JP2009236754A - Distortion measurement method, and distortion measurement system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide method and system which can easily measure any distortion arisen on surface of an object with a high degree of accuracy. <P>SOLUTION: The distortion measurement method comprises an image data acquisition process to define an optional reference point on the measuring object 2 and also define plural indicator points on plural concentric circles centering on the reference point, image the surface of the measuring object 2 before and after its deformation so as to include these reference point and indicator points by using optical imaging device 5, then acquire the image data before and after deformation, and an analysis process to calculate variation in point-to-point distance between the reference point and each indicator point from the image data before and after deformation, and then compute distortion in the direction from the reference point towards each indicator point, analyzing distortion distribution around the reference point based on that computed result. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present application relates to a strain measurement method and system for measuring strain of an object.

  2. Description of the Related Art Conventionally, a method for measuring strain generated on the surface of an object (for example, an existing concrete structure) as an object to be measured using an optical photographing apparatus such as a strain gauge or an electronic camera is known.

  The strain measurement method using a strain gauge detects the resistance value of a resistor of the strain gauge that is generated when the strain gauge is attached to the surface of the object and the strain gauge expands and contracts according to the deformation of the object. The strain generated in the object is measured based on the change in the resistance value (see, for example, Patent Document 1).

  On the other hand, in the strain measurement method using an optical imaging device, the surface of the object before and after the occurrence of the strain change is imaged by the optical imaging device, and the change amount and direction of each predetermined pixel (point) of the captured image are digitally recorded. This is obtained by an image correlation method and measures the distortion generated in the object (for example, see Patent Document 2).

JP-A-8-304191 JP 2003-232688 A

  However, in the strain measurement method using a strain gauge, when it is desired to grasp the strain of the measurement object in a plane, it is necessary to attach a large number of strain gauges, which leads to deterioration in workability.

  In addition, when the object to be measured is composed of non-uniform materials such as concrete, there is a problem that the value varies depending on the gauge length of the strain gauge and the position where the strain gauge is attached, and in order to solve the problem It is difficult to measure by attaching a plurality of strain gauges at the same location.

  In addition, the strain gauge is not suitable for a measurement object having a minute region or unevenness, and has a problem that it is disposable by one measurement.

  On the other hand, strain measurement using an optical imaging device can be applied to a case where it is desired to grasp a measurement object with unevenness and a strain distribution of the measurement object in a plane, but has the following problems.

  In strain measurement using an optical imaging device, generally, strain analysis is performed by a digital image correlation method, and in the strain analysis, strain is obtained using a change in distance before and after displacement between two points. However, it is generally said that the analysis resolution of the digital image correlation method is 50 to 1/100 per pixel, and there is a problem that an accurate result cannot be obtained when the displacement is small. .

  The present invention has been made as an example of solving the above-described problems, and an object thereof is to provide a strain measurement method and the like that can measure strain generated on the surface of an object easily and with high accuracy. .

  In order to solve the above-mentioned problem, the strain measuring method according to claim 1 sets an arbitrary base point on the object to be measured and a plurality of index points on a plurality of concentric circles centered on the base point, and the base point and The surface before and after deformation of the object to be measured is captured by an optical imaging device so as to include an index point, and an image data acquisition step for acquiring image data before and after the deformation, and the base point from each of the image data before and after the deformation An analysis step of obtaining a change in distance between two index points and calculating a strain in the direction of each index point from the base point, and analyzing a strain distribution around the base point based on the calculation result. Features.

  Further, the strain measuring method according to claim 2 sets an arbitrary base point on the object to be measured and a plurality of index points on a plurality of concentric circles around the base point, so that the base point and the index point are included. In addition, an image data acquisition step of capturing an image of the surface of the object to be measured before and after deformation with an optical imaging device and acquiring image data before and after the deformation, and an index point 2 that makes the base point symmetrical from the image data before and after the deformation. An analysis step of obtaining a change in distance between points, calculating a strain in the direction of each index point from the base point, and analyzing a strain distribution around the base point based on the calculation result.

