JP2009283623A - Soldering device and soldering method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering device and a soldering method which suppress the occurrence of deficiencies such as bridges and solder balls. <P>SOLUTION: A soldering device 10 includes a trowel 21 for actual heating and a trowel 31 for post-heating which heats solder melted by the trowel 21 to keep the solder in a melted state for an optional time. The trowel 31 for post-heating is controlled so as to start heating at a first terminal 12a immediately after the trowel 21 for actual heating passes through the first terminal 12a, and is controlled so as to leave the first terminal 12a to terminate heating after solder melted in an arrangement portion of the first terminal 12a by the trowel 31 for post-heating and solder melted in an arrangement portion of a second terminal 12b by the trowel 21 for actual heating are parted by surface tension, whereby the trowel 31 for post-heating heats terminals 12a, 12b, 12c, 12d, etc., consecutively after the trowel 21 for actual heating. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a soldering apparatus and a soldering method, and more particularly to a technique for continuously pulling and soldering a plurality of terminals arranged on a board to the board.

  Conventionally, in a soldering apparatus that continuously pulls and solders a plurality of terminals arranged on a board to the board, there may be a problem that solder remains between adjacent terminals. there were.

  Hereinafter, the problems in the prior art will be described in detail with reference to FIGS. FIGS. 8A, 8B, 9A, and 9B are a plan view and a side view showing a “bridge” and a “solder ball”, which are defects in the prior art, respectively.

A plurality of terminals to be soldered are continuously arranged on the substrate shown in FIG. Then, as shown in FIGS. 8 (a) and 8 (b), the solder melted in the soldering iron at the portion where each terminal is arranged is divided by the surface tension of the solder itself and tends to shrink to the respective terminal side. To do.
However, when the time for solidification due to the temperature drop of the solder is shorter than the time for separation due to the surface tension of the solder, a state in which the solder with increased viscosity connects between adjacent terminals (hereinafter referred to as “bridge”) occurs. However, the bridge causes an electrical short circuit.
On the other hand, as shown in FIGS. 9A and 9B, when the solder is divided by the surface tension, if the viscosity is increased due to a decrease in the temperature of the solder, a part of the solder remains without being contracted. (Hereinafter referred to as “solder ball”) occurs, and the solder ball remains as a foreign object between adjacent terminals.

  In order to solve the above-described problems, conventionally, in a soldering apparatus for soldering terminals continuously arranged on a substrate to the substrate, a technique for suppressing an increase in the viscosity of the solder has been proposed (for example, , See Patent Document 1).

According to the prior art, by supplying a non-oxidizing gas, the surface oxidation of the solder, which contributes to the increase in viscosity, is prevented. However, the effect on the viscosity increase is that the temperature decrease as described above is larger than the surface oxidation of the solder, and the conventional technology does not disclose a countermeasure for the temperature decrease.
JP-A-6-315766

  In view of the above, the present invention proposes a soldering apparatus and a soldering method that suppress the occurrence of defects such as bridges and solder balls.

  The problems to be solved by the present invention are as described above. Next, means for solving the problems will be described.

  That is, according to the first aspect of the present invention, the solder is supplied to the terminal arrangement portion of the board on which the plurality of terminals are arranged, and the solder is heated and melted by a soldering iron, whereby the plurality of terminals are attached to the board. A soldering apparatus for continuously pulling and soldering to a main heating iron for melting the solder, the solder melted by the main heating iron, and heating the solder for an arbitrary time And a post-heating means for maintaining the melted state only, the post-heating means starts heating the first terminal immediately after the main heating iron passes through the first terminal. The post-heating means melts the solder held in the molten state at the first terminal arrangement portion and the second heating terminal arrangement portion adjacent to the first terminal by the main heating iron. Or Then, after being divided by the surface tension, the terminal is continuously controlled by following the main heating iron by controlling the heating of the first terminal by the post-heating means to be finished. Is to heat.

  According to a second aspect of the present invention, the post-heating means is composed of any one of a soldering iron, a hot air heater, and a laser irradiation machine.

