JP2010025588A - Probe for current-carrying test, probe card, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent displacement of adjacent probes occurring due to heat of laser light, when probes are joined to a substrate with a narrow pitch. <P>SOLUTION: A probe for a current-carrying test (16) includes a probe body which has plate-like connection sections (22a) whose end surfaces make connection surfaces to the probe substrate, and foot sections (42) which extend in a plate thickness direction from at least one-side lateral surfaces of the connection sections and have end surfaces to be the connection surfaces to the probe substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an energization test probe suitable for use in an energization test of a semiconductor device such as a semiconductor integrated circuit, a probe card, and a manufacturing method thereof.

  A semiconductor device such as an uncut integrated circuit formed on a semiconductor wafer or an integrated circuit cut from a semiconductor wafer undergoes an energization test to determine whether or not the semiconductor device is manufactured according to specifications.

  This type of energization test is performed using a probe card in which a plurality of probes individually pressed against pad electrodes of a semiconductor device are arranged on a substrate such as a wiring board or a probe board. Such a probe card is attached to the tester so as to electrically connect the pad electrode and the test device or tester electrical circuit.

  The energization test is performed in a state where the probe card is attached to the tester and the probe and the pad electrode are brought into contact and electrically connected.

  In recent years, the demand for higher integrated and smaller integrated circuits has increased, and as a result, the adjacent pad electrodes are very close to each other and the arrangement pitch of the pad electrodes is reduced. A probe card used for such an integrated circuit energization test is required to be able to simultaneously test a plurality of uncut integrated circuits on a semiconductor wafer in order to improve test efficiency.

  Therefore, the probes must be arranged at a narrow pitch so that the arrangement pitch of the probes matches the arrangement pitch of the pad electrodes, and adjacent probes must be joined to the probe substrate in a very close state. .

  Under one of the above conditions, a technique using laser light as a heat source is known as one technique for joining a probe to a substrate when assembling or repairing a probe card. (For example, Patent Documents 1 and 2)

  However, if the probe has to be bonded to the substrate at a narrow pitch as described above, when the probe is bonded to the substrate, the bonding material of other probes already bonded to the substrate is dissolved by the heat of the laser beam. As a result, the probe tilts, and the needle tip may be displaced. A probe card including a probe with a positional deviation at the needle tip cannot be used for testing because the position of the needle tip does not correspond to the position of the pad electrode.

JP 2002-013642 A JP 2002-283049 A

  An object of the present invention is to prevent positional displacement of adjacent probes caused by heat of laser light when probes are bonded to a substrate at a narrow pitch.

  The probe for energization test according to the present invention has a plate-like connecting portion, and an end surface of the connecting portion serves as a connecting surface to the probe substrate, and extends in the plate thickness direction from at least one side surface of the connecting portion. And a foot portion having an end surface serving as a connection surface to the probe substrate.

  The foot portion may be provided on both side surfaces of the connection portion.

  The foot portions may be arranged in a staggered manner with respect to the connection portion on the end surface.

  The foot part may be covered with an insulator on the surface excluding the end face.

  The connection portion may include an opening that opens to one side surface and the other side surface.

  The manufacturing method of the current test probe card using the current test probe as described above includes a plate-like guide provided with a plurality of notches imitating a plurality of wiring portions formed on the probe substrate. Placing the probe on the probe board in a state where the wiring part is received in the notch, and placing the probe on the probe board in a state where the end face of the connection part is in contact with the wiring part. Joining.

  In addition, the method of manufacturing the probe card for the current test using the current test probe includes a plate-like guide provided with a plurality of notches that can receive the plurality of foot portions formed on the probe substrate. In the state in which the foot portion is received in the notch, and the probe on the probe substrate in a state in which the end surface of the connection portion is in contact with the wiring portion. Arranging and joining.

  The energization test probe card according to the present invention includes a plurality of energization test probes as described above.

