JP2010010326A - Method of manufacturing printed circuit board - Google Patents

Method of manufacturing printed circuit board Download PDF

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JP2010010326A
JP2010010326A JP2008166878A JP2008166878A JP2010010326A JP 2010010326 A JP2010010326 A JP 2010010326A JP 2008166878 A JP2008166878 A JP 2008166878A JP 2008166878 A JP2008166878 A JP 2008166878A JP 2010010326 A JP2010010326 A JP 2010010326A
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hole
wiring board
printed wiring
filling material
manufacturing
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Masaru Fujiki
勝 藤木
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Elna Co Ltd
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Elna Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed circuit board in which a filler other than solder is used, a heating temperature is suppressed as much as possible, and no damage is caused during cutting processing at a through-hole. <P>SOLUTION: The method of manufacturing the printed circuit board which has a hole bored for the through-hole and also has a through-hole plating layer formed in the hole, and is subjected to outward processing to expose part of the through-hole to have the exposed part as an electrode includes charging a hole filler, which is fused at such a low temperature that the printed circuit board is not damaged and solidified at room temperature, and then performing the outward processing. The hole filler charged in the through-hole may be removed with chemicals after the outward processing or a conductive hole filler may be used as the hole filler charged in the through-hole and used as the electrode as it is after the outward processing. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

本発明は、プリント配線板をスルーホール部分で切断加工するときに銅箔やスルーホールメッキ層に損傷を与えることがなく、加工性を向上せしめるためのプリント配線板の製造方法に関するものである。   The present invention relates to a printed wiring board manufacturing method for improving workability without damaging a copper foil or a through-hole plating layer when a printed wiring board is cut at a through-hole portion.

従来からプリント配線板の基材の両面に銅箔を貼着したプリント配線板にスルーホール用の穴を穿設し、このスルーホール用穴にスルーホールメッキ層を形成した後、スルーホールの一部が側面に露出するように切断して、この露出した部分を側面電極として利用することが行われてきた。
この切断加工には、ルーター等が使用されるが、スルーホールの銅箔やスルーホールメッキ層にめくれ、バリ、剥れなどの損傷が発生するという問題があった。 Conventionally, through-holes have been drilled in a printed wiring board in which copper foil is attached to both sides of the substrate of the printed wiring board, and a through-hole plating layer is formed in the through-hole hole. It has been performed that the portion is cut so as to be exposed on the side surface, and the exposed portion is used as a side electrode.
In this cutting process, a router or the like is used, but there is a problem that the copper foil or the through hole plating layer of the through hole is turned over, and damage such as burrs and peeling occurs.

このような問題点を解決するため、スルーホールに半田を充填して切断するという発明が提案されている（特許文献１）。
この特許文献１に記載されている発明を図４に基づき説明する。
図４（ａ）は、両面に銅箔１１を貼着したプリント配線板の基材１０に、スルーホール用の穴をあけ、この穴にスルーホールメッキ層１４を形成してスルーホール１３とする工程を示している。１２は、ランドである。
図４（ｂ）は、上記スルーホール１３に半田レベラー処理により半田１５を充填した工程を示している。
図４（ｃ）は、半田１５を充填したまま切断線１６に沿ってルーター等でスルーホール１３の一部が側面に露出するように切断している工程を示している。
図４（ｄ）は、プリント配線板１８を所定の大きさに切断し、実装部品１７を搭載することで、スルーホール１３の半田１５の露出した部分を側面電極として形成する工程を示している。
図４（ｅ）は、スルーホール１３の一部が側面に露出するように切断した状態を示す斜視図である。
特開平６−２９６０７６号公報。 In order to solve such a problem, an invention has been proposed in which a through hole is filled with solder and cut (Patent Document 1).
The invention described in Patent Document 1 will be described with reference to FIG.
FIG. 4A shows a through hole 13 in which a through hole is formed in a substrate 10 of a printed wiring board having a copper foil 11 bonded on both sides, and a through hole plating layer 14 is formed in the hole. The process is shown. 12 is a land.
FIG. 4B shows a process in which the through hole 13 is filled with the solder 15 by a solder leveler process.
FIG. 4C shows a process of cutting along the cutting line 16 so that a part of the through hole 13 is exposed on the side surface along the cutting line 16 while being filled with the solder 15.
FIG. 4D shows a process of forming the exposed portion of the solder 15 of the through hole 13 as a side electrode by cutting the printed wiring board 18 into a predetermined size and mounting the mounting component 17. .
FIG. 4E is a perspective view showing a state in which a part of the through hole 13 is cut so as to be exposed on the side surface.
Japanese Patent Application Laid-Open No. 6-296076.

