JP2009280684A5 - Polymer, photosensitive resin composition and method for forming resist pattern - Google Patents

Polymer, photosensitive resin composition and method for forming resist pattern Download PDF

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Publication number
JP2009280684A5
JP2009280684A5 JP2008133380A JP2008133380A JP2009280684A5 JP 2009280684 A5 JP2009280684 A5 JP 2009280684A5 JP 2008133380 A JP2008133380 A JP 2008133380A JP 2008133380 A JP2008133380 A JP 2008133380A JP 2009280684 A5 JP2009280684 A5 JP 2009280684A5
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Prior art keywords
resin composition
photosensitive resin
polymer
resist pattern
forming resist
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JP2008133380A
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Japanese (ja)
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JP5403943B2 (en
JP2009280684A (en
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Priority to JP2008133380A priority Critical patent/JP5403943B2/en
Priority claimed from JP2008133380A external-priority patent/JP5403943B2/en
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Claims (3)

下記一般式：
Figure 2009280684
 （式中、Ｒ7は水素又はＣ１〜４のアルキル基であり、Ｒ8は水素又はメチル基であり、Ａは単結合又はエステル結合であり、ｊは１〜４の整数である）
で表される構造、及び
下記一般式：
Figure 2009280684
 （式中、Ｒ9は水素又はメチル基である）
で表される構造を構成単位として含むことを特徴とするポリマー。 The following general formula:
Figure 2009280684
 (Wherein R 7 is hydrogen or a C 1-4 alkyl group, R 8 is a hydrogen or methyl group, A is a single bond or an ester bond, and j is an integer of 1 to 4)
And the following general formula:
Figure 2009280684
 (Wherein, R 9 is hydrogen or methyl)
Polymer characterized by including the structure represented by these as a structural unit. 請求項１に記載のポリマーと光酸発生剤とを含有することを特徴とする感光性樹脂組成物。   A photosensitive resin composition comprising the polymer according to claim 1 and a photoacid generator. 請求項２に記載の感光性樹脂組成物を基板に塗布して塗膜を形成した後、露光し、現像することを特徴とするレジストパターンの形成方法。A method for forming a resist pattern, comprising applying the photosensitive resin composition according to claim 2 to a substrate to form a coating film, exposing the film, and developing.
JP2008133380A 2008-05-21 2008-05-21 Polymer, photosensitive resin composition and method for forming resist pattern Expired - Fee Related JP5403943B2 (en)

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JP2008133380A JP5403943B2 (en) 2008-05-21 2008-05-21 Polymer, photosensitive resin composition and method for forming resist pattern

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JP2008133380A JP5403943B2 (en) 2008-05-21 2008-05-21 Polymer, photosensitive resin composition and method for forming resist pattern

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JP2009280684A JP2009280684A (en) 2009-12-03
JP2009280684A5 true JP2009280684A5 (en) 2011-03-17
JP5403943B2 JP5403943B2 (en) 2014-01-29

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014237847A (en) * 2014-08-20 2014-12-18 三菱レイヨン株式会社 Polymer for semiconductor lithography and method for producing the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60217356A (en) * 1984-04-13 1985-10-30 Asahi Chem Ind Co Ltd Photosensitive composition
JPH01274132A (en) * 1988-04-27 1989-11-01 Tokyo Ohka Kogyo Co Ltd Photosensitive composition
JP3896631B2 (en) * 1997-04-01 2007-03-22 凸版印刷株式会社 Black photosensitive resin composition and method for producing color filter using the same
JP4210407B2 (en) * 2000-02-04 2009-01-21 富士フイルム株式会社 Resist laminate
JP2004198724A (en) * 2002-12-18 2004-07-15 Fuji Photo Film Co Ltd Negative resist composition
JP4360242B2 (en) * 2004-03-24 2009-11-11 Ｊｓｒ株式会社 Negative radiation sensitive resin composition
JP4481789B2 (en) * 2004-10-18 2010-06-16 昭和高分子株式会社 Epoxy curing agent

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