JP2010018736A - Epoxy resin composition for sealing semiconductor, production process of the same and semiconductor device produced using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor that has low stress and greatly excellent adhesion after the molding process, to provide a process for producing the epoxy resin composition and to provide a semiconductor device produced using the epoxy resin composition. <P>SOLUTION: The epoxy resin composition for sealing a semiconductor comprises the component (A) and the component (B) as follows: the component (A) is a polyvalent epoxy resin having on the average two or more epoxy groups; and the component (B) is a straight-chain dihydric phenol resin which is a reaction product of (a) a straight-chain epoxy resin having epoxy groups at both ends and (b) a dihydric phenol compound. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  TECHNICAL FIELD The present invention relates to an epoxy resin composition for semiconductor encapsulation, a method for producing the same, and a semiconductor device obtained thereby, and more specifically, for semiconductor encapsulation that has low stress after molding and has excellent adhesion. The present invention relates to an epoxy resin composition, a method for producing the same, and a semiconductor device obtained thereby.

  2. Description of the Related Art Conventionally, semiconductor elements such as transistors and ICs have been made into semiconductor devices by resin sealing with a plastic package or the like from the viewpoint of protection from the external environment and the handling of the semiconductor elements. In recent years, in the field of element sealing, the size and density of semiconductor devices have been remarkably increased, and as a result, surface mount packages have become the mainstream of semiconductor devices. In the surface mount type package, in order to increase the mounting density and reduce the mounting height, the occupied volume of the semiconductor element with respect to the package is increased, and the thickness of the package is becoming extremely thin.

  In such a semiconductor device, due to the difference in shrinkage between the substrate and the sealing resin layer after molding, stress is generated between the two when the soldering temperature is high. Peeling is likely to occur.

From such a background, there is a demand for a resin composition that exhibits low stress after molding. For example, in order to keep the glass transition temperature of the cured product high, a resin having a rigid molecular structure such as naphthalene or anthracene is selected (Patent Document 1).
JP 2007-262384 A.

  However, a resin having a rigid molecular structure has the drawback that due to the rigidity of the molecule, the reactivity between reactive groups is poor and the reaction is difficult to complete. Furthermore, since this resin relaxes stress to some extent, the low stress property and adhesiveness are improved, but it is still not satisfactory.

  The present invention has been made in view of such circumstances, and provides an epoxy resin composition for semiconductor encapsulation, which has low stress after molding and has excellent adhesion, a method for producing the same, and a semiconductor device obtained thereby. Is the purpose.

In order to achieve the above object, the first gist of the present invention is an epoxy resin composition for semiconductor encapsulation containing the following components (A) and (B).
(A) A polyvalent epoxy resin having an average of two or more epoxy groups.
(B) A linear divalent phenol resin which is a reaction product of a linear epoxy resin (ii) having both terminal epoxy groups and a divalent phenol compound (b).

Moreover, this invention is a method of manufacturing the epoxy resin composition for semiconductor sealing containing the following (C) component in addition to the said (A) component and (B) component, Comprising: On the side of the said (B) component A second gist is a method for producing an epoxy resin composition for semiconductor encapsulation, in which an alcoholic hydroxyl group in the chain is reacted in advance with an alkoxy group in the following component (C).
(C) At least one of alkoxysilane and its partial hydrolyzate.

  And this invention makes a 3rd summary the semiconductor device formed by sealing a semiconductor element using the said epoxy resin composition for semiconductor sealing.

  That is, the present inventors examine the compounding of a new substance or a special compound in order to obtain an epoxy resin composition for semiconductor encapsulation that has low stress after molding and has excellent adhesion. Instead of eagerly studying from a completely different perspective. For example, instead of aiming at compounding a compound having a special molecular structure such as rigidity, research has been conducted starting from the use of conventionally known resin components. As a result, by reacting a linear epoxy resin having both terminal epoxy groups with a dihydric phenol compound, a linear dihydric phenol resin (component B), which is the reactant, is prepared. It has been found that when a polyvalent epoxy resin (component A) is used, an epoxy resin composition for semiconductor encapsulation that achieves the above-mentioned purpose is obtained by moderately suppressing three-dimensional crosslinking, and the present invention has been achieved.

