JP2010010909A - Solid-state imaging device, and electronic apparatus equipped therewith - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid-state imaging device preventing intrusion of dust and foreign matter onto a translucent member, and reducing imaging failures. <P>SOLUTION: A camera module 100 includes: a lens unit 2 including a lens 21, a lens barrel 22 holding the lens, and a lens holder 23 holding the lens barrel; and a sensor cover 3a covering a wiring board, a solid-state imaging element mounted on the wiring board, and a light reception part of the solid-state imaging element, formed with an opening to arrange a translucent member 13 having a space between the light reception part and itself, and surrounding the whole circumference of the translucent member 13. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a solid-state imaging device capable of preventing dust and foreign matter from entering a translucent member and reducing imaging defects, and an electronic apparatus including the solid-state imaging device.

  Various electronic devices such as a mobile phone with a camera and a portable information terminal include a camera module (solid-state imaging device). In recent years, in order to cope with the miniaturization of camera modules, the manufacturing process has been miniaturized. As the camera module is further miniaturized, imaging defects occur due to minute dust existing on the optical path. The imaging failure is, for example, that the shadow of dust on the optical path appears on the imaging screen as a black spot or a spot.

  Patent Document 1 discloses a camera module in which countermeasures against dust that cause such imaging defects are taken. FIG. 7 is a cross-sectional view of the camera module of Patent Document 1.

As shown in FIG. 7, in the camera module 200, a protruding dam material 213 </ b> A is formed around the IR cut filter 213 provided between the solid-state imaging device 212 and the lens 221. The dam material 213A prevents dust generated by contact between the lens holder 223 and the lens barrel 222 from moving onto the IR cut filter 213 when the lens barrel 222 is assembled into the lens holder 233. Yes.
JP 2007-60288 A (published March 8, 2007)

  However, the configuration of Patent Document 1 still has a problem in that imaging failure still tends to occur because measures against dust entering the IR cut filter 213 are insufficient.

  Specifically, in Patent Document 1, the IR cut filter 213 is fixed to the opening of the base 214. However, there is only a small space between the base 214 and the lens barrel 222. For this reason, it is not possible to form a sufficient dam material 214A to reliably prevent dust from entering the IR cut filter 213. As a result, dust easily enters the IR cut filter 213, and imaging failure tends to occur.

  Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide a solid-state imaging device capable of preventing dust and foreign matter from entering the translucent member and reducing imaging defects. An object of the present invention is to provide an electronic device including a solid-state imaging device.

In order to solve the above problems, a solid-state imaging device of the present invention includes a lens, a lens holder that holds the lens, and a lens unit that holds the lens holder, and forms a subject image.
A wiring board, a solid-state imaging device mounted on the wiring board, and a light-transmitting member that covers the light-receiving portion of the solid-state imaging device and is spaced from the light-receiving portion. Is a solid-state imaging device including an imaging unit sealed on a wiring board with a sealing resin,
A sensor cover is further provided on the sealing resin.
The sensor cover is characterized in that an opening is formed so that the translucent member is disposed therein and surrounds the entire periphery of the translucent member.

  In the solid-state imaging device of the present invention, dust is generated due to the contact between the lens barrel and the lens holder, or the foreign matter moves through the gap between the lens barrel and the lens holder and falls on the sealing resin. Then, the dust and foreign matter may move on the sealing resin and adhere to the translucent member. As a result, dust and foreign matters adhering to the translucent member block the optical path, resulting in imaging failure. In the solid-state imaging device according to the present invention, since the translucent member and the solid-state imaging device are arranged close to each other, such an imaging failure is particularly likely to occur.

  According to the above configuration, the sensor cover formed on the sealing resin surrounds the entire periphery of the translucent member. For this reason, even if dust or foreign matter falls on the sealing resin and moves on the sealing resin, the sensor cover can prevent the dust or foreign matter from entering the translucent member. Accordingly, it is possible to reduce imaging defects caused by dust and foreign matters adhering to the translucent member.

