JP2009231627A - Substrate treatment device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate treatment device capable of improving reliability of substrate transport in an interface part. <P>SOLUTION: This substrate treatment device 10 is provided with a treatment part 3 and an IF part 5, and the IF part 5 is adjacent to an exposure machine EXP separate from the device 10. The IF part 5 includes a second main transport mechanism T<SB>IFM</SB>transporting a substrate W to the exposure machine EXP, and a second spare transport mechanism T<SB>IFS</SB>transporting a substrate W to the exposure machine EXP in lieu of the second main transport mechanism T<SB>IFM</SB>. Accordingly, the second spare transport mechanism T<SB>IFS</SB>can transport the substrate in lieu of the second main transport mechanism T<SB>IFM</SB>even when the function of the second main transport mechanism T<SB>IFM</SB>is degraded. Thereby, reliability of the substrate transport in the IF part 5 is high and the device 10 and the exposure machine EXP can stably operate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus for performing a series of processes on a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a substrate for an optical disk, etc. (hereinafter simply referred to as “substrate”).

Conventionally, as this type of apparatus, there is an apparatus for forming a resist film on a substrate and developing the substrate exposed by a separate exposure machine. The apparatus is roughly divided into an indexer unit, a processing unit, and an interface unit. The indexer unit includes a transport mechanism that transports the substrate to the processing unit. The processing unit includes a plurality of processing units that perform predetermined processing on the substrate. The interface unit includes a transport mechanism that transports the substrate to the processing unit and the exposure machine. Then, a series of processing is performed on the substrate while reciprocating the substrate between the indexer unit, the processing unit, the interface unit, and a separate exposure machine (see, for example, Patent Document 1).
JP 2003-324139 A

However, the conventional example having such a configuration has the following problems.
In other words, in the conventional apparatus, when a trouble occurs in the transport mechanism of the interface unit, the interface unit cannot normally transfer the substrate to and from the exposure machine. In this case, not only the exposure machine but also the substrate transport and substrate processing of the processing unit and the indexer unit are directly affected. As a result, the operation rate of the apparatus and the separate exposure machine is reduced.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate processing apparatus capable of improving the reliability of substrate transport in the interface section.

In order to achieve such an object, the present invention has the following configuration.
That is, the invention described in claim 1 is provided in a substrate processing apparatus that performs processing on a substrate, adjacent to a processing unit that performs processing on a substrate, and an exposure machine separate from the processing unit and the apparatus. The interface unit includes an interface unit having a main transport mechanism that transports the substrate to the exposure machine, and a preliminary transport mechanism that transports the substrate to the exposure machine in place of the main transport mechanism. It is characterized by this.

  [Operation / Effect] According to the invention described in claim 1, since the preliminary transport mechanism for transporting the substrate to the exposure apparatus is provided instead of the main transport mechanism, the function of the main transport mechanism is temporarily deteriorated. Even so, the preliminary transport mechanism can transport the substrate instead of the main transport mechanism. Therefore, the reliability of the substrate transport in the interface unit is high, and the entire apparatus and the exposure machine can operate stably.

  In the present invention, the preliminary transport mechanism is configured to be displaceable to a standby area that is out of the main transport area, which is a movable area when the main transport mechanism transports the substrate, and the main transport mechanism is movable when the preliminary transport mechanism transports the substrate. It is preferable to be configured to be displaceable to a retreat area that is out of the preliminary transport area, which is an area (Claim 2). A standby area and a save area are formed in the interface unit. Then, the main transport mechanism can transport the substrate suitably by displacing the preliminary transport mechanism to the standby area. Further, the main transport mechanism is displaced to the retreat area, so that the preliminary transport mechanism can suitably carry the substrate.

  In the present invention, the interface unit and the exposure unit are adjacent to each other in a plan view, and a direction in which the interface unit and the exposure unit are arranged in a plan view is a horizontal first direction. It is preferable that the evacuation area is deviated in an arbitrary direction substantially orthogonal to each other, and the evacuation area is deviated in an arbitrary direction substantially orthogonal to the horizontal first direction from the preliminary conveyance area. The interface unit and the exposure device are arranged in the first horizontal direction in plan view. Since the standby area deviates from the main conveyance area in a direction substantially perpendicular to the first horizontal direction, the main conveyance area can be suitably formed at a position facing the delivery position with the exposure machine. For this reason, even when the standby area is provided in the interface unit, the main transport mechanism can efficiently transport the substrate. Similarly, since the evacuation area deviates from the preliminary transport area in a direction substantially perpendicular to the first horizontal direction, the preliminary transport area can be formed at a suitable position, and the preliminary transport mechanism also efficiently transports the substrate. Can do.

  In the present invention, it is preferable that the processing unit, the interface unit, and the exposure unit are arranged in a line in the first horizontal direction in this order in plan view. In plan view, the processing unit and the exposure unit are aligned in the first horizontal direction with the interface unit interposed therebetween. Since the standby area deviates from the main conveyance area in a direction substantially orthogonal to the first horizontal direction, a main conveyance area including the shortest path connecting the processing unit and the exposure machine can be formed. Therefore, the efficiency of substrate transfer by the main transfer mechanism is good. Similarly, since the evacuation area deviates from the preliminary conveyance area in a direction substantially perpendicular to the first horizontal direction, a preliminary conveyance area including the shortest path connecting the processing unit and the exposure machine can be formed. Therefore, the efficiency of substrate transport by the preliminary transport mechanism is also good.

  In the present invention, the main transport area and the preliminary transport area are substantially coincident, the standby area is provided on one side of the main transport area, and the retreat area is opposed to the standby area across the main transport area. (Claim 4). There is no possibility that the main transport mechanism and the preliminary transport mechanism interfere with each other at the time of switching.

  In the present invention, it is preferable that the preliminary transport mechanism is capable of moving the main transport mechanism from the main transport area toward the retreat area. The main transport mechanism can be reliably retracted to the retracting area.

  In the present invention, it is preferable that the preliminary transport mechanism can be moved to the retreat area by directly pressing the main transport mechanism located in the main transport area. The configuration of the main transport mechanism and the preliminary transport mechanism can be simplified.

  In the present invention, the preliminary transport mechanism includes a movable base that moves in a horizontal second direction that is substantially orthogonal to the horizontal first direction, and a holding arm that is supported by the movable base and holds the substrate. By moving, it is preferable that the holding arm moves from the standby area to the preliminary conveyance area together with the movable base and pushes the main conveyance mechanism located in the main conveyance area toward the retreat area. Since the preliminary conveyance area substantially coincides with the main conveyance area, the main conveyance mechanism can be suitably pushed by moving the preliminary conveyance mechanism from the standby area to the preliminary conveyance area.

  In the present invention, it is preferable that at least one of the main transport mechanism and the preliminary transport mechanism includes a buffer material that absorbs an impact when the preliminary transport mechanism presses the main transport mechanism. The main transport mechanism and the preliminary transport mechanism can be appropriately brought into contact with each other, and the main transport mechanism or the preliminary transport mechanism can be prevented from being damaged.

  In the present invention, the interface unit guides the preliminary transport mechanism over the standby region and the preliminary transport region, and a common guide member that guides the main transport mechanism over the main transport region and the retreat region on the same track as the preliminary transport mechanism. It is preferable to provide (Claim 9). The apparatus configuration can be simplified. In addition, since the main transport mechanism and the preliminary transport mechanism move along the same shared guide member, the preliminary transport mechanism can reliably push the main transport mechanism.

  In the present invention, the main transport mechanism is displaced from the main transport area to the retracted area, and the preliminary transport mechanism is displaced from the standby area to the preliminary transport area, and the controller is configured to switch the main transport mechanism to the preliminary transport mechanism to perform substrate transport. (Claim 10). By providing the control unit, it is possible to preferably continue the substrate transport by switching from the main transport mechanism to the preliminary transport mechanism.

  In the present invention, the main transport mechanism is displaced from the main transport area to the retracted area, and the preliminary transport mechanism is displaced from the standby area to the preliminary transport area, and the controller is configured to switch the main transport mechanism to the preliminary transport mechanism to perform substrate transport. The controller preferably drives the preliminary transport mechanism to move the main transport mechanism to the retreat area when switching from the main transport mechanism to the preliminary transport mechanism. Since it is not necessary to drive the main transport mechanism to move to the retreat area, switching can be realized with simple control.

  In the present invention, the main transport mechanism is displaced from the main transport area to the retracted area, and the preliminary transport mechanism is displaced from the standby area to the preliminary transport area, and the controller is configured to switch the main transport mechanism to the preliminary transport mechanism to perform substrate transport. The control unit can drive the main transport mechanism to move it to the retreat area when switching from the main transport mechanism to the spare transport mechanism, and in this case, the main transport mechanism can be positioned in the retreat area. If not, it is preferable to drive the preliminary transport mechanism to move the main transport mechanism to the retreat area (claim 12). Since the main transport mechanism is moved to the retreat area in two stages, ie, driving of the main transport mechanism and driving of the preliminary transport mechanism, switching from the main transport mechanism to the preliminary transport mechanism can be performed more reliably.

  In the present invention, when the control unit drives the preliminary transport mechanism to move the main transport mechanism to the retreat area, it is preferable that the main transport mechanism is previously brought into an unlocked state in which the main transport mechanism can be freely moved from the main transport area to the retreat area. (Claim 13). The main transport mechanism can be suitably moved.

  In the present invention, when the main transport mechanism holds the substrate when switching from the main transport mechanism to the spare transport mechanism, the control unit stops transporting the substrate and moves the main transport mechanism to the retreat area. It is preferable that the substrate transport by the transport mechanism is started from the subsequent substrate. Even when the main transport mechanism holds the substrate when performing the switching control, priority is given to the main transport mechanism itself being retracted to the retreat area over the transport of the substrate. As a result, switching can be performed more reliably. After switching, the preliminary transport mechanism transports the substrate subsequent to the substrate held by the main transport mechanism. Thereby, the board | substrate conveyance in an interface part can be recovered rapidly.

  In the present invention, a detection unit that detects at least one of the position, damage and dirt of the main transport mechanism, and the control unit determines that an abnormality has occurred in the main transport mechanism based on the detection result of the detection unit Is preferably switched from the main transport mechanism to the preliminary transport mechanism. By providing the detection unit, the control unit can detect an abnormality in the main transport mechanism and can switch at a suitable timing.

  In the present invention, it is preferable that the main transport mechanism transports the substrate also to the processing unit, and the preliminary transport mechanism transports the substrate to the processing unit instead of the main transport mechanism. Since the preliminary transport mechanism for transporting the substrate to the processing unit is provided instead of the main transport mechanism, the reliability of the substrate transport with respect to the main transport mechanism of the interface unit is high.

  In the present invention, the processing unit includes a plurality of substrate processing columns each having a processing unit that processes a substrate and a main transfer mechanism for a processing unit that transfers the substrate to the processing unit. Preferably, the substrate is processed, and the main transfer mechanism and the preliminary transfer mechanism transfer the substrate to each substrate processing row. Since the processing unit has a plurality of substrate processing rows, the reliability of substrate transport in the processing unit is also high.

  In the present invention, the processing unit includes a plurality of substrate processing columns each having a processing unit that processes a substrate and a main transfer mechanism for a processing unit that transfers the substrate to the processing unit. The substrate is processed, and the interface unit is provided separately for each substrate processing row, and transports the substrate to and from the corresponding substrate processing row and also transfers the substrate between the main transport mechanism and the preliminary transport mechanism. It is preferable that a plurality of sub-transport mechanisms that perform delivery are provided. Since the interface unit includes a plurality of sub-transport mechanisms for transporting the substrate to each substrate processing row, the reliability of substrate transport from the interface unit to the processing unit can be increased. Moreover, since the processing unit has a plurality of substrate processing rows, the reliability of substrate transport in the processing unit can be improved.

  In the present invention, it is preferable that each sub-transport mechanism is disposed on the processing unit side in the interface unit, and the main transport mechanism and the preliminary transport mechanism are disposed on the exposure machine side in the interface unit. Since the main transport mechanism, the preliminary transport mechanism, and the sub-transport mechanism are each disposed near the exposure machine or processing unit that is the transport destination, the amount of operation during substrate transport can be suppressed, and transport efficiency is good.

  In the present invention, it is preferable that the substrate processing rows are arranged in the vertical direction, and the sub-transport mechanisms are respectively arranged in the vertical direction while facing the corresponding substrate processing rows. . Since the plurality of sub transport mechanisms are provided side by side in the vertical direction, an increase in the installation area of the interface unit can be suppressed.

  In the present invention, it is preferable that a first blocking member for blocking the atmosphere is provided between the sub-transport mechanisms (claim 21). The atmosphere around each sub-transport mechanism can be kept clean.

  The present specification also discloses an invention relating to the following substrate processing apparatus.

  (1) In the substrate processing apparatus according to claim 18, each substrate processing row includes a post-exposure heat treatment (PEB: Post Exposure Bake) unit for performing heat treatment on the substrate exposed by the exposure machine, and is used for main transfer for the processing section. A substrate processing apparatus, wherein the mechanism transports a substrate to a post-exposure heat treatment unit.

  According to the invention described in (1) above, the main transport mechanism and the preliminary transport mechanism may pass the substrate discharged from the exposure machine to the processing section main transport mechanism without transporting it to the post-exposure heat treatment unit. . For this reason, the transport burden of the main transport mechanism and the preliminary transport mechanism can be relatively reduced, and the reliability of the interface unit can be further increased.

  (2) In the substrate processing apparatus according to claim 18, the first placement unit for the main transport mechanism and the preliminary transport mechanism to transfer the substrate to and from the main transport mechanism for the processing unit of each substrate processing row. A substrate processing apparatus comprising:

  According to the invention described in (2) above, the main transport mechanism and the preliminary transport mechanism can transport the substrate suitably to the processing unit.