  According to a third aspect of the present invention, the post-heating means is constituted by a soldering iron, and the post-heating means includes the soldering iron while the main heating iron melts the solder at the portion where the second terminal is disposed. Solder held in a molten state by the post-heating means in the arrangement portion of the first terminal by moving in the direction opposite to the traveling direction of the main heating iron in the arrangement portion of the first terminal The main heating iron is controlled so as to divide the solder melted at the portion where the second terminal is disposed.

  According to a fourth aspect of the present invention, the post-heating means is constituted by a soldering iron, and the post-heating means includes the first heating iron while the main heating iron melts the solder at the portion where the second terminal is disposed. The second terminal is arranged by the main heating iron and the solder held in the molten state in the first terminal arrangement part by the post-heating means by rotating at the one terminal arrangement part. It is controlled so as to divide the solder melted at the installed portion.

  According to claim 5, the solder is supplied to the terminal arrangement portion of the board on which the plurality of terminals are arranged, and the solder is heated and melted by a soldering iron so that the plurality of terminals are attached to the board. A soldering method of continuously pulling and soldering, wherein a soldering iron for main heating melts the solder at an arrangement portion of each terminal, and a post-heating means includes the main heating A post-heating step of heating the solder melted by the soldering iron and holding the solder in a melted state for an arbitrary time, wherein the main heating soldering iron is a first heating iron. A solder which is started at the first terminal immediately after passing through the terminal and held in a melted state by the post-heating means at the portion where the first terminal is disposed, and the main heating soldering iron And the solder which is melted at from arranged partial second terminal adjacent to the first terminal, but is intended to continue until interrupted by surface tension.

  According to a sixth aspect of the present invention, the post-heating means is composed of any one of a soldering iron, a hot air heater, and a laser irradiation machine.

  In the present invention, the post-heating means is constituted by a soldering iron, and the post-heating means includes the soldering iron while the main heating iron melts the solder at the arrangement portion of the second terminal. Solder held in a molten state by the post-heating means in the arrangement portion of the first terminal by moving in the direction opposite to the traveling direction of the main heating iron in the arrangement portion of the first terminal And a reverse dividing step of dividing the solder melted at the portion where the second terminal is disposed by the main heating iron.

  In the present invention, the post-heating means is constituted by a soldering iron, and the post-heating means includes the first heating iron while the main heating iron melts the solder at the portion where the second terminal is disposed. The second terminal is arranged by the main heating iron and the solder held in the molten state in the first terminal arrangement part by the post-heating means by rotating at the one terminal arrangement part. It further includes a rotation dividing step of dividing the solder melted at the installation portion.

  As effects of the present invention, the following effects can be obtained.

  According to the present invention, by maintaining the solder viscosity low between adjacent terminals of a soldering apparatus that performs drag soldering, the surface tension of the solder that is melted at the portions where both terminals are disposed Can be shrunk and divided to prevent the occurrence of defects such as bridges and solder balls.

Next, embodiments of the invention will be described.
FIG. 1 is a schematic side view showing a soldering apparatus according to a first embodiment of the present invention.
FIG. 2 is also a time chart of the soldering apparatus according to the first embodiment.
FIG. 3 is an enlarged side view of the soldering apparatus according to the first embodiment.
FIG. 4 is a time chart of the soldering apparatus according to the second embodiment of the present invention.
FIG. 5 is an enlarged side view of the soldering apparatus according to the second embodiment.
6A is an enlarged plan view of a soldering apparatus according to a third embodiment of the present invention, and FIG. 6B is an enlarged side view of the same.
FIG. 7 is an enlarged side view of a soldering apparatus according to a fourth embodiment of the present invention.
FIG. 8A is a plan view showing a bridge which is a defect in the prior art, and FIG. 8B is a side view of the same.
9A is a plan view showing a solder ball which is a defect in the prior art, and FIG. 9B is a side view of the same.
It should be noted that the technical scope of the present invention is not limited to the following examples, but broadly covers the entire scope of the technical idea that the present invention truly intends, as will be apparent from the matters described in the present specification and drawings. It extends.

  Below, the soldering apparatus which concerns on this invention is demonstrated.

[Configuration according to the first embodiment of the soldering apparatus 10]
First, the configuration of the soldering apparatus 10 according to the first embodiment of the present invention will be described with reference to FIG. In this specification, for the sake of convenience, the right side (the direction of arrow A) in FIG. 1 will be described as the front, the left side as the rear, the front side of the page as the right side, and the back side as the left side. That is, FIG. 1 is a side view of the soldering apparatus 10 as viewed from the right side.