  The energization test probe card may include a plate-like guide provided with a plurality of notches having a shape matching the arrangement pattern of the energization test probes on the probe substrate.

  The energization test probe card may include a plate-like guide provided with a plurality of cutouts imitating the foot portions of the energization test probe on the probe substrate.

  The method for manufacturing the probe for energization testing includes a step of forming the probe body on a base member using photolithography and deposition technology, and the foot using photolithography and deposition technology on the probe body. Forming a portion.

  The method for manufacturing the probe for energization testing includes a step of forming a concave groove corresponding to the foot portion on a base member, and a photolithography and a deposition technique on the base portion on which the concave groove is formed. Forming a probe main body and the foot portion.

  The method for manufacturing the probe for energization testing includes a step of forming a concave groove corresponding to the foot portion provided on one side surface of the connection portion on a base member, and a step of forming a concave groove on the base portion on which the concave groove is formed. A step of forming the probe body and the foot portion provided on one side surface of the connection portion using photolithography and a deposition technique; and a photolithography and a deposition technique on the probe body. Forming a foot portion provided on the other side surface of the connection portion.

  The deposition technique is performed by selecting one of electroplating, sputtering, and vapor deposition.

  According to the probe for energization test in the present invention, even when laser light is irradiated when the probe is bonded to the substrate, it extends in the plate thickness direction from at least one side surface of the connection portion, and the connection surface to the probe substrate Since the foot portion having the end face is provided, the inclination of adjacent probes can be prevented, and as a result, the displacement of the needle tip can be prevented.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  In the present invention, directions in which the side of the probe to be bonded to the substrate and the side of the needle tip are upward and downward (the vertical direction in FIG. 2) are referred to as the vertical direction. The left and right directions (left and right direction in FIG. 2) are referred to as left and right directions, and the direction perpendicular to the up and down direction and left and right direction (the paper back direction in FIG. That's it.

  Referring to FIG. 1, a probe card 10 uses a semiconductor device 12 such as an integrated circuit formed on a semiconductor wafer as a flat test object, and whether or not the semiconductor device 12 is manufactured according to specifications. Is used to electrically connect an electrode 14 such as a pad electrode of the semiconductor device 12 and a tester (not shown).

  In the illustrated example, the semiconductor device 12 is an uncut one formed on a semiconductor wafer, but may be a cut semiconductor device. In the energization test using the probe card 10, a plurality of semiconductor devices 12 are simultaneously energized.

  The probe card 10 is used as an electrical connection device together with the chuck top 20. The chuck top 20 is supported by an inspection stage (not shown) that three-dimensionally moves the chuck top 20 in at least three directions including the front-rear direction, the left-right direction, and the up-down direction. The probe card 10 includes a stiffener (reinforcing plate) 18 provided with a plurality of probes 16 for an electric current test on a probe substrate 30.

  As shown in FIG. 2, each probe 16 includes a plate-like connection region 22 extending in the vertical direction and a plate-shaped arm region capable of elastic deformation that extends from the lower end of the connection region 22 to at least one side in the left-right direction. 24, a plate-like pedestal region 26 that protrudes downward from the tip of the arm region 24, and a plate-like or columnar contact portion 28 that protrudes downward from the lower end of the pedestal region 26.

  The connection region 22 is formed by integrating a plate-like connection portion 22a joined to an attachment land provided on the probe substrate 30 at the upper end portion and a plate-like extension portion 22b extending downward from the lower end portion of the connection portion 22a. Have.

  The connection portion 22a has an opening 40 and a foot portion 42 on an end surface serving as a connection surface to the probe substrate. The foot portion 42 is provided at a portion of the upper end of the connection portion 22a where the opening 40 is not formed, and extends in the front-rear direction. In the embodiment shown in FIG. 2, the foot portions 42 are provided on both side surfaces of the connecting portion, that is, the front surface and the rear surface. As a result, when the probe 16 is bonded to the probe substrate, the probe 16 can be prevented from falling over and can be stably operated.

