JP2009260047A - Sheet for die sort - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet for die sort capable of stably holding a chip with tack, and easily picking up the chip with the tack. <P>SOLUTION: A sheet 1 for die sort comprises a disc-like base material film 2, and an annular adhesive sheet 3 stacked on the periphery of the base material film 2. The central portion of the surface of the base material film 2 is a chip temporary fitting part 20, and the surface roughness Ra of the chip temporary fitting part 20 is 0.01-0.4 μm. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a die sort sheet on which a chip having tacks is temporarily attached in order to store or carry the chip.

  One of the manufacturing processes of a semiconductor device is a dicing process of cutting and separating a semiconductor wafer on which a circuit is formed through a required pretreatment into a plurality of chips. In this step, a dicing sheet for fixing a semiconductor wafer is attached to a circular or square frame called a ring frame, the semiconductor wafer is attached to the dicing sheet, and dicing is performed for each circuit to obtain a semiconductor chip. Then, following the expanding process by the bonding machine, a die bonding process is performed in which a die bonding adhesive such as an epoxy resin is applied to the pad portion of the chip substrate, and the semiconductor chip is bonded to the chip substrate. Furthermore, after a wire bonding process and an inspection process, resin sealing is finally performed in a molding process to manufacture a semiconductor device. In addition, although the separated semiconductor chip may be stored and transported without being die-bonded, in this case, the die bonding process is performed in outline.

  In order to store and transport such semiconductor chips, a reel-shaped embossed carrier tape or chip tray in which pocket-shaped recesses are formed on a thermoplastic resin sheet by embossing is generally used. After housing the semiconductor chip in the recess, the semiconductor chip is covered with a cover sheet, and stored and transported until the semiconductor chip is incorporated into an electronic device. By using such an embossed carrier tape, only non-defective products can be selected and shipped after the dicing process, and further, a single semiconductor wafer can be shipped to a plurality of factories.

  Here, in the semiconductor device, dust, dirt, and the like cause problems, and therefore, the semiconductor chip may be washed with water before the semiconductor chip is used before it is transported. However, when the embossed carrier tape is used as described above, it is necessary to fix the semiconductor chip to the dicing tape again and wash it, which is very inefficient.

  On the other hand, a technique of mounting a semiconductor chip using an adhesive tape such as a general-purpose dicing tape or a thermal peeling tape (Patent Document 1) and storing and transporting the semiconductor chip is also used. In this case, the semiconductor chip is affixed to the adhesive layer of the adhesive tape, and is stored and transported.

  The semiconductor chip storage / conveying method using the embossed carrier tape or the general-purpose dicing tape as described above has been used for a semiconductor chip that does not have an adhesive layer on the back surface.

On the other hand, in recent years, since it is extremely complicated to perform the adhesive application work during die bonding, a pressure-sensitive adhesive layer having the performance of both a wafer-fixing pressure-sensitive adhesive and a die-bonding adhesive is provided. A provided dicing die bonding sheet has been developed (see, for example, Patent Document 2). Prior to the dicing step, this adhesive layer is affixed to the back surface of the wafer, diced together with the wafer into a chip size, and has a structure having the adhesive layer on the back surface of the chip.
JP 2000-95291 A JP-A-2-32181

  However, the adhesive used in this application has a certain amount of tack (adhesiveness) so that the wafer can be fixed in the dicing process. When a semiconductor chip having such a tack on the back surface is accommodated in the recess of the emboss carrier, the semiconductor chip adheres to the emboss carrier by the tack. For this reason, it is difficult to take out the semiconductor chip from the recess of the embossed carrier in the next step, and there is also a problem that the adhesive layer on the back surface of the chip is deformed even when it is taken out. A semiconductor device manufactured using such a semiconductor chip cannot obtain high reliability.

