JP2009246133A - Method for manufacturing of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the method for manufacturing of forming a cylindrical film having a fixed film thickness with high manufacturing efficiency when an electronic component having the cylindrical film in a base is manufactured. <P>SOLUTION: The base 11 is prepared which includes a through-hole 12 penetrating the base from one surface side to the other surface side. Conductive paste 24 is injected into the through-hole 12 from the one surface side of the base 11, and the conductive paste 24 injected into the through-hole is sucked from the other surface side of the base 11 to stick the conductive paste 24 on the entire inner wall surface of the through-hole 12, thus forming the cylindrical conductive film 241. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component having a cylindrical conductor film inside a dielectric substrate and a method of manufacturing an electronic component having a cylindrical insulating film inside a conductive substrate. Specific examples of such an electronic component include a resonator, a filter, a capacitor, or a composite electronic component combining them.

  Conventionally, in this type of electronic component, a technique for connecting internal electrodes to each other, internal electrodes, and external electrodes using columnar solid through-hole conductors is known. In the case of such a solid through-hole conductor, since the conductor diameter is determined by the through-hole, it is not necessary to control the conductor diameter. On the other hand, when forming a cylindrical conductive film, it is necessary to form a conductive film on the inner wall surface of the through-hole, which is difficult to control from the outside. It is extremely difficult to form the conductive film while ensuring high manufacturing efficiency as compared with the case of forming a solid through-hole conductor.

  As a technique for forming a cylindrical conductive film, Patent Document 1 discloses that a protective film is formed on one surface of an aluminum foil that is a conductive substrate, then a through hole hole is formed in the aluminum foil, and an insulating film is formed on the inner wall of the through hole hole. A solid electrolytic capacitor in which a through-hole electrode is formed is disclosed. An electrodeposition method is used as a method of forming the insulating film. However, the method for forming the insulating film by the electrodeposition method has room for improvement from the viewpoint of an efficient method for forming the insulating film.

In Patent Document 2, in manufacturing a solid electrolytic capacitor, an absorber is brought into contact with one side of a valve metal sheet body, an insulating paint made of a spacer and a resin material is applied to the inner wall of the through hole, A technique for forming an insulating film by removing the insulating resin so as to form a through hole while leaving a certain insulating resin on the inner wall surface is disclosed. The absorber is preferably made of a material that absorbs liquid appropriately, such as Japanese paper. However, in order to absorb the insulating paint only by the absorber, there is a limit to the constant amount of absorption and the improvement of the absorption speed, the constant thickness of the insulating resin film and the efficient formation of the insulating resin film However, there is still room for improvement.
JP 2003-22936 A Japanese Patent Laid-Open No. 2005-243889

  The subject of this invention is providing the manufacturing method which can form the cylindrical film | membrane which has a fixed film thickness with high manufacturing efficiency in manufacturing the electronic component which has a cylindrical film | membrane inside a base | substrate.

  In order to solve the above-described problems, in the manufacturing method according to the present invention, in manufacturing an electronic component having a cylindrical film inside a base, first, the base having a through-hole penetrating from one side to the other side facing the base. Prepare. Then, paste is injected into the through hole from one side of the base, and the paste injected into the through hole is sucked from the other side of the base, so that the entire inner wall surface of the through hole is sucked. The paste is adhered to the substrate, thereby forming a cylindrical film. This manufacturing method will be referred to as a first manufacturing method.

  According to the first manufacturing method, by adjusting the suction force from the other surface side of the substrate together with the viscosity of the paste, a cylindrical film having a constant film thickness can be quickly and efficiently formed on the entire inner wall surface of the through hole. Can be well formed.

  Moreover, since it is a paste, the paste can be reliably injected into the through-holes by means such as a screen printing method that is rich in mass productivity and excellent in positioning accuracy.

  The manufacturing method according to the present invention can be used for manufacturing an electronic component having a cylindrical conductive film inside a substrate. In this case, a base having a through hole penetrating from the one surface side to the other surface facing the surface is prepared, and a conductive paste is injected into the through hole from the one surface side of the base, and from the other surface side of the base. The conductive paste injected into the through hole is sucked to adhere the conductive paste to the entire inner wall surface of the through hole, thereby forming a cylindrical conductive film. This manufacturing method will be referred to as a second manufacturing method. The same effects as the first manufacturing method can be obtained by the second manufacturing method.