  As described above, the linear divalent phenol resin (component B), which is a reaction product of the linear epoxy resin having both terminal epoxy groups and the dihydric phenol compound, has a long distance between functional groups, and thus has a large amount of cross-linking. A cured product having a molecular weight can be obtained. This is presumably because a coarse network chain network is formed, so that the elastic modulus is lower than that of a conventional cured product of a fine network chain, and stress is reduced even in a high-temperature rubber state. On the other hand, since the linear divalent phenol resin (component B) is a reactant obtained by a reaction between an epoxy group and a phenolic hydroxyl group, the side chain of the component B contains an epoxy group and a phenolic hydroxyl group. Alcoholic hydroxyl groups produced by the reaction are present. The presence of this alcoholic hydroxyl group is considered to enhance the adhesion to the interface. Therefore, the present invention is considered to be excellent in the adhesiveness between the sealing resin and the lead frame because the stress reduction of the cured body is realized at a high soldering temperature and the adhesiveness is enhanced.

  As described above, the present invention is a reactant of a polyvalent epoxy resin (A) having two or more epoxy groups on average and a linear epoxy resin having both terminal epoxy groups and a divalent phenol compound. It is an epoxy resin composition for semiconductor encapsulation containing a linear dihydric phenol resin (B). For this reason, the hardened | cured material after formation has low stress, and comes to be excellent in adhesiveness significantly. In addition, a semiconductor device sealed with such a resin composition is also highly reliable.

  Further, when the component (A) is a bisphenol A type epoxy resin and the component (B) is bisphenol A, the adhesiveness after molding is further improved.

  Furthermore, in addition to the above components (A) and (B), an epoxy resin composition containing at least one of alkoxysilane and its partial hydrolyzate (C), which is an alcohol in the side chain of the above component (B) When the functional hydroxyl group is reacted with the alkoxy group of the component (C), the moisture resistance after molding becomes excellent.

  And when the alkoxysilane of the said (C) component is alkyl trialkoxysilane, dialkyl dialkoxysilane, phenyl trialkoxysilane, diphenyl dialkoxysilane, it comes to be further excellent in the moisture resistance after shaping | molding.

  The epoxy resin composition for semiconductor encapsulation of the present invention (hereinafter referred to as “epoxy resin composition”) comprises, on average, a polyvalent epoxy resin (component A) having two or more epoxy groups, and both terminal epoxy groups. It is obtained by using a linear dihydric phenol resin (component B) which is a reaction product of a linear epoxy resin (component B) and a dihydric phenol compound (component B), and is usually powder It is in the form of a tablet that is tableted or tableted. First, each of these components will be described in detail.

<< Polyvalent epoxy resin (component A) >>
As described above, the polyvalent epoxy resin (component A) refers to an epoxy resin having two or more epoxy groups on average, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin. And various epoxy resins such as a dicyclopentadiene type epoxy resin, a cresol novolac type epoxy resin, and a phenol novolac type epoxy resin. These may be used alone or in combination of two or more. Of these, bisphenol A type epoxy resins and biphenyl type epoxy resins are preferable from the viewpoint of adhesiveness. In particular, it is preferable to use one having a melting point or softening point exceeding room temperature and showing a solid or highly viscous liquid at room temperature. For example, those having an epoxy equivalent of 150 to 350 and a softening point of 50 to 130 ° C. are preferably used.

<< Linear dihydric phenol resin (component B) >>
The linear dihydric phenol resin (B component) used together with the component A functions as a curing agent for the polyvalent epoxy resin (component A), and is a linear epoxy having both terminal epoxy groups. It is a reactant of a resin (I component) and a dihydric phenol compound (B component).

  Examples of the linear epoxy resin (a component) having both terminal epoxy groups include linear epoxy having both terminal epoxy groups such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, and biphenyl type epoxy resin. Resin. Among these, bisphenol A type epoxy resin is preferable from the viewpoint of adhesiveness. These can be used alone or in combination of two or more.

  As these linear epoxy resins (component A), commercially available products can be used, and any linear epoxy resin having both terminal epoxy groups is the same as the above polyvalent epoxy resin (component A). Epoxy resins can also be used.

  On the other hand, examples of the dihydric phenol compound (b) include bisphenol A, hydroquinone, biphenol, bisphenol F, 1,4-hydroxynaphthalene, 1,5-hydroxynaphthalene, 2,6-dihydroxynaphthalene, and the like. . Of these, bisphenol A is preferred from the viewpoint of better adhesion. These may be used alone or in combination of two or more.

  The molecular weight of the dihydric phenol compound (b) is preferably 110 to 300, more preferably 110 to 250. This is because if the molecular weight is too large, the three-dimensional crosslinking of the resulting cured product tends to be suppressed too much, and conversely, if the molecular weight is too small, sufficient adhesiveness tends not to be improved. It is.

