JP2009285951A - Measuring system, measuring method and measuring program for mold clamping apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a measuring system for a mold clamping apparatus can appropriately measure the posture and the like of a movable mold in a mold clamping apparatus. <P>SOLUTION: The system includes the following means: a calculating means for calculating the coordinate values showing the relative position of the first marks against the second mark with respect to each of a plurality of images data obtained by imaging at the point of a mold clamping state and at the point of a movable mold moving process so as to include at least two first marks so added to the movable mold as to have a gap to the direction almost orthogonal to the mold opening-closing direction and a second mark added to the fixed member of the mold clamping apparatus stationary to the movement of the movable mold; a correction means for correcting the coordinate values of the first marks corresponding to the points in the moving process based on the coordinate values of those corresponding to the point in the mold clamping state; and an output means for outputting, based on the corrected coordinate values, the figure showing the posture of the movable mold in the moving process for it to be visible. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a mold clamping device measurement system, a mold clamping device measurement method, and a mold clamping device measurement program, and in particular, a mold clamping device measurement system and a mold for measuring a posture of a movable mold of the mold clamping device. The present invention relates to a clamping device measurement method and a mold clamping device measurement program.

  2. Description of the Related Art Conventionally, in an injection molding machine, resin is injected from an injection nozzle of an injection device, filled into a cavity space between a fixed mold and a movable mold, and solidified to obtain a molded product. ing. A mold clamping device is provided to move the movable mold relative to the fixed mold to perform mold closing, mold clamping, and mold opening.

  Here, in order to obtain a molded product of good quality, the relative movement between the molds is a very important factor. Specifically, if the moving direction of the movable mold has a deviation from the intended direction, or if the movable mold is tilted, there is a high possibility that defective molding will occur. In particular, since a molded product in recent years is required to have very high accuracy, even a minute one that cannot be confirmed by human eyes with respect to the deviation or the inclination may adversely affect the molded product.

Therefore, a highly accurate measuring means is required with respect to the position and orientation of the movable mold.
JP 2005-161644 A

  However, in the past, a systematic measurement method has not been established, and it has largely depended on the skills of workers on site. For example, by confirming the state of the molded product, a shift or inclination of the movable mold has been estimated.

  The present invention has been made in view of the above points, and is a mold clamping device measurement system, a mold clamping device measurement method, and a mold clamping device measurement system capable of appropriately measuring the posture of the movable mold in the mold clamping device, and the like. The purpose is to provide a measurement program for mold clamping devices.

  Therefore, in order to solve the above-described problem, the present invention provides at least two second molds added to the movable mold of the mold clamping device or the movable mold holding member so as to be displaced in a direction substantially perpendicular to the mold opening / closing direction. And a moving process of the movable mold so as to include one mark and a second mark added to a fixing member of the mold clamping device fixed to the movement of the movable mold. For each of a plurality of image data picked up at a time point in FIG. 5, a calculation means for calculating a coordinate value indicating a relative position of the first mark with respect to the second mark, and the first time with respect to the time point in the movement process Correction means for correcting the coordinate value of one mark based on the coordinate value of the first mark with respect to the time point in the mold-clamping state, and the movement excess based on the corrected coordinate value. And an outputting means for outputting a drawing showing a posture of the movable mold so as to be visible in.

  In the invention, it is preferable that the correction unit performs conversion for arranging the position of the first mark at the time in the mold clamping state on a straight line substantially orthogonal to the mold opening / closing direction at the time of the moving process. It is performed on the coordinate value of the first mark.

  In the present invention, the calculation means may calculate the seating value of the first mark for each of a plurality of image data captured at a plurality of time points when a mold clamping force is not applied in the mold movement process. The correction means calculates the first mark at the time point in the moving process with reference to an approximate straight line based on the coordinate values of the first mark at a plurality of time points when a clamping force is not applied. The coordinate value is corrected.

  Further, in the invention, the correction unit performs a conversion for making the approximate line a straight line substantially parallel to the mold opening / closing direction with respect to the coordinate value of the first mark at the time in the moving process. It is characterized by that.

  In the present invention, the second mark is provided for each of the first marks, and the image data is captured by a different imaging device for each set of the first mark and the second mark. It is characterized by.

  According to the present invention, the image data is obtained by taking at least the first mark out of the depth of focus, and calculates a light / dark distribution of a region including the first mark in the image data. Means for calculating a relative position of the second mark with respect to a position specified based on the brightness distribution.

  Further, according to the present invention, the light / dark distribution calculating means calculates a centroid position of an area including the first mark, and the calculating means calculates a relative position of the centroid position with respect to the second mark. It is characterized by that.

  Further, in the present invention, the light / dark distribution calculating means detects a light / dark peak value of an area including the first mark, and the calculating means relative to the second mark with respect to a position indicating the peak value. It is characterized in that a correct position is calculated.

  Further, the present invention is characterized in that the output means outputs the distance in the moving direction relatively shorter than the distance between the plurality of marks.

  According to the present invention, it is possible to provide a mold clamping device measurement system, a mold clamping device measurement method, and a mold clamping device measurement program capable of appropriately measuring the posture of the movable mold in the mold clamping device. it can.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic view of a mold clamping device of an injection molding machine according to an embodiment of the present invention. In FIG. 1, a mold clamping device 10 of an injection molding machine includes a frame 17, a predetermined distance between a fixed platen 12 and a fixed platen 12 as a fixed mold supporting device fixed to the frame 17. 17 and a toggle support 15 as a base plate disposed so as to be movable with respect to 17. The toggle support 15 functions as a toggle type mold clamping device support device. A plurality of (for example, four) tie bars 16 as guide means extend between the fixed platen 12 and the toggle support 15.

  The movable platen 13 is disposed so as to face the fixed platen 12 and functions as a movable mold support device disposed so as to be capable of moving back and forth (moving in the horizontal direction in the drawing) along the tie bar 16. The mold apparatus 11 includes a fixed mold 11a and a movable mold 11b. The fixed mold 11 a is attached to a mold mounting surface of the fixed platen 12 that faces the movable platen 13. On the other hand, the movable mold 11 b is attached to a mold attachment surface of the movable platen 13 that faces the fixed platen 12.

  Note that a drive device for moving an ejector pin (not shown) may be attached to the rear end (right end in the drawing) of the movable platen 13.