  The foot portion 42 may be formed with an insulating film of silicon dioxide or alumina by using a deposition technique such as vapor deposition or sputtering, in addition to the end face serving as a connection surface to the probe substrate. Since such an insulating film can prevent adjacent probes from being short-circuited, it is possible to arrange the probes at a narrower pitch.

The opening 40 is provided at an arbitrary position on the end surface, and has an effect of making it difficult for laser irradiation heat to be transferred to the distal end side of the probe 16 when the probe 16 is joined.

  The arm region 24 includes plate-like first and second arm portions 32 and 34 extending in the left-right direction at intervals in the up-down direction, and the first and second arm portions 32 and 34 with their distal ends and bases. Plate-shaped first and second connecting portions 36 and 38 that are respectively connected at the end portions are provided.

  The arm region 24 integrally follows the lower end portion of the extension portion 22b of the connection region 22, and the first and second arm portions 32 and 34 extend from the lower end portion of the extension portion 22b to one side in the left-right direction (in FIG. 2). The second connecting portion 38 located on the base end side (right end side in FIG. 2) is supported by the connection region 22 so as to extend to the left side.

  The pedestal region 26 extends in the left-right direction and downward on the distal end side (left end side in FIG. 2) of the second arm member 34, and the lower edge portion on the distal end side of the second arm member 34 and the first edge portion. It continues integrally with the lower edge part of the connection part 36.

  The connection region 22, the arm region 24, and the pedestal region 26 constituting the probe main body are formed as an integral plate having a substantially uniform thickness in the front-rear direction. Therefore, the probe 16 has a flat plate shape as a whole.

  The lower end of the contact portion 28 is a needle point pressed against the electrode 14 of the semiconductor device 12 and has a plate shape with the front-rear direction as the thickness direction. The needle tip which is the lower end surface of the contact portion 28 is a horizontal flat surface or a flat surface inclined with respect to a horizontal plane so as to press the electrode 14 of the semiconductor device 12. The thickness dimension which is the front-rear direction of the contact part 30 is smaller than the thickness dimension of other parts in the same direction, particularly the probe body.

  As described above, the probe 16 includes the probe main body configured by the connection region 22, the arm region 24, and the pedestal region 26, the foot provided in the connection region of the probe main body, and the probe main body together with the probe main body. And a contact portion 28 forming a main body. The foot portion may be provided integrally with the probe main body portion. Further, the pedestal region 26 may be omitted, and the contact portion 28 may protrude downward from the arm region 24.

  As the probe body and foot material, nickel (Ni), nickel-phosphorus alloy (Ni-P), nickel-tungsten alloy (Ni-W), phosphor bronze, palladium-cobalt alloy (Pd-Co), and palladium A conductive metal material having high toughness such as nickel-cobalt alloy (Pd—Ni—Co) can be used.

  As a material of the contact portion 28, a material having a hardness higher than that of the probe main body portion, such as tungsten (W), rhodium (Rh), cobalt (Co), or the like can be adopted. However, the material of the contact portion 28 may be the same as the material forming the probe main body, or may be a material having the same degree of hardness as the material forming the probe main body. .

  Next, a method of attaching the probe to the probe substrate will be described with reference to FIG.

  First, a bonding material 44 having conductivity and heat melting properties such as solder, gold, tin, and conductive adhesive is attached to the upper end portion of the connection region 22 of each probe 16.

  Next, with the probe substrate 30 turned upside down, the upper end of the attachment region 22 of each probe 16 is maintained upright on the attachment land 46 of the probe substrate 30.

  In this state, a laser beam 48 as a heating source is applied to the connection region 22 and the bonding material 42 from a direction opposite to the arm region 24. As shown in FIG. 3B, the laser beam 48 is a light beam having a spot diameter that does not irradiate the adjacent probe 16.

  By irradiation with the laser beam 48, the upper end portion of the connection region 22 and the bonding material 44 absorb the thermal energy of the laser beam 48, and the bonding material 44 is melted.

