JP2009266346A - Magnetic disk device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a magnetic disk device for suppressing increase in temperature of a semiconductor laser and prevent deterioration and damage thereof. <P>SOLUTION: The magnetic disk device of a thermal assist system includes a magnetic disk 2, a motor 6 rotating the magnetic disk 2, a slider 3 having a recording coil, a semiconductor laser 101, and a waveguide 102 guiding light from the semiconductor laser onto the magnetic disk. A base 7 holding the motor and a disk side lid 11 provided on the base 7 form a first space. The magnetic disk 2, motor 6 and slider 3 are disposed in the first space. The semiconductor laser 101 is disposed in a second space formed independent of the first space. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a magnetic disk apparatus, and more particularly, to a magnetic disk apparatus suitable for use in a heat-assisted system that incorporates a semiconductor laser and combines an optical recording system and a magnetic recording system.

  A heat-assisted magnetic disk device has a semiconductor laser mounted inside, and a light path in the waveguide from the light emitting part near the slider to the semiconductor laser mounted on the base via the substrate for heating the disk surface. Is known (for example, see Patent Document 1).

US Pat. No. 6,636,0035

  Patent Document 1 discloses a technology of a heat-assisted magnetic disk device in which a semiconductor laser is mounted inside a housing and combines an optical recording method and a magnetic recording method. However, the semiconductor laser is mounted in the same space as the rotating disk inside the housing of the magnetic disk device, and no consideration is given to cooling of the semiconductor laser that generates heat. As a result, the semiconductor laser is exposed to the air flow in the disk rotation space, and is therefore affected by the air whose temperature has increased due to the heat generated by the motor or the like. Further, even when there is no heat generation, the temperature rises to near the internal air temperature. As a result, the temperature of the active layer of the semiconductor laser rises. In semiconductor lasers, the allowable temperature for causing the active layer to emit light stably is determined by the material used and the fine structure in the laser, for example, an absolute Celsius temperature of 90 ° C. When the temperature exceeds a certain temperature, the laser active layer exceeds the allowable temperature, causing a problem of long-term deterioration or damage.

  An object of the present invention is to provide a magnetic disk device capable of preventing deterioration and damage by suppressing a temperature rise of a semiconductor laser.

(1) In order to achieve the above object, the present invention provides a magnetic disk, a motor for rotating the magnetic disk, a slider having a recording coil, a semiconductor laser, and light from the semiconductor laser on the magnetic disk. A first space formed by a magnetic disk base holding the motor and a disk side lid provided on the magnetic disk base. And a second space formed independently of the first space, the magnetic disk, the motor, and the slider are disposed in the first space, and the second space The semiconductor laser is arranged inside.
With this configuration, the temperature rise of the semiconductor laser can be suppressed and deterioration or damage can be prevented.

  (2) In the above (1), preferably, the semiconductor laser substrate having the semiconductor laser mounted thereon is interposed between the magnetic disk base and the semiconductor laser substrate, and has a lower thermal conductivity than the magnetic disk base. A heat conducting member is provided.

  (3) In the above (2), preferably, the heat conducting member is ceramic or resin.

  (4) In the above (1), preferably, the recording coil is provided with a flexible substrate for electrical wiring, and the waveguide is formed integrally with the flexible substrate.

  (5) In the above (1), preferably, a semiconductor laser substrate on which the semiconductor laser is mounted, and a circuit board on the back side of the magnetic disk base on which electronic components for controlling the magnetic recording system are mounted. The semiconductor laser substrate and the circuit substrate are provided with a heat conducting member that is thermally coupled.

  (6) In the above (1), preferably, a semiconductor laser substrate on which the semiconductor laser is mounted is provided, and the semiconductor laser and the semiconductor laser substrate are accommodated in the second space.

  (7) In the above (1), preferably, a mirror for emitting light from the semiconductor laser is built in, a first connector to which the waveguide is connected, and a first connector provided on the emitting side of the semiconductor laser. And the first connector and the second connector are connected to guide the emitted light of the semiconductor laser to the waveguide.