  As shown in FIG. 1, the soldering apparatus 10 according to the present embodiment includes a first XYZ robot 20, a main heating iron holder 23 disposed in the first XYZ robot 20, and The main heating iron 21, which is disposed in the main heating iron holder 23 and includes the heater 22, the solder reel 42 around which the thread solder 41 is wound, and the thread solder 41. A solder feeder 43 that feeds from the solder reel 42 to the tip of the main heating iron 21. The first XYZ robot 20 is connected to a control device (not shown), and the control device controls driving in the vertical direction (Y direction) and the horizontal direction (XZ direction).

  When soldering is performed by the soldering apparatus 10, the main heating iron 21, which has become high temperature due to the heat generated by the heater 22, slides on the substrate 11 by driving the first X-Y-Z robot 20. It moves horizontally along a plurality of terminals 12a, 12b, 12c, 12d... Arranged on the substrate 11 in the forward direction, that is, in the direction of arrow A in FIG. Further, in conjunction with the horizontal movement of the main heating iron 21, the thread solder 41 is transferred from the solder feeder 43 to the tip of the main heating iron 21 (that is, the terminals 12 a, 12 b, 12 c, 12 d, and so on on the substrate 11). .. Are provided and melted, whereby the terminals 12 a, 12 b, 12 c, 12 d... Are successively and soldered to the substrate 11 in order.

  In this embodiment, the soldering apparatus 10 further includes post-heating means for heating the molten solder by the main heating iron 21 and holding the solder in a molten state for an arbitrary time. As the post-heating means in this embodiment, a post-heating iron 31 composed of a soldering iron is provided.

  Specifically, a second XYZ robot 34 is disposed on the first XYZ robot 20, and the second XYZ robot 34 includes a post-heating iron holder 33, A post-heating iron 31 provided with a heater 32 is disposed in the post-heating iron holder 33. Similarly to the first XYZ robot 20, the second XYZ robot 34 is controlled in the vertical and horizontal directions by the control device (not shown).

  In the present embodiment, the second XYZ robot 34 is disposed on the first XYZ robot 20 and is driven in conjunction with the first XYZ robot 20. The second XYZ robot 34 may be arranged separately from the first XYZ robot 20 with respect to the soldering apparatus 10 and may be driven independently.

[Soldering Method According to First Example of Soldering Apparatus 10]
Next, a soldering method according to the present embodiment will be described with reference to FIGS.
In this embodiment, the post-heating iron 31 starts heating the first terminal 12a immediately after the main heating iron 21 passes through the portion where the first terminal 12a is disposed. Solder that maintains the state where the post-heating iron 31 is melted at the portion where the first terminal 12a is disposed; and solder where the main heating iron 21 is melted at the portion where the second terminal 12b is disposed; The post-heating iron 31 is controlled such that the post-heating iron 31 is separated from the portion where the first terminal 12a is disposed and the heating is finished after the iron is broken by the surface tension. 21 is continuously heated to heat the terminals 12a, 12b, 12c, 12d,.

Specifically, as shown in the time chart of FIG. 2, first, the supply of the thread solder 41 from the solder reel 42 to the tip of the main heating iron 21 is started. At the same time, the main heating iron 21 that has generated heat descends and comes into contact with the substrate 11, and the yarn solder 41 is melted to start advancing while performing pull soldering (melting step). In this state, the post-heating iron 31 is still in a non-contact state with the base 11 (a1: section a1 in FIG. 2, the same applies hereinafter).
Then, the post-heating iron 31 moves forward behind the main heating iron 21, moves to above the first terminal 12a, and stops (b1).

Further, immediately after the main heating iron 21 passes through the portion where the first terminal 12a is disposed, the post-heating iron 31 descends and comes into contact with the substrate 11, so that the first terminal 12a is arranged. Heating of the installed part is started (post-heating step).
Thereby, the molten state of the solder melted at the portion where the first terminal 12 a is disposed is maintained in the molten state by the heating of the post-heating iron 31. That is, the solder viscosity is kept low, and the solder melted between the portion where the first terminal 12a is disposed and the portion where the second terminal 12b is disposed is contracted by the surface tension, and the respective terminals 12a.・ It can be divided into the 12b side.