  Next, when the irradiation of the laser beam 48 is stopped, the temperature of the upper end portion of the connection region 22 and the bonding material 44 is lowered, and the bonding material 44 is solidified. Thereby, each probe 16 is joined to the attachment land 46 in a cantilever shape at the upper end portion of the connection region 22.

  The bonding by the laser beam 48 is performed for each probe 16 so that the probe 16 corresponds to the pad electrode 14 on a one-to-one basis, and the coordinate position of the probe tip of the probe 16 matches the coordinate position of the corresponding pad electrode 14. To be done.

  In the joining process as described above, when the laser beam is irradiated, even if the joining material of another probe already joined to the substrate 30 is melted by the heat of the laser beam, the foot portion 42 stabilizes the probe 16. Therefore, the probe 16 does not tilt, and the position of the needle tip does not shift.

  In the above attachment method, the bonding material is attached to the probe at the time of bonding, the probe to which the bonding material is attached is arranged on the probe substrate, and the laser beam is applied to the probe substrate, Instead of adhering the bonding material, a bonding material layer may be formed on the probe in advance, the probe having the bonding material layer may be placed on the probe substrate, and attached to the probe substrate by irradiating laser light. Is possible. In this case, gold, tin, or an alloy thereof can be used as the bonding material.

  The connecting portion 22a of the probe in the present embodiment has a configuration in which an opening 40 and foot portions 42 are provided on both ends of the opening at the upper end thereof, but the design of this configuration can be changed as appropriate. 4 and 5 show a modified example of the probe connecting portion 22a together with the above-described embodiment. 4 is a front view of the probe connecting portion 22a, and FIG. 5 is a cross-sectional view taken along line 5-5 in FIG. In the figure, (a) is the above embodiment, and (b) and (c) are modified examples.

  The modification shown in FIG. 4B and FIG. 5B has two openings 40 on the end face of the connecting portion 22a. The foot portion 42 is provided in a portion where no opening is formed in the upper end of the connection portion 22a. Further, as shown in FIG. 5 (b), the foot portions 42 are arranged in a staggered manner with respect to the connection portion 22a on both side surfaces of the connection portion 22a so that the probe stands stably.

  Further, as shown in another embodiment of FIGS. 4C and 5C, the foot portion 42 can be provided only on one side surface of the connecting portion 22a. The connection part 22a of the probe in (c) has one opening 40 at its upper end, and a foot part 42 is provided over the entire length of one side of the connection part 22a including the side of the opening.

  When the probe 16 is attached to the probe substrate, the guide plate 50 shown in FIGS. 6 to 8 may be attached in order to more stably realize the attachment at a fixed position. 6 is a top view of the probe card with the probe mounted with the probe substrate 30 upside down, FIG. 7 is a partially enlarged view of FIG. 6, and FIG. 8 is a side view of the probe card shown in FIG. is there.

  The guide plate 50 has a plurality of cutouts 52 imitating a plurality of attachment lands 46 formed on the probe substrate 30, and the probe board is in a state where the plurality of attachment lands 46 are received in the cutouts 52. 30. Further, as shown in FIG. 8, the thickness of the guide plate 50 is designed so that the foot portion 42 is lower than the height of the notch 52 in a state where the guide plate is disposed on the probe substrate 30.

  The guide plate 50 is made of a material that can withstand the heat of the laser beam, and is made of, for example, ceramic.

  By using this guide plate 50, heat transfer by laser light can be avoided more effectively, so that the bonding material of other probes already bonded to the substrate is not easily melted by the heat of the laser light, and the probe is also tilted. No. Therefore, it is possible to install the needle tip at a fixed position without causing a positional deviation of the needle tip.

  The notches 52 of the guide plate 50 in the present embodiment have a shape imitating a plurality of mounting lands 46 formed on the probe substrate, that is, the wiring portions. However, the notches 52 can receive the foot portions 42. Any shape may be adopted. 9 to 11 show modifications of the notch 52 of the guide plate 50. FIG.