  (8) In the above (1), preferably, a plurality of the semiconductor lasers are provided, and the semiconductor laser substrate is formed in a step shape in the height direction, and at different positions in each height direction, Each of the plurality of semiconductor lasers is installed.

  (9) In the above (1), preferably, a heat pipe is provided, and a heat receiving portion of the heat pipe is coupled to the semiconductor laser substrate.

(10) In the above (9), preferably
A semiconductor laser board on which the semiconductor laser is mounted; and a circuit board on the back side of the magnetic disk base on which electronic components for controlling a magnetic recording system are mounted. The semiconductor laser board on the circuit board Is mounted on the circuit board, and a hole is provided between a portion immediately below the semiconductor laser substrate and another substrate portion.

  (11) In the above (1), preferably, a Peltier element bonded to the semiconductor laser substrate is provided.

(12) In order to achieve the above object, the present invention provides a magnetic disk, a motor for rotating the magnetic disk, a slider having a recording coil, a semiconductor laser, and light from the semiconductor laser. A heat-assisted magnetic disk device having a waveguide guided onto a disk, the semiconductor laser substrate on which the semiconductor laser is mounted, and an electron for controlling a magnetic recording system provided on the back side of the magnetic disk base A circuit board on which components are mounted is provided, and the semiconductor laser board and the circuit board are thermally insulated.
With this configuration, the temperature rise of the semiconductor laser can be suppressed and deterioration or damage can be prevented.

  According to the present invention, the temperature rise of the semiconductor laser can be suppressed and deterioration and damage can be prevented.

The configuration of the magnetic disk device according to the first embodiment of the present invention will be described below with reference to FIGS.
First, the overall configuration of the magnetic disk device according to the first embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a plan view showing the configuration of the magnetic disk device according to the first embodiment of the present invention. FIG. 2 is a side view showing the configuration in the vicinity of the slider in the magnetic disk apparatus according to the first embodiment of the present invention. FIG. 3 is a bottom view showing the configuration of the magnetic disk device according to the first embodiment of the present invention. 4 is a cross-sectional view taken along line AA in FIG. 1 to 4, the same reference numerals indicate the same parts.

  In FIG. 1, as a configuration of a conventional magnetic disk device only of a magnetic recording system, a magnetic disk device 1 of this embodiment includes a disk 2, a slider 3, a suspension 4, an arm 5, a motor 6, and a base 7. A flexible substrate 8, an on-base circuit substrate 9, and a connector 10.

  The disk 2 is coated with a magnetic material on the surface and has a recording surface. The slider 3 has a built-in recording coil and floats with a small gap of about several nanometers from the disk 2 by the action of fluid force. The suspension 4 mechanically elastically supports the slider 3. The arm 5 moves the slider 3 to an arbitrary position on the disk 2 by rotational movement. A motor 6 for rotating the disk is attached to a base 7 formed mainly from an aluminum casting. A flexible substrate 8 that performs signal wiring to the recording coil inside the slider 3 is connected to the circuit board 9 on the base via a connector 10.

  Next, as a configuration necessary for the optical recording system, a semiconductor laser 101 serving as a light source, a waveguide 102, and an optical connector 103 are provided. Although FIG. 1 shows an example of four semiconductor lasers 101, there may be one semiconductor laser for one slider or one semiconductor laser for a plurality of sliders such as an array laser. The semiconductor laser 101 has a characteristic that the light output varies greatly depending on the operating temperature. For this reason, it is necessary to keep the operating temperature constant within a certain range in order to emit stable laser light.

  A waveguide 102 for guiding the light of the semiconductor laser 101 to the vicinity of the recording coil of the slider 3 is coupled to the semiconductor laser 101 via the optical connector 103. The waveguide 102 is preferably an optical fiber excellent in flexibility, such as a polymer. In FIG. 1, a plurality of fibers are arranged in a direction perpendicular to the paper surface. By adopting a structure in which the optical fiber is protected and supported by a thin polyimide film material or the like, the elasticity is reduced and the high-speed rotation operation of the arm is not hindered.

