inserted and the partition plate portion 15e is along the opposite side plate portion 10b of the inter-element connection conductor 13. , By contacting the connecting plate portion 10c of the inter-element connection conductor 11, the inter-group connection conductor 10, and the inter-element connection conductor 13.

Next, the inside of the side plate portion 14a of the second external connection conductor 14 is brought into contact with the outside of the partition plate portion 15e of the insulating member 15 with the connection plate portion 14b of the second external connection conductor 14 facing upward. .
Then, the small-diameter insertion hole 14d of the mounting flange portion 14c of the second external connection conductor 14 is made to substantially coincide with the female screw portion 7 of the second electrode terminal 6 of the semiconductor element S4, and the fixing screw 6 is attached as described above. The internal thread portion 7 is screwed and fixed.

In this way, the assembly of the switching arm 1 is completed. When this assembly is completed, the external connection terminals TP and TN protrude to the front and rear positions on the left end side as shown in FIG. 2 when viewed from the top, and the external connection terminals TAC are moved forward at a substantially central position in the left-right direction. It protrudes.
For this reason, the switching arms 1 assembled as described above are arranged in parallel in three rows, the external connection terminals TP and TN are connected to the positive line P and the negative line N, and the external connection terminal TAC is connected to the three-phase load. Thus, a three-phase inverter can be configured.

Hereinafter, the path of the current flowing through the switching arm 1 of the first embodiment will be described.
Here, when the semiconductor switching elements Q1 and Q2 of the semiconductor elements S1 and S2 of the upper arm 2 are turned on, the current path L1 of FIG. Thus, the external connection terminal TP → the connection plate portion 12b → the side plate portion 12a → the mounting flange portion 12c → the first electrode terminal 5 of the semiconductor element S1 → the second electrode terminal 6 of the semiconductor element S1 → the inter-element connection conductor 11 Mounting flange portion 10d → opposing side plate portion 10a of inter-element connection conductor 11 → connecting plate portion 10c of inter-element connection conductor 11 → opposed side plate portion 10b of inter-element connection conductor 11 → mounting flange portion 10e of inter-element connection conductor 11 → semiconductor The first electrode terminal 5 of the element S2 → the second electrode terminal 6 of the semiconductor element S2 → the mounting flange portion 10d of the inter-group connection conductor 10 → the opposed side plate portion 10a of the inter-group connection conductor 10 → the inter-group connection. Connecting plate portion 10c → current flows in the order of the external connection terminals TAC body 10.

  1 flows through the diodes D3 and D4 even when the semiconductor switching elements Q3 and Q4 of the semiconductor elements S3 and S4 of the lower arm 3 are in the OFF state, the current flows from the negative electrode side of the charging / discharging capacitor C. 4, external connection terminal TN → connection plate portion 14b → side plate portion 14a → mounting flange portion 14c → second electrode terminal 6 of semiconductor element S4 → first electrode terminal 5 of semiconductor element S4 → element Mounting flange portion 10e of inter-connection conductor 13 → opposite side plate portion 10b of inter-element connection conductor 13 → connecting plate portion 10c of inter-element connection conductor 13 → opposite side plate portion 10a of inter-element connection conductor 13 → attachment of inter-element connection conductor 13 Flange portion 10d → second electrode terminal 6 of semiconductor element S3 → first electrode terminal 5 of semiconductor element S3 → mounting flange portion 10e of inter-group connection conductor 10 → inter-group connection conductor 10 Current can flow in the order of the connecting plate portion 10c → the external connection terminals TAC of opposing side plate portions 10b → intergroup connection conductor 10.

Now, assume that the upper arm 2 is in the ON state and the current in the current path L1 flows as shown in FIG. In this state, when the upper arm 2 is turned off, the current in the current path L1 decreases and the current in the current path L2 flowing through the diodes D3 and D4 increases.
Therefore, when the upper arm 2 is turned off, in the semiconductor element S1, the side plate portion 12a of the first external connection conductor 12 and the inter-element connection conductor connected to the first electrode terminal 5 and the second electrode terminal 6, respectively. 11, opposite current flows between the opposing side plate portions 10a. Similarly, in the semiconductor element S2, the opposite side plate portions of the inter-element connection conductors 11 connected to the first electrode terminal 5 and the second electrode terminal 6 respectively. A current in the reverse direction flows between 10 b and the opposing side plate portion 10 a of the inter-group connection conductor 10. Similarly, in the semiconductor element S4, between the side plate portion 14a of the second external connection conductor 14 and the opposing side plate portion 10b of the inter-element connection conductor 13 connected to the second electrode terminal 6 and the first electrode terminal 5, respectively. In the semiconductor element S3, the opposing side plate portion 10a of the inter-element connection conductor 13 and the inter-group connection conductor 10 that are connected to the second electrode terminal 6 and the first electrode terminal 5 respectively are opposed to each other in the semiconductor element S3. Electrodes in the opposite direction flow between the side plate portions 10b.

