JP2009303285A - Module and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem, wherein a conventional module has a chance of being influenced in its characteristics, due to reduction in the radiation effect of heat generated in a transformer, when an adhesive is increased in thickness so as to prevent vibration generated in the transformer. <P>SOLUTION: In the manufacturing method for the module, while supporting an inductor 12 with the end part of a sheet-like heat transmission layer 13 formed on a metal plate 16 and a protrusion 18 formed on the metal plate 16, the inductor 12 is fixed on the metal plate 16 or the heat transmission layer 13 with the adhesive 22, thereby a high radiating formation and a low beating sound of the module 19 can be attained with the module 19 for suppressing the vibration 25 generated in the inductor 12. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a module used for a power source of an electronic device such as a plasma television or a liquid crystal television that requires a thin shape, and a method for manufacturing the same.

  In recent years, electronic devices such as plasma televisions and liquid crystal televisions have been required to be further downsized and thinned for the purpose of hanging on walls. Therefore, further thinning is required for power sources (including power modules, transformers, choke coils, and other large current modules) used in such electronic devices.

  In such a power supply module, it has been proposed to cool the transformer by mounting a transformer as a heat generating component on the heat dissipation board. For example, Patent Document 1 is known as such a module.

  7A to 7C are cross-sectional views showing a conventional module manufacturing method and problems.

  FIG. 7A is a cross-sectional view for explaining a conventional method for manufacturing a module, and shows a state in which a heat transfer layer 3 is fixed on a metal plate 1 as indicated by an arrow 2.

  FIG. 7B is a cross-sectional view for explaining the manner in which the transformer is fixed to the conventional module. The adhesive 5 is used to connect the transformer 5 with terminals 6 a and 6 b onto the heat transfer layer 3 with the arrow 2. A state of fixing as shown in FIG.

  FIG. 7C is a cross-sectional view for explaining the turning of the transformer in the conventional module. When current is applied to the transformer 5 from the terminals 6a and 6b, the transformer 5 vibrates greatly as shown by the vibration 7, This shows how to be angry. Note that an arrow 2 in FIG. 7C indicates a state in which the transformer 5 rolls up and down (or finely vibrates) due to the vibration 7.

As shown in FIG. 7C, in the conventional module 8, the vibration 7 generated in the transformer 5 is absorbed by the adhesive 4.
JP 2005-80382 A

  However, in the case of a module as shown in FIGS. 7A to 7C, when the heat generated in the transformer 5 is radiated to the heat transfer layer 3 or the metal plate 1, the thickness of the adhesive 4 is an obstacle. Therefore, it is required to reduce the thickness of the adhesive 4 for heat dissipation. However, when the thickness of the adhesive 4 is reduced, there is a problem that the absorption effect by the adhesive 4 of the vibration 7 generated in the transformer 5 is lowered.

  Further, when the thickness of the adhesive 4 is reduced for heat dissipation, it is necessary to use a very special member having high vibration absorption for the adhesive 4, and the adhesive strength of the transformer 5 may be lowered.

  In order to solve the above problems, the present invention provides a metal plate, a sheet-like heat transfer layer formed on the metal plate, a power element fixed on the heat transfer layer, the heat transfer layer, and the heat transfer layer. An inductor fixed to a metal plate, wherein a first end of the inductor is an end of the heat transfer layer, and a second end of the inductor is a protrusion provided on the metal plate. Thus, the module is fixed with an elastic adhesive so as to be held.

  As described above, according to the present invention, the transformer and the metal plate are supported by supporting the first end of the transformer on the heat transfer layer side and the second end of the transformer on the protrusion provided on the metal plate. The thickness of the adhesive provided between the two can be increased, and the vibration (or sag) generated in the transformer is absorbed by the thickness of the adhesive. Further, by reducing the thickness of the adhesive that fixes the transformer and the heat transfer layer, the heat generated in the transformer is effectively radiated to the heat transfer layer and the metal plate.

  As a result, it is possible to prevent the transformer incorporated in the module from being heated and twisted, to realize a smaller and higher density module, and to further reduce the thickness of the device.