  Moreover, the flexible substrate for electrical wiring and the waveguide can be integrally formed by sandwiching the optical fiber to be the waveguide 102 between the two resin plates of the flexible substrate 8.

  The feature of this embodiment is that the base 7 on which the disk rotation motor 6 is fixed and the substrate 104 on which the semiconductor laser 101 is mounted are separated by separate components. A heat insulating member 105 having a lower thermal conductivity than the base 7 is interposed between the base 7 and the substrate 104. Thereby, the base 7 and the semiconductor laser substrate 104 are mechanically fixed by the heat insulating member 105. The heat insulating member 105 is made of ceramic or resin having a low thermal conductivity with respect to the aluminum base 7. Thereby, the substrate 104 on which the semiconductor laser 101 is mounted and the base 7 of the magnetic disk are thermally insulated. Further, the lid 11 for partitioning from the outside for the purpose of preventing the entry of dust or the like into the space 71 having the disk 2 inside, and the lid 106 provided on the substrate container on which the semiconductor laser is mounted are separately configured. is doing.

  FIG. 2 shows a state in the vicinity of the slider of the heat-assisted magnetic disk apparatus as viewed from the side of the slider.

  As shown in FIG. 2, the slider 3 is provided on the lower surface of the suspension 4. Inside the slider 3, a coil 31 for recording on a magnetic material on the surface of the disk is incorporated. Light is incident on the waveguide 102 in the direction indicated by the arrow L in order to guide the light intended for heating near the recording coil 31. In the vicinity of the recording coil 31, a mirror 151 and a lens 152 are provided. The light passing through the inside of the waveguide 102 is bent by 90 ° by the mirror 151, condensed to a minute spot by the lens 152, and the temperature of a minute part of about several tens of nm square on the disk 2 is adjusted. For example, the temperature can be increased to a high temperature of 200 ° C. or higher. As a result, since the coercive force of the heated local magnetic material on the disk is temporarily lowered, information can be written to the disk 2 by energizing the recording coil 31 with a signal. Next, by stopping the light irradiation to the disk 2, the disk 2 is rotating, so that the magnetically recorded local area is rapidly cooled, and the written information is stably held. As described above, recording by the heat assist method is possible.

  FIG. 3 shows a configuration of the magnetic disk device shown in FIG. 1 viewed from the back side of the drawing.

  In FIG. 3, a circuit board 13 on which a large number of electronic components 12 are mounted is provided on the back side of the base 7. The circuit board 13 is mounted with electronic components 12 for controlling the rotation of the motor 6, the rotation of the arm 5, and sending the recording signal to the recording coil 13 of the slider 3. It is used for. As the circuit board 13, for example, a common double-sided multilayer board made of glass epoxy is used. The circuit board 13 is attached to the back surface of the disk with substantially the same outer shape as the base 7.

  In FIG. 4, a base 7 that fixes and supports the motor 6 and a substrate (submount substrate) 104 on which the semiconductor laser 101 is mounted are formed of different members, and a heat insulating member 105 is interposed between them. The disk 2 is supported by the motor shaft 61 of the motor 6. As for the lid for preventing the entry of dust and the like, the lid 11 in which the disk is built in and the lid 106 for housing the semiconductor laser are provided separately. The semiconductor laser 101 is bonded onto the submount substrate 104 with a solder material 1011 such as AuSn. The submount substrate 104 uses aluminium nitride (AlN), silicon carbide (SiC), or the like having high thermal conductivity so that the heat dissipation performance is high. Further, the surface of the submount substrate 104 is partially metallized such as Au for bonding and wiring, thereby facilitating soldering. The back surface of the submount substrate 104 is mechanically and thermally coupled to a part of the circuit substrate 13 on the back surface shown in FIG. 3 via a heat conductive member 1013 made of metal or the like having high heat conductivity.

  In FIG. 4, the slider 3 shown in FIG. 1 is not shown.

  Next, the operation of the magnetic disk device according to the present embodiment will be explained.