  In addition, when the semiconductor chip is attached to another general-purpose dicing tape, the adhesive layer of the semiconductor chip is fixed to the adhesive of the general-purpose dicing tape, which makes it difficult to pick up in the next process. There is. Moreover, when picking up, the adhesive of a dicing tape may adhere to the adhesive layer of a chip | tip back surface, and a chip | tip may be contaminated. Therefore, also in this case, the reliability of the manufactured semiconductor device is lowered.

  Note that the above problems are not limited to chips obtained from a semiconductor wafer, and there is a concern in any chip-shaped article such as an optical element chip.

  The present invention has been made in view of the above circumstances, and provides a die sort sheet that can stably hold a chip having a tack and can easily pick up a chip having a tack. Objective.

  In order to achieve the above object, the present invention provides a die sort sheet for temporarily attaching a chip having a tack, comprising a pressure-sensitive adhesive portion at a peripheral portion and a temporary chip-attaching portion inside the peripheral portion in plan view. In addition, a die sort sheet is provided in which the surface roughness Ra (arithmetic mean roughness) of the surface of the chip temporary attachment portion is 0.01 to 0.4 μm (Invention 1).

  The “plan view” includes a case where the die sort sheet is seen through. Moreover, said adhesive part and chip | tip temporary attachment part may be located in the same surface side of the sheet | seat for die sorting, and may be located in the surface side opposite to each other. Further, the above-mentioned “having a chip temporary attachment portion inside the peripheral portion” means “having a chip temporary attachment portion at least inside the peripheral portion”. For example, in the die sort sheet, When the chip temporary attachment portion is positioned on the opposite surface side, the entire surface of one side of the die sort sheet may be the chip temporary attachment portion. On the other hand, examples of the “chip having a tack” include a chip having an adhesive layer, a chip having an adhesive layer, a chip having an adhesive layer having a tack, and a chip having a tack itself. Is done.

  According to the above invention (Invention 1), the surface roughness Ra of the surface of the chip temporary attachment portion is controlled as described above, thereby having both excellent adhesion and peelability to the chip having a tack. It will be a thing. That is, due to the excellent adhesion of the chip temporary attachment portion, the chip can be securely attached to the chip temporary attachment portion by the tack, and the chip can be stably held. Moreover, the chip | tip which has a tack | tuck can be picked up easily when peeling the sheet | seat chip | tip for die sorts at the next process by the outstanding peelability of a chip | tip temporary attachment part. In particular, when the chip has a (viscous) adhesive layer, deformation of the (adhesive) adhesive layer during pickup can be prevented.

  In the said invention (invention 1), it is preferable that surface roughness Rt (maximum cross-sectional height of a roughness curve) of the surface of the chip | tip temporary attachment part is 0.1-3.0 micrometers (invention 2).

  In the said invention (invention 1 and 2), it is preferable that the said sheet | seat for die sort is comprised including a base film and the adhesive sheet laminated | stacked on the peripheral part of the said base film (invention 3).

  In the said invention (invention 3), the said adhesive sheet is the 1st adhesive layer affixed on the said base film, the 2nd adhesive layer to which a frame is affixed, and the said 1st adhesive layer And a core material sandwiched between the second pressure-sensitive adhesive layers (Invention 4) may be a single-layer pressure-sensitive adhesive layer.

  According to the die sort sheet of the present invention, a chip having a tack can be stably held and pickup can be easily performed. Therefore, according to the die sort sheet of the present invention, it is possible to securely store and transport a chip having a tack, and even if a temporarily attached chip is picked up, the chip is contaminated by an adhesive or the like on the sheet side. In particular, even when the chip has a (viscous) adhesive layer, the (viscous) adhesive layer is not deformed. Therefore, for example, when the chip is a semiconductor chip, a highly reliable semiconductor device can be manufactured.

Hereinafter, embodiments of the present invention will be described.
[Die sort sheet]
FIG. 1 is a perspective view of a die sort sheet according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view (XX sectional view in FIG. 1) of the die sort sheet according to the embodiment.