  Further, since the thickness of the adhesive can be ensured to a certain level or more, it is not necessary to use a special and expensive vibration-proof member, and a commercially available low-cost member having excellent adhesive strength can be used as the adhesive.

  In addition, if necessary, the circuit board can be incorporated into this module to minimize the wiring length (and wiring impedance) between the power element and the inductor, thereby suppressing the occurrence of noise caused by impedance such as ringing. it can.

  Note that some of the manufacturing steps shown in the embodiments of the present invention are performed using a molding die or the like. However, the molding die is not shown unless it is necessary for explanation. Further, the drawings are schematic views and do not show the positional relations in terms of dimensions.

(Embodiment 1)
Hereinafter, a module will be described as a first embodiment of the present invention with reference to the drawings.

  FIG. 1 is a cross-sectional view illustrating an example of a module according to the first embodiment. In FIG. 1, 11 is a power element, 12 is an inductor, 13 is a heat transfer layer, 14 is a circuit board, 15a to 15c are lead wires, 16 is a metal plate, 17 is an adhesive layer, 18 is a protrusion, and 19 is a module. is there. The inductor 12 includes a transformer, a choke coil, and the like. This is because both the transformer and the choke coil are inductor components that are subject to heat generation due to Joule heat. The heat generated by the Joule heat in the coil portions inside the inductor 12 causes an increase in the DCR (for example, series resistance), and affects the performance of the module 19.

  In FIG. 1, the metal plate 16 is provided with one or more (more than one, or one or more) protrusions 18 using a mold or the like. Further, a sheet-like heat transfer layer 13 is provided on a part of the metal plate 16, and one or more power elements 11 are fixed on the heat transfer layer 13.

  The power element 11 includes an IGBT, a power FET, a power transistor, a power diode, a power IC, and the like. A commercially available resin package product can be used as the power element 11.

  The first end of the inductor 12 is the end of the heat transfer layer 13 (in FIG. 1, the end of the heat transfer layer is the end of the heat transfer layer and the vicinity of the end, and the position from the end to 10 mm. The inductor 12 is held such that the second end of the inductor 12 is placed on the protrusion 18. The first end portion of the inductor 12 is the lead wire 15b side of the inductor 12, for example, a primary side terminal portion on the inductor 12 side. The second end portion of the inductor 12 is, for example, the lead wire 15 c side of the inductor 12 and a terminal portion on the secondary side of the inductor 12.

  The inductor 12 is fixed on the end portion of the heat transfer layer 13 and the metal plate 16 by the adhesive layer 17 provided below the inductor 12. The adhesive layer 17 can effectively absorb the warp and vibration generated in the inductor 12 by using an elastic adhesive.

  Note that the lead wires 15a to 15c and the like do not need to be related to copper wires, and may be terminals for connection, and may be a part of a copper plate or a lead frame.

  Further, by connecting the lead wire 15a of the power element 11 and the lead wires 15b and 15c of the inductor 12 to the circuit board 14 provided so as to be substantially parallel to the metal plate 16, the power element 11 and the inductor 12 are connected to each other. The effect of reducing the noise (for example, ringing noise) due to the impedance is obtained by shortening the wiring length between them.

  In FIG. 1, the circuit board 14 is not an essential element of the module 19 in the first embodiment. This is because the module 19 can be obtained without providing the circuit board 14 in FIG.

  When the circuit board 14 is not provided, for example, the module 19 includes a metal plate 16, a sheet-like heat transfer layer 13 formed on the metal plate 16, and a power element 11 fixed on the heat transfer layer 13. A module comprising the heat transfer layer 13 and an inductor 12 fixed to the metal plate 16, wherein the first end of the inductor 12 is the end of the heat transfer layer 13 and the second end of the inductor 12. The end portion of the module 19 is fixed by an adhesive layer 17 (for example, an elastic adhesive) so as to be held by the protrusion 18 provided on the metal plate, thereby preventing the inductor 12 from bending and dissipating heat. .