  In the case of a conventional magnetic disk device, when the disk 2 is rotated by the rotation operation of the motor 6, the heat generated by the motor is transmitted to the base 7 in contact with the metal. Further, it is transmitted from the motor shaft 61 to one or a plurality of disks 2. Since the surface of the base 7 facing the disk 2 has a high linear peripheral speed of several tens of meters per second, the internal air circulates by the rotation of the disk. As a result, the heat transfer coefficient of the surface of the base surface that comes into contact with the internal air is increased, and the heat from the motor is transmitted to the internal air. When the heat transfer coefficient of the outer surface is high, such as a high wind speed outside the magnetic disk device housing, the temperature of the internal air is efficiently transmitted from the magnetic disk device to the external air. In this case, the temperature rise of the air inside the magnetic disk device is small, but when the heat transfer coefficient on the outer surface of the magnetic disk device is small in a notebook computer or the like, the temperature of the air inside the temperature rises from several degrees C. to about 10 degrees C. In such an environment, when the semiconductor laser 101 in the heat assist method is energized for light emission, the temperature of the semiconductor laser rises with reference to the internal air temperature that has become high-temperature air due to motor heat generation. That is, the temperature of the active layer of the semiconductor laser rises on the basis of the temperature rise of the base and the internal air about several to 10 ° C. The semiconductor laser is determined by the material to be used and the fine structure in the laser so that the allowable temperature for causing the active layer to emit light stably is, for example, 90 ° C. in absolute Celsius. When the temperature exceeds a certain temperature, there is a problem that the laser active layer exceeds the allowable temperature and deteriorates or is damaged for a long time.

  On the other hand, in the configuration of this embodiment shown in FIGS. 1 to 4, the heat generated from the semiconductor laser is transmitted from the connection layer 1011 to the submount substrate 104 by heat conduction, and from the heat conducting member 1013 to the back circuit board 13. . The apparent thermal conductivity in the thickness direction of the circuit board 13 is as small as that of a resin, but the area in the plane direction is relatively large, and a multilayer board is provided with a plurality of metallic ground layers inside. For this reason, heat spreads over a wide area of the circuit board, and heat can be transferred to the outside of the magnetic disk apparatus to generate heat. Further, since the emissivity of the circuit board 13 is about 0.8 to 0.9, which is generally higher than that of an untreated metal surface, heat can be efficiently radiated by the action of radiation to the outside.

  Further, by separating the submount substrate from the base and further separating the lid for the disk space and the lid for the semiconductor laser, heat conduction through the lid can be suppressed. As a result, the internal air temperature rise usually occurs in the rotating space of the disk by about several to 10 ° C., but does not come into contact with the internal air and does not affect the temperature of the semiconductor laser. In addition, since the semiconductor laser that generates heat is not connected to the base portion, the base does not undergo thermal deformation and does not hinder high-precision positioning for high-density recording.

Next, the configuration in the vicinity of the semiconductor laser 101 in the magnetic disk device according to the first embodiment of the present invention will be described with reference to FIGS.
FIG. 5 is a plan view showing a configuration in the vicinity of the semiconductor laser in the magnetic disk apparatus according to the first embodiment of the present invention. FIG. 6 is a front view showing a configuration in the vicinity of the semiconductor laser in the magnetic disk apparatus according to the first embodiment of the present invention. 5 and 6, the same reference numerals as those in FIGS. 1 to 4 indicate the same parts.

  FIG. 5 shows the structure of the optical connector 103 from the semiconductor laser 101 to the waveguide 102 in FIG. On the emission side of the semiconductor laser 101 mounted on the submount substrate 104, a female connector 103b to which a plurality of waveguides 103c are fixed is provided. On the other hand, a male connector 103a having a built-in mirror 103d for changing the angle of light by 90 ° is provided at the end on the waveguide 102 side. The light of the semiconductor laser 101 can be guided to the waveguide 102 by inserting the connector 103b into the connector 103a and fixing it at a predetermined position. The semiconductor laser 101 can be easily replaced by pulling out the connector 103b.