  (3) The substrate processing apparatus according to (2), wherein the first placement unit is provided separately for each substrate processing row.

  According to the invention as described in said (3), the main conveyance mechanism and the preliminary conveyance mechanism can convey a board | substrate suitably with respect to a process part.

  (4) The substrate processing apparatus according to (2) or (3), wherein the first placement portions are provided side by side in the vertical direction.

  According to the invention described in (4) above, the main transport mechanism and the preliminary transport mechanism can suppress the amount of lateral movement when accessing each of the first placement units. That is, the main transport area and the preliminary transport area can be suppressed to a relatively small range in plan view. Therefore, the installation area of the interface unit can be reduced.

  (5) In the substrate processing apparatus according to any one of claims 19 to 22, each substrate processing row includes a post-exposure heat treatment (PEB) unit that performs heat treatment on the substrate exposed by the exposure machine. The post-exposure heat treatment unit is disposed at a position facing the sub-transport mechanism, and the sub-transport mechanism transports the substrate to the post-exposure heat treatment unit.

  According to the invention described in (5) above, since the sub-transport mechanism provided in the interface unit transports the substrate to the post-exposure heat treatment unit provided in the substrate processing row, the substrate is exposed. The time until the heat treatment after exposure can be suitably managed and adjusted. Therefore, the substrate can be processed with high accuracy.

  (6) In the substrate processing apparatus according to any one of claims 19 to 22, the interface section is provided separately corresponding to each sub-transport mechanism, and each sub-transport mechanism includes a main transport mechanism and a preliminary transport mechanism. A substrate processing apparatus, comprising: a plurality of second placement portions for delivering a substrate to and from the substrate.

  According to the invention described in (6), it is possible to suitably transfer the substrate between each sub-transport mechanism, the main transport mechanism, and the preliminary transport mechanism.

  (7) The substrate processing apparatus according to (6), wherein the second placement units are provided side by side in the vertical direction.

  According to the invention described in (7) above, the main transport mechanism, the preliminary transport mechanism, and the sub transport mechanism can suppress the amount of lateral movement when accessing the second placement unit. Therefore, the installation area of the interface unit can be reduced.

  (8) In the substrate processing apparatus according to (6) or (7), each second placement unit is disposed on the processing unit side in the interface unit and on the side of the corresponding sub-transport mechanism. A substrate processing apparatus.

  The length of the interface portion in the first horizontal direction can be shortened, and the installation area of the interface portion can be reduced.

  (9) In the substrate processing apparatus of the twentieth aspect, a second blocking member for blocking the atmosphere is provided between the main transfer mechanism, the preliminary transfer mechanism, and the sub-transfer mechanism, and the second A substrate processing apparatus, wherein the blocking member is formed with an opening for allowing a substrate to be transferred between the main transport mechanism, the preliminary transport mechanism, and each of the sub transport mechanisms.

  The atmosphere around the main transport mechanism and the spare transport mechanism and the atmosphere around the sub transport mechanism can be kept clean.

  (10) The substrate processing apparatus according to claim 3 or 4, wherein the standby area is provided on a side of the main transfer area.

  (11) The substrate processing apparatus according to claim 3 or 4, wherein the standby area is deviated above or below the main transfer area.

  (12) In the substrate processing apparatus according to any one of (3), (4), (10), and (11), the retreat area is provided on a side of the preliminary transfer area. Substrate processing equipment.

  (13) In the substrate processing apparatus according to any one of (3), (4), (10), and (11), the retreat area is located above or below the preliminary transfer area. A substrate processing apparatus.

  As in the inventions described in (10) to (13), an appropriate direction is selected as “an arbitrary direction substantially orthogonal to the first horizontal direction” described in claim 3.

  (14) In the substrate processing apparatus according to claim 3 or 4, the standby area is out of one side in the vertical direction of the main transfer area, and the retreat area is out of the other side in the vertical direction of the preliminary transfer area. A substrate processing apparatus.

  According to the invention as described in said (14), it can suppress that the installation area of an interface part increases.

  (15) In the substrate processing apparatus according to (14), one of the main transport mechanism and the preliminary transport mechanism is provided independently at a lower portion of the interface unit, and the other is suspended and supported at the upper portion of the interface unit. A substrate processing apparatus.

  According to the invention as described in said (15), a main conveyance area | region and a preliminary | backup conveyance area | region can be arrange | positioned suitably.

  (16) In the substrate processing apparatus according to (14) or (15), a third blocking member for blocking the atmosphere is provided between the main transfer mechanism and the preliminary transfer mechanism so as to be movable up and down. A substrate processing apparatus.

  According to the invention described in (16) above, the atmosphere around the main transport area and the atmosphere around the preliminary transport area can be kept clean.

  (17) In the substrate processing apparatus according to any one of (14) to (16), the main transport mechanism includes a base provided in the retreat area and a lift that is supported by the base and expands and contracts in a substantially vertical direction. And a holding arm that is supported by the elevating shaft and holds the substrate, and the elevating shaft expands and contracts to move the holding arm into the retreat area, and the preliminary conveyance mechanism has the same configuration as the main conveyance mechanism. Then, the holding arm moves into the standby area when the elevating shaft of the preliminary transport mechanism expands and contracts.

  According to the invention as described in said (17), the suitable main transport mechanism which can be displaced to a evacuation area | region is realizable. Similarly, a suitable preliminary transport mechanism that can be displaced to the standby area can be realized.

  (18) The substrate processing apparatus according to any one of claims 1 to 22, wherein the main transport mechanism is configured in the same manner as the preliminary transport mechanism.

  (19) In the substrate processing apparatus according to any one of claims 6 to 9 and 11 to 13, the main transport mechanism includes a movable base that moves in a horizontal direction, and a substrate supported by the movable base. A substrate processing apparatus comprising: a holding arm for holding the substrate, wherein the holding arm moves from the main transfer area to the retreat area together with the movable stage when the movable table moves.

  According to the inventions described in (18) and (19), the device configuration can be simplified.

  (20) The substrate processing apparatus according to any one of claims 11 to 16, further comprising: an input unit that receives a command related to switching from a user, wherein the control unit is based on the command input to the input unit. A substrate processing apparatus characterized by switching from a transport mechanism to a preliminary transport mechanism.

  According to the invention described in (20) above, by providing the input unit, it is possible to switch at an arbitrary timing such as when no abnormality occurs in the main transport mechanism.

  (21) The substrate processing apparatus according to claim 17 or 18, wherein the main transport mechanism and the preliminary transport mechanism stop the substrate transport for the substrate processing row in which an abnormality has occurred. apparatus.

  (22) The substrate processing apparatus according to any one of claims 19 to 22, wherein the sub-transport mechanism corresponding to the substrate processing row in which an abnormality has occurred stops the substrate transport.

  (23) The substrate processing apparatus according to any one of claims 1 to 22, wherein the atmosphere around the main transport mechanism and the atmosphere around the preliminary transport mechanism are in communication with each other. .

  According to the invention described in (23), since it is not partitioned by a blocking plate or the like, switching from the main transport mechanism to the preliminary transport mechanism can be performed quickly.

  According to the substrate processing apparatus of the present invention, since the preliminary transport mechanism for transporting the substrate to the exposure machine is provided instead of the main transport mechanism, even if the function of the main transport mechanism is temporarily lowered, Instead of the transport mechanism, the preliminary transport mechanism can transport the substrate. Therefore, the reliability of substrate conveyance in the interface unit is high, and the entire apparatus including the processing unit can be stably operated.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to an embodiment, FIGS. 2 and 3 are schematic side views showing the arrangement of processing units of the substrate processing apparatus, and FIG. 4 is an aa arrow. FIG.

  The embodiment is a substrate processing apparatus 10 that forms a resist film on a substrate (for example, a semiconductor wafer) W and develops the substrate W exposed by the exposure machine EXP. The exposure machine EXP is separate from the substrate processing apparatus 10. The substrate processing apparatus 10 includes an indexer section (hereinafter referred to as “ID section”) 1, a processing section 3, and an interface section (hereinafter referred to as “IF section”) 5. The ID unit 1, the processing unit 3, the IF unit 5, and the exposure unit EXP are arranged in one row so as to be arranged in this order in plan view. In this specification, one horizontal direction in which these are arranged is described as an “x-axis direction”, and a direction perpendicular to the x-axis direction is described as a “y-axis direction”. The x-axis direction corresponds to the horizontal first direction in the present invention. The y-axis direction corresponds to the second horizontal direction in the present invention. Hereinafter, each part will be described.

[ID part 1]
The cassette C containing the substrate W is transported to the ID unit 1 by an external transport mechanism (not shown). The ID unit 1 transports the substrate W in the cassette C to and from the processing unit 3. The ID unit 1 includes a mounting table 8 and a transport unit 9. The mounting table 8 and the transport unit 9 are provided adjacent to each other so as to be aligned in the x-axis direction in plan view. The processing unit 3 is adjacent to the side of the transport unit 9 opposite to the side on which the mounting table 8 is provided.

  The mounting table 8 mounts the cassette C described above. In the present embodiment, the mounting table 8 mounts a plurality (four) of cassettes C. The mounting table 8 mounts the cassettes C so as to be arranged in a line in the y-axis direction while facing the transport units 9. A plurality of substrates W are accommodated in the cassette C, and are arranged in the vertical direction in a horizontal posture.

The transport unit 9 transports the substrate W. The transport unit 9 is provided with a first main transport mechanism T _IDM and a first preliminary transport mechanism T _IDS . The first main transport mechanism T _IDM transports the substrate W to the cassette C and the processing unit 3. The first preliminary transport mechanism _{T IDS} a spare of the first main transport mechanism _{T IDM,} transports the substrate W to the cassette C and the processing unit 3 in place of the first main transport mechanism _{T IDM.}

Please refer to FIG. 2 and FIG. FIG. 5 is a front view of the transport unit. In FIG. 5, the direction perpendicular to the paper surface is the x-axis direction. In the transport unit 9, a first standby area Aa1 and a first retreat area Aa2 are formed. The first standby area Aa1 is a space where the first preliminary transport mechanism T _IDS is positioned when the first main transport mechanism T _IDM transports the substrate. The first retreat area Aa2 is a space for retracting the first main transport mechanism T _IDM when the first preliminary transport mechanism T _IDS transports the substrate.

The first standby area Aa1 is provided at a position deviated to one side in the y-axis direction from a movable area (hereinafter referred to as “first main transport area Aa3”) when the first main transport mechanism T _IDM transports the substrate. The first evacuation area Aa2 is provided at a position off the other side in the y-axis direction from the movable area (hereinafter, referred to as “first preliminary conveyance area Aa4”) during substrate conveyance of the first preliminary conveyance mechanism T _IDS . The first main transport mechanism T _IDM is configured to be displaceable from the first main transport area Aa3 to the first retreat area Aa2, and the first preliminary transport mechanism T _IDS is displaceable from the first standby area Aa1 to the first preliminary transport area Aa4. Configured.

  The first main transport area Aa3 and the first preliminary transport area Aa4 are formed so as to face the delivery position between the cassette C and the processing unit 3, respectively. In the present embodiment, the first main transport area Aa3 and the first preliminary transport area Aa4 substantially coincide. Therefore, the first standby area Aa1 and the first evacuation area Aa2 face each other in the horizontal direction with the first main transport area Aa3 (first preliminary transport area Aa4) interposed therebetween.

The first standby area Aa1, the first main transfer area Aa3, the first preliminary transfer area Aa4, and the first retreat area Aa2 are not partitioned, and the areas Aa1, Aa2, Aa3 (Aa4) communicate with each other. Yes. That is, the atmosphere around the first main transport mechanism T _{IDM communicates} with the atmosphere around the first preliminary transport mechanism T _IDS and is not blocked.

  The lateral width, which is the length in the y-axis direction, of the transport unit 9 is longer than that of the mounting table 8 and the processing unit 3. Both sides of the transport unit 9 protrude laterally (y-axis direction) from the mounting table 8 and the processing unit 3. A first standby area Aa1 and a first evacuation area Aa2 are arranged at each position where the transfer unit 9 protrudes. The conveyance part 9 has the side wall 11 which protrudes on both sides and is standingly arranged. A plurality of (two) opening / closing portions 11a capable of opening the first standby area Aa1 and the first evacuation area Aa2 to the outside are formed on the side wall 11 (in FIG. 2, the first standby area Aa1 and the first evacuation area 1a The opening / closing part 11a closing the area Aa2 is indicated by a solid line, and the opening / closing part 11a being open is indicated by a dotted line).

The transport unit 9 guides the first preliminary transport mechanism T _IDS from the first standby area Aa1 to the first main transport area Aa3, and moves the first main transport mechanism T _IDM on the same track as the first preliminary transport mechanism T _IDS. A guide rail 12 is provided for guiding from the first main transport area Aa3 to the first retreat area Aa2. The guide rail 12 is fixed to the lower part of the transport unit 9 in parallel with the y-axis direction. Both ends of the guide rail 12 reach the first standby area Aa1 and the first retreat area Aa2.

The first main transport mechanism T _IDM and the first preliminary transport mechanism T _IDS are configured in the same manner. That is, each includes a movable base 13, a lifting shaft 14, a rotating arm 15, and a holding arm 16. The movable table 13 includes a drive mechanism including a motor (not shown) and is guided by the guide rail 11 to move back and forth in the y-axis direction. The drive mechanism of the movable table 13 is configured to be controlled to an unlocked state that is movable in the y-axis direction.

  The lower end of the lifting shaft 14 is connected to the movable table 13. The elevating shaft 14 extends and contracts in the vertical direction, whereby the upper end of the elevating shaft 14 moves up and down with respect to the movable table 13. One end of the rotary arm 15 is linked and connected to the upper part of the lifting shaft 14. The rotary arm 15 rotates around the vertical axis around one end thereof, and thereby the other end of the rotary arm 15 rotates in a horizontal plane. One end of the holding arm 16 is slidably attached to the rotary arm 15. The holding arm 16 moves back and forth in the turning radius direction of the rotary arm 15. The other end of the holding arm 16 holds the substrate W.

