JP2010021531A - Method of determining mounting condition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of determining the mounting conditions of a component mounting machine so as to enhance throughput of a production line. <P>SOLUTION: A method is provided for determining the mounting conditions of a plurality of component mounting machines 200 which mount components on various substrates conveyed on a plurality of conveyance lanes in the production line with the plurality of component mounting machines 200. The method includes component arrangement determination steps (S108, S110) of determining a component supply part where the component is arranged among the component supply parts of the plurality of component mounting machines 200 concerning the respective components, so as to raise a tool common degree in at least one component mounting machine 200 when the tool common degree is defined as a degree where a tool, which is determined depending on the type of the component to be mounted on the substrate being conveyed on a conveyance lane and is used when one mounting head performs a component mounting work on the substrate being conveyed on the conveyance lane, is identical for two or more types of substrates out of the plurality of types of substrates. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a mounting condition determination method for a component mounter that mounts a component on a board, and more particularly to a mounting condition determination method for a component mounter that includes a plurality of transport lanes in parallel for transporting a board.

  Component mounters include component mounters that include a plurality of transport lanes in parallel. This component mounting machine conveys a board | substrate for every conveyance lane, and mounts components on a board | substrate. That is, by using a component mounter that includes a plurality of transport lanes in parallel, throughput per unit area (number of products produced per unit time) is improved compared to using a component mounter that includes only one transport lane.

  Conventionally, as a mounting condition determination method for such a component mounting machine having a plurality of transport lanes, a method has been proposed in which two opposing mounting heads mount components on each substrate transported on the plurality of transport lanes. (For example, refer to Patent Document 1).

JP 2003-204191 A

  However, the above mounting condition determination method has a problem that the throughput may not be maximized. The reason will be described below.

  In a component mounting machine having a plurality of transport lanes, two mounting heads facing each other mount components on each of the substrates transported on the plurality of transport lanes. For this reason, when the components mounted on each of the substrates transported on the plurality of transport lanes are different, for example, it is necessary to dispose different suction nozzles on the mounting head. That is, it is necessary to arrange various suction nozzles necessary for mounting components on each substrate in the mounting head, and the number of suction nozzles required for mounting the mounting head on one substrate is limited.

  As a result, the number of components that can be mounted on one board by the mounting head is limited in one component mounting operation in which the mounting head picks up the component and mounts the component on the substrate. In addition, because of this restriction, it is necessary to perform many component mounting operations, and thus throughput cannot be improved.

  For example, in a mounting head capable of arranging eight suction nozzles, depending on the type of eight suction nozzles arranged, only four suction nozzles may be used for mounting on one type of substrate. In this case, in order to mount the eight components on the board, it is necessary to perform the component mounting operation twice, and the throughput is halved compared to the case where all the eight suction nozzles can be used.

  For this reason, the above-described mounting condition determination method has a problem that the throughput may not be maximized.

  Therefore, the present invention has been made in view of such problems, and in a component mounter having a plurality of transport lanes, a mounting condition determination method capable of improving throughput so as to maximize the throughput. The purpose is to provide.

  In order to achieve the above object, a mounting condition determination method according to the present invention includes at least one mounting head for mounting a component on a substrate, and at least one component supply unit for supplying the component to the mounting head, arranged in parallel. And mounting the component mounting machine for a production line including a plurality of component mounting machines for mounting components on a plurality of types of boards transported on the plurality of transport lanes. A mounting condition determining method for determining a condition, wherein a component mounting operation is performed on a substrate that is determined from a type of a component mounted on a substrate transported on the transport lane and on which a single mounting head is transported on the transport lane The degree of the sameness between two or more types of substrates among the plurality of types of substrates is defined as the tool commonality, and the tool used at the time of at least one component mounter is used. As tool commonality is increased, for each component, including the component arrangement determining step of determining a component supply section in which the components are arranged from the component supply section of the plurality of component mounting machines.

  Thereby, in the production line, the component supply unit in which each component is arranged between the component mounting machines is determined so that the tool commonality between at least one component mounting machine is increased. Therefore, for example, it is possible to determine the arrangement of components between component mounting machines so that various suction nozzles are not arranged in the mounting head. That is, many suction nozzles can be used for mounting the mounting head on one substrate. For this reason, the number of components that can be mounted on one substrate by the mounting head in one component mounting operation can be increased, and components can be mounted on the substrate by a small component mounting operation. Therefore, the throughput can be improved so that the throughput is maximized.

  Also, two mounting heads for mounting components on the board, two component supply units for supplying components to the two mounting heads, and a plurality of conveyance lanes arranged in parallel between the two component supply units, A mounting condition determination method for determining mounting conditions of a component mounting machine that mounts components on a plurality of types of boards transported on a plurality of transport lanes, and mounted on the boards transported on the transport lanes Two or more types of the plurality of types of boards are defined by the types of parts to be used and used when a component mounting operation is performed on a board on which one mounting head is transported on the transport lane. The degree of identity between the boards is defined as a tool common degree, and a component placement determining step for deciding a part supply unit in which the part is placed is arranged for each part so as to increase the tool common degree. Good.

  As a result, for example, in one component mounter, the component supply unit in which each component is arranged is determined so that the tool commonality is increased. For example, a component in which various suction nozzles are not arranged in the mounting head Can be determined. That is, many suction nozzles can be used for mounting the mounting head on one substrate. For this reason, the number of components that can be mounted on one substrate by the mounting head in one component mounting operation can be increased, and components can be mounted on the substrate by a small component mounting operation. Therefore, the throughput can be improved so that the throughput is maximized.

  In addition, preferably, when a component mounting operation is performed on a substrate transported on each of the other transport lanes, and a tool used when performing a component mounting operation on a substrate transported on one transport lane. A common degree calculating step for calculating the tool common degree with each of the tools used in the step, and a common degree determining step for determining whether or not the calculated tool common degree is equal to or greater than a predetermined first threshold value. In the component placement determination step, a component supply unit in which the component is placed is determined for each component so that at least one of the calculated tool commonality is determined to be equal to or greater than the first threshold value. .