  Further, if necessary, by combining with the circuit board 14, the wiring length (and wiring impedance) between the power element and the inductor can be minimized, so that generation of noise due to impedance such as ringing can be suppressed.

  In this case, the metal plate 16, the sheet-like heat transfer layer 13 formed on the metal plate 16, the power element 11 fixed on the heat transfer layer 13, the heat transfer layer 13 and the metal plate 16 A module 19 comprising a fixed inductor 12 and a circuit board 14 connected to the power element 11 and the inductor 12 and provided substantially in parallel with the metal plate 16, wherein the first end ( For example, the lead wire 15b side of the inductor 12 in FIG. 1 is the end portion of the heat transfer layer 13, and the second end portion of the inductor 12 (for example, the lead wire 15c side of the inductor 12 in FIG. 1) is the metal. The module 19 is fixed by the adhesive layer 17 made of an elastic adhesive so as to be held by the protrusions 18 provided on the plate 16. As a result, vibrations and sags generated in the inductor 12 can be absorbed by the adhesive layer 17 provided so as to ensure a certain thickness by the heat transfer layer 13 and the protrusions 18, thereby preventing the sag of the inductor 12. Realize.

  In FIG. 1, it is desirable that the height of the protrusion 18 is substantially the same as the thickness of the heat transfer layer 13. By doing so, the space between the inductor 12 and the metal plate 16 can be made substantially parallel. Further, since the lower surface of the inductor 12 and the surface of the heat transfer layer 13 can also be made substantially parallel, the thickness of the adhesive layer 17 formed between the inductor 12 and the heat transfer layer 13 is reduced (more uniformly). As will be described later with reference to FIG. 6, the heat dissipation effect of the heat generated in the inductor 12 is enhanced.

  Note that the lower surface of the core constituting the inductor 12 (note that the core is not shown. The inductor 12 includes a core and a coil formed of copper wire, etc. Note that the coil is not shown) is the metal plate 16. And approximately parallel. By making the lower surface of the core constituting the inductor 12 and the metal plate 16 (and also the heat transfer layer 13) substantially parallel, the thickness of the adhesive layer 17 can be reduced (more uniform). As described in FIG. 6, the heat dissipation effect of the heat generated in the inductor 12 is enhanced.

  The heat transfer layer 13 is an epoxy resin containing a filler, and the thickness of the heat transfer layer 13 is preferably 0.4 mm or more. By using the epoxy resin with filler, the thermal conductivity of the heat transfer layer 13 can be increased, and the heat dissipation effect of the heat generated in the inductor 12 is enhanced. Further, by setting the thickness of the heat transfer layer 13 to 0.4 mm or more (preferably 0.6 mm or more in consideration of variation), the heat transfer layer 13 can be reinforced and insulated, and a primary circuit (for example, , A primary circuit fabricated using the power element 11 and the inductor 12) can be formed on the heat transfer layer 13. Further, in this case, the thickness of the adhesive layer 17 between the metal plate 16 and the inductor 12 can be set to the thickness of the heat transfer layer 13 (for example, 0.4 mm or more), and the effect of absorbing vibrations and wrinkles generated in the inductor 12 is achieved. Can be enhanced.

  When an elastic adhesive is used for the adhesive layer 17, the rubber hardness is desirably 40 or less (more desirably 30 or less). When the rubber hardness is greater than 40, there may be a case where the effect of absorbing vibrations and sag generated in the inductor 12 cannot be obtained.

  For measuring the rubber hardness of the adhesive layer 17, a rubber hardness meter standardized by JIS or the like is used. When a durometer type A rubber hardness tester specified in JIS-K-6253 is used, the rubber hardness is A_40 or less (_ means a blank), or a spring type A type specified in JIS-K-6301 When the rubber hardness tester is used, the rubber hardness is preferably 40Hs_JIS_C or less (where _ means a single letter blank). This is because, in both cases, when the rubber hardness is greater than 40, it may not be possible to obtain an effect of absorbing vibrations and distortion generated in the inductor 12. In addition, a rubber hardness meter known from JIS-K-7215, ASTM-D2240, ISO-7619, or the like may be used.