In other words, as shown by a solid arrow B1 in FIG. 3, the first terminal after the post-heating iron 31 has moved to the portion where the first terminal 12a is disposed and the main heating iron 21 has passed. 12a is heated. As a result, the solder maintained in a molten state can be shrunk in the direction of the arrow α by surface tension without increasing the viscosity due to a temperature drop, and the occurrence of defects such as bridges and solder balls can be suppressed. is there.
Further, since the melted solder tends to be adsorbed on the high-temperature post-heating iron 31, the effect of dividing between the terminals 12a and 12b is further increased by collecting the solder on the post-heating iron 31. is there.

  In this way, the solder that is maintained in a molten state in the portion where the first terminal 12 a is disposed by the heating of the post-heating iron 31, and the second terminal 12 b that is disposed by the main heating iron 21. After the solder melted at the part is divided by the surface tension, the post-heating iron 31 leaves the first terminal 12a and finishes the heating (c1).

  The post-heating iron 31 is lifted off from the substrate 11 and then stopped for a while (a2). Then, as shown by the broken line arrow B2 in FIG. By contacting (c2), the terminals 12c, 12d,... After the second terminal 12b are also successively heated.

  As described above, in the state where the supply of the thread solder 41 from the solder reel 42 and the heating / advance by the main heating iron 21 are continued, the post-heating iron 31 is stopped (a1, a2, a3, ..), advance (b1, b2, b3...), Contact with the substrate 11 and heating of the terminals 12a, 12b, 12c... (C1, c2, c3...) Are continuous. Are repeated in order, it is possible to suppress the occurrence of defects such as bridges and solder balls at the terminals 12a, 12b, 12c.

  As described above, in the soldering method according to the present invention, the solder is supplied to the terminals 12a, 12b, 12c,... Of the substrate 11 on which the plurality of terminals 12a, 12b, 12c,. The soldering method for continuously pulling and soldering the plurality of terminals 12a, 12b, 12c... To the substrate 11 by heating and melting the solder with the main heating iron 21. A melting step in which the main heating iron 21 melts the solder; and a post-heating means (in this embodiment, the post-heating iron 31) heats the solder melted by the main heating iron 21; A post-heating step for holding the solder in a melted state for an arbitrary time, and the post-heating step includes the first terminal 12 immediately after the main heating iron 21 passes through the first terminal 12a. And the solder that is held in a molten state at the portion where the first terminal 12a is disposed by the post-heating means and the main heating iron 21 is melted at the portion where the second terminal 12b is disposed. The solder is continued until it is divided by the surface tension.

  By configuring as described above, the solder viscosity can be kept low between the terminals 12a, 12b, 12c,... Arranged adjacent to each other in the soldering apparatus 10 that performs drag soldering. The solder melted between the terminals 12a, 12b, 12c,... Can be shrunk by surface tension, and the occurrence of defects such as bridges and solder balls can be suppressed.

In this embodiment, the post-heating iron 31 is used as the post-heating means. However, the post-heating means is constituted by a hot air heater for post heating constituted by a hot air heater or a laser irradiation machine. It is also possible to adopt a configuration in which any one of the post-heating laser irradiation machines is disposed.
That is, either a post-heating hot air heater or a post-heating laser irradiator is provided in place of the post-heating iron 31 of the present embodiment, and the hot air heater for post heating is controlled by a control device. Therefore, the post-heating process can be performed with hot air emitted from the laser or a laser irradiated from a post-heating laser irradiator.

[Soldering Method According to Second Embodiment]
Next, a soldering method according to the second embodiment of the present invention will be described with reference to FIGS. In addition, regarding each embodiment of the soldering method described below, portions common to the above-described embodiment are denoted by the same reference numerals and description thereof is omitted.

In the present embodiment, as shown in the time chart of FIG. 4, similar to the above embodiment, the supply of the thread solder 41 from the solder reel 42 and the melting of the thread solder 41 by the main heating iron 21 Start drag soldering (melting process). In this state, the post-heating iron 31 is still in a non-contact state with the base 11 (a1: section a1 in FIG. 4, the same applies hereinafter).
Then, the post-heating iron 31 moves forward behind the main heating iron 21, moves to above the first terminal 12a, and stops (b1).