  As a result, the components can be arranged so that at least one tool commonality is equal to or higher than the first threshold. For example, various suction nozzles are arranged on the mounting head using the tool having the tool commonality equal to or higher than the first threshold. It does not have to be. That is, many suction nozzles can be used for mounting the mounting head on one substrate. For this reason, the number of components that can be mounted on one substrate by the mounting head in one component mounting operation can be increased, and components can be mounted on the substrate by a small component mounting operation. Therefore, the throughput can be improved so that the throughput is maximized.

  In the component placement determination step, a component placed in a component supply unit of one of the plurality of component mounters and a component supply of the other component mounter of the plurality of component mounters When the parts arranged in the part are the same type of parts, the same type of parts is supplied to either one of the component supply unit of the one component mounter and the component supply unit of the other component mounter. By re-arranging the components, the component supply unit in which the components are arranged may be determined for each component.

  Thereby, tool commonality increases by rearranging components of the same type. For this reason, components can be mounted on the substrate with a small number of component mounting operations, and throughput can be improved so that throughput is maximized.

  Also preferably, when the tool is a component cassette arranged in the component supply unit and storing components, one mounting head has one or more types of the two or more types of substrates. A component determination step of determining whether or not the number of the component cassettes required for storing all the components to be mounted on the circuit board is equal to or less than a predetermined second threshold value. When it is determined that the number of component cassettes is less than or equal to the second threshold, the tool commonality between the transfer lanes where each of the two or more types of substrates is transferred is calculated to be greater than or equal to the first threshold. When it is determined that the number of the component cassettes is larger than the second threshold value, the tool commonality between the transfer lanes to which each of the two or more types of substrates is transferred is smaller than the first threshold value. Calculated to.

  Thus, when the tool is a component cassette, the throughput can be improved while preventing the number of component cassettes from exceeding the allowable amount that can be arranged in the component supply unit.

  The present invention can be realized not only as such a mounting condition determination method, but also as a device or program for determining mounting conditions according to the method, and a storage medium for storing the program. Furthermore, the present invention can also be realized as a component mounting machine or a component mounting method for determining a mounting condition according to the method and mounting the component on the board.

  According to the present invention, it is possible to provide a mounting condition determination method capable of improving throughput so that the throughput is maximized in a component mounting machine having a plurality of conveyance lanes.

1 is an external view showing a configuration of a component mounting system according to an embodiment of the present invention. It is a top view which shows the structure of the some component mounting machine of a component mounting system. It is a top view which shows the main structures inside a component mounting machine. It is a schematic diagram which shows the positional relationship of a mounting head and a component cassette. It is a figure which shows the example of the component tape and the reel which accommodated components. It is a block diagram which shows the function structure of the mounting condition determination apparatus in this Embodiment. It is a figure which shows an example of NC data. It is a figure which shows an example of a component library. It is a flowchart which shows an example of operation | movement of the mounting condition determination apparatus in this Embodiment. It is a flowchart which shows an example of operation | movement of the mounting condition determination apparatus in this Embodiment. It is a figure explaining an example of the mounting condition determination method in this Embodiment. It is a figure explaining an example of the mounting condition determination method in this Embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is an external view showing a configuration of a component mounting system 10 that realizes a mounting condition determination method according to the present invention.

  The component mounting system 10 is a production line that mounts components on a board to produce a circuit board, and includes a mounting condition determination device 100 and a plurality of component mounting machines 200 (in the example shown in FIG. 1, nine component mounting machines). And.

  The mounting condition determining apparatus 100 is an apparatus that executes the mounting condition determining method according to the present invention. The mounting condition determining apparatus 100 determines mounting conditions so that the throughput can be improved.

  The component mounter 200 mounts a component such as an electronic component on the board under the conditions determined by the mounting condition determination apparatus 100 as part of the component mounting system 10.

  FIG. 2 is a plan view showing the configuration of a plurality of component mounters 200 of the component mounting system 10.

  As shown in the figure, the plurality of component mounting machines 200 mount components while sending boards 21 and 23 from upstream to downstream.

  That is, first, the upstream component mounter 200 (component mounter MC1 shown in the figure) receives the boards 21 and 23 and mounts the components on the boards 21 and 23. Then, the boards 21 and 23 on which the components are mounted are sent to the component mounter 200 on the downstream side (component mounter MC2 shown in the figure).

  In this way, the boards 21 and 23 are sequentially sent to the component mounting machines 200, and the components are mounted.

  FIG. 3 is a plan view showing the main configuration inside the component mounter 200. Here, the substrate transport direction is the X-axis direction, and the front-rear direction of the component mounter orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction.

  The component mounting machine 200 includes a transport lane 215 and a transport lane 217 for transporting the two substrates 21 and 23, respectively, and two mounting units 210a and 210b for mounting components on the two substrates. .

  The transport lane 215 is disposed on the mounting unit 210a side, and the transport lane 217 is disposed on the mounting unit 210b side so as to be parallel to the X-axis direction.

  The transport lane 215 includes a fixed rail 215a and a movable rail 215b that are parallel to the X-axis direction. The position of the fixed rail 215a is fixed in advance, and the movable rail 215b is movable in the Y-axis direction according to the length of the substrate 21 to be transported in the Y-axis direction.

  Similarly to the transfer lane 215, the transfer lane 217 includes a fixed rail 217a and a movable rail 217b that are parallel to the X-axis direction. The position of the fixed rail 217a is fixed in advance, and the movable rail 217b is movable in the Y-axis direction according to the length of the substrate 23 to be transported in the Y-axis direction.

  Further, the substrate 21 and the substrate 23 are independently transferred on the transfer lane 215 and the transfer lane 217.

  The two mounting units 210 a and 210 b perform mounting work on the substrate 21 and the substrate 23.