  When “JIS-K-6301-A spring type A” and “Dilometer A (Shore A)” are used, the “Durometer A (Shore A)” is the same even if the rubber hardness is 40. May go higher. In such a case, it is desirable to use the value of “dilometer (Shore A)”. Moreover, you may utilize a "rubber hardness conversion table" etc. as needed.

(Embodiment 2)
Hereinafter, as a second embodiment of the present invention, an example of a method for manufacturing the module 19 described in the first embodiment will be described with reference to the drawings.

  2A to 2C are cross-sectional views showing an example of a method for manufacturing the module 19 in the second embodiment. 2A to 2C, 20 is a heat transfer material, 21 is an arrow, and 22 is an adhesive.

  In FIG. 2A, a protrusion 18 is formed in advance on the metal plate 16. As the metal plate 16, for example, an aluminum plate or a copper plate having a thickness of about 0.5 to 2.0 mm can be used. The size of the protrusion 18 is 0.5 mmφ or more. This is because it is difficult to form the protrusion 18 having a diameter of less than 0.5 mmφ by pressing or the like. Note that the shape of the protrusion 18 may be round, square, belt-shaped (or linear, striped), etc., and may be determined by workability.

  As shown by an arrow 21 in FIG. 2A, the heat transfer material 20 is set on the metal plate 16 so as to avoid the protrusion 18 and integrated to form a heat dissipation board. Thereafter, as shown in FIG. 2B, the power elements 11a and 11b, the inductor 12 and the like are fixed thereon. As shown in FIG. 2B, the power element 11b (for example, an element connected to the secondary output of the inductor 12 or a circuit element that does not require reinforced insulation) is not on the heat transfer layer 13. It can be fixed directly on the metal plate 16 using an adhesive or the like. By doing so, the heat radiation effect of the power element 11b (for example, the secondary side circuit element) can be enhanced, and the amount of the heat transfer material 20 can be reduced, so that the cost of the product is reduced.

  In FIG. 2B, the adhesive 22 is a rubber-based (for example, silicon-based, urethane-based, etc.) elastic adhesive, and becomes an elastic body (preferably having a rubber hardness of 40 or less) after curing.

  The adhesive 22 may be applied so as to cover the protrusion 18 provided on the metal plate 16 or the end of the heat transfer layer 13. By forming the adhesive 22 so as to cover the protrusion 18 and the end of the heat transfer layer 13, the adhesive strength in the protrusion 18 and the heat transfer layer 13 can be increased. It is desirable to apply the adhesive 22 so that the film thickness is high on the metal plate 16 and low on the heat transfer layer 13. By doing so, the adhesive can be formed on the metal plate 16 with a high film thickness, and the adhesive 22 can be formed on the heat transfer layer 13 with a thin layer. Thereafter, the adhesive 22 is cured to form the adhesive layer 17.

  FIG. 2C is a cross-sectional view of the module 19 thus completed. As shown in FIG. 2 (C), the adhesive layer 17 on the metal plate 16 can be formed in a high film thickness, and the adhesive layer 17 on the heat transfer layer 13 can be formed in a thin layer. Enhanced.

  Next, the shape of the protrusion 18 will be described with reference to FIGS.

  3A and 3B are perspective views for explaining the shape of the protrusion 18. 3A and 3B, reference numeral 23 denotes a dotted line. As shown in FIG. 3A, the number of protrusions 18 is one or more. For example, by providing a plurality of protrusions 18, a single mold (such as a mold for forming the protrusions 18) and a plurality of inductors 12 (for example, large, small, a plurality of parallel use, etc.) ). This is because it is sufficient that at least one of the protrusions 18 hits the inductor 12.