特許文献１に示されたプリント配線板の製造方法によれば、スルーホール１３の部分の銅箔１１やスルーホールメッキ層１４にめくれ、バリ、剥れなどの損傷が生じにくいという効果を有している。しかし、次のような問題点を有していた。
（１）スルーホール１３に半田１５を充填するには、半田用リフロー炉に入れて半田が溶ける温度まで加熱しなければならず、プリント配線板の基材１０に熱負荷がかかり、プリント配線板の基材１０のたわみ、変形が生じる。特に最近の電子機器の超小型化に伴い、プリント配線板の基材１０の厚さは、０．８〜０．０４ｍｍと極めて薄いので、たわみ、変形は、極力抑制されなければならない。
（２）半田は、有鉛でも２００℃に近い温度で加熱しなければならないところ、最近の半田は、環境保護のため鉛フリーのものが使用されるようになってきており、この種の半田は、３００℃前後に加熱しなければならない。そのため、プリント配線板の基材１０のストレスが大きくなったり、断線したりする恐れがある。
（３）最近では、半田レベラーの使用率が減少しつつあり水溶性プリフラックスを使用するなど、他の方法での前処理を行うことが多いことから、半田を充填する方法に代わるものが望まれている。 According to the method for manufacturing a printed wiring board disclosed in Patent Document 1, the copper foil 11 and the through-hole plating layer 14 in the through-hole 13 are turned over to prevent damage such as burr and peeling. ing. However, it has the following problems.
(1) In order to fill the through hole 13 with the solder 15, it must be put in a solder reflow furnace and heated to a temperature at which the solder melts, a thermal load is applied to the substrate 10 of the printed wiring board, and the printed wiring board The substrate 10 is bent and deformed. In particular, along with the recent miniaturization of electronic devices, the thickness of the substrate 10 of the printed wiring board is as extremely thin as 0.8 to 0.04 mm. Therefore, bending and deformation must be suppressed as much as possible.
(2) Even if the solder is leaded, it must be heated at a temperature close to 200 ° C. Recently, lead-free solder is used for environmental protection, and this kind of solder is used. Must be heated to around 300 ° C. Therefore, there is a possibility that the stress of the substrate 10 of the printed wiring board is increased or the wire is disconnected.
(3) Recently, since the usage rate of solder levelers is decreasing and water-soluble preflux is often used, pretreatment with other methods is often performed, so an alternative to the solder filling method is desired. It is rare.

本発明は、半田以外の充填材を使用し、加熱温度を極力抑え、スルーホールでの切断加工時に損傷を与えることのないプリント配線板の製造方法を提供することを目的とする。   An object of the present invention is to provide a method of manufacturing a printed wiring board that uses a filler other than solder, suppresses the heating temperature as much as possible, and does not cause damage during cutting through a through hole.

本発明は、プリント配線板にスルーホール用の穴をあけ、この穴にスルーホールメッキ層を形成した後、スルーホールの一部が露出するように外形加工を施してこの露出した部分を電極とするようにしたプリント配線板の製造方法において、
前記プリント配線板に損傷を与えない低い温度で溶融し、常温で固形化する穴埋め材をスルーホールに充填した後、前記外形加工を施すようにしたことを特徴とする。
スルーホールに充填した穴埋め材は、外形加工後に薬液で除去してもよいし、スルーホールに充填した穴埋め材は、導電性を有するものを使用して、外形加工後にそのまま電極とすることもできる。 In the present invention, a hole for a through hole is formed in a printed wiring board, a through hole plating layer is formed in the hole, and then an outer shape process is performed so that a part of the through hole is exposed. In the method for manufacturing a printed wiring board,
The outer shape processing is performed after filling a through hole with a hole filling material that melts at a low temperature that does not damage the printed wiring board and solidifies at room temperature.
The filling material filled in the through hole may be removed with a chemical solution after the outer shape processing, or the filling material filled in the through hole may be used as an electrode after the outer shape processing by using a conductive material. .