The manufacturing method according to the present invention can also be used to manufacture an electronic component having a cylindrical insulating film inside a substrate. In this case, a base having a through hole penetrating from the one surface side to the other surface facing the surface is prepared, and an insulating paste is injected into the through hole from the one surface side of the base,
The insulating paste injected into the through hole is sucked from the other surface side of the substrate to adhere the insulating paste to the entire inner wall surface of the through hole, thereby forming a cylindrical insulating film. This manufacturing method will be referred to as a third manufacturing method.

  In the third manufacturing method, when the entire substrate is made of a conductive material, or the substrate itself is made of an insulating material, the inner wall surface of the through-hole has conductivity, and the inner wall surface This is useful when it is necessary to insulate the substrate.

  Furthermore, the manufacturing method according to the present invention can also be used to manufacture an electronic component having a plurality of conductive films inside a substrate. Also in this case, first, a substrate having a through-hole penetrating from one surface side to the opposite other surface side is prepared. Then, from one surface side of the base body, a conductive paste is injected into the through-hole, and from the other surface side of the base body, the conductive paste injected into the through-hole is sucked, and the inner wall surface of the through-hole The conductive paste is attached to the entire surface, thereby forming a cylindrical conductive film having a first cylindrical hole.

  Next, an insulating paste is injected into the first cylindrical hole from one side of the base, and the insulating paste injected into the first cylindrical hole is sucked from the other side of the base. Then, the insulating paste is adhered to the entire inner wall surface of the first cylindrical hole, thereby forming a cylindrical insulating film having a second cylindrical hole. Next, a conductive paste is injected into the second cylindrical hole. This manufacturing method will be referred to as a fourth manufacturing method.

  In the fourth manufacturing method, first, after applying the second manufacturing method, the third manufacturing method is applied, and then the conductive paste is injected into the second cylindrical hole. The step of injecting the conductive paste into the second cylindrical hole may be a step of forming the cylindrical conductive film by applying the second manufacturing method, or conducting the entire second cylindrical hole. It may be a step of filling with a paste. When a larger number of cylindrical conductive films are required, after applying the second manufacturing method, the step of applying the third manufacturing method may be repeated according to the number of cylindrical conductive films required.

  In any of the first manufacturing method to the fourth manufacturing method, it is possible to take a step of sucking the paste while injecting the paste. By doing so, since the paste can be sucked under the adjusted viscosity, a cylindrical film having a target film thickness can be formed.

  In any of the first manufacturing method to the fourth manufacturing method, a screen printing method can be used for the step of injecting the paste. The advantages of the screen printing method are as described above. The process of sucking the paste is generally a vacuum suction process.

  Furthermore, in any of the first manufacturing method to the fourth manufacturing method, it is desirable that an absorbent sheet is disposed on the other surface side of the substrate and sucked through the absorbent sheet. Thereby, the sucked paste can be attached to the absorbent sheet to avoid surrounding environment contamination, and the paste can be collected from the absorbent sheet and reused to contribute to resource saving.

  As described above, according to the present invention, when manufacturing an electronic component having a cylindrical film inside a substrate, a manufacturing method capable of forming a cylindrical film having a constant film thickness with high manufacturing efficiency is provided. be able to.

  FIG. 1A is a diagram showing an embodiment of a method for manufacturing an electronic component according to the present invention, and FIG. 1B is a part of the electronic component obtained through the process of FIG. It is an expanded sectional view. The illustrated manufacturing method is mainly directed to the first manufacturing method and the second manufacturing method.

  In manufacturing the electronic component 1 having a cylindrical film inside the base body 11, first, the base body 11 having a through-hole 12 penetrating from one surface side to the other surface side is prepared.