  A toggle mechanism 20 as a toggle type mold clamping device is attached between the movable platen 13 and the toggle support 15. A mold clamping motor 26 as a mold clamping drive source for operating the toggle mechanism 20 is disposed at the rear end of the toggle support 15. The mold clamping motor 26 is provided with a motion direction conversion device (not shown) composed of a ball screw mechanism or the like that converts rotational motion into reciprocating motion, and toggles the drive shaft 25 by moving it back and forth (moving in the left-right direction in the figure). The mechanism 20 can be activated. The mold clamping motor 26 is preferably a servo motor, and includes a mold opening / closing position sensor 27 as an encoder for detecting the rotation speed.

  The toggle mechanism 20 described above includes a cross head 24 attached to the drive shaft 25, a second toggle lever 23 attached to the cross head 24 so as to be swingable, and a first toggle lever attached to the toggle support 15 so as to be swingable. 21 and a toggle arm 22 that is swingably attached to the movable platen 13. Between the first toggle lever 21 and the second toggle lever 23 and between the first toggle lever 21 and the toggle arm 22 are linked. The toggle mechanism 20 is a so-called inner volume five-node double toggle mechanism, and has a vertically symmetrical configuration.

  The toggle mechanism 20 can be operated by driving the mold clamping motor 26 and moving the cross head 24 as a driven member forward and backward. In this case, when the cross head 24 is moved forward (moved leftward in the figure), the movable platen 13 is moved forward to perform mold closing. Then, a mold clamping force obtained by multiplying the propulsive force of the mold clamping motor 26 by the toggle magnification is generated, and the mold clamping is performed by the mold clamping force.

  In addition, a mold clamping position adjusting device 35 is disposed at the rear end (right end in the drawing) of the toggle support 15 in order to adjust the position of the toggle support 15 with respect to the fixed platen 12. A plurality of, for example, four tie bar insertion holes (not shown) are formed in the toggle support 15, and the right end of the tie bar 16 in the figure is inserted into each tie bar insertion hole. The left end of the tie bar 16 is fixed to the fixed platen 12 by a fixing nut 16a.

  The tie bar 16 has a screw portion 36 formed with a screw on the outer periphery at the right end in the figure, and an adjustment nut 37 is screwed into the screw portion 36 of each tie bar 16. The adjustment nut 37 is attached to the rear end of the toggle support 15 so as to be rotatable and immovable in the axial direction of the tie bar 16. A driven gear 37 a is attached to the outer periphery of the adjustment nut 37.

  A mold thickness motor 31 as a mold clamping position adjusting drive source is disposed at an upper portion of the rear end of the toggle support 15. A driving gear 33 is attached to the rotation shaft of the mold thickness motor 31. Around the driven gear 37a and the driving gear 33 of the adjustment nut 37, a driving linear body 34 such as a chain or a toothed belt is wound around. Therefore, when the mold thickness motor 31 is driven and the driving gear 33 is rotated, the adjustment nuts 37 screwed into the screw portions 36 of the tie bars 16 are rotated in synchronization. Thereby, the mold thickness motor 31 can be rotated by a predetermined number of rotations in a predetermined direction, and the toggle support 15 can be advanced and retracted by a predetermined distance. The mold thickness motor 31 is preferably a servo motor, and includes a mold clamping position sensor 32 as an encoder that detects the number of rotations.

  The means for transmitting the rotation of the mold thickness motor 31 to the adjustment nut 37 may be any means as long as the adjustment nut 37 screwed into the screw portion 36 of the tie bar 16 can be rotated in synchronization. For example, instead of the driving linear body 34, a large-diameter gear that engages all of the driving gear 33 and the driving gear 33 may be rotatably disposed at the rear end of the toggle support 15.

  In the present embodiment, a mold clamping force sensor 18 is disposed on one of the tie bars 16. The mold clamping force sensor 18 is a sensor that detects distortion (mainly elongation) of the tie bar 16. The tie bar 16 is applied with a tensile force corresponding to the mold clamping force during mold clamping, and extends slightly in proportion to the mold clamping force. Therefore, the mold clamping force actually applied to the mold apparatus 11 can be known by detecting the extension amount of the tie bar 16 by the mold clamping force sensor 18.

  The above-described mold clamping force sensor 18, mold opening / closing position sensor 27, mold clamping motor 26 and mold thickness motor 31 are connected to the control device 19, and the detection signals output from the mold clamping force sensor 18 and the mold opening / closing position sensor 27 are controlled. Sent to device 19. The control device 19 controls the operations of the mold clamping motor 26 and the mold thickness motor 31 based on the detection signal.

  Here, an operation during normal molding will be described. When the mold clamping motor 26 is driven in the forward direction, the ball screw shaft 25 is rotated in the forward direction, and the ball screw shaft 25 is moved forward (moved in the left direction in FIG. 1) as shown in FIG. Accordingly, when the cross head 24 is advanced and the toggle mechanism 20 is operated, the movable platen 13 is advanced.

  When the movable mold 11b attached to the movable platen 13 comes into contact with the fixed mold 11a (mold closed state), the mold clamping process is started. In the mold clamping process, the mold clamping force is generated in the mold 11 by the toggle mechanism 20 by further driving the mold clamping motor 26 in the forward direction.

  And the injection drive part provided in the injection apparatus which is not shown in figure is driven, and a screw advances, The molten resin is filled in the cavity space formed in the metal mold | die 11. FIG. When opening the mold, when the mold clamping motor 26 is driven in the reverse direction, the ball screw shaft 25 is rotated in the reverse direction. Accordingly, when the cross head 24 is retracted and the toggle mechanism 20 is operated, the movable platen 13 is retracted.

  When the mold opening process is completed, an ejector driving unit (not shown) is driven, and the ejector device attached to the movable platen is operated. Thereby, an ejector pin protrudes and the molded article in the movable mold 11b protrudes from the movable mold 11b. Simultaneously with the driving of the ejector drive unit, the molded product take-out machine 40 as the gripping means is driven, and the arm 40a of the molded product take-out machine 40 enters between the fixed mold 11a and the movable mold 11b, and the molded product is moved. Stop at the extraction position. The molded product protruding from the movable mold 11b by the advancement of the ejector pin is gripped and taken out by the arm 40a of the molded product take-out machine 40, and is conveyed to a conveyor device as a conveying means provided outside the injection molding machine. Is done. In the present embodiment, an example of measuring the posture or the like of the movable mold 11b in the mold clamping device 10 will be described. For the measurement, a position measurement system not shown in FIG. 1 is used.

  FIG. 2 is a diagram illustrating a configuration example of the position measurement system according to the embodiment of the present invention. In FIG. 2, the position measurement system 1 includes a measurement device 110, an imaging device 120, a light source 130, and the like.

