JP2009258168A - Molding and laminate by using the same - Google Patents

Molding and laminate by using the same Download PDF

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JP2009258168A
JP2009258168A JP2008103852A JP2008103852A JP2009258168A JP 2009258168 A JP2009258168 A JP 2009258168A JP 2008103852 A JP2008103852 A JP 2008103852A JP 2008103852 A JP2008103852 A JP 2008103852A JP 2009258168 A JP2009258168 A JP 2009258168A
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molded body
protective film
adhesive layer
laminate
uneven structure
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JP5203784B2 (en
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Hiroshi Yokoyama
宏 横山
Takuji Namatame
卓治 生田目
Hiroshi Yamaki
宏 山木
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Asahi Kasei Corp
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Asahi Kasei E Materials Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a molding capable of exhibiting excellent optical properties when used even if a protective sheet is stuck to the surface of the molding on the side of a metallic wire when the molding is conveyed or handled and the stuck protective sheet is peeled when used; and to provide a laminate by using the molding. <P>SOLUTION: The laminate includes: a wire grid polarizing plate 1 having a minutely rugged structure, which has 0.01-10 μm height and 0.01-10 μm pitch in at least one direction, on the surface thereof; and a protective film 2 which is arranged on the minutely rugged structure 11a of the wire grid polarizing plate 1 and has an easy-to-peel adhesive layer 22. The amount of a component to be extracted when a covering material constituting the adhesive layer 22 is extracted with a solvent is ≤0.3 mg per 1 cm<SP>2</SP>covering material. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、表面に微細な凸凹構造を持つ成形体及びそれを用いた積層体に関する。   The present invention relates to a molded body having a fine uneven structure on the surface and a laminate using the molded body.

近年のフォトリソグラフィー技術の発達により、光の波長レベルのピッチを有する微細構造パターンを形成することができるようになってきた。この様に非常に小さいピッチのパターンを有する部材や製品は、半導体分野だけでなく、光学分野において利用範囲が広く有用である。   With the recent development of photolithography technology, it has become possible to form a fine structure pattern having a pitch at the wavelength level of light. Such a member or product having a pattern with a very small pitch is useful in a wide range of applications not only in the semiconductor field but also in the optical field.

例えば、金属などで構成された導電体線が特定のピッチで格子状に配列してなる凸凹構造を持つワイヤグリッドは、そのピッチが入射光(例えば、可視光の波長400nmから800nm)に比べてかなり小さいピッチ(例えば、2分の1以下)であれば、導電体線に対して平行に振動する電場ベクトル成分の光をほとんど反射し、導電体線に対して垂直な電場ベクトル成分の光をほとんど透過させるため、単一偏光を作り出す偏光板として使用できる。ワイヤグリッド型偏光素子は、透過しない光を反射し再利用することができるので、光の有効利用の観点からも望ましいものである。   For example, a wire grid having an uneven structure in which conductor wires made of metal or the like are arranged in a lattice pattern at a specific pitch has a pitch that is greater than that of incident light (for example, wavelengths of visible light from 400 nm to 800 nm). If the pitch is very small (for example, less than one half), the light of the electric field vector component that oscillates parallel to the conductor line is almost reflected, and the light of the electric field vector component perpendicular to the conductor line is reflected. Since it is almost transparent, it can be used as a polarizing plate that produces a single polarized light. The wire grid type polarizing element is desirable from the viewpoint of effective use of light because it can reflect and reuse light that does not pass through.

このようなワイヤグリッド型偏光素子としては、例えば、特許文献1に開示されているものがある。このワイヤグリッド偏光板は、入射光の波長より小さいグリッド周期で間隔が置かれた金属ワイヤを備えている。
特開2002−328234号公報
An example of such a wire grid type polarizing element is disclosed in Patent Document 1. The wire grid polarizer includes metal wires spaced at a grid period smaller than the wavelength of incident light.
JP 2002-328234 A

しかしながら、特許文献1に開示されている構成においては、微小間隔で微小な金属ワイヤが立設されており、強度的にも弱い。このため、搬送や取扱いの際には、金属ワイヤ側の表面に保護シートなどを貼付して金属ワイヤを保護することが考えられる。粘着層を有する保護シートを、単にワイヤグリッド偏光板の表面に貼付すると、粘着層を構成する被覆材から比較的低分子量の粘着成分が表面の凸凹構造に移行し、ワイヤ間に浸入して光学特性を損なうという問題がある。   However, in the configuration disclosed in Patent Document 1, minute metal wires are erected at minute intervals, which is weak in strength. For this reason, it is conceivable to protect the metal wire by attaching a protective sheet or the like to the surface on the metal wire side during transport or handling. When a protective sheet with an adhesive layer is simply applied to the surface of the wire grid polarizer, the adhesive component with a relatively low molecular weight moves from the coating material constituting the adhesive layer to the uneven structure on the surface, and enters between the wires to optically There is a problem that the characteristics are impaired.

本発明はかかる点に鑑みてなされたものであり、搬送や取扱いの際には、金属ワイヤ側の表面に保護シートを貼付し、使用時に保護シートを剥離する態様であっても、使用時に良好な光学特性を発揮できる成形体及びそれを用いた積層体を提供することを目的とする。   The present invention has been made in view of such points, and when transporting and handling, even when the protective sheet is attached to the surface on the metal wire side and the protective sheet is peeled off at the time of use, it is good at the time of use. An object of the present invention is to provide a molded product that can exhibit excellent optical characteristics and a laminate using the molded product.

本発明の積層体は、高さが0.01μm〜10μmであり、少なくとも1方向のピッチが0.01μm〜10μmである微細な凸凹構造を表面に有する成形体と、前記成形体の前記凸凹構造上に配設され、易剥離性の粘着層を有する被覆材と、を具備する積層体であって、前記粘着層を構成する被覆材を溶剤抽出することによって抽出される成分の量が、前記被覆材1cm当たり0.3mg以下であることを特徴とする。 The laminate of the present invention has a surface having a fine uneven structure having a height of 0.01 μm to 10 μm and a pitch in at least one direction of 0.01 μm to 10 μm, and the uneven structure of the formed body. And a covering material having an easily peelable adhesive layer, wherein the amount of the component extracted by solvent extraction of the covering material constituting the adhesive layer is It is characterized by being 0.3 mg or less per 1 cm 2 of the covering material.

この構成によれば、微細で高精度な凸凹構造を保護することができる。また、この積層体における保護フィルムは、比較的低分子量の粘着成分の含有量が最小である粘着層を有するので、粘着成分の移行による光学特性の低下を防止することができる。また、この積層体は、高生産性であり、曲げ加工性にも優れるものである。   According to this configuration, it is possible to protect a fine and highly accurate uneven structure. Moreover, since the protective film in this laminated body has an adhesive layer in which the content of the adhesive component having a relatively low molecular weight is minimum, it is possible to prevent a decrease in optical properties due to the migration of the adhesive component. In addition, this laminate has high productivity and excellent bending workability.

本発明の積層体においては、前記成形体は、複数の格子状凸部が並設して構成された凸凹構造の前記格子状凸部上に金属ワイヤが形成されてなることが好ましい。   In the laminated body of the present invention, it is preferable that the molded body is formed by forming a metal wire on the grid-shaped convex portion having a concave-convex structure in which a plurality of grid-shaped convex portions are arranged in parallel.

本発明の積層体においては、前記被覆材を剥離した際に、前記粘着層を構成する被覆材から前記成形体への移行成分量が前記被覆材1cm当たり0.005mg以下であることが好ましい。 In the laminated body of the present invention, when the covering material is peeled off, the amount of component transferred from the covering material constituting the adhesive layer to the molded body is preferably 0.005 mg or less per 1 cm 2 of the covering material. .

本発明の積層体においては、剥離速度1000mm/分での90度剥離法による前記成形体と前記被覆材との間の剥離力が0.1gf/25mm〜200gf/25mmであることが好ましい。   In the laminated body of this invention, it is preferable that the peeling force between the said molded object and the said coating | covering material by the 90 degree | times peeling method at peeling speed 1000mm / min is 0.1gf / 25mm-200gf / 25mm.

