JP2009279226A - Controller for appliance - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To largely reduce the amount of moistureproof potting material used in a controller for an appliance. <P>SOLUTION: The controller for an appliance includes: the controller body 6 constituted of a printed circuit board where an electronic member 14 or the like is mounted on the upper front surface 6a and the rear surface is made to be a soldering surface 6b; a protective case 15 for mounting the controller body 6 inside; and the moistureproof potting material 8 to fill the protective case 15. The protective case 15 has a contact part 17 where the soldering surface 6b of the controller body 6 is placed and which is formed in a loop shape with a curved line or a straight line, thereby adhesively fixing the controller body 6. A closed space 16, which is not filled with the moistureproof potting material 8, is formed on the side of the soldering surface 6b on the rear surface of the controller body 6 in the protective case 15, so that the moistureproof potting material 8 is largely reduced. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a control device for a device in which a control device main body for controlling operation is waterproofed with a moisture-proof potting material.

  Various electronic parts such as switches and light-emitting diodes are mounted on printed circuit boards in control devices mounted on equipment, particularly water-using equipment such as washing machines. The surface of the conductor is waterproofed with a moisture-proof potting material made of urethane resin or the like (see, for example, Patent Document 1).

  3-5 shows the structure of the control apparatus of the conventional washing machine described in patent document 1. FIG.

  As shown in the cross-sectional view of the main part of the configuration of the control device in FIG. 3, a top cover 2 that forms an upper frame is provided above the housing 1, and an operation unit 3 is formed on the top cover 2. The upper casing 4 is coupled. A protective case 5 arranged in a space 13 constituted by the top cover 2 and the upper housing 4 is provided with a control device main body 6 for controlling the operation, and has a cross-sectional shape made of a thermoplastic resin such as polypropylene resin or ABS resin. It has an open part of a U-shaped upper surface notch, and the bottom surface is flat with a substantially rectangular shallow bottom.

  The control device main body 6 has a switch 12 and an electronic component 14 mounted on a printed circuit board on which a wiring pattern is formed, and is housed in the protective case 5. As shown in the exploded perspective view of the main part of FIG. Fix to 5.

  In the protective case 5, as shown in the cross-sectional view showing the moisture-proof potting injection method of the control device configuration of FIG. 5 in order to perform the moisture-proof treatment also on the solder surface of the printed circuit board (the side opposite to the switch 12), the protective case side A gap is ensured by the steps of the convex portions 5a and 5b provided in the upper portion so as to be filled.

A moisture-proof potting material 8 made of urethane resin or the like is filled in the protective case 5 from above, and the front and back of the printed circuit board are completely filled with the moisture-proof potting material 8 by a potting injector 9 to protect the control device body 6 by moisture-proof treatment. The case-integrated control device 10 is configured.
JP 2002-315993 A

  However, in such a conventional configuration, since it is necessary to cover the entire periphery of the printed wiring board of the control device main body 6 with the moisture-proof potting material, the amount of moisture-proof potting is increased, and the time required for curing is 80, for example. Holding for 1 hour or more in a curing furnace at 0 ° C. was necessary, and there was a problem in productivity in addition to material costs.

  Further, since the control device main body 6 is integrated with the protective case 5, when a problem is found in the electronic component mounted on the printed circuit board, the switch and the electronic component are covered with a moisture-proof potting material. It is common to replace and repair the entire protective case integrated control device 10 without individual repairs. At the time of replacement, in addition to switches and electronic components, moisture-proof potting materials made of a large amount of urethane resin, etc. are used as industrial waste. There was a problem that would be discarded as.

  SUMMARY OF THE INVENTION The present invention solves the above-described problems, and an object of the present invention is to greatly reduce the moisture-proof potting material without reducing the moisture-proof effect on the control device body.

  In order to achieve the above-mentioned object, the present invention achieves the above-described purpose by storing a control device body composed of a printed circuit board with an electronic member mounted on the upper surface and a solder surface on the back surface in a protective case, and filling the protective case with moisture. Provided with a potting material, the protective case is provided with a contact portion formed in a loop shape by a curve or a straight line on which the periphery of the solder surface of the control device body is placed, and the control device body is closely fixed, A closed space not filled with a moisture-proof potting material is formed on the solder surface side of the back surface of the control device main body.

