JP2009520321A - 電気活性デバイス用積層電極及びその製造方法 - Google Patents
電気活性デバイス用積層電極及びその製造方法 Download PDFInfo
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- JP2009520321A JP2009520321A JP2008545748A JP2008545748A JP2009520321A JP 2009520321 A JP2009520321 A JP 2009520321A JP 2008545748 A JP2008545748 A JP 2008545748A JP 2008545748 A JP2008545748 A JP 2008545748A JP 2009520321 A JP2009520321 A JP 2009520321A
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Abstract
【選択図】 図1
Description
12 電子注入層
14 キャップ層
16 ゲッタ層
20 有機電気活性デバイス
22 陽極層
24,28 電気活性層
26 電源
30 カバーグラス
32 接着剤
Claims (28)
- 有機電気活性デバイス用積層陰極であって、電子注入層と、電子注入層上に配置されたキャップ層と、キャップ層上に配置されたゲッタ層とを備え、ゲッタ層が積層陰極に内在する、積層陰極。
- 前記キャップ層の少なくとも一部分が前記電子注入層の少なくとも一部分の上に配置され、前記ゲッタ層の少なくとも一部分が前記キャップ層の少なくとも一部分の上に配置された、請求項1記載の積層陰極。
- さらに、前記ゲッタ層上に配置された第2キャップ層を備える、請求項1記載の積層陰極。
- 前記ゲッタ層が前記キャップ層に埋設されている、請求項1記載の積層陰極。
- 前記ゲッタ層がその2つ以上の側面で前記キャップ層により包囲されている、請求項1記載の積層陰極。
- 前記ゲッタ層が前記キャップ層で封止されている、請求項1記載の積層陰極。
- 前記電子注入層が、アルカリ金属、アルカリ土類金属、アルカリ金属ハロゲン化物又はアルカリ土類金属ハロゲン化物又はこれらの組合せを含有する材料からなる、請求項1記載の積層陰極。
- 前記電子注入層が、リチウム、カルシウム、フッ化リチウム、フッ化カルシウム、フッ化ナトリウム、フッ化カリウム又はこれらの組合せを含有する材料からなる、請求項1記載の積層陰極。
- 前記キャップ層が、Al、Ag、Au、In、Sn、Zn、Zr、Sc、Y、Mn、Pb、ランタノイド系列金属又はこれらの混合物又はこれらの合金を含有する、請求項1記載の積層陰極。
- 前記ゲッタ層が、カルシウム、バリウム、ストロンチウム、マグネシウム、酸化カルシウム、酸化ストロンチウム、酸化バリウム、酸化マグネシウム又はこれらの組合せを含有する、請求項1記載の積層陰極。
- 1つ以上の電気活性層と積層陰極とを備える有機電気活性デバイスであって、前記積層陰極が、電子注入層と、キャップ層と、ゲッタ層とを備え、ゲッタ層が積層陰極に内在する、有機電気活性デバイス。
- 前記キャップ層の少なくとも一部分が前記電子注入層の少なくとも一部分の上に配置され、前記ゲッタ層の少なくとも一部分が前記キャップ層の少なくとも一部分の上に配置された、請求項11記載の有機電気活性デバイス。
- 前記電気活性デバイスが有機発光装置を含む、請求項12記載の有機電気活性デバイス。
- 前記電気活性デバイスが有機光起電力装置を含む、請求項12記載の有機電気活性デバイス。
- さらに、正孔輸送層、正孔注入層、正孔注入増強層、電子輸送層、電子注入増強層、エレクトロルミネセント層、光吸収層、陽極層又は基板層又はこれらの組合せを含む、請求項12記載の有機電気活性デバイス。
- さらに、正孔輸送層、正孔注入層、正孔注入増強層、電子輸送層、電子注入増強層、エレクトロルミネセント層、光吸収層、陽極層又は基板層又はこれらの組合せを含む、請求項11記載の有機電気活性デバイス。
- さらに、耐摩耗性層、接着層、耐薬品性層、フォトルミネセント層、放射線吸収層、エレクトロクロミック層、フォトクロミック層、放射線反射層、バリア層、平坦化層、光拡散層又はこれらの組合せを含む、請求項11記載の有機電気活性デバイス。
- 電子注入層の厚さが約0.1〜100nmの範囲にある、請求項11記載の有機電気活性デバイス。
- キャップ層の厚さが約20〜200nmの範囲にある、請求項11記載の有機電気活性デバイス。
- ゲッタ層の厚さが約10〜200nmの範囲にある、請求項11記載の有機電気活性デバイス。
- 有機電気活性デバイスががタンデム構造を有する、請求項11記載の有機電気活性デバイス。
- 電子注入層、キャップ層及びゲッタ層を積層構造に形成する工程を含み、
この際前記キャップ層の少なくとも一部分を前記電子注入層の少なくとも一部分に密接配置し、前記ゲッタ層の少なくとも一部分を前記キャップ層の少なくとも一部分に密接配置する、
積層陰極の製造方法。 - 基板及び1つ以上の電気活性層を含む第1部分構造を形成し、
積層陰極を含む第2部分構造を形成する工程を含み、
この際第2部分構造を第1部分構造の少なくとも一部分に密接配置し、
前記積層陰極が電子注入層、キャップ層及びゲッタ層を含む、
有機電気活性デバイスの製造方法。 - 積層陰極を含む第2部分構造を形成する工程で、電子注入層、キャップ層及びゲッタ層を堆積する、請求項23記載の方法。
- 積層陰極を堆積する工程で、前記キャップ層の少なくとも一部分を前記電子注入層の少なくとも一部分に密接配置し、前記ゲッタ層の少なくとも一部分を前記キャップ層の少なくとも一部分に密接配置する、請求項23記載の方法。
- 前記電気活性層が、陽極層、正孔輸送層、正孔注入層、正孔注入増強層、電子輸送層、電子注入増強層、光吸収層、エレクトロルミネセント層又はこれらの組合せを含む、請求項23記載の方法。
- 第2部分構造を形成する工程で、さらに正孔輸送層、正孔注入層、正孔注入増強層、電子輸送層、電子注入増強層、光吸収層、エレクトロルミネセント層、陽極層又はこれらの組合せを形成する、請求項23記載の方法。
- さらに第1デバイス部分構造と第2デバイス部分構造を互いに積層する工程を含む、請求項23記載の方法。
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Also Published As
Publication number | Publication date |
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EP1964191A2 (en) | 2008-09-03 |
KR20080084947A (ko) | 2008-09-22 |
WO2007070529A3 (en) | 2008-01-17 |
US20070131278A1 (en) | 2007-06-14 |
CN103354277B (zh) | 2016-03-30 |
JP5312949B2 (ja) | 2013-10-09 |
TWI459606B (zh) | 2014-11-01 |
TW200731596A (en) | 2007-08-16 |
CN103354277A (zh) | 2013-10-16 |
WO2007070529A2 (en) | 2007-06-21 |
US8044571B2 (en) | 2011-10-25 |
KR101372244B1 (ko) | 2014-03-11 |
CN101331628A (zh) | 2008-12-24 |
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