  Thus, the said linear dihydric phenol resin (B component) which concerns on this invention is obtained by making the said A component, B component, and another component react as needed. Specifically, the linear epoxy resin (component A): dihydric phenol compound (component B) is preferably 1: 2 to 1:10 in molar ratio, more preferably 1: 5 to 1: 1. 8. In order to react the epoxy group in the component B with the phenolic hydroxyl group in the component B to obtain a linear phenol resin, the reaction is preferably carried out in an excess ratio of the component B over the component A.

  The above reaction is preferably carried out by appropriately blending component A, component B, and, if necessary, a curing accelerator, etc., and melt-kneading in a heated state using a kneader such as a mixing roll machine.

  The unreacted dihydric phenol compound (b component) remaining after the reaction may be removed by a method utilizing a difference in solubility in a solvent or the like, and the A component is left as it is together with the reactant (B component). In this case, the target epoxy equivalent may be obtained in consideration of the number of hydroxyl groups. The latter is preferable from the viewpoint of workability.

  The weight average molecular weight of the linear dihydric phenol resin (component B) of the reactant thus obtained is preferably 500 to 3000, more preferably 1000 to 2000. Moreover, it is preferable that the hydroxyl equivalent of B component is 150-500, More preferably, it is 175-250.

  Moreover, as a suitable combination of the above component B and component B, from the viewpoint of adhesiveness, component A is a bisphenol A type epoxy resin and component B is bisphenol A. As the reactant (component B) obtained from this combination, the following general formula (1) is preferable.

  The linear dihydric phenol resin (component B) obtained by reacting an epoxy resin with a dihydric phenol compound is an alcoholic hydroxyl group originally produced by the reaction of an epoxy group with a hydroxyl group. It is characterized by having a hydroxyl group in the molecule. Due to the presence of this portion, the adhesion to the interface is enhanced. Moreover, this coupling | bond part is flexible and is easy to move when reacting. For this reason, even if the distance between the reactive groups is increased, the reactivity can be increased, and excellent physical properties can be obtained.

  When the linear divalent phenol resin (component B) is used as a curing agent for an epoxy resin, a cured product having a low elastic modulus at a high temperature is obtained. Further, compared to the case where a phenol novolac resin is used as a curing agent, the transparency is improved.

  The blending ratio of the polyvalent epoxy resin (component A) and the linear divalent phenol resin (component B) is the ratio of the number of phenolic hydroxyl groups in the phenol resin to the number of epoxy groups in the epoxy resin (number of phenolic hydroxyl groups / The number of epoxy groups) is preferably distributed so as to be 0.5 to 2.0, and more preferably 0.8 to 1.2.

《Other ingredients》
In addition to the above components A and B, the epoxy resin composition of the present invention contains halogen-based compounds such as alkoxysilane compounds, inorganic fillers, curing accelerators, silane coupling agents, and brominated epoxy resins as necessary. Other additives such as a flame retardant, a flame retardant aid such as antimony trioxide, a pigment such as carbon black, and a surface treatment agent can be appropriately blended.

<Alkoxysilane compound (component C)>
The epoxy resin composition of the present invention uses the above-mentioned linear dihydric phenol resin (component B) as a curing agent for the epoxy resin. Therefore, if there is an alcohol hydroxyl group in the side chain of the component B, Water absorption may increase. In order to avoid this, it is preferable that an alkoxysilane compound (C component) is blended and the alcoholic hydroxyl group of the linear dihydric phenol resin (B component) is reacted in advance with the alkoxy group of the alkoxysilane compound. .

  The alkoxysilane compound (component C) is preferably at least one of alkoxysilane and a partial hydrolyzate thereof. Specific examples include alkoxysilanes such as alkyltrialkoxysilanes, dialkyldialkoxysilanes, phenyltrialkoxysilanes, and diphenyldialkoxysilanes, and partial hydrolysates of these alkoxysilanes. These may be used alone or in combination of two or more. In addition, those having an alkoxy group directly bonded to silicon are preferable, those having 2 or 3 alkoxy groups bonded to silicon are preferable, and those having 3 are particularly preferable. If necessary, tetraalkoxysilane or a partial condensate thereof can be used in combination. By using these together, the glass transition temperature of the cured product can be improved.

  Such an alkoxysilane compound (C component) has an alkoxy group that does not react with the alcoholic hydroxyl group of the side chain of the B component, but this alkoxy group reacts with the inorganic filler, so that the adhesive property is reduced. Can be maintained.