  FIG. 6 shows the optical axis direction of the semiconductor laser 101 in FIG. The light emitted from the semiconductor laser active layer 101a to the back side in the direction perpendicular to the paper surface is bent inside the connector 103a, guided to the inside of the waveguide 102, and emitted in the direction of the arrow L1. In order to guide light to a plurality of fibers having different height directions inside the waveguide 102 in FIG. 6, a step-like step 104 a is provided on the submount substrate 104 on which the semiconductor laser 101 is mounted. The step 104a can be easily molded as long as it is ceramic.

  The heat dissipation path of the semiconductor laser is in the direction of the arrow H1, and the stepped step 104a has a difference in thermal resistance, but the difference in the installation height of the fiber in the waveguide 102 is about several tens to several hundreds μm. The difference in thermal resistance is small and does not matter. Alternatively, the stepped step 104a can be configured by changing the thickness of the metallized layer such as Au.

  As described above, according to the present embodiment, in the heat-assisted magnetic disk device that combines the optical recording method and the magnetic recording method, by efficiently cooling the semiconductor laser during light emission to a predetermined temperature or less, It emits light stably and can prevent deterioration and damage.

Next, the configuration of the magnetic disk device according to the second embodiment of the present invention will be described with reference to FIGS.
FIG. 7 is a cross-sectional view showing the configuration of the magnetic disk device according to the second embodiment of the present invention. FIG. 8 is a plan view showing the configuration of the magnetic disk device according to the second embodiment of the present invention. 7 and 8, the same reference numerals as those in FIGS. 1 to 6 denote the same parts.

  This embodiment is different from the first embodiment in that the electric circuit board 9 housed in the disk built-in space in FIG. 1 is housed in the same space as the semiconductor laser 101.

  With this configuration, in the embodiment shown in FIG. 1, the electrical connector 10 of the flexible circuit board 8 and the optical connector 103 of the waveguide 102 are configured as separate parts. The same connector 10A can be used. As a result, the number of parts is reduced and the assemblability is improved.

  Further, when there is a heat generating component on the circuit board 9, another heat conductive member (not shown) is formed from the circuit board 9 up to the heat conductive member 1013, so that the component on the substrate that generates heat together with the semiconductor laser 101 can be efficiently used. Can cool well.

  According to the present embodiment, in the thermally assisted magnetic disk device that combines the optical recording method and the magnetic recording method, the semiconductor laser during light emission is efficiently cooled to a predetermined temperature or less, thereby stably emitting light. Deterioration and damage can be prevented.

  Further, by sharing the connector, the number of parts can be reduced and the assemblability can be improved.

Next, the configuration of the magnetic disk device according to the third embodiment of the present invention will be described with reference to FIGS.
FIG. 9 is a bottom view showing the configuration of the magnetic disk device according to the third embodiment of the present invention. FIG. 10 is a cross-sectional view showing a configuration of a magnetic disk device according to the third embodiment of the present invention. 9 and 10, the same reference numerals as those in FIGS. 1 to 8 denote the same parts.

  As shown in FIG. 9, the back surface portion of the submount substrate 104 on which the semiconductor laser 101 is mounted is partially exposed from the circuit substrate 13. Then, as shown in FIGS. 9 and 10, a cooling structure mounting bracket 1014 is mounted at a position corresponding to the back surface of the submount substrate 104. The heat receiving portion of the flat heat pipe 1015 is fastened and fixed to the cooling structure mounting bracket 1014 with a screw or the like, and the heat radiating portion 1016 having an enlarged heat transfer surface at the other end is provided at a position where the air flow is relatively fast.

  With such a configuration, the heat of the semiconductor laser 101 can be effectively guided to a portion having a high air flow rate by a dedicated heat radiating surface. Even a high-power semiconductor laser or a semiconductor laser that continuously oscillates and generates a large amount of heat can obtain sufficient cooling performance. Further, since the semiconductor laser temperature is controlled by the air temperature, it is possible to prevent the semiconductor laser from being affected by the temperature rise and fall caused by the rotating operation of the disk.

