JP2009231625A - Substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of reducing the installation area of an apparatus having a main conveyance mechanism for conveying a substrate to a plurality of processing units. <P>SOLUTION: Coating processing units 31a-c are provided at one side in a nearly horizontal direction perpendicularly crossing a conveyance route R of the main conveyance mechanism T for coating. Each of the adjacent coating processing units 31a-c is arranged while forming a line in a slanting direction to the conveyance route R in a plan view, thus shortening the conveyance route R of the main conveyance mechanism T for coating as compared with when arranging the respective coating processing units 31a-c in parallel with the conveyance route R. Also, a space for installing the coating processing units 31a-c can be shortened for the length in the direction of the conveyance route R. In this manner, the installation area of the main conveyance mechanism T for coating and the coating processing units 31a-c can be reduced. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus for performing a series of processes on a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a substrate for an optical disk, etc. (hereinafter simply referred to as “substrate”).

Conventionally, as this type of apparatus, there is a substrate processing apparatus that forms a coating film on a substrate and develops the substrate exposed by a separate exposure machine. This apparatus includes various processing units such as a coating processing unit for applying a processing liquid (for example, a resist film material or a processing liquid for an antireflection film) and a developing processing unit for supplying a developing liquid to a substrate. A main transport mechanism for transporting the substrate is provided. Then, the main transport mechanism sequentially transports the substrate W to various processing units, and performs a series of processes on the substrate (see, for example, Patent Document 1).
JP 2003-324139 A

However, the conventional example having such a configuration has the following problems.
That is, in the conventional apparatus, since the processing units are arranged in a line on one side of the main transport mechanism, the total length of the processing units in the alignment direction becomes long, and the substrate transport distance of the main transport mechanism becomes long. is there. Further, there is a disadvantage that the installation area of the main transport mechanism and the processing unit is increased.

  This invention is made in view of such a situation, Comprising: It provides the substrate processing apparatus which can reduce the installation area of the apparatus provided with the main conveyance mechanism which conveys a board | substrate to several process units. With the goal.

In order to achieve such an object, the present invention has the following configuration.
That is, the invention according to claim 1 is a substrate processing apparatus for processing a substrate, and is provided on one side in a substantially horizontal direction orthogonal to a main transport mechanism for transporting a substrate and a transport path of the main transport mechanism, Each of the adjacent processing units is arranged so as to be arranged in an oblique direction with respect to the transport path in plan view, and the main transport mechanism is a substrate along the transport path. And a substrate is transported to the processing unit.

  [Operation / Effect] According to the first aspect of the present invention, adjacent processing units are arranged in an oblique direction with respect to the transport path in plan view. For this reason, compared with the space | interval of adjacent processing units, the distance with respect to the direction of a conveyance path | route of this space | interval can be shortened. Therefore, the transport path of the main transport mechanism can be shortened compared to the case where the processing units are arranged in parallel to the transport path. Further, the installation space for the processing unit can be shortened by the length in the direction of the transport path. As a result, the installation area of the main transport mechanism and the processing unit can be reduced.

  In the present invention, it is preferable that the orthogonal projections on the vertical plane including the transport path do not overlap each other in each processing unit. Since the main transport mechanism can directly face each processing unit, the operation of the main transport mechanism transporting the substrate to each processing unit can be suppressed from affecting the substrates of other processing units.

  In the present invention, the processing units are preferably arranged in a staggered manner (claim 3). Adjacent processing units can be suitably arranged in an oblique direction with respect to the transport path in plan view.

  In the present invention, it is preferable that the processing unit is disposed on a first imaginary curve curved in a convex shape on the side where the main transport mechanism is provided in plan view. The variation in distance from the main transport mechanism to each processing unit tends to increase. However, when viewed from the side opposite to the side where the main transport mechanism of each processing unit is provided, the variation in distance to each processing unit is relatively small. For this reason, the mechanism and instrument provided corresponding to the processing unit can be suitably installed on the side opposite to the side where the main transport mechanism of each processing unit is provided. In addition, it is possible to easily configure the above-described mechanism or the like corresponding to a plurality of processing units so that the plurality of processing units share the mechanism.

  In the present invention, it is preferable that the processing unit is provided on a side opposite to the side on which the main transport mechanism is provided, and includes a supply unit that supplies the processing liquid to the substrate. Compared with the case where the supply unit is provided on the side where the main transport mechanism of the processing unit is provided, the range where the movable range of the supply unit and the main transport mechanism overlap can be reduced. For this reason, it can suppress suitably that both interfere.