本発明の成形体は、上記積層体から前記被覆材を剥離してなることを特徴とする。   The molded body of the present invention is characterized in that the covering material is peeled from the laminate.

本発明の成形体においては、前記成形体を溶剤抽出することによって抽出される成分の量が、前記成形体の全体の重量の10重量%以下であることが好ましい。   In the molded article of the present invention, the amount of components extracted by solvent extraction of the molded article is preferably 10% by weight or less of the total weight of the molded article.

本発明の積層体は、高さが0.01μm〜10μmであり、少なくとも1方向のピッチが0.01μm〜10μmである微細な凸凹構造を表面に有する成形体と、前記成形体の前記凸凹構造上に配設され、易剥離性の粘着層を有する被覆材と、を具備し、前記粘着層を構成する被覆材を溶剤抽出することによって抽出される成分の量が、前記被覆材1cm当たり0.3mg以下であるので、搬送や取扱いの際には、金属ワイヤ側の表面に保護シートを貼付し、使用時に保護シートを剥離する態様であっても、使用時に良好な光学特性を発揮することができる。 The laminate of the present invention has a surface having a fine uneven structure having a height of 0.01 μm to 10 μm and a pitch in at least one direction of 0.01 μm to 10 μm, and the uneven structure of the formed body. And a covering material having an easily peelable adhesive layer, and the amount of a component extracted by solvent extraction of the covering material constituting the adhesive layer per 1 cm 2 of the covering material Since it is 0.3 mg or less, even when transported or handled, a protective sheet is affixed to the surface on the metal wire side, and even when the protective sheet is peeled off during use, it exhibits good optical properties during use. be able to.

以下、本発明の実施の形態について、添付図面を参照して詳細に説明する。ここでは、成形体が、複数の格子状凸部が並設して構成された凸凹構造の格子状凸部上に金属ワイヤが形成されてなるワイヤグリッド偏光板である場合について説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Here, a case will be described in which the molded body is a wire grid polarizing plate in which a metal wire is formed on a grid-like convex part having a concave-convex structure formed by arranging a plurality of grid-like convex parts.

図1は、本発明の実施の形態に係る積層体の一部を示す概略断面図である。図1に示す積層体は、微細な凸凹構造11a(一方向に延在した凸部を持つ格子状の凸凹構造)を表面に有する透明な基材11と、この基材11の凸凹構造11aの格子状凸部を含む領域上に設けられた金属ワイヤ12と、この金属ワイヤ12の先端部と接触する粘着層22を有する保護フィルム基材21を備えた被覆材である保護フィルム2とから主に構成されている。基材11と金属ワイヤ12とで成形体であるワイヤグリッド偏光板1を構成しており、微細な凸凹構造11aは、高さが0.01μm〜10μmであり、少なくとも1方向のピッチが0.01μm〜10μmであり、例えば、光ナノインプリント技術を応用して製造することができる。また、凸凹構造11aについては、格子状凸部上に形成された金属ワイヤ12だけでなく、格子状凸部を薄膜やドットで構成しても良く。凸凹構造11aの凹部をピンホールで構成しても良い。   FIG. 1 is a schematic cross-sectional view showing a part of a laminate according to an embodiment of the present invention. The laminated body shown in FIG. 1 includes a transparent base material 11 having a fine uneven structure 11a (a lattice-like uneven structure having protrusions extending in one direction) on the surface, and an uneven structure 11a of the base material 11. Mainly from the protective film 2 which is a covering material provided with the protective film base material 21 which has the adhesion layer 22 which contacts the front-end | tip part of this metal wire 12, and the metal wire 12 provided on the area | region containing a grid | lattice-like convex part It is configured. The substrate 11 and the metal wire 12 constitute a wire grid polarizing plate 1 that is a molded body, and the fine uneven structure 11a has a height of 0.01 μm to 10 μm, and a pitch in at least one direction is 0.1. For example, it can be manufactured by applying an optical nanoimprint technique. Moreover, about the uneven structure 11a, you may comprise not only the metal wire 12 formed on the grid-like convex part but the grid-like convex part with a thin film or a dot. You may comprise the recessed part of the uneven structure 11a with a pinhole.

なお、ここでは、基材11は、基材11の表面に凸凹構造11aが形成された単層構造を有しているが、本発明においては、金属ワイヤ12を設けるための凸凹構造11aを有するものであれば、単層に限定されることはない。   Here, the base material 11 has a single layer structure in which the uneven structure 11a is formed on the surface of the base material 11, but in the present invention, the base material 11 has the uneven structure 11a for providing the metal wire 12. If it is a thing, it will not be limited to a single layer.

基材11を単層で構成する場合、基材1を構成するものとしては、PET樹脂、PMMA樹脂、PC樹脂、PS樹脂、COPなどの熱可塑性樹脂やTAC樹脂などの樹脂、ガラスなどを挙げることができる。また、基材11は、例えば、ベース基材上に、凸凹構造11aを有するように紫外線硬化型樹脂層が設けられた複数層構造であっても良い。この場合、基材11を構成するものとしては、PET(ポリエチレンテレフタレート)樹脂、PMMA(ポリメタクリル酸メチル)樹脂、PC(ポリカーボネート)樹脂、PS(ポリスチレン)樹脂、PE(ポリエチレン)樹脂、PP(ポリプロピレン)樹脂、COP(シクロオレフィンポリマー)などの熱可塑性樹脂やTAC(トリアセチルセルロース)樹脂などの樹脂、ガラスなどを挙げることができる。紫外線硬化型樹脂層を構成する紫外線硬化型樹脂としては、アクリル系、エポキシ系、ウレタン系などの紫外線硬化型樹脂を用いることができる。   When the substrate 11 is formed of a single layer, examples of the substrate 1 include thermoplastic resins such as PET resin, PMMA resin, PC resin, PS resin, and COP, resins such as TAC resin, and glass. be able to. Moreover, the base material 11 may have a multi-layer structure in which an ultraviolet curable resin layer is provided on the base base material so as to have an uneven structure 11a. In this case, the substrate 11 is composed of PET (polyethylene terephthalate) resin, PMMA (polymethyl methacrylate) resin, PC (polycarbonate) resin, PS (polystyrene) resin, PE (polyethylene) resin, PP (polypropylene). ) Resins, thermoplastic resins such as COP (cycloolefin polymer), resins such as TAC (triacetyl cellulose) resin, and glass. As the ultraviolet curable resin constituting the ultraviolet curable resin layer, an acrylic, epoxy, urethane or other ultraviolet curable resin can be used.

紫外線硬化型樹脂を用いて凸凹構造11aを設ける場合には、例えば、上記の基材11を構成する樹脂、ガラスの表面に上記の紫外線硬化樹脂を塗布し、所望の凸凹構造を反転した凹凸構造を有する型に押し当てながら紫外線硬化型樹脂を紫外線で硬化して、型の凹凸構造を紫外線硬化型樹脂に転写して基材11上に凸凹構造11aを設ける。   In the case where the uneven structure 11a is provided using an ultraviolet curable resin, for example, an uneven structure in which the above-described ultraviolet curable resin is applied to the surface of the resin or glass constituting the substrate 11 and the desired uneven structure is inverted. The ultraviolet curable resin is cured with ultraviolet rays while being pressed against the mold having the, and the concave / convex structure of the mold is transferred to the ultraviolet curable resin to provide the convex / concave structure 11 a on the substrate 11.