  The imaging device 120 includes a CCD camera 121, a telecentric lens 122, and the like. For example, a general digital camera may be used. The imaging device 120 is disposed or disposed above the fixed mold 11a and the movable mold 11b, and the object 140 (the upper surface of the fixed mold 11a and the upper surface of the movable mold 11b) is substantially orthogonal to the mold opening / closing direction, for example. By capturing an image from the direction, electronic image information (hereinafter, “image data”) of the subject 140 is acquired, and the image data is supplied (transferred) to the measurement apparatus 110. In general, the CCD camera 121 and the telecentric lens 122 are arranged so as to be in focus with respect to the subject 140. However, in this embodiment, the subject 140 (particularly, a target mark TM described later) is a lens. Arranged so that it is out of focus (out of depth of focus).

  The upper surfaces of the fixed mold 11a and the movable mold 11b form, for example, a horizontal plane, and a mark for measuring the posture of the movable mold 11b and the like is provided on each upper surface (added). ). The fixed mold 11a is provided with three reference marks BM1, BM2, and BM3 (hereinafter collectively referred to as “reference mark BM”). The movable mold 11b is provided with two target marks TMa and TMb (hereinafter collectively referred to as “target marks TM”). The two target marks TM are provided so as to have a deviation (distance) in at least a direction (vertical direction in the drawing) substantially orthogonal to the mold opening / closing direction. The distance is preferably larger as long as it falls within the angle of view.

  In this embodiment, in order to clarify the contrast between each mark and the upper surface of the fixed mold 11a or the movable mold 11b, a reference area 160 is provided on the upper surface of the fixed mold 11a, Is provided with a reference mark BM. Further, target regions 170a and 170b (hereinafter collectively referred to as “target region 170”) are provided on the upper surface of the movable mold 11b, and the target mark TMa is provided in the target region 170a, and the target mark TMb is provided in the target region 170b. Is provided. The reference region 160 and the target region 170 may be formed by attaching a thin plate or the like to the upper surface of the fixed mold 11a or the movable mold 11b.

  The reference area 160 and the target area 170 preferably have uniform background brightness. For example, a mirror other than polished metal or ceramic is suitable. Each mark may be provided by printing or drilling so that a difference in luminance from the background (the reference area 160 or the target area 170) is clear.

  The light source 130 irradiates the subject 140 with appropriate brightness when the imaging device 120 images the subject 140. When the target area 170 is a mirror surface, the light source 130 may be installed coaxially with the imaging device 120. The light quantity of the light source 130 is adjusted so that the difference in luminance between the target area 170 and the target mark TM is clear.

  The measuring device 110 is configured by an information processing device such as a PC (Personal Computer). The measuring device 110 is connected to the imaging device 120 via the cable 180, and measures the attitude and the like of the movable mold 11b based on image data transferred from the imaging device 120.

  The measuring device 110 will be described in more detail. FIG. 3 is a diagram illustrating a hardware configuration example of the measurement device according to the embodiment of the present invention. 3 includes a drive device 100, an auxiliary storage device 102, a memory device 103, a CPU 104, an interface device 105, a display device 106, and an input device 107, which are mutually connected by a bus B. And is configured to have.

  A program that realizes processing in the measurement apparatus 110 is provided by a recording medium 101 such as a CD-ROM. When the recording medium 101 on which the program is recorded is set in the drive device 100, the program is installed from the recording medium 101 to the auxiliary storage device 102 via the drive device 100. The auxiliary storage device 102 stores the installed program and also stores necessary files and data.

  The memory device 103 reads the program from the auxiliary storage device 102 and stores it when there is an instruction to start the program. The CPU 104 realizes functions related to the measurement device 110 according to a program stored in the memory device 103. The interface device 105 is used as an interface for connecting to a cable between the imaging device 120 and the subject 140 in FIG. For example, an image processing board may be used as the interface device 105. The display device 106 displays a GUI (Graphical User Interface) or the like by a program. The input device 107 includes a keyboard and a mouse, and is used for inputting various operation instructions.

  The program need not be installed from the recording medium 101 and may be downloaded from another computer via a network.

  FIG. 4 is a diagram illustrating a functional configuration example of the measurement apparatus according to the embodiment of the present invention. In FIG. 4, the measurement apparatus 110 includes an imaging control unit 112, a position measurement unit 113, an operation image generation unit 114, and the like. Each of these units is realized by processing that the program causes the CPU 104 to execute.

  The imaging control unit 112 outputs an imaging command to the imaging device 120 and takes captured image data from the imaging device 120.

  The position measurement unit 113 measures the position of the target mark TM at a plurality of points in the process of moving the movable mold 11b based on image data captured by the imaging device 120. The position measurement unit 113 includes an image processing unit 1131, a light / dark distribution calculation unit 1132, a position determination unit 1133, and the like. The motion image generation unit 114 derives the posture of the movable mold 11b at each time point based on the position information of the target mark TM at each time point measured by the position measurement unit 113, and generates (constructs) a motion image based on the posture. ) The display unit 115 displays information generated by the operation image generation unit 114 on the display device 106.

  Hereinafter, the operation of the position measurement system 1 will be described. FIG. 5 is a flowchart for explaining the operation of the position measurement system. In the following flowchart, measurement of the posture of the movable mold 11b in the mold closing process (including the start of the mold clamping process) will be described for convenience.

  At a plurality of points in the mold closing process, the imaging control unit 112 outputs a command to the imaging device 120 to image the subject 140 (S101). The imaging device 120 starts imaging from a state in which both the reference mark BM and the target mark TM are within the angle of view, and is predetermined until at least the fixed mold 11a and the movable mold 11b are brought into contact and sufficient clamping force is applied. The imaging is continued at a period of. Therefore, a plurality of image data is captured, and the imaging time is recorded for each image data. At this time, the imaging device 120 obtains a light / dark distribution (density distribution) by the target mark TM so that the background of the target mark TM, the reference mark BM, and each mark is out of focus depth (so as to be out of focus). To capture the image. The focus of the imaging device 120 may be set in advance so that the target mark TM is outside the depth of focus. Note that the instruction to the imaging device 120 by the imaging control unit 112 may be performed in response to an instruction input by an operator, or the control device 19 and the measurement device 10 are connected via a network or the like, and the control device 19 may be automatically performed when the position control information of the movable mold 11b (movable platen 13) from 19 indicates a predetermined position. Alternatively, it may be performed manually by the operator directly operating the imaging device 120. In this case, the imaging control unit 112 does not need a command from.

  Subsequently, the imaging control unit 112 acquires a plurality of pieces of image data at a plurality of time points and information indicating the imaging times from the imaging device 120, and records them in the memory device 103 of the measuring device 110 (S102).