  In the present invention, the supply unit is disposed on the side opposite to the side where the main transport mechanism of the processing unit is provided, and includes a plurality of nozzles that discharge the processing liquid, and the side on which the main transport mechanism of the nozzle is provided. Is provided on the opposite side, and preferably includes a nozzle moving mechanism that selectively holds one nozzle and moves it above the substrate. By providing a nozzle moving mechanism that is provided separately from the nozzles and that can hold the nozzles and separate the held nozzles, a plurality of nozzles can be selected by a single nozzle moving mechanism. Therefore, a supply part can be made into a simple structure.

  In the present invention, it is preferable that the nozzle moving mechanism can turn in a substantially horizontal plane and can advance and retreat in the turning radius direction. The nozzle moving mechanism can move the nozzle to an arbitrary position in the horizontal plane.

  The present specification also discloses an invention relating to the following substrate processing apparatus.

  (1) The substrate processing apparatus according to any one of claims 1 to 7, wherein the processing unit is a development processing unit for developing a substrate.

  According to the substrate processing apparatus as described in said (1), a coating film can be formed suitably in a board | substrate.

  (2) The substrate processing apparatus according to any one of claims 1 to 7, wherein the processing unit is a coating processing unit that applies a coating material to a substrate.

  According to the substrate processing apparatus as described in said (2), a board | substrate can be developed suitably.

  (3) The substrate processing apparatus according to any one of claims 1 to 7, wherein the processing unit holds a single substrate in a horizontal posture.

  (4) The substrate processing apparatus according to any one of claims 1 to 7, wherein the transport path is in a horizontal uniaxial direction.

  (5) The substrate processing apparatus according to any one of claims 1 to 7, wherein the processing units are provided close to each other.

  According to the substrate processing apparatus as described in said (5), an installation area can be reduced more.

  (6) The substrate processing apparatus according to claim 6 or 7, wherein the nozzle moving mechanism moves the nozzle with respect to two or more processing units.

  According to the substrate processing apparatus as described in said (6), the number of nozzle moving mechanisms can be reduced with respect to the number of processing units, and a structure can be simplified.

  (7) In the substrate processing apparatus according to claim 6 or 7, the nozzle is disposed on a second imaginary curve curved in a convex shape on the side on which the main transport mechanism is provided in plan view. A substrate processing apparatus.

  According to the substrate processing apparatus as described in said (7), the dispersion | variation in the distance from a nozzle moving mechanism to each nozzle can be suppressed comparatively. Thereby, the nozzle moving mechanism can access each of the plurality of nozzles.

  (8) The substrate processing apparatus according to claim 4, wherein the first virtual curve is an arc centered on a virtual straight line orthogonal to a substantially central point of the transport path in plan view. Processing equipment.

  According to the substrate processing apparatus as described in said (8), since a processing unit can be arrange | positioned substantially symmetrical with respect to a virtual straight line, the utilization efficiency of space can be improved.

  (9) In the substrate processing apparatus according to (7), the second virtual curve is an arc centered on a point on a virtual straight line that is orthogonal to a substantially central point of the transport path in plan view. A substrate processing apparatus.

  According to the substrate processing apparatus as described in said (9), since a nozzle can be arrange | positioned substantially symmetrically with respect to a virtual straight line, the utilization efficiency of a space can be improved.

  (10) In the substrate processing apparatus according to claim 6 or 7, the nozzle moving mechanism is capable of turning about a point on an imaginary straight line orthogonal to a substantially central point of the transport path in plan view. A substrate processing apparatus.

  According to the substrate processing apparatus described in (10) above, the nozzle moving mechanism can move the nozzle to the left and right of the virtual straight line, so that the range in which the nozzle can be moved can be increased.

  (11) In the substrate processing apparatus according to claim 6 or 7, the nozzle moving mechanism includes a base fixedly provided in the apparatus, and is attached to the base so as to be rotatable about a substantially vertical axis. A substrate processing apparatus comprising: a multi-joint arm portion that operates within the multi-joint arm; and a grip portion that is attached to a free end portion of the multi-joint arm portion and grips one nozzle.

  According to the substrate processing apparatus as described in said (11), the nozzle moving mechanism which can be swiveled in a substantially horizontal plane and can be advanced / retreated in the turning radius direction can be suitably configured.