  As shown in FIGS. 1 and 2, the die sort sheet 1 according to this embodiment includes a circular base film 2 and an annular pressure-sensitive adhesive sheet 3 laminated on the peripheral edge of the upper surface of the base film 2. Configured. In the die sort sheet 1, the peripheral edge portion is an adhesive portion by the adhesive sheet 3 in a plan view, and the surface of the base film 2 on the inner side (center portion) of the peripheral edge portion is the chip temporary attachment portion 20. ing.

  In the present embodiment, the surface roughness Ra (arithmetic mean roughness) of the chip temporary attachment portion 20 of the base film 2 is 0.01 to 0.4 μm, preferably 0.02 to 0.3 μm. When the surface roughness Ra of the chip temporary attachment portion 20 is within the above range, the chip having a tacky chip has both excellent adhesion and peelability. In other words, due to the excellent adhesion of the chip temporary attachment part 20, the chip having a tack can be securely attached to the chip temporary attachment part 20 and the chip can be stably held. Therefore, for example, even if the chip is washed with water in that state, it is possible to effectively suppress the chip from falling off the die sort sheet 1. Moreover, when the chip | tip which has a tack | tuck is peeled from the sheet | seat 1 for die-sorting at the next process by the outstanding peelability of the chip | tip temporary attachment part 20, a chip | tip can be picked up easily. In particular, when the chip has a (viscous) adhesive layer, deformation of the (adhesive) adhesive layer during pickup can be prevented.

  The surface roughness Rt (maximum cross-sectional height of the roughness curve) of the chip temporary attachment portion 20 of the base film 2 is preferably 0.1 to 3.0 μm, and preferably 0.2 to 2.5 μm. Is particularly preferred. When the surface roughness Rt of the chip temporary attachment portion 20 is within the above range, the above-described effect becomes more excellent.

  Moreover, it is preferable that the surface tension of the chip | tip temporary attachment part 20 of the base film 2 is 25-45 mN / m, and it is especially preferable that it is 25-35 mN / m. When the surface tension of the temporary chip attachment portion 20 is within the above range, the above-described effects are further improved.

  The material of the base film 2 is not particularly limited as long as it has the above-mentioned properties. For example, polyethylene such as low density polyethylene (LDPE) and linear low density polyethylene (LLDPE), ethylene / propylene copolymer, Polypropylene, polybutylene, polybutadiene, polymethylpentene, ethylene / vinyl acetate copolymer, ethylene / (meth) acrylic acid copolymer, ethylene / (meth) acrylic acid ester copolymer, polyvinyl chloride, polyurethane, polystyrene, polyamide A film made of polyimide, ionomer, styrene-butadiene rubber or the like is used. Moreover, the film which combines these 2 or more types of materials can also be used, and a 2 or more types of film can also be laminated | stacked and used.

  The film may be produced so as to have the above-mentioned characteristics when the film is formed, or may be subjected to a surface treatment so as to have the above-mentioned characteristics after the film is produced. In the former case, for example, a film having the above characteristics can be produced by adjusting the surface roughness of a roll used for extrusion. In the latter case, for example, a film having the above characteristics can be obtained by subjecting the film to sandblasting or peeling treatment.

  The thickness of the base film 2 is preferably 10 to 1000 μm, and more preferably 20 to 800 μm.

  The pressure-sensitive adhesive sheet 3 is provided to fix the die sort sheet 1 to a ring frame which is a kind of frame, and a ring frame is attached to the pressure-sensitive adhesive sheet 3 as described later. Therefore, the pressure-sensitive adhesive sheet 3 has a size and shape that can be attached to the ring frame.