  In FIG. 9 and FIG. Although an example of a heat pipe using phase change inside has been shown, a metal rod having a high thermal conductivity such as a copper alloy can also be used.

  According to the present embodiment, in the thermally assisted magnetic disk device that combines the optical recording method and the magnetic recording method, the semiconductor laser during light emission is efficiently cooled to a predetermined temperature or less, thereby stably emitting light. Deterioration and damage can be prevented.

  In addition, the cooling performance can be improved by providing a dedicated heat radiating section.

Next, the configuration of a magnetic disk device according to the fourth embodiment of the present invention will be described with reference to FIGS.
FIG. 11 is a cross-sectional view showing a configuration of a magnetic disk device according to the fourth embodiment of the present invention. FIG. 12 is a plan view showing the configuration of the magnetic disk device according to the fourth embodiment of the present invention. 11 and 12, the same reference numerals as those in FIGS. 1 to 10 denote the same parts.

  The configuration in the present embodiment is basically the same as that shown in FIGS. However, the back surface of the submount substrate 104 is mechanically and thermally coupled to a part of the circuit board 13 through a heat conductive member 1013 having high heat conductivity. That is, as an assembly order in the present embodiment, the submount substrate 104 on which the semiconductor laser 101 is mounted is mounted on the circuit board 13 and assembled as a magnetic disk device. This assembly order is higher in assembly than the case shown in FIGS. 9 and 10.

  The cooling structure mounting bracket 1014 is mounted on the circuit board 13. The heat receiving portion of the flat heat pipe 1015 is fastened and fixed to the cooling structure mounting bracket 1014 with a screw or the like, and the heat radiating portion 1016 having an enlarged heat transfer surface at the other end is provided at a position where the air flow is relatively fast.

  In the case where the submount substrate 104, the circuit board 13 and the cooling structure mounting bracket 1014 are stacked in this order, heat does not flow from the portion immediately below the submount substrate 104 of the circuit board 13 to the other substrate portions. There is a need. Therefore, as shown in FIG. 11, a hole 131b is provided in the circuit board 12 between the portion immediately below the submount substrate 104 of the circuit board 13 and the other substrate part.

  As shown in FIG. 12, the holes 131a, 131b, and 131c are provided around the portion immediately below the submount substrate 104 of the circuit board 13 to increase the thermal resistance in the surface direction. As a result, only the portion directly below the submount substrate 104 of the circuit board 13 can be thermally conducted in the thickness direction, and heat can be prevented from flowing to other substrate portions.

  According to the present embodiment, in the thermally assisted magnetic disk device that combines the optical recording method and the magnetic recording method, the semiconductor laser during light emission is efficiently cooled to a predetermined temperature or less, thereby stably emitting light. Deterioration and damage can be prevented.

  In addition, the cooling performance can be improved by providing a dedicated heat radiating section.

  Furthermore, heat can be prevented from flowing from the portion immediately below the submount substrate of the circuit substrate to other substrate portions.

Next, the configuration of a magnetic disk device according to the fifth embodiment of the present invention will be described with reference to FIG.
FIG. 13 is a sectional view showing the structure of a magnetic disk device according to the fifth embodiment of the present invention. In FIG. 13, the same reference numerals as those in FIGS. 1 to 12 denote the same parts.

  In this embodiment, a Peltier element 1017 is additionally provided to the cooling structure mounting bracket 1014 in the embodiment shown in FIG.

  With such a configuration, it is possible to generate a temperature lower than room temperature on the cooling structure mounting bracket side by energizing the Peltier element 1017. As a result, it is possible to use the semiconductor laser at a temperature lower than the environmental temperature, and it is possible to apply a heat-assisted magnetic disk device that can operate stably even under high-temperature conditions such as in-vehicle use.

  According to the present embodiment, in the thermally assisted magnetic disk device that combines the optical recording method and the magnetic recording method, the semiconductor laser during light emission is efficiently cooled to a predetermined temperature or less, thereby stably emitting light. Deterioration and damage can be prevented.

  Moreover, the cooling performance can be further improved by providing a dedicated heat radiating section and cooling with a Peltier element.