  According to the substrate processing apparatus of the present invention, adjacent processing units are arranged in an oblique direction with respect to the transport path in plan view. For this reason, compared with the space | interval of adjacent application | coating blocks, the distance with respect to the direction of a conveyance path | route of this space | interval can be shortened. Therefore, the transport path of the main transport mechanism can be shortened compared to the case where the processing units are arranged in parallel to the transport path. Moreover, about the installation space of a processing unit, the length of the direction of a conveyance path | route can be shortened. As a result, the installation area of the main transport mechanism and the processing unit can be reduced.

Embodiment 1 of the present invention will be described below with reference to the drawings.
FIG. 1 is a plan view illustrating a schematic configuration of a substrate processing apparatus according to the first embodiment, and FIGS. 2 and 3 are schematic side views illustrating an arrangement of processing units included in the substrate processing apparatus. These are each vertical sectional views of aa and bb in FIG.

  The first embodiment is a substrate processing apparatus that forms a resist film or the like on a substrate (for example, a semiconductor wafer) W and develops the exposed substrate W. The apparatus includes an indexer unit (hereinafter referred to as “ID unit”) 1, a processing unit 3, and an interface unit (hereinafter referred to as “IF unit”) 5. The ID unit 1, the processing unit 3, and the IF unit 5 are arranged in this order in a substantially horizontal direction and are installed adjacent to each other. Further, an exposure machine EXP, which is an external device separate from the present apparatus, is provided adjacent to the IF unit 5. The apparatus further includes an inter-mounting unit transport mechanism TP, and mounting units P arranged in various places.

  The ID unit 1 transports the substrate W to the cassette C that accommodates the substrate W and delivers the substrate to and from the processing unit 3.

  The processing unit 3 performs a coating process for forming a coating film on the substrate W and a developing process for developing the substrate W. The processing unit 3 is divided into a coating block B1 that performs coating processing and a development block B2 that performs development processing. The application block B1 and the development block B2 are arranged in a substantially horizontal direction and are installed adjacent to each other.

  The direction in which both the blocks B1 and B2 are arranged is preferably the direction connecting the ID part 1 and the IF part 5. Further, it is preferable that the coating block B1 is disposed on the ID portion 1 side and the developing block B2 is disposed on the IF portion 5 side. In other words, the ID portion 1 is disposed on the opposite side of the coating block B1 from the side where the developing block B2 is adjacent. The IF unit 5 is disposed on the side opposite to the side where the coating block B1 of the developing block B2 is adjacent.

  The IF unit 5 transports the substrate W to and from an exposure machine EXP separate from the present apparatus. The exposure machine EXP exposes the substrate W. Hereinafter, the ID unit 1, the processing unit 3, the IF unit 5, and the like will be described. In addition, the characteristic structure of this invention is employ | adopted for the application | coating block B1.

[ID part 1]
The ID unit 1 includes a cassette mounting table 9 and an ID transport mechanism T _ID . The cassette mounting table 9 can mount a plurality of (for example, four) cassettes C in a line. Each cassette C accommodates a plurality of substrates W arranged in a vertical direction in a substantially horizontal posture. The ID transport mechanism T _ID transports the substrate W to each cassette C and transports the substrate W to the coating block B1. The ID transport mechanism T _ID includes a movable table 21 that horizontally moves the side of the cassette mounting table 9 in the direction in which the cassettes C are arranged, a lifting shaft 23 that expands and contracts in the vertical direction with respect to the movable table 21, and the lifting shaft 23. And a holding arm 25 that holds the substrate W by moving back and forth in the turning radius direction.

[Coating block B1]
The application block B <b> 1 delivers the substrate W from the ID unit 1 to the IF unit 5 or from the IF unit 5 to the ID unit 1 while performing a process of applying a processing liquid to the substrate W. The application block B1 is divided into a plurality (four layers) of layers K in the vertical direction. In the hierarchy K1 to the hierarchy K3, processing is mainly performed on the substrate W, and the hierarchy K4 mainly inspects the substrate W. The level K4 is disposed on the lowermost side of the coating block B1, and the levels K1, K2, and K3 are stacked in the upper direction on the upper side of the level K4.

  The layers K1, K2, and K3 are provided with application main transport mechanisms T1, T2, and T3, respectively. In the following, when the coating main transport mechanisms T1, T2, and T3 are not particularly distinguished, they are simply referred to as “coating main transport mechanism T”.