  Moreover, according to said structure, since the translucent member is provided on the solid-state image sensor 12, a comparatively wide space is formed between a translucent member and a lens unit. And the sensor cover is provided on sealing resin using this space. For this reason, the sensor cover can reliably prevent entry of dust and foreign matter onto the translucent member.

  Note that an opening is formed in the sensor cover, and a translucent member is disposed in the opening. For this reason, the optical path is secured.

  In the solid-state imaging device of the present invention, it is preferable that the side surface of the sensor cover extends parallel to the optical axis.

  According to said structure, since the side surface of a sensor cover is extended in parallel with respect to an optical axis, the wall part which stands perpendicularly with respect to an optical axis is formed in the circumference | surroundings of a translucent member. Therefore, it is possible to reliably prevent the entry of dust and foreign matter onto the translucent member by the wall portion.

In the solid-state imaging device of the present invention, the top surface of the sensor cover is flat,
It is preferable that the top surface of the sensor cover is disposed immediately below the contact portion between the lens barrel and the lens holder.

  According to said structure, the top | upper surface of a sensor cover is arrange | positioned directly under the contact part of a lens barrel and a lens holder. As a result, dust generated due to contact between the lens barrel and the lens holder and foreign matter moved through the gap between the lens barrel and the lens holder fall on the top surface of the sensor cover. In addition, since the top surface of the sensor cover is flat, dust and foreign matters that have dropped on the top surface can be held on the top surface. Accordingly, it is possible to reliably prevent dust and foreign matter from entering the translucent member.

  In the solid-state imaging device of the present invention, the side surface of the sensor cover is preferably inclined so as to approach the optical axis as it goes from the sealing resin toward the lens.

  According to the above configuration, the side surface of the sensor cover is inclined with respect to the optical axis. Specifically, according to the light traveling direction, the side surface of the sensor cover is inclined so as to be separated from the optical axis. Thereby, a weight-like wall part is formed around the translucent member. Accordingly, it is possible to reliably prevent dust and foreign matter from entering the translucent member.

  In the solid-state imaging device of the present invention, it is preferable that at least a part of the side surface of the sensor cover is disposed inside the contact portion between the lens barrel and the lens holder.

  According to said structure, the wall part inclined with respect to the optical axis is formed in the circumference | surroundings of a translucent member by the side surface of a sensor cover. For this reason, the dust and foreign matter that have dropped onto the side surface of the sensor cover move along the side surface. Thereby, dust and foreign substances can be excluded outside the translucent member (outside the sealing resin). Accordingly, it is possible to reliably prevent dust and foreign matter from entering the translucent member.

  In the solid-state imaging device of the present invention, the sensor cover preferably has a light shielding property.

  According to said structure, the sensor cover is comprised from the material which has light-shielding property. As a result, light that is unnecessary for imaging that enters the solid-state imaging device through the translucent member from the gap between the lens barrel and the lens holder can be blocked by the sensor cover.

  In the solid-state imaging device of the present invention, it is preferable that an adhesive material is applied to the surface of the sensor cover.

  According to the above invention, the adhesive material is applied to the surface of the sensor cover. Thereby, the dust which fell on the sensor cover can be made to adhere to an adhesive material. For this reason, dust can be reliably collected in the sensor cover. Therefore, imaging defects due to dust can be prevented for a long time.

  In order to solve the above-described problems, an electronic apparatus according to the present invention includes any one of the solid-state imaging devices. Therefore, it is possible to provide an electronic device that can prevent dust from entering the optical path and reduce imaging defects.

  As described above, the solid-state imaging device of the present invention has a configuration in which an opening is formed so that the translucent member is disposed therein, and the sensor cover that surrounds the entire periphery of the translucent member. . Thereby, it can prevent that a dust and a foreign material penetrate | invade on a translucent member with a sensor cover. Therefore, there is an effect that it is possible to reduce imaging defects caused by dust and foreign matters adhering to the translucent member.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  The solid-state imaging device of the present invention is characterized by reducing imaging defects caused by the dust by preventing the dust from falling on the translucent member.