  The strain measurement method according to claim 3 further comprises a stress calculation step of calculating stress acting on the base point based on the strain distribution in the strain measurement method according to claim 1 or 2. It is characterized by that.

  Further, the strain measuring method according to claim 4 is the strain measuring method according to claim 3, wherein the stress extracts a plurality of combinations of strains for rosette analysis based on the base point. The average value of the obtained stress is calculated.

  The strain measurement method according to claim 5 is the strain measurement method according to any one of claims 1 to 4, wherein the measured object is not affected by deformation based on the base point. The fixed point is included in the area imaged by the optical imaging device, the moving direction and moving amount of the fixed point are obtained from the image data before and after the deformation, and the moving direction of the fixed point and The image data after displacement is corrected based on the amount of movement.

  The strain measurement system according to claim 6 sets an arbitrary base point on the object to be measured and a plurality of index points on a plurality of concentric circles centered on the base point, so that the base point and the index point are included. And an image data acquisition means for acquiring the image data before and after the deformation by imaging the surface of the measured object before and after the deformation with an optical imaging device, and between the base point and each index point from the image data before and after the deformation. And analyzing means for calculating the strain in the direction of each index point from the base point and analyzing the strain distribution around the base point based on the calculation result.

  The strain measurement system according to claim 7 sets an arbitrary base point on the object to be measured and a plurality of index points on a plurality of concentric circles centered on the base point, so that the base point and the index point are included. In addition, image data acquisition means for acquiring the image data before and after deformation by imaging the surface of the object to be measured before and after deformation with an optical imaging device, and index point 2 that makes the base point symmetrical from the image data before and after deformation. Analyzing means for obtaining a change in distance between points, calculating a strain in the direction of each index point from the base point, and analyzing a strain distribution around the base point based on the calculation result.

  Hereinafter, the best embodiment of the present application will be described in detail with reference to FIGS. 1 is a schematic configuration diagram of a strain measurement system, FIG. 2 is a schematic configuration diagram of an analysis apparatus, FIG. 3 is a flowchart of the strain measurement system, and FIG. 4 is an enlarged view showing index points set in a measurement target region. Is a strain distribution diagram at the time of a uniaxial compression test, FIG. 6 is an explanatory diagram used when obtaining stress in an example of rosette analysis, and FIG. 7 is a strain distribution diagram when a core-out test is performed.

  The strain measurement system of this embodiment measures strain generated in a concrete structure due to its own weight or load, for example. In the present embodiment, a concrete structure is used as an object to be measured 2 as an example. However, the present invention is not limited to this embodiment. For example, elasticity such as a steel structure, a rock mass, a metal material, a stone material, a gypsum, and a plastic material is used. It can also be applied to body materials. The measurement target area S shown below means a peripheral area including a measurement target point (base point) defined in advance.

  As shown in FIG. 1, the strain measurement system is generated in the measurement target region S based on the imaging device 5 that images the measurement target region S on the surface of the DUT 2 and the image data captured by the imaging device 5. And an analysis device 10 for analyzing the strain to be generated.

  The imaging device 5 uses an optical imaging device such as a digital video camera, for example, to image the surface (measurement target region) of the object 2 to be measured. Note that the photographing device 5 is not limited to the digital video camera, and a CCD camera, a digital camera, a scanner, or the like can be used as appropriate.

  As shown in FIGS. 1 and 2, the analysis device 10 is a device generally called a computer and has a display screen 10a. The analysis device 10 includes an I / F unit 12 to which image data captured by the imaging device 5 is input, a storage unit 14 that stores the image data, an image analysis unit 15 that performs image analysis on the image data, an image An output unit 17 that outputs the strain distribution and stress obtained by the analysis on the display screen 10a, and a control unit 19 are provided.