  Each of the application main transport mechanisms T1-T3 is disposed at the approximate center of each of the layers K1-K3 in plan view. Each application main transport mechanism T transports the substrate W between both side portions of the layer K passing through the approximate center of each layer and facing the ID unit 1 side and the IF unit 5 side. At this time, the coating main transport mechanism T may deliver the substrate W to the outside of the layer K at both sides or receive the substrate W from the outside of the layer K (for example, the coating main transport mechanism T1). Alternatively, the substrate W may be transferred to and from the outside of the layer K only at one of the side portions, and the substrate W may be reciprocated between both side portions of the layer K (for example, the main transfer mechanism T2 for coating, T3). In this specification, a path connecting these two side portions is referred to as “a transport path R of the coating main transport mechanism T” or simply “a transport path R”. The conveyance path R is a single horizontal axis extending substantially linearly. The transport routes R of the respective levels K1-K3 are substantially the same position in plan view. The substrate W is transported by the coating main transport mechanism T1 not only to the transport path R but also to the substrate processing unit 31 (described later), for example.

  In each level K1-K3, transport areas A1, A2, and A3 are formed around the transport path R. Specifically, the transport area A1-A3 is an area that passes through substantially the center of each layer K1-K3 and extends to both sides of the coating block B1 in a direction connecting the ID part 1 and the IF part 5. A blocking plate 27 is provided between the coating main transfer mechanisms T1, T2, and T3, and the atmospheres of the transfer areas A1, A2, and A3 are blocked from each other.

  A plurality of coating processing units 31 are provided side by side on one side in a substantially horizontal direction orthogonal to the transport path R of each coating main transport mechanism T. Therefore, all the coating processing units 31 in each level K are located on one side of the main transport mechanism T for application in the level K. The coating processing unit 31 corresponds to the processing unit in this invention.

  The coating processing unit 31 applies a processing liquid (coating material) to the substrate W. The same kind of coating processing unit 31 is provided in each of the levels K1 to K3. In addition, different types of coating processing units 31 are provided between the levels K1 to K3.

  Specifically, in the level K1, a lower antireflection film coating processing unit BARC for applying a processing liquid for an antireflection film formed below the resist film is provided. In the level K2, a resist film coating processing unit RESIST for coating a resist film material is provided. In the level K3, there is provided an upper antireflection film coating processing unit TARC for applying an antireflection film processing liquid formed on the resist film.

  The coating unit 31 of each level K will be described with reference to FIGS. 1, 6, 7 and 8. FIG. 6 is a detailed plan view of the main part of the coating block, FIG. 7 is a vertical sectional view taken along the line aa in FIG. 6, and FIG. 8 is a front view taken along the line bb in FIG. . 6 shows the layout of the layer K1 because the placement parts P are arranged on both sides of the transport path R. However, in the case of the levels K2 and K3, the placement part P on one side of the transport path R is omitted. The

  As shown in FIG. 6, in each level K, three coating processing units 31a, 31b, and 31c are arranged in a substantially horizontal direction. No partition walls or partition walls are provided between the coating processing units 31. Therefore, the atmosphere around each coating processing unit 31 is not blocked (communicated) with each other.

  Adjacent coating processing units 31 are arranged in an oblique direction with respect to the transport path R. In the present embodiment, the center points Oa, Ob, and Oc of the coating processing units 31a-31c are on the first virtual curve L1 that is convexly curved to the side where the coating main transport mechanism T is provided in plan view. It is arranged to be located. Here, assuming that the transport route R is a route connected by the points Q1 and Q2, and one point at substantially the center (substantially middle) of the transport route R is a point Qm, the first virtual curve L1 is transported in plan view. It is preferably a substantially arc centered on a virtual straight line Lm perpendicular to the point Qm of the route R. Note that the substantially circular arc includes a part of a circle or an ellipse or an unclosed curve.

  Further, the respective coating processing units 31 are arranged close to each other. Proximity is a range in which the orthogonal projections of the coating processing units 31 on the vertical plane including the transport path R are not overlapped with each other, and the closer the coating processing units 31 are, the better. FIG. 8 corresponds to an orthogonal projection of each coating processing unit 31 onto a vertical plane including the transport path R.

  In this embodiment, as shown in FIG. 6, the adjacent coating processing units 31a-31b are positioned with a gap d1, and the adjacent coating processing units 31b-31c are spaced with a gap d2. ing. Further, since the arrangement direction of the adjacent coating processing units 31 and the conveyance path R form an angle larger than 0 degrees in plan view, the conveyance between the intervals d1 and d2 is larger than the intervals d1 and d2. The distances d1 ′ and d2 ′ with respect to the direction of the route R become shorter (see FIGS. 6 and 8). With regard to such a relationship, focusing on the center point O of the coating processing unit 31, the center points Oa and Ob are lowered perpendicularly to the transport path R compared to the distance between the center points Oa and Ob of the coating processing units 31a and 31b. In other words, when the distance between the points Oa ′ and Ob ′ becomes shorter.