  The mounting unit 210a and the mounting unit 210b have the same configuration. That is, the mounting unit 210a includes a component supply unit 211a, a mounting head 213a, and a component recognition camera (not shown). Similarly, the mounting unit 210b includes a component supply unit 211b, a mounting head 213b, and a component recognition camera (not shown).

  Here, a detailed configuration of the mounting unit 210a will be described. The detailed description of the configuration of the mounting unit 210b is the same as that of the mounting unit 210a, and is therefore omitted.

  The component supply unit 211a includes an array of a plurality of component cassettes 212a that store component tapes. The component tape is, for example, a plurality of components of the same component type arranged on a tape (carrier tape) and supplied in a state of being wound on a reel or the like. The parts arranged on the part tape are, for example, chips and the like, specifically, 0402 chip parts having a size of 4 mm × 2 mm, 1005 chip parts having a size of 10 mm × 5 mm, and the like.

  The mounting head 213 a can include, for example, a maximum of 10 suction nozzles, and can mount a maximum of 10 components from the component supply unit 211 a and mount them on the substrate 21 and the substrate 23.

  The component recognition camera is used for photographing the component sucked by the mounting head 213a and inspecting the suction state of the component two-dimensionally or three-dimensionally.

  FIG. 4 is a schematic diagram showing the positional relationship between the mounting head 213a and the component cassette 212a.

  As described above, for example, a maximum of ten suction nozzles nz can be attached to the mounting head 213a. The mounting head 213a to which the ten suction nozzles nz are attached can suck components from each of a maximum of ten component cassettes 212a at the same time (by one up and down movement).

  FIG. 5 is a diagram illustrating an example of a component tape and a reel that contain components.

  Components such as chip-type electronic components are housed in a housing recess 221a formed continuously at a predetermined interval in a carrier tape 221 shown in the figure, and a cover tape 222 is attached to the upper surface and packaged. The carrier tape 221 with the cover tape 222 attached in this way is supplied to the user in a taping form wound around the reel 223 by a predetermined quantity. The carrier tape 221 and the cover tape 222 constitute a component tape. The configuration of the component tape may be other than the configuration shown in FIG.

  The mounting unit 210a of such a component mounting machine 200 moves the mounting head 213a to the component supply unit 211a and causes the mounting head 213a to attract the component supplied from the component supply unit 211a. The mounting unit 210a moves the mounting head 213a onto the component recognition camera at a constant speed, causes the component recognition camera to capture images of all the components sucked by the mounting head 213a, and accurately detects the suction position of the component. Let Further, the mounting unit 210a moves the mounting head 213a to, for example, the substrate 21 and sequentially mounts all the sucked components on the mounting points of the substrate 21. The mounting unit 210a mounts all the predetermined components on the substrate 21 by repeatedly performing such operations of suction, movement, and mounting by the mounting head 213a.

  Also, the mounting unit 210b repeatedly executes the operations of suction, movement, and mounting by the mounting head 213b, similarly to the mounting unit 210a. Accordingly, the mounting unit 210a and the mounting unit 210b mount all predetermined components on the substrate 21 and the substrate 23.

  Then, each of the mounting unit 210a and the mounting unit 210b picks up a component from the component supply unit when the counterpart mounting unit is mounting the component, and conversely, the counterpart mounting unit picks up the component from the component supply unit. When mounting, the components are alternately mounted on the substrate 21 and the substrate 23 so as to mount the components. In other words, the component mounter 200 is configured as a so-called alternating component mounter.

  The two mounting units 210a and 210b mount components only on a board that is set in advance to mount components. For this reason, the board | substrate which is not set to mount components among the board | substrate 21 and the board | substrate 23 is conveyed to the following component mounting machine 200, without mounting.

  That is, each component mounter 200 is configured to be able to mount components on both the substrate 21 and the substrate 23 that are transported to each transport lane. Mounting conditions are determined so that components are mounted only on boards that are set to be mounted, and boards that are not set to be mounted are transported to the next component mounting machine without being mounted. can do.

  Moreover, there are two types of methods for producing the board of the component mounter 200, a method called a so-called synchronous mode and a method called an asynchronous mode.

  The synchronous mode is a mode in which mounting of components is started on a plurality of loaded substrates after the substrates are loaded into each of the two or more transfer lanes. The asynchronous mode is a mode in which component mounting is started on one board that has been loaded after the board has been loaded into any one of the plurality of conveyance lanes.

  In the asynchronous mode, for example, the substrate 23 is transported on the transport lane 217 while a component is mounted on the substrate 21 on the transport lane 215, so that it is not necessary to consider the transport time of the substrate 23. In this regard, in the asynchronous mode, the throughput can be improved as compared with the synchronous mode.

  Here, it is assumed that the board production method of the component mounter 200 is performed in the asynchronous mode.

  FIG. 6 is a block diagram showing a functional configuration of the mounting condition determining apparatus 100 in the present embodiment.

  The mounting condition determining apparatus 100 is a computer that performs processing such as determining mounting conditions so that throughput can be improved. The mounting condition determining apparatus 100 includes an arithmetic control unit 101, a display unit 102, an input unit 103, a memory unit 104, a program storage unit 105, a communication I / F (interface) unit 106, and a database unit 107.

  The mounting condition determining apparatus 100 is realized by a general-purpose computer system such as a personal computer executing the program according to the present invention, and is not connected to the component mounting machine 200, but is a stand-alone simulator (for mounting conditions). It also functions as a decision tool. It should be noted that the function of the mounting condition determining apparatus 100 may be provided in the component mounter 200.

The arithmetic control unit 101 is a CPU (Central Processing Unit), a numerical processor, or the like, and loads and executes a necessary program from the program storage unit 105 to the memory unit 104 in accordance with an instruction from an operator or the like. Each component 102-107 is controlled.