本発明は、以上のように構成したので、以下の効果を有する。
（１）プリント配線板に損傷を与えない低い温度で穴埋め材を溶融し、常温で固形化する穴埋め材をスルーホールに充填した後前記外形加工を施すようにしたので、プリント配線板の基材に熱負荷がかかることがなく、プリント配線板の基材のたわみ、変形が生じない。従って、特に最近の電子機器の超小型化に対応できる。
（２）半田レベラーがなくても穴埋め材をスルーホールに充填できる。
（３）スルーホールに充填した穴埋め材は、導電性を有するものを使用すれば、外形加工後にそのまま電極とすることができる。
（４）従来の切断加工後の検査は、全数を顕微鏡で検査することを要していたが、本発明では、穴埋め材を充填して加工することで損傷が少なくなり、検査が容易になる。
（５）プリント配線板の生産性を重視した加工条件の設定が可能になる。 Since this invention was comprised as mentioned above, it has the following effects.
(1) Since the hole filling material is melted at a low temperature that does not damage the printed wiring board and the through hole is filled with the hole filling material that is solidified at room temperature, the outer shape processing is performed. No heat load is applied to the substrate, and the substrate of the printed wiring board is not bent or deformed. Therefore, it is possible to cope with the recent miniaturization of electronic devices.
(2) The hole filling material can be filled into the through hole without a solder leveler.
(3) If the hole filling material filled in the through hole is conductive, it can be used as an electrode after the outer shape processing.
(4) The conventional inspection after cutting processing required inspection of all of them with a microscope, but in the present invention, filling with a hole filling material reduces the damage and facilitates inspection. .
(5) It is possible to set processing conditions that emphasize printed wiring board productivity.

第１工程（ａ）
プリント配線板の基材１０の両面に銅箔１１を貼着した両面銅張積層板２１が用意される。この銅張積層板２１は、単層のものであってもよいし、内層パターンを作成した多層のものであってもよい。
第２工程（ｂ）
スルーホール１３を形成する箇所に穴あけ加工が施される。
第３工程（ｃ）
穴あけ加工した銅張積層板２１は、銅メッキが施される。
第４工程（ｄ）
この工程では、外層パターン（回路）が形成される。
第５工程（ｅ）
この工程では、ソルダレジスト１９を塗布してマーキング形成をする。
第６工程（ｆ）
この工程では、スルーホール１３の部分と前記工程でマーキングされなかった部分に穴埋め材２０で穴埋めを行なう。この穴埋め材２０は、熱負荷によりプリント配線板の基材１０にたわみ、変形、ストレス、断線等が生じないものが用いられる。また、穴埋め材２０は、半田レベラーを使用しないで充填可能なもので、切断加工後に苛性ソーダを含む溶液など、アルカリ可溶性のような薬液で除去可能な穴埋めインキ等が使用される。
第７工程（ｇ）
この工程では、切断加工するなどの外形加工を施す。
第８工程（ｈ）
この工程では、充填された穴埋め材２０を除去して完成品となる。
前記第７工程（ｇ）において、穴埋め材２０に導電性を有するものを用いて穴埋めした場合には、外形加工後に穴埋め材２０を除去しない状態のまま完成品として使用することも可能である。 First step (a)
A double-sided copper-clad laminate 21 having a copper foil 11 attached to both sides of a substrate 10 of a printed wiring board is prepared. The copper clad laminate 21 may be a single layer or a multilayer having an inner layer pattern.
Second step (b)
Drilling is performed at a location where the through hole 13 is formed.
Third step (c)
The copper-clad laminate 21 that has been drilled is plated with copper.
Fourth step (d)
In this step, an outer layer pattern (circuit) is formed.
Step 5 (e)
In this step, a solder resist 19 is applied to form a marking.
Step 6 (f)
In this step, the portion of the through hole 13 and the portion not marked in the step are filled with the hole filling material 20. As the hole filling material 20, a material that does not bend, deform, stress, or break the printed wiring board substrate 10 due to a thermal load is used. Further, the hole filling material 20 can be filled without using a solder leveler, and a hole filling ink or the like that can be removed with a chemical solution that is soluble in alkali such as a solution containing caustic soda after cutting is used.
7th step (g)
In this step, external processing such as cutting is performed.
Step 8 (h)
In this step, the filled hole filling material 20 is removed to obtain a finished product.
In the seventh step (g), when the hole-filling material 20 is filled with a conductive material, it can be used as a finished product without removing the hole-filling material 20 after the outer shape processing.