  In the present embodiment, the pressure-sensitive adhesive sheet 3 includes a first pressure-sensitive adhesive layer 31 attached to the base film 2, a second pressure-sensitive adhesive layer 33 to which a ring frame is attached, the first pressure-sensitive adhesive layer 31 and the first pressure-sensitive adhesive layer 31. It is a double-sided pressure-sensitive adhesive sheet composed of a core material 32 sandwiched between two pressure-sensitive adhesive layers 33. The pressure-sensitive adhesive sheet 3 may be composed of a single pressure-sensitive adhesive layer. However, the pressure-sensitive adhesive force of the first pressure-sensitive adhesive layer 31 and that of the second pressure-sensitive adhesive layer 33 can be increased by having the above-described configuration. There is an advantage that the adhesive strength can be changed. For example, when the first pressure-sensitive adhesive layer 31 is composed of a strong pressure-sensitive adhesive and the second pressure-sensitive adhesive layer 33 is composed of a releasable pressure-sensitive adhesive, after the die-sorting sheet 1 is used, the die-sorting sheet 1 is changed to a ring frame. It becomes easy to remove from.

  The pressure-sensitive adhesive constituting the first pressure-sensitive adhesive layer 31 and the second pressure-sensitive adhesive layer 33 is not particularly limited, and a pressure-sensitive adhesive such as acrylic, rubber-based, silicone-based, polyurethane-based, or polyester-based is used. Can be used.

  The thicknesses of the first pressure-sensitive adhesive layer 31 and the second pressure-sensitive adhesive layer 33 are each preferably 1 to 100 μm, and more preferably 2 to 50 μm.

  The material of the core material 32 is not particularly limited as long as it can support the first pressure-sensitive adhesive layer 31 and the second pressure-sensitive adhesive layer 33. For example, a resin film similar to the base film 2 is used. In addition, films made of polyethylene terephthalate, polybutylene terephthalate, polycarbonate, etc., various papers, nonwoven fabrics, and the like can be used. Among these, when a relatively high rigidity film such as a polyethylene terephthalate film is used, the dimensional stability at the time of manufacturing the pressure-sensitive adhesive sheet 3 becomes good.

  The thickness of the core material 32 is preferably 10 to 500 μm, and more preferably 30 to 200 μm.

[Die sort sheet manufacturing method]
The die sort sheet 1 can be manufactured by a conventional method. For example, the first pressure-sensitive adhesive layer 31 is formed by coating the pressure-sensitive adhesive coating liquid of the first pressure-sensitive adhesive layer 31 on the release-treated surface of the light release type release film. Further, the second pressure-sensitive adhesive layer 33 is formed by applying a pressure-sensitive adhesive coating solution for the second pressure-sensitive adhesive layer 33 on the release treatment surface of the heavy release type release film. Then, the first pressure-sensitive adhesive layer 31 is bonded to one surface of the core material 32 and the second pressure-sensitive adhesive layer 33 is bonded to the other surface of the core material 32, and the double-sided pressure-sensitive adhesive sheet (both surfaces of the pressure-sensitive adhesive sheet 3 is bonded). In which a release film is laminated).

  Next, a punching process is performed on the double-sided pressure-sensitive adhesive sheet, a portion corresponding to the inner circumferential circle is cut, and an inner portion of the inner circumferential circle is removed. At this time, only the heavy release type release film may be left without being punched. As a result, subsequent processing can be performed continuously in a roll-to-roll manner.

  The light release type release film is peeled from the double-sided pressure-sensitive adhesive sheet, and the exposed first pressure-sensitive adhesive layer 31 is attached to the surface of the base film 1. And the punching process is given with respect to the obtained laminated body, the part applicable to the outer periphery circle | round | yen of the said double-sided adhesive sheet is cut, and the outer part of an outer periphery circle | round | yen is removed. In this way, the die sort sheet 1 is obtained. The heavy release type release film may be peeled off when the die sort sheet 1 is fixed to the ring frame.

[How to use die sort sheet]
Next, a method of using the die sort sheet 1 will be described. In this embodiment, a semiconductor chip is taken as an example of the chip, but the present invention is not limited to this, and the chip may be an optical element chip such as a glass chip, for example.

