JPS6011475U

JPS6011475U - Waterproofing equipment for electronic component mounting boards

Info

Publication number: JPS6011475U
Application number: JP10348783U
Authority: JP
Inventors: 堆　誠一郎; 濱川　悦三; 守記福田
Original assignee: 松下電器産業株式会社
Priority date: 1983-07-05
Filing date: 1983-07-05
Publication date: 1985-01-25
Also published as: JPH0140221Y2

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は、電子部品実装基板に防水コーティングを施し
た従来例の断面図、第２図は、第１図の基板を装置本体
に取付けた状態を示す図、第３図は、本考案の一実施例
のケース内に電子部品実装基板を配置した状態を示す一
部断面図、第４図は、同断面図、第５図は、同回路ユニ
ットを装置本体　　、に取付けた状態を示す図だ第６図
及び第７図は、ケースに部品実装基板を固定する他の実
施例を示す斜視図、第８図は、同断面図、第９図は、ケ
ースに部品実装基板を固定するさらに他の実施例を示す
斜視図、第１０図は、同断面図である。１・・・・・・プリント基板、８・・・・・・ケース、
９・・・・・・ホス、１０．　１１．　１２・・・・・
・電子部品、１４・・・・・・爪、１５・・・・・・突
起、１６・・・・・・ピン、１８・・・・・・鍔、１９
・・・・・・取付用ボス。Figure 1 is a cross-sectional view of a conventional example in which a waterproof coating is applied to an electronic component mounting board, Figure 2 is a diagram showing the board in Figure 1 attached to the main body of the device, and Figure 3 is a diagram of the present invention. FIG. 4 is a partial cross-sectional view showing the state in which the electronic component mounting board is arranged in the case of one embodiment. FIG. 5 is a view showing the state in which the circuit unit is attached to the main body of the device. 6 and 7 are perspective views showing other embodiments of fixing the component mounting board to the case, FIG. 8 is a cross-sectional view of the same, and FIG. A perspective view showing another embodiment, and FIG. 10 is a sectional view thereof. 1... Printed circuit board, 8... Case,
9...Hoss, 10. 11. 12...
・Electronic parts, 14...Claw, 15...Protrusion, 16...Pin, 18...Tsuba, 19
・・・・・・Boss for installation.

Claims

[Scope of utility model registration request]

(1) The case consists of a case made of a box-shaped resin molded product with an opening on one side, and a waterproof filler filled so as to bury the electronic component mounting board housed in the case; a plurality of bosses that rise from the inner bottom, penetrate through the housed electronic component mounting board, protrude to approximately the same height as the opening edge, and have through holes through which mounting screws to the device body are inserted; 1. A waterproofing device for an electronic component mounted board, comprising: a locking means for arranging the electronic component mounted board housed in a case at a position approximately in the middle of the height of the case.

(2) The locking means for arranging the electronic component mounting board at approximately the middle position of the height of the case rises from a step provided at an intermediate position of the boss or from the inner bottom of the case, and supports the bottom surface of the board. A waterproofing device for an electronic component mounting board according to claim 1, which is characterized by comprising a protrusion and a hook that rises from the bottom of the case and hooks onto the edge of the board.

(3) The locking means includes a protrusion that rises from a step provided at an intermediate position of the boss or an internal part of the case and supports the bottom surface of the board, and a protrusion that rises from the inner bottom of the case and penetrates the board and projects onto the top surface of the board. A waterproofing device for an electronic component mounting board according to claim (1) of claim 1, which is characterized by comprising a pin whose head part is heated and deformed to form a flange part.

(4) The locking means comprises a boss that rises from the bottom of the case to support the bottom surface of the board and fixes the board with a screw screwed from the top surface of the board. 1) A waterproofing device for an electronic component mounting board as described in item 1).