For this reason, when the current in the reverse direction flows between the plate portions of the connecting conductors that are close to each other, the direction of the magnetic flux generated by energization is in the reverse direction. As a result, the magnetic fluxes in the opposite directions cancel each other, the inductance component can be reduced, and the jumping of the voltage accompanying the change in current during switching can be reliably suppressed.
In addition, since the semiconductor elements S1 to S4 are connected by the inter-group connection conductor 10 and the inter-element connection conductors 11 and 13, they are connected in series as long as the inter-group connection conductor 10 or the inter-element connection conductors 11 and 13 are separately prepared. There is no limit on the number of semiconductor elements to be used. In this case, the length of the second external connection conductor 14 may be changed according to the number of semiconductor elements to be connected.

  In the above embodiment, when the switching arm 1 is configured, a jig having recesses in which the semiconductor elements S1 to S4 can be placed is prepared at predetermined intervals, and the semiconductor elements S1 to S4 are placed in the recesses of the jig. In the mounted state, the inter-group connection conductor 10, the inter-element connection conductors 11, 13 and the first external connection conductor 12 are fixed, and the second external connection conductor 14 is mounted after mounting the insulating member 15 in this state. Thus, the connection work can be easily performed.

Next, a second embodiment of the present invention will be described with reference to FIGS.
Here, FIG. 5 is a circuit diagram showing the power conversion device of the second embodiment, FIG. 6 is a plan view showing the mechanical connection structure of FIG. 5, and FIG. 7 is a cross-section on the line BB of FIG. FIG. 8 is an exploded perspective view showing the second embodiment.
In the second embodiment, instead of the semiconductor elements S1 to S4, charging / discharging capacitors C1 and C2 are aligned and connected in series.

That is, in the second embodiment, as shown in FIGS. 5 to 8, a series circuit as a circuit element group in which two charge / discharge capacitors C <b> 1 and C <b> 2 are connected in series between the positive electrode line P and the negative electrode line N. 20 is formed.
Here, each of the charging / discharging capacitors C1 and C2 includes, as shown in FIGS. 6 to 8, a cylindrical case 21 having at least an upper surface formed of an insulator, and a radial direction on the upper surface of the case 21. Are provided with first and second electrode terminals 22 and 23 arranged at a predetermined interval. Here, a dielectric (not shown) is interposed between the first and second electrode terminals 22 and 23 in the case 21. Each of the first and second electrode terminals 22 and 23 has a female screw portion 24 at the center of the upper surface.

  As shown in FIGS. 5 to 8, the charge / discharge capacitors C1 and C2 constituting the series circuit 20 include the second electrode terminal 23 of the adjacent charge / discharge capacitor C1 and the first electrode of the charge / discharge capacitor C2. Charge / discharge in which the terminal 22 is electrically connected by the inter-element connection conductor 25 having the same configuration as the inter-element connection conductors 11 and 13 in the first embodiment described above, and there is no adjacent charge / discharge capacitor and no connection partner The first electrode terminal 22 of the capacitor C1 and the positive electrode line P are electrically connected by the first external connection conductor 26 having the same configuration as the first external connection conductor 12 in the first embodiment described above, The second electrode terminal 23 and the negative electrode line N of the charging / discharging capacitor C2 having no adjacent charging / discharging capacitor and no connection partner are the second in the first embodiment described above. It is electrically connected by a second external connection conductor 27 having a part connecting conductor 14 having the same configuration. The respective connection conductors 25, 26 and 27 are insulated by an insulating member 28. The inter-element connection conductor 25, the first external connection conductor 26, and the second external connection conductor 27 are the inter-element connection conductors 11, 13, the first external connection conductor 12, and the second external connection conductor 27 in the first embodiment. Since it has the same configuration as that of the external connection conductor 14, the same reference numerals are given to the corresponding parts, and the detailed description thereof will be omitted.