  In the present embodiment, as shown in FIG. 3, a chip 7 (semiconductor chip) having an adhesive layer 8 laminated on the back surface is temporarily attached to the chip temporary attachment portion 20 of the die sort sheet 1, and the chip 7 is attached. It shall be stored and transported. Here, what laminated | stacked the adhesive layer 8 on the back surface of the chip | tip 7 is obtained by dicing what stuck the dicing die bonding sheet | seat which has an adhesive layer on the semiconductor wafer back surface, for example. As the adhesive constituting the adhesive layer 8, a composition containing a thermosetting resin and an adhesive component is preferably used.

  Examples of the thermosetting resin in such a composition include epoxy resins, phenol resins, urea resins, melamine resins, unsaturated polyester resins, resorcinol resins, furan resins, polyurethane resins, silicone resins, and the like. Of these, epoxy resins are preferred. On the other hand, examples of the adhesive component include acrylic adhesives, rubber adhesives, polyester adhesives, and thermoplastic resins such as polyolefin, polyvinyl chloride, polystyrene, thermoplastic polyamide, and polyester. May contain an energy beam polymerizable compound. As such an adhesive component, a (meth) acrylic acid ester copolymer is preferable. The thermosetting resin is usually used in an amount of 5 to 2000 parts by mass, preferably 100 to 1000 parts by mass with respect to 100 parts by mass of the adhesive component.

  Particularly preferred as a composition containing a thermosetting resin and an adhesive component are a (meth) acrylic acid ester copolymer having a weight average molecular weight of 30000 or more, an epoxy resin having a weight average molecular weight of 100 to 10,000, an energy ray polymerizable compound, and It is a composition containing a thermally activated latent epoxy resin curing agent.

  In order to use the die sort sheet 1, as shown in FIG. 3, the second pressure-sensitive adhesive layer 33 of the pressure-sensitive adhesive sheet 3 is attached to the ring frame 6, and the die sort sheet 1 is fixed by the ring frame 6. Then, the adhesive layer 8 on the back surface of the chip 7 is attached to the chip temporary attachment portion 20 of the base film 2 of the die sort sheet 1, and the chip 7 is temporarily attached to the chip temporary attachment portion 20. Since the adhesive layer 8 has a tack, the adhesive layer 8 adheres to the chip temporary attachment portion 20 by the tack. The number of chips 7 temporarily attached to the chip temporary attachment portion 20 may be a desired number. This temporary attachment work can be performed by, for example, a normal die bonding apparatus.

  As described above, since the surface roughness of the chip temporary attachment portion 20 of the die sort sheet 1 is controlled, it has excellent adhesion to the adhesive layer 8. Therefore, the adhesive layer 8 on the back surface of the chip 7 can be securely attached to the chip temporary attachment portion 20 and the chip 7 can be stably held. Therefore, for example, even if the chip 7 temporarily attached to the die sort sheet 1 is washed with water by a spin washing machine or the like, it is possible to effectively suppress the chip 7 from dropping from the die sort sheet 1. By this water washing, dust adhering to the chip 7 or the adhesive layer 8 during storage and transport can be removed, and contamination can be prevented.

  The die sort sheet 1 temporarily attached with the chips 7 as described above is stored and transported as desired, and is transferred to the next step, for example, a die bonding step. In this step, the chip 7 is picked up together with the adhesive layer 8 from the chip temporary attachment portion 20 of the die sort sheet 1.

  As described above, since the surface roughness of the chip temporary attachment portion 20 of the die sort sheet 1 is controlled, it has excellent peelability with respect to the adhesive layer 8. Therefore, the chip 7 can be easily picked up together with the adhesive layer 8 by push-up and adsorption using a die bonding apparatus or the like, and deformation of the adhesive layer 8 can be prevented.