本発明の実施例１を図１ないし図３に基づき説明する。
第１工程（ａ）
プリント配線板の基材１０の両面に銅箔１１を貼着した両面銅張積層板２１が用意される。前記プリント配線板の基材１０は、ガラス繊維などの補強材にエポキシ樹脂等をコーティングしたもので、０．８ｍｍから使用目的によっては０．０４ｍｍの厚さのものが使用される。また、前記銅箔１１は、３５μｍを標準とするが、使用目的によって５〜２００μｍの範囲で選択される。そして、前記プリント配線板の基材１０がプリプレグの状態で両面に銅箔１１を積層プレスして作られる。
この銅張積層板２１は、単層のものであってもよいし、内層パターンを作成した多層のものであってもよい。 A first embodiment of the present invention will be described with reference to FIGS.
First step (a)
A double-sided copper-clad laminate 21 having a copper foil 11 attached to both sides of a substrate 10 of a printed wiring board is prepared. The substrate 10 of the printed wiring board is obtained by coating a reinforcing material such as glass fiber with an epoxy resin or the like, and has a thickness of 0.84 mm depending on the purpose of use. Moreover, although the said copper foil 11 makes 35 micrometers into a standard, it is selected in the range of 5-200 micrometers according to the intended purpose. And the base material 10 of the said printed wiring board is made by carrying out the lamination press of the copper foil 11 on both surfaces in the state of a prepreg.
The copper clad laminate 21 may be a single layer or a multilayer having an inner layer pattern.

第２工程（ｂ）
スルーホール１３を形成する箇所に穴あけ加工が施される。穴あけ加工は、機械的なドリルによる方法、レーザによる方法などがある。 Second step (b)
Drilling is performed at a location where the through hole 13 is formed. The drilling includes a mechanical drill method and a laser method.

第３工程（ｃ）
穴あけ加工した銅張積層板２１は、洗浄後に無電解銅メッキが施される。必要に応じて電解銅メッキも施される。すると、銅箔１１の両面に銅メッキ層が形成されると共に、スルーホール用の穴に銅のスルーホールメッキ層１４が施され、スルーホール１３となる。 Third step (c)
The copper-clad laminate 21 that has been subjected to drilling is subjected to electroless copper plating after cleaning. Electrolytic copper plating is also applied if necessary. Then, a copper plating layer is formed on both surfaces of the copper foil 11, and a copper through-hole plating layer 14 is applied to the hole for the through-hole to form a through-hole 13.

第４工程（ｄ）
この工程では、一般的に行われている感光レジスト積層、露光、現像、エッチングにより外層パターン（回路）が形成される。１２は、形成されたランドである。 Fourth step (d)
In this step, an outer layer pattern (circuit) is formed by generally performed photosensitive resist lamination, exposure, development, and etching. Reference numeral 12 denotes a land formed.

第５工程（ｅ）
この工程では、基板表面の劣化抑制、不要部分の半田の付着防止のためソルダレジスト１９を塗布してマーキング形成をする。 5th process (e)
In this step, marking is performed by applying a solder resist 19 to suppress deterioration of the substrate surface and to prevent adhesion of unnecessary portions of solder.