  As shown in FIGS. 6 to 8, the insulating member 28 includes a connection plate portion 12 b of the first external connection conductor 26, a connection plate portion 10 c of the inter-element connection conductor 25, and a connection plate portion of the second external connection conductor 27. The flat plate part 28a which covers 14b is provided. Furthermore, partition plates 28b and 28c are provided on the lower surface of the flat plate portion 28a so as to be suspended in parallel at a predetermined interval. Here, the partition plate portion 28c is connected to one end of the flat plate portion 28a.

  The insulating member 28 has the partition plate portion 28b interposed between the side plate portion 12a of the first external connection conductor 26 and the opposing side plate portion 10a of the inter-element connection conductor 25, and the partition plate portion 28c is inter-element connection conductor. 25, the opposing side plate portion 10b and the side plate portion 14a of the second external connection conductor 27 are inserted, and the flat plate portion 28a is connected to the connection plate portion 12b of the first external connection conductor 26 and the connection plate of the inter-element connection conductor 25. Insulating the first external connection conductor 26, the inter-element connection conductor 25, and the second external connection conductor 27 with a relationship interposed between the portion 10 c and the connection plate portion 14 b of the second external connection conductor 27. Yes.

Next, the path of the current flowing through the series circuit 20 according to the second embodiment will be described.
Here, the current corresponding to the current path L3 from the charge / discharge capacitor C1 to the positive line P shown in FIG. 5 is the first electrode terminal 22 → mounting flange portion of the charge / discharge capacitor C1, as shown in FIG. It flows in the order of 12c → side plate portion 12a → connecting plate portion 12b.
As shown in FIG. 9, the current corresponding to the current path L4 from the charging / discharging capacitor C2 to the negative electrode line N shown in FIG. 5 is the second electrode terminal 23 → the mounting flange portion 14c of the charging / discharging capacitor C2. → Current flows in the order of side plate portion 14a → connection plate portion 14b →.

  In addition, when current flows through the current path L3 or the current path L4, in the portion of the inter-element connection conductor 25 that connects the charge / discharge capacitors C1 and C2, as shown in FIG. Electrode terminal 22 → mounting flange portion 10d of inter-element connection conductor 25 → opposing side plate portion 10a of inter-element connection conductor 11 → connecting plate portion 10c of inter-element connection conductor 25 → opposed side plate portion 10b of inter-element connection conductor 25 → element A current flows in the order of the mounting flange portion 10e of the inter-connection conductor 25 and the first electrode terminal 22 of the charge / discharge capacitor C2.

  Therefore, when a current flows through the current path L3 (or L4), the side plate portion 12a of the first external connection conductor 26 and the opposite side plate portion 10a of the inter-element connection conductor 25 (or the side plate portion of the second external connection conductor 27). 14a and the opposite side plate portion 10b of the inter-element connection conductor 25), currents in opposite directions flow, and the magnetic fluxes generated by these currents cancel each other, reducing the inductance component. It is possible to reliably suppress the voltage jump accompanying the change.

In addition, since the charge / discharge capacitors C2 and C1 are connected by the inter-element connection conductor 25, as long as the inter-element connection conductor 25 is prepared separately, the number of charge / discharge capacitors connected in series is not limited. In this case, the length of the second external connection conductor 27 may be changed according to the number of charge / discharge capacitors to be connected.
Next, a third embodiment of the present invention will be described with reference to FIGS.

Here, FIG. 10 is a circuit diagram of the power conversion device of the third embodiment, FIG. 11 is a plan view showing the mechanical connection structure of FIG. 10, and FIG. 12 is a side view on the CC line of FIG. FIG. 13 is an exploded perspective view showing the third embodiment.
In the third embodiment, while the semiconductor elements S1 to S4 and the charge / discharge capacitors C1 and C2 are arranged in series, the series circuit of the semiconductor elements S1 to S4 and the series circuit of the charge / discharge capacitors C1 and C2 The parallel circuit is configured, and the connection midpoints between the two are further connected.