また、熱可塑性樹脂に凸凹構造11aを設け、単層の基材11とする場合には、例えば所望の凸凹構造を反転した凹凸構造を有する型を用いて熱可塑性樹脂に凸凹構造を熱転写する方法や、例えば延伸加工が可能な熱可塑性樹脂によりピッチの大きな反転型を用いて熱転写した後に延伸加工を施して、所望のピッチの凸凹構造11aを設けた基材11を得る方法が挙げられる。なお、このような熱可塑性樹脂基材の延伸については、本出願人の特願2006−2100号に記載されている。この内容はすべてここに含めておく。また、ガラス基板などに凸凹構造11aを設ける場合には、例えばフォトリソグラフィー、エッチングなどの通常のパターニング方法を用いればよい。   Further, when the uneven structure 11a is provided in the thermoplastic resin to form the single-layer base material 11, for example, a method of thermally transferring the uneven structure to the thermoplastic resin using a mold having an uneven structure obtained by inverting the desired uneven structure. Alternatively, for example, there is a method of obtaining a base material 11 provided with an uneven structure 11a having a desired pitch by performing a thermal transfer using a reversible mold having a large pitch with a thermoplastic resin that can be stretched and then performing a stretching process. Such stretching of the thermoplastic resin substrate is described in Japanese Patent Application No. 2006-2100 of the present applicant. All this content is included here. Further, when the uneven structure 11a is provided on a glass substrate or the like, a normal patterning method such as photolithography or etching may be used.

基材11の凸凹構造11aの格子状凸部のピッチは、可視光領域の広帯域にわたる偏光特性を考慮すると、150nm以下が好ましく、より好ましくは120nm以下であり、さらに好ましくは80nm以下である。ピッチが小さくなるほど偏光特性は向上する。一方、加工の容易さの面では10nm以上であることが好ましい。偏光特性を重視した場合2μm以下が好ましく、より好ましくは1μm以下であり、さらに好ましくは250nm以下である。また、テラヘルツ領域の偏光特性を重視した場合10μm以下が好ましい。上記したようなピッチの大きさは製造条件を調整することにより制御することができる。   In consideration of polarization characteristics over a wide band in the visible light region, the pitch of the grid-like convex portions of the convex / concave structure 11a of the substrate 11 is preferably 150 nm or less, more preferably 120 nm or less, and further preferably 80 nm or less. The polarization characteristics improve as the pitch decreases. On the other hand, in terms of ease of processing, the thickness is preferably 10 nm or more. When importance is attached to the polarization characteristics, it is preferably 2 μm or less, more preferably 1 μm or less, and further preferably 250 nm or less. Further, when importance is attached to polarization characteristics in the terahertz region, it is preferably 10 μm or less. The pitch size as described above can be controlled by adjusting the manufacturing conditions.

上記したように、凸凹構造11aの格子状凸部の高さは0.01μm〜10μmであることが好ましく、強度面からは格子状凸部間のピッチに対して0.5〜1.5倍の高さ、特に0.8〜1.5倍の高さであることがより好ましい。凸凹構造11aの上に金属ワイヤ12を設けた場合には、(格子状凸部+金属ワイヤ12)の高さが格子状凸部間のピッチに対して0.5〜1.5倍の高さ、特に0.8〜1.5倍の高さであることが強度、偏光性能の面からより好ましい。   As described above, the height of the lattice-shaped convex portions of the uneven structure 11a is preferably 0.01 μm to 10 μm, and 0.5 to 1.5 times the pitch between the lattice-shaped convex portions in terms of strength. More preferably, the height is 0.8 to 1.5 times higher. When the metal wire 12 is provided on the concavo-convex structure 11a, the height of (grid-like convex part + metal wire 12) is 0.5 to 1.5 times the pitch between the lattice-like convex parts. In particular, a height of 0.8 to 1.5 times is more preferable in terms of strength and polarization performance.

また、凸凹構造11a上に誘電体層を設けてもよい。特に、基材11として樹脂基材を用いる場合、誘電体層を設けることが好ましい。誘電体層が凸凹構造11aの格子状凸部の側面を覆うことにより、格子状凸部と誘電体層との間の接触面積が増加する。これにより、格子状凸部と誘電体層との間の密着性を向上させることができる。そして、このように格子状凸部と誘電体層との間の密着性が向上することにより、金属ワイヤ12を強固に格子状凸部上に立設することができるので、金属ワイヤ12を厚く設けてワイヤ全体(格子状凸部+金属ワイヤ12)の高さを高くしても、ワイヤの外力に対する強度を高く保つことが可能となる。   A dielectric layer may be provided on the uneven structure 11a. In particular, when a resin base material is used as the base material 11, it is preferable to provide a dielectric layer. When the dielectric layer covers the side surfaces of the lattice-shaped protrusions of the uneven structure 11a, the contact area between the lattice-shaped protrusions and the dielectric layer increases. Thereby, the adhesiveness between a grid | lattice-like convex part and a dielectric material layer can be improved. Since the adhesion between the lattice-shaped convex portion and the dielectric layer is improved as described above, the metal wire 12 can be firmly erected on the lattice-shaped convex portion, so that the metal wire 12 is thickened. Even if the height of the entire wire (lattice-shaped convex portion + metal wire 12) is increased by providing it, the strength against the external force of the wire can be kept high.

金属ワイヤ12を構成する金属としては、光の反射率が高い素材が好ましく、アルミニウム、銀などを挙げることができる。金属ワイヤ12の幅は、偏光度、透過率などを考慮すると、格子状凸部間のピッチの35%〜60%であることが好ましい。ワイヤの高さと幅の比(アスペクト比)としては2〜5が好ましく、特に2〜3.5が好ましい。ワイヤの高さは可視光領域の偏光特性を考慮した場合には、120nm〜220nmがさらに好ましく、140nm〜200nmであることが最も好ましい。なお、金属ワイヤ12を形成する方法としては、金属ワイヤ12を構成する材料と基材を構成する材料とを考慮して適宜選択する。例えば、真空蒸着法などを用いることができる。   The metal constituting the metal wire 12 is preferably a material having a high light reflectivity, and examples thereof include aluminum and silver. The width of the metal wire 12 is preferably 35% to 60% of the pitch between the lattice-shaped convex portions in consideration of the degree of polarization, transmittance, and the like. The ratio between the height and width (aspect ratio) of the wire is preferably 2 to 5, and particularly preferably 2 to 3.5. The height of the wire is more preferably 120 nm to 220 nm, and most preferably 140 nm to 200 nm in consideration of the polarization characteristics in the visible light region. The method for forming the metal wire 12 is appropriately selected in consideration of the material constituting the metal wire 12 and the material constituting the substrate. For example, a vacuum deposition method or the like can be used.

格子状凸部や、複数の格子状凸部によって形成される微細凸凹格子の凹部の断面形状に制限はない。これらの断面形状は、例えば台形、矩形、方形、プリズム状や、半円状などの正弦波状であってもよい。ここで、正弦波状とは凹部と凸部の繰り返しからなる曲線部をもつことを意味する。なお、曲線部は湾曲した曲線であればよく、例えば、凸部にくびれがある形状も正弦波状に含める。   There is no limitation on the cross-sectional shape of the concave portions of the fine convex-concave lattice formed by the lattice-shaped convex portions or the plurality of lattice-shaped convex portions. These cross-sectional shapes may be sinusoidal, such as trapezoidal, rectangular, square, prismatic, and semicircular. Here, the sinusoidal shape means that it has a curved portion formed by repetition of a concave portion and a convex portion. In addition, the curved part should just be a curved curve, for example, the shape which has a constriction in a convex part is also included in a sine wave form.

成形体1の凸凹構造11a上に配設された保護フィルム2の粘着層22は、格子状凸部の(凸凹構造11aの上に金属ワイヤ12を設けた場合には、金属ワイヤ12の(以後このケースに沿って説明する。))頂部の形状に追従して接触し、成形体1と保護フィルム基材21とを結合するために必要な結合力を有すると共に、一方、保護フィルム2を成形体1から外す際には、金属ワイヤ12を基材11から剥離させたり、凸凹構造11aや成形体1そのものを保護フィルム2を設ける前と比較して変形させたり、粘着層22に由来する成分をワイヤ上に残留させることのない易剥離性を持つ。   The adhesive layer 22 of the protective film 2 disposed on the uneven structure 11a of the molded body 1 is a lattice-shaped protrusion (if the metal wire 12 is provided on the uneven structure 11a, This will be described along this case.)) Following the shape of the top portion, it comes into contact and has the necessary binding force to bond the molded body 1 and the protective film substrate 21, while the protective film 2 is molded. When removing from the body 1, the metal wire 12 is peeled off from the base material 11, the uneven structure 11 a or the molded body 1 itself is deformed as compared to before the protective film 2 is provided, or the component derived from the adhesive layer 22 Has easy releasability without remaining on the wire.