Then, as the movable base 13 of the first main transport mechanism T _IDM moves in the y-axis direction, the elevating shaft 14, the rotary arm 15 and the holding arm 16 are integrated together as a first retreat from the first main transport area Aa3. Move to area Aa2.

Similarly, as the movable base 13 of the first preliminary transport mechanism T _IDS moves in the y-axis direction, the lift shaft 14, the rotary arm 15 and the holding arm 16 are integrated with each other from the first standby area Aa1 to the first main area. Move to the transport area Aa3. At this time, the first preliminary transport mechanism T _IDS is configured to move toward the first retreat area Aa2 by directly pressing the first main transport mechanism T _IDM located in the first main transport area Aa3.

The first main transport mechanism T _IDM and the first preliminary transport mechanism T _IDS are further provided with a buffer material 17 that absorbs an impact when they contact each other. The buffer material 17 is attached to the side portion of each lifting shaft 14.

Further, a position detection sensor 19 for detecting the position of the first main transport mechanism T _IDM such as the position and orientation of the holding arm 16 is provided (see FIG. 9). Examples of the position detection sensor 19 include an encoder that detects a rotation angle of a motor (not shown) such as the movable base 13 and the lifting shaft 14. The detection result of the position detection sensor 19 is given to the control unit 93 described later.

[Processing unit 3]
The processing unit 3 includes processing blocks Ba and Bb connected in the x-axis direction. The transport unit 9 is adjacent to the processing block Ba, and the IF unit 5 is adjacent to the processing block Bb. Each processing block Ba, Bb has a plurality (two) of layers K in the vertical direction.

  Processing unit main transport mechanisms T1 and T2 are provided on the upper levels K1 and K2 of the processing blocks Ba and Bb, respectively. The layers K1 and K2 are connected to each other so that the processing unit main transport mechanisms T1 and T2 can deliver the substrate W to each other. The hierarchies K1 and K2 connected in series form a substrate processing row Lu. Similarly, processing unit main transport mechanisms T3 and T4 are provided in the lower levels K3 and K4 of the processing blocks Ba and Bb, respectively. Each of the levels K3 and K4 is also configured so that the main transfer mechanisms T3 and T4 for the processing unit are connected to each other so as to be able to deliver the substrate W to each other, thereby forming a substrate processing row Ld. Hereinafter, the “processing section main transport mechanism” is appropriately abbreviated as “main transport mechanism”.

  In the substrate processing row Lu, the main transport mechanisms T1 and T2 transfer the substrate W to each other, and transport the substrate W to a processing unit (described later) provided in the substrate processing row Lu. In the processing unit, a process for forming a resist film on the substrate W and a process for developing the substrate W are performed. In parallel with this, similar processing is performed on the substrate W while the substrate W is transported also in the substrate processing row Ld. Hereinafter, when the substrate processing rows Lu and Ld are not particularly distinguished, they are simply referred to as a substrate processing row L.

[Processing unit 3 to processing block Ba]
Between the layers K1 and K3 of the transport unit 9 and the processing block Ba, mounting units P1 and P3 for mounting the substrate W are provided. A substrate W transferred between the first main transport mechanism T _IDM and the main transport mechanism T1 or between the first preliminary transport mechanism T _IDS and the main transport mechanism T1 is temporarily placed on the mounting portion P1. Placed. Similarly, the substrate W transferred between the first main transport mechanism T _IDM / first preliminary transport mechanism T _IDS and the main transport mechanism T3 is temporarily placed on the placement unit P3. In a cross-sectional view, the placement portion P1 is disposed at a height position near the lower portion of the upper layer K1, and the placement portion P3 is disposed at a height near the upper portion of the lower layer K3. As described above, since the positions of the mounting portion P1 and the mounting portion P3 are relatively close, the first main transport mechanism T _IDM / first preliminary transport mechanism T _IDS can move the mounting portion P1 and the mounting portion P3 with a small lift amount. Can move between.

  Between the processing blocks Ba and Bb, mounting portions P2 and P4 for mounting the substrate W are also provided. The placement part P2 is arranged between the hierarchy K1 and the hierarchy K2, and the placement part P4 is arranged between the hierarchy K3 and the hierarchy K4. The main transport mechanism T1 and the main transport mechanism T2 deliver the substrate W via the placement part P2, and the main transport mechanism T3 and the main transport mechanism T4 deliver the substrate W via the placement part P4.

Each mounting part P1 is plural (two), and is arranged close to each other in the vertical direction. Of the two placement portions P1, the substrate W passing from the first main transport mechanism T _IDM / first preliminary transport mechanism T _IDS to the main transport mechanism T1 is placed on one placement portion P1a, and the other placement portion P1a is placed. A substrate W to be transferred from the main transport mechanism T1 to the first main transport mechanism T _IDM / first preliminary transport mechanism T _IDS is placed on the placement portion P1b. There are also a plurality of (two) placement units P2 to P4 and later-described placement units P5-P8, and one of the placement units P is selected according to the direction in which the substrate W is delivered. In addition, sensors (not shown) for detecting the presence or absence of the substrate W are attached to the placement portions P1a and P1b, respectively, and based on the detection signal of each sensor, the first main transport mechanism T _IDM / first preliminary transport. The delivery of the substrate W by the mechanism T _IDS and the main transport mechanism T1 is controlled. Similar sensors are also attached to the placement portions P2-P8.

The hierarchy K1 will be described. The layer K1 includes a plurality of coating processing units 31 and a plurality of heat treatment units 41 in addition to the main transport mechanism T1. Transporting space A ₁ substantially center parallel to the street x axis direction of the hierarchy K1 is formed in plan view the hierarchy K1. The main transport mechanism T1 is movable the transporting space A _1. Coating units 31 are arranged at one side of the transporting space A _1. The heat treatment unit 41 is disposed so as to face the coating processing unit 31 in the horizontal direction with the conveyance space A1 interposed therebetween. The coating treatment unit 31 and the heat treatment unit 41 correspond to the treatment unit in this invention.

Each coating unit 31 is arranged in the vertical and horizontal directions respectively facing the transporting space A _1. In the present embodiment, a total of four coating processing units 31 are arranged in two rows in the vertical direction and in two rows in the x-axis direction.

  The coating processing unit 31 is further divided into an antireflection film coating processing unit BARC and a resist film coating processing unit RESIST. The antireflection film coating processing unit BARC applies an antireflection film processing solution to the substrate W, and the resist film coating processing unit RESIST applies a resist film material to the substrate W.

  The antireflection film coating unit BARC is arranged in the lower stage. The resist film coating unit RESIST is arranged in the upper stage. There are no partition walls or partition walls between the antireflection coating application units BARC. That is, all the antireflection coating application units BARC are only accommodated in a common chamber, and the atmosphere around each antireflection coating application unit BARC is not blocked (communicated). Similarly, the atmosphere around each resist film coating unit RESIST is not blocked from each other.

  Please refer to FIG. FIG. 6A is a plan view of the coating processing unit, and FIG. 6B is a cross-sectional view of the coating processing unit. Each coating processing unit 31 includes a rotation holding unit 32 that rotatably holds the substrate W, a cup 33 provided around the substrate W, a supply unit 34 that supplies the processing liquid to the substrate W, and the like.

  The supply unit 34 has a plurality of nozzles 35, a gripping unit 36 that grips one nozzle 35, and moves the gripping unit 36 so that the one nozzle 35 is displaced from the processing position above the substrate W and the top of the substrate W. And a nozzle moving mechanism 37 for moving between the standby positions. One end of a processing liquid pipe 38 is connected to each nozzle 35 in communication. The processing liquid pipe 38 is provided movably (flexibly) so as to allow movement of the nozzle 35 between the standby position and the processing position. The other end of each processing liquid pipe 38 is connected to a processing liquid supply source (not shown). In the case of the antireflection film coating processing unit BARC, the processing liquid supply source supplies different types of antireflection film processing liquids to the nozzles 35. In the case of the resist film coating processing unit RESIST, the processing liquid supply source supplies different types of resist film materials to the nozzles 35.

  The nozzle moving mechanism 37 includes a first guide rail 37a and a second guide rail 37b. The first guide rails 37a are arranged in parallel with each other with the two cups 33 arranged side by side. The second guide rail 37 b is slidably supported by the two first guide rails 37 a and is installed on the two cups 33. The grip portion 36 is slidably supported by the second guide rail 37b. Here, the directions guided by the first guide rail 37a and the second guide rail 37b are both substantially horizontal directions and are substantially orthogonal to each other. The nozzle moving mechanism 37 further includes a drive unit (not shown) that slides and moves the second guide rail 37b and slides the grip portion 36. When the driving unit is driven, the nozzle 35 held by the holding unit 36 is moved to a position above the two rotation holding units 32 corresponding to the processing position.

Heat-treating units 41 are a plurality, are arranged vertically and horizontally, each facing the transporting space A _1. In this embodiment, three heat treatment units 41 can be arranged in the x-axis direction, and five heat treatment units 41 can be stacked in the vertical direction. Each heat treatment unit 41 includes a plate 43 on which the substrate W is placed. The heat treatment unit 41 includes a cooling unit CP that cools the substrate W, a heating / cooling unit PHP that performs heat treatment and cooling processing continuously, and a vapor atmosphere of hexamethyldisilazane (HMDS) in order to improve the adhesion between the substrate W and the film. It includes an adhesion processing unit AHL for heat treatment. The heating / cooling unit PHP has two plates 43 and a local transport mechanism (not shown) that moves the substrate W between the two plates 43. There are a plurality of various heat treatment units CP, PHP, and AHL, which are arranged at appropriate positions.

The main transport mechanism T1 will be specifically described. Please refer to FIG. FIG. 7 is a perspective view of the main transport mechanism. The main transport mechanism T1 includes two first guide rails 51 that guide in the vertical direction and a second guide rail 52 that guides in the x-axis direction. The two first guide rails 51 are fixed so as to face each other at positions near both ends of the conveyance space A. In this embodiment, the first guide rail 51 is arranged on the side coating units 31 of the transport region A ₁ is disposed. The second guide rail 52 is slidably attached to the first guide rail 51.

A base portion 53 is slidably provided on the second guide rail 52. The base 53 extends transversely, substantially to the center of the transport region A _1. The base 53 is provided with a turntable 55 that is rotatable about the longitudinal axis. On the turntable 55, two holding arms 57a and 57b for holding the substrate W are provided so as to be movable in the horizontal direction. The two holding arms 57a and 57b are arranged at positions close to each other in the vertical direction.

  The main transport mechanism T1 further includes various drive mechanisms that respectively drive the second guide rail 52, the base portion 53, the turntable 55, and the holding arms 57a and 57b. By these various drive mechanisms, the second guide rail 52 moves up and down in the vertical direction with respect to the first guide rail 51, the base portion 53 moves in the x-axis direction with respect to the second guide rail 52, and the turntable 55 The base arm 53 rotates in a horizontal plane, and the holding arms 57 a and 57 b move forward and backward with respect to the turntable 55. Accordingly, the main transport mechanism T1 transports the substrate W to the coating processing unit 31 and each heat treatment unit 41. Further, the main transport mechanism T1 moves to both sides of the application block Ba in the x-axis direction, and transports the substrate to each placement unit P corresponding to the main transport mechanism T1.

  The hierarchy K3 will be described. In addition, detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol about the same structure as the hierarchy K1. A blocking member 21 that blocks the atmosphere is provided between the hierarchy K3 and the hierarchy K1. The layout (arrangement) in plan view of the main transport mechanism T3 and the processing units 31, 41 of the hierarchy K3 is substantially the same as those of the hierarchy K1. For this reason, the arrangement of the various processing units 31 and 41 in the level K3 as viewed from the main transport mechanism T3 is substantially the same as the arrangement of the various processing units 31 and 41 in the level K1 as viewed from the main transport mechanism T1. The coating processing unit 31 and the heat treatment unit 41 in the layer K3 are respectively stacked below the coating processing unit 31 and the heat treatment unit 41 in the layer K1.

In the following, when distinguishing the resist film coating processing units RESIST and the like provided in the layers K1 and K3, subscripts “1” or “3” are respectively attached (for example, resist films provided in the layer K1). The coating processing unit RESIST is described as “resist film coating processing unit RESIST ₁ ”).

Other configurations of the processing block Ba will be described. At the end portion of the space where the coating processing units 31 of the respective layers K1 and K3 are installed, a pothole portion PS penetrating in the vertical direction is formed. In this hole part PS, piping through which the processing liquid is passed, electric wiring, etc. (all not shown) are installed. In addition, the pit hole PS is also provided with air supply and exhaust pipes for keeping the coating processing unit 31 of each layer and the transport areas A ₁ and A ₃ in a clean atmosphere.

[Processing unit 3 to processing block Bb]
The hierarchy K2 will be described. About the same structure as the hierarchy K1, detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol.

Transporting space A ₂ in the hierarchy K2 is formed so as to be on the extension of the transporting space A _1. The main transport mechanism T ₂ is disposed substantially at the center of the transporting space A ₂ in plan view. The level K2 further includes a development processing unit DEV that develops the substrate W, a heat treatment unit 42 that heat-treats the substrate W, and an edge exposure unit EEW that exposes the peripheral edge of the substrate W. The development processing unit DEV, the heat treatment unit 42, and the edge exposure unit EEW correspond to the processing units in the present invention.

Developing units DEV are arranged at one side of the transporting space A _2, heat-treating units 42 and edge exposing unit EEW are arranged at the other side of the transporting space A _2. Here, the development processing unit DEV is preferably disposed on the same side as the coating processing unit 31. Further, it is preferable that the heat treatment unit 42 and the edge exposure unit EEW are aligned with the heat treatment unit 41.