  Moreover, since the said sheet | seat 1 for a die sort does not have an adhesive layer in the area | region holding the chip | tip 7 unlike adhesive tapes, such as a general purpose dicing tape, the adhesive layer 8 is not contaminated with the adhesive of an adhesive tape. Therefore, a highly reliable semiconductor device can be manufactured using the chip 7 having the adhesive layer 8.

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  For example, the adhesive sheet 3 may be laminated | stacked on the peripheral part of the lower surface of the base film 2 like the sheet | seat 1A for die sorts shown in FIG. In this die sort sheet 1A, the entire upper surface of the base film 2 becomes the chip temporary attachment portion 20, and the lower surface of the adhesive sheet 3, that is, the lower surface of the second adhesive layer 33 is attached to the ring frame 6 as an adhesive portion. The

  Further, the die sort sheet of the present invention, like the die sort sheet 1B shown in FIG. 5, is a support film 5 and an adhesive layer 4 having substantially the same shape as the support film 5 laminated on the support film 5. And the base material film 2 laminated | stacked on the center part on the adhesive layer 4 may be comprised.

  In this die sort sheet 1B, the entire upper surface of the base film 2 becomes the chip temporary attachment portion 20, and the peripheral portion of the adhesive layer 4 where the base film 2 is not laminated is affixed to the ring frame 6 as an adhesive portion. The

  As the support film 5 and the pressure-sensitive adhesive layer 4, a general-purpose dicing tape can be used, but is not limited thereto. As the material of the support film 5, the same material as the core material 32 of the pressure-sensitive adhesive sheet 3 described above can be used. The thickness of the support film 5 is preferably 10 to 500 μm, and more preferably 30 to 300 μm. Moreover, as an adhesive which comprises the adhesive layer 4, the material similar to the adhesive which comprises the 2nd adhesive layer 33 of the adhesive sheet 3 mentioned above can be used. The thickness of the pressure-sensitive adhesive layer 4 is preferably 1 to 100 μm, and more preferably 3 to 80 μm.

  Moreover, in the said embodiment, although the shape of the sheet | seat 1 for die sort was circular according to the shape of the ring frame 6, it is not limited to this, It can change according to the frame body of the various shapes to be used. It is. For example, when the frame is square, the die sort sheet and the chip temporary attachment portion are preferably square.

  EXAMPLES Hereinafter, although this invention is demonstrated further more concretely based on an Example, this invention is not limited to these Examples.

  Here, the measurement of the surface roughness and the surface tension of the base film in Examples and Comparative Examples described later was performed as follows.

1. Surface roughness measurement Product geometric property specification (GPS)-Surface property: Contour curve method-Terminology, definition and surface property parameter In accordance with JIS B0601: 2001, using a contact surface roughness meter SV3000S4 manufactured by Mitutoyo Corporation , Ra (arithmetic mean roughness) and Rt (maximum cross-sectional height of the roughness curve) were measured. The measurement conditions were λc: 0.8 mm, λs: 0.08 mm, reference length: 2.5 mm, and evaluation length: 10.0 mm.

2. Measurement of surface tension Plastic-film and sheet-wetting tension test method Surface tension was measured according to JIS K6768: 1999.

[Example 1]
To 100 parts by mass of an acrylic copolymer (manufactured by Soken Chemical Co., Ltd., SK Dyne 1811L), 3 parts by mass of aromatic polyisocyanate (manufactured by Toyo Ink Manufacturing Co., Ltd., Olivevine BHS8515) and 20 parts by mass of methyl ethyl ketone as a solvent were added. An adhesive solution a was prepared.

  Moreover, 3.6 parts by mass of aromatic polyisocyanate (manufactured by Toyo Ink Manufacturing Co., Ltd., Olivevine BHS8515) and 35 parts by mass of toluene as a solvent with respect to 100 parts by mass of acrylic copolymer (manufactured by Soken Chemical Co., Ltd., K-Dyne 1755) Part was added to prepare an adhesive solution b.

