JP2009239060A - Temperature detecting device for substrate processor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the reduction of the availability factor of a substrate processor which is caused by the damage of temperature measuring means, by announcing the failure of the temperature measuring means before they damage wholly. <P>SOLUTION: In the substrate processor, a temperature sensor 41 and a temperature controlling portion 43 make certain output signals generally before failure. In addition, many output signals show some inherent values in response to their failure modes. Therefore, the inherent values are memorized in a memorizing portion 59 every failure mode before hand so as to perform the announcement of a failure through an announcing portion 61 when the output signals from the temperature sensor 41 and the temperature controlling portion 43 consist with their inherent values substantially, even though the consistency is temporary. The failure is announced before the temperature measuring means damages wholly so as to be able to complete their repairing provisions before the failure occurs wholly. Therefore, the reduction of the availability factor of the substrate processor which is caused by the damage of the temperature sensor 41 and the temperature controlling portion 43 can be prevented. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a temperature detection device for a substrate processing apparatus that performs predetermined processing such as cleaning and etching on a glass substrate (hereinafter simply referred to as a substrate) for a semiconductor wafer or a liquid crystal display device.

Conventionally, as this type of apparatus, a processing tank storing a processing liquid for processing a substrate, a heater for heating the processing liquid, a temperature measuring unit for measuring the temperature of the processing liquid in the processing tank, and a temperature measuring unit And a control unit that controls the temperature of the processing liquid by controlling the heater based on the signal from (see, for example, Patent Documents 1 and 2).
JP 2006-296617 A Japanese Patent No. 4027288

However, the conventional example having such a configuration has the following problems.
In other words, the temperature measuring unit is covered with a material having resistance to the chemical solution contained in the processing solution, but actually requires periodic replacement. Although the replacement is periodic, the temperature measuring unit may actually be damaged in a short period of time. In general, equipment users purchase only a minimum number of replacement parts in preparation for regular replacement of the temperature measurement unit. There is a problem that the processing apparatus needs to be stopped and the operating rate of the substrate processing apparatus is lowered.

  The present invention has been made in view of such circumstances, and prevents the operating rate from being lowered due to the failure of the temperature measuring means by notifying the failure before the temperature measuring means is completely damaged. An object of the present invention is to provide a temperature detection device for a substrate processing apparatus capable of performing the above.

In order to achieve such an object, the present invention has the following configuration.
That is, according to the first aspect of the present invention, in the temperature detection device of the substrate processing apparatus, the temperature measurement unit that measures the temperature of the fluid used for processing the substrate, and the output signal from the temperature measurement unit are used as the temperature measurement unit. Storage means for storing in advance as eigenvalues for each failure mode of the means, informing means for informing that there is a risk of failure in the temperature measurement means, and an output signal from the temperature measurement means as the eigenvalue of the storage means Control means for notifying the failure via the notification means when there is a substantial coincidence even temporarily.

  [Operation / Effect] According to the first aspect of the present invention, the temperature measuring means is not suddenly damaged and the output signal is not interrupted, but generally becomes an output signal before failure. In addition, the output signal often shows an eigenvalue depending on the failure mode. Therefore, an eigenvalue is stored in advance in the storage means for each failure mode, and if the output signal from the temperature measuring means is temporarily coincident with the eigenvalue, it is determined as a sign of failure. Then, failure notification is performed via the notification means. As a result, it is possible to prepare for repairs before a complete failure by notifying the failure before the temperature measuring device is completely damaged, thus preventing a reduction in operating rate due to the failure of the temperature measuring device. Can do.

  Note that the eigenvalue here is a value that is not output as an output signal in normal measurement.

  In the present invention, it is preferable that the temperature measurement unit includes a detection unit that detects a temperature, and a conversion unit that converts the detection signal from the detection unit into an output signal representing the temperature. (Claim 2). The detecting means is frequently exchanged because it directly touches the fluid. Therefore, it is advantageous for maintenance that only the detection means can be separated.