  Among these, from the viewpoint of reactivity with the inorganic filler, the alkyl group of the alkoxy group that does not react with the alcoholic hydroxyl group of the component B may be a methyl group, an ethyl group, a propyl group, or a butyl group having 4 or less carbon atoms. preferable.

  It is preferable to set the compounding quantity of such an alkoxysilane compound (C component) to the ratio of 0.01 to 5 weight% of the whole epoxy resin composition. In particular, 0.03 to 1% by weight is more preferable from the viewpoint of adhesive strength.

<Inorganic filler>
Various conventionally known fillers are used as the inorganic filler used together with the A component and the B component. Examples thereof include quartz glass, talc, silica powder (such as fused silica powder and crystalline silica powder), alumina powder, aluminum nitride powder, and silicon nitride powder. These inorganic fillers can be used in any form such as crushed, spherical, or ground. And these inorganic fillers are used individually or in combination of 2 or more types. Among these, for applications that require high thermal conductivity, it is preferable to use alumina powder or silica powder, and more preferably, crushed crystalline silica powder. From the viewpoint of the fluidity of the resin, those obtained by polishing and removing the corners of the powder and those obtained by spraying crystalline silica into a flame and melting it into a spherical shape (hereinafter referred to as “fused spherical silica powder”) It is preferable to use it. In addition, it is also preferable to use silica powder that has been melted and made amorphous (hereinafter referred to as “fused silica powder”) from the viewpoint of reducing the linear expansion coefficient of the obtained cured product.

  The average particle size of the inorganic filler is preferably in the range of 5 to 30 μm, particularly preferably in the range of 5 to 25 μm. If the average particle size is too small, the fluidity of the resin composition tends to be inferior. Conversely, if the average particle size is too large, clogging at the metal gate portion tends to occur. . Furthermore, the maximum particle size should be 63 μm (250 mesh) or less, and in the case of a small semiconductor package, the molding appearance is excellent and smooth, poor flow due to the trapping of the inorganic filler on the gate part, and between the wires This is particularly preferable because deformation of the wire due to pinching and voids in the wire portion do not occur.

  For the measurement of the average particle size and the maximum particle size of the inorganic filler, for example, an arbitrary measurement sample is taken out from the population, and a commercially available laser particle size distribution measuring apparatus is used.

  And it is preferable to set content of the said inorganic filler in the range of 70 to 95 weight% of the whole epoxy resin composition. That is, if it is less than the above lower limit value, the proportion of the organic component in the epoxy resin composition increases, and there is a tendency that the flame retardant effect of the cured product becomes poor. This is because the fluidity of the resin composition tends to decrease significantly.

<Curing accelerator>
Examples of the curing accelerator include organic phosphorus compounds such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine, imidazole compounds such as 2-methylimidazole and phenylimidazole, and 1,8-diazabicyclo (5.4.0). And tertiary amine compounds such as undecene-7,1,5-diazabicyclo (4.3.0) nonene-5. These may be used alone or in combination of two or more. Of these, imidazole and tertiary amine curing accelerators are preferable from the viewpoint of curability, and organophosphorus curing accelerators are preferably used from the viewpoint of electrical reliability. It is also possible to use an adduct of triphenylphosphine and quinone (particularly p-benzoquinone), an adduct of triphenylphosphine and phenol, or the like that gives latent curing behavior.

  The blending amount of the curing accelerator is preferably set to 0.05 to 1.0% by weight of the entire epoxy resin composition. From the viewpoint of fluidity of the epoxy resin composition, it is particularly preferably 0.1 to 0.3% by weight. That is, if the blending amount is too small, the curing reaction between the target polyvalent epoxy resin (component A) and the linear phenol resin (component B) is difficult to proceed, and it is difficult to obtain the required curability. This is because if the amount is too large, the curing reaction is too fast and the moldability tends to be impaired.

<< Production method of epoxy resin composition >>
The epoxy resin composition of the present invention can be produced, for example, as follows. That is, the A component, the B component, and, if necessary, other additives such as the C component are appropriately mixed according to a conventional method and then mixed. Next, the mixed product is melt-kneaded in a heated state using a mixing roll or an extrusion kneader, and then cooled and solidified at room temperature. Thereafter, the desired epoxy resin composition can be produced by a series of steps of pulverization by known means and tableting as necessary.

