JP2009267253A - Component supply device and surface mounting device including the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To more effectively prevent an operation fault on taking out a component, by stabilizing a posture of the component in a carrier tape by an appropriate attractive force according to the size of the component. <P>SOLUTION: A component supply device 4 feeds out a carrier tape 28 wherein component storage parts 28a for storing components t therein are provided at fixed intervals, along a tape conveyance surface 41 to supply the components t to a component extraction position S where the components t are taken out from the component storage parts 28a. A magnet member 52 located between the tape conveyance surface 41 and the carrier tape 28 passing on the surface 41 is provided below the component extraction position S, and a gap C between the magnet member 52 and the carrier tape 28 is made wider as the carrier tape 28 is thinner. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention supplies parts to the part extraction position where the parts are taken out from the part storage part by sending out a carrier tape provided with parts storage parts at regular intervals along the tape transport surface. The present invention relates to a component supply device and a surface mounter including the component supply device.

  Conventionally, as shown in Patent Document 1 below, in a component supply device (tape feeder) that pitch-feeds a carrier tape containing electronic components to a component extraction position (pickup position) where the electronic component is extracted by the mounting head. An upper guide portion that covers an upper portion of the carrier tape and guides the feed path in the vicinity of the component extraction position; and a lower receiving member that is positioned below the upper guide portion and supports the carrier tape from below. In addition, a magnet member fixed to the lower surface of the upwardly projecting leaf spring member is provided as a part of the lower receiving member.

According to the configuration disclosed in Patent Document 1, when the carrier tape passes above the magnet member fixed to the lower surface of the leaf spring member, a magnetic attractive force acts on the components housed in the tape. Therefore, advantages such as stabilization of the posture of the parts at the time of tape feeding can be obtained.
JP 2007-27246 A

  By the way, since there are various sizes of electronic components stored in the carrier tape, it is common to use a plurality of types of carrier tapes having different thicknesses according to the size of such components. And according to the structure of the said patent document 1, even when the above carrier tapes with different thickness are used, the said leaf | plate spring member bends and deforms according to the change of the thickness of a carrier tape, and this leaf | plate spring member By similarly changing the height of the magnet member fixed to the magnet member, the magnet member is always arranged immediately below the carrier tape regardless of the change in the thickness of the carrier tape.

  However, in the above configuration, even when the component size is small and the thickness of the carrier tape is thin, or even when the component size is large and the thickness of the carrier tape is thick, the attraction force by the magnet member is the same level. Will act on the parts. Then, for a small-sized component, there is a possibility that the attractive force of the magnet member is too large compared to the size of the component, which hinders the component taking-out operation by the mounting head.

  The present invention has been made in view of the circumstances as described above, and stabilizes the posture of a component in the carrier tape with an appropriate suction force according to its size, thereby preventing malfunction during component removal. It aims at preventing more effectively.

  In order to solve the above-mentioned problem, the invention according to claim 1 of the present application is configured to send out a carrier tape provided with a component storage portion for storing a component at regular intervals along a tape transport surface. A component supply device that supplies a component to a component extraction position from which the component is extracted from the component storage unit, and is positioned below the component extraction position and between the tape transport surface and a carrier tape that passes above the tape conveyance surface. A magnet member is provided, and a gap between the magnet member and the carrier tape is configured to increase as the thickness of the carrier tape decreases (claim 1).

  According to the present invention, when the component stored in the component storage portion of the carrier tape reaches the component take-out position, a magnetic attraction force is exerted on the component in the component storage portion from the magnet member arranged below the component storage position. Since this causes the parts to be drawn downward, it is possible to prevent the parts in the parts storage unit from rising or tilting due to vibration or static electricity during tape feeding, and the parts at the parts pick-up position can be prevented. There is an advantage that the posture becomes more stable.

  In addition, since the gap between the magnet member and the carrier tape is increased as the thickness of the carrier tape is thinner (that is, when the size of the component housed therein is smaller), The magnetic attraction acting on a part can be weakened as the size of the part is reduced, and it effectively prevents the take-out operation of this part from being obstructed by an excessive attraction force acting on a small part. be able to. On the other hand, when the size of the part is large, the posture is stabilized with a relatively large attraction force adapted to the large part by reducing the gap and increasing the magnetic attraction force acting on the part. Can do. For this reason, there is an advantage that the posture of the component in the component storage unit can be stabilized with an appropriate suction force according to the size, and malfunction during component removal can be prevented more effectively.