このような粘着層22を構成する被覆材は、溶剤抽出することによって抽出される成分の量が、保護フィルム2(前記被覆材)1cm当たり0.3mg以下であることが好ましい。このような材料を用いれば、保護フィルム2を成形体1に貼付しても、粘着層22に含まれる比較的低分子量の粘着成分が成形体1の表面に移行し、金属ワイヤ12のワイヤ間および格子状凸部間に浸入し残留汚染したり、成形体1に浸透して凸凹構造11aを変形させたり、保護フィルム2と成形体1との層間を強固に接着したりすることがなく、保護フィルム2を成形体1から容易に剥離でき、保護フィルム2から剥離した成形体1はワイヤグリッド偏光板として、保護フィルム2を設ける前と同等の良好な光学特性を発揮せしめることができる。 It is preferable that the coating material which comprises such an adhesion layer 22 is 0.3 mg or less per 1 cm < 2 > of the protective film 2 (the said coating | covering material) the quantity of the component extracted by solvent extraction. If such a material is used, even if the protective film 2 is applied to the molded body 1, the relatively low molecular weight adhesive component contained in the adhesive layer 22 moves to the surface of the molded body 1, and the wire between the metal wires 12 Intrusion between the lattice-shaped convex portions and residual contamination, permeating into the molded body 1 to deform the uneven structure 11a, and firmly bonding the interlayer between the protective film 2 and the molded body 1, The protective film 2 can be easily peeled off from the molded body 1, and the molded body 1 peeled off from the protective film 2 can exhibit good optical characteristics equivalent to those before providing the protective film 2 as a wire grid polarizing plate.

本発明の積層体の保存安定性を一層向上させるには溶剤抽出することによって抽出される成分の量が、より少ないことが好ましく、被覆材1cm当たり0.2mg以下であることがより好ましい。さらに好ましくは被覆材1cm当たり0.1mg以下であり、特に好ましくは被覆材1cm当たり0.05mg以下であり、最も好ましくは被覆材1cm当たり0.01mg以下であり、特に最も好ましくは被覆材1cm当たり0.005mg以下である。このように溶剤抽出することによって抽出される成分の量が少ない保護フィルムを製造する方法としては、比較的低分子量の粘着成分の配合を制限する方法や、過剰な粘着成分を予め抽出等の手段で除去し低減する方法や、粘着層22の厚みを薄く制限する方法等が挙げられる。 In order to further improve the storage stability of the laminate of the present invention, the amount of components extracted by solvent extraction is preferably smaller, more preferably 0.2 mg or less per 1 cm 2 of the coating material. More preferably, it is 0.1 mg or less per cm 2 of the coating material, particularly preferably 0.05 mg or less per cm 2 of the coating material, most preferably 0.01 mg or less per cm 2 of the coating material, and most preferably coating. It is 0.005 mg or less per 1 cm 2 of the material. As a method for producing a protective film with a small amount of components extracted by solvent extraction in this way, a method of limiting the blending of a relatively low molecular weight adhesive component, a means such as extracting an excessive adhesive component in advance, etc. And a method of reducing the thickness of the pressure-sensitive adhesive layer 22 and a method of limiting the thickness of the adhesive layer 22 thinly.

ここで、溶剤抽出に使用する溶剤としては、抽出されうる成分の特性に応じて、トルエン、クロロホルム、アルコール類、ケトン類、エーテル類等の有機溶剤や、温水などから適宜選択できるが、広範な成分を溶解出来る面及び、安全性の面から、トルエン、アルコール類、温水などが好ましく用いられる。また、溶剤抽出の方法としては、従来用いられる方法を採用することができる。   Here, the solvent used for solvent extraction can be appropriately selected from organic solvents such as toluene, chloroform, alcohols, ketones, ethers, and hot water depending on the characteristics of components that can be extracted. Toluene, alcohols, hot water and the like are preferably used from the viewpoint of dissolving the components and safety. Moreover, as a method for solvent extraction, a conventionally used method can be employed.

また、粘着層22を構成する被覆材については、成形体1から保護フィルム2を剥離した際に、粘着層22を構成する被覆材から成形体1に移行する成分の量が保護フィルム2(前記被覆材)の1cm当たり0.005mg以下であるものが好ましい。このように成形体1に実質的に移行する成分の量が少ない材料を粘着層22に用いることにより、移行した成分がワイヤ間に浸入したり、ワイヤを腐食させたり、保護フィルム2を剥離した後の成形体1の表面に、塵などの異物を粘着させたりすることがなく、保護フィルム2から剥離した成形体1はワイヤグリッド偏光板として、保護フィルム2を設ける前と同等の良好な光学特性を発揮せしめることができるので好ましい。 Moreover, about the coating | coated material which comprises the adhesion layer 22, when the protective film 2 is peeled from the molded object 1, the quantity of the component which transfers to the molded object 1 from the coating | coated material which comprises the adhesion layer 22 is protective film 2 (said said What is 0.005 mg or less per 1 cm 2 of the coating material is preferable. Thus, by using a material with a small amount of components that migrate to the molded body 1 for the adhesive layer 22, the migrated components enter between the wires, corrode the wires, or peel off the protective film 2. The molded body 1 peeled off from the protective film 2 without sticking foreign matter such as dust to the surface of the subsequent molded body 1 is used as a wire grid polarizer, and the same good optical as before the protective film 2 is provided. This is preferable because the characteristics can be exhibited.

本発明の効果を一層向上させるには粘着層22を構成する被覆材から成形体1に移行する成分の量がより少ないことが好ましく、被覆材1cm当たり0.001mg以下であるものがより好ましく、さらに好ましくは被覆材1cm当たり0.0005mg以下であり、特に好ましくは被覆材1cm当たり0.0002mg以下である。このように粘着層を構成する被覆材から成形体に移行する成分の量が少ない保護フィルムを製造する方法としては、比較的低分子量の粘着成分の配合を制限する方法や、過剰な粘着成分を予め抽出等の手段で除去し低減する方法や、粘着層22の厚みを薄く制限する方法や、粘着成分として保護フィルム2を剥離した後、成形体1の表面から速やかに揮発するものを選択する方法等が挙げられる。 In order to further improve the effect of the present invention, it is preferable that the amount of the component transferred from the covering material constituting the adhesive layer 22 to the molded body 1 is smaller, and more preferably 0.001 mg or less per 1 cm 2 of the covering material. , more preferably less dressing 1 cm 2 per 0.0005 mg, particularly preferably not more than dressing 1 cm 2 per 0.0002 mg. As a method for producing a protective film with a small amount of components transferred from the covering material constituting the adhesive layer to the molded body in this way, there is a method for limiting the blending of relatively low molecular weight adhesive components, and excessive adhesive components. A method of removing and reducing in advance by means such as extraction, a method of restricting the thickness of the adhesive layer 22 to be thin, and a method of quickly volatilizing from the surface of the molded body 1 after peeling off the protective film 2 as an adhesive component are selected. Methods and the like.

ここで、移行成分量は、保護フィルム2と密着させる前の成形体1(a)と、積層体1から保護フィルム2を剥離した後の成形体2(b)の、各々の抽出物量を比較する方法や、上記成形体1(a)及び成形体1(b)のワイヤグリッド表面をXPS分析する方法などによって求めることができる。   Here, the amount of the migration component is a comparison of the respective extract amounts of the molded body 1 (a) before being in close contact with the protective film 2 and the molded body 2 (b) after the protective film 2 is peeled off from the laminate 1. Or a method of XPS analysis of the wire grid surfaces of the molded body 1 (a) and the molded body 1 (b).