第６工程（ｆ）
この工程では、スルーホール１３の部分と前記工程でマーキングされなかった部分に穴埋め材２０で穴埋めを行なう。この穴埋め材２０は、熱負荷によりプリント配線板の基材１０にたわみ、変形、ストレス、断線等が生じないように、また、半田レベラーを使用しないもの、例えば、切断加工後にアルカリ可溶性のような薬液（例えば、苛性ソーダなど）で除去可能な穴埋めインキが使用される。
具体的には、例えば、１２０〜１５０℃程度の温度で、６０〜１２０分程度で硬化する熱硬化型の穴埋めインキ（マレイン酸変性ロジン系樹脂など）が挙げられる。
その他、常温では固形化しているが、半田の溶融温度よりも低い温度で溶融する熱可塑性樹脂でもよい。また、紫外線硬化型樹脂を用いてもよい。 Step 6 (f)
In this step, the portion of the through hole 13 and the portion not marked in the step are filled with the hole filling material 20. This hole-filling material 20 does not cause bending, deformation, stress, disconnection or the like to the printed wiring board substrate 10 due to heat load, and does not use a solder leveler, such as alkali-soluble after cutting processing. A hole-filling ink that can be removed with a chemical solution (for example, caustic soda) is used.
Specifically, for example, a thermosetting hole-filling ink (such as maleic acid-modified rosin resin) that cures at a temperature of about 120 to 150 ° C. for about 60 to 120 minutes can be used.
In addition, although it is solidified at normal temperature, it may be a thermoplastic resin that melts at a temperature lower than the melting temperature of the solder. Further, an ultraviolet curable resin may be used.

第７工程（ｇ）
この工程では、切断線１６で切断加工するなどの外形加工を施す。図１（ｇ）では、断面図と平面図を表しており、さらに、図３（ｂ）には、斜視図を表している。 7th step (g)
In this step, an outer shape process such as a cutting process at the cutting line 16 is performed. FIG. 1G shows a cross-sectional view and a plan view, and FIG. 3B shows a perspective view.

第８工程（ｈ）
この工程では、充填された穴埋め材２０を除去した断面図と平面図を表しており、さらに、図３（ａ）には、斜視図を表している。これが完成品となる。 Step 8 (h)
In this step, a cross-sectional view and a plan view in which the filled hole filling material 20 is removed are shown, and FIG. 3A shows a perspective view. This is the finished product.

前記第７工程（ｇ）において、穴埋め材２０に導電性を有するもの、例えば、穴埋めインキに銀粉、銅粉などの導電性粉末を混合したものを用いて穴埋めした場合には、外形加工後に穴埋め材２０を除去しないで図３（ａ）の状態のまま完成品として使用することも可能である。   In the seventh step (g), when filling the hole filling material 20 with a conductive material such as a mixture of conductive powder such as silver powder or copper powder in the hole filling ink, the hole filling material is filled after the outer shape processing. It is also possible to use it as a finished product without removing the material 20 as it is in the state of FIG.

本発明によるプリント配線板の製造方法の一実施例を示す工程説明図である。It is process explanatory drawing which shows one Example of the manufacturing method of the printed wiring board by this invention. 図１のフローチャートである。It is a flowchart of FIG. （ａ）は、スルーホール１３に充填した穴埋め材２０を外形加工後に薬液で除去した完成品の斜視図、（ｂ）は、スルーホール１３に充填した導電性を有する穴埋め材２０を外形加工後にそのまま電極とした完成品の斜視図である。(A) is a perspective view of a finished product in which the filling material 20 filled in the through-hole 13 is removed with a chemical solution after external processing, and (b) is after the external processing of the conductive filling material 20 filled in the through-hole 13. It is a perspective view of the finished product made into an electrode as it is. 従来のプリント配線板の製造方法の工程説明図である。It is process explanatory drawing of the manufacturing method of the conventional printed wiring board.