  In the present invention, preferably, an upwardly projecting arch-shaped leaf spring member is provided on the tape conveying surface, and one end of the magnet member is pivotally supported near the top of the leaf spring member. The amount of bending of the leaf spring member that receives a downward pressing force from the carrier tape changes according to the thickness of the carrier tape, so that the gap between the other end of the magnet member and the carrier tape is variable. (Claim 2).

  According to this configuration, the gap between the magnet member and the carrier tape can be changed with a very simple and low-cost configuration utilizing the change in the amount of bending of the leaf spring member according to the thickness of the carrier tape, There is an advantage that an appropriate suction force according to the size of the component can be easily generated and the posture can be effectively stabilized.

  The invention according to claim 3 of the present application is a surface mounter that takes out a component supplied from a component supply device and mounts it on a substrate, and the component supply device according to claim 1 or 2 is used as the component supply device. A supply device is provided.

  According to the present invention, it is possible to accurately pick up a component from the component supply device and efficiently mount it on the substrate.

  As described above, according to the present invention, the posture of a component in the carrier tape can be stabilized with an appropriate suction force according to its size, and malfunctions during component removal can be prevented more effectively. can do.

  1 and 2 schematically show an example of a surface mounter 1 according to an embodiment of the present invention. As shown in these drawings, a conveyor 2 for transporting a printed circuit board P (hereinafter simply referred to as a substrate P) is disposed on a base 1A of the surface mounting machine 1, and a predetermined length is provided along the conveyor 2. The substrate P that has been transported to the mounting work position (position indicated by a two-dot chain line in FIG. 1) is positioned and fixed at the same position by a clamp or the like not shown.

  Component supply sections 3 are provided on both sides of the base 1A with the conveyor 2 interposed therebetween. This component supply unit 3 has a multi-row component supply device 4 arranged in parallel, and each component supply device 4 supplies various components t (see FIG. 5 and the like) such as an IC, a transistor and a capacitor. It has come to be.

  Above the base 1A, a component mounting head unit 5 is provided, and the head unit 5 is orthogonal to the X axis in the X axis direction (conveying direction of the conveyor 2) and the Y axis direction (horizontal plane). Each direction). That is, on the base 1A, a support member 6 movable in the Y-axis direction along a pair of fixed rails 7 is installed, and the head unit along the guide member 8 provided on the support member 6 5 is supported so as to be movable in the X-axis direction. The support member 6 is driven in the Y-axis direction via a ball screw shaft 10 that is rotationally driven by a Y-axis servo motor 9, and via a ball screw shaft 12 that is rotationally driven by an X-axis servo motor 11. The head unit 5 is driven in the X-axis direction.

  In the head unit 5, a plurality of suction heads 13 are arranged in the X-axis direction. These suction heads 13 are supported so as to be able to move in the Z-axis direction (vertical direction) and rotate around the R-axis (nozzle central axis) with respect to the main body of the head unit 5, It is driven in each of the above directions by a rotational drive mechanism.

  A nozzle 14 for sucking parts is provided at the lower end of each suction head 13. Each nozzle 14 is connected to a negative pressure supply means (not shown), and when taking out a component from the component supply device 4, negative pressure is supplied from the negative pressure supply means to the tip of the nozzle 14, The component t is attracted by the suction force due to the negative pressure.

  In the surface mounter 1 configured as described above, first, the component t supplied from the predetermined component supply device 4 of the component supply unit 3 is taken out by each suction head 13 of the head unit 5. The removed component t is transported above the substrate P as the head unit 5 moves. When the conveyed component t reaches above a predetermined mounting point on the substrate P, the suction head 13 moves up and down, so that the component t sucked on the suction head 13 is placed on the substrate P. Implemented.

  FIG. 3 is a view showing a mounting structure of the component supply unit 3. As shown in the figure, the component supply unit 3 is provided with a feeder mounting portion 16 extending along the arrangement direction (X-axis direction) of the component supply device 4, and the component supply device is connected to the feeder mounting portion 16. 4 is detachably attached in a state where a large number of 4 are arranged in parallel. In the illustrated example, the entire component supply unit 3 including the feeder attachment unit 16 and the multiple rows of component supply devices 4 held by the feeder attachment unit 16 can be attached to and detached from the base 1 </ b> A of the surface mounter 1. ing. That is, the both ends in the X-axis direction of the feeder mounting portion 16 are locked by the mounting portion 18 and the clamping means 19 provided on the base 1A, so that the component supply portion 3 is fixed on the base 1A. By releasing the clamp by the clamp means 19 from this state, the component supply unit 3 can be removed from the base 1A. Therefore, according to such a configuration, it is possible to replace the component supply devices 4 individually and also to replace the entire component supply unit 3 at once.