  The solid-state imaging device of the present invention is suitable for electronic devices capable of photographing such as a mobile phone with a camera, a digital still camera, and a security camera. In this embodiment, a camera module applied to a camera-equipped mobile phone will be described.

[Embodiment 1]
FIG. 1 is a cross-sectional view of the camera module 100 of the first embodiment. As shown in FIG. 1, the camera module 100 has a configuration in which a lens unit 2 and a sensor cover 3 are mounted on an imaging unit 1.

  Specifically, the imaging unit 1 includes a wiring board 11, a solid-state imaging device 12, a translucent member 13, a wire 14, and a sealing resin 15. The solid-state image sensor 12 is mounted on the wiring board 112. The wiring board 11 and the solid-state imaging element 12 are electrically connected to each other by a wire 14.

  More specifically, the wiring substrate 11 is a substrate that takes out an electrical signal of the solid-state imaging device 12 and has a patterned wiring (not shown). The wiring board 11 is electrically connected to the solid-state imaging device 12 through this wiring. Specifically, in the present embodiment, the wiring board 11 and the solid-state imaging device 12 are connected by a wire 14. Thereby, the wiring board 11 and the solid-state image sensor 12 can send and receive electrical signals to each other. The wiring board 11 is, for example, a printed board, a glass epoxy board, or a ceramic board. The wiring board 11 can be electrically connected to an external device.

  The solid-state imaging device 12 is disposed in the center of the wiring substrate 11 and is a semiconductor substrate (for example, a silicon single crystal substrate) on which a semiconductor circuit is formed formed in a rectangular shape in plan view. The solid-state imaging device 12 is, for example, a CCD (charge-coupled device) image sensor, a CMOS (complementary metal-oxide semiconductor) image sensor, or a VMIS image sensor (Threshold Voltage Modulation Image Sensor). The solid-state image sensor 12 converts a subject image formed by the lens unit 2 into an electric signal. In other words, it is a sensor device that photoelectrically converts incident light incident from the lens unit 2.

  On the surface (upper surface) of the solid-state imaging device 12, a light receiving unit (not shown) in which a plurality of pixels are arranged in a matrix is formed. This light receiving portion is an effective pixel region (imaging surface) in the solid-state imaging device 12. The solid-state imaging device 12 converts the subject image (light transmitted through the translucent member 13) formed on the light receiving unit into an electrical signal and outputs the signal as an analog image signal.

  The translucent member 13 is provided on the solid-state image sensor 12. Specifically, the translucent member 13 covers the light receiving part of the solid-state imaging device 12 and is provided with a space between the light receiving part. The translucent member 13 is composed of a translucent member such as translucent glass or resin. The translucent member 13 may be formed with an optical filter such as an infrared cut filter that cuts infrared rays incident on the solid-state imaging device 12. Thereby, the translucent member 13 comes to have a function of blocking infrared rays from the outside.

  The translucent member 13 is bonded onto the solid-state image sensor 12 by an adhesive portion (not shown) formed around the light-receiving section of the solid-state image sensor 12. The translucent member 13 is provided so as to form a gap (gap / gap) between the light receiving portion. For this reason, the solid-state image sensor 12 and the translucent member 13 do not contact each other. Since the bonding portion is formed over the entire periphery of the light receiving portion, this interval is substantially a sealed space. Note that the adhesive portion is formed by patterning, for example, by attaching a sheet-like adhesive and performing a process such as exposure and development with a photolithography technique. If the photolithography technique is used, the bonding portion can be patterned with high accuracy. Moreover, if a sheet-like adhesive is used, the thickness of the bonded portion can be made uniform. Thereby, the translucent member 13 can be adhered to the light receiving portion with high accuracy.