Developing units DEV is four, are arranged, each facing the transporting space A _2. Specifically, they are arranged in two rows in the x-axis direction and in two upper and lower stages. Each development processing unit DEV includes a rotation holding unit 61 that rotatably holds the substrate W, and a cup 63 provided around the substrate W. Two development processing units DEV arranged side by side are provided without being partitioned by a partition wall or the like. Further, a supply unit 65 for supplying a developing solution is provided for the two development processing units DEV. The supply unit 65 has two slit nozzles 67 having slits or small hole arrays for discharging the developer. The length in the longitudinal direction of the slit or small hole array is preferably equivalent to the diameter of the substrate W. The two slit nozzles 67 are preferably configured to discharge different types or concentrations of developing solutions. The supply unit 65 further includes a moving mechanism 69 that moves each slit nozzle 67. Thereby, each slit nozzle 67 can move above the two rotation holding portions 61 arranged in the horizontal direction.

At the end of the space where the development processing unit DEV described above is installed, a pit portion PS is formed penetrating in the vertical direction over the layers K2 and K4. In the hole portion PS, a pipe through which the developer passes, electric wiring, etc. (all not shown) are installed. In addition, the pit hole PS is also provided with air supply and exhaust pipes for keeping each development processing unit DEV and each transport area A ₂ , A ₄ in a clean atmosphere.

Thermal processing unit 42, each facing the transporting space A _2, together with the aligned plurality of x-axis direction, are stacked in the vertical direction. The heat treatment unit 42 includes a heating unit HP that heats the substrate W, a cooling unit CP that cools the substrate W, and a heating and cooling unit PHP that continuously performs the heating process and the cooling process.

The heating / cooling unit PHP provided in the level K2 performs a post-exposure heat treatment (PEB) process. Each heating / cooling unit PHP is stacked in the vertical direction in a row closest to the IF unit 5. A transport port for the substrate W is formed on one side facing each IF unit 5 side of each heating and cooling unit PHP. A sub-transport mechanism _{TIFA1, which} will be described later, transports the substrate W to the heating / cooling unit PHP through the transport port. Therefore, the heating / cooling unit PHP provided in the level K2 corresponds to the post-exposure heat treatment unit in the present invention. A heating / cooling unit PHP at level K4 described later also corresponds to a post-exposure heat treatment unit in the present invention.

  The edge exposure unit EEW is single and is provided at a predetermined position. The edge exposure unit EEW includes a rotation holding unit (not shown) that rotatably holds the substrate W, and a light irradiation unit (not shown) that exposes the periphery of the substrate W held by the rotation holding unit. .

Furthermore, the mounting part P5 is laminated on the upper side of the heating / cooling unit PHP. The main transport mechanism T2 and the sub transport mechanism _TIFA1 deliver the substrate W through the placement unit P5.

  The main transport mechanism T2 is configured similarly to the main transport mechanism T1. Then, the main transport mechanism T2 transports the substrate W among the development processing units DEV, the heat treatment unit 42, the edge exposure unit EEW, and the placement portions P2 and P5.

The hierarchy K4 will be briefly described. On the upper side of the heating / cooling unit PHP of the level K4, the mounting portion P6 is stacked. A sub-transport mechanism _TIFA1 described later transports the substrate W to the heating / cooling unit PHP of the level K4. The transfer of the substrate W between the main transport mechanism T4 and the sub transport mechanism _TIFA2 is performed via the placement unit P6. The main transport mechanism T4 transports the substrate W between each development processing unit DEV, the heat treatment unit 42, the edge exposure unit EEW, and the placement portions P4 and P6.

In the following, when distinguishing the development processing units DEV, edge exposure units EEW, and the like provided in the hierarchies K2 and K4, subscripts “2” and “4” are respectively attached (for example, provided in the hierarchy K2). The heating unit HP is described as “heating unit HP ₂ ”).

[IF unit 5]
The IF unit 5 transports the substrate W between the processing unit 3 and the exposure apparatus EXP. The IF unit 5 is adjacent to the processing block Bb and is adjacent to the exposure unit EXP. The IF section 5 is divided into a front transport section 5a and a rear transport section 5b that are substantially divided into two in the x-axis direction. The front transport unit 5a is on the processing unit 3 side in the IF unit 5, and the rear transport unit 5b is on the exposure unit EXP side of the IF unit 5. The front transport unit 5a is adjacent to the processing block Bb, and the rear transport unit 5b is adjacent to the exposure unit EXP.

The front transport unit 5a is provided with a sub transport mechanism T _IFA1 and a sub transport mechanism T _IFA2 separately for each substrate processing row L. The sub-transport mechanism T _IFA1 is provided at a position facing the heat treatment unit PHP ₂ and the placement part P5 of the corresponding substrate processing row Lu. The _{TIFA 2} is provided at a position facing the heat treatment unit PHP ₄ and the mounting portion P6 of the corresponding substrate processing row Ld. The sub transport mechanisms T _IFA1 and T _IFA2 are arranged so as to be aligned in the vertical direction.

On the one side in the y-axis direction of the sub transport mechanism _TIFA1 , there are provided mounting portions P7 and P8 for mounting the substrate W, respectively. A buffer BF that temporarily accommodates the substrate W is attached to each of the placement portions P7 and P8. The placement portions P7 and P8 and the buffer BF are arranged so as to be aligned in the vertical direction.

Please refer to FIG. A blocking member 71 that blocks the atmosphere is provided between the sub-transport mechanisms T _IFA1 and T _IFA2 . The blocking member 71 corresponds to the first blocking member in this invention. The sub-transport mechanisms T _IFA1 and T _IFA2 are both supported by the column 73 so as to be movable up and down. The sub-transport mechanisms T _IFA1 and T _IFA2 include an elevating member 74, a base portion 75, a turntable 76, and two holding arms 77a and 77b, respectively. The elevating member 74 is slidably attached to the column 73 and moves up and down along the column 73. A base portion 75 is connected to the elevating member 74. The base portion 75 rotates around the central axis of the column 73 with respect to the lifting member 74. A rotating arm 76 is connected to the base portion 75. The rotating arm 76 rotates around the vertical axis with respect to the base portion 75. Two holding arms 77 a and 77 b are attached to the rotating arm 76. The holding arms 77a and 77b are provided independently of each other so as to advance and retract in the horizontal direction with respect to the turntable 76.

The auxiliary transport mechanism _{T IFA1} configured to transfer the substrate W to the mounting portion P5, P7 and the heating and cooling units PHP _2. Further, auxiliary transport mechanism _{T IFA2} conveys the substrate W to the mounting portion P6, P8 and the heating and cooling units PHP _4.

The rear transport unit 5b is provided with a second main transport mechanism _TIFM and a second preliminary transport mechanism _TIFS . A blocking member 79 that blocks the atmosphere is provided between the rear conveyance unit 5b and the front conveyance unit 5a. The blocking member 79 has an opening for the second main transport mechanism _{T IFM} and the second preliminary transport mechanism _{T IFS} access the mounting portion P7, P8 are formed. The blocking member 79 corresponds to the second blocking member in this invention.

Please refer to FIG. 1 and FIG. FIG. 8 is a front view of the IF unit 5 as viewed from the exposure apparatus EXP. A second standby area Ab1 and a second retreat area Ab2 are formed in the rear transport unit 5b. The second standby region Ab1 is a region outside the second main transfer region Ab3 is a range of motion during substrate transfer of the second main transport mechanism T _IFM. The second save area Ab2 is an area out of the second preliminary transfer region Ab4 a excursion during substrate transfer of the second preliminary transport mechanism T _IFS.

Here, the second main transport area Ab3 and the second preliminary transport area Ab4 are respectively located at a delivery position (mounting portions P7, P8) to the sub-transport mechanisms T _IFA1 and T _IFA2 and a delivery position to the exposure apparatus EXP. And an opposite position. Range second main transfer region Ab3 and second preliminary transfer region Ab4 is formed will vary depending on the structure of the second main transport mechanism T _IFM and the second preliminary transport mechanism T _IFS, in the present embodiment as described below the The two main transport areas Ab3 and the second preliminary transport area Ab4 substantially coincide with each other.

The second standby area Ab1 is provided at a position away from the second main transport area Ab3 on one side in the y-axis direction. Further, the second retreat area Ab2 is provided at a position deviated from the first preliminary transport area Aa4 to the other side in the y-axis direction. Accordingly, the second standby area Ab1 and the first retreat area Aa2 are opposed in the horizontal direction with the first main transport area Aa3 (first preliminary transport area Aa4) interposed therebetween. Together with the second preliminary transport mechanism T _IFS do substrate transported in the second preliminary transfer region Ab4, is displaceably configured to the second waiting region Ab1. The second main transport mechanism _TIFM is also configured to transport the substrate in the second main transport area Ab3 and to be displaced to the second retreat area Ab2. The second standby area Ab1, the second evacuation area Ab2, the second main transport area Ab3, and the second preliminary transport area Ab4 correspond to the standby area, the evacuation area, the main transport area, and the preliminary transport area in the present invention, respectively.

The second standby area Ab1, the second preliminary transport area Ab4, the second main transport area Ab3, and the second retreat area Ab2 are not partitioned, and the areas Ab1, Ab2, Ab3 (Ab4) communicate with each other. ing. That is, the atmosphere around the second main transport mechanism _{TIFM communicates} with the atmosphere around the second preliminary transport mechanism _TIFS and is not blocked.

Rear conveyor unit 5b is configured to guide the second preliminary transport mechanism _{T IFS} from the second waiting region Ab1 to the second preliminary transfer region Ab4, the same orbit as the second preliminary transport mechanism _{T IFS} second main transport mechanism _{T IFM} Is provided from the second main transport area Ab3 to the second retreat area Ab2. The guide rail 82 is fixed to the lower part of the rear transport unit 5b in parallel with the y-axis direction. Both ends of the guide rail 82 reach the second standby area Ab1 and the second retreat area Ab2, respectively. The guide rail 82 corresponds to the shared guide member in the present invention.

The second main transport mechanism _TIFM and the second preliminary transport mechanism _TIFS are configured similarly. Both are provided with a movable base 83, a lifting shaft 84, a rotating arm 85, and a holding arm 86. The movable table 83 includes a drive mechanism including a motor (not shown) and is guided by the guide rail 82 to move back and forth in the y-axis direction. The driving mechanism of the movable base 83 is configured to be controlled to an unlocked state that is movable in the y-axis direction. Specifically, the movable base 83 is exemplified by being configured to include a motor whose output shaft can freely rotate when the power is turned off, and a power transmission mechanism having an electromagnetic clutch.

  The lower end of the elevating shaft 84 is connected to the movable table 83. The elevating shaft 84 expands and contracts in the vertical direction, whereby the upper end of the elevating shaft 84 moves up and down with respect to the movable table 83. One end of the rotary arm 85 is interlocked to the upper part of the elevating shaft 84. The rotating arm 85 rotates around the vertical axis around its one end, and thereby the other end of the rotating arm 85 pivots in a horizontal plane. One end of a holding arm 86 is attached to the rotating arm 85 so as to be slidable. The holding arm 86 moves back and forth in the turning radius direction of the rotary arm 85. The other end of the holding arm 86 holds the substrate W.

Then, the movable base 83 of the second main transport mechanism _TIFM moves in the y-axis direction, so that the lift shaft 84, the rotary arm 85, and the holding arm 86 are integrated into the second main transport region Ab3 as the second retreat. Move to area Ab2.

Similarly, when the movable base 83 of the second preliminary transport mechanism _TIFS moves in the y-axis direction, the lift shaft 84, the rotary arm 85, and the holding arm 86 are integrated with each other from the second standby area Ab1 to the second preliminary area Ab1. It moves to conveyance area Ab4. At this time, the second pre-transport mechanism T _IFS is configured to be movable toward the second save area Ab2 pushes the second main transport mechanism T _IFM positioned to the second main transfer region Ab3 directly.

The second main transport mechanism T _IFM and the second preliminary transport mechanism T _IFS are further provided with a buffer material 87 that absorbs an impact when they come into contact with each other. The buffer material 87 is attached to the side portion of each lifting shaft 84.

Further, a position detection sensor 89 that detects the position of the second main transport mechanism _TIFM such as the position and orientation of the holding arm 86 and the like is provided (see FIG. 9). The detection result of the position detection sensor 89 is given to the control unit 93 described later. The position detection sensor 89 corresponds to the detection unit in this invention.

Substrate with respect to the exposing machine EXP with the second main transport mechanism _{T IFM} configured, the receiving and transferring the substrates W between the mounting portion P7, each through P8 auxiliary transport mechanism _{T IFA1, T IFA2} Transport W. The second pre-transport mechanism _{T IFS} second as main transport mechanism _{T IFM} for the preliminary second main transport mechanism _{T IFM} in behalf mounting portion P7, through P8 each auxiliary transport mechanism _{T IFA1, T IFA2} The substrate W is delivered to and from the exposure apparatus EXP. The second main transport mechanism _TIFM corresponds to the main transport mechanism in the present invention. The second preliminary transport mechanism _TIFS corresponds to the preliminary transport mechanism in the present invention. The placement portions P7 and P8 correspond to the second placement portion in the present invention.

  Next, the control system of the apparatus 10 will be described. FIG. 9 is a control block diagram of the substrate processing apparatus according to the embodiment.

The apparatus 10 includes an input unit 91 and a control unit 93. The input unit 91 can input a command related to switching between the first main transport mechanism T _IDM and the first preliminary transport mechanism T _IDS and a command related to switching between the second main transport mechanism _TIFM and the second preliminary transport mechanism T _IFS. It is. Information input to the input unit 91 is given to the control unit 93. The input unit 91 includes a pointing device represented by a mouse, a keyboard, a joystick, a trackball, a touch panel, and the like.