このような易剥離性の粘着層22の材料としては、低流動性ゴム系弾性材料が挙げられる。具体的には、ポリアクリル酸エステルを主成分とするアクリル系粘着剤、架橋したシリコーンゴム(ポリオルガノシロキサン)、天然ゴム、ポリイソブチレンなどが挙げられる。このような粘着層22を構成する被覆材は、低分子量成分(揮発成分)が少ないことが好ましい。このようなゴム系材料に、本発明の効果を損なわない質的、量的範囲内で、粘着性付与剤、オイル、ガラス転移温度シフト剤などの添加剤を付与しても良い。このような材料で構成された粘着層22は、金属ワイヤ12と主にファンデルワールス力で結合する。これにより、上述したように、金属ワイヤ12を有する基材11上に対して保護フィルム2を多数回にわたって貼付・剥離することが可能となる。   Examples of the material of the easily peelable pressure-sensitive adhesive layer 22 include a low-flow rubber-based elastic material. Specifically, an acrylic pressure-sensitive adhesive mainly composed of a polyacrylic acid ester, a crosslinked silicone rubber (polyorganosiloxane), natural rubber, polyisobutylene and the like can be mentioned. It is preferable that the coating material constituting such an adhesive layer 22 has a small amount of low molecular weight components (volatile components). Additives such as tackifiers, oils, and glass transition temperature shift agents may be added to such rubber materials within the qualitative and quantitative ranges that do not impair the effects of the present invention. The adhesive layer 22 composed of such a material is bonded to the metal wire 12 mainly by van der Waals force. Thereby, as above-mentioned, it becomes possible to affix and peel the protective film 2 on the base material 11 which has the metal wire 12 many times.

保護フィルム2の基材21は透明であり、微細な凸凹構造11aや金属ワイヤ12を保護するために十分な剛性を有する。このような保護フィルム基材21を構成する材料としては、PET、PE、PP、PMMA、COP、PC、PS、TACなどを挙げることができる。   The base material 21 of the protective film 2 is transparent and has sufficient rigidity to protect the fine uneven structure 11 a and the metal wire 12. Examples of the material constituting the protective film substrate 21 include PET, PE, PP, PMMA, COP, PC, PS, and TAC.

成形体1と保護フィルム2(前記被覆材)との剥離力は保護フィルム2を設けた際に保護フィルム2を成形体1上に確実に固定するために十分な力であると同時に、成形体1と保護フィルム2とを剥がす際には、金属ワイヤ12を基材11から剥離させたり、凸凹構造11aや成形体1そのものを保護フィルム2を設ける前と比較して変形させたり、粘着層22に由来する成分をワイヤ上に残留させることのない程度の力である。例えば、剥離速度1000mm/分での90度剥離法による剥離力が0.1gf/25mm〜200gf/25mmであることが好ましい。成形体1と保護フィルム2との接触面積が大きい大面積の成形体を保護する場合には、単位面積当たりの剥離力は小さい方が好ましく、他方小面積の成形体を保護する場合には、単位面積当たりの剥離力は大きい方が好ましい。より好ましい剥離力は0.5gf/25mm〜150gf/25mmの範囲であり、さらに好ましくは1.0gf/25mm〜100gf/25mmの範囲であり、特に好ましくは2.0gf/25mm〜50gf/25mmの範囲であり、最も好ましくは3.0gf/25mm〜30gf/25mmの範囲である。   The peeling force between the molded body 1 and the protective film 2 (the covering material) is sufficient to securely fix the protective film 2 on the molded body 1 when the protective film 2 is provided, and at the same time, the molded body. When peeling 1 and the protective film 2, the metal wire 12 is peeled from the base material 11, the uneven structure 11 a or the molded body 1 itself is deformed as compared with the state before the protective film 2 is provided, or the adhesive layer 22. It is a force of the grade which does not leave the component derived from to a wire. For example, it is preferable that the peeling force by the 90 degree peeling method at a peeling speed of 1000 mm / min is 0.1 gf / 25 mm to 200 gf / 25 mm. In the case of protecting a large-area molded body having a large contact area between the molded body 1 and the protective film 2, it is preferable that the peel force per unit area is small, while in the case of protecting a small-area molded body, A larger peel force per unit area is preferable. More preferable peeling force is in the range of 0.5 gf / 25 mm to 150 gf / 25 mm, more preferably in the range of 1.0 gf / 25 mm to 100 gf / 25 mm, and particularly preferably in the range of 2.0 gf / 25 mm to 50 gf / 25 mm. And most preferably in the range of 3.0 gf / 25 mm to 30 gf / 25 mm.

これにより、本発明の積層体においては、成形体1と保護フィルム2とを、ワイヤグリッド偏光板としての特性を低下させることなく多数回にわたって貼付・剥離することが可能となる。   Thereby, in the laminated body of this invention, it becomes possible to stick and peel the molded object 1 and the protective film 2 many times, without reducing the characteristic as a wire grid polarizing plate.

尚、本発明の成形体は保護フィルム2を剥離した後で溶剤抽出することによって抽出される残留モノマー、可塑剤、離型剤などといった成分の量が、成形体1の全体の重量の10重量%以下であることが好ましい。基材11を単層で構成する場合、残留モノマーの量は原料樹脂の純度に関わり、紫外線硬化型樹脂を用いて凸凹構造11aを設ける場合には、残留モノマーの量は原料樹脂の純度や反応率(生産性)に関わり、可塑剤の量は基材11を単層で延伸加工により製造する場合の加工性や、成形体1を製造した後での曲げ加工性の確保に関わり、離型剤の量は反転型によって凸凹構造11aを転写する際の高生産性の確保に、それぞれ関わる成分である。本発明の積層体においてはこれらの成分は成形体1からブリードアウトし、保護フィルム2から移行した成分とともに格子状凸部間やワイヤ間に浸入して光学特性を損なう問題がある。本発明の積層体においては、保護フィルムを剥離した後の成形体を溶剤抽出することによって抽出されるような成分の量を最小レベルに調整しつつ成形体の高生産性、延伸加工性、曲げ加工性などにも優れているように原料樹脂の組成面で対策することが好ましく、例えば原料樹脂の高純度化や高反応率化や、化学結合で固定されて抽出されることのない可塑成分や離型成分を導入する手段が好ましい。   In the molded product of the present invention, the amount of components such as residual monomer, plasticizer, mold release agent and the like extracted by solvent extraction after peeling off the protective film 2 is 10% of the total weight of the molded product 1. % Or less is preferable. When the substrate 11 is composed of a single layer, the amount of residual monomer is related to the purity of the raw resin, and when the uneven structure 11a is provided using an ultraviolet curable resin, the amount of residual monomer depends on the purity and reaction of the raw resin. In relation to the rate (productivity), the amount of the plasticizer is related to the workability when the base material 11 is produced by stretching with a single layer and the bending workability after the molded body 1 is produced. The amount of the agent is a component related to ensuring high productivity when transferring the uneven structure 11a by the inversion type. In the laminate of the present invention, these components bleed out from the molded body 1 and have a problem of impairing optical properties by entering between the lattice-like convex portions and between the wires together with the components transferred from the protective film 2. In the laminate of the present invention, high productivity, stretch workability, bending of the molded product while adjusting the amount of components extracted by solvent extraction of the molded product after peeling off the protective film. It is preferable to take measures in terms of the composition of the raw material resin so that it is excellent in processability, for example, high purity and high reaction rate of the raw material resin, plastic components that are fixed by chemical bonds and not extracted And means for introducing a mold release component are preferred.