  The control unit 19 includes a CPU (Central Processing Unit) having a calculation function, a working RAM, a nonvolatile memory, a ROM for storing various processing programs and data, and the like. Then, the CPU reads out and executes various processing programs stored in the ROM, thereby controlling the units 12, 14, 15, and 17 in an integrated manner.

  Next, a method for measuring strain and stress generated in the DUT 2 using the strain measurement system will be described with reference to FIG.

  First, the measurement target area S is set by the user or the like on the surface of the DUT 2, and the imaging device 5 is fixed so that the measurement target area S can be imaged. And the measurement object area | region S in an initial state (Before displacement of the to-be-measured object 2 by dead weight or a load) is imaged by the said imaging device 5 (step S11). The captured image data is stored in the storage unit 14 via the I / F unit 12 (step S12).

  Next, after the elapse of a predetermined period (after displacement of the DUT 2 due to its own weight or load), the measurement target region S is imaged by the imaging device 5 (step S13). The captured image data is stored in the storage unit 14 via the I / F unit 12 (step S14).

  Next, the image analysis unit 15 reads the image data before displacement and the image data after displacement from the storage unit 14, and performs analysis based on a predetermined image analysis method (step S15).

  As the image analysis method, a digital image correlation method is used. Since there are many image analysis methods for obtaining the displacement amount and the moving direction using two images, detailed description thereof is omitted.

  In the present embodiment, as shown in FIG. 4, based on the image data before and after displacement, for example, the center of the measurement target region S is set as a base point X by the user, and index points are arranged on a plurality of concentric circles centered on the base point. Is set. The index point is set, for example, at each point where the reference line L divided into 64 in the circumferential direction around the base point X intersects with a plurality of concentric circles.

  Then, the image analysis unit 15 obtains a change in the distance between the base point X and each index point (radial direction) from the image data before and after the displacement, and the distance change is determined by the distance between the base point X and each index point. By dividing, the distortion in the direction of each index point (radial direction) from the base point X is calculated.

  It should be noted that a change in distance between two index points (diameter direction) that is symmetrical with respect to the base point X is obtained from the image data before and after displacement, and the base point X is determined by dividing the distance change by the distance between the index points. You may make it calculate the distortion | strain of 2 index point directions (diameter direction) made symmetrical.

  The image analysis unit 15 creates a strain distribution around the base point X based on the calculated strain, and causes the output unit 17 to output the strain distribution on the display screen 10a.

  FIG. 5 shows a display example of the strain distribution. This display example shows an example when a predetermined vertical load is applied to the concrete formed in a rectangular parallelepiped shape. However, the user acts to extend in the X direction around the base point X, and Y It is easy to understand that a shrinking force acts in the direction and no force acts in the XY direction, which is effective in evaluating the current stress state of concrete.

  In this way, the strain in a predetermined direction is calculated based on the distance change between the two index points in the radial direction centered on the base point or the two index points that are point-symmetric with respect to the base point. Basically, if the strain distribution around the base point is output, it is possible to measure the strain with high accuracy even when the displacement is small. Further, the strain distribution around the base point can be easily grasped by the strain distribution. For example, if an abnormal value is detected, it is possible to know a situation such as a crack near the index point. In addition, a plurality of strain measurements can be performed at the same location, and the strain generated in the DUT 2 can be easily grasped in a plane.

  Further, the image analysis unit 15 calculates a stress generated in the DUT 2. The stress is calculated by extracting a combination of strains in three or four axes for rosette analysis that can analyze the plane strain state based on the base point. Generally, as a type of rosette used in rosette analysis, three directions of equiangular triaxial type that calculates stress from strain in triaxial direction that makes an angle of 120 ° or 45 ° based on the base point, or right angle triaxial type A method known as a double-right quadrature type or a T-delta four-axis type four-way measurement rosette that calculates stress from four-axis strain that forms an angle of 45 ° based on the measurement rosette or base point is known. ing.

  The stress calculation method in the right-angle triaxial type will be described below as an example.