  Subsequently, the image processing unit 1131 sets one of a plurality of image data recorded in the memory device 103 as a processing target (S103). Thereafter, steps S104 to S108 are executed for the image data to be processed.

  FIG. 6 is a diagram illustrating an example of a captured image. In FIG. 6, the same components as those in FIG. As shown in FIG. 6, the image (angle of view) 200 includes images of the upper surfaces of the fixed mold 11a and the movable mold 11b. Images of the reference region 160 and the reference mark BM are included on the upper surface of the fixed mold 11a. Images of the target area 170 and the target mark TM are included on the upper surface of the movable mold 11b. In the drawing, the target mark TM and the reference mark BM are clearly shown for convenience. However, as described above, since these marks and the background thereof are captured outside the depth of focus, they are actually included in the image 200 in a defocused (blurred) state.

  Subsequently, from the image 200, the image processing unit 1131 includes rectangular areas including the target marks TMa or TMb in the target areas 170a and 170b (hereinafter referred to as “processing target range 171a” and “processing target range 171b”, respectively). The processing target range 171 is referred to as a generic name, and the parameters for specifying the range of each processing target range 171 are recorded in the memory device 103 (S104). The parameter may be, for example, the coordinate value of any one of the four vertices if the vertical and horizontal sizes of the processing target range 171 are determined in advance. Further, all the coordinate values of the four vertices may be used. In the present embodiment, the vertical and horizontal sizes are determined, and the coordinate value (X11, Y11) of the upper left vertex TP1 of the processing target range 171a and the upper left vertex TP2 (X22, Y22) of the processing target range 171b are obtained. Take the case of recording as an example. The coordinate value is a coordinate value in the coordinate system 210 of the image 200. That is, it is a coordinate value in a coordinate system in which the upper left vertex of the image 200 is (0, 0) and the unit is a pixel. Hereinafter, the coordinate system is referred to as “viewing angle coordinate system”.

  The image processing unit 1131 also includes a rectangular area (processing target range 161a, processing target range 161b, processing target range 161c, and so on) that includes the reference mark BM in the reference area 160 for each reference mark BM. In this case, the processing target range 161 is cut out, and a parameter for specifying the area of each processing target range 161 is recorded in the memory device 103.

  By the way, the extraction of the processing target range 171 by the image processing unit 1131 may be performed based on, for example, coordinate values that the control device 19 should have controlled the position of the movable mold 11b. That is, the image processing unit 1131 calculates the coordinate value of the target mark TM in the image 200 based on the coordinate value, and based on the calculation result, the position (the vertex TP1 and the vertex TP2) of the processing target range 171 in the image 200 is calculated. Coordinate value).

  However, since the position of the coordinate value of the processing target range 161 related to the reference mark BM is fixed, for example, the value may be recorded in advance in the auxiliary storage device 102 and used.

  Subsequently, the image processing unit 1131 performs the fill processing for each of the processing target range 171 and the processing target range 161 (S105). That is, for the purpose of noise removal, processing such as a low-pass filter or a contraction / expansion operation is performed. Note that the filtering process may be omitted depending on the state of the image 200.

  Subsequently, the light / dark distribution calculation unit 1132 calculates the light / dark distribution for each of the processing target range 171 and the processing target range 161, and calculates or determines the detection position of the target mark TM or the reference mark BM based on the light / dark distribution ( S106).

  Specifically, as a first method, the center of gravity is calculated for each of the processing target range 171 and the processing target range 161, and the center of gravity calculated as a result is set as the detection position. That is, the position of the center of gravity of the processing target range 171 is the detection position of the target mark TM. Similarly, the barycentric position of the processing target range 161a, the barycentric position of the processing target range 161b, and the barycentric position of the processing target range 161c are the detection positions of the reference mark BM1, the reference mark BM2, and the reference mark BM3, respectively.

  The center of gravity calculation may be performed based on the following formula.

ここで、各パラメータの意味は以下の通りである。
Ｘ_G：処理対象範囲の重心位置
ｘ_ｎ：処理対象範囲内のｎ番目の画素の位置
ｄ_ｎ：ｎ番目の画素の輝度
なお、輝度の闘値を設けてそれより大きい輝度を有する画素のみで重心演算を行うことにより、背景の影響を低減させるようにしてもよい。

Here, the meaning of each parameter is as follows.
X _G : The barycentric position x _{n of the} processing target range x _n : The position of the n-th pixel in the processing target range d _n : The luminance of the n-th pixel You may make it reduce the influence of a background by performing a gravity center calculation.

  In addition, as a second method, a light and dark peak value may be detected for each of the processing target range 171 and the processing target range 161, and a position where the peak value is detected may be set as a detection position of each mark.

  The detection position is expressed by a coordinate value (that is, a pixel position in the processing target range) in a coordinate system within the processing target range (hereinafter referred to as “processing target range coordinate system”). For example, FIG. 7 is a diagram for explaining the detection position of the target mark.

  In the example in the figure, an example in which the detection position of the target mark TMa is determined as (X12, Y12) is shown. Here, (X12, Y12) indicates the number of pixels in the X direction and the Y direction from the upper left vertex TP1 of the processing target range 171a. In the figure, the coordinate value (X11, Y11) of the upper left vertex TP1 is indicated by the coordinate value in the view angle coordinate system, but is (0, 0) in the processing target range coordinate system.

  Similarly, the detected values of the target mark TMb and each reference mark BM are expressed by coordinate values in the respective processing target range coordinate systems.

  In this embodiment, for each mark, an “out-of-focus” “blurred” image is obtained, and therefore edge detection and pattern matching are not suitable for detecting the position of the mark.

Subsequently, the position determination unit 1133 adds the coordinate value in the angle-of-view coordinate system of the upper left vertex of each processing target range to the coordinate value in the angle-of-view coordinate system with respect to the coordinate value of the detection position of each mark. Conversion is performed (S107). Therefore, for example, according to the example of FIG. 6, the coordinate values (X10, Y10) of the view angle coordinate system of the target mark TMa are as follows.
X10 = X11 + X12
Y10 = Y11 + Y12
Subsequently, the position determination unit 1133 converts the coordinate value of the target mark TM from the view angle coordinate system to a coordinate system defined by the three reference marks BM (hereinafter referred to as “reference mark coordinate system”) (S108). .

  Here, when the coordinate values of the view angle coordinate system of the reference marks BM1, BM2, and BM3 are (X000, Y000), (X001, Y001), (X002, Y002), the reference mark BM1 (X000, Y000) is set. A coordinate system having the origin, the vector (X000, Y000) → (X001, Y001) as the X basis vector, and the vector (X000, Y000) → (X002, Y002) as the Y basis vector corresponds to the reference mark coordinate system.