  The control unit 93 includes a main controller 100 and first to tenth controllers 101-110. The main controller 100 comprehensively controls the first to tenth controllers 101-110. The main controller 100 is given detection results from the position detection sensors 19 and 89.

The first controller 101 controls substrate transport by the first main transport mechanism T _IDM . The second controller 102 controls the substrate transport by the first preliminary transport mechanism T _IDS . The third controller 103 performs substrate transport by the main transport mechanism T1, resist film coating processing unit RESIST ₁ , antireflection film coating processing unit BARC ₁ , cooling unit CP ₁ , heating / cooling unit PHP _1, and adhesion processing unit AHL ₁ . Control substrate processing. The fourth controller 104 controls substrate transport by the main transport mechanism T2, and substrate processing in the edge exposure unit EEW ₂ , the development processing unit DEV ₂ , the heating unit HP _2, and the cooling unit CP ₂ . The control of the fifth and sixth controllers 105 and 106 corresponds to the control of the third and fourth controllers 103 and 104, respectively. Seventh controller 107 controls substrate transport by the auxiliary transport mechanism _{T IFA1,} the substrate processing in the heating and cooling units PHP _2. The control of the eighth controller 108 corresponds to the control of the seventh controller 107. The ninth controller 109 controls the substrate transport by the second main transport mechanism _TIFM . The tenth controller 110 controls the substrate transport by the second preliminary transport mechanism _TIFS . The first to tenth controllers 101 to 110 described above perform control independently of each other.

  Each of the main controller 100 and the first to tenth controllers 101 to 110 is a central processing unit (CPU) that executes various processes, a RAM (Random-Access Memory) that is a work area for arithmetic processing, and is set in advance. It is realized by a storage medium such as a fixed disk for storing various information such as a processing recipe (processing program).

Next, the operation of the substrate processing apparatus according to the embodiment will be described.
First, the operation at the time of switching from the main transport mechanism T _IDM / T _IFM to the preliminary transport mechanism T _IDS / T _IFS in the ID unit 1 and the IF unit 5 will be described. Here, since the switching operation between the ID unit 1 and the IF unit 5 is the same, the description of the switching operation of the ID unit 1 will be omitted by describing the IF unit 5. FIG. 10 is a flowchart showing the switching operation in the IF unit 5. Hereinafter, each process will be described.

[Switching operation example]
<Step S1> Continue Substrate Transport by T _IFM Based on the control of the ninth controller 109, the second main transport mechanism T _IFM continues to perform a predetermined substrate transport described later in the second main transport region Ab3. Based on the control of the 10 controller 110, a second preliminary transport mechanism _{T IFS} is positioned in the second waiting region Ab1.

<Step S2> Has an abnormality occurred in the _TIFM ?
The position detection sensor 89 detects the position of the second main transport mechanism _TIFM and gives the detection result to the main controller 100. The main controller 100 determines whether an abnormality has occurred in the second main transport mechanism _TIFM based on the detection result. Specifically, it is monitored whether the second main transport mechanism _TIFM is operating in accordance with the control of the ninth controller 109. If not, it is determined that an abnormality has occurred in the second main transport mechanism _TIFM. . In this determination, the main controller 100 cooperates with the ninth controller 109 to refer to control information for the second main transport mechanism _TIFM . When it is determined that an abnormality has occurred in the second main transport mechanism _TIFM , the process proceeds to step S4. Otherwise, the process proceeds to step S3.

<Step S3> Is a switching command input?
When the input unit 91 receives a switching command by a user operation, the input unit 91 gives the switching command to the control unit 93. Thus, when the command to switch to the first preliminary transport mechanism T _IDS is input to the control unit 93, the process proceeds to step S4. Otherwise, the process returns to step S1.

<Step S4> Is _TIFM holding the substrate?
The controller 93 starts the switching control after step S4. First, the control unit 93 determines whether or not the second main transport mechanism _TIFM is holding the substrate W on the holding arm 86 at the timing of starting the switching control. As a result, if it is determined that it is held, the process proceeds to step S5, and if not, the process proceeds to step S6.

<Step S <b>5> Canceling the transport of the held substrate The control unit 93 performs a process of canceling a control command related to the transport of the held substrate W. As a result, the second main transport mechanism _TIFM is maintained in a state where the substrate W is held, and the subsequent transport of the substrate W is stopped.

<Step _{S6> T IFM} controller 93 for driving retracted performs control to move to drive the second main transport mechanism _{T IFM} in the second save area Ab2. Specifically, the ninth controller 109 moves toward the movable base 83 of the second main transport mechanism _{T IFM} to the second save area Ab2.

<Step S7> Was the _TIFM saved?
The main controller 100 and the second main transport mechanism T _IFM determines whether located in the second save area Ab2 based on the detection result of the position detecting sensor 89. As a result, when it is determined that the second main transport mechanism _TIFM has been retracted, the process proceeds to step S9, and when it is determined that it is not, the process proceeds to step S8.

<Step S8> The T _IFS is driven to retract the _TIFM . The ninth controller 109 controls the movable base 83 of the second main transport mechanism _{TIFM to} an unlocked state that is free to move in the y-axis direction. 10 controller 110 moves toward the second waiting region Ab1 to drive the second pre-transport mechanism _{T IFS} to the second main transfer region Ab3. Specifically, driving in the y-axis direction toward the movable base 83 of the second preliminary transport mechanism _{T IFS} from the second waiting region Ab1 to the second main transfer region Ab3. When the second preliminary transport mechanism T _IFS moves to the second main transport area Ab3, the second preliminary transport mechanism T _IFS comes into contact with the second main transport mechanism T _IFM and moves the second main transport mechanism T _IFM to the second retreat area Ab2. Press towards. At this time, the buffer materials 87 of the second main transport mechanism _TIFM and the second preliminary transport mechanism _TIFS are in direct contact with each other. The movable base 83 of the second main transport mechanism _TIFM that is free to move in the y-axis direction starts to move along the guide rail 82 from the second main transport area Ab3 toward the second retreat area Ab2. Accordingly, the second main transport mechanism _{T IFM} is moved in the y-axis direction from the second main transfer region Ab3 to the second save area Ab2.

Please refer to FIG. FIG. 11 is a front view of the IF unit 5 after switching. Step S8 or after the end of the step S9 which will be described later, the second main transport mechanism _{T IFM} is located in the second save area Ab2, second preliminary transport mechanism _{T IFS} is located in the second pre-transfer region Ab4. Incidentally, as described above, the second preliminary transfer region Ab4 a range of motion of the second preliminary transport mechanism T _IFS during substrate transfer is substantially coincides with the second main transfer region Ab3.

<Step _S9> 10 controller 110 to move the _{T IFS} to Ab3 moves toward the second waiting region Ab1 to drive the second pre-transport mechanism _{T IFS} to the second preliminary transfer region Ab4.

<Step S10> Starting Substrate Transport by T _IFS Based on the control of the tenth controller 110, the second preliminary transport mechanism T _IFS starts substrate transport. Thereby, the substrate transport in the IF unit 5 is continued for the subsequent substrate W.

  Next, an operation example in which a series of processing is performed on the substrate W in the apparatus 10 will be described. FIG. 12 is a flowchart for performing a series of processes on the substrate W, and shows a processing unit or a placement unit on which the substrates W are sequentially transferred. FIG. 13 is a diagram schematically showing the operation repeatedly performed by each transport mechanism, and clearly shows the order of processing units, placement units, cassettes, and the like accessed by the transport mechanism. Below, it demonstrates for every conveyance mechanism. The following operations are performed based on control by the control unit 93.

[First main transport mechanism T _IDM / First preliminary transport mechanism T _IDS ]
An operation example of the first main transport mechanism T _IDM and the first preliminary transport mechanism T _IDS will be described. Here, since the operation of both is the same, the description of the operation of the first preliminary transport mechanism T _IDS is omitted by describing the operation of the first main transport mechanism T _IDM .

The first main transport mechanism T _IDM moves to a position opposite to one cassette C, holds one unprocessed substrate W accommodated in the cassette C on the holding arm 16 and carries it out of the cassette C. The first main transport mechanism T _IDM turns the holding arm 16 and moves the lifting shaft 14 up and down to move to a position facing the mounting portion P1 to place the held substrate W on the mounting portion P1a (FIG. This corresponds to step U1a in step 12. Hereinafter, only step numbers are added. Usually, at this time, the substrate W is placed on the placement portion P1b. The first main transport mechanism T _IDM receives the substrate W and stores it in the cassette C (steps U22 and U23). In addition, when there is no substrate W in the mounting part P1b, the board | substrate conveyance from the mounting part P1b to the cassette C is abbreviate | omitted. Subsequently, the first main transport mechanism T _IDM accesses the cassette C and transports the substrate W accommodated in the cassette C to the placement unit P3a (step U1b). Again, if the substrate W is placed on the placement portion P3b, the substrate W is stored in the cassette C (steps U22 and U23). The first main transport mechanism T _IDM repeats the above-described operation.

The operation of the first main transport mechanism T _IDM is controlled by the first controller 101. Thereby, the substrate W of the cassette C is sent to the substrate processing row Lu, and the substrate W discharged from the substrate processing row Lu is accommodated in the cassette C. Similarly, the substrate W of the cassette C is sent to the substrate processing row Ld, and the substrate W discharged from the substrate processing row Ld is accommodated in the cassette C.

Further, when an abnormality or the like occurs in any one of the substrate processing rows L and the corresponding sub transport mechanism _TIFA , the substrate transportation to one substrate processing row L is stopped, and only the other substrate processing row L is stopped. The first controller 101 controls the first main transport mechanism T _IDM so as to transport the substrate W.

[Main transport mechanisms T1, T3]
Since the operation of the main transport mechanism T3 is substantially the same as the operation of the main transport mechanism T1, only the main transport mechanism T1 will be described. The main transport mechanism T1 moves to a position facing the placement unit P1. At this time, the main transport mechanism T1 holds the substrate W received from the placement unit P2b immediately before on one holding arm 57 (for example, the holding arm 57b). The main transport mechanism T1 places the held substrate W on the placement portion P1b (step U22a), and the substrate W placed on the placement portion P1a by the other holding arm 57 (for example, the holding arm 57a). Is held (step U1a).

The main transport mechanism T1 accesses a predetermined one of the cooling units CP _1. The cooling unit CP ₁ already has predetermined heat treatment (cooling) other substrate W has ended. As well as out from the main transport mechanism T1 is the cooling unit CP ₁ holds the other substrate W in an empty (not holding the substrate W) holding arm 57, the wafer W received from the mounting portion P1a cooling units CP Bring it into ₁ . Then, the main transport mechanism T1 moves while holding the cooled wafer W into the film coating units BARC _1. The cooling unit CP ₁ starts heat treatment (cooling) to the loaded wafer W (step U2a). This heat treatment (cooling) is already completed when the cooling unit CP main transport mechanism T1 to ₁ next access. In the following description, it is assumed that the other various heat treatment units 41 and coating processing units 31 already have substrates W that have undergone predetermined processing when the main transport mechanism T1 accesses them.

When the antireflection film coating unit BARC ₁ is accessed, the main transport mechanism T1 unloads the substrate W on which the antireflection film is formed from the antireflection film coating unit BARC _1, and also prevents the cooled substrate W from being reflected. It is placed on the rotation holding unit 32 of the film coating processing unit BARC ₁ . Then, the main transport mechanism T1 moves into the heating and cooling unit PHP _1, holding the wafer W having antireflection film formed. The antireflection film coating processing unit BARC ₁ starts processing the substrate W placed on the rotation holding unit 32 (step U3a).

  Specifically, the rotation holding unit 32 rotates the substrate W in a horizontal posture, holds one nozzle 35 by the holding unit 36, and moves the held nozzle 35 above the substrate W by driving the nozzle moving mechanism 37. Then, the processing liquid for the antireflection film is supplied from the nozzle 35 to the substrate W. The supplied processing liquid spreads over the entire surface of the substrate W and is discarded from the substrate W. The cup 33 collects the discarded processing liquid. In this way, the process of coating and forming the antireflection film on the substrate W is performed.

The main transport mechanism T1 accesses the heating and cooling unit PHP _1, with unloading the wafer W having the heat treatment from the heating and cooling unit PHP _1, turning on the wafer W having antireflection film formed thereon the heating and cooling unit PHP _1. Then, the main transport mechanism T1 moves while holding the wafer W taken out of the heating and cooling unit PHP ₁ to the cooling unit CP _1. In the heating / cooling unit PHP ₁ , the substrates W are sequentially placed on the two plates 43, the substrate W is heated on one plate 43, and then the substrate W is cooled on the other plate 43 (step U 4 a).

The main transport mechanism T1 is moved to the cooling unit CP _1, with a wafer W out of the cooling unit CP _1, and loads the wafer W held in the cooling unit CP _1. The cooling unit CP ₁ cools the loaded wafer W (step U5a).

Subsequently, the main transport mechanism T1 moves to the resist film coating unit RESIST ₁ . The main transport mechanism T 1 takes a wafer W having resist film formed from the resist film coating units RESIST _1, the substrate W held in the resist film coating units RESIST ₁ carries the substrate W. The resist film coating unit RESIST ₁ supplies the resist film material while rotating the loaded substrate W to form a resist film on the substrate W (step U6a).

The main transport mechanism T1 further moves to one of the heating and cooling units PHP ₁ and _one of the cooling units CP _1. Then, the wafer W having resist film formed thereon is carried into the heating and cooling unit PHP _1, transfers a wafer W to the cooling unit CP ₁ having undergone the processing in the heating and cooling unit portion PHP _1, the processing in the cooling unit CP ₁ The finished substrate W is received. The heating / cooling unit PHP ₁ and the cooling unit CP ₁ each perform a predetermined process on the unprocessed substrate W. (Steps U7a, U8a).