  In the modification shown in FIG. 9, the notch 52 is provided in a shape imitating the outside of the foot portion 42, and the guide plate 50 is disposed on the probe substrate in contact with the upper surface of the mounting land 46. Yes.

  In the modification shown in FIG. 10, the notch 52 is provided in a shape imitating the outside of the foot portion 42 and the attachment land 46, and the guide plate 50 is in contact with the upper surfaces of the probe substrate 30 and the attachment land 46. Has been placed.

  The modified example shown in FIG. 11 is a combination of the modified examples shown in FIGS. Of the plurality of cutouts 52, the cutout 52 located at the end is shaped like the outside of the foot portion 42 and the mounting land 46, and the other cutouts 52 are shaped like the outside of the foot portion 42. The guide plate 50 is disposed in contact with the upper surfaces of the lobe substrate 30 and the attachment land 46, respectively.

  Next, a method for manufacturing the probe 16 in the present invention will be described with reference to FIG. Here, for convenience of explanation, a method of manufacturing the probe 16 in which the foot portion is provided only on one side will be described. 12 is a cross-sectional view taken along line 9-9 in FIG.

  First, as shown in FIG. 12A, a plate-like base member 54 made of silicon or stainless steel is prepared, and tungsten, rhodium, cobalt, etc. are formed on the upper surface of the base member 54 by a photography technique and a deposition technique. After forming the contact portion 28 made of a highly hard conductive metal material, a photoresist 56 is formed on the upper surface of the base member 54 in a layered manner.

  Next, as shown in FIG. 12B, the photoresist 56 is exposed in a masked state and developed. As a result, a recess 58 that imitates the probe main body is formed in the photoresist 56.

  Next, as shown in FIG. 12C, the probe main body 60 is formed in the recess 58 by a deposition technique such as electroplating, sputtering, or vapor deposition.

  The main body portion 60 is a conductive metal material having a toughness superior to the contact portion 28, such as a nickel / phosphorus alloy, nickel / tungsten alloy (Ni-W), phosphor bronze, nickel, palladium / cobalt alloy, palladium / nickel / cobalt alloy. It is formed using.

  Next, as shown in FIG. 12D, after removing the photoresist 56, a photoresist 62 is formed on the base member 54 and the main body 60 by coating.

  Next, as shown in FIG. 12E, the photoresist 62 is exposed in a masked state and developed. Thereby, a recess 64 imitating the foot is formed in the photoresist 62.

  Further, as shown in FIG. 12 (F), the foot portion 66 is formed in the recess 64 by a deposition technique using a conductive material similar to that of the main body portion 60 or an insulating material such as silicon dioxide, titanium oxide, and aluminum oxide. Form.

  Next, the photoresist 62 is removed as shown in FIG. As a result, the probe body 60 and the probe 16 having the foot 66 on one side of the probe body are exposed. The probe 16 is peeled from the base member 54 to complete the manufacture.

  According to the above manufacturing method, the foot portion is manufactured separately from the probe main body portion, but is integrally connected to the probe main body portion. However, it is also possible to manufacture and connect them together by the method described below.

  First, as shown in FIG. 13A, a plate-like base member 68 made of silicon or stainless steel is prepared, and a recess 70 imitating a foot portion is formed on the upper surface of the base member 68 by etching.

  Next, as shown in FIG. 13B, a photoresist 72 is formed on the upper surface of the base member 68 by coating.

  Next, as shown in FIG. 13C, the photoresist 72 is exposed in a masked state and developed. As a result, a recess 74 imitating the probe body is formed in the photoresist 72.

  Next, as shown in FIG. 13D, a probe 76 having a probe body and a foot is formed in the recesses 74 and 70 by a deposition technique such as electroplating, sputtering, or vapor deposition. Finally, the photoresist 72 is removed and peeled off from the base member 68 to complete the manufacture of the probe 16.