  The pressure-sensitive adhesive solution a was applied onto the release-treated surface of a release film (SP-PET 381031 (S) manufactured by Lintec Co., Ltd.) that was release-treated with a silicone release agent, dried in an oven at 100 ° C. for 1 minute, A pressure-sensitive adhesive layer A having a thickness of 5 μm was formed. Further, using the adhesive solution b, an adhesive layer B having a thickness of 5 μm was formed on the release-treated surface of the release film in the same manner as described above.

  Next, a soft vinyl chloride film (thickness 50 μm) was prepared as a core material, and the pressure-sensitive adhesive layer A was transferred to one side thereof. Next, the pressure-sensitive adhesive layer B was transferred to the other surface of the soft vinyl chloride film to obtain a double-sided pressure-sensitive adhesive sheet having a release film laminated on both surfaces. The obtained double-sided pressure-sensitive adhesive sheet was subjected to a circular punching process with a diameter of 165 mm, and the inner circular portion was removed.

  On the other hand, as a base film, a low-density polyethylene film whose surface roughness is controlled by passing a metal roll whose surface roughness is controlled during extrusion (thickness: 100 μm, Ra on the surface of the chip temporary attachment portion side: 0.044 μm) , Rt: 0.281 μm, surface tension: 31 mN / m).

  The pressure-sensitive adhesive layer B exposed by peeling the release sheet from the double-sided pressure-sensitive adhesive sheet was attached to the surface of the base film on the chip temporary attachment portion side. Next, punching with a diameter of 207 mm was performed so as to be concentric with the circular punched portion of the double-sided PSA sheet, and the outer portion of the circle was removed to obtain a sheet for die sorting.

[Example 2]
Example 1 except that a polypropylene film (thickness: 100 μm, Ra on the surface of the chip temporary attachment portion side: 0.051 μm, Rt: 0.525 μm, surface tension: 30 mN / m) was used as the base film. Similarly, a die sort sheet was produced.

Example 3
As the substrate film, an ethylene / methyl methacrylate copolymer film (thickness: 100 μm, Ra on the side of the chip temporary attachment portion side: 0.231 μm, Rt: 1.919 μm, surface tension: 33 mN / m) was used. Except for the above, a die sort sheet was produced in the same manner as in Example 1.

[Comparative Example 1]
Example except that a low-density polyethylene film (thickness: 100 μm, Ra on the surface of the chip temporary attachment portion side: 0.430 μm, Rt: 3.842 μm, surface tension: 31 mN / m) was used as the base film. In the same manner as in No. 1, a die sort sheet was prepared.

[Comparative Example 2]
As a base film, a low-density polyethylene film whose surface roughness was controlled by passing a water-cooled metal roll whose surface roughness was controlled during extrusion (thickness: 100 μm, Ra on the surface of the chip temporary attachment portion side: 0.009 μm, A die sort sheet was produced in the same manner as in Example 1 except that Rt: 0.099 μm and surface tension: 31 mN / m) were used.

[Comparative Example 3]
Example 1 except that a polyethylene terephthalate film (thickness: 100 μm, Ra on the surface of the chip temporary attachment portion side: 0.008 μm, Rt: 0.097 μm, surface tension: 48 mN / m) was used as the base film. In the same manner as above, a die sort sheet was produced.

[Comparative Example 4]
As a base film, a polyethylene terephthalate film whose surface on the side of the chip temporary attachment portion was subjected to a release treatment with a silicone release agent (thickness: 100 μm, Ra on the surface of the temporary attachment portion side: 0.425 μm, Rt: 3.750 μm, A die sort sheet was prepared in the same manner as in Example 1 except that the surface tension was less than 22.6 mN / m.

The surface roughness and surface tension of the base film used in the above Examples and Comparative Examples are summarized in Table 1 below.

[Test example]
1. Chip Retention Test A semiconductor wafer (dummy wafer, diameter 200 mm) was pasted on the adhesive layer of a dicing die bond sheet (Adwill LE5000, manufactured by Lintec Co., Ltd.) whose adhesive layer has tack, and the adhesive layer Each wafer was diced to obtain a semiconductor chip (5 mm × 5 mm size) having an adhesive layer on the back surface.