  The display unit 102 is a CRT (Cathode-Ray Tube), an LCD (Liquid Crystal Display), or the like, and the input unit 103 is a keyboard, a mouse, or the like. These are mounted condition determination devices under the control of the arithmetic control unit 101. 100 is used for dialogue between an operator and the like.

  The communication I / F unit 106 is a LAN (Local Area Network) adapter or the like, and is used for communication between the mounting condition determining apparatus 100 and the component mounting machine 200. The memory unit 104 is a RAM (Random Access Memory) or the like that provides a work area for the arithmetic control unit 101.

  The program storage unit 105 is a hard disk or the like that stores various programs that implement the functions of the mounting condition determination apparatus 100. The program is a program for determining a mounting condition by the component mounter 200, and functionally (as a processing unit that functions when executed by the arithmetic control unit 101), includes a component placement determining unit 105a.

  The component arrangement determination unit 105a determines a component supply unit in which the component is arranged for each component so that the tool commonality is increased. Here, the tool commonality is determined from the type of component mounted on the board transported on the transport lane, and is used when one mounting head performs component mounting work on the board transported on the transport lane. The degree of the tool to be used is the same between two or more types of substrates among the plurality of types of substrates.

  Specifically, the component placement determination unit 105a is configured to select the component from among the component supply units of the plurality of component mounters 200 so that the commonality of the tools in at least one component mounter 200 increases. A component supply unit in which components are arranged is determined.

  In addition, the component placement determination unit 105a supplies two components provided in one component mounter 200 for each component so that the commonality of the tools in at least one mounting head in one component mounter 200 increases. The component supply unit in which the component is arranged is determined from the units 211a and 211b.

  The database unit 107 is a hard disk or the like that stores NC data 107a, a component library 107b, and the like, which are data used for the mounting condition determination processing by the mounting condition determination apparatus 100.

  7 to 8 are diagrams showing examples of the NC data 107a and the parts library 107b, respectively.

  FIG. 7 is a diagram illustrating an example of the NC data 107a.

The NC data 107a is a collection of information indicating mounting points of all components to be mounted. One mounting point pi includes a component type ci, an X coordinate xi, a Y coordinate yi, control data φi, and a mounting angle θi. Here, the component type corresponds to the component name in the component library 107b shown in FIG. 8, the X coordinate and the Y coordinate are the coordinates of the mounting point (coordinates indicating a specific position on the board), and the control data is The constraint information (the type of usable suction nozzle nz, the maximum movement acceleration of the mounting head, etc.) regarding the mounting of the component is shown. The mounting angle θi indicates an angle at which the nozzle that sucks the component of the component type ci should rotate. NC (Numeric Control) data to be finally obtained is an arrangement of mounting points that minimizes the line tact.

  FIG. 8 is a diagram illustrating an example of the component library 107b.

  The component library 107b is a library in which unique information about all component types that can be handled by the component mounter 200 is collected. As shown in the figure, the component library 107b includes a component size for each component type (component name), tact (tact specific to the component type under a certain condition), and other constraint information (for usable suction nozzles nz). Type, recognition method by component recognition camera, maximum acceleration ratio of mounting head, etc.). In the drawing, the external appearance of the components of each component type is also shown for reference. In addition, the component library 107b may include information such as the color and shape of the component.

  Next, an example of operation | movement of the mounting condition determination apparatus 100 in this Embodiment is demonstrated.

  9 and 10 are flowcharts showing an example of the operation of the mounting condition determining apparatus 100 in the present embodiment.

  The component arrangement determination unit 105a determines a component supply unit in which the component is arranged for each component so that the tool commonality is increased.

  That is, first, as shown in FIG. 9, the component arrangement determining unit 105a acquires tool information (S102).

  Specifically, the tools are mounting heads 213a and 213b, suction nozzles nz, or component cassettes 212a and 212b. The tool information includes the number of suction nozzles nz arranged in the mounting heads 213a and 213b, the type of suction nozzles nz, or the types of component cassettes 212a and 212b.

  Then, the component placement determination unit 105a is transported on the tool used when performing component mounting work on the board transported on one transport lane and each of the other transport lanes based on the acquired tool information. The tool commonality with each tool used when the component mounting work is performed on the board is calculated (S104).

  Next, the component arrangement determining unit 105a determines whether or not the calculated tool commonality is equal to or greater than a predetermined first threshold (S106).

  The component arrangement determination unit 105a determines a component supply unit in which the component is arranged for each component so that it is determined that at least one of the calculated tool commonality is equal to or greater than the first threshold.

  Specifically, when the component placement determining unit 105a determines that all of the calculated tool commonality is smaller than the first threshold (NO in S106), the component placement determining unit 105a places the components placed in the component supply units 211a and 211b. Re-execute (S108). Then, the component placement determining unit 105a calculates the tool commonality again in a state where the components are rearranged (S104).

  If the component placement determination unit 105a determines that at least one of the calculated tool commonality levels is equal to or greater than the first threshold (YES in S106), the component placement determination unit 105a sends the component placement state to the component supply units 211a and 211b. The arrangement of the parts is determined (S110).

  FIG. 10 is a flowchart illustrating an example of processing for calculating the tool commonality (S104 in FIG. 9).

  First, the component placement determining unit 105a determines whether the tool is the component cassette 212a, 212b (S202).

  When the component placement determining unit 105a determines that the tool is not the component cassette 212a or 212b (NO in S202), the tool used when performing the component mounting work on the board transported on one transport lane, and the like The tool commonality with each tool used when the component mounting operation is performed on the board transported on each of the transport lanes is calculated (S204).

  Here, the case where the tool is not the component cassette 212a, 212b is a case where the tool is the suction nozzle nz or the mounting heads 213a, 213b. In addition, the tool commonality is a degree that a tool to be used is the same between two or more types of substrates among a plurality of types of substrates.

