JP2009264865A - Device for inspecting defect of flat panel display and its method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a defect inspection device for a flat panel display capable of exactly indicating spots to be repaired to a repair device, by pinpointing the spots from inspection information acquired by defect inspection, not to mention of being capable of finding out the causes of the defects or the like in a short time efficiently, and to provide its inspection method. <P>SOLUTION: The defect inspection device includes a database 640 for keeping the inspection information acquired by the defect inspection; and a processing part 650 which performs lighting inspection of flat panel displays formed by mutually sticking a first substrate and a second substrate for forming display panels, and dividing the stuck substrates into individual units after that and attaching identifiers to them, respectively, verifies the inspection information acquired by the defect inspection with inspection information acquired by the lighting inspection of the divided flat panel displays on the basis of the identifiers, and automatically classifying inspection information acquired by defect inspection performed on the occasion of manufacturing the first and second substrates, pinpoints the spot of a line defect detected by the lighting inspection from the inspection information acquired by the defect inspection performed on the occasion of the manufacture of the first and second substrates, and indicates the spot to be repaired. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a defect inspection apparatus and method for a flat panel display such as an organic EL (Electro luminescence) display panel or a liquid crystal display panel.

  In manufacturing a flat panel display, a TFT substrate manufacturing process called a TFT (Thin Film Transistor) process, a color filter substrate manufacturing process called a color filter process, and a TFT substrate and a color filter substrate are bonded together. Then, it is divided into a manufacturing process called assembling to divide into individual flat panel displays.

  The TFT process and the color filter process are processes on a rectangular glass called a mother substrate, and the mother substrate is currently used in a size of, for example, 720 mm × 600 mm, and several to several hundreds of pieces are formed on one mother substrate. It is produced by the method of manufacturing a flat panel display at the same time.

  The mother substrate that has finished the TFT process and the color filter process is cut into a flat panel display (panel), and in the assembly process, the conductor portion for electrical contact is taken out and the panel is sealed with resin.

By the way, if manufacturing history information is given to a flat panel display manufactured by the method as described above, it can be expected to be very useful for quality control, production control, and the like.
As a technique for providing manufacturing history information to a flat panel display in this way, for example, a process management system for a liquid crystal panel disclosed in Patent Document 1 is known.
JP-A-5-309552

However, the above-described technique has a disadvantage that the history information on the panel is not sufficiently utilized, and the cause of the defect cannot be efficiently investigated in a short period of time.
Further, with the above-described technique, it is difficult to accurately indicate the repair location to the repair device by specifying from the inspection information subjected to the defect inspection.

  The present invention provides a flat display panel capable of accurately instructing the repair location to a repair device by identifying the cause of the defect in a short period of time and identifying from the inspection information of the defect inspection. A defect inspection apparatus and method thereof are provided.

  A flat display panel defect inspection apparatus according to a first aspect of the present invention includes a database that holds inspection information subjected to defect inspection during manufacturing of a first substrate and a second substrate, and a first substrate and a second substrate that form a display panel. Are attached individually, and each flat panel display is individually inspected and subjected to lighting inspection, and the inspection information subjected to the defect inspection and the inspection information obtained by inspecting the individually divided flat panel display are identified as identifiers. Based on the lighting inspection information of the flat panel display individually divided, the inspection information subjected to defect inspection at the time of manufacturing the first substrate and the second substrate is automatically classified, and the line defects detected by the lighting inspection are classified. A processing unit that indicates a repair location by specifying a defect location from inspection information that has been inspected for defects when manufacturing the first substrate and the second substrate. Including the.

  Preferably, the identifier assigned to each flat panel display includes at least information indicating the manufacturing order of the flat panel display.

  Preferably, the identifier includes information on a manufacturing position of the flat panel display during the flat panel display manufacturing process.

  Preferably, the identifier is provided on the substrate of the flat panel display using a photolithographic method during the manufacturing process.

  Preferably, the identifier is stored as identifier information in a storage area inside the flat panel display, and the identifier information can be read by a special command not related to the operating state of the flat panel display.

  Preferably, the processing unit determines, from the identifier of the flat panel display in which a defect has occurred in the lighting inspection, from the assembly manufacturing line, the assembly conditions, the assembly time, the TFT process manufacturing line, the color filter process manufacturing line, the manufacturing time, and the manufacturing process order. In addition, it is possible to sequentially retrieve information on the manufacturing apparatus and the manufacturing panel position, and it is possible to specify the process, the manufacturing apparatus, and the manufacturing conditions that cause the defect.

  Suitably, the said process part can identify the process and defect position coordinate which caused the line defect from the identifier of the flat panel display in which the line defect generate | occur | produced by the lighting test | inspection.