  FIG. 3B is a perspective view illustrating a state after the inductor 12 is set on the metal plate 16 provided with the plurality of protrusions 18. As shown in FIG. 3B, it can be seen that even when a plurality of protrusions 18 are prepared, it is sufficient that at least one protrusion 18 supports the inductor 12. In FIG. 3B, a dotted line 23 indicates the protrusion 18 hidden behind the inductor 12. 3B, the adhesive layer 17 for fixing the inductor 12, the power element 11, and the like are not shown.

  Next, the thickness uniformity effect of the heat transfer layer 13 in the protrusion 18 will be described with reference to FIGS.

  4A to 4C are cross-sectional views illustrating an example of a method for forming the heat transfer layer 13 using the protrusions 18. 4A to 4C, reference numeral 24 denotes a mold or the like.

  As shown in FIG. 4A, the heat transfer material 20 is pressed against the metal plate 16 side as shown by an arrow 21 using a mold 24 or the like. At this time, since the protrusion 18 provided in advance on the metal plate 16 becomes a kind of spacer (or a lower operation limit point of the mold 24 or the like), the thickness of the heat transfer layer 13 is set to the height of the protrusion 18. I can match. 4A, the protrusions 18 are illustrated on both sides of the heat transfer material 20, but it goes without saying that the protrusions 18 may be provided only on one side.

  FIG. 4B is a cross-sectional view for explaining that the height of the protrusion 18 and the height (or thickness) of the heat transfer layer 13 are substantially the same, and the dotted line 23 is substantially the same in thickness. Indicates that

  FIG. 4C is a cross-sectional view of the module 19 thus manufactured. As shown in FIGS. 4A to 4B, the thickness of the adhesive layer 17 is made thin (more uniform) by making the thickness of the heat transfer layer 13 and the height of the protrusion 18 substantially the same. As will be described later with reference to FIG. 6, the heat dissipation effect of the heat generated in the inductor 12 is enhanced.

  Next, the twisting prevention effect of the inductor 12 will be described with reference to FIGS.

  5A and 5B are cross-sectional views for explaining the effect of preventing the inductor 12 from turning. In FIG. 5A, reference numeral 25 denotes vibration, for example, showing that the inductor 12 vibrates as indicated by an arrow 21.

  FIG. 5A shows the vibration 25 of the inductor 12 when the adhesive layer 17 is not provided. As shown in FIG. 5A, when the adhesive layer 17 is not provided, the vibration 25 of the inductor 12 increases as indicated by an arrow 21 and is transmitted to the device as a twist.

  FIG. 5B is a cross-sectional view illustrating the vibration absorption effect of the inductor 12 when the adhesive layer 17 is provided. As shown in FIG. 5B, by providing the adhesive layer 17 below the inductor 12, the vibration 25 of the inductor 12 can be absorbed within the thickness of the adhesive layer 17. It becomes difficult to be transmitted.

  A dotted line 23 in FIG. 5B shows how vibration (for example, arrow 21) generated in the inductor 12 is absorbed by the adhesive layer 17 and becomes smaller. As described above, the vibration 25 shown in FIG. 5A is significantly reduced by the thickness effect of the adhesive layer 17 as shown by the dotted line 23 in FIG.

  The protrusion 18 that holds one end of the inductor 12 is provided from the end of the inductor 12 to the vicinity of the end (the vicinity of the end indicates between the end of the inductor 12 and the center of the inductor 12). . This is to prevent the inductor 12 from being tilted by its own weight.

  The adhesive layer 17 preferably has a rubber hardness of 40 or less, but the vibration absorption effect can be further enhanced by further utilizing the elastic modulus of rubber.

  For example, the vibration 25 generated in the inductor 12 can be effectively absorbed by optimizing the Young's modulus (elastic modulus) from the rubber hardness of 40 or less and the rubber strength and elongation.

  For example, it is also effective to measure the elasticity of the adhesive layer 17 using not only a rubber hardness meter but also a viscoelastic spectrometer. It is useful to positively use the elasticity of the adhesive layer 17 (for example, to use a complex elastic modulus when sinusoidal vibration is applied).