  That is, the same tool means that when the tool is the suction nozzle nz, the type of the suction nozzle nz to be used is the same. When the tool is the mounting head 213a, 213b, the type of the mounting head 213a, 213b is the same. The same, for example, the number of suction nozzles nz provided in the mounting heads 213a and 213b to be used is the same. Specifically, for example, when the tool is the suction nozzle nz, the tool commonality is commonly used between transport lanes each transporting two or more types of substrates with respect to the entire suction nozzle nz. The ratio of the suction nozzles nz.

  Further, when the component arrangement determining unit 105a determines that the tool is the component cassette 212a or 212b (YES in S202), one or more types of two or more types of substrates to be mounted by one mounting head. It is determined whether or not the number of component cassettes necessary for storing all components mounted on the substrate is equal to or smaller than a predetermined second threshold value (S206). That is, the component arrangement determining unit 105a determines whether or not the total number of component cassettes used for mounting one mounting head on all of two or more types of substrates is equal to or less than the second threshold value.

  When the component arrangement determining unit 105a determines that the number of component cassettes is equal to or less than the second threshold, the tool commonality between the transfer lanes where each of the two or more types of substrates is transferred is equal to or greater than the first threshold. Is calculated (S208).

  In addition, when the component arrangement determining unit 105a determines that the number of component cassettes is larger than the second threshold, the tool commonality between the transfer lanes to which each of the two or more types of substrates is transferred is smaller than the first threshold. Is calculated (S210).

  Next, the mounting condition determination method in the present embodiment will be specifically described.

  11 and 12 are diagrams for explaining an example of the mounting condition determination method in the present embodiment.

  As shown in FIG. 11, the component mounting system 10 includes a component mounter MC1 and a component mounter MC2 which are two component mounters 200. Note that the component mounter 200 is a component mounter in alternating and asynchronous mode. The mounting heads 213a and 213b are each provided with eight suction nozzles nz.

  Here, in the same figure and the figure demonstrated below, the mounting heads 213a and 213b are greatly illustrated for convenience of explanation. The symbols described in the boards 21 and 23 indicate the type of the board, and the numerical values described in the boards 21 and 23 indicate the number of components to be mounted. Furthermore, the symbols described in the mounting heads 213a and 213b indicate the type of substrate to be mounted. The numerical values on the left side of the mounting heads 213a and 213b indicate the number of components to be mounted, and the numerical values on the right side indicate the number of suction nozzles nz used for mounting the components.

  That is, as shown in the figure, the board type A board 23 with 100 parts is transported to the transport lane 217, the number of parts 50 is mounted by the component mounter MC1, and transported on the transport lane 217 to mount the parts. The remaining number of parts 50 is mounted by the machine MC2. Similarly, the board type B board 21 having 80 parts is transported to the transport lane 215, the number 40 of parts is mounted by the component mounter MC1, transported on the transport lane 215, and the remaining parts are transported by the component mounter MC2. Number 40 is implemented.

  In the component mounter MC1, the mounting heads 213a and 213b both mount a component number of 25 on the board 23 of the board type A and mount a component of 20 parts on the board 21 of the board type B. The same applies to the component mounter MC2.

  In such a component mounting system 10, first, the component arrangement determining unit 105a acquires tool information (S102 in FIG. 9). Note that the component placement determining unit 105a may acquire the information on the tool from the operator via the input unit 103, or may acquire the information from preset data or the like.

  Here, it is assumed that the tool is the suction nozzle nz. That is, the component arrangement determining unit 105a acquires the type of the suction nozzle nz used for mounting the component on the substrate transported on the transport lane as the tool information. Specifically, the component arrangement determining unit 105a determines, for example, the type of the suction nozzle nz used for mounting the component on the substrate 23 of the substrate type A on which the mounting head 213b is transported on the transport lane 217, and the mounting head. 213b acquires the type of the suction nozzle nz used for mounting the component on the board 21 of the board type B transported on the transport lane 215.

  Then, the component placement determination unit 105a is transported on the tool used when performing component mounting work on the board transported on one transport lane and each of the other transport lanes based on the acquired tool information. The degree of tool commonality with each tool used when performing component mounting work on the board is calculated (S104 in FIG. 9).

  Specifically, the component arrangement determining unit 105a first determines whether or not the tool is the component cassette 212a or 212b (S202 in FIG. 10).

  Here, since the tool is the suction nozzle nz, the component arrangement determining unit 105a determines that the tool is not the component cassette 212a, 212b (NO in S202 of FIG. 10), and the substrate to be transported on one transport lane. The tool commonality between the tool used when performing the component mounting work and each tool used when performing the component mounting work on the board transported on each of the other transport lanes is calculated (FIG. 10). S204).

  Specifically, the component arrangement determining unit 105 a determines the type of suction nozzle nz used by the mounting head 213 b to mount the component on the substrate 23 and the mounting head 213 b on the substrate 21. Based on the type of suction nozzle nz used to mount the component, the suction nozzle nz of the mounting head 213b as a tool in the transport lane 217 and the suction nozzle nz of the mounting head 213b as a tool in the transport lane 215 Calculate tool commonality.

  Here, as shown in FIG. 11, in the component mounter MC1, the number of suction nozzles nz of the mounting head 213b used for mounting components on the board 23 of the board type A transferred to the transfer lane 217 is five. is there. Similarly, the number of suction nozzles nz of the mounting head 213b used for mounting components on the board 21 of the board type B transported to the transport lane 215 is five. For this reason, since the mounting head 213b includes a total of eight suction nozzles nz, the two suction nozzles nz are used to mount components on both the substrate 21 and the substrate 23. That is, the tool commonality of the suction nozzle nz of the mounting head 213b is 25% of 2/8.

  In this way, the component arrangement determining unit 105a calculates the tool commonality of the suction nozzle nz of the mounting head 213b of the component mounter MC1 between the transport lane 215 and the transport lane 217 as 25%. Similarly, the component arrangement determining unit 105a also calculates the tool commonality of the suction nozzle nz of the mounting head 213a of the component mounter MC1 and the mounting heads 213a and 213b of the component mounter MC2.