  Each coating processing unit 31 includes a rotation holding unit 32 that holds the substrate W in a horizontal posture and rotatably holds the substrate W around a vertical axis, and a cup 33 provided around the substrate W.

  A supply unit 34 is provided on the side of the coating processing unit 31. In this embodiment, the coating processing unit 31 is disposed on the side opposite to the side on which the coating main transport mechanism T is provided. The supply unit 34 supplies the processing liquid to each substrate W held by the three coating processing units 31.

  The supply unit 34 includes a plurality of nozzles 35 that discharge the processing liquid, and a nozzle moving mechanism 36 that selectively holds one nozzle 35 and moves it above the substrate W. The plurality of nozzles 35 are detachably arranged in a substantially horizontal direction by a nozzle holder (not shown). The treatment liquid applied from the nozzle 35 is a resist film material, an antireflection film treatment liquid formed on the lower part of the resist film, or an antireflection film formed on the upper part of the resist film in accordance with the coating processing unit 31. It becomes a processing liquid. Note that the same processing liquid may be discharged between the nozzles 35 that discharge the same type of processing liquid (provided in the same level K), but the properties such as the components and concentration of the processing liquid are different. Also good.

  Each nozzle 35 is disposed on the opposite side of the coating processing unit 31 from the side on which the coating main transport mechanism T is provided. Further, the nozzle moving mechanism 36 is provided on the opposite side of the nozzle 35 from the side on which the application main transport mechanism T is provided. Each nozzle 35 is arranged on a second virtual curve L2 that is curved in a convex shape on the side where the coating processing unit 31 is provided in plan view. Here, the second virtual curve L2 is also preferably a substantially arc centered on a virtual straight line Lm orthogonal to the point Qm of the transport path R in plan view, like the first virtual curve L1.

  The nozzle moving mechanism 36 is further provided on the opposite side of the nozzle 35 from the side where the application main transport mechanism T is provided. The nozzle moving mechanism 36 includes a base 37, a lifting shaft 38, an articulated arm portion 39, and a grip portion 41. The articulated arm portion 39 includes a first link portion 39a and a second link portion 39b.

  The base 37 is fixedly installed on the side of the nozzle 35 opposite to the side on which the main transport mechanism T for application is provided. It is preferable that the base 37 is located on the virtual straight line Lm orthogonal to the point Qm of the conveyance path | route R by planar view. The lower end portion of the elevating shaft 38 is held on the base 37. The upper end portion of the elevating shaft 38 can be expanded and contracted in a substantially vertical direction with respect to the base 37.

  One end portion of the first link portion 39a is attached to the upper end portion of the elevating shaft 38 so as to be rotatable around a substantially vertical axis. One end portion of the second link portion 39b is attached to the other end portion of the first link portion 39a so as to be rotatable about a substantially vertical axis. The articulated arm portion 39 configured in this manner revolves around the vertical axis with respect to the lifting shaft 38 (base 37) and advances and retreats in the revolving radius direction.

  A gripping portion 41 is attached to the other end portion (free end portion) of the second link portion 39b. The gripping portion 41 includes a gripping claw that can be opened and closed, and is configured to be able to hold one nozzle 35 and to release the holding state of the nozzle 35.

  Next, the coating main transport mechanism T will be specifically described. An inspection main transport mechanism T4, which will be described later, has the same configuration as the application main transport mechanism T. Please refer to FIG. FIG. 9 is a perspective view of the main transport mechanism for application.

  The application main transport mechanism T includes two first guide rails 51 that are guided in a substantially vertical direction and a second guide rail 52 that is guided in a substantially horizontal direction. The two first guide rails 51 are fixed so as to face each other at positions near both ends of the conveyance space A. In the present embodiment, each first guide rail 51 is disposed on the side of the transport area A where the coating processing unit 31 is disposed. The second guide rail 52 is slidably attached to the first guide rail 51. At this time, it is preferable that the direction guided by the second guide rail 52 substantially coincides with the direction connecting the ID portion 1 and the IF portion 5.

  A base portion 53 is slidably provided on the second guide rail 52. The base portion 53 extends in the lateral direction to the approximate center of the transport area A.

  The base 53 is provided with a turntable 55 that is rotatable about the longitudinal axis. On the turntable 55, two holding arms 57a and 57b for holding the substrate W are provided so as to be movable in the horizontal direction. The two holding arms 57a and 57b are arranged at positions close to each other in the vertical direction.