  FIG. 4 is a diagram specifically showing the structure of the component supply device 4. The component supply device 4 shown in the figure supplies the component t by feeding out a carrier tape 28 (details will be described later) in which the component t is stored in a predetermined direction. A main body frame 22; a feed mechanism 30 and a take-off mechanism 33 provided inside the main body frame 22; and a reel holding plate 23 attached to one end side (upstream in the feed direction) of the main body frame 22. Yes.

  A reel 26 is rotatably supported on the reel holding plate 23, and the carrier tape 28 is wound around the reel 26. Then, in accordance with the feeding operation (details will be described later) by the feeding mechanism 30, the carrier tape 28 led out from the reel 26 is fed out from the left side to the right side in FIG. 4 along the longitudinal direction of the component supply device 4. It is supposed to be. In the following description, it is assumed that the longitudinal direction of the component supply device 4 is the front-rear direction, and the front-rear direction follows the feeding direction of the carrier tape 28. That is, in FIG. 4, the right side is the front side and the left side is the rear side.

  A pair of front and rear positioning pins 22a to be inserted into attachment holes 16a formed in the feeder attachment portion 16 protrude from the lower surface of the main body frame 22 and are fixed to the front end portion of the main body frame 22. A clamp 24 is provided. Specifically, the clamp 24 is linked to a handle 25 provided at the upper end of the rear portion of the main body frame 22 via links 25a and 25b, and is switched between a clamped state and an unclamped state by swinging the handle 25. It is supposed to be. Then, the positioning pin 22a of the main body frame 22 is inserted into the mounting hole 16a of the feeder mounting portion 16, and the clamping operation by the clamp 24 is performed in this state, so that the component supply device 4 becomes the feeder mounting portion. It is fixed in a state where it is positioned with respect to 16.

  FIG. 5 is a diagram showing a specific configuration of the carrier tape 28. As shown in the figure, the carrier tape 28 is provided with component storage portions 28a that open upward at regular intervals in the longitudinal direction. Each component storage portion 28a has a small piece shape such as an IC or a transistor. The parts t are accommodated. A cover tape 29 is affixed to the upper surface of the carrier tape 28 via an adhesive or the like, and the component t accommodated in each component accommodating portion 28a is covered from above by the cover tape 29. Yes. As shown in FIG. 7 and the like, in this embodiment, a so-called embossed tape is used as the carrier tape 28, and the component storage portion 28a is provided so as to protrude downward from the other portions. .

  The carrier tape 28 is provided with a plurality of engagement holes 28b at regular intervals along a side portion on one side thereof, and a sprocket 31 of a delivery mechanism 30 described later is engaged with the engagement holes 28b. It comes to match.

  As shown in FIGS. 4 and 6, a tape transport surface 41 extending in the front-rear direction is formed on the upper side portion of the main body frame 22, and is pulled forward by the feed mechanism 30 and led out from the reel 26. The carried carrier tape 28 is fed forward along the tape transport surface 41 toward the front of the apparatus. Then, the cover tape 29 is peeled off from the carrier tape 28 in the middle of the transport path along the tape transport surface 41, and the component t in the component storage portion 28a is exposed to the outside. The part t is taken out by the suction head 13.

  Removal of the component t by the suction head 13 is performed at a component extraction position S that is located a predetermined distance downstream from the point where the cover tape 29 is peeled off. That is, when the component t exposed to the outside due to the peeling of the cover tape 29 is supplied together with the carrier tape 28 to the component extraction position S, the suction head 13 positioned above the component extraction position S is The part t is picked up by moving up and down.

  As shown in FIG. 4, the delivery mechanism 30 includes a sprocket 31 disposed at a front end portion of the main body frame 22 located below the component extraction position S, and a ratchet (not shown) coupled to the sprocket 31. And an air cylinder 32 for driving the ratchet. The driving force of the air cylinder 32 is transmitted to the sprocket 31 via the ratchet, so that the sprocket 31 rotates about its axis.