Further, immediately after the main heating iron 21 passes through the first terminal 12a, the post-heating iron 31 descends and comes into contact with the substrate 11 to start heating the first terminal 12a ( Post-heating step c1).
Thereby, the molten state of the solder melted at the portion where the first terminal 12 a is disposed is maintained in the molten state by the heating of the post-heating iron 31. That is, the solder viscosity is kept low, and the solder melted between the portion where the first terminal 12a is disposed and the portion where the second terminal 12b is disposed is contracted by the surface tension, and the respective terminals 12a.・ Can be divided into 12b.

  Here, in the present embodiment, in addition to the above-described configuration, the post-heating iron 31 is used while the main heating iron 21 melts the solder at the portion where the second terminal 12b is disposed. By moving in the direction opposite to the traveling direction of the main heating iron 21 in the arrangement portion of the first terminal 12a, the post-heating iron 31 was melted in the arrangement portion of the first terminal 12a. Control is performed so that the solder whose state is maintained and the solder melted at the portion where the second terminal 12 b is disposed are divided by the main heating iron 21.

  Specifically, the post-heating iron 31 is slidably in contact with the substrate 11 at the portion where the first terminal 12a is disposed, and is opposite to the arrow A which is the traveling direction of the main heating iron 21. (I.e., reverse division step d1).

That is, as shown by the solid line arrow C1 and solid line arrow C'1 in FIG. 5, the post-heating iron 31 moves to the arrangement part of the first terminal 12a, and in the arrangement part of the first terminal 12a. The molten solder moves backward in a heated state.
As a result, the solder maintained in a molten state does not increase in viscosity due to a decrease in temperature, and is given physical movement / deformation to the solder so as to contract in the direction of arrow β by surface tension, so that the bridge or solder It is possible to further suppress the occurrence of defects such as balls.
Further, since the melted solder tends to be adsorbed by the high-temperature post-heating iron 31, the solder is attracted to the post-heating iron 31 and moved, so that the effect of dividing between the terminals 12a and 12b is achieved. Will rise more.

  Thus, the solder melted in the portion where the first terminal 12a is melted by the heating of the post-heating iron 31, and the solder where the main heating iron 21 is melted in the portion where the second terminal 12b is disposed. Are separated by the surface tension, the post-heating iron 31 leaves the first terminal 12a and finishes the heating.

  The post-heating iron 31 is lifted off from the substrate 11 and then stopped for a while (a2), and then advanced in the same manner as described above (b2) as indicated by the broken line arrow C2 and broken line arrow C′2 in FIG. By descending / contacting the substrate 11 (c2) and retreating (d2), the terminals 12c, 12d,... After the second terminal 12b are also successively heated.

  As described above, in the state where the supply of the thread solder 41 from the solder reel 42 and the heating / advance by the main heating iron 21 are continued, the post-heating iron 31 is stopped (a1, a2, a3, ..), forward movement (b1, b2, b3...), Contact with the substrate 11 and heating of the terminals 12a, 12b, 12c... (C1, c2, c3...), Backward movement (d1) ... (D2 · d3...) Are successively repeated in order, so that it is possible to suppress the occurrence of defects such as bridges and solder balls at the terminals 12a, 12b, 12c.

  As described above, in the soldering method according to the present invention, the post-heating means (in the present embodiment, the post-heating is used) while the main heating iron 21 melts the solder at the portion where the second terminal 12b is disposed. The iron 31) moves in a direction opposite to the traveling direction of the main heating iron 21 in the arrangement portion of the first terminal 12a, whereby the post-heating means arranges the first terminal 12a. The apparatus further includes a reverse dividing step of dividing the solder that is maintained in a molten state at the installed portion and the solder that is melted at the portion where the second terminal 12b is disposed by the main heating iron 21.

  By configuring as described above, the solder viscosity is kept low between the terminals 12a, 12b, 12c,. By giving physical movement / deformation, the solder melted between the terminals 12a, 12b, 12c,... Can be shrunk by surface tension and divided, causing problems such as bridges and solder balls. Can be deterred.

[Soldering Method According to Third Embodiment]
Next, a soldering method according to a third embodiment of the present invention and a soldering apparatus 10 used therefor will be described with reference to FIG.