  Accordingly, it is possible to significantly reduce the moisture-proof potting material by forming a closed space that is not filled with the moisture-proof potting material on the solder surface of the protective case and the control device main body.

  The apparatus control device of the present invention can greatly reduce the amount of moisture-proof potting material used.

  According to a first aspect of the present invention, there is provided a shallow and flat protective case having a control device body configured of a printed circuit board for controlling the operation of the device, and the control device body has an electronic member mounted on the upper surface and a back surface as a solder surface. A moisture-proof potting material made of urethane resin or the like that fills the protective case and moisture-proofs the control device main body, and the protective case is looped by a curve or a straight line around the solder surface of the control device main body. By providing a contact portion formed on the surface of the control device, the control device main body is closely fixed, and a closed space not filled with a moisture-proof potting material is formed on the solder surface side of the back surface of the control device main body. The moisture-proof potting material can be greatly reduced without impairing the performance.

  In particular, the second invention closes the protective case of the first invention by providing a small opening at the bottom for communicating between the closed space formed between the solder surface of the control device body and the outside. It is possible to eliminate the pressure difference between the space and the atmosphere, and to prevent the solder part from condensing due to moisture intrusion from the outside due to the respiration action.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the thing of the same structure as a prior art example attaches | subjects the same code, and abbreviate | omits description. Further, the present invention is not limited by this embodiment.

(Embodiment 1)
FIG. 1 is a cross-sectional view of a main part of a device control apparatus according to the first embodiment of the present invention, and FIG. 2 is an exploded perspective view of a main part of the device control apparatus.

  As shown in the cross-sectional view of the main part of FIG. 1, a control device main body 6 is provided in a space 13 formed by a top cover 2 that forms an upper frame by arranging an upper housing 4 above the housing 1. A protective case 15 having an open portion 21 is disposed above.

  The control device main body 6 is formed of a printed circuit board, and the periphery of the control device main body 6 is closely mounted on the contact portion 17 integrally formed so as to form a step having a height dimension H at the bottom of the protective case 15. Fastened and fixed with screws 18. Therefore, a closed space 16 having a dimension H is formed between the back side of the control device body 6 and the bottom of the protective case 15.

  Further, the moisture-proof potting material 8 filled from the open portion 21 side is filled on the upper surface 6a side opposite to the closed space 16, that is, on the mounting side of the switch 12 and the electronic member 14, and the solder surface 6b of the printed board. The closed space 16 (on the side opposite to the switch 12) is not filled.

  Accordingly, the moisture-proof potting material 8 and the control device body 6 are sealed, and the solder surface 6b side of the control device body 6 facing the closed space 16 can be blocked from the outside.

  Further, a small opening 24 (for example, a small hole of about φ0.8 mm) that communicates between the closed space 16 formed between the protective case 15 and the solder surface 6b of the control device body 6 and the outside is provided at the bottom to close the space. The pressure difference between the space 16 and the outside is eliminated.

  As shown in the exploded perspective view of the main part of FIG. 2, the protective case 15 is made of a thermoplastic resin such as polypropylene resin or ABS resin, and has an open portion 21 with a top cutout, and the bottom is flat with a shallow bottom having a substantially rectangular shape. A contact portion 17 having a height step H on which the control device main body 6 is closely mounted is formed around the inside.

  The contact portion 17 is formed in a loop shape with a curved line or a straight line, is placed around the solder surface of the control device body 6, and has a peripheral edge portion of the protective case 15 in order to improve adhesion to the control device body 6. A plurality of mounting boss portions 19 are formed integrally with each other, and a peripheral portion is fixed with a plurality of screws 18.

  Moreover, if the packing 20 comprised with the thin rubber sheet etc. is additionally used between the contact part 17 and the control apparatus main body 6 as needed, a sealing effect can be heightened more.