  In the present invention, it is preferable that the eigenvalue includes a first output signal when the detection unit fails and a second output signal when the conversion unit fails (Claim 3). If the temperature measuring means includes a detecting means and a converting means, the eigenvalue is output regardless of which means is damaged, so the first output signal and the second output signal should be stored. Therefore, even if one of them is about to be damaged, the failure can be notified. Therefore, failure notification can be performed with higher accuracy.

  According to the temperature detecting device of the substrate processing apparatus of the present invention, the temperature measuring means is not suddenly damaged and the output signal is not interrupted, but generally, it becomes an output signal before the failure. In addition, the output signal often shows an eigenvalue depending on the failure mode. Therefore, an eigenvalue is stored in advance in the storage means for each failure mode, and if the output signal from the temperature measuring means is temporarily coincident with the eigenvalue, it is determined as a sign of failure. Then, failure notification is performed via the notification means. As a result, it is possible to prepare for the repair before the complete failure by performing the failure notification before the temperature measuring unit is completely damaged, so that it is possible to prevent the operating rate from being lowered due to the failure of the temperature measuring unit.

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a block diagram illustrating a schematic configuration of a substrate processing apparatus including a temperature measuring apparatus according to an embodiment.

  The substrate processing apparatus includes a processing tank 1 that stores a phosphoric acid solution as a processing solution. Around the treatment tank 1, a collection tank 3 for collecting the phosphoric acid solution overflowing from the treatment tank 1 is disposed. The phosphoric acid solution recovered in the recovery tank 3 is returned to the treatment tank 1 via the circulation system 5. The circulation system 5 includes a circulation pump 11, an in-line heater 13, and a filter 15 in a pipe 9 that connects the recovery tank 3 and a jet pipe 7 provided at the bottom of the processing tank 1. The in-line heater 13 has a function of heating the phosphoric acid solution returned to the processing tank 1, and the filter 15 has a function of removing particles and the like from the phosphoric acid solution returned to the processing tank 1. A tank heater 17 for heating the phosphoric acid solution in the processing tank 1 is attached to the outer peripheral sides of the processing tank 1 and the recovery tank 3.

  An openable / closable cover 19 is provided on the upper portion of the processing tank 1. A plurality of substrates W to be processed are held in an upright posture on a vertically movable holding arm 21. When the vertically movable holding arm 21 is in a standby position outside the tank, the cover 19 is closed. On the other hand, when holding the substrate W on the holding arm 21 and putting it in the processing position in the tank, the cover 19 is opened. The cover 19 is closed again while the substrate W is put into the bath and the etching process is performed.

  The phosphoric acid supply unit 23 supplies phosphoric acid to the recovery tank 3. The phosphoric acid supply unit 23 includes a nozzle 25 disposed above the recovery tank 3, a pipe 27 that connects the nozzle 25 to a phosphoric acid supply source, and a flow rate adjustment valve 29 disposed in the pipe 27. I have. In addition, a pure water replenishment unit 31 for replenishing the treatment tank 1 with pure water is provided. The pure water replenishment unit 31 includes a nozzle 33 disposed in the vicinity of the edge of the processing tank 1, a pipe 35 communicating the nozzle 33 with a pure water supply source, and a flow rate adjusting valve disposed in the pipe 35. 37.

  A temperature sensor 41 for detecting the temperature of the phosphoric acid solution is disposed in the treatment tank 1. The detection signal of the temperature sensor 41 is given to the temperature control unit 43. The temperature control unit 43 converts the output signal indicating the temperature based on the detection signal, and performs PID (proportional / integral / differential) control of the in-line heater 13 based on the temperature. Further, the tank heater 17 is ON / OFF controlled. Specifically, the in-line heater 13 is controlled so that the temperature of the phosphoric acid solution falls within the range of 159.7 to 160.3 ° C. When the temperature of the phosphoric acid solution is 160.3 ° C. or lower, the tank heater 17 is maintained in the ON state, and when it exceeds 160.3 ° C., the tank heater 17 is turned off.