  According to a second aspect of the present invention, there is provided a flat panel display defect inspection method in which a first substrate and a second substrate forming a display panel are bonded together, and then individually divided, and an identifier is assigned before or after the division. Forming a flat display panel to which the first substrate and the second substrate are manufactured, obtaining inspection information subjected to defect inspection at the time of manufacturing the first substrate and the second substrate, and performing a lighting inspection of the individually divided flat panel display And the step of collating the inspection information of the defect inspection with the inspection information of lighting inspection of the individually divided flat panel display by the identifier, and the first substrate based on the lighting inspection information of the individually divided flat panel display A step of automatically classifying inspection information subjected to defect inspection at the time of manufacturing the second substrate and detection by lighting inspection The defect portion of the line defect by identifying the examination information defect inspection during manufacturing of the first substrate and the second substrate, and a step of instructing a repair location.

According to the present invention, after the first substrate and the second substrate forming the display panel are bonded to each other by the processing unit, a lighting test is performed on the flat panel display that is divided individually and assigned with an identifier. .
In the processing unit, the inspection information on the defect inspection and the inspection information on the individually divided flat panel display are inspected by the identifier, and the first substrate and the first substrate are checked based on the lighting inspection information on the individually divided flat panel display. Inspection information subjected to defect inspection at the time of manufacturing two substrates is automatically classified.
Then, in the processing unit, the defect location of the line defect detected by the lighting inspection is specified from the inspection information subjected to the defect inspection at the time of manufacturing the first substrate and the second substrate, and the repair location is indicated.

  According to the present invention, the cause of the defect can be investigated efficiently in a short period of time, and the repair location can be accurately instructed to the repair device by specifying the defect inspection information.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

In the present embodiment, basically, after a TFT substrate and a color filter substrate of a liquid crystal display panel as a flat panel display are bonded together, each flat panel display divided individually has an identifier. Then, the inspection information subjected to the defect inspection at the time of manufacturing (bonding) the TFT substrate and the color filter substrate and the inspection information subjected to the lighting inspection at the time of individually dividing the flat panel display are collated with an identifier. Furthermore, based on the lighting inspection information of the flat panel display that is divided individually, inspection information that has been inspected for defects when manufacturing TFT substrates and color filter substrates is automatically classified so that the cause of defects can be investigated efficiently in a short period of time. The system which realizes is realized.
Further, in the present embodiment, the repair location of the repair device is determined by specifying the defect location of the line defect detected by the lighting inspection from the inspection information inspected at the time of manufacturing (bonding) the TFT substrate and the color filter substrate. The system that can be instructed is realized.
The system will be specifically described below.

First, an identifier of a product used in the embodiment of the present invention will be described.
FIG. 1 is a diagram for explaining product identifiers used in the present embodiment.

In the present embodiment, the product identifier is obtained by coding information such as a product manufacturing history. Based on this code, production management, progress management, quality management, defect identification, and the like are performed.
A method of attaching the product identifier will be described.

In the present embodiment, the product identifier includes a TFT identifier 101, a color filter identifier 102, and a panel identifier 103 as shown in FIG.
The TFT identifier 101 includes “TFT lot number” and “TFT substrate number”.
The color filter identifier 102 includes a “color filter lot number” and a “color filter substrate number”.
The panel identifier 103 includes “TFT lot number”, “TFT substrate number”, “color filter lot number”, “color filter substrate number”, and “panel position number”.
These code forms are as shown in FIG. The “TFT lot number” of the TFT identifier 101 indicates the product type name, the number of TFT substrates per lot, and the lot insertion time, and is expressed by 10 alphanumeric characters.

  As shown in FIG. 2, the “TFT substrate number” indicates the number of the TFT substrate stored in the transport carrier 201.

In FIG. 2, TFT numbers are assigned from the bottom to the top of the transport carrier 201, 202 is the first from the bottom and TFT number = 1, and 203 is the Nth from the bottom and is stored in TFT number = N for transport. It is shown that.
The “color filter lot number” of the color filter identifier 102 indicates the product type name, the number of color filter substrates per lot, and the lot insertion time, and is represented by 10 alphanumeric characters.
As shown in FIG. 2, the “color filter substrate number” represents the number of the color filter substrate stored in the transport carrier 201.
In FIG. 2, color filter numbers are assigned from the bottom to the top of the transport carrier 201, 202 is the first from the bottom and the color filter substrate = 1, 203 is the Nth from the bottom and is stored in the color filter substrate = N. It shows that it is transported.

  “TFT lot number” and “TFT substrate number” of the panel identifier 103 are “TFT lot number” and “TFT substrate number” of the TFT identifier 101 when the TFT substrate and the color filter substrate are bonded to each other. The “lot number” and “color filter substrate number” are also the “color filter lot number” and “color filter substrate number” of the color filter identifier 102 when the TFT substrate and the color filter substrate are bonded together.