  Therefore, in step S108, the coordinate values (X10, Y10) of the field angle coordinate system of the target mark TMa and the coordinate values (X20, Y20) of the field angle coordinate system of the target mark TMb are the coordinate values of the reference mark coordinate system. Is converted to

  By executing the processing from step S103 to S108 on the image data at each time point (S109), information as shown in FIG. 8, that is, the reference mark coordinate system of each target mark TM at each time point is obtained. A coordinate value (detection position) is obtained.

  FIG. 8 is a diagram showing the detection position of each target mark in the reference mark coordinate system at each time point. In the figure, each point indicated by An (n is an integer) indicates the detection position of the target mark TMa at each time point. Each point indicated by Bn (n is an integer) indicates the detection position of the target mark TMb at each time point. Note that n in An and Bn is a number for identifying a time point and is in ascending order as time passes. Therefore, A1 and B1 indicate detection positions of the target mark TMa or TMb at the same time point. It is assumed that the detection position of the target mark TMa does not change after A7, and the detection position of the target mark TMb does not change after B5. Here, “no change occurs” includes that the change is within a predetermined threshold.

  Subsequently, the motion image generation unit 114 calculates an approximate straight line of the trajectory of each target mark TM based on the detection position of each target mark TM in a period in which the fixed mold 11a and the movable mold 11b are not in contact with each other. (S110). During the period when the mold is not in contact, both target marks TM are considered to draw a linear locus. Therefore, the approximate curve LA of the trajectory of the target mark TMa is calculated based on A1 to A3, and the approximate curve LB of the trajectory of the target mark TMb is calculated based on B1 to B3.

  Subsequently, the motion image generation unit 114 corrects each detection position (An, Bn) based on the detection position (A7, B5) and the approximate lines LA and LB at the time when the change in the detection position no longer occurs. Thus, the posture of the movable mold 11b at each time point is estimated, and an operation image of the movable mold 11b is constructed (S111).

  FIG. 9 is a diagram illustrating a method for constructing an operation image of a movable mold. In the figure, A0 indicates the detection position of the target mark TMa after A7, and B0 indicates the detection position of the target mark TMb after B5.

  As shown in the figure, A0 and B0 are arranged on the Y axis orthogonal (substantially orthogonal) to the X axis (axis indicating the mold opening / closing direction), and straight lines LA0 and LB0 orthogonal to the Y axis from A0 and B0 are arranged. Generate. Straight lines LA0 and LB0 indicate operation straight lines for using the movable mold 11b.

  Subsequently, conversion is performed to make the approximate lines LA and LB parallel (substantially parallel) to LA0 and LB0 (that is, to the X axis) while maintaining the relative positional relationship between the respective detection positions. Is performed on the coordinate value of each detection position (coordinate value in the coordinate system shown in FIG. 9). Each detection position is corrected as shown in FIG. Note that the approximate curves LA and LB are parallel to the X axis because the movement direction of the movable mold 11b in a state where the mold is not in contact is parallel to the X axis. This is to make the image easy to see. Therefore, if the visibility is not taken into consideration, the approximate curve may not necessarily be parallel to the X axis. In this case, conversion for arranging A0 and B0 on the Y axis may be performed on the coordinate value of each detection position while maintaining the relative positional relationship between the detection positions.

  Each corrected detection position indicates the attitude of the movable mold 11b at each time point with reference to the attitude of the movable mold 11b in a state where the mold clamping force is sufficiently applied (mold clamping state). That is, even if the movable mold 11b has an inclination in the moving process of the movable mold 11b, in the mold clamping state, the opposing surface of the movable mold 11b to the fixed mold 11a is moved by the movable mold 11b. There is an empirical fact that it is approximately perpendicular to the direction. Therefore, in the present embodiment, in accordance with such an empirical rule, the detection position of the target mark TM (A7 and later (A0), B5 and later (B0)) in the mold clamping state is arranged on the Y axis. In addition, since the movement amount in each part in the movable mold 11b becomes very small in the mold clamping state, it is determined that the mold clamping state is after A7 and B5.

  By disposing A0 and B0 on the Y axis, a shift between the position where the target mark TMa is added and the position where the target mark TMb is added is absorbed. Therefore, even if the two target marks TM are not added at symmetrical positions, it is possible to obtain a highly accurate attitude of the movable mold 11b.

  Subsequently, the display unit 115 causes the display device 106 to display a view showing the operation image (posture) of the movable mold 11b based on the calculation result by the operation image generation unit 114. For example, each detection position may be displayed by a corrected coordinate value (in a format as shown in FIG. 9). By doing so, the shift | offset | difference etc. of the locus | trajectory of the movable metal mold | die 11b can be shown easily.

  Further, as shown in FIG. 9, a line segment connecting the detection position of the target mark TMa and the target mark TMb at the same time may be displayed. The inclination of the line segment indicates the inclination (rotation angle) of the movable mold 11b at that time. Therefore, the posture (inclination) of the movable mold 11b at each time point can be clearly shown by the line segment.

  However, the diagram showing the operation image (posture) may be output at least so as to be visible. Therefore, printing may be performed by a printer or the like instead of the display device 106.

  By displaying a diagram as shown in FIG. 9, it is possible to observe a shift in the state in the initial state (A1 and B1). Therefore, by correcting the deviation in the initial state, the movable mold 11b can be fed more appropriately. However, there is no absolute standard as to what is appropriate, and a deviation from a desired posture or motion image is corrected. For example, in FIG. 9, when the operation image indicated by the straight lines LA0 and LB0 is ideal, the movable mold 11b may be adjusted counterclockwise on the drawing and adjusted to translate upward. . Furthermore, in order to evaluate the details, the distance in the direction to be grasped should be displayed in an enlarged manner. Specifically, by reducing the distance of A0-B0 relatively, the front-rear direction to A6-A1 and B6-B1 Can be displayed relatively large. Thus, the adjustment can be easily performed by displaying the display of the direction to be grasped for adjustment relatively larger than the other directions.

  Note that when it is necessary to check only the posture in the initial state, it is not always necessary to perform imaging periodically a plurality of times; the time points of A1 and B1 and the clamped state (time points after A7 and B5). Imaging may be performed only once.