  The material of the base 11 is selected according to the electronic component to be obtained. For example, when it is intended to obtain a resonator, a filter, a capacitor, or the like, the substrate 11 can be formed of a ceramic dielectric or an organic dielectric. In order to obtain an inductor or the like, the base 11 can be made of various magnetic materials in addition to a ceramic dielectric or an organic dielectric. When obtaining an electronic component including at least two kinds of passive circuit elements selected from a capacitor, an inductor, a resistor, or the like, a composite material suitable for the electronic component is used. Further, in the case of a solid electrolytic capacitor, aluminum or the like may be used.

  When the substrate 11 is made of a ceramic dielectric, a fired one can be used, or an unfired one can be used. In this embodiment, a case where a substrate 11 made of unfired ceramic is used will be described as an example.

  The paste 24 may be conductive or insulative. Here, the case where the conductive paste 24 is used will be described as an example on the premise that the base 11 is made of a ceramic dielectric. As is well known, the conductive paste 24 is obtained by mixing and dispersing a granular conductive component with an organic vehicle, and the viscosity can be adjusted by selecting the ratio and type of these components. As the granular conductive component, those known so far, such as Ag, Cu, Pd, and Ni, can be arbitrarily used.

  A conductive paste 24 is injected into the through hole 12 from the one surface side of the base body 11 described above. In this embodiment, a screen printing method is used as means for injecting the conductive paste 24. That is, the screen printing apparatus 2 is arranged on one surface side of the base 11, and the squeegee 23 is moved in the direction of the arrow F1, for example, on the screen 21 having a punching pattern that matches the pattern of the through-holes 12, so that the conductive paste 24 Is injected into the through-hole 12. The screen 21 is stretched around the screen frame 22.

  On the other hand, the suction device 4 is disposed on the other surface side of the base body 11. With this suction device 4, the conductive paste 24 injected into the through hole 12 is sucked from the other surface side of the substrate 11, and the conductive paste 24 is attached to the entire inner wall surface of the through hole 12, thereby FIG. A cylindrical conductive film 241 is formed as shown in FIG. In FIG. 1B, the first cylindrical hole 121 generated inside the cylindrical conductive film 241 is left as a hole as it is or is filled with an insulating paste.

  The illustrated suction device 4 has a porous support plate 41 at a position facing the base 11. The porous support plate 41 is disposed inside the support container 42. The support container 42 is connected to a vacuum device or the like (not shown), thereby giving a suction force F2.

  In this embodiment, the paste absorbing device 3 is further provided on the other surface side of the substrate 11. The paste absorbing device 3 arranges the absorbent sheet 31 between the other surface of the substrate 11 and the porous support 41 and sucks the conductive paste 24 injected into the through-hole 12 through the absorbent sheet 31. It has become. The absorbent sheet 31 is made by bonding fibers with a synthetic resin or other adhesive into a cloth shape, and can be made of an elastic and breathable member such as a nonwoven fabric. The absorbent sheet 31 is pulled out from the supply roll 32 and guided between the other surface side of the substrate 11 and the porous support 41 to the take-up roll 33, and is taken in the direction of arrow F 3 by the take-up roll 33. It is wound up.

  The injection of the conductive paste 24 by the screen printing device 2 and the absorption of the paste 24 by the paste absorbing device 3 are simultaneously performed. That is, the paste 24 is sucked while being injected.

  Furthermore, in the embodiment shown in FIG. 1, the drying device 5 is provided behind the injection / suction stage, and the cylindrical conductive film 241 applied to the inside of the through hole 12 is dried.

  As described above, in the manufacturing method according to the present invention, the conductive paste 24 is injected into the inside of the through hole 12 from one surface side of the base body 11 having the through hole penetrating from the one surface side to the opposite other surface side. The conductive paste 24 injected into the through hole 12 is sucked from the other surface side to adhere the conductive paste 24 to the entire inner wall surface of the through hole 12, thereby forming the cylindrical conductive film 241. Therefore, by adjusting the suction force from the other surface side of the substrate 11 along with the adjustment of the viscosity of the conductive paste 24, the cylindrical conductive film 241 having a constant film thickness is formed on the entire inner wall surface of the through hole 12. It can be formed quickly and efficiently.

  Moreover, since the conductive paste 24 is used, the conductive paste 24 can be reliably injected into the through-hole 12 by means such as a screen printing method, which is rich in mass productivity and excellent in alignment accuracy.