  Next, the component arrangement determining unit 105a determines whether or not the calculated tool commonality is greater than or equal to a predetermined first threshold (S106 in FIG. 9). Here, the predetermined first threshold is 50%. For example, since the calculated tool commonality of the suction nozzle nz of the mounting head 213b of the component mounting machine MC1 is 25%, the component placement determining unit 105a first determines the calculated tool commonality in advance. It is determined that the value is smaller than the threshold value. Further, since the component mounting machine 200 has only two transport lanes, the transport lane 215 and the transport lane 217, the component placement determining unit 105a determines the tool commonality of the suction nozzle nz of the mounting head 213b of the component mounter MC1. It is determined that all are smaller than the first threshold.

  Further, when the component arrangement determining unit 105a determines that all the tool commonality is smaller than the first threshold (NO in S106 of FIG. 9), the component arrangement determining unit 105a rearranges the components arranged in the component supply units 211a and 211b ( S108 of FIG. 9).

  Here, the component arrangement determining unit 105a determines a component supply unit in which the component is arranged for each component so that the commonality of the tools in at least one component mounter 200 is increased. Then, the component placement determination unit 105a supplies, for example, a component placed in a component supply unit of one of the plurality of component mounters and a component supply of the other component mounter of the plurality of component mounters. When the parts arranged in the part are the same type of parts, the same type of parts is placed in one of the component supply units of one of the component mounters and the component supply unit of the other component mounter. By re-arranging, the component supply unit in which the component is arranged is determined for each component. Here, since the tool is the suction nozzle nz, the same type of component refers to a component that is sucked by the same suction nozzle nz.

  Specifically, for example, a component mounted on the board type A substrate by the mounting head 213b by the component mounting machine MC1 (arranged in the component supply unit 211b), and a board of the board type B by the mounting head 213a by the component mounting machine MC2. When the component to be mounted (arranged in the component supply unit 211a) is the same type of component and is sucked by the same suction nozzle nz, the component is mounted on the board of the board type B by the mounting head 213a by the component mounter MC1. If the component to be mounted (arranged in the component supply unit 211a) is not included, the component mounter for mounting the component on the substrate of the board type B is changed from the component mounter MC2 to the mounting head 213a of the component mounter MC1. The components are rearranged so as to be changed to mounting (the component is arranged in the component supply unit 211a of the component mounter MC1). As a result, the component mounter MC1 can mount the component on both the substrate type A substrate and the substrate type B substrate, thereby increasing the tool commonality in the component mounter MC1.

  In addition, when a component arranged in one component supply unit of one component mounting machine 200 and a component arranged in the other component supply unit are of the same type, the same type of component is You may determine the component supply part by which the said component is arrange | positioned about each component by rearranging in any one component supply part of a component supply part and the other component supply part.

  Specifically, for example, the mounting head 213b of the component mounting machine MC1 is sucked from the component supply unit 211b and mounted on the board of the board type A, and the mounting head 213a of the component mounting machine MC1 is sucked from the component supply unit 211a. When the component mounted on the substrate of the substrate type B is a component of the same type and is sucked by the same suction nozzle nz, the component is arranged in the same component supply unit. That is, for example, the component mounted on the substrate of the board type B by the mounting head 213a is rearranged from the component supply unit 211a to the component supply unit 211b, and the mounting head for mounting the component is transferred from the mounting head 213a to the mounting head 213b. change. Accordingly, the component can be mounted on both the board type A board and the board type B board by the mounting head 213b, so that the tool commonality can be increased.

  When the tool is a component cassette, the same type of component is a component stored in the same component cassette.

  Then, the component placement determining unit 105a calculates the tool commonality again in a state where the components are rearranged (S104 in FIG. 9).

  Here, the component arrangement determining unit 105a rearranges the components as shown in FIG. That is, as shown in the figure, in the component mounter MC1, the number of suction nozzles nz of the mounting head 213b used for mounting components on the substrate 23 of the substrate type A transferred to the transfer lane 217 is eight. . Similarly, the number of suction nozzles nz of the mounting head 213b used for mounting components on the board 21 of the board type B transported to the transport lane 215 is eight. For this reason, since the mounting head 213b is provided with a total of eight suction nozzles nz, all eight suction nozzles nz are used for mounting components on both the substrate 21 and the substrate 23. That is, the tool commonality of the suction nozzle nz of the mounting head 213b is 100% of 8/8.

  In this way, the component arrangement determining unit 105a calculates the tool commonality of the suction nozzle nz of the mounting head 213b of the component mounter MC1 between the transport lane 215 and the transport lane 217 as 100%. Similarly, the component arrangement determining unit 105a also calculates the tool commonality of the suction nozzle nz of the mounting head 213a of the component mounter MC1 and the mounting heads 213a and 213b of the component mounter MC2.

  Next, the component arrangement determining unit 105a determines whether or not the calculated tool commonality is equal to or greater than a first threshold (S106 in FIG. 9). Here, since the first threshold is 50%, the component arrangement determining unit 105a determines that the calculated tool commonality of the suction nozzle nz of the mounting head 213b of the component mounter MC1 is equal to or greater than the first threshold.

  If the component placement determination unit 105a determines that at least one of the calculated tool commonality levels is equal to or greater than the first threshold value, the component placement determination unit 105a sets the component placement state to the component supply units 211a and 211b. Is determined (S110 in FIG. 9).

  That is, the component arrangement determining unit 105a determines the state in FIG. 12 as the arrangement of components in the component supply units 211a and 211b.

  As a result, the components can be arranged so that at least one tool commonality is equal to or higher than the first threshold. For example, various suction nozzles are arranged on the mounting head using the tool having the tool commonality equal to or higher than the first threshold. It does not have to be. That is, many suction nozzles can be used for mounting the mounting head on one substrate. For this reason, the number of components that can be mounted on one substrate by the mounting head in one component mounting operation can be increased, and components can be mounted on the substrate by a small component mounting operation.