Next, the mounting structure of the magnetic disk device according to the third to fifth embodiments of the present invention will be described with reference to FIG.
FIG. 14 is a cross-sectional view showing the mounting structure of the magnetic disk device according to the third to fifth embodiments of the present invention. In FIG. 14, the same reference numerals as those in FIGS. 1 to 13 denote the same parts.

  In this example, a configuration is shown in which the magnetic disk device according to the embodiment shown in FIGS. 9 to 13 is mounted in a forced air-cooled casing equipped with a fan such as a desktop personal computer, a hard disk recorder, or a car navigation system. .

  When the magnetic disk device 1 is installed in the vicinity of a relatively large electronic component 92 such as an electronic tuner in a device including the forced air cooling fan 91, the air flow of the fan is partially obstructed. As a result, the amount of heat released by the air flow of the magnetic disk device 1 is reduced. Therefore, by thermally coupling the heat radiating portion 1016b to the inner side surface of the housing, the outer surface of the housing becomes a heat radiating surface, and heat radiation H2 by natural convection and radiation becomes possible.

  According to this example, the degree of freedom for mounting electronic components in the housing is improved.

Next, the configuration of a magnetic disk device according to the sixth embodiment of the present invention will be described with reference to FIG.
FIG. 15 is a plan view showing the configuration of the magnetic disk device according to the sixth embodiment of the present invention. In FIG. 16, the same reference numerals as those in FIGS. 1 to 12 denote the same parts.

  In the example shown in FIGS. 1 to 12, the circuit board 9 is installed on the outer peripheral side of the rotating portion of the disk 2 with the flexible substrate 102 and the waveguide 8 as a boundary.

On the other hand, in the present embodiment, the circuit board 9 is installed on the inner peripheral side of the rotating portion of the disk 2 with the flexible substrate 102 and the waveguide 8 as a boundary. That is, by forming the air flow by the waveguide 102 installed so as to block the air flow in the direction perpendicular to the paper surface, cooling can be performed even when a heat-generating component is mounted on the circuit board 9. Become.

1 is a plan view showing a configuration of a magnetic disk device according to a first embodiment of the present invention. 1 is a side view showing a configuration in the vicinity of a slider in a magnetic disk device according to a first embodiment of the present invention. 1 is a bottom view showing a configuration of a magnetic disk device according to a first embodiment of the present invention. It is AA sectional drawing of FIG. 1 is a plan view showing a configuration in the vicinity of a semiconductor laser in a magnetic disk device according to a first embodiment of the present invention. 1 is a front view showing a configuration in the vicinity of a semiconductor laser in a magnetic disk device according to a first embodiment of the present invention. It is sectional drawing which shows the structure of the magnetic disc apparatus by the 2nd Embodiment of this invention. It is a top view which shows the structure of the magnetic disc unit by the 2nd Embodiment of this invention. It is a bottom view which shows the structure of the magnetic disc apparatus by the 3rd Embodiment of this invention. It is sectional drawing which shows the structure of the magnetic disc apparatus by the 3rd Embodiment of this invention. It is sectional drawing which shows the structure of the magnetic disc apparatus by the 4th Embodiment of this invention. It is a top view which shows the structure of the magnetic disc apparatus by the 4th Embodiment of this invention. It is sectional drawing which shows the structure of the magnetic disc apparatus by the 5th Embodiment of this invention. It is sectional drawing which shows the mounting structure of the magnetic disc apparatus by the 3rd-5th embodiment of this invention. It is a top view which shows the structure of the magnetic disc apparatus by the 6th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Composite type thermally assisted magnetic disk apparatus of optical recording system and magnetic recording system, 2 ... Disk, 3 ... Slider, 4 ... Suspension, 5 ... Arm, 6 ... Motor, 7 ... Base, 8 ... Flexible substrate for signals, 9 DESCRIPTION OF SYMBOLS ... Circuit board, 10 ... Circuit board connector, 11 ... Disc side cover, 12 ... Electronic component, 13 ... Circuit board, 31 ... Recording coil, 61 ... Motor shaft, 71 ... Disk internal space, 9 ... Circuit board, 101 ... Semiconductor laser, 102 ... Waveguide, 103 ... Optical connector, 104 ... Submount substrate, 105 ... Low thermal conductivity (heat insulating) member, 106 ... Semiconductor laser side cover, 151 ... Mirror, 152 ... Lens, 1011 ... Joint material, 1013 ... Heat conduction member, 1014 ... Connection surface, 1015 ... Heat pipe, 1016 ... Heat radiation part, 1017 ... Peltier element