  In the embodiment of the present invention, the above methods may be combined to manufacture the probe 16 having the foot portions provided on both side surfaces. The manufacturing method will be specifically described below with reference to FIGS. 14-1 and 14-2.

  First, as shown in FIG. 14A, a plate-like base member 78 made of silicon or stainless steel is prepared, and an upper surface of the base member 78 is etched to simulate a foot portion provided on one side surface. A recess 80 is formed.

  Next, as shown in FIG. 14B, a photoresist 82 is formed on the upper surface of the base member 78 by coating.

  Next, as shown in FIG. 14-1 (C), the photoresist 82 is exposed in a masked state and developed. As a result, a recess 84 imitating the probe body is formed in the photoresist 82.

  Next, as shown in FIG. 14-1 (D), the probe main body and the probe 86 having a foot portion on one side surface thereof are formed in the recesses 84 and 80 by a deposition technique such as electroplating, sputtering, or vapor deposition. Is done.

  Next, as shown in FIG. 14-2 (E), after removing the photoresist 82, the upper surface of the base member 78, the probe main body, and the probe 86 provided with a foot portion provided on one side surface thereof. Then, a photoresist 88 is formed into a layer by coating.

  Next, as shown in FIG. 14-2 (F), the photoresist 88 is exposed with a mask and development processing is performed. As a result, a recess 90 that imitates a foot portion provided on the other side surface is formed in the photoresist 88.

  Next, as shown in FIG. 14-2 (G), a foot portion 92 is formed in the recess 90 by using a deposition technique such as electroplating, sputtering, or vapor deposition.

  Next, as shown in FIG. 14-2 (H), the photoresist 88 is removed. As a result, the probe main body portion and the probe having the foot portions on both side surfaces of the probe main body portion are exposed. The probe is peeled off from the base portion 78 to complete the manufacture.

  Although the manufacturing method of the probe 76 has been described with reference to FIGS. 12 to 14, in the case of manufacturing a probe provided with a bonding material in advance, a step of forming a bonding material layer by a deposition technique in the above manufacturing process. What is necessary is just to provide suitably.

  The arm region 24 of the probe 16 in the present invention does not need to include the two arm portions 32 and 34, and may include a single arm portion. In this case, the connecting portions 36 and 38 are omitted, the pedestal region 26 is integrally formed on the front end side of the single arm portion, and the extension portion 22b is integrally formed on the rear end side of the single arm portion. May be.

  Further, the present invention is not limited to a probe having a crank-like structure / shape as shown in FIG. 2, but a probe having an existing structure / shape formed from a conductive metal thin wire, and a probe bent into an S-shape. The present invention can also be applied to probes having other structures and shapes that can be elastically deformed.

  In the probe having any structure / shape, at least the connection region 22, particularly the connection portion 22 a, is plate-shaped in order to increase the area of the portion to be bonded to the substrate, particularly the area, thereby increasing the bonding strength. It is desirable.

  The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

The figure which shows one Example of the probe card which concerns on this invention. The front view which shows one Example of the probe which concerns on this invention. The figure for demonstrating the joining method to the board | substrate of the probe shown in FIG. The front view which shows the modification of the probe which concerns on this invention. FIG. 5 is a top sectional view of the probe shown in FIG. 4. The bottom view which shows the probe card which concerns on this invention in the state which attached the guide plate. The elements on larger scale of the probe card shown in FIG. The cross-sectional view of the probe card shown in FIG. The cross-sectional view which shows the modification of the guide plate shown in FIG. The cross-sectional view which shows the other modification of the guide plate shown in FIG. The cross-sectional view which shows the other modification of the guide plate shown in FIG. Process drawing for demonstrating the manufacturing method of the probe card based on this invention. Process drawing for demonstrating the other manufacturing method of the probe card based on this invention. The process figure for demonstrating the further another manufacturing method of the probe card which concerns on this invention. The process figure for demonstrating the further another manufacturing method of the probe card which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Probe card 12 Semiconductor device 14 Pad electrode 16 Probe 22a Connection part 30 Probe board | substrate 40 Opening 42 Foot part 44 Joining material 48 Laser beam 50 Guide plate 52 Notch