  Specifically, in the case shown in FIG. 11, for example, when the mounting head 213 b of the component mounting machine MC <b> 1 mounts a component with a component count of 25 on the board 23 transported on the transport lane 217, If five components are mounted by the nozzle nz, five component mounting operations are required. Similarly, when the mounting head 213b mounts 20 components on the substrate 21 transported on the transport lane 215, if 5 components are mounted by 5 suction nozzles nz, 4 components are mounted. Mounting operation is required. That is, a total of nine component mounting operations are required for the mounting head 213b to mount the components. The same applies to the component mounter MC2.

  On the other hand, in the case shown in FIG. 12, when the mounting head 213b of the component mounter MC1 mounts a component with a component count of 25 on the substrate 23 transported on the transport lane 217, eight suction nozzles nz Thus, it is possible to mount eight parts each, so that four parts mounting operations are required. Similarly, when the mounting head 213b mounts 20 components on the substrate 21 transported on the transport lane 215, if 8 components are mounted by 8 suction nozzles nz, 3 components are mounted. Mounting operation is required. That is, in order for the mounting head 213b to mount a component, only a total of seven component mounting operations are required. That is, with the configuration shown in FIG. 12, the component mounting operation can be reduced twice compared to the case shown in FIG.

  Therefore, the throughput can be improved so that the throughput is maximized.

  The case where the tool is the suction nozzle nz has been described above, but the tool may be a component cassette 212a, 212b.

  In this case, the component arrangement determining unit 105a determines that the tool is the component cassette 212a, 212b (YES in S202 of FIG. 10), and one mounting head has two or more types of substrates among a plurality of types of substrates. It is determined whether or not the number of component cassettes in which components to be mounted are stored is equal to or smaller than a predetermined second threshold (S206 in FIG. 10).

  Here, the second threshold is an allowable amount of the component cassettes 212a and 212b that can be arranged in the component supply units 211a and 211b. That is, for example, if the number of component cassettes 212a is equal to or less than the second threshold value, all the component cassettes 212a can be arranged in the component supply unit 211a. Further, if the number of component cassettes 212a is larger than the second threshold value, all of the component cassettes 212a cannot be arranged in the component supply unit 211a.

  When the component arrangement determining unit 105a determines that the number of component cassettes is equal to or less than the second threshold, the tool commonality between the transfer lanes where each of the two or more types of substrates is transferred is equal to or greater than the first threshold. Is calculated (S208 in FIG. 10).

  In addition, when the component arrangement determining unit 105a determines that the number of component cassettes is larger than the second threshold, the tool commonality between the transfer lanes to which each of the two or more types of substrates is transferred is smaller than the first threshold. (S210 in FIG. 10).

  Then, the component arrangement determining unit 105a determines the arrangement of components so that all the component cassettes 212a and 212b can be arranged in the component supply units 211a and 211b (S106 to S110 in FIG. 9). The processing after the component arrangement determining unit 105a calculates the tool commonality (S106 to S110 in FIG. 9) is the same as the description in FIG.

  Thereby, when the tools are the component cassettes 212a and 212b, it is possible to prevent the number of the component cassettes 212a and 212b from exceeding the allowable amount that can be arranged in the component supply units 211a and 211b.

  As described above, according to the mounting condition determination method according to the present invention, it is possible to improve the throughput so that the throughput is maximized in the production line in which the component mounter includes a plurality of transport lanes.

  As mentioned above, although the mounting condition determination method according to the present invention has been described using the above embodiment, the present invention is not limited to this.

  That is, the embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  For example, in the present embodiment, the component mounter 200 includes two mounting heads 213a and 213b and two component supply units 211a and 211b. However, the component mounter 200 includes one mounting head and one component supply unit, and is a modular type component that moves the mounting head having a plurality of suction nozzles in the XY directions shown in FIG. It may be a mounting machine.

  In this case, for example, both the component mounting machines MC1 and MC2 have only one mounting head and one component supply unit, and are mounted on the board of the board type A that is transported on the transport lane 217 by the component mounting machine MC1. If the component and the component mounted on the substrate of the substrate type B that is transported on the transport lane 215 by the component mounting machine MC2 are the same type of component and are sucked by the same suction nozzle nz, and the component is a component If the component is not included in the component mounted on the substrate of the board type B by the mounter MC1, the component is rearranged so that the component is changed from the component mounter MC2 to the mount by the component mounter MC1. As a result, the component mounter MC1 can mount the component on both the substrate type A substrate and the substrate type B substrate, thereby increasing the tool commonality in the component mounter MC1.

  In the present embodiment, the component mounter 200 includes two transport lanes, but the number of transport lanes is not limited to two but may be three or more.

  In the present embodiment, the component mounter 200 is mounted on two types of boards. However, the number of board types is not limited to two, but may be three or more.

  In the present embodiment, when the tool is a component cassette, the component arrangement determining unit 105a calculates that the tool commonality is smaller than the first threshold when determining that the number of component cassettes is larger than the second threshold. It was. However, the component arrangement determining unit 105a may calculate the tool commonality when the tool is a component cassette, and may determine whether the calculated tool commonality is equal to or greater than a first threshold value. Here, the tool commonality when the tool is a component cassette is, for example, the number of substrate types A and B with respect to the number of all component cassettes required for mounting on the substrate of the substrate type A and the substrate type B. This is the ratio of the number of component cassettes that store components common to both boards.

  The present invention can be applied to a mounting condition determining method in a component mounter that includes a plurality of transport lanes in which a board is transported in parallel, and in particular, a mounting condition determining method capable of improving the throughput so as to maximize the throughput. Applicable to etc.