  In the camera module 100 of the present embodiment, the solid-state imaging device 12 is made of mold resin (sealing resin) 15. Sealed on the wiring substrate 11. The mold resin 15 also seals the wire 14. That is, the camera module 100 has a so-called CSP (Chip Scale Package) structure. For this reason, the camera module 100 has a configuration suitable for miniaturization and thinning.

  The encapsulation with the mold resin 15 is performed on a region other than the light transmission region of the camera module 100. Therefore, the surface of the translucent member 13 is not covered with the mold resin 15. For this reason, the optical path from the translucent member 13 to the solid-state image sensor 12 is ensured.

  Although not illustrated, various electronic components (not shown) for driving the camera module 100 may be mounted on the wiring board 11. For example, an amplification circuit unit (analog signal circuit unit) that amplifies the electrical signal converted by the light receiving element of the solid-state imaging device 12 and outputs the electrical signal as an analog signal, and analog / analog that converts the analog signal into a digital signal. An electronic component such as a digital conversion processing circuit unit, a CPU that performs various arithmetic processes in accordance with a program, a ROM that stores the program, and a RAM that stores data of each process, and the like. By these, the entire camera module 100 is controlled.

  The lens unit 2 is a photographing optical system that forms a subject image. That is, the lens unit 2 is an optical system for forming an image of light from the subject on the solid-state imaging device 12. The lens unit 2 includes a lens 21, a lens barrel (barrel) 22 that holds the lens 21 in the center, and a lens holder 23 that holds the lens barrel 22 inside. The lens barrel 22 and the lens holder 23 are both hollow cylindrical members. The lens holder 23 is fixed on the sealing resin 15 with an adhesive (not shown).

  Further, the contact surfaces of the lens barrel 22 and the lens holder 23 have a screw structure. That is, the outer surface of the lens barrel 22 and the inner surface of the lens holder 23 are each threaded. Thereby, the lens barrel 22 can be moved in the optical axis direction along the outer surface of the lens holder 23. That is, the lens barrel 22 can be rotated to focus.

  The lens 21, the lens barrel 22, and the lens holder 23 can all be made of resin, for example. The optical axis of the lens 21 coincides with the central axes of the lens barrel 22 and the lens holder 23.

  The sensor cover 3 a is for preventing dust and foreign matter from entering the translucent member 13. The sensor cover 3 a is fixed on the mold resin 15 and is accommodated in the lens holder 23. The sensor cover 3a will be described later.

  Such a camera module 100 takes in external light taken in through the lens unit 2 into the solid-state image pickup device 12 through the translucent member 13 and is arranged in the light receiving portion of the solid-state image pickup device 12. An image is received by the received light receiving element.

  Here, the characteristic part of the camera module 100 will be described. In the camera module 100, dust may be generated due to contact between the lens barrel 22 and the lens holder 23, or foreign matter may move through the gap between the lens barrel 22 and the lens holder 23 and drop onto the translucent member 13. . If dust or foreign matter is present on the translucent member 13, the shadows are projected on a black dot or an imaging screen. Thereby, imaging failure occurs.

  Specifically, when the camera module 100 is assembled, it is necessary to adjust the position of the lens 21 by moving the lens barrel 22 up and down in order to focus. However, when the lens barrel 22 is moved, fine dust may be generated due to friction between the lens barrel 22 and the lens holder 23. Further, there is a case where a foreign substance moves through a gap between the lens barrel 22 and the lens holder 23. There is a possibility that such dust and foreign matter adhere to the translucent member 13. The dust and foreign matters adhering to the translucent member 13 cast a shadow on the solid-state imaging device 12 and appear as black dots or spots on the output image, resulting in a decrease in yield and reliability of the camera module 100. Leads to. Thus, dust on the translucent member 13 causes imaging failure.

  Therefore, the camera module 100 includes a sensor cover 3a on the mold resin 15 as a countermeasure against imaging defects. The sensor cover 3a prevents dust and foreign matter from entering the translucent member 13.