  The application main transport mechanism T further includes various drive mechanisms for driving the second guide rail 52, the base portion 53, the turntable 55, and the holding arms 57a and 57b, respectively. By these various drive mechanisms, the second guide rail 52 moves up and down in a substantially vertical direction with respect to the first guide rail 51, the base portion 53 moves in a substantially horizontal direction with respect to the second guide rail 52, and the turntable 55 Rotates relative to the base portion 53, and the holding arms 57 a and 57 b move forward and backward with respect to the turntable 55. As a result, the coating main transport mechanism T transports the substrate W along the transport path R, and each coating processing unit 31 and each heat treatment unit PHP1 (described later) provided corresponding to the coating main transport mechanism T are mounted. The substrate W is transported to the part P.

  Next, other configurations of the application block B1 will be described. In the hierarchy K4, an inspection unit MI and an inspection main transport mechanism T4 are provided. The inspection unit MI is disposed below the coating processing unit 31 (lower antireflection film coating processing unit BARC). The inspection unit MI measures and inspects the line width of the resist film on the substrate W after the development processing is performed. The inspection main transport mechanism T4 is disposed below the coating main transport mechanism T3 and on the side of the inspection unit MI.

  In each layer K1-K4 of the coating block B1, a plurality of heat treatment units PHP1 for performing heat treatment on the substrate W are provided. In the hierarchy K1-K3, a heat treatment unit PHP1 is disposed at a position facing the coating processing unit 31 in a substantially horizontal direction with each coating main transport mechanism T interposed therebetween. In the level K4, the heat treatment unit PHP1 is disposed at a position facing the inspection unit MI in a substantially horizontal direction across the inspection main transport mechanism T4.

  The heat treatment unit PHP1 will be described. Each heat treatment unit PHP1 includes two plates 43 on which the substrate W is placed, and a local transport mechanism (not shown) that moves the substrate W between the two plates 43. In each heat treatment unit PHP1, the substrate W is continuously subjected to the heat treatment and the cooling treatment. The heat treatment unit PHP1 is not limited to such a configuration. For example, it may be a heat treatment unit that performs only heat treatment or cooling treatment. Moreover, in order to improve the adhesiveness of the board | substrate W and a film, the adhesion processing unit heat-processed in the vapor | steam atmosphere of hexamethyldisilazane (HMDS) may be sufficient.

  At the end of the space where the coating processing unit 31 and the inspection unit MI of each layer described above are installed, a pit portion PS penetrating in the vertical direction is formed. In this hole part PS, piping through which the processing liquid is passed, electric wiring, etc. (all not shown) are installed. In addition, in the hole part PS, piping for supplying and exhausting air for keeping the coating processing unit 31 and the inspection unit MI of each layer or the transport areas A1-A4 in a clean atmosphere are also installed.

  Between the ID part 1 and the coating block B1, a placement part P1 and a placement part P12 for placing the substrate W are provided. The placement portion P1 is disposed at a position facing the coating main transport mechanism T3 in a substantially horizontal direction. The placement portion P12 is disposed at a position facing the inspection main transport mechanism T4 in a substantially horizontal direction. The mounting portions P1 and P12 are arranged so as to be aligned in the vertical direction.

Sensors (not shown) for detecting the presence or absence of the substrate W are respectively attached to the mounting portions P1 and P12. Based on the detection signals of the sensors, the ID transport mechanism T _ID and the coating main transport mechanism. The substrate W is transferred by T1 or the ID transport mechanism T _ID and the inspection main transport mechanism T4. Similar sensors are also attached to mounting parts P2-P11 described later.

  Further, between the coating block B1 and the developing block B2, a mounting portion P2 on which the coating main transport mechanism T1 can be mounted, and mounting portions P3 and P4 on which the coating main transport mechanism T2 can be transported, There are provided mounting portions P5 and P6 that can be transported by the coating main transport mechanism T3 and a mounting portion P11 that can be transported by the inspection main transport mechanism T4. Each mounting part P2-P6, P11 is arrange | positioned so that it may mutually align in an upward direction.

[Development block B2]
The developing block B2 will be described. In addition, about the same structure as application | coating block B1, detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol.

  The development block B2 has a plurality of development processing units DEV that supply a developing solution to the substrate W. The development processing units DEV are arranged side by side in a substantially vertical direction. Further, a plurality of development processing units DEV are arranged side by side in a substantially horizontal direction. The direction in which the development processing units DEV are arranged in the substantially horizontal direction substantially coincides with the direction connecting the ID unit 1 and the IF unit 5. The group of development processing units DEV includes one side of the development block B2 that is substantially parallel to the direction connecting the ID portion 1 and the IF portion 5 in plan view (in other words, the development block B2 that is not adjacent to the coating block B1 and the IF portion 5). One side).