符号の説明Explanation of symbols

１０…プリント配線板の基材、１１…銅箔、１２…ランド、１３…スルーホール、１４…スルーホールメッキ層、１５…半田、１６…切断線、１７…実装部品、１８…プリント配線板、１９…ソルダレジスト、２０…穴埋め材、２１…銅張積層板。   DESCRIPTION OF SYMBOLS 10 ... Base material of printed wiring board, 11 ... Copper foil, 12 ... Land, 13 ... Through hole, 14 ... Through-hole plating layer, 15 ... Solder, 16 ... Cutting line, 17 ... Mounting component, 18 ... Printed wiring board, 19 ... Solder resist, 20 ... Filler, 21 ... Copper-clad laminate.

Claims (5)

プリント配線板にスルーホール用の穴をあけ、この穴にスルーホールメッキ層を形成した後、スルーホールの一部が露出するように外形加工を施してこの露出した部分を電極としたプリント配線板の製造方法において、
前記プリント配線板に損傷を与えない低い温度で溶融、固形化する穴埋め材をスルーホールに充填した後、前記外形加工を施すようにしたことを特徴とするプリント配線板の製造方法。 After drilling holes for through holes in the printed wiring board and forming a through hole plating layer in these holes, the printed wiring board is subjected to outline processing so that part of the through holes are exposed, and the exposed portions are used as electrodes. In the manufacturing method of
A method of manufacturing a printed wiring board, comprising filling a through hole with a hole filling material that melts and solidifies at a low temperature that does not damage the printed wiring board, and then performs the outer shape processing. スルーホールに充填した穴埋め材は、外形加工後に薬液で除去するようにしたことを特徴とする請求項１記載のプリント配線板の製造方法。   2. The method for manufacturing a printed wiring board according to claim 1, wherein the filling material filled in the through hole is removed with a chemical solution after the outer shape processing. 穴埋め材は、１２０〜１５０℃程度の温度で、６０〜１２０分程度で硬化し、切断加工後に薬液で除去可能な穴埋めインキからなることを特徴とする請求項２記載のプリント配線板の製造方法。 3. The method for producing a printed wiring board according to claim 2, wherein the hole filling material is made of hole filling ink which is cured in about 60 to 120 minutes at a temperature of about 120 to 150 [deg.] C. and can be removed with a chemical after cutting. . スルーホールに充填した穴埋め材は、導電性を有するものからなり、外形加工後にそのまま電極としたことを特徴とする請求項１記載のプリント配線板の製造方法。   2. The printed wiring board manufacturing method according to claim 1, wherein the filling material filled in the through hole is made of an electrically conductive material, and is used as an electrode after the outer shape processing. 穴埋め材は、導電性粉末を混合した穴埋めインキからなり、外形加工後に除去することなく完成品としたことを特徴とする請求項４記載のプリント配線板の製造方法。 The printed wiring board manufacturing method according to claim 4, wherein the hole filling material is made of hole filling ink mixed with conductive powder, and is made into a finished product without being removed after the outer shape processing.
JP2008166878A 2008-06-26 2008-06-26 Method of manufacturing printed circuit board Pending JP2010010326A (en)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN111988910A (en) * 2019-05-23 2020-11-24 枣有限公司 Electronic component mounting structure and electronic component mounting method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10126024A (en) * 1996-10-24 1998-05-15 Hitachi Aic Inc Wiring board having end-face through hole
JP2001339156A (en) * 2000-05-30 2001-12-07 Cmk Corp Printed wiring board for surface mounting chip component and method for manufacturing surface mounting component

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10126024A (en) * 1996-10-24 1998-05-15 Hitachi Aic Inc Wiring board having end-face through hole
JP2001339156A (en) * 2000-05-30 2001-12-07 Cmk Corp Printed wiring board for surface mounting chip component and method for manufacturing surface mounting component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111988910A (en) * 2019-05-23 2020-11-24 枣有限公司 Electronic component mounting structure and electronic component mounting method
US11013118B2 (en) 2019-05-23 2021-05-18 Jujube Llc Electronic component mounting structure and method
TWI733235B (en) * 2019-05-23 2021-07-11 日商棗有限公司 The mounting structure of electronic parts and the mounting method of electronic parts

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