  On the other hand, the release sheet was peeled from the double-sided pressure-sensitive adhesive sheet of the die sort sheet obtained in Examples and Comparative Examples, and the exposed pressure-sensitive adhesive layer A was attached to the ring frame.

  The die-bonding device (manufactured by Canon Machinery Co., Ltd., BESTEM-D02) is used to pick up the semiconductor chip with the adhesive layer, and the chip temporary attachment portion 20 of the die sort sheet (the inner part of the double-sided pressure-sensitive adhesive sheet in the base film) ) Was attached to the die-sorting sheet. At this time, a total of 100 semiconductor chips were arranged in a lattice pattern so as to be separated from each other so that a gap of 300 μm was formed.

  After storing in this state at 25 ° C. for 12 hours, the semiconductor chip temporarily attached to the die sort sheet is subjected to water for 1 minute at a rotational speed of 4000 rpm by a spin cleaning machine (Disco wafer grinding device, unit in DFD651). Washing was performed. During the washing with water, the chip was removed from the base film and the number of chip jumps was confirmed. The results are shown in Table 2.

2. Pickup property test Following the above, using a die-bonding device (Canon Machinery Co., Ltd., BESTTEM-D02), it was equipped with 10 adhesive layers from a sheet for die sorting by pushing up with four needles and suction with a suction collet. A semiconductor chip was picked up.

  At this time, the suction collet could not hold the semiconductor chip by suction, and the semiconductor chip left on the die sort sheet or the semiconductor chip left out was regarded as a pickup failure, and the number of pickup failures was confirmed. The results are shown in Table 2.

  As is apparent from Tables 1 and 2, the die sort sheet that satisfies the conditions of the present invention was excellent in both chip holding property and pickup property.

  The sheet | seat for die sorts concerning this invention can be used conveniently for storage and conveyance of the semiconductor chip with an adhesive layer obtained by dicing using a dicing die-bonding sheet.

It is a perspective view of the sheet | seat for die sorting which concerns on one Embodiment of this invention. It is sectional drawing of the sheet | seat for die sorts concerning the embodiment. It is sectional drawing which shows the use condition of the sheet | seat for die sorts concerning the embodiment. It is sectional drawing which shows the use condition of the sheet | seat for die sorting which concerns on other embodiment. It is sectional drawing which shows the use condition of the sheet | seat for die sorting which concerns on another embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,1A, 1B ... Sheet | seat for die sort 2 ... Base film 20 ... Chip temporary attachment part 3 ... Adhesive sheet (adhesive part)
DESCRIPTION OF SYMBOLS 31 ... 1st adhesive layer 32 ... Core material 33 ... 2nd adhesive layer 4 ... Adhesive layer 5 ... Support film 6 ... Ring frame (frame body)
7 ... Chip 8 ... Adhesive layer

Claims (4)

A die sort sheet for temporarily attaching a chip having a tack,
In plan view, the peripheral portion is provided with an adhesive portion, the tip peripheral portion is provided inside the peripheral portion,
A die sort sheet, wherein the surface roughness Ra (arithmetic mean roughness) of the surface of the chip temporary attachment portion is 0.01 to 0.4 μm.   2. The die sort sheet according to claim 1, wherein a surface roughness Rt (maximum cross-sectional height of the roughness curve) of the surface of the chip temporary attachment portion is 0.1 to 3.0 μm. The die sort sheet is:
A base film;
The sheet for die sorting according to claim 1 or 2, comprising an adhesive sheet laminated on a peripheral edge of the base film. The pressure-sensitive adhesive sheet is
A first pressure-sensitive adhesive layer affixed to the base film;
A second adhesive layer to which the frame is attached;
The die sort sheet according to claim 3, comprising a core material sandwiched between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer.

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