  The development block B2 includes a single development main transport mechanism T5 that transports the substrate W to each development processing unit DEV. The development main transport mechanism T5 is disposed substantially at the center of the development block B2 in plan view. A region (hereinafter simply referred to as “transport region”) A5 in which the main transport mechanism T5 for development transports the substrate passes through substantially the center of the development block B2 in a plan view, and connects the ID portion 1 and the IF portion 5. In addition, the region extends to both sides of the development block B2. Accordingly, the transport path of the development main transport mechanism T5 corresponds to an extension of the transport path R of the application main transport mechanism T in plan view.

  Each development processing unit DEV described above is located on one side of the transport area A5. As shown in FIG. 1, the transport area A5 of the developing main transport mechanism T5 is preferably formed in a range that is continuous with the transport area A of each coating main transport mechanism T in a plan view.

  When the transport area A5 of the development main transport mechanism T5 is viewed from the side, the transport area A5 extends to at least the range of all the development processing units DEV arranged in the vertical direction. Further, as shown in FIG. 2, the transport area A5 is formed to be continuous with the transport areas A1-A4 of the coating main transport mechanism T and the inspection main transport mechanism T4.

  An inter-mounting-part transport mechanism TP is provided between the coating block B1 and the developing block B2 at a position facing the mounting parts P2-P6 and P11. In the present embodiment, the inter-mounting unit transport mechanism TP is installed on the side opposite to the side on which the development processing unit DEV is provided with the development main transport mechanism T5 interposed therebetween. The inter-mounting unit transport mechanism TP transports the substrate W between the mounting units P2-P6 and P11 disposed between the coating block B1 and the developing block B2. Further, the inter-mounting unit transport mechanism TP is configured to be able to face the IF unit 5. In other words, the transport area AP of the inter-mounting unit transport mechanism TP extends to a range facing the IF unit 5. And the board | substrate W is conveyed with respect to IF part 5 via the mounting parts P7 and P10 mentioned later.

  The development block B2 includes a plurality of heat treatment units PHP2 that heat-treat the substrate W. Each heat treatment unit PHP <b> 2 is arranged at a position facing the IF unit 5. In the present embodiment, the development processing unit DEV is disposed on the opposite side of the development main transport mechanism T5, and is arranged side by side in a vertical direction on a single screen on the IF unit 5 side. On the upper side of each heat treatment unit PHP2, mounting parts P7 and P10 for mounting the substrate W are stacked.

  The developing main transport mechanism T5 will be specifically described. The developing main transport mechanism T5 includes a fixed base 61, a lift shaft 62 held by the fixed base 61 so as to be vertically movable, a rotary base 63 rotatably held by the lift shaft 62, and a rotary base 63. Two holding arms 65a and 65b held so as to be able to advance and retreat are provided. The development main transport mechanism T5 transports the substrate W to the development processing unit DEV, the heat treatment unit PHP2, the mounting portions P2-P7 and P11, and the mounting portions P7 and P10.

  The inter-mounting part transport mechanism TP includes a single holding arm 66. Other configurations are the same as those of the development main transport mechanism T5. The inter-mounting part transport mechanism TP transports the substrate W to the mounting parts P2-P7, P11 and the mounting parts P7, P10.

  The development processing unit DEV will be described. Please refer to FIG. Each development processing unit DEV includes a rotation holding unit 71 that rotatably holds the substrate W, and a cup 73 provided around the substrate W. Two development processing units DEV arranged side by side are provided without being partitioned by a partition wall or the like. Further, a single supply unit 75 that supplies developer to the two development processing units DEV is provided on the side of each development processing unit DEV arranged in parallel. The supply unit 75 is configured to be rotatable around a vertical axis, and supplies the developer to the substrate W processed by each development processing unit DEV.

  At the end of the space where the development processing unit DEV described above is installed, a pit portion PS penetrating in the vertical direction is formed. In the hole portion PS, a pipe through which the developer passes, electric wiring, etc. (all not shown) are installed. In addition, the pit hole PS is also provided with air supply and exhaust pipes for keeping each development processing unit DEV and each transport area A5, AP in a clean atmosphere.