That is, in the third embodiment, as shown in FIG. 10, the charge / discharge capacitors C1 and C2 of the second embodiment described above are applied as the charge / discharge capacitors of the first embodiment described above. . Therefore, the circuit configuration is such that the series circuit 20 of the charge / discharge capacitors C1 and C2 is connected in parallel with the switching arm 1 of the first embodiment described above.
The mechanical configuration of the circuit shown in FIG. 10 is such that, as shown in FIGS. 11 to 12, the semiconductor elements S <b> 1 to S <b> 4 constituting the switching arm 1 are arranged in that order in the same manner as in the first embodiment described above. 10 and inter-element connection conductors 11 and 13 are electrically connected.

On the other hand, as in the second conventional example, the second electrode terminal 23 of the charging / discharging capacitor C1 and the first electrode terminal 22 of the charging / discharging capacitor C2 are electrically connected by the inter-element connection conductor 25. .
The first electrode terminal 5 of the semiconductor element S1 of the switching arm 1 and the first electrode terminal 22 of the charge / discharge capacitor C1 are electrically connected by the first external connection conductor 31 and the switching arm. The second electrode terminal 6 of the first fourth semiconductor element S4 and the second electrode terminal 23 of the charge / discharge capacitor C2 are electrically connected by the second external connection conductor 32.

Here, the first external connection conductor 31 is the same as the inter-group connection conductor 10 in the first and second embodiments described above except that the external connection terminal TP protrudes rearward from the rear end. The components corresponding to the inter-group connection conductor 10 are denoted by the same reference numerals, and detailed description thereof is omitted.
The second external connection conductor 32 includes a side plate portion 32a, a connection plate portion 32b, and a mounting flange portion 32c, similarly to the second external connection conductor 14 of the first embodiment described above. The second external connection conductor 32 has a side plate portion 32d facing the opposing side plate portion 10a of the inter-element connection conductor 25 connected to the other end of the connection plate portion 32b at a predetermined interval, and this side plate portion 32d. There is a mounting flange portion 32e that projects outwardly and is connected to the lower end of each. And the small diameter hole parts 32f and 32g which penetrate the external thread part 16b of the fixing screw 16 are formed in the attachment flange parts 32c and 32e.

The inter-element connection conductor 25, the first external connection conductor 31, the inter-element connection conductor 11, the inter-group connection conductor 10, the inter-element connection conductor 13, and the second external connection conductor 32 are connected by the insulating member 33. .
The insulating member 33 covers the inter-element connection conductor 25, the first external connection conductor 31, the inter-element connection conductor 11, the inter-group connection conductor 10, the inter-element connection conductor 13, and the second external connection conductor 32. The flat plate portion 33a is formed wider than the width. The flat plate portion 33a has end plate portions 33b and 33g protruding downward on the lower surfaces of both ends thereof, and partition plate portions 33c to 33f protruding downward with a predetermined interval between the end plate portions 33b and 33g. Is formed.

  The charge / discharge capacitors C2 and C1 and the semiconductor elements S1 to S4 are connected by the inter-element connection conductor 25, the first external connection conductor 31, the inter-element connection conductor 11, the inter-group connection conductor 10, and the inter-element connection conductor 13. In this state, the end plate portion 33b of the insulating member 33 is brought into contact with the opposite side plate portion 10a of the inter-element connection conductor 25, and the partition plate portions 33c, 33d, 33e, and 33f are respectively connected to the inter-element connection conductor 25 and the first external portion. Between the connection conductors 31, between the first external connection conductor 31 and the inter-element connection conductor 11, between the inter-element connection conductor 11 and the inter-group connection conductor 10, and between the inter-group connection conductor 10 and the inter-element connection conductor 13, Further, the end plate portion 33g is brought into contact with the opposite side plate portion 10b of the inter-element connection conductor 13, and the flat plate portion 33a is connected to the inter-element connection conductor 25, the first external connection conductor 31, the inter-element connection conductor 11, and the inter-group connection. Brought into contact with the upper surface of the body 10 and the inter-element connecting conductors 13 arranged.

  In this state, the second external connection conductor 32 is disposed on the upper surface side of the insulating member 33 so that the lower surface of the connection plate portion 32b is in contact with the mounting flange portions 32c and 32d with the fixing screw 6 and the second of the semiconductor element S4. Are fixed to the electrode terminal 6 and the second electrode terminal 23 of the charging / discharging capacitor C2, so that the series circuit 20 of the charging / discharging capacitors C1 and C2 and the switching arm 1 are electrically arranged in parallel while being arranged in series. Can be connected to.