  The main transport mechanism T1 moves to the placement unit P2, places the held substrate W on the placement unit P2a (step U9a), and receives the substrate W placed on the placement unit P2b (step S9). U21a).

  Thereafter, the main transport mechanism T1 accesses the placement unit P1 again and repeats the above-described operation. This operation is controlled by the third controller 103. Thus, all the substrates W transferred from the cassette C to the placement unit P1 are transferred between the various processing units in the hierarchy K1 through the transfer path described above, and predetermined processing is sequentially performed in each transferred processing unit.

The main transport mechanism T1 transports the substrate W transported to the placement unit P1 to a predetermined processing unit (cooling unit CP ₁ in this embodiment) and takes out the processed substrate W from the processing unit. Subsequently, the taken-out substrate W is transferred to the next processing unit (antireflection film coating processing unit BARC _{1 in} this embodiment), and the processed substrate W is taken out from this processing unit. In this manner, the substrates W that have been processed in the respective processing units are moved to new processing units, so that the processing is performed in parallel on the plurality of substrates W. And it mounts in order on the mounting part P2 from the board | substrate W mounted previously in the mounting part P1, and pays out to the hierarchy K2. Similarly, the substrates W placed on the placement unit P2 are placed on the placement unit P1 in order from the substrate W, and are paid out to the ID unit 1.

[Main transport mechanisms T2, T4]
Since the operation of the main transport mechanism T4 is substantially the same as the operation of the main transport mechanism T2, only the main transport mechanism T2 will be described. The main transport mechanism T2 moves to a position facing the placement unit P2. At this time, the main transport mechanism T2 holds a wafer W received from a cooling unit CP ₂ accessed immediately before. The main transport mechanism T2 places the held substrate W on the placement portion P2b (step U21a) and holds the substrate W placed on the placement portion P2a (step U9a).

The main transport mechanism T2 accesses into the edge exposing unit EEW _2. The main transport mechanism T2 carries the held substrate W into the edge exposure unit EEW ₂ and receives the substrate W that has been subjected to predetermined processing from the edge exposure unit EEW ₂ . The edge exposure unit EEW ₂ irradiates the peripheral edge of the substrate W from a light irradiation unit (not shown) while rotating the loaded substrate W. Thereby, the periphery of the substrate W is exposed (step U10a).

The main transport mechanism T2 accesses the mounting portion P5 holding the wafer W received from the edge exposing unit EEW _2. Then, the substrate W held is placed on the placement part P5a (step U11a), and the substrate W placed on the placement part P5b is held (step U16a).

The main transport mechanism T2 is moved in one of the cooling units CP _2, the wafer W held by replacing the substrate W in the cooling unit CP _2. The main transport mechanism T2 accesses the developing units DEV ₂ holds the wafer W having received cooling treatment. Cooling unit CP ₂ starts treatment of the newly loaded wafer W (step U17A).

The main transport mechanism T2 takes a wafer W that has been developed from the developing unit DEV _2, and places the cooled wafer W on the spin holder 61 of the developing unit DEV _2. The development processing unit DEV ₂ develops the substrate W placed on the rotation holding unit 61 (step U18a). Specifically, while the rotation holding unit 61 rotates the substrate W in a horizontal posture, the developing solution is supplied from one of the slit nozzles 67 to the substrate W to develop the substrate W.

The main transport mechanism T2 accesses the heating units HP ₂ holding a substrate W which is developed. Then, the substrate W is unloaded from the heating unit HP ₂ and the substrate W to be held is put into the heating unit HP ₂ . Subsequently, the main transport mechanism T2, together transports the wafer W taken out of the heating unit HP ₂ to one of the cooling units CP _2, takes out the substrate W that is already processing completed in this cooling unit CP _2. The heating unit HP ₂ and the cooling unit CP ₂ each perform a predetermined process on the unprocessed substrate W (Step U19a, Step U20a).

  Thereafter, the main transport mechanism T2 accesses the placement unit P2 again and repeats the above-described operation. This operation is controlled by the fourth controller 104. Thereby, the board | substrate W is discharged | paid out to the mounting part P5a according to the order mounted on the mounting part P2a. Similarly, the substrates W are delivered to the placement portion P2b in the order in which the substrates W are placed on the placement portion P5b.

[Sub-transport mechanisms T _IFA1 , T _IFA2 ]
Since the operation of the auxiliary transport mechanism _{T IFA1} is substantially the same as the operation of the auxiliary transport mechanism _{T IFA2,} a description will be given only secondary transport mechanism _{T IFA1.} The sub transport mechanism _{TIFA1 accesses} the placement unit P5 and receives the substrate W placed on the placement unit P5a (step U11a). The sub transport mechanism _TIFA1 holds the received substrate W, moves to the placement part P7, and places it on the placement part P7a (step U12a).

Then, the sub-transport mechanism _{T IFA1} receives the substrate W from the mounting portion P7b (step U14a), and moves to a position opposed to the heating and cooling units PHP _2. Then, the sub-transport mechanism _{T IFA1} retrieves the of the heating and cooling unit PHP ₂ already heated after exposure from (PEB) processing has finished substrate W, and carries the wafer W received from the mounting portion P7b the heating and cooling units PHP _2. The heating / cooling unit PHP ₂ heat-treats the unprocessed substrate W (step U15a). The sub transport mechanism T _IFA1 transports the substrate W taken out from the heating / cooling unit PHP ₂ to the placement unit P5b (step U16a).

Thereafter, the first IF transport mechanism _TIFA1 accesses the mounting portion P5 again and repeats the above-described operation. This operation is controlled by the seventh controller 107.

[Second Main Transfer Mechanism T _IFM / Second Preliminary Transfer Mechanism T _IFS ]
An operation example of the second main transport mechanism _TIFM and the second preliminary transport mechanism _TIFS will be described. Since the operations of both are the same, the description of the operation of the second preliminary transport mechanism _TIFS is omitted by describing the operation of the second main transport mechanism _TIFM .

The second main transport mechanism _{T IFM} takes out the substrate W from the mounting portion P7a (step U12a), transports it to the exposing machine EXP. The exposure machine EXP exposes the substrate W (step U13). Then, when the exposed substrate W delivered from the exposure machine EXP is received, it is transported to the placement part P7b (step U14a). Subsequently, the second main transport mechanism _{T IFM} takes out the substrate W from the mounting portion P8a (step U12b), transported to the exposing machine EXP (step U13). Then, the substrate W paid out from the exposure machine EXP is transferred to the placement part P8b (step U14b).

Thereafter, the second main transport mechanism _TIFM accesses the placement portion P7 again and repeats the above-described operation. This operation is controlled by the ninth controller 109.

Moreover, any case where one of the substrate treatment lines L and abnormality in the secondary transport mechanism T _IFA corresponding thereto occurs, discontinue the substrate transfer to the secondary transport mechanism T _IFA corresponding to one of the substrate treatment lines L The ninth controller 109 controls the second main transport mechanism _TIFM so that the substrate W is transported only to the sub transport mechanism _TIFA corresponding to the other substrate processing row L.

Thus, according to the substrate processing apparatus according to the first embodiment, the IF unit 5 is replaced with the second main transport mechanism _TIFM that transports the substrate W to the exposure apparatus EXP, and the second main transport mechanism _TIFM . in Te in that it comprises a second preliminary transport mechanism T _IFS for transporting the substrate W to the exposing machine EXP, when an abnormality to the second main transport mechanism T _IFM functions of the second main transport mechanism T _IFM or resulting drops even, it is possible to perform the substrate transfer second preliminary transport mechanism T _IFS is instead of the second main transport mechanism T _IFM. Therefore, the reliability of substrate conveyance in the IF unit 5 can be improved.

Further, even when one of the second main transport mechanism _TIFM and the second preliminary transport mechanism _TIFS performs maintenance or inspection, the other continues the operation of the apparatus 10 by transporting the substrate in the IF unit 5. be able to.

Further, since the second standby area Ab1 is formed in the IF section 5 (rear transport section 5b), the switching from the second main transport mechanism _TIFM to the second preliminary transport mechanism _TIFS can be performed quickly. For this reason, the board | substrate conveyance efficiency in IF part 5 can be maintained favorable. In addition, since the second retreat area Ab2 is formed in the IF unit 5 (rear transport unit 5b), the second main transport mechanism TIFM can also be retracted quickly.

In the layout in which the IF unit 5 and the exposure unit EXP are arranged in the x-axis direction in plan view, the second standby area Ab1 and the second retreat area Ab2 are moved from the second main transport area Ab3 / second preliminary transport area Ab4 to the y-axis. Since it is formed at a position deviated in the direction, the second main transport area Ab3 / second preliminary transport area Ab4 can be suitably formed at a position facing the delivery position with the exposure machine EXP. For this reason, even when the second standby area Ab1 and the second evacuation area Ab2 are provided in the IF unit 5, the transport efficiency of the second main transport mechanism _TIFM and the first preliminary transport mechanism _TIFS may decrease. Absent.

Further, the second main transport area Ab3 and the second preliminary transport area Ab4 are substantially matched, the second standby area Ab1 is disposed on one side in the y-axis direction of the second main transport area Ab3, and the second retreat area is disposed on the other side. Area Ab2 is arranged. According to such an arrangement, it is allowed to increase the height of the second main transport area Ab3 compared to the case where the areas Ab1 and Ab2 are disposed in the vertical direction of the second main transport area Ab3. There are no restrictions on the height dimensions of the main transport mechanism _TIFM and the second preliminary transport mechanism _TIFS . Further, when switching, a second main transport mechanism _{T IFM} to move to the second save area Ab2, a second preliminary transport mechanism _{T IFS} to move to the second main transfer region Ab3 absence may interfere.

Further, since the second main transport mechanism _TIFM and the second preliminary transport mechanism _TIFS have the same structure, the apparatus configuration can be simplified.

Further, since the second preliminary transport mechanism _{T IFS} is configured to be movable second main transport mechanism _{T IFM} toward the second main transfer region Ab3 the second preliminary transfer region Ab4, second main transport mechanism _{T IFM} Even if it cannot move to the second retreat area Ab2 by itself, the second main transport mechanism _TIFM can be forcibly positioned in the second retreat area Ab2. Therefore, switching from the second main transport mechanism _TIFM to the second preliminary transport mechanism _TIFS can be performed reliably.

Since the second preliminary transport mechanism _{T IFS} moves from the second waiting region Ab1 to the second main transfer region Ab3, it can provide a force to push the second save area Ab2 directly to the second main transport mechanism _{T IFM} . Therefore, the second preliminary transport mechanism T _IFS is without requiring that a drive mechanism for moving the exclusively second main transport mechanism T _IFM separately, it is possible to prevent the apparatus configuration becomes complicated. Moreover, the second preliminary transport mechanism _{T IFS} is to move to the second save area Ab2 pushes the second main transport mechanism _{T IFM} can be directly extremely simplified construction of the second preliminary transport mechanism _{T IFS.}

Further, since each of the second main transport mechanism T _IFM and the second preliminary transport mechanism T _IFS includes the buffer material 87, the second main transport mechanism T _IFM or the second preliminary transport mechanism T _IFS is damaged when contacting. Can be prevented.

Further, since the guide rail 12 for guiding the second main transport mechanism _TIFM and the second preliminary transport mechanism _TIFS on the same track is provided, the second preliminary transport mechanism _TIFS is switched to the second main transport mechanism at the time of switching. _TIFM can be pressed reliably.

In addition, since the controller 93 that switches from the second main transport mechanism _TIFM to the second preliminary transport mechanism _TIFS is provided, the substrate transport can be preferably continued. Further, since the position detection sensor 89 is provided, it is possible to quickly switch when the second main transport mechanism _TIFM becomes defective. Furthermore, since the input unit 91 is provided, switching can be performed at an arbitrary timing.

Further, when the second main transport mechanism _TIFM holds the substrate W when performing the switching control, the transport of the substrate W is stopped, and thereafter the holding arm 86 of the second main transport mechanism _TIFM There is no risk of entering the placement position P7 or P8 in the delivery position of the exposure apparatus EXP. Therefore, the holding arm 86 and operates in a state of entering the cassette C inside the like is stopped, it is possible to the second main transport mechanism T _IFM to avoid becoming immovable to the second save area Ab2. Therefore, the second main transport mechanism _TIFM can be reliably retracted. Further, the substrate conveyance in the IF unit 5 can be quickly restored.

The control unit 93, when switching from the second main transport mechanism _{T IFM} to the second preliminary transport mechanism _{T IFS,} first, to drive the first main transport mechanism _{T IFM} second save area Ab2 (step S6) Move yourself. In this case, if the second main transport mechanism _TIFM cannot be positioned in the second retreat area Ab2, then the movable base 83 of the second preliminary transport mechanism _TIFS is driven to drive the second main transport mechanism. the T _IFM is moved to the second save area Ab2 (step S8). Thus, retraction of the second main transport mechanism _{T IFM} is earlier than the step S8 that the second preliminary transport mechanism _{T IFS} moves the second main transport mechanism _{T IFM,} the second main transport mechanism _{T IFM} is on its own By performing the moving step S6, the frequency of direct contact between the second main transport mechanism _TIFM and the second preliminary transport mechanism _TIFS can be suppressed. In addition, since there are two methods for retracting the second main transport mechanism _TIFM , switching can be performed more reliably.

Further, when the second preliminary transport mechanism _TIFS is driven and the second main transport mechanism _TIFM is pushed, the control unit 93 controls the second main transport mechanism _TIFM to be unlocked so as to be freely movable in the y-axis direction. Therefore, the second main transport mechanism _TIFM can be suitably moved to the second retreat area Ab2.

  The same applies to the ID unit 1.