このような材料を用いることにより、保護フィルムを剥離した後の成形体を溶剤抽出することによって抽出されるような成分の量が最小レベルであるために、これらの成分が格子状凸部間やワイヤ間に浸入して光学特性を損なうことを防止できるとともに、成形体の高生産性、延伸加工性、曲げ加工性などにも優れた成形体を製造できる。ここで、溶剤抽出に使用する溶剤としては、抽出されうる成分の特性に応じて、トルエン、クロロホルム、アルコール類、ケトン類、エーテル類等の有機溶剤や、温水などから適宜選択できるが、広範な成分を溶解出来る面及び、安全性の面から、トルエン、アルコール類、温水などが好ましく用いられる。また、溶剤抽出の方法としては、従来用いられる方法を採用することができる。   By using such a material, the amount of components that can be extracted by solvent extraction of the molded product after peeling off the protective film is at a minimum level. It is possible to prevent the intrusion between the wires and impair the optical characteristics, and it is possible to produce a molded body excellent in high productivity, stretch workability, bending workability and the like of the molded body. Here, the solvent used for solvent extraction can be appropriately selected from organic solvents such as toluene, chloroform, alcohols, ketones, ethers, and hot water depending on the characteristics of components that can be extracted. Toluene, alcohols, hot water and the like are preferably used from the viewpoint of dissolving the components and safety. Moreover, as a method for solvent extraction, a conventionally used method can be employed.

上記構成の積層体によれば、微細で高精度な凸凹構造を保護することができる。また、この積層体を構成する保護フィルム及び成形体は、比較的低分子量の粘着成分の量や、残留モノマー、可塑剤、離型剤などの含有量が最小であるので、ブリードアウトによる光学特性の低下を防止することができる。また、この積層体は、高生産性であり、曲げ加工性にも優れるものである。   According to the laminated body of the said structure, a fine and highly accurate uneven structure can be protected. In addition, the protective film and the molded body constituting this laminate have a minimum amount of adhesive component having a relatively low molecular weight and a minimum content of residual monomer, plasticizer, mold release agent, etc. Can be prevented. In addition, this laminate has high productivity and excellent bending workability.

次に、本発明の効果を明確にするために行った実施例について説明する。
(実施例1)
(格子状凸部の形成)
まず、本出願人の特開2006−224659号公報に記載された方法を用いて、ピッチが230nmで、微細凹凸格子の高さが350nmである微細凹凸格子から、表面の微細凹凸格子のピッチと高さが140nm/162nmで、厚さ0.3mm、縦300mm、横180mmのニッケルスタンパ(スタンパ1)を作製した。
Next, examples performed for clarifying the effects of the present invention will be described.
(Example 1)
(Formation of grid-shaped convex part)
First, using the method described in Japanese Patent Application Laid-Open No. 2006-224659 of the present applicant, the pitch of the fine concavo-convex lattice on the surface is changed from the fine concavo-convex lattice having a pitch of 230 nm and the fine concavo-convex lattice height of 350 nm. A nickel stamper (stamper 1) having a height of 140 nm / 162 nm, a thickness of 0.3 mm, a length of 300 mm, and a width of 180 mm was produced.

・紫外線硬化樹脂を用いた格子状凸部転写フィルムの作製
トリメチロールプロパントリアクリレート(TMPTA)を20重量%、ヘキサメチレンジアクリレート(HDDA)を47重量%、ラウリルアクリレートを30重量%、ダロキュア1173(チバ・スペシャリティ・ケミカルズ製)を3重量%配合し、異物をろ過して光硬化性樹脂組成物(組成物1)を作成した。
Production of lattice convex transfer film using ultraviolet curable resin 20% by weight of trimethylolpropane triacrylate (TMPTA), 47% by weight of hexamethylene diacrylate (HDDA), 30% by weight of lauryl acrylate, Darocur 1173 ( 3% by weight of Ciba Specialty Chemicals Co., Ltd. was blended, and foreign matter was filtered to prepare a photocurable resin composition (Composition 1).

組成物1を厚さ100μmのPETフィルムに10μmの厚みで塗布し、表面にスタンパ1を押し付けて、PETフィルム側から1J/cmの光量で紫外光照射して硬化させて格子状凸部転写フィルムを作製した。 The composition 1 is applied to a PET film having a thickness of 100 μm to a thickness of 10 μm, the stamper 1 is pressed on the surface, and the UV light is irradiated from the PET film side with an amount of light of 1 J / cm 2 to be cured and transferred to a lattice-like convex portion. A film was prepared.

(ワイヤグリッド偏光板の作製)
・真空蒸着法を用いた金属の蒸着
得られた紫外線硬化樹脂格子状凸部転写フィルムに、電子ビーム真空蒸着法(EB蒸着法)を用いて金属を被着した。本実施例では、金属としてアルミニウム(Al)を用い、真空度2.5×10-3Pa、蒸着速度4nm/s、常温下においてアルミニウムを蒸着した。
(Production of wire grid polarizer)
-Deposition of metal using vacuum deposition method The metal was deposited on the obtained ultraviolet curable resin lattice-shaped convex transfer film using an electron beam vacuum deposition method (EB deposition method). In this example, aluminum (Al) was used as a metal, and aluminum was vapor-deposited at a vacuum degree of 2.5 × 10 −3 Pa, a vapor deposition rate of 4 nm / s, and at room temperature.

・エッチングによる不要金属の除去
格子状凸部転写フィルムにAlを被着した後、フィルムを室温下の0.1重量%水酸化ナトリウム水溶液中で55秒及び80秒の2条件で洗浄し、すぐに水洗してエッチングを停止させた。その後、フィルムを乾燥して、金属ワイヤ層を有する格子状凸部転写フィルムを作製した。この格子状凸部転写フィルムの大きさは、縦300mm、横180mmであった。格子状凸部転写フィルムの断面を、電界放出型走査型電子顕微鏡にて観察したところ、格子状凸部のピッチ、形成したアルミニウムの高さ、及び幅はそれぞれ、140nm/162nm/63nm、140nm/130nm/55nmであった。このようにして実施例のワイヤグリッド偏光板(成形体1(a))を作製した。
・ Elimination of unnecessary metal by etching After depositing Al on the lattice-shaped convex transfer film, the film was washed in 0.1 wt% sodium hydroxide aqueous solution at room temperature under two conditions of 55 seconds and 80 seconds, and immediately The etching was stopped by washing with water. Thereafter, the film was dried to produce a lattice-shaped convex transfer film having a metal wire layer. The size of the lattice-shaped convex transfer film was 300 mm long and 180 mm wide. When the cross section of the lattice-shaped convex portion transfer film was observed with a field emission scanning electron microscope, the pitch of the lattice-shaped convex portions, the height of the formed aluminum, and the width were 140 nm / 162 nm / 63 nm, 140 nm / It was 130 nm / 55 nm. Thus, the wire grid polarizing plate (molded body 1 (a)) of the example was produced.

(保護フィルムの作製)
厚さ50μmのPET製基材に、厚さ25μmのシリコーンゴム製の粘着剤層を設けたフィルムを作製し、さらにこれをヘキサン中に1時間浸漬した後、80℃の熱風乾燥機中で3時間乾燥して保護フィルムを作製した(保護フィルム1)。
(Preparation of protective film)
A film in which a pressure-sensitive adhesive layer made of silicone rubber having a thickness of 25 μm was formed on a PET substrate having a thickness of 50 μm was further immersed in hexane for 1 hour, and then 3 hours in a hot air dryer at 80 ° C. A protective film was produced by drying for a while (protective film 1).

保護フィルム1の粘着層が成形体1(a)のアルミニウムワイヤ層と対向するようにして密着させた。その後、20℃、55%RHの環境で24時間保持した。このようにして積層体を作製した(積層体1)。   The adhesive layer of the protective film 1 was brought into close contact with the aluminum wire layer of the molded body 1 (a). Thereafter, it was kept for 24 hours in an environment of 20 ° C. and 55% RH. In this way, a laminate was produced (laminate 1).

(保護フィルムからの抽出成分量の測定)
保護フィルム1を620cm採取し、短冊状に裁断したものをトルエン50mlに12時間浸漬した抽出液を真空乾燥して抽出成分量を評価した結果、抽出成分量は、保護フィルム1について1cm当たり0.11mgであった。
(Measurement of amount of extracted components from protective film)
620 cm 2 of the protective film 1 was collected, and the extract obtained by immersing the strip cut into a strip shape in 50 ml of toluene for 12 hours was vacuum-dried, and the amount of the extracted component was evaluated. As a result, the amount of the extracted component was 1 cm 2 for the protective film 1 It was 0.11 mg.