  FIG. 2 is a perspective view of the imaging unit 1 and the sensor cover 3a of FIG. As shown in FIG. 2, the sensor cover 3a has an opening 30 at the center. The translucent member 13 is disposed in the opening 30. That is, the entire periphery of the translucent member 13 is surrounded by the sensor cover 3a.

  For this reason, even if dust or foreign matter falls on the mold resin 15 and moves on the mold resin 15, the sensor cover 3 a can prevent the dust or foreign matter from entering the translucent member 13. Accordingly, it is possible to reduce imaging defects caused by dust and foreign matters adhering to the translucent member 13.

  Moreover, as shown in FIG. 2, the side surface of the sensor cover 3a extends in parallel to the optical axis indicated by the alternate long and short dash line in the figure. For this reason, a wall (side wall) is formed around the translucent member 13 by the side surface of the sensor cover 3a. Therefore, the side surface of the sensor cover 3a can reliably prevent entry of dust and foreign matters onto the translucent member 13.

  Furthermore, as shown in FIG. 2, the top surface 31 of the sensor cover 3a is flat. In addition, as shown in FIG. 1, the top surface 31 is disposed immediately below the contact portion between the lens barrel 22 and the lens holder 23. Thereby, the dust generated by the contact between the lens barrel 22 and the lens holder 23 and the foreign matter moved through the gap between the lens barrel 22 and the lens holder 23 fall on the flat top surface 31 of the sensor cover 3a. For this reason, dust and foreign matters that have fallen on the top surface 31 can be held on the top surface 31. Therefore, it is possible to reliably prevent dust and foreign matter from entering the translucent member 13.

  Further, the sensor cover 3 a of FIG. 2 has a bottom 33 extending outward from the side surface 32. That is, the sensor cover 3a has a flange structure. Thereby, the area of the bottom face of the sensor cover 3a can be increased. Therefore, the sensor cover 3a can be securely fixed onto the mold resin 15.

  In the camera module 100, as shown in FIG. 1, the translucent member 13 is provided on the solid-state imaging device 12, and therefore, between the translucent member 13 and the lens unit 2 (lens barrel 22). A relatively wide space is formed. And the sensor cover 3a is provided on the mold resin 15 using this space. For this reason, the sensor cover 3a can reliably prevent entry of dust and foreign matter onto the translucent member 13.

  The shape of the sensor cover 3a is not limited to the shape shown in FIG. 2, and may be configured as follows, for example. FIG. 3 is a cross-sectional view of the camera module 101 provided with another sensor cover 3b. FIG. 4 is a perspective view showing the imaging unit 1 and the sensor cover 3b in the camera module 101 of FIG. FIG. 5 is a cross-sectional view of the camera module 102 provided with another sensor cover 3b. FIG. 6 is a perspective view showing the imaging unit 1 and the sensor cover 3b in the camera module 101 of FIG.

  As shown in FIG. 3, in the camera module 101 as well, the sensor cover 3b is provided on the imaging unit 1 (on the mold resin 15) in the same manner as the sensor cover 3a. However, the side surface of the sensor cover 3b is inclined with respect to the optical axis indicated by the alternate long and short dash line.

  Specifically, as shown in FIG. 4, the side surface 32 of the sensor cover 3 b is inclined so as to approach the optical axis from the mold resin 15 toward the lens 21. Specifically, according to the traveling direction of light, the side surface 32 of the sensor cover 3b is inclined so as to be separated from the optical axis. Since the opening 30 formed in the sensor cover 3b is circular, the sensor cover 3b has a truncated cone shape. Thereby, a weight-like wall portion is formed around the translucent member 13 by the side surface 32 of the sensor cover 3b. Therefore, it is possible to reliably prevent dust and foreign matter from entering the translucent member 13.