  According to the third embodiment, since the first embodiment and the second embodiment described above are combined, when the upper arm 2 of the switching arm 1 is in the ON state, the charge / discharge capacitor C1 A current path L5 from the first electrode terminal 22 to the external connection terminal TAC of the inter-group connection conductor 10 is formed through the first external connection conductor 31 → the semiconductor element S1 → the inter-element connection conductor 11 → the semiconductor element S2.

When the upper arm 2 is turned off from this state, the charge / discharge capacitor C2 is connected to the external connection terminal TAC of the inter-group connection conductor 10 through the second external connection conductor 32 → the semiconductor element S4 → the inter-element connection conductor 13 → the semiconductor element S3. A current path L6 is formed.
Furthermore, between the charging / discharging capacitors C1 and C2, a current path L7 is formed from the charging / discharging capacitor C1 to the charging / discharging capacitor C2 through the inter-element connection conductor 25 when the current path L5 or L6 is formed.

  When the upper arm 2 is turned off, the current in the current path L5 decreases and the current in the current path L6 increases, and the inter-element connection conductor 25, the first external connection conductor 31, the inter-element connection conductor 11, By canceling out the magnetic flux between the opposing side plate portions of the inter-group connection conductor 10 and the inter-element connection conductor 13 that are close to each other, the inductance component can be reduced, and the jump of the voltage accompanying the change of the current during switching can be ensured. Can be suppressed.

Next, a fourth embodiment of the present invention will be described with reference to FIGS.
Here, FIG. 14 is a circuit diagram showing a connection circuit configuration of a charging / discharging capacitor of the power converter of the fourth embodiment, FIG. 15 is a plan view showing the mechanical connection structure of FIG. 14, and FIG. It is sectional drawing on the DD line of FIG.
In the fourth embodiment, parallel circuits of charge / discharge capacitors are connected in series.

  That is, in the fourth embodiment, as shown in a circuit diagram in FIG. 14, the parallel circuit 41 of the charge / discharge capacitors C3 and C4 corresponding to the charge / discharge capacitor C1 in the second embodiment described above and the above-described circuit are shown. The charge / discharge unit 43 is configured by connecting in parallel the parallel circuit 42 of the charge / discharge capacitors C5 and C6 corresponding to the charge / discharge capacitor C2 in the second embodiment. One end of the charging / discharging capacitors C3 and C4 is connected to the positive electrode line P, and the other end of the charging / discharging capacitors C5 and C6 is connected to the negative electrode line N.

The mechanical connection structure of the charging / discharging unit 43 is shown in FIGS. Here, the charge / discharge capacitors C3 to C6 have the same configuration as that of the second embodiment described above, and the same reference numerals are given to the corresponding parts to those in FIGS. 6 and 7, and the detailed description thereof is omitted. To do.
Then, as shown in FIG. 15, the charge / discharge capacitors C3 and C4 are arranged on the same plane, with the first electrode terminal 22 and the second electrode terminal 23 on the upper side, and the first electrode terminal 22 on the left side, The two electrode terminals 23 are on the right side, and are arranged in a line at a predetermined interval in the front-rear direction.

Further, the charge / discharge capacitors C5 and C6 are arranged on the same plane as described above, and similarly, the first electrode terminal 22 and the second electrode terminal 23 are on the upper side, the first electrode terminal 22 is on the left side, and the second electrode terminal is on the left side. With 23 as the right side, it is arranged with a predetermined interval in the front-rear direction and aligned with the charge / discharge capacitors C3 and C4 with a predetermined interval in the left-right direction.
The second electrode terminals 23 of the charge / discharge capacitors C3 and C4 and the first electrode terminals 22 of the charge / discharge capacitors C5 and C6 are electrically connected by an inter-element connection conductor 44. Further, the first external connection conductor 45 is electrically connected to the first electrode terminals 22 of the charge / discharge capacitors C3 and C4, and the second external connection to the second electrode terminals 23 of the charge / discharge capacitors C5 and C6. The connection conductor 46 is electrically connected.

  Here, the cross-sectional shape of the inter-element connection conductor 44 has the same shape as the inter-element connection conductors 11, 13 and 25 in the first and second embodiments described above, and is connected to the opposing side plate portions 44a and 44b. It has a plate portion 44c and mounting flange portions 44d and 44e, and the width in the front-rear direction is wide enough to connect the front and rear charge / discharge capacitors C3, C5 and C4, C6. The fixing screws 16 are mounted on the mounting flange portions 44d and 44e at positions corresponding to the female screws 24 of the second electrode terminals 23 of the charge / discharge capacitors C3 and C4 and the first electrode terminals 22 of the charge / discharge capacitors C5 and C6. Small-diameter hole portions 44f and 44g are formed through which the male screw portion 16b is inserted.