(保護フィルム剥離の際の移行成分量の測定)
積層体1から保護フィルム1を剥離した後の成形体1(b)について、(1)成形体1(b)を700cm採取し、短冊状に裁断したものをクロロホルム50mlに浸漬し、1時間超音波照射した抽出液を濃縮して抽出成分を回収した、また成形体1(a)についても同様にして抽出成分を回収し、GPC分析によって保護フィルム1からの移行成分と判定された成分の量を測定した。その結果、移行成分量は、保護フィルム1について1cm当たり0.0002mgであった。また、(2)成形体1(b)のワイヤグリッド面のXPS分析によりシロキサン系粘着成分が14atomic%検出され、物質量としては保護フィルム1について1cm当たり凡そ0.00015mgと判定した。
(Measurement of amount of migration component when protective film is peeled off)
About molded body 1 (b) after peeling protective film 1 from laminate 1, (1) 700 cm 2 of molded body 1 (b) was sampled and cut into strips and immersed in 50 ml of chloroform for 1 hour. Extracted components were collected by concentrating the extracted solution that was irradiated with ultrasonic waves. Also, the extracted components were collected in the same manner for the molded body 1 (a), and the components determined to be components transferred from the protective film 1 by GPC analysis. The amount was measured. As a result, the migration component amount was 0.0002 mg per cm 2 for the protective film 1. Further, (2) 14 atomic% of the siloxane-based adhesive component was detected by XPS analysis of the wire grid surface of the molded body 1 (b), and the amount of the substance was determined to be about 0.00015 mg per 1 cm 2 for the protective film 1.

(成形体からの抽出成分量の測定)
積層体1から保護フィルム1を剥離した後の成形体1(b)を700cm採取し、短冊状に裁断したものをクロロホルム50mlに浸漬し、1時間超音波照射した抽出液を真空乾燥して抽出成分量を評価した結果、抽出成分量は、成形体1の全体の重量の0.08w%であり、紫外線硬化樹脂部分の重量に対する値と考えても0.90w%であった。
(Measurement of the amount of extracted components from the molded body)
700 cm 2 of the molded body 1 (b) after the protective film 1 was peeled from the laminate 1 was collected, and the cut piece was soaked in 50 ml of chloroform, and the extract subjected to ultrasonic irradiation for 1 hour was vacuum-dried. As a result of evaluating the amount of the extracted component, the amount of the extracted component was 0.08 w% of the total weight of the molded body 1 and was 0.90 w% even when considered as a value relative to the weight of the ultraviolet curable resin portion.

(90度剥離法による剥離力測定)
積層体1について、幅25mm、長さ100mmに裁断したものを、JIS Z1528に準拠した、粘着テープ90度剥離試験治具を用いて、引っ張り試験機にて剥離速度1000mm/分での剥離力を測定した結果、剥離力は、16gf/25mmであった。
(Measurement of peel force by 90 degree peel method)
About the laminated body 1, what was cut | judged to width 25mm and length 100mm uses the adhesive tape 90 degree peeling test jig based on JISZ1528, and the peeling force in the peeling rate of 1000 mm / min with a tensile tester. As a result of the measurement, the peel force was 16 gf / 25 mm.

(分光光度計による偏光性能評価)
保護フィルム1と密着させる前の成形体1(a)と、60℃の熱風乾燥機中で8時間加熱した積層体1から保護フィルム1を剥離した後の成形体1(b)について分光光度計を用い、直線偏光に対する平行ニコル時及び直交ニコル時の透過光強度を測定した。測定波長域は可視光として400nm〜780nmとし、偏光度を下記式より算出した。その結果について図2に示す。
偏光度=[(Imax−Imin)/(Imax+Imin)]×100(%)
ここで、Imaxは平行ニコル時の透過光強度であり、Iminは直交ニコル時の透過光強度である。
(Evaluation of polarization performance by spectrophotometer)
A spectrophotometer for the molded body 1 (a) before being in close contact with the protective film 1 and the molded body 1 (b) after peeling off the protective film 1 from the laminate 1 heated in a hot air dryer at 60 ° C. for 8 hours. Was used to measure the transmitted light intensity at the time of parallel Nicols and crossed Nicols with respect to linearly polarized light. The measurement wavelength range was 400 nm to 780 nm as visible light, and the degree of polarization was calculated from the following formula. The results are shown in FIG.
Polarization degree = [(Imax−Imin) / (Imax + Imin)] × 100 (%)
Here, Imax is the transmitted light intensity at the time of parallel Nicols, and Imin is the transmitted light intensity at the time of crossed Nicols.

本発明に係る積層体及びワイヤグリッド偏光板(成形体)は、保護フィルムを密着させた前後で、可視光領域のほぼ全領域にわたって同程度の優れた偏光度及び透過率を示した。またこの積層体をカッターナイフで切断した後で保護フィルムを剥離して、ワイヤグリッド偏光板の切断部とその周辺を目視外観評価したところ、いずれの箇所にも粘着層の付着などの異常は何ら認められなかった。   The laminate and the wire grid polarizing plate (molded body) according to the present invention exhibited the same degree of excellent polarization degree and transmittance over almost the entire visible light region before and after the protective film was adhered. Moreover, after cutting this laminated body with a cutter knife, the protective film was peeled off, and the appearance of the cut portion of the wire grid polarizing plate and its periphery was visually evaluated, and there was no abnormality such as adhesion of the adhesive layer at any location. I was not able to admit.

このように、本発明の積層体は保護フィルムによってワイヤグリッド偏光板の表面を周辺環境からの汚染や、取扱い時の擦れや切断加工などの外力から保護できる。また保護フィルムからの悪影響たとえば粘着剤によるワイヤグリッド偏光板性能の低下や、保護フィルムを剥離する際のワイヤグリッド表面の損傷や移行物質による汚染もほとんどないことがわかる。   Thus, the laminate of the present invention can protect the surface of the wire grid polarizer from external forces such as contamination from the surrounding environment, rubbing during handling, and cutting by the protective film. Moreover, it turns out that there is almost no bad influence from a protective film, for example, the fall of the wire grid polarizing plate performance by an adhesive, the damage of the wire grid surface at the time of peeling a protective film, and the contamination by a transfer material.

(実施例2、3)
保護フィルムとして、厚さ50μmのPET製基材に、厚さ20μmのアクリル系粘着剤層を設けたフィルムを調整し、さらにこれをヘキサン中に1時間浸漬した後、80℃の熱風乾燥機中で3時間乾燥して保護フィルムを作製した(保護フィルム2)。
(Examples 2 and 3)
As a protective film, a 50 μm-thick PET base material prepared with a 20 μm-thick acrylic pressure-sensitive adhesive layer was prepared, and further immersed in hexane for 1 hour, and then in a hot air dryer at 80 ° C. And dried for 3 hours to prepare a protective film (protective film 2).

厚さ50μmのPET製基材に、厚さ5μmのアクリル系粘着剤層を設けたフィルムを調整し、さらにこれをヘキサン中に1時間浸漬した後、80℃の熱風乾燥機中で3時間乾燥して保護フィルムを作製した(保護フィルム3)。   A 50 μm thick PET substrate was prepared with a 5 μm thick acrylic pressure-sensitive adhesive layer, which was further immersed in hexane for 1 hour, and then dried in a hot air dryer at 80 ° C. for 3 hours. Thus, a protective film was produced (protective film 3).

さらに保護フィルム2〜3を使用した以外、積層体1を作製したのと同じ操作によって積層体を作製した(積層体2〜3)。   Furthermore, the laminated body was produced by the same operation as produced the laminated body 1 except having used the protective films 2-3 (laminated bodies 2-3).