  Prior to mixing the A component and the B component, the linear dihydric phenol resin (B component) and at least one of alkoxysilane and a partial hydrolyzate thereof (C component) are melt-mixed in advance, It is more preferable from the viewpoint of moisture resistance to react the alcoholic hydroxyl group in the side chain in the component B with the alkoxy group in the component C in advance. And after mix | blending each remaining component with such a prior mixture, the epoxy resin composition of this invention which improved moisture resistance can be manufactured by manufacturing according to the same manufacturing method as the above.

  The semiconductor element sealing method using such an epoxy resin composition can be performed by a known molding method such as normal transfer molding, for example, and a semiconductor device can be obtained.

  Since the semiconductor device thus obtained is composed of an epoxy resin composition containing an A component and a B component, it becomes a semiconductor package with low stress and greatly excellent adhesion, and has high reliability.

  Examples of the obtained semiconductor device include semiconductor devices such as IC and LSI.

  Next, examples will be described together with comparative examples. However, the present invention is not limited to these examples.

  First, prior to the examples and comparative examples, the following components were prepared.

[Epoxy resin a1 (component A)]
Bisphenol A epoxy resin (epoxy equivalent 470, softening point 64 ° C)

[Epoxy resin a2 (component A)]
Biphenyl type epoxy resin (epoxy equivalent 193, melting point 105 ° C)

[Epoxy resin a3 (component A)]
Dicyclopentadiene type epoxy resin (epoxy equivalent 280, softening point 80 ° C)

[Phenolic resin b1 (component B)]
470 g of bisphenol A type epoxy resin (epoxy equivalent 470, softening point 64 ° C.) is prepared as a linear epoxy resin (component B) having both terminal epoxy groups, and bisphenol A (b) 912 g of molecular weight 228, hydroxyl group equivalent 114, melting point 152 ° C.) is prepared. Then, 0.03% by weight of dimethylbenzylamine is added to and mixed with the component (a) and component (b) (molar ratio 1: 8), and then heated at 125 ° C. for 3 hours. A dihydric phenol resin (component b1) (phenolic hydroxyl group equivalent 190) is used.

[Phenolic resin b2 (component B)]
800 g of the phenol resin (component b1) and 200 g of an alkoxysilane compound (component C) [(poly) methyltrimethoxysilane / manufactured by Tama Chemical Industry / MTMS-A] are prepared. Then, 0.5 g of dibutyltin dilaurate was added thereto, and the mixture was melt-mixed for 16 hours at 100 ° C. under nitrogen, followed by demethanol, whereby a phenol resin (b2 component) in which the alkoxysilane compound was grafted to the side chain (phenolic hydroxyl group equivalent) 200) is obtained.

[Phenolic resin b3 (for comparative example)]
Phenol novolac resin (hydroxyl equivalent 105, softening point 85 ° C.).

[Phenolic resin b4 (for comparative example)]
Phenol aralkyl resin (hydroxyl equivalent 170, softening point 62 ° C.).

[Divalent phenol compound b5 (for comparative example)]
Biphenol A (molecular weight 228, hydroxyl group equivalent 114) similar to the dihydric phenol compound (b) used for the preparation of the b1 component is used as a curing agent component for the comparative example.

[Inorganic filler]
Fused spherical silica with an average particle size of 20 μm.

[Curing accelerator]
Triphenylphosphine.

[Pigment]
Carbon black with an average particle size of 25 nm.

[Examples 1 to 4, Comparative Examples 1 to 7]
The components shown in Tables 1 to 3 below were blended in the proportions shown in the same table, and melted and kneaded for 3 minutes in a roll kneader heated to about 100 ° C. to prepare a melt. Next, this melt was cooled and solidified and then pulverized, and further tableted at 20 ° C. to obtain target epoxy resin compositions for Examples and Comparative Examples.

  Each epoxy resin composition thus obtained was used for measurement and evaluation according to the following test method. These results are shown in Table 2 below. Moreover, these evaluations accompanying the results are also shown in Table 2.

[Frame adhesion and low stress]
The epoxy resin composition formed in a truncated cone shape having a bottom area of 10 mm ² (diameter: 3.6 mm) and a height of about 5 mm is placed on a Ni-plated copper frame plate, heated at 175 ° C. for 2 minutes, and heated. A molded product was produced by transfer molding. This was held in an atmosphere at 175 ° C. for 5 hours to prepare a test piece. Next, as shown in FIG. 1, the cured body 2 of the epoxy resin composition adhered to the Ni-plated copper frame plate 1 is fitted into the sample fixing jig 3, and a tester (Autograph, manufactured by Shimadzu Corporation) is used. The chuck 4 extending from the load cell pinched the end of the Ni-plated copper frame plate 1 and pulled the frame in the direction parallel to the frame surface. And the hardening body 2 of a truncated cone measures the maximum force at the time of peeling from the Ni plating copper frame board 1, and the measured value (adhesion force value) (MPa) is made into the evaluation object of flame | frame adhesiveness and low-stress property. did.