  When the step of sucking the conductive paste 24 is performed while injecting the conductive paste 24, the conductive paste 24 can be sucked under the adjusted viscosity, so that the cylindrical conductive film 241 having a desired film thickness is formed. can do.

  Further, the absorbent sheet 31 is disposed on the other surface side of the substrate 11 and sucked through the absorbent sheet 31, so that the sucked paste 24 is attached to the absorbent sheet 31, thereby avoiding environmental pollution and absorbing. The conductive paste 24 can be collected from the sheet 31 and reused to contribute to resource saving.

The manufacturing method according to the present invention can also be used for manufacturing an electronic component having a cylindrical insulating film inside the substrate 11 (third manufacturing method). FIG. 2A is a view showing an example of the manufacturing method, and FIG. 2B is a partially enlarged view of an electronic component obtained by the manufacturing method of FIG. In the figure, parts corresponding to those shown in FIG. 1 are given the same reference numerals.
The manufacturing method shown in FIG. 2 is not different from the second manufacturing method in terms of process except that the conductive paste 24 in the second manufacturing method shown in FIG. That is, a base body 11 having a through hole 12 penetrating from the one surface side to the opposite surface side is prepared, and the insulating paste 25 is injected into the through hole 12 from the one surface side of the base material 11. Then, the insulating paste 25 injected into the through hole 12 is sucked to adhere the insulating paste 25 to the entire inner wall surface of the through hole 12, thereby forming the cylindrical insulating film 251.

  In the third manufacturing method, when the entire base 11 is made of a conductive material, or the base 11 itself is made of an insulating material, the inner wall surface of the through hole 12 has conductivity. This is useful when it is necessary to insulate the inner wall surface.

  The insulating paste 25 may be an inorganic ink in which a particulate inorganic insulator is mixed and dispersed with an organic vehicle, or may be an organic ink mainly composed of an organic insulating material.

  Furthermore, the manufacturing method according to the present invention can also be used for manufacturing an electronic component having a plurality of conductive films inside the substrate 11 (fourth manufacturing method). 3 (a) and 4 (a) are diagrams showing steps of the fourth manufacturing method, and FIGS. 3 (b) and 4 (b) are enlarged views of a part of electronic components obtained by the fourth manufacturing method. FIG.

  Also in this case, first, a base body 11 having a through hole 12 penetrating from one surface side to the opposite surface side is prepared. Then, as described with reference to FIG. 1A, the conductive paste 24 is injected into the through hole 12 from one surface side of the substrate 11, and is injected into the through hole 12 from the other surface side of the substrate 11. The conductive paste 24 is sucked to adhere the conductive paste 24 to the entire inner wall surface of the through-hole 12, and as a result, as shown in FIG. 1B, the cylindrical conductive material having the first cylindrical hole 121. A film 241 is formed.

  Next, as illustrated in FIG. 3A, the insulating paste 25 is injected into the first cylindrical hole 121 from one surface side of the base 11, and the first cylindrical hole 121 is injected from the other surface side of the base 11. The insulating paste 25 injected into the inside is sucked to adhere the insulating paste 25 to the entire inner wall surface of the first cylindrical hole 121, thereby forming the second cylindrical shape as shown in FIG. A cylindrical insulating film 251 having a hole 122 is formed.

  Next, as illustrated in FIG. 4A, the conductive paste 26 is injected into the second cylindrical hole 122. FIG. 4B is an enlarged cross-sectional view showing a part of the electronic component obtained as described above, and a solid conductor 261 is formed inside the second cylindrical hole 122. 4, parts corresponding to those shown in FIGS. 1 to 3 are denoted by the same reference numerals, and redundant description is omitted.

  The fourth manufacturing method is simply a method of applying the third manufacturing method after applying the second manufacturing method, and then injecting the conductive paste 26 into the second cylindrical hole 122. The step of injecting the conductive paste 26 into the second cylindrical hole 122 may be a step of forming a cylindrical conductive film by applying the second manufacturing method, as shown in FIG. In this way, the entire second cylindrical hole 122 may be filled with the conductive paste 26 to form the solid conductor 261. When a larger number of cylindrical conductive films are required, after applying the second manufacturing method, the step of applying the third manufacturing method may be repeated according to the number of cylindrical conductive films required. Although illustration is omitted, in an actual electronic component, another sheet-like substrate, an electrode layer, or the like is laminated on the substrate 11. The laminated structure depends on the structure of the electronic component to be obtained.