これら積層体2〜3についても、実施例1と同様に抽出成分、移行成分、剥離力、偏光性能、目視外観について評価した。結果を表1にまとめて示した。積層体2〜3についても保護フィルムからの悪影響はほとんどなく、ワイヤグリッド偏光板の性能を周辺環境や外力から保護できることがわかる。   These laminates 2 to 3 were also evaluated in the same manner as in Example 1 for the extraction component, the migration component, the peeling force, the polarization performance, and the visual appearance. The results are summarized in Table 1. It turns out that there is almost no bad influence from a protective film also about the laminated bodies 2-3, and it can protect the performance of a wire grid polarizing plate from surrounding environment or external force.

(比較例1)
保護フィルムとして、厚さ38μmのPETフィルムに、厚さ25μmのアクリル系粘着剤層を設けたフィルムを作成した(保護フィルム4)。
(Comparative Example 1)
As a protective film, a film in which an acrylic adhesive layer having a thickness of 25 μm was provided on a PET film having a thickness of 38 μm was prepared (protective film 4).

さらに保護フィルム4を使用した以外、実施例1と同様に積層体を作製した(積層体4)。
これら積層体4についても、実施例1と同様に抽出成分、移行成分、剥離力、偏光性能、目視外観について評価した。結果を表1にまとめて示した。
Furthermore, the laminated body was produced similarly to Example 1 except having used the protective film 4 (laminated body 4).
These laminates 4 were also evaluated for extraction components, migration components, peeling force, polarization performance, and visual appearance in the same manner as in Example 1. The results are summarized in Table 1.

保護フィルム4と密着させる前の成形体1(c)と、60℃の熱風乾燥機中で8時間加熱した積層体4から保護フィルム4を剥離した後の成形体1(d)について偏光性能を評価した結果を図3に示す。成形体1(d)は、可視光領域の短波長側において、偏光度の低下率が顕著であった。これは、保護フィルム4の粘着剤成分がワイヤグリッド表面に移行し、アルミニウムワイヤ間に入り込んでしまったことが原因と考えられる。また、積層体4をカッターナイフで切断した後で保護フィルム4を剥離してワイヤグリッド偏光板の切断部とその周辺を、目視外観評価したところ肉眼で判別出来る程度の粘着層断片の付着が認められた。一方、保護フィルム4は、格子状凸部を有さない単にアルミニウムを被着しただけのPET平面と密着させて切断加工などの外力を加えても、肉眼で判別出来る程度の粘着層断片の付着は認められなかった。この保護フィルム4の挙動の相違は、粘着層の流動性が高いために格子状凸部に浸入しやすく、成形体1(d)に対してはより強力に接着したためと考えられる。   Polarization performance of the molded body 1 (c) before being in close contact with the protective film 4 and the molded body 1 (d) after peeling off the protective film 4 from the laminate 4 heated in a hot air dryer at 60 ° C. for 8 hours. The evaluation results are shown in FIG. In the molded product 1 (d), the rate of decrease in the degree of polarization was remarkable on the short wavelength side in the visible light region. This is considered to be because the adhesive component of the protective film 4 has moved to the surface of the wire grid and has entered between the aluminum wires. Further, after the laminate 4 was cut with a cutter knife, the protective film 4 was peeled off, and the cut portion of the wire grid polarizing plate and its periphery were visually evaluated for appearance. It was. On the other hand, the protective film 4 adheres to the PET plane that does not have a grid-like convex portion and is simply attached with aluminum, and can adhere to an adhesive layer fragment that can be discerned with the naked eye even when an external force such as cutting is applied. Was not recognized. This difference in the behavior of the protective film 4 is considered to be because the adhesive layer has high fluidity, so that it can easily enter the grid-like convex portions, and is more strongly adhered to the molded body 1 (d).

本発明は上記実施の形態に限定されず、種々変更して実施することが可能である。例えば、上記実施の形態における寸法、材質などは例示的なものであり、適宜変更して実施することが可能である。また、上記実施の形態における偏光板については、板状の部材である必要はなく、必要に応じてシート状、フィルム状であっても良い。その他、本発明の範囲を逸脱しない限りにおいて適宜変更して実施することが可能である。

Figure 2009258168
The present invention is not limited to the embodiment described above, and can be implemented with various modifications. For example, the dimensions, materials, and the like in the above-described embodiment are illustrative, and can be changed as appropriate. Moreover, the polarizing plate in the said embodiment does not need to be a plate-shaped member, and may be a sheet form and a film form as needed. In addition, various modifications can be made without departing from the scope of the present invention.
Figure 2009258168

本発明の実施の形態に係る積層体を示す図である。It is a figure which shows the laminated body which concerns on embodiment of this invention. 実施例1の成形体1(a)と成形体1(b)の光学特性を示す図である。It is a figure which shows the optical characteristic of the molded object 1 (a) of Example 1, and the molded object 1 (b). 比較例1の成形体1(c)と成形体1(d)の光学特性を示す図である。It is a figure which shows the optical characteristic of the molded object 1 (c) of comparative example 1, and the molded object 1 (d).

符号の説明Explanation of symbols

1 ワイヤグリッド偏光板(成形体)
2 保護フィルム(被覆材)
11 基材
11a 凸凹構造
12 金属ワイヤ
21 保護フィルム基材
22 粘着層
1 Wire grid polarizer (molded body)
2 Protective film (coating material)
DESCRIPTION OF SYMBOLS 11 Base material 11a Uneven structure 12 Metal wire 21 Protective film base material 22 Adhesive layer

Claims (6)

高さが0.01μm〜10μmであり、少なくとも1方向のピッチが0.01μm〜10μmである微細な凸凹構造を表面に有する成形体と、前記成形体の前記凸凹構造上に配設され、易剥離性の粘着層を有する被覆材と、を具備する積層体であって、前記粘着層を構成する被覆材を溶剤抽出することによって抽出される成分の量が、前記被覆材1cm当たり0.3mg以下であることを特徴とする積層体。 A molded body having a fine uneven structure with a height of 0.01 μm to 10 μm and a pitch of at least one direction of 0.01 μm to 10 μm on the surface, and disposed on the uneven structure of the molded body And a covering material having a peelable adhesive layer, wherein the amount of components extracted by solvent extraction of the covering material constituting the adhesive layer is 0.000 per 1 cm 2 of the covering material. A laminate having a content of 3 mg or less. 前記成形体は、複数の格子状凸部が並設して構成された凸凹構造の前記格子状凸部上に金属ワイヤが形成されてなることを特徴とする請求項1記載の積層体。   The laminate according to claim 1, wherein the molded body is formed by forming metal wires on the grid-shaped convex portions having a concave-convex structure configured by arranging a plurality of grid-shaped convex portions in parallel. 前記被覆材を剥離した際に、前記粘着層を構成する被覆材から前記成形体への移行成分量が前記被覆材1cm当たり0.005mg以下であることを特徴とする請求項1又は請求項2記載の積層体。 The amount of components transferred from the coating material constituting the adhesive layer to the molded body when the coating material is peeled is 0.005 mg or less per 1 cm 2 of the coating material. 2. The laminate according to 2. 剥離速度1000mm/分での90度剥離法による前記成形体と前記被覆材との間の剥離力が0.1gf/25mm〜200gf/25mmであることを特徴とする請求項1から請求項3のいずれかに記載の積層体。   The peeling force between the said molded object and the said coating | covering material by the 90 degree | times peeling method with a peeling speed of 1000 mm / min is 0.1gf / 25mm-200gf / 25mm, The Claim 1- Claim 3 characterized by the above-mentioned. The laminated body in any one. 請求項1から請求項4のいずれかに記載の積層体から前記被覆材を剥離してなることを特徴とする成形体。   A molded body obtained by peeling off the covering material from the laminate according to any one of claims 1 to 4. 前記成形体を溶剤抽出することによって抽出される成分の量が、前記成形体の全体の重量の10重量%以下であることを特徴とする請求項5記載の成形体。   6. The molded body according to claim 5, wherein the amount of components extracted by solvent extraction of the molded body is 10% by weight or less of the total weight of the molded body.
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