Moreover, although the example which produces | generates the operation | movement image at the time of a mold closing was demonstrated above, the measurement of the attitude | position of the movable metal mold | die 11b at the time of a mold opening or construction | assembly of an operation | movement image may be performed similarly. That is, posture measurement or the like may be performed based on image data captured at least at the mold clamping state and at a predetermined time after the mold opening is started. An example in which the reference region 160 is provided is shown. Therefore, it is necessary to image so that the two target marks TM are included in the same angle of view at the time of imaging. In this case, depending on the size of the mold and the distance between the two target regions 170, it is necessary to image the mold from a distance, and the accuracy of the image may be relatively deteriorated.

  Therefore, a reference area 160 may be provided for each target area 170. FIG. 10 is a diagram illustrating an example in which a reference area is provided for each target area. In FIG. 10, the same parts as those in FIG.

  In FIG. 10, a reference area 160a is provided for the target area 170a, and a reference area 160b is provided for the target area 170b.

  In this case, two imaging devices 120 are used to image each of the two sets of the reference region 160 and the target region 170. FIG. 11 is a diagram illustrating an arrangement example of two imaging devices.

  In the same figure, (A) is the figure seen from the front direction (direction shown by arrow a1 in FIG. 10) of the fixed mold 11a, (B) is the side direction (in FIG. 10) of the movable mold 11b. It is the figure seen from the direction (shown by arrow ab). As shown in the figure, the imaging device 120a captures an angle of view (hereinafter referred to as “view angle A”) including the reference region 160a and the target region 170a, and the imaging device 120b includes the reference region 160b and the target region. An angle of view including 170b (hereinafter referred to as “angle of view B”) is imaged.

  FIG. 12 is a diagram illustrating the angle of view of each of the two imaging devices. In FIG. 12, the same parts as those in FIG. In FIG. 12, the angle of view A and the angle of view B are each indicated by a broken-line rectangle.

  Imaging by the two imaging devices 120 is performed simultaneously at each time point. Therefore, at each time point, image data related to the angle of view A and image data related to the angle of view B are obtained.

  In this case, the processing from steps S103 to S108 in FIG. 5 is performed for each of the image data related to the angle of view A and the image data related to the angle of view B at each time point. As a result, the detection position of the target mark TMa at each time point is calculated as a coordinate value in a reference mark coordinate system (hereinafter referred to as “reference mark coordinate system A”) defined based on the reference marks BM1a, BM2a, and BM3a. Is done. The detection position of the target mark TMb at each time point is calculated as a coordinate value in a reference mark coordinate system (hereinafter referred to as “reference mark coordinate system B”) defined based on the reference marks BM1b, BM2b, and BM3b. The That is, the detection positions of the two target marks TM are obtained as coordinate values of different coordinate systems. This is different from the case where the number of the imaging device 120 is one.

  FIG. 13 is a diagram illustrating the position of each target mark in each reference mark coordinate system at each time point. In the figure, (A) shows the detection position of the target mark TMa in the reference mark coordinate system A. (B) shows the detection position of the target mark TMb in the reference mark coordinate system B. In addition, the meaning of the code | symbol with respect to the detection position in the same figure is the same as FIG.

  However, even if the coordinate systems to which the two target marks TM belong are different, the processing content executed by the motion image generation unit 114 may be the same as when the imaging device 120 is one (when the angle of view is one).

  In other words, the motion image generation unit 114 determines the approximate straight line of the trajectory of each target mark TM based on the detection position of each target mark TM during the period when the fixed mold 11a and the movable mold 11b are not in contact with each reference. Calculation is performed in the mark coordinate system (S110).

  Subsequently, the motion image generation unit 114 corrects each detection position (An, Bn) based on the detection position (A7, B5) and the approximate lines LA and LB at the time when the change in the detection position no longer occurs. Thus, the posture of the movable mold 11b at each time point is estimated, and an operation image of the movable mold 11b is constructed (S111).

  FIG. 14 is a second diagram illustrating a method for estimating the posture of the movable mold at each time point. The meaning of each symbol in FIG. 14 is the same as that in FIG.

  As shown in the figure, A0 and B0 are arranged on the Y axis orthogonal to the X axis. That is, each detection position in a different coordinate system is transferred to the same coordinate system. At this time, the relative positional relationship between A0 and B0 may be determined based on the distance (measured value) between the target mark TMa and the target mark TMb. Subsequently, straight lines LA0 and LB0 orthogonal to the Y axis are generated from A0 and B0. Straight lines LA0 and LB0 indicate operation straight lines for using the movable mold 11b.

  Subsequently, conversion is performed to make the approximate lines LA and LB parallel (substantially parallel) to LA0 and LB0 (that is, to the X axis) while maintaining the relative positional relationship between the respective detection positions. Is performed on the coordinate value of each detection position (coordinate value in the coordinate system shown in FIG. 9). Each detection position is corrected as shown in FIG. When two imaging devices 120 are used, the reason why the approximate curves LA and LB are parallel to the X axis is not only to make the operation image of the movable mold 11b easy to see, but also to two reference marks. There is also the purpose of correcting the shift of the coordinate system.

  That is, in the present embodiment, it is not assumed that the two imaging devices 120 are arranged in exactly the same direction. Also, it is not assumed that the basis vectors of the two reference mark coordinate systems are the same. Therefore, the directions of the base vectors of the two reference mark coordinate systems are likely to be shifted. Therefore, by making the approximate curves LA and LB parallel to the X-axis, the visibility of the operation image is ensured and the deviation between the two reference mark coordinate systems is corrected.

  By making the approximate curves LA and LB parallel, the deviation between the two reference mark coordinate systems is corrected when the trajectories of the two target marks TM are parallel when the mold is not in contact. Based on the idea that it is reasonable to assume. That is, the fact that the trajectories of the two target marks TM are not parallel means that the movable mold 11b is deformed, and the occurrence of such a situation is unlikely in the state where the mold is not in contact. .

  Subsequent processing contents may be the same as in the case where there is one imaging device 120.

  In the above, the example in which the position of the movable mold 11b is measured based on the image picked up from the upper surface of the movable mold 11b and the like is shown, but the target mark TM is added to the side surface of the movable mold 11b. The reference mark BM may be added to the side surface of the fixed mold 11a and the side surface may be imaged by the imaging device 110. In this case, the displacement of the movable mold 11b on the side surface can be observed.

  Furthermore, both the upper surface and the side surface may be imaged, and the position of the movable mold 11b on both sides may be measured. In this case, the displacement of the movable mold 11b in three dimensions can be observed.

  Further, three or more target marks TM may be added to the movable mold 11b, and the above-described processing may be executed for each target mark. In this case, not only the inclination of the movable mold 11b but also deformation and the like can be detected.