  Since the temperature sensor 41 described above directly touches the phosphoric acid solution that is a processing solution, the temperature sensor 41 is configured by a member having resistance to phosphoric acid, but can be periodically replaced. Examples of the temperature sensor 41 include a K thermocouple made of an alloy mainly composed of nickel and chromium, and a Pt temperature measuring body made of an alloy mainly composed of platinum. The K thermocouple has a measurable temperature range of −200 to 1000 ° C. and is suitable.

  The temperature sensor 41 and the temperature control unit 43 described above correspond to “temperature measurement means” and “detection means” in the present invention, and the temperature control unit 43 corresponds to “conversion means” in the present invention.

  The temperature control unit 43 also controls the holding arm 21 in addition to the above control. That is, when the holding arm 21 is at a position different from the standby position or the processing position, the in-line heater 13 and the tank heater 17 are controlled as described above. On the other hand, before the holding arm 21 moves from the standby position to the processing position, the heating by the in-line heater 13 is stopped and the heating is switched to only the heating by the tank heater 17. When the processing on the substrate W is completed and the holding arm 21 returns from the processing position to the standby position, heating by the in-line heater 13 is resumed. In other words, before the substrate W is moved to the processing tank 1 and processed, the heating by the inline heater 13 and the tank heater 17 is switched to the heating by the tank heater 17 only. Information such as where the holding arm 21 is located is given from the main control unit 57 described later.

  The treatment tank 1 is provided with a concentration detector 45 that detects the concentration of the phosphoric acid solution. The concentration detection device 45 detects the concentration of the phosphoric acid solution by substantially detecting the specific gravity of the phosphoric acid solution, paying attention to the fact that there is a correlation between the concentration of the phosphoric acid solution and the specific gravity of the phosphoric acid solution. . Further, since the specific gravity of the phosphoric acid solution has a correlation with the pressure at a predetermined depth in the processing tank 1, the concentration detector 45 has a detection end at a predetermined depth in the processing tank 1, and the detection end The concentration of the phosphoric acid solution is detected by detecting the pressure of the applied treatment liquid. Below, the structure of the density | concentration detection apparatus 45 is demonstrated concretely.

  The concentration detection device 45 includes a detection tube 47, a regulator 49, a pressure detection unit 51, and a concentration calculation unit 53. The detection tube 47 is resistant to a phosphoric acid solution, and is attached so that a pressure detection end which is a tip portion thereof is positioned at a predetermined depth in the processing tank 1. The regulator 49 supplies nitrogen gas from a nitrogen gas supply source to the detection tube 47 at a constant flow rate. The pressure detection unit 51 includes a pressure sensor that measures the nitrogen gas pressure in the detection tube 47. Therefore, the output signal from the pressure detection unit 51 corresponds to the liquid pressure at a predetermined depth from the liquid surface of the processing tank 1. The concentration calculation unit 53 stores in advance calibration curve data representing the correspondence between the voltage and the concentration according to the pressure from the pressure detection unit 51, and based on the detection signal (voltage) from the pressure detection unit 51. The concentration of the phosphoric acid solution in the treatment tank 1 is obtained.

  The concentration data of the phosphoric acid solution obtained by the concentration detector 45 is given to the concentration controller 55. The concentration control unit 55 adjusts the above-described flow rate adjustment valve 37 so that the detected concentration of the phosphoric acid solution is slightly higher than the boiling point concentration corresponding to the set temperature of the phosphoric acid solution, thereby supplying the treatment tank 1 from the nozzle 33. Adjust the amount of pure water replenished. Specifically, the concentration control unit 55 operates the flow rate adjustment valve 37 by PID (proportional / integral / derivative) control based on the detected concentration of the phosphoric acid solution.

  The main controller 57 is provided for overall control of the entire substrate processing apparatus. Specifically, the main control unit 57 gives a command of the set temperature of the phosphoric acid solution to the temperature control unit 43, a command of the target concentration of the phosphoric acid solution to the concentration control unit 55, an operation command of the flow rate adjustment valve 29 of phosphoric acid, and the like. At the same time, failure notification described later is performed.