  Since the periphery of the control device body 6 is in close contact with the protective case 15, the moisture-proof potting material 8 injected from above basically does not enter the solder surface 6 b side on the back surface of the control device body 6. There may be cases where the warp of the substrate in the solder dip tank remains in the production process, such as when a paper phenolic material is used for the printed circuit board, and the moisture-proof potting material 8 has a high viscosity of 1300 cps at 25 ° C. when filled. However, until it is cured, if there is a slight gap, there is a possibility that it flows from the gap between the control device body 6 and the contact portion 17 of the protective case 15 to the solder surface 6b side. In order to increase the contact between the protective case 15 and the contact portion 17 as much as possible, the number of screw points is increased, the packing 20 is added, or an adhesive is applied to the contact portion 17. Corresponding in.

  In addition, an opening 24 is formed at the bottom of the protective case 15 to eliminate the above-described pressure difference from the outside.

  About the control apparatus of the apparatus comprised as mentioned above, the operation | movement, an effect | action, and an effect are demonstrated below.

  First, the shallow and flat protective case 15 that houses the control device main body 6 that controls the operation forms a closed space 16 on the solder surface of the control device main body 6, and the control case main body 6 is subjected to moisture-proof treatment in the protective case 15. Since the moisture-proof potting material 8 made of urethane resin or the like is filled only on the electronic member side such as the switch 12, the moisture-proof potting material 8 can be greatly reduced and shielded from the atmosphere, so that a moisture-proof effect can be obtained. It becomes.

  Generally, the thickness when potting the control device is at least about 3 mm because the solder surface has electronic component leads, microcomputers, etc., and the opposite component surface covers the resistor, LED leads, etc. Therefore, at least 3 mm is necessary. By eliminating the filling of the moisture-proof potting material on the solder side, the material cost of the moisture-proof potting material is approximately halved, so the material cost can be reduced, the processing productivity can be improved, and the amount used can be reduced. It is possible to provide an environmentally friendly control device.

  Further, the closed space 16 formed between the protective case 15 and the solder surface of the control device main body 6 has a breathing action when there is a difference between the pressure inside the closed space 16 and the surrounding pressure, and the outside of the closed space 16 is In the case of a high temperature and high humidity state, there is a risk that condensation will occur inward and the insulation of the solder surface may be reduced. However, by providing a minute opening 24 on the closed space side to communicate with the outside, Since the pressure difference from the outside can be eliminated and water intrusion from the outside due to the respiratory action can be prevented, it is possible to prevent the solder surface from condensing.

  As described above, the device control apparatus according to the present invention forms a closed space on the solder surface of the protective case and the control device main body, thereby greatly reducing the moisture-proof potting material and blocking the atmosphere to obtain a moisture-proof effect. It becomes possible.

  As described above, the device control device according to the present invention is useful as a device control device or the like that requires water resistance.

Sectional drawing of the principal part of the control apparatus of the apparatus in embodiment of this invention The exploded perspective view of the principal part of the control device of the equipment Cross-sectional view of the main part of the control device configuration of a conventional device An exploded perspective view of a main part of a conventional device control device configuration Sectional drawing which shows the moisture-proof potting injection method of the control apparatus structure of the conventional apparatus

Explanation of symbols

6 Control Device Body 6a Upper Surface 6b Solder Surface 8 Moisture-proof Potting Material 15 Protective Case 16 Closed Space 17 Contact Portion 24 Opening Portion

Claims (2)

A shallow and flat protective case that houses a control device body composed of a printed circuit board that controls the operation of the device, and the control device body has an electronic member mounted on the upper surface and a solder surface on the back surface, And a moisture-proof potting material made of urethane resin or the like for filling and moisture-proofing the control device main body, and the protective case has a contact portion formed in a loop shape by a curve or a straight line on which the periphery of the solder surface of the control device main body is placed. A control device for a device provided with a control device main body closely fixed, and having a closed space not filled with a moisture-proof potting material on the solder surface side of the back surface of the control device main body of the protective case. The apparatus for controlling a device according to claim 1, wherein the protective case is provided with a minute opening at the bottom for communicating between a closed space formed between the solder surface of the main body of the control device and the outside.

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