  Moreover, in the sensor cover 3 b, at least a part of the side surface 32 is disposed inside the contact portion between the lens barrel 22 and the lens holder 23. That is, the side surface 32 is disposed immediately below the contact portion between the lens barrel 22 and the lens holder 23. Accordingly, a wall portion inclined with respect to the optical axis is formed around the translucent member 13 by the side surface 32 of the sensor cover 3b. For this reason, the dust and foreign matter that have fallen on the side surface 32 of the sensor cover 3 b move along the side surface 32. Thereby, it is possible to remove dust and foreign matters to the outside of the translucent member 13 (to the outside of the mold resin 15). Therefore, it is possible to reliably prevent dust and foreign matter from entering the translucent member 13.

  Further, as shown in FIG. 5, also in the camera module 102, the sensor cover 3c is provided on the imaging unit 1 (on the mold resin 15), similarly to the sensor cover 3a. However, the inner side surface 34 of the sensor cover 3 c is higher than the top surface 31. For this reason, this inner side surface 34 becomes a wall, and it can prevent that the dust and foreign material which fell to the top | upper surface 31 move to the translucent member 13 by a vibration or an impact. Therefore, it is possible to reliably prevent dust and foreign matter from entering the translucent member 13.

  Such sensor covers 3a to 3c preferably have a light shielding property. Thus, when the sensor covers 3a to 3c are made of a light-shielding material, they are unnecessary for imaging that enters the solid-state imaging device 12 through the translucent member 13 from the gap between the lens barrel and the lens holder. Light can be blocked by the sensor covers 3a to 3c.

  Moreover, the adhesive material which is not shown in figure may be apply | coated to the surface of sensor cover 3a-3c. For example, an adhesive material may be applied to portions of the sensor covers 3a to 3c that hold dust and foreign matter. Thereby, the dust which fell to the sensor covers 3a-3c can be made to adhere to an adhesive material. For this reason, it is possible to reliably collect dust in the sensor covers 3a to 3c. Therefore, imaging defects due to dust can be prevented for a long time.

  Although an adhesive material is not specifically limited, For example, semi-solid (or a state close | similar to solid) fats and oils and resin can be applied. For example, grease is suitable. Grease is a kind of fat and oil that is semi-solid or nearly liquid, and can be composed of, for example, a semi-solid (or nearly solid) or paste-like lubricant. As the grease, for example, a molybdenum disulfide lubricant, a white lubricant, a silicone lubricant, a perfluoropolyether lubricant, or the like can be used. In addition, greases are mineral oil-based greases mainly composed of mineral oil, poly-α-olefin-based greases composed mainly of poly-α-olefin oil, silicone-based greases composed mainly of silicone oil, fluorosilicone-based greases, perfluoro A perfluoropolyether-based grease containing a polyether as a main component can be used. These greases can be used alone or in admixture of two or more. Further, the grease may include an additive for grease such as lithium soap, calcium soap, polytetrafluoroethylene (PTFE), and the like.

  The application amount of the adhesive material is not particularly limited as long as dust can be attached. Moreover, what is necessary is just to set the application quantity of an adhesive material according to the characteristic of an adhesive material. Further, a large amount of adhesive material may be applied to a portion where dust is likely to be generated.

In addition, when grease is used as the adhesive material, the following effects are also obtained.
(A) Grease not only attaches dust, but also can coat (spray) dust attached to the application position before applying grease.
(B) Since grease has fluidity, it easily penetrates into the application position.
(C) Grease has little deterioration in properties (for example, physical properties such as heat resistance and weather resistance).
(D) Non-toxic.
(E) By changing the composition of the grease, it is possible to easily change the properties of the grease (for example, viscosity adjustment).
(F) No maintenance is required.

  The present invention can also be expressed as follows.

[1] An imaging lens, a cylindrical lens barrel, a lens holder, a filter glass (translucent member) that cuts infrared light, an imaging element (solid-state imaging element), and a substrate (wiring board) The imaging lens is held inside the lens barrel, and the lens barrel constitutes a lens unit fitted with the lens holder by a screw structure;
The filter glass is fixed on the image pickup device, the image pickup device is electrically connected to the substrate, and the image pickup device is sealed with a mold resin except for the filter glass portion serving as a light receiving portion thereof. The lens unit has a sensor cover in the solid-state imaging device fixed on the mold resin so as to cover the imaging element, and the sensor cover is fixed on the imaging element. A solid-state imaging device, which is fixed on the mold resin so as to cover the surface.

