JP2009259453A - Lighting fixture for vehicle - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To aim at protecting a light-emitting part of a semiconductor-type light source, securing dust resistance and avoiding thermal obstruction. <P>SOLUTION: The semiconductor-type light source 10 is wholly covered with a cover lens 20, and a vent 23 is partially fitted at a peripheral side part of the cover lens 20, therefore air inside the cover lens 20 and outside is freely circulated, thus, even if a temperature inside the cover lens 20 is increased by heat generation due to lighting of the light-emitting part 11 of the semiconductor-type light source 10, heat inside the cover lens 20 is dispersed outside through the vent 23. Therefore, with protection and dust resistance of the light-emitting part 11 secured, thermal obstruction of the light-emitting part 11 is avoided. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a vehicular lamp used for a headlamp, a rear combination lamp, or the like of an automobile.

  In recent years, self-luminous semiconductor light sources such as light-emitting diodes (LEDs) have been used as light sources for vehicle lamps such as headlamps.

In the vehicular lamp using such a semiconductor-type light source, the light-emitting portion is formed in a dome shape in consideration of the protection of the light-emitting portion of the semiconductor-type light source and the influence on the light distribution pattern due to dust adhering to the light-emitting portion. (See Patent Document 1).
JP 2008-16362 A

  As described above, when the light emitting part of the semiconductor light source is covered with a cover, the inner volume of the light emitting part by the cover is small, so when the light emitting part generates heat, the inside of the cover is heated up and the light emitting part is subjected to thermal failure. As a result, the lighting effect may be reduced. As in recent years, the amount of heat generated in the light emitting portion increases as the brightness of the semiconductor light source increases to increase the illumination effect, and the above-described problems are promoted.

  Therefore, the present invention provides a vehicular lamp that can appropriately protect and prevent dust from being emitted from a semiconductor-type light source, and that can prevent the light emitting unit from being damaged due to heat generated by the light emitting unit. .

  In the vehicle lamp of the present invention, a semiconductor-type light source, a cover lens that covers the semiconductor-type light source as a whole, a heat sink member that attaches the semiconductor-type light source and the cover lens toward the front of the lamp chamber, The cover lens is mainly characterized in that a ventilation hole is partially provided in the peripheral side portion thereof.

  Accordingly, although the light emitting part generates heat by heating the light emitting part of the semiconductor type light source and the temperature inside the cover lens rises, the inside of the cover lens is formed by the ventilation holes partially provided on the peripheral side part of the cover lens. Air flows outside and the heat inside the cover lens is diffused outward.

  According to the present invention, since the vent hole is partially provided in the peripheral side portion of the cover lens that entirely covers the semiconductor-type light source, the inside of the cover lens is heated by the heat generation of the light-emitting portion of the semiconductor-type light source. However, air can be circulated in and out of the cover lens through the vent, and the heat inside the cover lens can be diffused outward.

  As a result, it is possible to avoid the light-emitting portion of the semiconductor light source from receiving a thermal failure due to the heat generation.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

  1 is a front view of a semiconductor-type light source of a vehicular lamp according to the present invention, FIG. 2 is a view as viewed from an arrow A in FIG. 1, FIG. 3 is a view as viewed from an arrow B in FIG. It is a disassembled perspective view.

  As shown in FIGS. 1 to 3, the vehicular lamp according to the present embodiment includes a semiconductor light source 10 such as a light emitting diode (LED), a cover lens 20 that entirely covers the semiconductor light source 10, and these semiconductor types. And a heat sink member 30 to which the light source 10 and the cover lens 20 are attached facing the front of the lamp chamber.

  The heat sink member 30 receives and diffuses the heat generated in the semiconductor light source 10 and is made of a metal material having a good thermal conductivity and a large heat capacity, for example, made of aluminum die casting.

  The semiconductor light source 10 and the cover lens 20 are accurately positioned and fixed to a mounting surface 31 set as a required portion on the front surface of the heat sink member 30 by positioning means, for example, engaging means such as a locate pin and a locate hole.

  The semiconductor-type light source 10 has a substrate (not shown) with good thermal conductivity. This substrate is superposed on the mounting surface 31 of the heat sink member 30 to perform the above-described positioning and fixing.

  In addition, a reflector (not shown) for reflecting the light of the semiconductor-type light source 10 in a predetermined direction and irradiating a predetermined light distribution pattern in front of the lamp is positioned and fixed on the mounting surface 31. A lamp unit is configured. And this lamp unit is arrange | positioned in the lamp chamber formed with the housing and outer lens which are not shown in figure, and comprises the vehicle lamp.

  The cover lens 20 is made of a transparent synthetic resin material, and includes a cover portion 21 that covers substantially the entire semiconductor light source 10 and a lens portion 22.

  The portions other than the lens portion 22 are made opaque, for example, by painting, and the light from the semiconductor light source 21 is transmitted only from the lens portion 22 portion. Further, the surface of the lens portion 22 is subjected to optical surface treatment such as AR coating.

  The lens portion 22 is formed in a dome shape that bulges outward from the light emitting portion 11 of the semiconductor light source 10.

  Further, a vent hole 23 is partially provided in the peripheral side portion of the cover lens 20, and air can freely flow inside and outside the cover lens 20 by the vent hole 23.

  The ventilation hole 23 is provided with a dustproof filter 40 having air permeability. The dustproof filter 40 prevents dust, metal powder, and the like from entering the cover lens 20.