  In this case, E ′ (storage modulus) and E ″ (loss modulus) are determined for the adhesive layer 17. In particular, E ″ is determined during one cycle of vibration of the inductor 12. It becomes an attenuation term of energy that can be dissipated as heat, that is, an energy dissipation term. Therefore, in order to absorb the vibration generated by the inductor 12, the frequency range generated by the inductor 12 (when measurement is still difficult, measurement may be performed in a frequency range that can be easily measured by the measuring device. In the case of a solid, it is desirable to select an adhesive having a large value of E ″ in the case where the elastic modulus is less dependent on the frequency. Specifically, the frequency region (or measurement) generated by the inductor 12 is preferably selected. E ″ is 20 times or less of E ′ (preferably E ″ is 10 times or less of E ′, more preferably 5 times or less. This is the accuracy of the measured values of E ″ and E ′. Taking this variation into consideration, it is desirable to provide such a difference.) By doing so, vibration generated by the inductor 12 can be converted from heat (or sound) to heat energy, so that the inductor 12 can be prevented from being turned. Further, since the heat energy obtained by converting the vibration energy of the inductor 12 can be released to the outside through the heat transfer layer 13 and the metal plate 16, the performance of the inductor 12 is not affected.

  Next, the heat dissipation mechanism of the module 19 described in the embodiment will be described with reference to FIG.

  FIG. 6 is a cross-sectional view illustrating the heat dissipation mechanism of the module 19. In FIG. 6, the heat generated in the inductor 12 is radiated to the metal plate 16 through the heat transfer layer 13, the protrusion 18, and the adhesive layer 17 as indicated by an arrow 21. Here, as shown in FIG. 6, even when the thickness of the adhesive layer 17 between the inductor 12 and the metal plate 16 is about the same as that of the heat transfer layer 13, the heat generated in the inductor 12. Can be effectively radiated to the metal plate 16 via the heat transfer layer 13 and the protrusions 18. This is because the coil (coil not shown) built in the inductor 12 is composed of a copper wire, a copper plate, or the like, and the thermal conductivity of the copper metal itself is extremely high. Therefore, the heat (for example, Joule heat) generated in the transformer is transferred through the coil constituting the transformer as indicated by an arrow 21 and is transferred to the metal plate 16 through the heat transfer layer 13 and the like. Heat is dissipated.

  As shown in FIG. 6, at least one end side of the inductor 12 (for example, the primary circuit side or the side where reinforced insulation is required) is placed on the heat transfer layer 13, whereby the terminal of the inductor 12 (for example, Reinforced insulation of the lead wire 15b) becomes possible. In addition, by overlapping one end of the inductor 12 and the end of the heat transfer layer 13, the overlapping heat transfer layer 13 can be set as a creepage distance. When the overlapping portion of the heat transfer layer 13 is a creepage distance, the creepage distance is preferably 6 mm or more (preferably 8 mm or more). If the distance is less than 6 mm, the creepage distance may not be accepted. Note that this is not the case when a part of the inductor 12 (for example, a lead-out portion of the lead wire 15b) can be added to the creepage distance.

(Embodiment 3)
In the third embodiment, members and the like used for the module 19 described in the first embodiment will be described in more detail.

  As the metal plate 16, it is desirable to use a member having high thermal conductivity such as copper or aluminum. Further, by fixing the module 19 to the housing or chassis of the device with screws or the like, the heat dissipation is further enhanced. Moreover, the cost can be reduced by using the metal plate 16 as a housing or chassis of the device.

  Next, the heat transfer material 20 used for the heat transfer layer 13 will be described. For example, the heat transfer material 20 is made of a resin and a filler, so that the thermal conductivity can be increased. And the reliability can be improved by using thermosetting resin as resin.

  Here, as the inorganic filler, for example, it has a substantially spherical shape, and its diameter is suitably 0.1 μm or more and 100 μm or less (if it is less than 0.1 μm, it becomes difficult to disperse in the resin. 13 becomes thick and affects the thermal diffusivity). In this embodiment, the inorganic filler is a mixture of two types of alumina having an average particle diameter of 3 μm and an average particle diameter of 12 μm. By using alumina having two kinds of large and small particle diameters, it is possible to fill the gaps between the large particle diameters of alumina with small particle diameters, so that alumina can be filled at a high concentration to nearly 90% by weight. As a result, the heat conductivity of these heat transfer layers 13 is about 5 W / (m · K).