  According to the above configuration, dust generated from the fitting portion between the lens barrel and the lens barrel holder during focus adjustment falls on the sensor cover. For this reason, the fall of the dust on the filter glass can be prevented.

  [2] The sensor cover has an opening so that the central portion does not block incident light, and a conical side wall with a certain angle is provided downward from the end of the opening toward the outer periphery of the sensor cover. The solid-state imaging device according to [1], wherein the solid-state imaging device has a three-dimensional shape in which a flat portion is provided from the lowermost part of the conical side wall to the outer periphery of the sensor cover.

According to said structure, since the dust which fell on the sensor cover falls to the outer side of an inclination part, the fall on filter glass can be prevented more.
[3] The solid-state imaging device according to the above [2], wherein the opening end of the sensor cover is disposed inside the fitting portion between the lens holder and the lens unit.

  According to said structure, the opening end of a sensor cover exists inside the fitting part of a lens barrel and a lens barrel holder. For this reason, most of the dust falling on the sensor cover falls outside through the inclined portion of the sensor cover. Accordingly, it is possible to further greatly reduce the stain defect due to dust.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  The present invention can be applied to various imaging apparatuses including a solid-state imaging apparatus, such as a camera-equipped mobile phone, a digital still camera, and a security camera such as a monitor or a door phone.

It is sectional drawing of the camera module of this invention. It is a perspective view of the imaging unit and sensor cover in the camera module of FIG. It is sectional drawing of another camera module of this invention. It is. FIG. 4 is a perspective view of an imaging unit and a sensor cover in the camera module of FIG. 3. It is sectional drawing of another camera module of this invention. It is. FIG. 6 is a perspective view of an imaging unit and a sensor cover in the camera module of FIG. 5. It is sectional drawing of the camera module of patent document 1. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Imaging unit 2 Lens unit 3 Sensor cover 3a Sensor cover 3b Sensor cover 3c Sensor cover 11 Wiring board 12 Solid-state image sensor 13 Translucent member 15 Mold resin (sealing resin)
21 Lens 22 Lens barrel 23 Lens holder 30 Opening 31 Top surface 32 Side surface 33 Bottom portion 34 Inner surface 100 Camera module (solid-state imaging device)
101 Camera module (solid-state imaging device)
102 Camera module (solid-state imaging device)

Claims (8)

A lens unit that has a lens, a lens barrel that holds the lens, and a lens holder that holds the lens barrel, and forms a subject image;
A wiring board, a solid-state imaging device mounted on the wiring board, and a light-transmitting member that covers the light-receiving portion of the solid-state imaging device and is spaced from the light-receiving portion. Is a solid-state imaging device including an imaging unit sealed on a wiring board with a sealing resin,
A sensor cover is further provided on the sealing resin.
The sensor cover has an opening formed therein so that the translucent member is disposed, and surrounds the entire periphery of the translucent member.   The solid-state imaging device according to claim 1, wherein a side surface of the sensor cover extends parallel to the optical axis. The top surface of the sensor cover is flat,
The solid-state imaging device according to claim 2, wherein a top surface of the sensor cover is disposed immediately below a contact portion between the lens barrel and the lens holder.   The solid-state imaging device according to claim 1, wherein a side surface of the sensor cover is inclined so as to approach the optical axis as it goes from the sealing resin toward the lens.   5. The solid-state imaging device according to claim 4, wherein at least a part of a side surface of the sensor cover is disposed inside a contact portion between the lens barrel and the lens holder.   The solid-state imaging device according to claim 1, wherein the sensor cover has a light shielding property.   The solid-state imaging device according to claim 1, wherein an adhesive material is applied to a surface of the sensor cover.   The electronic device provided with the solid-state imaging device of any one of Claims 1-7.

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