Further, the IF unit 5 is provided separately for each of the plurality of substrate processing rows L, and includes the sub transport mechanisms T _IFA1 and T _IFA2 that transport the substrate W to the corresponding substrate processing row L. Therefore, the IF unit 5 Therefore, the reliability of the substrate transfer to the processing unit 3 is also high. Furthermore, the processing unit 3 having a plurality of substrate processing rows L is also highly reliable in substrate transport. That is, the apparatus 10 includes the main transport mechanisms T1, T2 between the first main transport mechanism T _IDM / first preliminary transport mechanism T _IDS and the second main transport mechanism T _IFM / second preliminary transport mechanism T _{IFS. And} a path through which the substrate W is transported by the sub transport mechanism T _IFA1 and a path through which the substrate W is transported by the main transport mechanisms T3 and T4 and the sub transport mechanism T _IFA2 . Therefore, even if an abnormality occurs in any one of the main transport mechanism T1-T4 and the sub transport mechanisms T _IFA1 and T _IFA2 , the substrate W is transported through another path that does not include the transport mechanism. Can be made.

Further, since the sub transport mechanisms T _IFA1 and T _IFA2 are arranged on the processing unit 3 side in the IF unit 5, the operation amount of the sub transport mechanisms T _IFA1 and T _IFA2 can be reduced. In addition, since the second main transport mechanism _TIFM and the second preliminary transport mechanism _TIFS are arranged on the exposure machine EXP side in the IF section 5, the second main transport mechanism _TIFM and the second preliminary transport mechanism _TIFS The amount of operation during substrate transfer can be reduced.

In addition, since the sub transport mechanisms T _IFA1 and T _IFA2 are provided in the vertical direction, it is possible to suppress an increase in the installation area of the IF unit 5.

Further, since the auxiliary transport mechanism _{T IFA1, T IFA2} blocking member 71 between the adjacent are provided, it is possible to maintain the atmosphere around each sub-transport mechanism _{T IFA1, T IFA2} each cleaning.

Further, since the sub-transport mechanisms T _IFA1 and T _IFA2 transport the substrate W to the heating / cooling units PHP ₂ and PHP ₄ , the time from the exposure of the substrate W by the exposure machine EXP to the post-exposure heat treatment is suitable. Can be managed and adjusted.

Further, since the placement portions P7 and P8 are provided in the vertical direction, the amount of movement in the horizontal direction can be reduced when the second main transport mechanism _TIFM and the second preliminary transport mechanism _TIFS access both. . For this reason, an increase in the installation area of the IF unit 5 can be suppressed.

Further, since the sub-transport mechanism _TIFA1 and the mounting portion P7 and the sub-transport mechanism _TIFA2 and the mounting portion P8 are provided so as to be aligned in the y-axis direction, the length of the IF portion 5 in the x-axis direction is suppressed. be able to.

Further, since the blocking member 79 is provided between the front transport unit 5a and the rear transport unit 5b, the atmosphere around the second main transport mechanism _TIFM and the second preliminary transport mechanism T _IFS and the sub transport mechanism T _IFA The surrounding atmosphere can be kept clean.

Embodiment 2 of the present invention will be described below with reference to the drawings. In the second embodiment, in the substrate processing apparatus described in the first embodiment, the sub-transport mechanism _TIFA is omitted, and the configuration of the processing block Bb and the IF unit 5 described in the first embodiment is changed accordingly. Is. For this reason, in the second embodiment, the processing block Bb and the IF unit 5 will be mainly described.

FIG. 14 is a schematic diagram illustrating a schematic configuration of the substrate processing apparatus according to the second embodiment. Placing portion P5, P6 is a hierarchical K2, K4, is disposed at a position facing the transporting space _A 2, _{A 4} be between IF section 5. The heating / cooling unit PHP provided in the levels K2 and K4 has a transfer port for the substrate W at a position facing the transfer spaces A ₂ and A ₄ . The main transport mechanisms T2 and T4 transport the substrate W to each heating and cooling unit PHP.

The first main transport area Aa3 and the first preliminary transport area Aa4 are formed at positions that include the shortest path connecting the mounting portions P5 and P6 and the exposure machine EXP, respectively, with the shortest distance. The first main transport area Aa3 and the first preliminary transport area Aa4 are substantially coincident. The second main transport mechanism _TIFM transports the substrate W to the exposure apparatus EXP and also transports the substrate W to the substrate processing rows Lu and Ld. In other words, the second main transport mechanism _{TIFM delivers the} substrate W to and from the main transport mechanism T2 through the placement unit P5, and the substrate W from the main transport mechanism T4 through the placement unit P6. Deliver. The second preliminary transport mechanism _{TIFS replaces} the second main transport mechanism _TIFM and transports the substrate W to the exposure apparatus EXP and each of the substrate processing rows Lu and Ld. The IF unit 5 according to the second embodiment does not include the placement units P7 and P8 and the buffer BF described in the first embodiment. The placement portions P5 and P6 in Embodiment 2 correspond to the first placement portion in the present invention.

Next, an operation example of the substrate processing apparatus according to the second embodiment will be described. The operations repeatedly performed by the main transport mechanisms T2, T4, the second preliminary transport mechanism _TIFS, and the second main transport mechanism _TIFM are different from those in the first embodiment, and will be described. Note that the processing unit or the placement unit that sequentially transports the substrates W is the same as that of the first embodiment (see FIG. 12) except that steps U12a, U12b, U14a, and 14b relating to the placement units P7 and P8 are omitted. It is. FIG. 15 is a diagram schematically illustrating operations that each transport mechanism repeatedly performs.

[Main transport mechanisms T2, T4]
Since the operation of the main transport mechanism T4 is substantially the same as the operation of the main transport mechanism T2, only the main transport mechanism T2 will be described. Access to the main transport mechanism T2 is placing portion P2, places the substrate W received from a cooling unit CP ₂ immediately prior to the placing portion P2b (step U21a), it is placed on the placing portion P2a substrate W Is held (step U9a).

Subsequently, the main transport mechanism T2 accesses the edge exposing unit EEW _2, the wafer W held is transported into the edge exposing unit EEW _2, predetermined processing from an edge exposing unit EEW ₂ is performed substrates W is received (step U10a). The main transport mechanism T2 accesses the placement unit P5, places the held substrate W on the placement unit P5a (step U11a), and holds the substrate W placed on the placement unit P5b ( Step U16a).

Subsequently, the main transport mechanism T2 accesses the of the heating and cooling units PHP _2, and loads the wafer W held on of the heating and cooling units PHP _2, predetermined processing of the heating and cooling unit PHP ₂ is a substrate W made Receive (step U15a).

Subsequently, the main transport mechanism T2 is moved in one of the cooling units CP _2, holding a by which the substrate W replacing the treated wafer W in the cooling unit CP ₂ (step U17A). Similarly, the main transport mechanism T2 accesses the development processing unit DEV ₂ , the heating unit HP ₂ , and the cooling unit CP ₂ in this order, takes out the processed substrate W from each unit, and carries in the unprocessed substrate W.

  Thereafter, the main transport mechanism T2 accesses the placement unit P2 again and repeats the above-described operation.

[Second Main Transfer Mechanism T _IFM / Second Preliminary Transfer Mechanism T _IFS ]
An operation example of the second main transport mechanism _TIFM and the second preliminary transport mechanism _TIFS will be described. Since the operations of both are the same, the description of the operation of the second preliminary transport mechanism _TIFS is omitted by describing the operation of the second main transport mechanism _TIFM .

The second main transport mechanism _{T IFM} takes out the substrate W from the mounting portion P5a (step U11A), transports it to the exposing machine EXP. The exposure machine EXP exposes the substrate W (step U13). Then, when the exposed substrate W delivered from the exposure machine EXP is received, it is transported to the placement part P7b (step U15a). Subsequently, the second main transport mechanism _{T IFM} takes out the substrate W from the mounting portion P6a (step U11b), transported to the exposing machine EXP (step U13). Then, the substrate W paid out from the exposure machine EXP is transported to the placement part P6b (step U15b).

Thereafter, the second main transport mechanism _TIFM accesses the placement portion P7 again and repeats the above-described operation. This operation is controlled by the ninth controller 109.

Thus, also in the substrate processing apparatus according to the second embodiment, the IF unit 5 includes the second main transport mechanism T _IFM that transports the substrate W to the processing unit 3 and the exposure apparatus EXP, and the second main transport mechanism T. _By providing the second preliminary transport mechanism _TIFS for transporting the substrate W to the processing unit 3 and the exposure machine EXP instead of the _IFM , the reliability of the substrate transport in the IF unit 5 can be improved.

  Further, since the substrate transfer in the IF unit 5 does not include the transfer of the substrate W to each heating / cooling unit PHP provided in the layers K2 and K4, the load of the substrate transfer in the IF unit 5 can be relatively reduced. Therefore, the reliability of substrate conveyance in the IF unit 5 can be improved.

Further, since the placement portions P5 and P6 are provided in the vertical direction, the amount of movement in the horizontal direction can be reduced when the second main transport mechanism _TIFM and the second preliminary transport mechanism _TIFS access both. . For this reason, an increase in the installation area of the IF unit 5 can be suppressed.

  The present invention is not limited to the above-described embodiment, and can be modified as follows.

  (1) In each of the above-described embodiments, the second standby area Ab1 and the second retreat area Ab2 are provided on both sides of the second main transport area Ab3. However, the present invention is not limited to this. The arrangement of the second standby area Ab1 and the second retreat area Ab2 can be appropriately selected and designed. Hereinafter, modified embodiments will be described with reference to the drawings.

Please refer to FIG. 16 and FIG. FIG. 16 is a plan view showing a main part of a substrate processing apparatus according to a modified embodiment, and FIG. 17 is a front view of the IF unit 5. FIG. 17A shows the time when the second main transport mechanism _TIFM is transporting the substrate, and FIG. 17B shows the time when the second preliminary transport mechanism _TIFS is transporting the substrate. In addition, about the same structure as an Example, detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol.

  As shown in the drawing, the second standby area Ab1 is provided at a position off the upper side of the second main transport area Ab3. Further, the second evacuation area Ab2 is provided at a position off the lower side of the second preliminary transport area Ab4.

The basic structure of the second main transport mechanism _{TIFM is} the same as that of each embodiment, and is provided independently on the lower part of the IF unit 5. The movable table 83 moves the second retreat area Ab2 in the y-axis direction even when the substrate is transported. As the elevating shaft 84 moves up and down in the vertical direction, the holding arm 86 moves into the second retreat area Ab2. As described above, the second main transport mechanism _TIFM is configured to be displaceable to the second retreat area Ab2.

A suspension guide rail 121 is installed on the top of the IF section 5. The suspension guide rail 121 guides the movable base 83 in the y-axis direction and supports the second preliminary transport mechanism _TIFS in a suspended manner. The movable base 83 moves in the second standby area Ab1 in the y-axis direction. As the lifting / lowering shaft 84 of the second preliminary transport mechanism _TIFS moves up and down in the vertical direction, the holding arm 86 moves into the second standby area Ab1. As described above, the second preliminary transport mechanism _TIFS is configured to be displaceable to the second standby area Ab1. Each movable base 83 of the second main transport mechanism _TIFM and the second preliminary transport mechanism _TIFS also corresponds to the base in the present invention. Incidentally, the second main transport mechanism _{T IFM} and second preliminary transport mechanism _{T IFS} alternative embodiment does not include a buffer material 87.

  As in this modification, the second evacuation area Ab2 may be changed so as to overlap the second main transport area Ab3. Further, the second standby area Ab1 may be changed so as to overlap the second preliminary transport area Ab4. Further, the second main transport area Ab3 and the second preliminary transport area Ab4 may be changed so as not to substantially match (become different areas).

Further, a blocking member 123 that blocks the atmosphere between the second main transport mechanism _TIFM and the second preliminary transport mechanism _TIFS is provided in the IF section 5 so as to be movable up and down. The blocking member 123 is slidably supported on the guide rail 125 in the vertical direction. With this blocking member 123, the atmosphere around the second main transport mechanism _TIFM arranged particularly on the lower side can be kept clean. The blocking member 123 corresponds to the third blocking member in this invention.

In such a modification, switching is performed as follows. That is, the control unit 93, causes displaced from second main transfer region Ab3 drives the second main transport mechanism _{T IFM} in the second save area Ab2, second standby area by driving the second preliminary transport mechanism _{T IFS} It is displaced from Ab1 to the second preliminary transport area Ab4. Then, to continue the substrate transported by the second preliminary transport mechanism T _IFS of displacing the second preliminary transfer region Ab4.

Next, a second modified embodiment will be described. Please refer to FIG. FIG. 18 is a front view of the IF unit 5 according to the second modified embodiment. FIG. 18A shows the substrate transport time of the second main transport mechanism _TIFM , and FIG. 18B shows the substrate transport time of the second preliminary transport mechanism _TIFS . In addition, about the same structure as an Example, detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol.

  As shown in the figure, the second standby area Ab1 is provided at a position off the diagonally upper side of the second main transport area Ab3. The second evacuation area Ab2 is formed from the side of the second preliminary transport area Ab4 to the obliquely lower side.

Hereinafter, each configuration of the second main transport mechanism _TIFM and the second preliminary transport mechanism _TIFS will be briefly described. The second main transport mechanism _TIFM is provided independently on the lower part of the IF unit 5. The guide rail 82 guides the movable table 83 in the y-axis direction over the second main transport area Ab3 and the second retreat area Ab2. As the movable table 83 moves, the second main transport mechanism _TIFM is retracted from the second main transport area Ab3 to the second retreat area Ab2.

The second preliminary transport mechanism _TIFS is suspended and supported by a suspension guide rail 121 installed at the top of the IF section 5. The suspension guide rail 121 guides the movable base 83 in the y-axis direction from the second standby area Ab1 to the second preliminary transport area Ab4. By carriage 83 is moved, the second preliminary transport mechanism _{T IFS} moves from the second waiting region Ab1 to the second preliminary transfer region Ab4.

  Next, a third modified embodiment will be described. Refer to FIG. FIG. 19 is a plan view showing the main part of the substrate processing apparatus according to the third modified embodiment. In addition, about the same structure as an Example, detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol.