Claims (14)

  A probe main body having a plate-like connection portion, and an end surface of the connection portion serving as a connection surface to the probe substrate, and extending from at least one side surface of the connection portion in the plate thickness direction to become a connection surface to the probe substrate A probe for energization test including a foot portion having an end face.   The probe for energization testing according to claim 1, wherein the foot portion is provided on both side surfaces of the connection portion.   The probe for energization testing according to claim 2, wherein the foot portions are arranged in a staggered manner with respect to the connection portion on the end surface.   4. The probe for energization testing according to claim 1, wherein a surface of the foot part excluding the end face is covered with an insulator. 5.   5. The probe for energization testing according to claim 1, wherein the connection portion includes an opening that opens to one side surface and the other side surface. A method for producing a probe card for energization test using the plurality of energization test probes according to any one of claims 1 to 5,
Placing a plate-like guide provided with a plurality of notches imitating a plurality of wiring portions formed on the probe substrate on the probe substrate in a state where the wiring portions are received by the notches When,
And a step of placing the probe on the probe substrate and joining the probe in a state where the end face of the connection portion is in contact with the wiring portion. A method for producing a probe card for energization test using the plurality of energization test probes according to any one of claims 1 to 5,
A plate-shaped guide provided with a plurality of notches that can receive the plurality of foot portions formed on the probe substrate, and the probe substrate in a state in which the foot portions are received in the notches. A step of arranging in
And a step of placing the probe on the probe substrate and joining the probe in a state where the end face of the connection portion is in contact with the wiring portion.   An energization test probe card comprising a plurality of energization test probes according to any one of claims 1 to 5.   The probe card for an energization test according to claim 8, further comprising: a plate-shaped guide provided with a plurality of notches having a shape matching the arrangement pattern of the probe for energization test on the probe substrate.   The probe card for an energization test according to claim 8, further comprising: a plate-like guide provided with a plurality of notches that can receive the foot portion of the probe for the energization test on the probe substrate. A probe main body having a plate-like connection portion, and an end surface of the connection portion serving as a connection surface to the probe substrate, and an end surface extending from one side surface of the connection portion in the plate thickness direction and serving as a connection surface to the probe substrate And a method for manufacturing a probe for energization test including a foot portion having:
Forming the probe body on the base member using photolithography and deposition techniques;
And a step of forming the foot portion on the probe body using photolithography and a deposition technique. A probe main body having a plate-like connection portion, and an end surface of the connection portion serving as a connection surface to the probe substrate, and an end surface extending from one side surface of the connection portion in the plate thickness direction and serving as a connection surface to the probe substrate And a method for manufacturing a probe for energization test including a foot portion having:
Forming a concave groove corresponding to the foot portion on the base member;
And a step of forming the probe main body and the foot portion using photolithography and a deposition technique on the base portion on which the concave groove is formed. A probe main body having a plate-like connection portion, and an end surface of the connection portion serving as a connection surface to the probe substrate, and an end surface serving as a connection surface to the probe substrate extending from both side surfaces of the connection portion in the plate thickness direction. A method for manufacturing a probe for energization testing including a foot part having:
Forming a groove corresponding to the foot portion provided on one side surface of the connecting portion on the base member;
Forming the probe body and the foot portion provided on one side surface of the connecting portion using photolithography and a deposition technique on the base portion where the concave groove is formed;
And a step of forming a foot portion provided on the other side surface of the connection portion on the probe body using photolithography and a deposition technique.   The method for manufacturing a probe for energization testing according to any one of claims 11 to 13, wherein the deposition technique is performed by selecting any one of electroplating, sputtering, and vapor deposition.

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