JP2009522119A5 - - Google Patents

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Publication number
JP2009522119A5
JP2009522119A5 JP2008548619A JP2008548619A JP2009522119A5 JP 2009522119 A5 JP2009522119 A5 JP 2009522119A5 JP 2008548619 A JP2008548619 A JP 2008548619A JP 2008548619 A JP2008548619 A JP 2008548619A JP 2009522119 A5 JP2009522119 A5 JP 2009522119A5
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JP
Japan
Prior art keywords
glass
ceramic matrix
total weight
total
teo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008548619A
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English (en)
Japanese (ja)
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JP2009522119A (ja
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Publication date
Priority claimed from US11/323,452 external-priority patent/US20070154713A1/en
Application filed filed Critical
Publication of JP2009522119A publication Critical patent/JP2009522119A/ja
Publication of JP2009522119A5 publication Critical patent/JP2009522119A5/ja
Withdrawn legal-status Critical Current

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JP2008548619A 2005-12-30 2006-12-20 セラミック切削工具及び切削工具インサート、並びにそれらを作製する方法 Withdrawn JP2009522119A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/323,452 US20070154713A1 (en) 2005-12-30 2005-12-30 Ceramic cutting tools and cutting tool inserts, and methods of making the same
PCT/US2006/048702 WO2007078973A1 (en) 2005-12-30 2006-12-20 Ceramic cutting tools and cutting tool inserts, and methods of making the same

Publications (2)

Publication Number Publication Date
JP2009522119A JP2009522119A (ja) 2009-06-11
JP2009522119A5 true JP2009522119A5 (https=) 2010-02-04

Family

ID=38224806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008548619A Withdrawn JP2009522119A (ja) 2005-12-30 2006-12-20 セラミック切削工具及び切削工具インサート、並びにそれらを作製する方法

Country Status (4)

Country Link
US (1) US20070154713A1 (https=)
EP (1) EP1968763A4 (https=)
JP (1) JP2009522119A (https=)
WO (1) WO2007078973A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5739189B2 (ja) * 2011-02-24 2015-06-24 三菱マテリアル株式会社 耐摩耗性に優れた表面被覆切削工具の製造方法
WO2013030922A1 (ja) * 2011-08-29 2013-03-07 新電元工業株式会社 半導体接合保護用ガラス組成物、半導体装置の製造方法及び半導体装置
EP2717299B1 (en) * 2011-05-26 2016-07-27 Shindengen Electric Manufacturing Co., Ltd. Glass composition for semiconductor junction protection, production method for semiconductor device, and semiconductor device
JP5876755B2 (ja) * 2012-03-21 2016-03-02 三菱マテリアル株式会社 高速断続切削加工においてすぐれた潤滑性、耐チッピング性、耐摩耗性を発揮する表面被覆切削工具
WO2013168236A1 (ja) 2012-05-08 2013-11-14 新電元工業株式会社 樹脂封止型半導体装置及び樹脂封止型半導体装置の製造方法
CN110483046B (zh) * 2019-09-26 2021-06-29 中钢集团洛阳耐火材料研究院有限公司 一种高发射率红外节能材料以及制备方法
FI131339B1 (en) * 2022-12-23 2025-02-27 Teknologian Tutkimuskeskus Vtt Oy Method for producing powder mixture for ceramic coating and its use
JP7438501B1 (ja) 2023-01-24 2024-02-27 学校法人 龍谷大学 アルミナ-ジルコニア混合材料及びその製造方法

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