  Although the contents of the present invention have been specifically described above with reference to the preferred embodiments, it is obvious that those skilled in the art can take various modifications based on the basic technical idea and teachings of the present invention. It is.

FIG. 1A is a diagram showing an embodiment of a method for manufacturing an electronic component according to the present invention, and FIG. 1B is a partially enlarged view of the electronic component obtained through the process of FIG. It is sectional drawing. 2A is a diagram showing an embodiment of another method for manufacturing an electronic component according to the present invention, and FIG. 2B is an electronic component obtained through the process of FIG. 2A. FIG. FIG. 3A is a view showing an embodiment of still another method for manufacturing an electronic component according to the present invention, and FIG. 3B is an electronic component obtained through the process of FIG. It is a partially expanded sectional view. FIG. 4A is a diagram illustrating a process subsequent to FIG. 3A, and FIG. 4B is a partially enlarged cross-sectional view of the electronic component obtained through the process of FIG. 4A.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 11 Base | substrate 12 Through-hole 2 Screen printing apparatus 21 Screen 24 Conductive paste 241 Cylindrical conductive film 25 Insulating paste 251 Cylindrical insulating film 26 Conductive paste 261 Solid conductor 3 Paste absorber 4 Suction apparatus

Claims (8)

A method of manufacturing an electronic component having a cylindrical film inside a substrate,
Preparing a substrate having a through-hole penetrating from the one surface side to the other surface side,
From one side of the substrate, a paste is injected into the through hole,
From the other surface side of the substrate, the paste injected into the through hole is sucked to adhere the paste to the entire inner wall surface of the through hole, thereby forming a cylindrical film.
A method comprising the steps. A method of manufacturing an electronic component having a cylindrical conductive film inside a substrate,
Preparing a substrate having a through-hole penetrating from the one surface side to the other surface side,
From one surface side of the substrate, a conductive paste is injected into the through hole,
The conductive paste injected into the through hole is sucked from the other surface side of the base, and the conductive paste is attached to the entire inner wall surface of the through hole, thereby forming a cylindrical conductive film.
A manufacturing method including a process. A method of manufacturing an electronic component having a cylindrical insulating film inside a substrate,
Preparing a substrate having a through-hole penetrating from the one surface side to the other surface side,
Injecting an insulating paste into the through hole from one surface side of the substrate,
The insulating paste injected into the through hole is sucked from the other surface side of the base, and the insulating paste is attached to the entire inner wall surface of the through hole, thereby forming a cylindrical insulating film.
A manufacturing method including a process. A method of manufacturing an electronic component having a plurality of conductive films inside a dielectric substrate,
Preparing a substrate having a through-hole penetrating from the one surface side to the other surface side,
From one surface side of the dielectric substrate, a conductive paste is injected into the through hole,
The conductive paste injected into the through hole is sucked from the other surface side of the dielectric substrate, and the conductive paste is adhered to the entire inner wall surface of the through hole, thereby forming the first cylindrical hole. Forming a cylindrical conductive film,
Next, an insulating paste is injected into the first cylindrical hole from one surface side of the base,
The insulating paste injected into the first cylindrical hole is sucked from the other surface side of the base to adhere the insulating paste to the entire inner wall surface of the first cylindrical hole. Forming a cylindrical insulating film having two cylindrical holes;
Next, a conductive paste is injected into the second cylindrical hole.
A manufacturing method including a process.   5. The manufacturing method according to claim 1, further comprising a step of sucking the paste while injecting the paste.   The manufacturing method according to claim 1, wherein the step of injecting the paste is a screen printing step.   The manufacturing method according to claim 1, wherein the step of sucking the paste is a vacuum suction step.   The manufacturing method according to claim 1, wherein an absorption sheet is disposed on the other surface side of the base body and sucked through the absorption sheet.

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