Claims (12)

A heat-assisted magnetic disk device having a magnetic disk, a motor for rotating the magnetic disk, a slider having a recording coil, a semiconductor laser, and a waveguide for guiding light from the semiconductor laser onto the magnetic disk. There,
A first space formed by a magnetic disk base for holding the motor and a disk side lid provided on the magnetic disk base;
A second space formed independently of the first space,
In the first space, the magnetic disk, the motor, and the slider are arranged,
A magnetic disk device, wherein the semiconductor laser is disposed in the second space. The magnetic disk apparatus according to claim 1,
A semiconductor laser substrate on which the semiconductor laser is mounted;
A magnetic disk device comprising a heat conducting member interposed between the magnetic disk base and the semiconductor laser substrate and having a lower thermal conductivity than the magnetic disk base. The magnetic disk device according to claim 2,
The magnetic disk device, wherein the heat conducting member is ceramic or resin. The magnetic disk apparatus according to claim 1,
Comprising a flexible substrate for electrical wiring to energize the recording coil;
A magnetic disk drive, wherein the waveguide is formed integrally with the flexible substrate. The magnetic disk apparatus according to claim 1,
A semiconductor laser substrate on which the semiconductor laser is mounted;
A circuit board provided on the back side of the magnetic disk base and mounted with electronic components for controlling the magnetic recording system;
A magnetic disk drive comprising: a heat conducting member that thermally couples the semiconductor laser substrate and the circuit board. The magnetic disk apparatus according to claim 1,
A semiconductor laser substrate on which the semiconductor laser is mounted;
The magnetic disk device, wherein the semiconductor laser and the semiconductor laser substrate are accommodated in the second space. The magnetic disk apparatus according to claim 1,
A first connector having a built-in mirror for light emitted from the semiconductor laser and connected to the waveguide;
A second connector provided on the emission side of the semiconductor laser,
A magnetic disk device, wherein the light emitted from the semiconductor laser is guided to the waveguide by connecting the first connector and the second connector. The magnetic disk apparatus according to claim 1,
A plurality of the semiconductor lasers are provided,
The semiconductor laser substrate is formed in a step shape in the height direction,
A magnetic disk device, wherein the plurality of semiconductor lasers are installed at different positions in each height direction. The magnetic disk apparatus according to claim 1,
With a heat pipe,
A magnetic disk device, wherein a heat receiving portion of the heat pipe is coupled to the semiconductor laser substrate. The magnetic disk drive according to claim 9, wherein
A semiconductor laser substrate on which the semiconductor laser is mounted;
Provided on the back side of the magnetic disk base, comprising a circuit board on which electronic components for magnetic recording system control are mounted,
The semiconductor laser substrate is mounted on the circuit board, and a hole is provided on the circuit board between a portion immediately below the semiconductor laser substrate and another substrate portion. Magnetic disk unit. The magnetic disk apparatus according to claim 1,
A magnetic disk drive comprising a Peltier element bonded to the semiconductor laser substrate. A heat-assisted magnetic disk device having a magnetic disk, a motor for rotating the magnetic disk, a slider having a recording coil, a semiconductor laser, and a waveguide for guiding light from the semiconductor laser onto the magnetic disk. There,
A semiconductor laser substrate on which the semiconductor laser is mounted;
Provided on the back side of the magnetic disk base, comprising a circuit board on which electronic components for magnetic recording system control are mounted,
A magnetic disk drive comprising the semiconductor laser substrate and the circuit board thermally insulated.

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