In the case of the TFT substrate 301, the “panel position number” indicates that the TFT substrate orientation flat 302 of the TFT substrate 301 is at the lower left, and the X axis (horizontal axis) and the Y axis (vertical axis) are as shown in FIG. For example, the panel numbers of the fourth panel in the X-axis direction and the fourth panel in the Y-axis direction from the substrate origin 300 are expressed in a matrix format as (4, 4).
The pitch in the X axis direction of the panel unit of the TFT side panel 304 is XP, and the pitch in the Y axis direction is YP.

  In the case of the color filter substrate 307, as shown in FIG. 3B, the color filter substrate orientation flat 308 of the color filter substrate 307 is set to the lower right, and the X axis (horizontal axis) and the Y axis (vertical axis) are taken. The panel numbers of the fourth panel in the X-axis direction and the fourth panel in the Y-axis direction from the substrate origin 311 are expressed in a matrix format such as (4, 4).

  Thus, by making the coordinate system of the TFT substrate 301 and the coordinate system of the color filter substrate 307 symmetrical to each other, when the pattern processing surfaces of the TFT substrate and the color filter substrate are bonded to each other with reference to the substrate origin, the TFT substrate 301 and the color filter substrate 307 The panel numbers of the filter substrates 307 are the same. The pitch in the X-axis direction of the color filter side panel 310 is XP, and the pitch in the Y-axis direction is YP.

  FIG. 4 shows an alignment pattern 401 for obtaining the substrate origin 300 of the TFT substrate 301 and the X and Y axes.

  The alignment pattern 401 shown in FIG. 4 is patterned around the four corners of the TFT side panel 304. The patterning position is designed such that patterning remains even if the substrate is divided. The alignment pattern 401 at the lower left of the TFT side panel 304 is used for substrate alignment.

The X-axis of the TFT substrate 301 is obtained at the center of the alignment pattern of any two-panel alignment pattern 401 at the bottom in the X direction.
In order to improve the alignment accuracy, it is preferable to obtain with TFT side panels 304 at both ends. The Y axis of the TFT substrate 301 is obtained at the center of the alignment pattern of the alignment pattern 401 of any two panels at the leftmost part in the Y direction.
In order to improve the alignment accuracy, it is preferable to obtain with TFT side panels 304 at both ends. The obtained intersection point of the X axis and the Y axis is set as the substrate origin 300.
Although the method of obtaining the substrate origin 311 and the X and Y axes of the color filter substrate 307 is not shown, it is obtained in the same manner as the TFT substrate 301 of FIG.

  Next, as an identifier assigning method, a method of engraving on the surface of a TFT substrate, a color filter substrate or a panel using a laser or an electron beam, and a dedicated storage area in the panel (or product) A method of electrically writing necessary information such as an identifier in the inside will be described.

In the case of laser marking, for example, it is effective to use carbon dioxide gas, YAG laser (yttrium aluminum garnet laser) or the like. Laser marking may be performed by directly marking an identifier composed of alphanumeric characters, or by converting it into a bar code or a two-dimensional code.
The space can be reduced by converting to a two-dimensional code and engraving.

During the manufacturing process, when an identifier is engraved using the photolithographic method in the manufacturing process, if a liquid crystal mask forming apparatus is used as the mask of the exposure apparatus, it is easy to form a symbol with a different identifier for each panel. Yes.
In addition, when identifier information is electrically stored, a dedicated memory such as EEPROM (Electrically Erasable and Programmable Read Only Memory) is provided in the peripheral part (part other than the effective pixel area) of the TFT substrate panel, and information is stored there. Let

In this method, information is stored in the dedicated memory, so that necessary information can be held in addition to the identifier. For example, after inspecting the electrical characteristics of each panel, it is also possible to write information in the identifier dedicated storage area of the panel together with the identifier information including the inspection result information.
Alternatively, at the time of final electrical characteristic inspection before product shipment, simultaneously with this inspection, it is also possible to write final electrical characteristic inspection information and the like together with identifier information into the product identifier dedicated storage area. When identifier information is electrically stored, the written identifier information is read by a read-only pin or a read-only command (a special command not related to the operation state of the flat panel display). Is done.

  Next, the marking position of each identifier and the timing of marking will be described with reference to FIGS. 3 (a) and 3 (b).

In the case of the TFT identifier 101, as shown in FIG. 3A, the identifier 101 is engraved on the peripheral portion 303 other than the panel area on the surface of the TFT substrate 301.
It is desirable that the time for engraving the identifier be the time immediately before the first process is performed on the substrate after the lot is put into the TFT process. By inserting the TFT identifier 101 at this time, it is possible to manage information on subsequent processing as a substrate in a single sheet.

In the case of the color filter identifier 102, as shown in FIG. 3B, the identifier 102 is engraved on the peripheral portion 309 other than the panel region on the surface of the color filter substrate 307.
The timing for engraving the identifier is preferably the timing immediately before the first processing is performed on the substrate after the lot is put into the color filter process.
By inserting the color filter identifier 102 at this time, it is possible to manage information on subsequent processing as a substrate in a single sheet.