  For example, as shown in FIG. 6, if strains a to c in the x-axis direction, the y-direction, and the x-direction and the xy-direction that form an angle of 45 degrees with the y-direction from the same point are obtained, It has been conventionally known that the maximum (minimum) principal stress in a measured object is obtained from the following equation (Equation 1).

  That is, in the present embodiment, a plurality of combinations of the strains in the three axial directions are extracted from the same base point, and after calculating the stress obtained by each combination, an average of them is calculated. Thereby, since many strain analysis results can be obtained from the same base point, highly accurate strain measurement is possible.

  Specifically, for example, in FIG. 4, the index point is arranged at a point where the line L divided into 64 in the circumferential direction around the base point X intersects each of the plurality of concentric circles. In one of the circles, it is possible to extract 64 combinations of different triaxial directions from the base point X in the radial direction. Therefore, the image analysis unit 15 calculates the average after calculating the stress based on the strain in the triaxial direction including 64 combinations.

  However, it is not always necessary to calculate the average of the principal stresses in each of the 64 combinations, and some combinations may be extracted at random to calculate the average of the stresses in the combinations.

  In the above embodiment, combinations of different triaxial directions in the radial direction are extracted from the base point X. However, different combinations of triaxial directions in the diameter direction with the base point X being point-symmetric are extracted. It doesn't matter. In that case, in the above-described embodiment, 32 combinations of different three-axis directions can be extracted.

  Here, in order to verify the measurement accuracy of the strain, when a vertical load (P = 1335 kN) was applied using a concrete, which is a non-uniform material formed in a rectangular parallelepiped having a width of 370 mm, a depth of 240 mm, and a height of 470 mm, as a test body The resulting stress was analyzed using a strain measurement system. The analysis results are shown in FIG.

Based on the analysis result shown in FIG. 5, 16 combinations of strains in the triaxial direction are extracted at random and the strain is analyzed. As a result of calculating the average value of the principal stress, the maximum principal stress σ1 is 15. It was 75 N / mm ² .

On the other hand, if the principal stress is calculated by a general calculation formula, σ1 ′ = loaded load / cross-sectional area is 15.03 N / mm ² , so the analysis result and the calculated value are almost the same, and the accuracy is high. Was confirmed.

  When measuring with a strain gauge, problems such as variations with very large errors occur depending on the measurement position, but the strain analysis according to the present invention can easily increase the accuracy.

  In addition, the index point set away from the base point X in the circumferential direction due to local deformation or the shape of the measurement object as in the stress release experiment is not affected by the deformation. In these cases, a fixed point that is not affected by deformation can be set, so the measurement target area is expanded so that the fixed point is included, and the movement state (moving direction and moving amount) of the fixed point from the image data before and after the displacement. When the strain analysis is performed, the movement state of the fixed point is referred to and corrected, so that the influence of the imaging device moving due to some factor can be removed and the accuracy of strain measurement is further improved. It becomes possible. Specifically, when the fixed point in the image data before and after the displacement moves, the moving amount and direction of the fixed point may be corrected for the image data after the displacement. It is also possible to arbitrarily create a fixed point by capturing a fixed point that is not affected by the deformation of the measurement object on the analysis image before and after the displacement.

  As another embodiment, in the state where a vertical load (P = 1335KN) is applied to the test body used in FIG. 5, a circular hole having a diameter of 50 mm (depth of 50 mm) is provided and near the center of the side surface of the test body. The stress is released, the state of strain change before and after the stress release is analyzed, and the result is shown in FIG. The index points analyzed at this time are defined from the vicinity of the outer circumference of the hole to the outside, the strain in the direction of each index point is calculated from the base point before and after stress release in the same manner as in the above embodiment, and the strain distribution is output. It is a thing.