  A large number of teeth (not shown) are provided on the outer periphery of the sprocket 31 to engage with the engagement holes 28b of the carrier tape 28, and are engaged with the engagement holes 28b when supplying parts. As the sprocket 31 rotates, the carrier tape 28 is fed forward. Then, as the part t is picked up by the suction head 13 at the part picking position S, the air cylinder 32 is driven to rotate the sprocket 31 in a certain direction, and the carrier tape 28 is intermittently fed by a certain amount in accordance with this. It is supposed to be. The used carrier tape 28 after passing through the component take-out position S is led out rearward and downward through a tape discharge path 36 provided in the main body frame 22 and stored in a tape container or the like not shown. It is like that.

  The take-up mechanism 33 is disposed at a lower rear portion of the main body frame 22, and the cover tape 29 peeled off from the carrier tape 28 before the component take-out position S is taken up by the take-up mechanism 33. Yes.

  Specifically, the take-off mechanism 33 has a drive roller 34 that is rotationally driven by a drive source (not shown), and a driven roller 35 that is in pressure contact with the drive roller 34. The cover tape 37 folded back is guided and sandwiched between the rollers 64 and 65. Then, the drive roller 34 is driven to rotate, and the cover tape 29 sandwiched between the drive roller 34 and the driven roller 35 is led downward, so that the cover tape 29 is attached to the carrier tape 28. It is pulled away from the lead-out direction and peels off. Note that the cover tape 29 that has passed through the take-off mechanism 33 is led out downward and stored in a tape container or the like not shown.

  As shown in FIGS. 4 and 6, a tape guide 42 is attached to the upper end of the front portion of the main body frame 22 so as to cover a predetermined range of the tape transport surface 41 from above. The upper surface of the tape 28 is pressed and the pop-out of the tape is restricted.

  An opening 42a that is opened over a predetermined range in the front-rear direction including the component extraction position S is formed at the front portion of the tape guide 42, and the component t is taken out by the suction head 13 through the opening 42a. Is to be done. In the example shown in the drawing, the component extraction position S is set at a position near the rear end of the opening 42a.

  On the other hand, a notch 42b is formed in the rear part of the tape guide 42, and the cover tape 29 peeled off from the carrier tape 28 is pulled out from the notch 42b and folded back. Yes. Then, the carrier tape 28 after the cover tape 29 is peeled off at the installation portion of the notch 42b is further fed forward, and the component storage portion 28a is below the opening portion 42a (below the component extraction position S). ), The suction head 13 approaches from above the component t stored in the component storage portion 28a, and the component t is sucked up by the nozzle 14, thereby the component t from the component storage portion 28a. Is taken out.

  Although not shown, the tape guide 42 is provided with a shutter member that covers the opening 42a so that the opening 42a can be opened and closed, and the shutter member is opened only when the suction head 13 takes out the component t. Opening 42a prevents the component t from being accidentally popped out.

  As shown in FIG. 7, a plate spring member 50 formed in an upwardly projecting arch shape is attached below the tape guide 42 with the front and rear ends fixed to the upper surface of the tape transport surface 41. A plate-like magnet member 52 having a predetermined thickness is attached to the upper portion of the leaf spring member 50. Specifically, the magnet member 52 is pivotable in the vertical direction with the support shaft 51 as a fulcrum by the rear end portion 52b being pivotally supported near the top of the leaf spring member 50 via the support shaft 51. In this state, the plate spring member 50 is attached. In FIG. 7, a line passing through the top of the leaf spring member 50 is represented as L, and the position of the support shaft 51 (that is, the position of the pivot point of the magnet member 52) passes through the top of the plate spring member 50. The position is set slightly offset forward from the line L.

  The magnet member 52 is installed so as to extend in the front-rear direction over a range from the vicinity of the point where the cover tape 29 is peeled (that is, the installation portion of the notch 42b) to the lower side of the component extraction position S. . Then, by arranging the magnet member 52 at such a position, a magnetic attraction force by the magnet member 52 acts on the component t transported to the component pick-up position S or the vicinity thereof, and the component t becomes It is designed to be drawn downward.