FIG. 5A is a diagram in which the pattern processing surfaces of the TFT substrate 301 and the color filter substrate 307 are bonded to each other on the basis of the substrate origin and then divided into panel units.
Reference numeral 310 denotes a color filter side panel of the color filter substrate 307, and 304 denotes a TFT side panel of the TFT substrate 301.

  In the case of the panel identifier 103, as shown in FIG. 5B, 311 of the color filter side panel 310 (an area in which a peripheral pattern other than the effective pixel area 312 is not formed) or as shown in FIG. The TFT side panel 304 area (area where the peripheral pattern other than the effective pixel area 306 is not formed) 305, or the color filter side panel 310 and the TFT after the panel division as shown in FIG. The panel identifier 103 is engraved on the side surface 501 of the side panel 304.

As the timing for engraving the panel identifier 103 using a laser, an electron beam or the like, the panel identifier 103 is engraved (marked) after the TFT substrate and the color filter substrate are bonded to each other and divided into individual flat panel displays. desirable.
This is because (d) in FIG. 5 engraves the panel identifier 103 after division. However, after the division and the order of the panels are separated, the TFT identifier 101 of the TFT side panel 304, the color filter identifier 102 of the color filter side panel 310, and the panel number are not confirmed or managed in any way. This is because the panel identifier 103 cannot be engraved.

  The product identifier engraved with the above method and timing is read by the manufacturing apparatus and inspection apparatus of each process, and production management, progress management, quality management, defect identification, and the like are performed.

  Next, the defect classification system using the above-described product identifier used in the embodiment of the present invention will be described.

  FIG. 6 is a schematic flow diagram of a liquid crystal display manufacturing process using a product identifier and a defect classification system according to an embodiment of the present invention.

The manufacturing process of the liquid crystal display is roughly divided into three processes: a TFT process 610, a color filter process 620, and an assembly 630.
In the TFT process 610, a TFT (thin film transistor) and a wiring circuit for driving are formed on a glass substrate. In this process, a TFT circuit is formed on a glass substrate through a film forming process, an exposure process, and an etching process.
After the TFT circuit is built, an alignment film for aligning the liquid crystal is printed. Immediately after each process, defect inspection 611 is performed, and defect inspection 611 is performed so that it can be understood in which process the defect has occurred.
The color filter process 620 is a process for producing a color filter substrate 307 in which layers of RGB three primary colors are formed on a glass substrate different from the TFT substrate 301 completed in the TFT process 610.
Even in the color filter process 620, layers of RGB three primary colors are formed through repetition of a film forming process, an exposure process, and an etching process. After the layers of the three primary colors of RGB are formed, an alignment film for aligning the liquid crystal is printed.
Immediately after each step, a defect inspection 621 is performed, and similarly to the TFT process 610, a defect inspection 611 is performed so that it can be understood in which process the defect has occurred.
The TFT substrate 301 completed in the TFT process 610 and the color filter substrate 307 completed in the color filter process 620 are bonded together, divided into panel units, and liquid crystal is injected into the divided panels.
After sealing the injected liquid crystal with UV resin or the like, a terminal for wiring is taken out from the panel, and when the terminal is taken out, an electric signal is inputted, a panel lighting inspection 631 is performed, and a non-defective product and a defective product are judged. do.
An assembly 630 includes a process from the bonding of the TFT substrate 301 completed in the TFT process 610 and the color filter substrate 307 completed in the color filter process 620 to the lighting inspection 631.

The inspection result of the defect inspection 611 of the TFT process 610 and the inspection result of the defect inspection 621 of the color filter process 620 are stored in the defect inspection database 641 of the defect analysis database 640.
The inspection result of the lighting inspection 631 of the assembly 630 is stored in the lighting inspection database 642 of the defect analysis database 640.
A defective product preset by a defect analysis system computer 650 as a processing unit and a panel that satisfies the conditions are repaired by a repair device 632.
By specifying the defect location of the line defect detected by the lighting inspection from the inspection information inspected for defects at the time of the TFT substrate and the color filter substrate, the repair location can be indicated to the repair device, so that efficient repair can be performed.
A repair method in the repair device will be described later with an example.

  Next, the defect analysis database 640 will be described in detail with reference to FIG.

  The defect inspection database 641 includes TFT process information in which the inspection result of the defect inspection 611 of the TFT process 610 is stored, and color filter process information in which the inspection result of the defect inspection 621 of the color filter process 620 is stored.

  The TFT process information stores all TFT lot numbers (TFT lot numbers of the TFT identifier 101) inspected by the defect inspection 611 of the TFT process 610.

  In the color filter process information, all color filter lot numbers (color filter lot numbers of the color filter identifier 102) inspected by the defect inspection 621 of the color filter process 620 are stored.

  Each TFT lot number stores the names of all processes inspected by the defect inspection 611 of the TFT process 610. In each process name, the TFT substrate number of the TFT identifier 101 inspected by the defect inspection 611 is stored.