  The first external connection conductor 45 is also configured to have the same cross-sectional shape as the first external connection conductor 26 of the second embodiment described above, and includes a side plate portion 45a, a connection plate portion 45b, and a mounting flange portion 45c. Further, the width in the front-rear direction is set to be substantially equal to the width of the inter-element connection conductor 44. Further, an external connection terminal TP is integrally formed on the front end side at the left end of the connection plate portion 45b.

  Further, the second external connection conductor 46 is also configured to have the same cross-sectional shape as the second external connection conductor 27 of the second embodiment described above, and includes a side plate portion 46a, a connection plate portion 46b, and a mounting flange portion 45c. The width in the front-rear direction is set to be approximately equal to the width of the inter-element connection conductor 44 and the first external connection conductor 45. Further, an external connection terminal TN is integrally formed on the rear end side at the left end of the connection plate portion 45b.

The inter-element connection conductor 44, the first external connection conductor 45, and the second external connection conductor 46 are insulated by the insulating member 47.
The insulating member 47 is also configured to have the same cross-sectional shape as the insulating member 28 in the second embodiment described above, and includes a flat plate portion 47a and partition plate portions 47b and 47c.
The inter-element connection conductor 44 is fixed to the charge / discharge capacitors C3 to C6 with the fixing screw 16, and the first external connection conductor 45 is connected to the charge / discharge capacitors C3 and C4 with the fixing screw 16. Then, the partition plate portion 47 b is inserted between the first external connection conductor 45 and the inter-element connection conductor 44, and the flat plate portion 47 a is connected to the opposing side plate portion 44 b of the inter-element connection conductor 44 while the partition plate portion 47 c is in contact therewith. The connection plate portion 45 b of the external connection conductor 45 and the connection plate portion 44 c of the inter-element connection conductor 44 are brought into contact with each other. After that, the second external connection conductor 46 is brought into contact with the upper surface of the flat plate portion 47a of the insulating member 47, the connection plate portion 46b is brought into contact with the partition plate portion 47c, and the mounting flange portion 46c is brought into contact with the charging / discharging capacitor. The charging / discharging part 43 can be comprised by fixing to the 2nd electrode terminal 23 of C5 and C6 with the fixing screw 16. FIG.

  According to the fourth embodiment, except that the charge / discharge capacitors C1 and C2 in the second embodiment described above are composed of charge / discharge capacitors C3, C4 and C5, C6 connected in parallel, respectively. Is configured in the same manner as in the second embodiment described above, a current path L3 flowing from the charge / discharge capacitors C3 and C4 to the positive line P, and a current path flowing from the charge / discharge capacitors C5 and C6 to the negative line N When a current flows through L4 and the current path L3 or L4, a current path that flows from the charge / discharge capacitors C3 and C4 to the charge / discharge capacitors C5 and C6 is formed.

  Therefore, between the side plate portion 45a of the first external connection conductor 45 and the opposed side plate portion 44a of the inter-element connection conductor 44, the opposed side plate portion 44b of the inter-element connection conductor 44, and the side plate portion of the second external connection conductor 45. Current flows in the opposite direction with respect to 46a, and the resulting magnetic flux cancels out, so that the inductance component can be reduced, and the jump of the voltage accompanying the change in current during switching is reliably suppressed. Can do.

In the first to fourth embodiments, the case where the semiconductor elements S1 to S4 and the charge / discharge capacitors C1 to C4 are arranged on the same plane has been described. However, the first electrode terminal and the second electrode of the circuit element are described. It is sufficient that the upper surface on which the electrode terminals are arranged is on the same plane, and the height of the circuit element can be selected arbitrarily.
Moreover, as shown in FIG. 17, when connecting circuit elements having different heights in series, the height of the opposing side plate portion of the inter-group connection conductor may be changed in accordance with the height of the circuit elements to be connected. . That is, as shown in FIG. 17, when the semiconductor element S5 and the charge / discharge capacitor C7 are connected by the inter-group connection conductor 51, when the height of the charge / discharge capacitor C7 is higher than the semiconductor element S5, the group By reducing the height of the opposing side plate portion 51a fixed to the charging / discharging capacitor C7 among the opposing side plate portions 51a and 51b of the inter-connection conductor 51, and increasing the height of the opposing side plate portion 51b fixed to the semiconductor element S5. It is possible to connect circuit elements having different heights electrically in series. Here, the connecting plate portion 51c of the inter-group connection conductor 51 is not limited to being extended in the horizontal direction, and when the opposite side plate portions 51a and 51b have the same height, they are connected in an inclined state. Also good.