  Of the magnet member 52, the rear end portion 52b pivotally supported near the top of the plate spring member 50 is urged upward by the plate spring member 50, whereby the carrier tape after the cover tape 29 is peeled off. It is pressed against the lower surface of 28 (more specifically, the lower surface of the component storage portion 28a). On the other hand, the front end portion 52 a of the magnet member 52 positioned below the component extraction position S is disposed at a height position slightly lower than the lower surface of the carrier tape 28. That is, as described above, the magnet member 52 having the rear end portion 52b pivotally supported in the vicinity of the top portion of the leaf spring member 50 is slightly inclined in a front-down manner along the tangent line of the outer peripheral surface of the leaf spring member 50. As a result, a slight gap indicated by symbol C in the figure is formed between the front end portion 52a of the magnet member 52 and the lower surface of the component storage portion 28a of the carrier tape 28. ing.

  Here, in the example of FIG. 7, a tape having a relatively thick thickness (that is, a relatively large height of the component storage portion 28a) is used as the carrier tape 28. In such a case, Since the component storage portion 28a of the carrier tape 28 pushes down the rear end portion 52b of the magnet member 52 to a relatively low height, the leaf spring member 50 is bent and deformed so as to sink greatly downward. As a result, the curvature of the leaf spring member 50 is reduced, and the magnet member 52 is inclined forwardly downward along the tangent line of the leaf spring member 50 at a very gentle inclination angle (that is, an angle close to the horizontal direction). Thus, the gap C between the front end portion 52a of the magnet member 52 and the component storage portion 28a is maintained at a very small value as illustrated.

  On the other hand, FIG. 8 shows a case where a relatively thin tape (that is, a relatively small height of the component storage portion 28a) is used as the carrier tape 28. In such a case, The amount of downward bending of the leaf spring member 50 is reduced by the thin thickness of the carrier tape 28, and the curvature thereof is increased. Then, the magnet member 52 is attached along the tangent line of the leaf spring member 50 having an increased curvature in this manner, whereby the inclination angle of the magnet member 52 is lowered downward. As a result, the magnet member 52 The gap C between the front end portion 52a and the component storage portion 28a is relatively enlarged as compared with the case of FIG. 7 (that is, when the thickness of the carrier tape 28 is thick).

  As described above, the component supply device 4 of the above embodiment sends out the carrier tape 28 in which the component storage portions 28a for storing the component t are provided at regular intervals along the tape transport surface 41. The component t is supplied from the component storage portion 28a to the component extraction position S where the component t is extracted, and below the component extraction position S, the tape transport surface 41 and the carrier tape 28 passing thereabove. Between the magnet tape 52 (more specifically, the front end 52a thereof) and the carrier tape 28, the thinner the carrier tape 28 is, the thinner the carrier tape 28 is. It is configured to expand. According to such a configuration, the posture of the part t in the carrier tape 28 can be stabilized with an appropriate suction force according to the size, and the malfunction at the time of taking out the part t can be prevented more effectively. There is an advantage that you can.

  That is, in the above embodiment, when the component t stored in the component storage portion 28a of the carrier tape 28 reaches the component take-out position S, the components in the component storage portion 28a are disposed from the magnet member 52 disposed below the component t. Since a magnetic attraction force acts on t, and this pulls the component t downward, the component t in the component storage portion 28a rises or tilts due to vibration or static electricity during tape feeding. This is advantageous in that the posture of the component t at the component extraction position S is further stabilized.

  In addition, the gap C between the magnet member 52 and the carrier tape 28 increases as the thickness of the carrier tape 28 decreases (that is, when the size of the component t housed therein is smaller). The magnetic attraction force acting on the component t from the magnet member 52 can be weakened as the size of the component t is reduced, and an excessive attraction force acts on the small component t, so that the operation of taking out the component t can be performed. It is possible to effectively prevent obstruction (that is, it becomes difficult to suck the component t by the suction head 13). On the other hand, when the size of the component t is large, the gap C is reduced to increase the magnetic attractive force acting on the component t, thereby stabilizing the posture with a relatively large attractive force adapted to the large component t. Can be achieved. For this reason, the posture of the component t in the component storage portion 28a can be stabilized with an appropriate suction force according to the size, and the malfunction when the suction head 13 takes out the component t (that is, the suction head 13 is There is an advantage that it is possible to more effectively prevent the component t from being missed or adsorbed in an abnormal posture.