Each TFT substrate number stores the number of defects detected on the substrate and a serial number of defect numbers.
Each defect serial number is composed of a defect coordinate X, a defect coordinate Y indicating a defect position detected by the defect inspection 611, a defect area, a defect mode, and a defect image file name when the defect is imaged by a CCD camera or the like. Has been.

The defect coordinate X is a distance in the X axis direction from the substrate origin 300 of the TFT substrate 301, and the defect coordinate Y is a distance in the Y axis direction from the substrate origin 300 of the TFT substrate 301.
Each color filter lot number stores the names of all processes inspected by the defect inspection 621 of the color filter process 620.
In each process name, the color filter substrate number of the color filter identifier 102 inspected in the defect inspection 621 is stored.
Each color filter substrate number stores the number of defects detected on the substrate and the consecutive defect number.

Each defect serial number is composed of a defect coordinate X, a defect coordinate Y indicating a defect position detected by the defect inspection 621, a defect area, a defect mode, and a defect image file name when the defect is imaged by a CCD camera or the like. Has been.
The defect coordinate X is a distance in the X-axis direction from the substrate origin 311 of the color filter substrate 307, and the defect coordinate Y is a distance in the Y-axis direction from the substrate origin 311 of the color filter substrate 307.

Next, the lighting inspection database 642 will be described.
The lighting inspection database 642 separates the lighting inspection result of the panel unit inspected by the lighting inspection 631 of the assembly 630 into the TFT substrate defect information of the TFT side panel and the color filter substrate defect information of the color filter side panel. Aggregated and configured.

The TFT substrate defect information stores all TFT lot numbers (the TFT lot number of the panel identifier 103).
Each TFT lot number is composed of all TFT substrate numbers of the panel identifier 103 inspected in the lighting inspection 631. For example, when the TFT lot is 20 substrates and 1 lot, the TFT substrate 1 is changed to the TFT substrate 20.

Each TFT substrate number is composed of all panel position numbers of the panel identifier 103 inspected in the lighting inspection 631.
Each panel position number is composed of the number of defects detected in the panel and the defect modes classified by the lighting inspection 631.

In each defect mode, the number of defects for each mode and a sequential defect number are stored. Each defect serial number is composed of a lighting defect coordinate X and a lighting defect coordinate Y indicating a defect position detected in the lighting inspection 631, and a defect coordinate X and a defect coordinate Y indicating a defect position detected in the defect inspection 611. Yes.
The defect coordinate X and the defect coordinate Y are stored by converting the distance in the X-axis direction from the lighting inspection origin 500 of the TFT side panel 304 and the distance in the Y-axis direction into a distance from the substrate origin 300.

  An example of converting the defect 502 (px, py) in FIG. 5C to the panel position 313 (KX, KY) of n = 4 and m = 4 of the TFT substrate 301 in FIG. 3A will be described.

The lighting inspection origin 500 (0, 0), the X axis, and the Y axis are obtained using the alignment patterns 401 at the lower left, lower right, and upper left of the TFT side panel 304 shown in FIG.
The X axis of the TFT side panel 304 is obtained at the alignment pattern center of the lower left and lower right alignment patterns 401. The Y axis of the TFT side panel 304 is obtained at the alignment pattern center of the lower left and upper left alignment patterns 401.
The obtained intersection of the X axis and the Y axis is set as the lighting inspection origin 500 (0, 0). The defect 502 (px, py) represents the distance from the lighting inspection origin (0, 0).
The panel pitch in the X direction of the TFT substrate 301 is XP, the panel pitch in the Y direction is YP, and the defect 502 (px, py) is moved to the n = 4 and m = 4 panel positions of the TFT substrate 301 in FIG. If the converted coordinates are 313 (KX, KY), KX = XP × 4 + px and KY = YP × 4 + py.

Further, when the defect 313 (KX, KY) at the panel position of n = 4 and m = 4 of the TFT substrate 301 in FIG. 3A is converted into the defect 502 (px, py), px = KX− (XP × 4). ), Py = KY− (YP × 4).
In the color filter substrate defect information, all color filter lot numbers (color filter lot numbers of the panel identifier 103) are stored. Each color filter lot number is composed of all color filter substrate numbers of the panel identifier 103 inspected in the lighting inspection 631.
For example, when the color filter lot is 20 substrates and 1 lot, the color filter substrate 1 is changed to the color filter substrate 20.
Each color filter substrate number is composed of all panel position numbers of the panel identifier 103 inspected in the lighting inspection 631. Each panel position number is composed of the number of defects detected in the panel and the defect mode of the lighting inspection 631.

In each defect mode, the number of defects for each mode and a sequential defect number are stored.
Each defect serial number is composed of a lighting defect coordinate X and a lighting defect coordinate Y indicating a defect position detected in the lighting inspection 631, and a defect coordinate X and a defect coordinate Y indicating a defect position detected in the defect inspection 611. Yes.
The defect coordinate X and the defect coordinate Y are also stored by converting the distance in the X-axis direction from the lighting inspection origin of the TFT side panel 304 and the distance in the Y-axis direction into a distance from the origin of the color filter substrate.