Furthermore, in the first to fourth embodiments, the case where the first external connection conductor and the second external connection conductor are extended in the same direction has been described. However, the present invention is not limited to this. The second external connection conductor may be configured to be plane-symmetric with the first external connection conductor so as to extend in the opposite direction to the first external connection conductor.
Furthermore, in the first to fourth embodiments, the first and second electrode terminals 5 and 6 of the semiconductor elements S1 to S4 and the first and second electrode terminals 22 of the charge / discharge capacitors C1 to C4. However, the present invention is not limited to this. For example, as shown in FIG. 18, the first and second semiconductor elements S1 and S3 are alternately connected. The second electrode terminals 5 and 6 may be directed upward, and the first and second electrode terminals 5 and 6 of the remaining semiconductor elements S2 and S4 may be disposed downward. In this case, the connecting plate portion 10c of the inter-group connecting conductor 10 and the inter-element connecting conductors 11 and 13 may be replaced with a crank-shaped connecting plate portion 10j.

  Still further, in the first to fourth embodiments, the circuit elements such as the semiconductor elements S1 to S4 and the charge / discharge capacitors C1 to C4, the first electrode terminals 5 and 22 on the left side, and the second electrode terminals. 6 and 23 are arranged on the right side, the external connection terminal TP is formed on the first external connection conductors 12, 26, 31 and the external connection terminal TN is formed on the second external connection conductors 14, 34, 43. Although it demonstrated, it is not limited to this, The 1st electrode terminals 5 and 22 can also be arrange | positioned as the right side and the 2nd electrode terminals 6 and 23 can also be arrange | positioned as the left side. In this case, the external connection terminal TN may be formed on the first external connection conductors 12, 33, 42, and the external connection terminal TP may be formed on the second external connection conductors 14, 34, 43.

  Moreover, in the said 1st-4th embodiment, although the case where the connection conductors 10, 11, 12, 13, 14, etc. were insulated with the insulation members 15, 28, 33 was demonstrated, it is limited to this. Instead, the insulating members 15, 28, 33 themselves or a part thereof can be omitted, and furthermore, an insulating coating may be applied to the outer surface excluding the connection surface of the electrode terminal of each connection conductor.

  Furthermore, in the first to fourth embodiments, the case where the connection conductor is fixed to the semiconductor elements S1 to S4 as the circuit elements or the charge / discharge capacitors C1 to C6 using the fixing screw 16 has been described. However, it is not limited to the above, and any other fixing means such as brazing or soldering can be applied.

It is a circuit diagram which shows the structure of the switching arm of the power converter device of 1st Embodiment. It is a top view which shows the mechanical connection structure of FIG. It is sectional drawing on the AA line of FIG. It is a disassembled perspective view of the power converter device of 1st Embodiment. It is a circuit diagram which shows the power converter device of 2nd Embodiment. It is a top view which shows the mechanical connection structure of FIG. It is sectional drawing on the BB line of FIG. It is a disassembled perspective view of the power converter device of 2nd Embodiment. It is explanatory drawing which shows the current pathway of 2nd Embodiment. It is a circuit diagram which shows the power converter device of 3rd Embodiment. It is a top view which shows the mechanical connection structure of FIG. It is sectional drawing on the CC line of FIG. It is a disassembled perspective view of the power converter device of 3rd Embodiment. It is a circuit diagram which shows the power converter device of 4th Embodiment. It is a top view which shows the mechanical connection structure of FIG. It is sectional drawing on the DD line of FIG. It is sectional drawing which shows the modification of a power converter device. It is sectional drawing which shows the other modification of a power converter device. It is a circuit diagram which shows the power converter device of a prior art example. FIG. 20 is a circuit diagram for one phase of FIG. 19. It is a circuit diagram which shows the power converter device of a prior art example. It is a figure which shows the mechanical connection structure of FIG.