  As is clear from the analysis result (strain distribution diagram) shown in FIG. 7, the state of contraction in the vertical direction in the vicinity of the circular hole, the state of elongation in the horizontal direction, and the state of no strain in the direction extending at 45 ° around the base point It was confirmed that. From this result, it was confirmed that the strain distribution can be easily analyzed even when the end of the object to be measured is circular. In addition, when calculating | requiring stress, it is possible to calculate | require easily by calculating back the variation | change_quantity of strain distribution by FEM analysis etc.

  In the present invention, if the strain measurement of a measurement target point is likely to vary with a material such as concrete, or if the measurement target is an uneven shape or a soft material, it is difficult to attach a strain gauge. Therefore, it is particularly effective when it is difficult to attach a strain gauge or when it is desired to precisely measure the strain distribution in a portion where the strain change is large.

  Moreover, this embodiment is one form and is not limited to this form.

It is a schematic block diagram of a strain measurement system. It is a schematic block diagram of an analyzer. It is a flowchart figure of a strain measurement system. It is an enlarged view which shows the index point set to a measurement object area | region. It is a strain distribution figure at the time of a uniaxial compression test. It is explanatory drawing used when calculating | requiring stress by an example of a rosette analysis. It is a strain distribution figure when performing a core removal test.

Explanation of symbols

S measurement object region 2 object to be measured 5 optical measurement device 10 analysis device

Claims (7)

An arbitrary base point on the object to be measured, and a plurality of index points on a plurality of concentric circles centered on the base point, and the surface before and after the deformation of the object to be measured is optical so that the base point and the index points are included. An image data acquisition step of imaging with an imaging device and acquiring image data before and after the deformation;
The distance between the base point and each index point is calculated from the image data before and after the deformation, the strain in the direction of each index point is calculated from the base point, and the strain distribution around the base point is analyzed based on the calculation result Analysis process to
A strain measuring method characterized by comprising: An arbitrary base point on the object to be measured, and a plurality of index points on a plurality of concentric circles centered on the base point, and the surface before and after the deformation of the object to be measured is optical so that the base point and the index points are included. An image data acquisition step of imaging with an imaging device and acquiring image data before and after the deformation;
From the image data before and after the deformation, a change in the distance between two index points that are symmetrical with respect to the base point is calculated, strains in the direction of the respective index points are calculated from the base point, and strain distribution around the base point is calculated based on the calculation result An analysis process for analyzing
A strain measuring method characterized by comprising:   The strain measurement method according to claim 1, further comprising a stress calculation step of calculating a stress acting on the base point based on the strain distribution.   The strain measurement method according to claim 3, wherein the stress is obtained by extracting a plurality of combinations of strains for rosette analysis based on the base point, and calculating an average value of stress obtained by each combination.   Based on the base point, a fixed point at which the object to be measured is not affected by deformation is set, and the fixed point is included in a region imaged by the optical imaging device. 5. The moving direction and moving amount of the fixed point are obtained, and the image data after displacement is corrected based on the moving direction and moving amount of the fixed point. Strain measurement method. An arbitrary base point on the object to be measured, and a plurality of index points on a plurality of concentric circles centered on the base point, and the surface before and after the deformation of the object to be measured is optical so that the base point and the index points are included. Image data acquisition means for acquiring an image data before and after being imaged by an imaging device;
The distance between the base point and each index point is calculated from the image data before and after the deformation, the strain in the direction of each index point is calculated from the base point, and the strain distribution around the base point is analyzed based on the calculation result Analysis means to
A strain measurement system comprising: An arbitrary base point on the object to be measured, and a plurality of index points on a plurality of concentric circles centered on the base point, and the surface before and after the deformation of the object to be measured is optical so that the base point and the index points are included. Image data acquisition means for acquiring an image data before and after being imaged by an imaging device;
From the image data before and after the deformation, a change in the distance between two index points that are symmetrical with respect to the base point is calculated, strains in the direction of the respective index points are calculated from the base point, and strain distribution around the base point is calculated based on the calculation result An analysis means for analyzing
A strain measurement system comprising:

Images