DESCRIPTION OF SYMBOLS 10 Component mounting system 21, 23 Board | substrate 100 Mounting condition determination apparatus 101 Operation control part 102 Display part 103 Input part 104 Memory part 105 Program storage part 105a Component arrangement | positioning determination part 106 Communication I / F part 107 Database part 107a NC data 107b Component library 200 Component mounting machines 210a and 210b Mounting units 211a and 211b Component supply units 212a and 212b Component cassettes 213a and 213b Mounting heads 215 and 217 Transport lanes

Claims (10)

At least one mounting head for mounting components on a board, at least one component supply unit for supplying components to the mounting head, and a plurality of transport lanes arranged in parallel, and transporting on the plurality of transport lanes A mounting condition determination method for determining a mounting condition of the component mounter, targeting a production line provided with a plurality of component mounters for mounting a component on a plurality of types of boards,
A plurality of tools, which are determined from the types of components mounted on the substrate transported on the transport lane and used when one mounting head performs a component mounting operation on the substrate transported on the transport lane, The degree of the sameness between two or more types of substrates among the types of substrates is defined as the tool commonality, and the plurality of the plurality of components for each component so that the commonality of the tool in at least one component mounter is increased. A mounting condition determining method comprising: a component arrangement determining step for determining a component supplying unit in which the component is arranged from among the component supplying units of a component mounting machine. Two mounting heads for mounting components on a board, two component supply units for supplying components to the two mounting heads, and a plurality of conveyance lanes arranged in parallel between the two component supply units A mounting condition determination method for determining mounting conditions for a component mounter that mounts components on a plurality of types of boards transported on a plurality of transport lanes,
A plurality of tools, which are determined from the types of components mounted on the substrate transported on the transport lane and used when one mounting head performs a component mounting operation on the substrate transported on the transport lane, The degree of identity between two or more types of substrates among the types of substrates is defined as the tool commonality, and the component supply unit in which the component is arranged is determined for each component so that the tool commonality is increased. A mounting condition determining method comprising a component placement determining step. further,
Tools used when performing component mounting work on a board transported on one transport lane, and tools used when performing component mounting work on a board transported on each of the other transport lanes A commonality calculating step of calculating the tool commonality with
A commonality determination step of determining whether or not the calculated tool commonality is equal to or greater than a predetermined first threshold,
In the component placement determination step, the component supply unit in which the component is placed is determined for each component so that at least one of the calculated tool commonality is determined to be greater than or equal to the first threshold value. The mounting condition determining method according to claim 1, wherein the mounting condition is determined. In the component placement determination step, a component placed in a component supply unit of one of the plurality of component mounters and a component supply unit of the other component mounter of the plurality of component mounters When the arranged component is the same type of component, the same type of component is placed in one of the component supply unit of the one component mounter and the component supply unit of the other component mounter. The mounting condition determining method according to claim 1, wherein a component supply unit in which the component is disposed is determined for each component by re-arranging. When the tool is a component cassette that is arranged in the component supply unit and accommodates a component, the same type of component is a component that is accommodated in the same component cassette, and the tool is arranged in the mounting head. The mounting condition determination method according to claim 4, wherein the same kind of component is a component that is sucked by the same suction nozzle. further,
When the tool is a component cassette that is arranged in the component supply unit and stores components, a component that one mounting head mounts on one or more types of substrates among the two or more types of substrates. Including a component determination step of determining whether or not the number of the component cassettes necessary for storing all is equal to or less than a predetermined second threshold value;
In the commonality calculation step, when it is determined that the number of the component cassettes is equal to or less than the second threshold value, the tool commonality between transfer lanes to which each of the two or more types of substrates is transferred is When the number of component cassettes is calculated to be greater than or equal to a first threshold and it is determined that the number of component cassettes is greater than the second threshold, the degree of tool commonality between the transport lanes to which each of the two or more types of substrates is transported The mounting condition determination method according to any one of claims 3 to 5, wherein the calculation is performed such that is smaller than the first threshold value. At least one mounting head for mounting a component on a substrate, at least one component supply unit for supplying the component to the mounting head, and a plurality of transport lanes arranged in parallel, and transporting on the plurality of transport lanes A mounting condition determination device for determining a mounting condition for the component mounting machine, targeting a production line provided with a plurality of component mounting machines for mounting components on a plurality of types of boards,
A plurality of tools, which are determined from the types of components mounted on the substrate transported on the transport lane and used when one mounting head performs a component mounting operation on the substrate transported on the transport lane, The degree of the sameness between two or more types of substrates among the types of substrates is defined as the tool commonality, and the plurality of the plurality of components for each component so that the commonality of the tool in at least one component mounter is increased. A mounting condition determining apparatus comprising: a component arrangement determining unit that determines a component supplying unit in which the component is arranged from among the component supplying units of a component mounting machine. A component mounting method for mounting components on a plurality of types of boards,
A component placed in the component supply unit determined by the mounting condition determination method according to any one of claims 1 to 6, wherein one mounting head has two or more types in which the tool commonality is increased A component mounting method comprising a mounting step of mounting on a substrate. A component mounter for mounting components on a board,
The mounting condition determining device according to claim 7, wherein the component mounting machine determines a condition for mounting a component,
Component mounting means for mounting a component placed in the component supply unit determined by the mounting condition determination device on two or more types of substrates having a high degree of tool commonality on one mounting head. Component mounter characterized by. At least one mounting head for mounting components on a board, at least one component supply unit for supplying components to the mounting head, and a plurality of transport lanes arranged in parallel, and transporting on the plurality of transport lanes A program for determining a mounting condition of the component mounter, targeting a production line provided with a plurality of component mounters for mounting components on a plurality of types of boards,
A plurality of tools, which are determined from the types of components mounted on the substrate transported on the transport lane and used when one mounting head performs a component mounting operation on the substrate transported on the transport lane, The degree of the sameness between two or more types of substrates among the types of substrates is defined as the tool commonality, and the plurality of the plurality of components for each component so that the commonality of the tool in at least one component mounter is increased. A program that causes a computer to execute a component placement determination step for determining a component supply unit in which a component is placed from among the component supply units of a component mounter.

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