  A conversion example of the lighting point defect 502 (px, py) in FIG. 5C to the panel position 314 (KX, KY) of n = 4 and m = 4 of the color filter substrate 307 in FIG. 3B will be described. .

The lighting inspection origin 500 (0, 0), the X axis, and the Y axis are obtained using the alignment patterns 401 at the lower left, lower right, and upper left of the TFT side panel 304 shown in FIG. The X axis of the TFT side panel 304 is obtained at the alignment pattern center of the lower left and lower right alignment patterns 401.
The Y axis of the TFT side panel 304 is obtained at the alignment pattern center of the lower left and upper left alignment patterns 401. The obtained intersection of the X axis and the Y axis is set as the lighting inspection origin 500 (0, 0).
The lighting point defect 502 (px, py) represents a distance from the lighting inspection origin (0, 0). The panel pitch in the X direction of the color filter substrate 307 is XP, the panel pitch in the Y direction is YP, and the lighting point defect 502 (px, py) is n = 4 and m = 4 of the color filter substrate 307 in FIG. If the converted coordinates to the panel position are 314 (KX, KY), KX = XP × 4 + px and KY = YP × 4 + py.

  Further, when the defect 314 (KX, KY) at the panel position of n = 4 and m = 4 of the color filter substrate 307 in FIG. 3A is converted into the defect 502 (px, py), px = KX− (XP × 4), py = KY− (YP × 4).

  FIG. 8 summarizes the lighting inspection results for each panel inspected in the lighting inspection 631 of the assembly 630 for each substrate, the lighting inspection results, the inspection results inspected by the defect inspection 611 of the TFT process 610, and the color filter process. The present invention for specifying in which process and process a defect in the lighting inspection result occurred by collating the inspection result inspected by the defect inspection 621 of 620 is schematically shown.

  FIG. 8 shows a lighting inspection result 810 that is obtained by separating the lighting inspection result of the panel unit in the lighting inspection 631 of the assembly 630 into TFT substrate defect information of the TFT side panel and tabulated in the substrate unit, and defects after the film forming process. The collation example of the inspection result 830 of the inspection 611 and the inspection result 820 of the defect inspection 611 after the exposure process is shown.

The lighting inspection point defect 812 indicates that the defect 831 of the inspection result 830 of the defect inspection 611 after the film forming process is caused.
The lighting inspection point defect 813 represents that the defect 821 of the inspection result 820 of the defect inspection 611 after the exposure process is caused. The lighting inspection line defect 814 indicates that the defect 823 of the inspection result 820 of the defect inspection 611 after the exposure process is caused.
The lighting inspection point defect 815 indicates that the defect inspection 611 of the TFT process 610 was not detected.
The defect 832 of the inspection result 830 of the defect inspection 611 after the film forming process and the defect 822 of the inspection result 820 of the defect inspection 611 after the exposure process are detected as defects in the defect inspection 611, but are defective in the actual lighting inspection 631. This indicates that the defect was not.

  FIG. 9 shows a lighting inspection result 840 obtained by separating the lighting inspection result of the panel unit in the lighting inspection 631 of the assembly 630 into the color filter substrate defect information of the color filter side panel and totaling the substrate unit. The example of collation of the inspection result 850 of the defect inspection 621 is shown.

  The lighting inspection point defect 815 represents that the defect 852 of the inspection result 850 of the defect inspection 621 after the etching process is caused. The lighting inspection point defects 812 and 813 and the lighting inspection line defect 814 indicate that they were not detected in the defect inspection 621 of the color filter process 620.

  The defect 851 represents a defect that was detected as a defect in the defect inspection 621 but did not become a defect in the actual lighting inspection 631. The lighting inspection point defects 812, 813, and 815 are point defects in which a defective portion to be repaired in the lighting inspection 631 is specified.

  The lighting inspection point defect 814 is a line defect in which the defective portion to be repaired cannot be specified by the lighting inspection 631 alone, but the inspection result inspected by the defect inspection 611 of the TFT process 610 and the defect inspection 621 of the color filter process 620. By comparing the inspection results inspected in step (1), the defective portion can be specified, and the repair device 632 can be instructed where to repair.

  Next, an example in which the defect position 910 (PX1, PY1) of the lighting inspection line defect 814 is specified from the defect 823 (KX1, KY1) of the inspection result 820 of the defect inspection 611 after the exposure process will be described with reference to FIG.