As illustrated, the IF unit 5 includes two sets of guide rails 127 and 129 that guide in the y-axis direction. One guide rail 127 guides the second main transport mechanism _TIFM in the y-axis direction, and the other guide rail 129 guides the second preliminary transport mechanism _TIFS in the y-axis direction. In this modified embodiment, the second main transport area Ab3 and the second preliminary transport area Ab4 substantially coincide. The second standby area Ab1 and the second retreat area Ab2 are provided on the same side in the y-axis direction with respect to the second main transport area Ab3 (second preliminary transport area Ab4).

(2) In each embodiment described above, the control unit 93 is controlled so as to be itself moved to the second save area Ab2 drives the first second main transport mechanism T _IFM when switching (step S6), and this Not limited to. For example, by omitting the step S6, the control unit 93 may always be the second preliminary transport mechanism T _IFS controlled so as to retract the second main transport mechanism T _IFM by pressing the second main transport mechanism T _IFM .

(3) In each of the embodiments described above, when the second main transport mechanism _TIFM holds the substrate W when performing the switching control, the control unit 93 stops the transport of the substrate W. Not limited to. For example, the second main transport mechanism _TIFM may be controlled to be retracted after the substrate W held when performing the switching control is delivered to the placement unit P or the like. In addition, when switching is performed according to a command from the input unit 91 and when switching is performed based on the detection result of the position detection sensor 89, handling of the substrate W held when switching control is performed (conveyance of the substrate W is continued). It may be configured to change whether or not to cancel.

(4) In each of the embodiments described above, the position detection sensor 89 that detects the position of the second main transport mechanism _TIFM is provided, but the present invention is not limited to this. For example, you may change so that the detection part which detects damages, such as drive sources, such as a motor of 2nd main conveyance mechanism _TIFM , and power transmission mechanisms, such as a belt, may be provided. Or you may change so that the detection part which detects dirt etc. of holding arm 86 may be provided.

(5) In each of the above-described embodiments, the buffer material 87 is provided in both the second main transport mechanism _TIFM and the second preliminary transport mechanism _TIFS , but may be configured to be provided only in one.

(6) In each of the above-described embodiments, the second main transport mechanism _TIFM is retracted by the second preliminary transport mechanism _TIFS being pressed directly. However, the present invention is not limited to this. For example, a power transmission mechanism capable of transmitting the power generated by the drive source of the second preliminary transport mechanism _TIFS to the second main transport mechanism _TIFM , the drive source of the second main transport mechanism _TIFM , it may be changed so as to drive the second main transport mechanism T _IFM by switching a drive source included in the pre-transport mechanism T _IFS.

  (7) In each of the embodiments described above, the processing unit 3 is configured to include two substrate processing rows L, but is not limited thereto. It may be changed so that three or more substrate processing rows L are configured and provided in multiple stages in the vertical direction. Or you may change so that the single board | substrate process line L may be provided.

  (8) In each of the above-described embodiments, the processing unit 3 having the substrate processing row L is configured by two processing blocks Ba and Bb. However, the present invention is not limited to this. Three or more processing blocks B may be arranged side by side.

  (9) In the above-described embodiment, the substrate processing row L performs a process of forming a resist film or an antireflection film on the substrate W, a post-exposure heating (PEB) process, and a development process. Absent. In the substrate processing line L, other processing such as cleaning processing may be performed on the substrate W. As a result, the type and number of each processing unit are appropriately selected and designed.

  (10) In the embodiment described above, no partition walls are provided between the antireflection film coating unit BARC and the resist film coating unit RESIST provided in each of the layers K1 and K2, and the atmosphere between the units is different. Although it communicated, it is not restricted to this. You may comprise so that atmosphere may be interrupted | blocked suitably.

  (11) You may change so that each structure of the substrate processing apparatus demonstrated by the Example and each modification mentioned above may be combined suitably. In particular, the ID unit 1 can be appropriately changed by applying the configuration of the IF unit 5 to the configuration of the ID unit 1.

It is a top view which shows schematic structure of the substrate processing apparatus which concerns on an Example. It is a schematic side view which shows arrangement | positioning of the processing unit which a substrate processing apparatus has. It is a schematic side view which shows arrangement | positioning of the processing unit which a substrate processing apparatus has. It is each vertical sectional view of the aa arrow in FIG. It is a front view of a conveyance part. (A) is a top view of a coating processing unit, (b) is sectional drawing of a coating processing unit. It is a perspective view of a main conveyance mechanism. It is a front view of IF section seen from exposure machine. It is a control block diagram of the substrate processing apparatus which concerns on an Example. It is a flowchart which shows switching operation. It is a front view of IF section. It is a flowchart which shows a series of processes performed to a board | substrate. It is a figure which shows typically the operation | movement which each conveyance mechanism repeats, respectively. FIG. 6 is a schematic diagram illustrating a schematic configuration of a substrate processing apparatus according to a second embodiment. It is a figure which shows typically the operation | movement which each conveyance mechanism repeats, respectively. It is a top view which shows the principal part of the substrate processing apparatus which concerns on a modified example. It is a front view of IF section concerning a modification, (a) shows at the time of substrate conveyance of the 2nd main conveyance mechanism, and (b) shows at the time of substrate conveyance of the 2nd preliminary conveyance mechanism. It is a front view of IF section concerning a modification, (a) shows at the time of substrate conveyance of the 2nd main conveyance mechanism, and (b) shows at the time of substrate conveyance of the 2nd preliminary conveyance mechanism. It is a top view which shows the principal part of the substrate processing apparatus which concerns on a modified example.

Explanation of symbols

1 ... Indexer part (ID part)
3 ... Processing unit 5 ... Interface unit (IF unit)
DESCRIPTION OF SYMBOLS 8 ... Mounting stand 9 ... Conveying part 31 ... Coating processing unit 41, 42 ... Heat processing unit DEV ... Development processing unit EEW ... Edge exposure unit PHP ... Heating / cooling unit 61 ... First blowing unit 61a ... First blowing port 62 ... Discharge unit 62a ... discharge port 65 ... second gas supply pipe 66 ... second gas discharge pipe 71 ... blocking member 74 ... elevating member 75 ... base portion 76 ... rotating arm 77 ... holding arm 79 ... blocking member 82 ... guide rail 83 ... movable stand 84: Elevating shaft 85 ... Rotating arm 86 ... Holding arm 87 ... Buffer material 89 ... Position detection sensor 91 ... Input unit 93 ... Control unit 91 ... Main controller 93-99 ... First to seventh controller P ... Mounting unit L, lu, Ld ... substrate treatment lines _{T 1, T 2, T 3} , T 4 ... processing unit for main transport mechanism T _{I A} ... auxiliary transport mechanism T _{IFM ...} second main transport mechanism T _{IFS ...} second preliminary transport mechanism Ab1 ... second waiting region Ab2 ... second retraction region Ab3 ... second main transfer region Ab4 ... second preliminary transfer region EXP ... exposure Machine
C ... cassette W ... substrate

Claims (22)

In a substrate processing apparatus for processing a substrate,
A processing unit for processing the substrate;
An interface unit provided adjacent to an exposure machine separate from the processing unit and the apparatus,
A main transport mechanism for transporting the substrate to the exposure machine;
A preliminary transport mechanism for transporting the substrate to the exposure machine instead of the main transport mechanism;
An interface unit having
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The preliminary transfer mechanism is configured to be displaceable to a standby area that is out of the main transfer area, which is a movable range when the substrate is transferred by the main transfer mechanism,
The substrate processing apparatus, wherein the main transport mechanism is configured to be displaceable to a retreat area that is out of a preliminary transport area, which is a movable area when the preliminary transport mechanism transports a substrate. The substrate processing apparatus according to claim 2,
The interface unit and the exposure unit are adjacent to each other in plan view.
In the plan view, the direction in which the interface unit and the exposure unit are aligned is a horizontal first direction.
The standby area is out of the main transport area in an arbitrary direction substantially orthogonal to the first horizontal direction,
The substrate processing apparatus, wherein the retreat area deviates from the preliminary transfer area in an arbitrary direction substantially orthogonal to the horizontal first direction. The substrate processing apparatus according to claim 3,
The substrate processing apparatus, wherein the processing unit, the interface unit, and the exposure device are arranged in a line in the first horizontal direction in this order in a plan view. In the substrate processing apparatus of Claim 3 or Claim 4,
The main transport area and the preliminary transport area are approximately the same,
The standby area is provided on one side of the main transfer area,
The substrate processing apparatus, wherein the retreat area faces the standby area across the main transfer area. In the substrate processing apparatus in any one of Claims 2-5,
The substrate processing apparatus, wherein the preliminary transfer mechanism is capable of moving the main transfer mechanism from the main transfer area toward the retreat area. The substrate processing apparatus according to claim 5,
A substrate processing apparatus, wherein the preliminary transport mechanism is capable of moving to the retreat area by directly pressing the main transport mechanism located in the main transport area. The substrate processing apparatus according to claim 7,
The preliminary transport mechanism
A movable base that moves in a horizontal second direction substantially orthogonal to the horizontal first direction;
A holding arm that is supported by the movable table and holds the substrate;
With
The substrate processing is characterized in that the holding arm moves from the standby area to the preliminary transfer area integrally with the movable table by moving the movable table, and pushes the main transfer mechanism located in the main transfer region toward the retreat area. apparatus. In the substrate processing apparatus of Claim 7 or Claim 8,
At least one of the main transport mechanism and the preliminary transport mechanism includes a buffer material that absorbs an impact when the preliminary transport mechanism presses the main transport mechanism. In the substrate processing apparatus in any one of Claims 7-9,
The interface section includes a common guide member that guides the preliminary transport mechanism across the standby area and the preliminary transport area, and guides the main transport mechanism across the main transport area and the retreat area on the same track as the preliminary transport mechanism. A substrate processing apparatus. In the substrate processing apparatus in any one of Claims 2-10,
A control unit is provided for displacing the main transport mechanism from the main transport area to the retreat area and displacing the preliminary transport mechanism from the standby area to the preliminary transport area and switching the main transport mechanism to the preliminary transport mechanism to perform substrate transport. A substrate processing apparatus. In the substrate processing apparatus in any one of Claims 7-10,
A controller that displaces the main transport mechanism from the main transport area to the retreat area and displaces the preliminary transport mechanism from the standby area to the preliminary transport area, and switches the main transport mechanism to the preliminary transport mechanism to perform substrate transport,
The control unit, when switching from the main transport mechanism to the preliminary transport mechanism, drives the preliminary transport mechanism to move the main transport mechanism to the retreat area. In the substrate processing apparatus in any one of Claims 7-10,
A controller that displaces the main transport mechanism from the main transport area to the retreat area and displaces the preliminary transport mechanism from the standby area to the preliminary transport area, and switches the main transport mechanism to the preliminary transport mechanism to perform substrate transport,
When switching from the main transport mechanism to the preliminary transport mechanism, the control unit drives the main transport mechanism to move it to the retract area, and in this case, the main transport mechanism cannot be positioned in the retract area. Is a substrate processing apparatus which drives the preliminary transport mechanism to move the main transport mechanism to the retreat area. In the substrate processing apparatus of Claim 12 or Claim 13,
When the controller moves the main transport mechanism to the retreat area by driving the preliminary transport mechanism, the controller performs in advance a lock release state in which the main transport mechanism can be freely moved from the main transport area to the retreat area. apparatus. In the substrate processing apparatus in any one of Claims 11-14,
When the main transport mechanism holds the substrate when switching from the main transport mechanism to the preliminary transport mechanism, the control unit stops transporting the substrate and moves the main transport mechanism to the retreat area. 2. A substrate processing apparatus, wherein conveyance is started from a subsequent substrate. In the substrate processing apparatus in any one of Claims 11-15,
A detection unit for detecting at least one of the position, damage and dirt of the main transport mechanism;
And the control unit switches from the main transport mechanism to the preliminary transport mechanism when it is determined that an abnormality has occurred in the main transport mechanism based on the detection result of the detection unit. The substrate processing apparatus in any one of Claims 1-16,
The main transport mechanism transports the substrate to the processing unit,
A substrate processing apparatus, wherein the preliminary transport mechanism transports a substrate to a processing unit instead of the main transport mechanism. The substrate processing apparatus according to claim 17, wherein
The processing unit includes a plurality of substrate processing rows each having a processing unit that processes a substrate and a main transfer mechanism for a processing unit that transports the substrate to the processing unit, and processes the substrate in parallel in each substrate processing row. Done
A substrate processing apparatus, wherein each of a main transport mechanism and a preliminary transport mechanism transports a substrate to each substrate processing row. The substrate processing apparatus in any one of Claims 1-16,
The processing unit includes a plurality of substrate processing rows each having a processing unit that processes a substrate and a main transfer mechanism for a processing unit that transports the substrate to the processing unit, and processes the substrate in parallel in each substrate processing row. Done
The interface unit is provided separately for each substrate processing row, and transports the substrate to and from the corresponding substrate processing row, and transfers a plurality of sub-portions for transferring the substrate to and from the main transport mechanism and the preliminary transport mechanism. A substrate processing apparatus comprising a transport mechanism. The substrate processing apparatus according to claim 19,
Each sub-transport mechanism is arranged on the processing unit side in the interface unit,
A substrate processing apparatus, wherein the main transport mechanism and the preliminary transport mechanism are arranged on the exposure machine side in the interface section. The substrate processing apparatus according to claim 19 or 20,
Each substrate processing row is provided side by side in the vertical direction,
Each sub-transport mechanism is opposed to a corresponding substrate processing row, and is arranged side by side in the vertical direction. The substrate processing apparatus according to any one of claims 19 to 21,
A substrate processing apparatus, wherein a first blocking member that blocks an atmosphere is provided between the sub-transport mechanisms.

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