  In particular, in the above-described embodiment, the upwardly projecting arched leaf spring member 50 is provided on the tape transport surface 41, and the rear end portion 52 b of the magnet member 52 is pivotally supported near the top of the leaf spring member 50. At the same time, the amount of bending of the leaf spring member 50 that receives a downward pressing force from the carrier tape 28 changes according to the thickness of the carrier tape 28, whereby the front end portion 52a of the magnet member 52 and the carrier tape 28. Since the gap C with the magnetic tape 28 is variable, the magnet member can be constructed with a very simple and low-cost structure utilizing a change in the amount of bending of the leaf spring member 50 according to the thickness of the carrier tape 28. The gap C between the magnetic tape 52 and the carrier tape 28 can be changed, and an appropriate suction force corresponding to the size of the component t can be easily generated to effect the posture. There is an advantage that it can be stabilized.

  In the above embodiment, the front end portion 52a of the magnet member 52 is moved up and down in accordance with the bending deformation (that is, the change in curvature) of the leaf spring member 50, whereby the gap C between the magnet member 52 and the carrier tape 28 is set. Although changed, the mechanism for making the gap C variable is not limited to the one using the leaf spring member 50. For example, like the magnet member 102 shown in FIG. 9, the same effect can be obtained by using the tilting operation of the cam 103.

  That is, in the example of FIG. 9, the rear end portion 102 b of the magnet member 102 is pivotally supported on the upper end of the protruding portion 101 projecting from the upper surface of the tape transport surface 41, and the front end portion 102 a of the magnet member 102 is , And is supported from below by an egg-shaped cam 103 rotatably provided around the support shaft 104. FIG. 9 shows a state in which the cam 103 protrudes most upward with respect to the tape transport surface 41. In this state, the front end portion 102a of the magnet member 102 is supported at the highest position. The gap C ′ between the magnet member 102 and the lower surface of the carrier tape 28 is the smallest. Then, the cam 103 gradually tilts from this state, and the height of the front end portion 102a of the magnet member 102 decreases accordingly, so that the size of the gap C ′ gradually increases. Yes. The cam 103 is linked to an electric motor (not shown), and the tilting angle of the cam 103 is changed by operating the electric motor according to a change in the thickness of the carrier tape 28. . The thickness of the carrier tape 28 can be determined based on, for example, the model number of the carrier tape 28 included in the production program input in advance.

  As described above, according to the example of FIG. 9, the gap C ′ between the magnet member 102 and the carrier tape 28 can be freely changed according to the tilt of the cam 103. However, as in the above-described embodiment shown in FIGS. 7 and 8 and the like, if the gap C is changed using the bending deformation of the leaf spring member 50, the structure is simple and the cost is low. Is advantageous.

1 is a plan view schematically showing an overall configuration of a surface mounter according to an embodiment of the present invention. It is a front view of the surface mounter. It is a front view which shows the attachment structure of a components supply part. It is a side view which shows the specific structure of a components supply apparatus. It is a perspective view which shows the specific structure of a carrier tape. It is the top view which looked at the front part upper end of the said component supply apparatus from upper direction. It is side surface sectional drawing of the front part upper end of the said component supply apparatus, and is a figure which shows the state of a magnet member in case the thickness of a carrier tape is thick. FIG. 8 is a view corresponding to FIG. 7 showing a state of the magnet member when the thickness of the carrier tape is thin. It is a figure for demonstrating the modification of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Surface mounter 4 Component supply apparatus 28 Carrier tape 28a Component storage part 41 Tape conveyance surface 50 Leaf spring member 52,102 Magnet member C, C 'Gap P Printed circuit board (board | substrate)
S Parts removal position t Parts

Claims (3)

A component supply device that supplies a component from the component storage portion to a component take-out position where the component is taken out by feeding a carrier tape provided with a component storage portion for storing the components at regular intervals along the tape transport surface. Because
A magnet member located between the tape conveying surface and the carrier tape passing thereabove is provided below the component take-out position, and a gap between the magnet member and the carrier tape is provided between the carrier tape and the carrier tape. A component supply device configured to expand as the thickness decreases. The component supply apparatus according to claim 1,
An upwardly projecting arch-shaped leaf spring member is provided on the tape conveying surface, and one end of the magnet member is pivotally supported near the top of the leaf spring member, and the downward pressing force from the carrier tape The gap between the other end of the magnet member and the carrier tape is variable by changing the amount of bending of the plate spring member that receives the magnetic tape according to the thickness of the carrier tape. Feeding device. A surface mounter that takes out a component supplied from a component supply device and mounts it on a substrate,
A surface mounter comprising the component supply device according to claim 1 or 2 as the component supply device.

Images