  In the present embodiment, an example is shown in which the position of the movable mold 11b is measured using the target mark TM and the reference mark BM. However, instead of the mark, a point light source is used, or laser reflected light is used. You may make it use.

  Further, the measuring device 100 and the control device 19 may be configured by one piece of hardware, and the measuring device 100 may be incorporated in the mold clamping device 10.

  Further, the target mark TM may be added not to the movable mold 11b but to a member that moves together with the movable mold 11b (for example, the movable platen 13 as a holding member of the movable mold 11b). Similarly, the reference mark BM may be added to a member that is not changed (fixed) with respect to the movement of the movable mold 11b instead of the fixed mold 11a. However, considering that the target mark TM and the reference mark BM are within the same angle of view, it is appropriate to add the respective marks to the movable mold 11b and the fixed mold 11a as in the present embodiment. I believe that.

  As described above, according to the present embodiment, the fixed mark 11a is provided with the reference mark BM, and imaging is performed so that the reference mark BM is included in the image together with the target mark TM. Then, the coordinate value of the detection position of the target mark TM is measured as a coordinate value in the reference mark coordinate system defined by the reference mark BM on the same image as the target mark TM. Moreover, the attitude | position and operation | movement image of the movable metal mold | die 11b are constructed | assembled based on such coordinate value.

  Therefore, even if there is a change such as expansion / contraction, inclination, and rotation in the captured image, the measurement result and the construction of the operation image of the movable mold 11b are not affected. For this reason, even when the imaging device 120 is operated with respect to the measurement target (movable mold 11b) (that is, the distance between the imaging device 120 and the subject 140 is changed, the imaging device 120 is tilted, or the imaging device 120 is Even in the case of rotation), the measurement result of the movable mold 11b with respect to the fixed mold 11a does not change, and the necessity of fixing the imaging device 120 can be eliminated. Therefore, for example, even an image captured by a person using a normal digital camera can be used for measuring the position of the movable mold 11b.

  In other words, when the imaging device 120 is fixed, the reference mark BM is not necessarily required (that is, conversion of the coordinate value of the target mark TM to the reference mark coordinate system is not necessary). In this case, if the relationship between the view angle coordinate system and the measurement plane coordinate system is obtained in advance by calibration or the like, the coordinate values of the target mark TM may be converted from the view angle coordinate system to the measurement plane coordinate system. .

  In the present embodiment, an example in which the target mark TM and the reference mark BM are imaged outside the focal depth is shown. However, the image is captured within the focal depth and is detected at the position of each mark detected by pattern matching or edge detection. Based on this, the position of the movable mold 11b may be measured.

  However, by imaging each mark outside the depth of focus as in the present embodiment, a highly accurate and stable measurement result can be obtained as follows. Furthermore, in order to evaluate the details as shown in FIG. 9, it is preferable to enlarge and display the distance in the direction to be grasped. Specifically, by reducing the distance A0-B0 relatively, A6 to A1 and B6 to The distance in the front-rear direction up to B1 can be displayed relatively large. Thus, the adjustment can be easily performed by displaying the display of the direction to be grasped for adjustment relatively larger than the other directions.

  FIG. 15 is a diagram for explaining the advantage of imaging the mark outside the depth of focus. In FIG. 15, (A) shows the case where it is in focus, and (B) shows the case where it is out of focus (out of the depth of focus).

  As shown in (A), when the camera is in focus, the camera pixel outputs in accordance with light rays from the corresponding narrow range of the imaging target. On the other hand, when the focus is removed as in the present embodiment, as shown in (B), the camera pixel is in a so-called “blurred” state that outputs in accordance with light rays from a wide range, Fine shape information such as the state of the edge, unevenness of the background surface of the mark, and the like hardly appears in the imaging result. In this state, in the position detection (position measurement), the influence of the condition of the subject and the state of the light ray is reduced, and becomes a factor for improving the stability of the measurement result.

  In addition, when the mark is in focus, if the mark moves, the output of limited pixels (pixels related to the boundary of the mark) will change abruptly. Since the output of the pixel continuously changes, the stability of the measurement result is improved and the resolution of the position measurement can be made smaller than the pixel.

  In addition, when the focus is not achieved, the influence on the imaging result when the distance between the imaging device and the subject changes is smaller than when the focus is achieved.

  In addition, the measurement apparatus 110 according to the present embodiment uses an algorithm that extracts a central point from dispersed information, such as centroid calculation and peak detection. Such an algorithm has high affinity with an image captured outside the depth of focus, and the detection position obtained as a result has high reproducibility regardless of changes in the amount of light and the focal length. This point will be described with reference to the drawings.

  FIG. 16 is a diagram for explaining inconvenience when the target mark is imaged within the depth of focus. FIG. 16 shows an image of the processing target range 171 when the target mark TM is taken within the depth of focus. As shown in FIG. 16, when an image is captured within the depth of focus, the background pattern or unevenness of the processing target range 171, noise N, and the like are clearly output to the image. Therefore, the influence of these pieces of information (patterns, noise N, etc.) becomes large during the centroid calculation and peak detection. For example, with respect to the noise N, the result of the center of gravity calculation is greatly shifted to the noise N side, or a peak is detected at the position of the noise N. In addition, the background pattern or the like and the noise N are changed in the manner of being output to the image depending on the change in the light amount or the focal length (including the inclination of the processing target range 171) (for example, the noise N is copied to the image depending on the light amount). May not be issued.) Therefore, there is a high possibility that the detection position (the center of gravity position or the peak detection position) changes each time an image is captured.

  On the other hand, when the target mark TM is imaged outside the focal depth as in the present embodiment, the background of the target mark TM is also out of the focal depth, so the background pattern, noise N, and the like are blurred. As a result, the influence of the background pattern, noise N, etc. on the centroid calculation and peak detection is reduced. Therefore, the detection position is unlikely to change greatly every time the image is taken (that is, the reproducibility of the detection position is high), and the movement amount can be calculated based on the stable detection position.

  In the position measurement, the movement of the measurement object and the movement of the detection position (the center of gravity position and the peak position) only need to correspond one-to-one, so that the “blurred” state deteriorates the detection accuracy. Not connected. That is, if the center of gravity or peak position is detected at the same position (substantially the same position) every time the movable mold 11b moves and images are taken, by paying attention to the relative movement of the detected position, The amount of movement or position can be measured with high accuracy.

  By the way, the telecentric lens usually has an advantage that the magnification does not change depending on the distance to the imaging target, but the magnification may change when the lens is out of focus as in the present invention. Even in such a case, the measurement result does not change according to the algorithm of the present invention.