  From the above results, in Examples 1 and 4 and Comparative Examples 1 and 2 that are bisphenol A epoxy resin systems, the adhesive strength of Examples 1 and 4 is greatly improved compared to Comparative Examples 1 and 2. I understand. Moreover, in Example 2 which is a biphenyl type epoxy resin system, and Comparative Examples 3 and 4, it turns out that the adhesive force of Example 2 is greatly improved compared with Comparative Examples 3 and 4. Furthermore, in Example 3 and Comparative Examples 5 and 6 that are dicyclopentadiene type epoxy resin systems, it can be seen that Example 3 has a significantly improved adhesive force compared to Comparative Examples 5 and 6.

  Moreover, the comparative example 7 uses the component of the reactant (component b1), the component B, and the component B used in Example 1 as an epoxy resin and its curing agent, respectively. That is, Comparative Example 7 is substantially the same as the component material prepared in Example 1, except that a reactant of component A and component B is not prepared in advance. When this Comparative Example 7 and Example 1 were compared, Example 1 showed a significant improvement in adhesion. This is presumably because Example 1 obtained a cured product having a large cross-linking molecular weight as compared with Comparative Example 7 and the stress was reduced.

  From the above, all the products of the examples are of the same epoxy resin type and pass through a soldering temperature as high as 260 ° C. as compared with the epoxy resin composition not using the phenol resin (component B) according to the present invention. It can be seen that the frame adhesion and the low stress are greatly improved even after the test. This is considered to be because the adhesiveness was improved because the alcoholic hydroxyl group was present in the side chain of the phenol resin (component B) according to the present invention, and the stress was reduced because the crosslinking density was slightly reduced. . Therefore, also in the semiconductor device obtained from the epoxy resin composition of the example product, exfoliation of the sealing resin portion does not occur, and an excellent reliability can be obtained.

  And, as a result of measuring the increase rate (wt%) of the cured product after 169 hours under 85 ° C./85% RH, Example 4 using the alkoxysilane-modified B component as a curing agent for the epoxy resin, It was found that the rate of increase was lower than that of the other examples and comparative examples, and the moisture resistance was improved. In addition, even when the alkoxysilane compound used in b2 was replaced with alkyltrialkoxysilane, dialkyldialkoxysilane, phenyltrialkoxysilane, or diphenyldialkoxysilane, the moisture resistance was similarly improved.

It is explanatory drawing which shows the test method of copper frame adhesiveness.

Explanation of symbols

1 Ni-plated copper frame plate 2 Cured body of epoxy resin composition 3 Sample fixing jig 4 Chuck

Claims (6)

The epoxy resin composition for semiconductor sealing characterized by containing the following (A) and (B) component.
(A) A polyvalent epoxy resin having an average of two or more epoxy groups.
(B) A linear divalent phenol resin which is a reaction product of a linear epoxy resin (ii) having both terminal epoxy groups and a divalent phenol compound (b).   The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the component (a) is a bisphenol A type epoxy resin and the component (b) is bisphenol A. In addition to the components (A) and (B), a resin composition for semiconductor encapsulation containing the following component (C), wherein the alcoholic hydroxyl group in the side chain of the component (B) is the following (C) The epoxy resin composition for semiconductor encapsulation according to claim 1 or 2, which is reacted with an alkoxy group as a component.
(C) At least one of alkoxysilane and its partial hydrolyzate.   The epoxy resin composition for semiconductor encapsulation according to claim 3, wherein the alkoxysilane as the component (C) is alkyltrialkoxysilane, dialkyldialkoxysilane, phenyltrialkoxysilane, or diphenyl dialkoxysilane.   It is a method of manufacturing the epoxy resin composition for semiconductor sealing of Claim 3 or 4, Comprising: The alcoholic hydroxyl group in the side chain of the said (B) component, and the alkoxy group in the said (C) component The manufacturing method of the epoxy resin composition for semiconductor sealing characterized by making it react beforehand.   A semiconductor device, wherein a semiconductor element is sealed using the epoxy resin composition for sealing a semiconductor according to any one of claims 1 to 4.

Images