  In this embodiment, in addition to the configuration of the first embodiment, the post-heating iron 51 is used for the first heating iron 21 while the main heating iron 21 melts the solder at the portion where the second terminal 12b is disposed. The solder is held by the post heating iron 51 in the molten state at the first terminal 12a and the main heating iron 21 is rotated by the post heating iron 51. Control is performed so as to divide the molten solder at the portion where the second terminal 12b is disposed.

  That is, during the post-heating process in the first embodiment, as shown by the solid line arrow D in FIG. 6, the post-heating iron 51 rotates at the portion where the first terminal 12a is disposed, and the molten solder is removed. It is drawn as if it is wound up (rotational cutting step).

As a result, the solder maintained in a molten state does not increase in viscosity due to a decrease in temperature, and is given physical movement / deformation to the solder so as to contract in the direction of arrow γ by surface tension, so that the bridge or solder It is possible to further suppress the occurrence of defects such as balls.
Further, since the melted solder tends to be adsorbed by the high-temperature post-heating iron 51, the solder is attracted to the post-heating iron 51 and moved, so that the effect of dividing between the terminals 12a and 12b is achieved. Will rise more.

  As described above, in the soldering method according to the present invention, while the main heating iron 21 melts the solder at the portion where the second terminal 12b is disposed, post-heating means (in the present embodiment, post-heating). The solder 51) rotates at the portion where the first terminal 12a is disposed, so that the post-heating means holds the molten state at the portion where the first terminal 12a is disposed, and the main heating. It further includes a rotation dividing step of dividing the solder melted by the trowel 21 at the portion where the second terminal 12b is disposed.

  By configuring as described above, the solder viscosity is kept low between the terminals 12a, 12b, 12c,. By giving physical movement / deformation, the solder melted between the terminals 12a, 12b, 12c,... Can be shrunk by surface tension and divided, causing problems such as bridges and solder balls. Can be deterred.

In this embodiment, branching portions 51a and 51a are formed to protrude from the tip of the post-heating iron 51, and the effect of attracting the solder is further improved. It is possible to adopt a configuration in which 51a is not formed.
The shape of the post-heating iron 51 is not limited to this embodiment, and may be a shape in which two parallel plate-like portions protrude downward, for example. That is, it is only necessary that the post-heating iron 51 can be rotated in a plan view so as not to contact the terminals 12a, 12b, 12c.

  Furthermore, the soldering method according to the soldering apparatus 10 can be configured to include both the rotational dividing step in the present embodiment and the reverse dividing step in the second embodiment. That is, after the post-heating step, after the post-heating iron 51 is rotated by the rotational dividing step, the post-heating iron 51 is moved backward by the reverse dividing step. By adopting such a configuration, it is possible to further improve the effect of suppressing the occurrence of defects such as the bridges and solder balls.

[Soldering Method According to Fourth Embodiment]
Next, a soldering method and a soldering apparatus 10 used therefor according to a fourth embodiment of the present invention will be described with reference to FIG.
In the present embodiment, the soldering operation is performed at an ambient temperature equal to or higher than the melting point of the solder when the soldering is performed by the main heating iron 21.

  As a result, the solder melted at the arrangement portions of the terminals 12a, 12b, 12c,... Is maintained at a high temperature by the ambient temperature. That is, the solder viscosity is kept low, and the solder melted between the terminals 12a, 12b, 12c,... Can be shrunk by surface tension, so that it can be divided into the terminals 12a, 12b. it can. As a result, the solder maintained in a molten state can be shrunk in the direction of the arrow α by surface tension without increasing the viscosity due to a temperature drop, and the occurrence of defects such as bridges and solder balls can be suppressed. is there.

  Furthermore, by performing the configuration of the fourth embodiment simultaneously with the configurations of the first to third embodiments, that is, by performing the soldering method in the first to third embodiments so that the ambient temperature of the soldering operation is equal to or higher than the solder melting point. Further, it is possible to further improve the effect of suppressing the occurrence of defects such as the bridges and solder balls.