  In the present embodiment, the cover portion 21 of the cover lens 20 is formed in a front rectangular shape including left and right side walls 21a, an upper wall 21b, and a front wall 21c. A series of flanges 24 are formed on the rear end edges of the left and right side walls 21a and the upper wall 21b, and a pair of locate holes 24a and screw insertion holes 24b are provided on the left and right side portions thereof, and these locate holes 24a and screw insertion holes are provided. Positioning and fixing to the mounting surface 31 of the heat sink member 30 is performed via 24b.

  Thus, the left and right sides, the upper side, and the front side of the semiconductor light source 10 are surrounded by the left and right side walls 21a, the upper wall 21b, and the front wall 21c of the cover portion 21.

  The lens portion 22 is formed in a dome shape with the light emitting portion 11 of the semiconductor light source 10 as the center on the front wall 21c of the cover portion 21 as described above, and a substantially lower half portion thereof from the lower edge of the front wall of the cover portion 21. It is formed to project downward. A lower edge of the front wall 21c of the cover portion 21 extends as a flange portion 22a on the periphery of the protruding portion of the lens portion 22.

  Therefore, in the present embodiment, the vent 23 of the cover lens 20 is provided in the lower side portion of the cover lens 20 in a region extending from the lower edge of the cover portion 21 to the substantially lower half periphery of the lens portion 22. (See FIG. 4).

  On the other hand, the dustproof filter 40 is formed in a substantially semicircular shape so as to close the vent 23, and extends over the inner surface of the lower edge portion of the cover portion 21 and the inner surface of the flange portion 22 a of the substantially lower half portion of the lens portion 22. Then, they are bonded and fixed with an appropriate adhesive.

  In the vent 23, a pair of power supply terminals 12 connected to the substrate of the semiconductor light source 10 are disposed so as to protrude outward. For this reason, the dustproof filter 40 is provided with a pair of through holes 41 for inserting these power supply terminals 12.

  According to the vehicular lamp of the present embodiment having the above configuration, the light emitting unit 11 generates heat by the lighting of the light emitting unit 11 of the semiconductor light source 10, and the inside of the cover lens 20 is heated, but the cover lens 20 Air is circulated inside and outside the cover lens 20 by the vent holes 23 partially provided on the peripheral side of the cover lens 20, and the heat inside the cover lens 20 is diffused to the outside.

  As a result, it is possible to prevent the light emitting unit 11 of the semiconductor light source 10 from receiving a thermal failure due to the heat generation and to prevent the light emitting function from being deteriorated.

  The cover lens 20 entirely covers the semiconductor light source 10 including a substrate (not shown), and the lens portion 21 of the cover lens 20 is formed in a dome shape with the light emitting portion 11 as the center. Therefore, the temperature rise characteristic inside the cover lens 20 can be lowered.

  In particular, in this embodiment, the cover lens 20 includes a cover portion 21 that surrounds the left and right sides, the upper side, and the front side of the semiconductor light source 10, and a dome-shaped lens portion 22 formed on the front wall 21 c of the cover portion 21. However, since the lens portion 22 is formed to protrude downward from the lower edge of the front wall 21c of the cover portion 21, the outer diameter of the lens portion 22 is in the plane of the front wall 21c of the cover portion 21. The diameter can be increased without being restricted by the above, and the volume around the light emitting portion 11 can be sufficiently secured to enhance the thermal diffusion effect.

  Even if the semiconductor light source 10 is entirely covered by the cover portion 21 including the substrate (not shown), since the heat diffusion effect in the cover lens 20 is high, the heat diffusibility of the substrate of the semiconductor light source 10 is improved. There is little influence.

  Moreover, the vent 23 is formed with a large opening area in a region extending from the lower edge of the cover portion 21 to the substantially lower half of the lens portion 22 projecting downward. The thermal diffusion effect can be further enhanced.

  Further, since the vent hole 23 is provided in the lower side portion of the cover lens 20 as described above, dust, metal powder or the like does not directly fall into and enter the cover lens 20, and the semiconductor light source 10 can be connected to the substrate and the light source 10. It is possible to protect the entire unit including the light emitting unit 11.

  Since the air vent 23 is provided with a dust-proof filter 40 having air permeability, it is possible to reliably prevent the light emitting function from being deteriorated due to dust adhering to the light emitting portion 11 and the substrate of the semiconductor light source 10. .

The front view of the semiconductor type light source in one Embodiment of this invention. The A arrow directional view of FIG. B arrow view of FIG. The exploded perspective view of a cover lens and a dustproof filter.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Semiconductor type light source 11 Light emission part 20 Cover lens 21 Cover part 21c Front wall 22 Lens part 23 Vent 30 Heat sink member 40 Dust-proof filter

Claims (4)

  A semiconductor-type light source; a cover lens that covers the semiconductor-type light source as a whole; and a heat sink member that is mounted with the semiconductor-type light source and the cover lens facing the front of the lamp chamber. A vehicular lamp characterized in that a vent is partially provided in the part.   The vehicular lamp according to claim 1, wherein a ventilating barrier filter having air permeability is provided in the vent hole.   The vehicular lamp according to claim 1, wherein the cover lens has a lens portion formed in a dome shape with the light emitting portion of the semiconductor light source as a center.   The cover lens is formed in a dome shape with the light emitting part of the semiconductor light source as the center on the front wall of the semiconductor light source, the cover part surrounding the left and right sides, the upper side and the front side of the semiconductor light source. And a lens portion that protrudes downward from the lower edge of the front wall of the cover portion, and the vent hole is formed on the lower side portion of the cover lens in the region extending from the lower edge of the cover portion to the substantially lower half periphery of the lens portion. The vehicular lamp according to claim 1, wherein the vehicular lamp is formed.

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