The defect 823 (KX1, KY1) coordinates of the inspection result 820 are coordinates converted from the substrate origin 300 to the lighting inspection origin 500.
In the lighting inspection line defect 814, the Y coordinate has already been specified by the lighting inspection 631 from the line defect in the X-axis direction.
Let the identified Y coordinate be PY1. The Y coordinate corresponding to PY1 is collated with the inspection result inspected by the defect inspection 611 of the TFT process 610 and the inspection result inspected by the defect inspection 621 of the color filter process 620, and the Y coordinate of the defect 823 of the inspection result 820 is compared. Since it coincides with KY1, the X coordinate PX1 of the defect position 910 of the lighting inspection line defect 814 can be specified from the X coordinate KX1 of the defect 823 of the inspection result 820.

  FIG. 11 shows an outline of a method for identifying a defective portion in the present invention, instructing the repair device 632 where to repair, and repairing by the repair device 632. A detailed repair method is described in Japanese Patent Application No. 2006-348375.

  In the repair device 632, the stage is moved to the defective portion 1010 specified by the present invention, and the one-pixel region 1000 including the specified defective portion 1010 is detected by image processing.

  Next, a template 1040 that is most similar to the one-pixel region 1000 including the defective portion 1010 is extracted from a template group 1030 of one-pixel region registered in advance.

  In each template of the template group 1030, a method to be repaired and repair conditions are registered. Reference numeral 1050 in the extracted template 1040 indicates a method to be repaired.

  The method of repairing 1050 in the extracted template 1040 is a method of cutting a defective portion that is short-circuited between two wirings.

  Template information that is a repair condition registered in the extracted template 1050 is as follows.

Examples of additional information (template information) include the following.
・ Characteristic information of defects on electrical circuits (open, short, etc.),
・ Circuit status information after repair (bright spot, dark spot, etc.)
The position of the repetitive pattern in the wiring board, the number of the pixel number, RGB information (color information),
・ Whether the defect can be confirmed visually,
・ Priority when templates with the same conditions exist,
-The number of times defect correction has actually been performed in the past (priority is given to actual results).

  Since the method to be repaired can be specified by the template 1050 in the extracted template 1040, the repair can be realized by cutting the defective portion 1010 short-circuited between the two wires like the defective portion 1020. .

  As described above, according to the present embodiment, the following effects can be obtained.

(1) It is desirable that the time for engraving the identifier in the TFT process is the time immediately before the first process is performed on the substrate after a lot is put into the TFT process.
By inserting the TFT identifier 101 at this time, it is possible to manage information on subsequent processing as a substrate in a single sheet.

(2) It is desirable that the time when the identifier is engraved in the color filter process is the time immediately before the first processing is performed on the substrate after a lot is put into the color filter process.
By inserting the color filter identifier 102 at this time, it is possible to manage information on subsequent processing as a substrate in a single sheet.

(3) A lighting inspection method for a flat panel display provided with an identifier indicating manufacturing information. In this method, from the identifier of the flat panel display that caused the defect in the lighting inspection, the assembly production line, assembly conditions, assembly time, TFT process production line, color filter process production line, production time, production process order, production equipment, production The panel position information can be searched sequentially. Thereby, the process, manufacturing apparatus, and manufacturing condition which caused the defect can be specified.

(4) After attaching the TFT substrate and the color filter substrate of the flat panel display, and the TFT substrate and the color filter substrate, an identifier is given to each of the divided flat panel displays. Then, the inspection information subjected to the defect inspection at the time of bonding the TFT substrate and the color filter substrate and the inspection information subjected to the lighting inspection at the time of individually dividing the flat panel display are collated with an identifier. Furthermore, based on the lighting inspection information of the flat panel display divided individually, the inspection information subjected to the defect inspection when the TFT substrate and the color filter substrate are bonded is automatically classified. As a result, the cause of the defect can be investigated efficiently in a short period of time.

(5) Since the defect location of the line defect detected in the lighting inspection is specified from the inspection information subjected to the defect inspection when the TFT substrate and the color filter substrate are bonded together, it is possible to instruct the repair device to indicate the repair location. Can be repaired.

  As described above, according to the present embodiment, it is possible to manufacture with high efficiency by quickly identifying and dealing with a defective portion, and its industrial value is great.

It is a figure for demonstrating the identifier of the product used in this embodiment. It is a figure which shows the lot structure of a TFT substrate and a color filter substrate. It is a figure for demonstrating the marking position of each identifier, and the timing to stamp. It is a figure which shows the alignment pattern for calculating | requiring the board | substrate origin, X-axis, and Y-axis of a TFT substrate. FIG. 5 is a diagram showing the pattern processing surfaces of the TFT substrate and the color filter substrate that are bonded to each other on the basis of the substrate origin and then divided into panel units. It is a schematic flowchart of the manufacturing process of a liquid crystal display using the product identifier which concerns on embodiment of this invention, and a defect classification system. It is a figure for demonstrating a defect analysis database. It is a figure which shows typically this invention which pinpoints in which process and process the defect by a lighting test result generate | occur | produced. It is a figure which shows the collation example of the lighting test result which isolate | separated the lighting test result into the color filter board | substrate defect information of the color filter side panel, and was totaled per board | substrate, and the test result of the defect inspection after an etching process. It is a figure for demonstrating the example which pinpoints the defect position of a lighting inspection line defect from the defect of the inspection result of the defect inspection after an exposure process. In this embodiment, it is a figure which shows the outline | summary of the method of specifying a defect location, instruct | indicating the location which should be repaired to a repair apparatus, and repairing with a repair apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 101 ... TFT identifier, 102 ... Color filter identifier, 103 ... Panel identifier, 201 ... Transport carrier, 300 ... Substrate origin, 301 ... TFT substrate, 302 ... TFT substrate orientation flat 304 ... TFT side panel, 307 ... Color filter substrate, 308 ... Color filter substrate orientation flat, 310 ... Color filter side panel, 632 ... Repair device, 640 ... Defect analysis database, 650... Computer (processing unit) for defect analysis system, 1000... First pixel region, 1010... Defect location, 1030.