  The inorganic filler is at least one selected from the group consisting of alumina, magnesium oxide, boron nitride, silicon oxide, silicon carbide, silicon nitride, and aluminum nitride, zinc oxide, silica, titanium oxide, tin oxide, and zircon silicate. It is desirable from the viewpoint of thermal conductivity and cost.

  In addition, when using a thermosetting resin, what contains at least 1 type of thermosetting resin chosen from the group of an epoxy resin, a phenol resin, cyanate resin, a polyimide resin, an aramid resin, and PEEK resin is desirable. This is because these resins are excellent in heat resistance and electrical insulation.

  As described above, the module and the manufacturing method according to the present invention can realize further downsizing and thinning of a plasma television, a liquid crystal television, and the like.

Sectional drawing which shows an example of the module in Embodiment 1 (A)-(C) is sectional drawing which shows an example of the manufacturing method of the module in Embodiment 2 together. (A) (B) is a perspective view explaining the shape of a projection part together (A)-(C) are sectional drawings explaining an example of the formation method of the heat-transfer layer using a projection part. (A) and (B) are sectional views for explaining the effect of preventing the inductor from turning. Sectional view explaining the heat dissipation mechanism of the module (A)-(C) is sectional drawing which shows the manufacturing method and subject of the conventional module

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Power element 12 Inductor 13 Heat transfer layer 14 Circuit board 15a-15d Lead wire 16 Metal plate 17 Adhesion layer 18 Protrusion part 19 Module 20 Heat transfer material 21 Arrow 22 Adhesive 23 Dotted line 24 Mold etc. 25 Vibration

Claims (8)

A metal plate and a sheet-like heat transfer layer formed on the metal plate;
A power element fixed on the heat transfer layer;
A module comprising the heat transfer layer and an inductor fixed to the metal plate,
The first end portion of the inductor is an end portion of the heat transfer layer, and the second end portion of the inductor is a protrusion provided on the metal plate, and is fixed with an elastic adhesive so as to be held. . A metal plate and a sheet-like heat transfer layer formed on the metal plate;
A power element fixed on the heat transfer layer;
An inductor fixed to the heat transfer layer and the metal plate;
A wiring board that connects the power element and the inductor and is provided substantially parallel to the metal plate;
A module consisting of
The first end portion of the inductor is an end portion of the heat transfer layer, and the second end portion of the inductor is a protrusion provided on the metal plate, and is fixed with an elastic adhesive so as to be held. . The module according to claim 1, wherein the height of the protrusion is substantially the same as the thickness of the heat transfer layer. The module according to claim 1, wherein a lower surface of a core constituting the inductor is substantially parallel to the metal plate. The module according to claim 1, wherein the heat transfer layer is a curable resin having a filler-containing insulating property, and the thickness of the heat transfer layer is 0.4 mm or more. The module according to claim 1, wherein the elastic adhesive has a rubber hardness of 40 or less. Providing a protrusion on the metal plate;
Providing a sheet-like heat transfer layer on the metal plate;
Fixing the power element on the heat transfer layer;
A first end portion of the inductor is an end portion of the heat transfer layer, and a second end portion of the inductor is the projection portion, and is fixed with an elastic adhesive so as to be held;
The manufacturing method of the module which has. Providing a protrusion on the metal plate;
Providing a sheet-like heat transfer layer on the metal plate;
Fixing the power element on the heat transfer layer;
A first end portion of the inductor is an end portion of the heat transfer layer, and a second end portion of the inductor is the projection portion, and is fixed with an elastic adhesive so as to be held;
Connecting the power element and the inductor with a wiring board provided substantially parallel to the metal plate;
The manufacturing method of the module which has.

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