  In addition, a storage unit 59 and a notification unit 61 are connected to the main control unit 57. The storage unit 59 stores output signals from the temperature sensor 41 and the temperature control unit 43 in advance as eigenvalues for each failure mode of the temperature sensor 41 and the temperature control unit 43.

  The eigenvalue will be specifically described with reference to FIGS. 2 is a schematic diagram illustrating an example of eigenvalues, and FIG. 3 is a schematic diagram illustrating examples of other eigenvalues. However, the above-mentioned phosphoric acid solution is normally maintained at 40 ° C., and is adjusted to the above-described high temperature during processing. In these schematic diagrams, the temperature change in the normal state is shown.

  FIG. 2 shows a state in which the temperature sensor 41 is about to be damaged. When the temperature sensor 41 is in a normal state, the temperature control unit 43 determines [40 ° C.] based on the detection signal from the temperature sensor 41, and the temperature is given to the main control unit 57 as an output signal. This state corresponds to the time t0 to t4 in FIG. On the other hand, when the temperature sensor 41 is about to be damaged, even if the phosphoric acid solution is [40 ° C.], the detection signal from the temperature sensor 41 becomes an abnormal value, and based on this, the temperature control unit 43 [220 ° C.] It is judged that. This corresponds to the time t4 to t6. Therefore, the output signal from the temperature control unit 43, which can be said abnormal value, is stored in the storage unit 59 as the eigenvalue SV1.

  FIG. 3 shows a state in which the temperature sensor 43 is about to be damaged although there is no problem with the temperature sensor 41. Based on the detection signal from the temperature sensor 41, it should be determined that the temperature is 40 ° C., and is given to the main control unit 57 as an output signal representing [−−− ° C.] indicating a range over because of an abnormality occurring inside. . This state corresponds to the time t3 to t4 in FIG. Therefore, an output signal from the temperature control unit 43 that can be said abnormal value is stored in the storage unit 59 as the eigenvalue SV2. In the normal state, the output signal from the temperature control unit 43 indicates 40 ° C. as at time t0 to t4.

  The main control unit 57 compares the eigenvalues SV1 and SV2 of the storage unit 59 with the output signal in addition to the command related to the temperature control described above, and determines whether or not they are substantially the same. In that case, the notification unit 61 is activated. The notification unit 61 is, for example, a lamp, a buzzer, a display device, or the like, and notifies the operator of the device that a failure is occurring or that a failure has occurred. The above-mentioned substantially coincides with, for example, whether or not it is in the range of 5% or 7% with the eigenvalue as the center.

  The main control unit 57 corresponds to the “control means” in the present invention, and the eigenvalues SV1 and SV2 correspond to the first output signal and the second output signal in the present invention.

  Next, only the operation related to the temperature detection device will be described with reference to FIG. 4 among the temperature detection devices of the substrate processing apparatus described above. In the substrate processing apparatus, it is assumed that the phosphoric acid solution is maintained at a non-processing temperature of 40 ° C.

Step S1
The main control unit 57 receives an output signal from the temperature control unit 43 as temperature data.

Step S2
The main control unit 57 compares the received temperature data with the eigenvalue SV1 of the storage unit 59 and branches the process depending on whether or not they substantially match. If they do not match, the process proceeds to step S3, and if they match, the process proceeds to step S4.

Step S3
The main control unit 57 compares the received temperature data with the eigenvalue SV2 of the storage unit 59 and branches the process depending on whether or not they substantially match. If they do not match, the process proceeds to step S3, and if they match, the process proceeds to step S4.