1 is a schematic side view showing a soldering apparatus according to a first embodiment of the present invention. The time chart figure of the soldering apparatus which similarly concerns on 1st Example. Similarly the enlarged side view of the soldering apparatus which concerns on 1st Example. The time chart figure of the soldering apparatus which concerns on 2nd Example of this invention. The enlarged side view of the soldering apparatus which concerns on 2nd Example similarly. (A) is an enlarged plan view of the soldering apparatus based on 3rd Example of this invention, (b) is an enlarged side view similarly. The expanded side view of the soldering apparatus which concerns on 4th Example of this invention. (A) is the top view which showed the bridge | bridging which is a malfunction in a prior art, (b) is a side view similarly. (A) is the top view which showed the solder ball which is a malfunction in a prior art, (b) is a side view similarly.

Explanation of symbols

10 Soldering equipment 12 Terminal 21 Iron for heating 31 Iron for heating

Claims (8)

Solder is supplied to the terminal arrangement part of the board on which a plurality of terminals are arranged, and the solder is heated and melted by a soldering iron so that the plurality of terminals are continuously pulled and soldered to the board. A soldering device that performs
A main heating iron for melting the solder;
A post-heating means for heating the solder melted by the main heating iron and holding the solder in a melted state for an arbitrary time; and
The post-heating means starts heating the first terminal immediately after the main heating trowel passes through the first terminal, and melts at the portion where the first terminal is disposed by the post-heating means. The post-heating means after the solder held in the state and the solder melted at the portion of the second terminal adjacent to the first terminal by the main heating iron are separated by surface tension The heating of the first terminal according to the above is controlled so as to end, so that the terminal is continuously heated following the main heating iron,
The soldering apparatus characterized by the above-mentioned. The post-heating means includes
Consists of either a soldering iron, hot air heater, or laser irradiation machine,
The soldering apparatus according to claim 1, wherein: The post-heating means is composed of a soldering iron,
While the main heating iron melts the solder at the second terminal arrangement portion,
The post-heating means moves in the direction opposite to the traveling direction of the main heating iron in the arrangement portion of the first terminal,
The solder which is held in a melted state at the portion where the first terminal is disposed by the post-heating means and the solder which is melted at the portion where the second terminal is disposed by the main heating iron are divided. Controlled by
The soldering apparatus according to claim 1, wherein: The post-heating means is composed of a soldering iron,
While the main heating iron melts the solder at the arrangement portion of the second terminal, the post-heating means rotates at the arrangement portion of the first terminal,
The solder which is held in a melted state at the portion where the first terminal is disposed by the post-heating means and the solder which is melted at the portion where the second terminal is disposed by the main heating iron are divided. Controlled by
The soldering apparatus according to claim 1 or claim 3, wherein Solder is supplied to the terminal arrangement part of the board on which a plurality of terminals are arranged, and the solder is heated and melted by a soldering iron so that the plurality of terminals are continuously pulled and soldered to the board. A soldering method to perform,
A melting step in which a soldering iron for main heating melts the solder at an arrangement portion of each terminal;
A post-heating step for heating the solder melted by the main heating soldering iron, and holding the solder in a melted state for an arbitrary time; and
The post-heating step is started at the first terminal immediately after the main heating soldering iron passes through the first terminal,
Solder held in a molten state at the first terminal arrangement portion by the post-heating means, and a second terminal arrangement portion adjacent to the first terminal by the main heating soldering iron Continue until the molten solder is broken by surface tension,
The soldering method characterized by the above-mentioned. The post-heating means includes
Consists of either a soldering iron, hot air heater, or laser irradiation machine,
The soldering method according to claim 5, wherein: The post-heating means is composed of a soldering iron,
While the main heating iron melts the solder at the second terminal arrangement portion,
The post-heating means moves in the direction opposite to the traveling direction of the main heating iron in the arrangement portion of the first terminal,
The solder that is held in a melted state at the first terminal arrangement portion by the post-heating means and the solder that is melted at the second terminal arrangement portion by the main heating iron are divided. Further comprising a reverse dividing step,
The soldering method according to claim 5, wherein: The post-heating means is composed of a soldering iron,
While the main heating iron melts the solder at the arrangement portion of the second terminal, the post-heating means rotates at the arrangement portion of the first terminal,
The solder that is held in a melted state at the first terminal arrangement portion by the post-heating means and the solder that is melted at the second terminal arrangement portion by the main heating iron are divided. A rotation dividing step;
The soldering method according to claim 5 or 7, characterized by the above.

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