Claims (14)

A database for holding inspection information subjected to defect inspection at the time of manufacturing the first substrate and the second substrate;
After the first substrate and the second substrate forming the display panel are bonded together, the flat panel display that is divided into individual pieces and each assigned an identifier is subjected to lighting inspection, and the inspection information subjected to the defect inspection is divided into pieces. The inspection information on the inspected lighting of the flat panel display is collated with the identifier, and the inspection information that has been inspected for defects at the time of manufacturing the first substrate and the second substrate is automatically based on the lighting inspection information of the flat panel display that is divided individually. A flat panel comprising: a processing unit that indicates a repair location by classifying and identifying a defect location of a line defect detected by a lighting inspection from inspection information that has been inspected for defects when manufacturing the first substrate and the second substrate Display defect inspection equipment. The flat panel display defect inspection apparatus according to claim 1, wherein the identifier assigned to each flat panel display includes at least information indicating a manufacturing order of the flat panel display. The flat panel display defect inspection apparatus according to claim 1, wherein the identifier includes information on a manufacturing position of the flat panel display during a manufacturing process of the flat panel display. The flat panel display defect inspection apparatus according to claim 1, wherein the identifier is provided on a substrate of the flat panel display using a photolithography method in a manufacturing process. The identifier is stored as identifier information in a storage area inside the flat panel display, and the identifier information can be read by a special command not related to the operation state of the flat panel display. Defect inspection apparatus for flat panel display as described. The processing unit
Information on assembly production line, assembly conditions, assembly time, TFT process manufacturing line, color filter process manufacturing line, manufacturing time, manufacturing process order, manufacturing equipment, manufacturing panel position The defect inspection apparatus for a flat panel display according to claim 1, wherein the process, the manufacturing apparatus, and the manufacturing conditions that cause the defect can be specified. The processing unit
The defect inspection apparatus for a flat panel display according to claim 1, wherein a process and a defect position coordinate that cause the line defect can be identified from an identifier of the flat panel display in which the line defect has occurred in the lighting inspection. After bonding the first substrate and the second substrate forming the display panel, individually dividing, and forming a flat display panel to which an identifier is assigned before or after the division; and
Obtaining inspection information subjected to defect inspection at the time of manufacturing the first substrate and the second substrate;
A step of performing lighting inspection of the flat panel display individually divided;
The step of collating the inspection information for inspecting the defect and the inspection information for inspecting the lighting of the flat panel display individually divided with an identifier,
Automatically classifying inspection information subjected to defect inspection at the time of manufacturing the first substrate and the second substrate, based on lighting inspection information of individually divided flat panel displays;
A defect inspection of a flat panel display including a step of indicating a repair location by specifying a defect location of a line defect detected by a lighting inspection from inspection information subjected to a defect inspection at the time of manufacturing the first substrate and the second substrate. Method. The defect inspection method for a flat panel display according to claim 8, wherein the identifier assigned to each flat panel display includes at least information indicating a manufacturing order of the flat panel display. The flat panel display defect inspection method according to claim 8, wherein the identifier includes information on a manufacturing position of the flat panel display during a manufacturing process of the flat panel display. The defect inspection method for a flat panel display according to claim 8, wherein the identifier is provided on a substrate of the flat panel display using a photolithography method in a manufacturing process. The identifier is stored as identifier information in a storage area inside the flat panel display, and the identifier information can be read by a special command not related to the operation state of the flat panel display. The defect inspection method of the flat panel display as described. Information on assembly production line, assembly conditions, assembly time, TFT process manufacturing line, color filter process manufacturing line, manufacturing time, manufacturing process order, manufacturing equipment, manufacturing panel position The flat panel display defect inspection method according to claim 8, wherein the process, the manufacturing apparatus, and the manufacturing condition that cause the defect can be specified. The defect inspection method for a flat panel display according to claim 8, wherein a process and a defect position coordinate that cause the line defect are specified from an identifier of the flat panel display in which the line defect has occurred in the lighting inspection.

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