Step S4
Since the failure is occurring in the temperature sensor 41 or the temperature control unit 43 or both, the main control unit 57 operates the notification unit 61 to notify the failure. And the process from step S1 mentioned above is repeatedly performed by a predetermined time interval. It should be noted that the main control unit 57 cancels the notification even if the determination in steps S2 and S3 described above during repetitive execution results in a state that does not substantially match the eigenvalues SV1 and SV2. There is no need. This is because, as a sign of complete failure, it is often regarded as a sign that the same phenomenon as a failure occurs temporarily. Therefore, even if it is temporary, when it is practically coincident with the eigenvalues SV1 and SV2, the above-described failure notification may be performed.

  As described above, the temperature sensor 41 and the temperature control unit 43 are not suddenly damaged and the output signal is not interrupted. In general, the temperature sensor 41 and the temperature control unit 43 become an output signal before failure. In addition, the output signal often shows the eigenvalues SV1 and SV2 depending on the failure mode. Therefore, the eigenvalues SV1 and SV2 are stored in advance in the storage unit 59 for each failure mode, and even if the output signals from the temperature sensor 41 and the temperature control unit 43 are temporary, they substantially coincide with the eigenvalues SV1 and SV2. In such a case, it is determined that it is a sign of failure, and failure notification is performed via the notification unit 61. As a result, it is possible to prepare for the repair before the complete failure by performing the failure notification before the temperature sensor 41 and the temperature control unit 43 are completely damaged. Therefore, the temperature sensor 41 and the temperature control unit 43 are damaged. It is possible to prevent the operating rate from being reduced due to the above.

  The present invention is not limited to the above embodiment, and can be modified as follows.

  (1) In the above-described embodiment, the substrate processing apparatus performs processing with a phosphoric acid solution and measures the temperature of the solution. However, the present invention is a processing liquid other than the phosphoric acid solution, for example, sulfuric acid / peroxidation. Even a mixed solution of hydrogen water or a hydrofluoric acid solution is applicable.

  (2) In the above-described embodiments, the processing liquid has been described as an example. However, the present invention can be applied to a fluid used for processing a substrate, for example, a gas such as ozone gas.

  (3) In the above-described embodiment, the occurrence of a failure is determined based on two types of eigenvalues SV1 and SV2. However, the eigenvalue may be one type or three or more types.

  (4) In the above-described embodiment, the temperature detection device is provided in a so-called batch type substrate processing apparatus, but the present invention can be applied to a single wafer type substrate processing apparatus.

It is a block diagram which shows schematic structure of the substrate processing apparatus provided with the temperature measurement apparatus which concerns on an Example. It is a schematic diagram which shows the example of an eigenvalue. It is a schematic diagram which shows the example of another eigenvalue. It is a flowchart which shows operation | movement.

Explanation of symbols

W ... Substrate 1 ... Processing tank 3 ... Recovery tank 5 ... Circulation system 13 ... In-line heater 21 ... Holding arm 47 ... Detection tube 53 ... Concentration calculation unit 55 ... Concentration control unit 57 ... Main control unit 59 ... Storage unit 61 ... Notification unit SV1, SV2 ... eigenvalues

Claims (3)

In the temperature detection device of the substrate processing apparatus,
Temperature measuring means for measuring the temperature of the fluid used for processing the substrate;
Storage means for preliminarily storing the output signal from the temperature measuring means as an eigenvalue for each failure mode of the temperature measuring means;
Informing means for informing that there is a risk of failure in the temperature measuring means;
If the output signal from the temperature measuring means substantially coincides with the eigenvalue of the storage means even if temporarily, a control means for performing a failure notification via the notification means,
A temperature detection apparatus for a substrate processing apparatus, comprising: In the temperature detection apparatus of the substrate processing apparatus of Claim 1,
The temperature measuring means includes
Detecting means for detecting temperature;
Conversion means for converting into an output signal representing temperature based on the detection signal from the detection means;
A temperature detection apparatus for a substrate processing apparatus, comprising: In the thermometer of the substrate processing apparatus according to claim 2,
The temperature detection apparatus for a substrate processing apparatus, wherein the eigenvalue includes a first output signal when the detection unit fails and a second output signal when the conversion unit fails.

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