  As mentioned above, although the Example of this invention was explained in full detail, this invention is not limited to such specific embodiment, In the range of the summary of this invention described in the claim, various deformation | transformation・ Change is possible.

It is the schematic of the mold clamping apparatus of the injection molding machine in embodiment of this invention. It is a figure which shows the structural example of the position measurement system in embodiment of this invention. It is a figure which shows the hardware structural example of the measuring device in embodiment of this invention. It is a figure which shows the function structural example of the measuring device in embodiment of this invention. It is a flowchart for demonstrating operation | movement of a position measurement system. It is a figure which shows the example of one imaged image. It is a figure for demonstrating the detection position of a target mark. It is a figure which shows the position in the reference mark coordinate system of each target mark in each time. It is a figure which shows the estimation method of the attitude | position of a movable metal mold | die at each time. It is a figure which shows the example which provided the reference | standard area | region for every target area | region. It is a figure which shows the example of arrangement | positioning of two imaging devices. It is a figure which shows each angle of view of two imaging devices. It is a figure which shows the position in each reference mark coordinate system of each target mark in each time. It is a 2nd figure which shows the estimation method of the attitude | position of a movable metal mold | die at each time. It is a figure for demonstrating the advantage of imaging a mark outside a depth of focus. It is a figure for demonstrating the inconvenience when a target mark is imaged within the depth of focus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Position measuring system 10 Mold clamping device 11 Mold device 12 Fixed platen 13 Movable platen 15 Toggle support 16 Tie bar 18 Clamping force sensor 19 Control device 20 Toggle mechanism 26 Mold clamping motor 27 Mold opening / closing position sensor 31 Mold thickness motor 32 Mold clamping Position sensor 40 Mold take-out machine 100 Drive device 101 Recording medium 102 Auxiliary storage device 103 Memory device 104 CPU
105 Interface device 106 Display device 107 Input device 110 Measurement device 112 Imaging control unit 113 Position measurement unit 114 Operation image generation unit 115 Display unit 120 Imaging device 121 CCD camera 122 Telecentric lens 130 Light source 140 Subject 160 Reference region BM, BM1, BM2, BM3 Reference mark 170 Target area TM Target mark 1131 Image processing unit 1132 Brightness / darkness distribution calculation unit 1133 Position determination unit B bus

Claims (11)

At least two first marks added to the movable mold of the mold clamping device or the movable mold holding member so as to have a deviation in a direction substantially perpendicular to the mold opening / closing direction, and the movement of the movable mold A plurality of image data captured at a time in the mold clamping state and a time in the moving process of the movable mold so as to include a second mark added to the fixing member of the mold clamping device fixed to the mold clamping device. For each, calculating means for calculating a coordinate value indicating a relative position of the first mark with respect to the second mark;
Correction means for correcting the coordinate value of the first mark with respect to the time point in the moving process based on the coordinate value of the first mark with respect to the time point in the mold clamping state;
A mold clamping device measuring system comprising: output means for outputting a view showing a posture of the movable mold in the moving process based on the corrected coordinate values so as to be visible.   The correction means performs the conversion for arranging the position of the first mark at the time in the mold clamping state on a straight line substantially perpendicular to the mold opening / closing direction of the first mark at the time in the moving process. 2. The measurement system for a mold clamping apparatus according to claim 1, wherein the measurement system is executed for coordinate values. The calculation means calculates the seating value of the first mark for each of a plurality of image data captured at a plurality of time points when a mold clamping force is not applied in the movement process of the mold,
The correcting means uses the approximate line based on the coordinate value of the first mark at a plurality of time points when no clamping force is applied as a reference, and calculates the coordinate value of the first mark at the time point in the moving process. The measuring system for a mold clamping apparatus according to claim 2, wherein correction is performed.   The correction means performs transformation for converting the approximate straight line into a straight line substantially parallel to the mold opening / closing direction with respect to the coordinate value of the first mark at the time of the moving process. Item 4. The mold clamping device measurement system according to Item 3.   The second mark is provided for each of the first marks, and the image data is imaged by a different imaging device for each set of the first mark and the second mark. 3. The mold clamping device measuring system according to 3 or 4. The image data is obtained by capturing at least the first mark outside the depth of focus,
A light / dark distribution calculating means for calculating a light / dark distribution of an area including the first mark in the image data;
6. The mold clamping device according to claim 1, wherein the calculation unit calculates a relative position with respect to the second mark with respect to a position specified based on the brightness distribution. system. The light / dark distribution calculating means calculates a barycentric position of an area including the first mark,
The measurement system for a mold clamping apparatus according to claim 6, wherein the calculation unit calculates a relative position of the center of gravity position with respect to the second mark. The light / dark distribution calculating means detects a light / dark peak value of an area including the first mark,
The measurement system for a mold clamping apparatus according to claim 6, wherein the calculation unit calculates a relative position with respect to the second mark with respect to a position indicating the peak value.   9. The measuring system for a mold clamping apparatus according to claim 1, wherein the output means outputs the distance in the moving direction relatively shorter than the distance between the plurality of marks. A method of measuring a mold clamping device executed by a computer,
At least two first marks added to the movable mold of the mold clamping device or the movable mold holding member so as to have a deviation in a direction substantially perpendicular to the mold opening / closing direction, and the movement of the movable mold A plurality of image data captured at a time in the mold clamping state and a time in the moving process of the movable mold so as to include a second mark added to the fixing member of the mold clamping device fixed to the mold clamping device. For each, a calculation procedure for calculating a coordinate value indicating a relative position of the first mark with respect to the second mark;
A correction procedure for correcting the coordinate value of the first mark with respect to the time point in the moving process based on the coordinate value of the first mark with respect to the time point in the mold clamping state;
A method for measuring a mold clamping device, comprising: an output procedure for outputting a view showing a posture of the movable mold in the movement process so as to be visible based on the corrected coordinate value. On the computer,
At least two first marks added to the movable mold of the mold clamping device or the movable mold holding member so as to have a deviation in a direction substantially perpendicular to the mold opening / closing direction, and the movement of the movable mold A plurality of image data captured at a time in the mold clamping state and a time in the moving process of the movable mold so as to include a second mark added to the fixing member of the mold clamping device fixed to the mold clamping device. For each, a calculation procedure for calculating a coordinate value indicating a relative position of the first mark with respect to the second mark;
A correction procedure for correcting the coordinate value of the first mark with respect to the time point in the moving process based on the coordinate value of the first mark with respect to the time point in the mold clamping state;
A measurement program for a mold clamping device for executing an output procedure for outputting a view showing a posture of the movable mold in the movement process so as to be visible based on a corrected coordinate value.

Images