Explanation of symbols

  S1 to S5: Semiconductor elements, C1 to C6: Charging / discharging capacitors, L1 to L7: Current path, 1 ... Switching arm, 2 ... Upper arm, 3 ... Lower arm, 5 ... First electrode terminal, 6 ... Second 7 ... female screw part, 10 ... inter-group connection conductor, 10a, 10b ... opposite side plate part, 10c ... coupling plate part, 10d, 10e ... mounting flange part, 11, 13 ... inter-element connection conductor, 12 ... first 1 external connection conductor, 12a ... side plate, 12b ... connection plate, 12c ... mounting flange, 14 ... second external connection conductor, 14a ... side plate, 14b ... connection plate, 14c ... mounting flange, 15 DESCRIPTION OF SYMBOLS ... Insulating member, 16 ... Fixing screw, 20 ... Series circuit, 22 ... 1st electrode terminal, 23 ... 2nd electrode terminal, 24 ... Female thread part, 31 ... 1st external connection conductor, 32 ... 2nd exterior Connection conductor, 33 ... insulating member, 41, 42 ... Column circuit, 43 ... discharge unit, 44 ... inter-element connection conductors, 45 ... first outer connecting conductor, 46 ... second external connection conductor, 47 ... insulating member

Claims (9)

A power conversion device including a series circuit in which at least two circuit elements are arranged in series and connected in series,
Each of the circuit elements has at least first and second electrode terminals formed on the same surface side,
In the series circuit, one second electrode terminal and the other first electrode terminal of two adjacent circuit elements are connected by an inter-element connection conductor, and circuit elements at both ends where no adjacent circuit element exists are connected. Among them, the first external connection conductor is connected to the first electrode terminal having no connection partner, and the second external connection conductor is connected to the second electrode terminal having no connection partner,
The power converter according to claim 1, wherein the inter-element connection conductor is formed with an inductance canceling unit that cancels the inductance between the adjacent connection conductors. A power converter having a series circuit in which a plurality of circuit elements are arranged and connected in series,
Each of the circuit elements has at least first and second electrode terminals formed on the same surface side,
The series circuit has a configuration in which a first circuit element group and a second circuit element group each having a plurality of circuit elements connected in series are connected by an inter-group connection conductor having an external output terminal,
In the first circuit element group, one second electrode terminal and the other first electrode terminal of two adjacent circuit elements are connected by an inter-element connection conductor, and there is no adjacent circuit element. The first external connection conductor is connected to the first electrode terminal having no connection partner among the circuit elements of the portion,
In the second circuit element group, one of the adjacent two circuit elements is connected to the other first electrode terminal by the inter-element connection conductor, and the adjacent circuit element does not exist. The second external connection conductor is connected to the second electrode terminal with no connection partner among the circuit elements of the portion,
The inter-group connecting conductor and the inter-element connecting conductor are formed with an inductance canceling unit that cancels the inductance between the adjacent connecting conductors.   The power conversion device according to claim 1, wherein the circuit element is configured by at least one of an active element and a passive component.   The inter-element connection conductors protrude inward from a pair of opposing side plate portions that serve as inductance canceling portions, a connecting plate portion that connects one ends of the opposing side plate portions, and the other ends of the pair of opposing side plate portions, respectively. The power converter according to any one of claims 1 to 3, further comprising a mounting flange portion connected to the electrode terminal of the circuit element.   The inter-group connection conductors protrude inward from a pair of opposing side plate portions serving as inductance canceling portions, a connecting plate portion that connects one ends of these opposing side plate portions, and the other ends of the pair of opposing side plate portions, respectively. The power converter according to claim 2, further comprising a mounting flange portion connected to the electrode terminal of the circuit element.   The power conversion device according to any one of claims 1 to 5, wherein the inter-element connection conductor is detachably fixed to an electrode terminal of the circuit element by a fixing member.   6. The power conversion device according to claim 2, wherein the inter-group connection conductor is detachably fixed to an electrode terminal of the circuit element by a fixing member.   The power converter according to any one of claims 1 to 7, wherein the first external connection conductor and the second external connection conductor are arranged in parallel at a predetermined interval.   9. The power conversion according to claim 1, wherein a series circuit using a semiconductor element as the circuit element and a series circuit using a capacitor as the circuit element are connected in parallel. apparatus.

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