The heat treatment unit PHP2 provided in the development block B2 will be described. The heat treatment unit PHP <b> 2 has a transfer port for the substrate W formed on the side facing the IF unit 5. Then, the heat treatment unit PHP2, transport mechanism _{T IF} transports the substrate W through the transfer port for IF, which will be described later. In such a heat treatment unit PHP2 of the development block B2, a post-exposure heating (PEB) process is performed on the substrate W exposed by the exposure machine EXP.

[IF unit 5]
IF section 5 is provided with an IF's transport mechanisms _{T IF} for transporting the substrate W. The IF transport mechanism _TIF includes a first transport mechanism _TIFA and a second transport mechanism _TIFB that can transfer the substrate W to each other. First transport mechanism _{T IFA,} conveys the substrate W relative to the developing block B2 through the receiver P7, P10, transports the substrate W to the thermal processing unit PHP2 developing block B2. The second transport mechanism T _IFB transports the substrate W to the exposure machine EXP.

The first transport mechanism T _IFA and the second transport mechanism T _IFB are provided side by side in a lateral direction substantially orthogonal to the direction connecting the ID unit 1 and the IF unit 5. First transport mechanism _{T IFA} is disposed at the side located heat treatment unit PHP2 developing block B2. The second transport mechanism _TIFB is disposed on the side where the development processing unit DEV of the development block B2 is located. Further, between the first and second transport mechanisms T _IFA and T _IFB , mounting portions P8 and P9 for mounting the substrate W and a buffer BF for temporarily storing the substrate W are stacked in multiple stages. The first and second transport mechanisms T _IFA and T _IFB deliver the substrate W via the placement parts P8 and P9. Only the first transport mechanism _TIFA accesses the buffer BF.

The first transport mechanism _TIFA includes a base 83 that is fixedly provided, a lifting shaft 85 that expands and contracts vertically with respect to the base 83, and a turntable 86 that is pivotally attached to the lifting shaft 85. A holding arm 87 for holding the substrate W by moving forward and backward with respect to the turntable 86 is provided. The second transport mechanism T _IFB also includes a base 83, a lifting shaft 85, and a holding arm 87.

Next, the control system of the apparatus 10 will be described. FIG. 10 is a control block diagram of the substrate processing apparatus according to the embodiment. The apparatus 10 includes a control unit 90. The controller 90 controls each transport mechanism T _ID , T1-T5, TP, T _IFA , T _IFB , each processing unit RESIST, BARC, TARC, DEV, PHP1, and PHP2, as shown in the figure. As for the heat treatment unit PHP1, the heat treatment unit PHP1 corresponding to each of the coating main transport mechanisms T1-T3 and the inspection main transport mechanism T4 is controlled.

  The control unit 90 stores various information such as a central processing unit (CPU) that executes various processes, a RAM (Random-Access Memory) that is a work area for the arithmetic processes, and a preset processing recipe (processing program). This is realized by a storage medium such as a fixed disk for storage.

  Next, the operation of the substrate processing apparatus according to the embodiment will be described. FIG. 11 is a flowchart for performing a series of processes on the substrate W, and shows a processing unit or a placement unit on which the substrates W are sequentially transferred. FIG. 12 is a diagram schematically showing an operation repeatedly performed by each transport mechanism, and clearly shows the order of processing units, placement units, cassettes, and the like accessed by the transport mechanism. Below, it demonstrates for every conveyance mechanism. The following operations are performed based on control by the control unit 90.

[Transport mechanism _{T ID} for ID]
The ID transport mechanism T _ID moves to a position opposite to one cassette C, and holds one unprocessed substrate W accommodated in the cassette C from the cassette C while being held by the holding arm 25 (in FIG. 10). This corresponds to step S1. The ID transport mechanism T _ID turns the holding arm 25, moves the lifting shaft 23 up and down to move to a position facing the mounting portion P1, and places the held substrate W on the mounting portion P1 (step S2). ). Then, it moves to the mounting part P12. Usually, the substrate W paid out from the coating block B1 is placed on the placement portion P12. The ID transport mechanism T _ID receives the substrate W placed on the placement part P12 (step S20) and stores it in the cassette C (step S21). In addition, when there is no substrate W in the mounting part P12, Step S20 and Step S21 are omitted. The ID transport mechanism T _ID repeatedly performs the above-described operation.

By such operation of the ID transport mechanism T _ID , the ID unit 1 transports the substrate W from the cassette C to the coating block B1 and transports the substrate W from the coating block B1 to the cassette C.

[Main transport mechanism T1 for coating]
The application main transport mechanism T1 moves to a position facing the placement part P1, and the holding arm 57 holds the substrate W placed on the placement part P1 (step S2). Subsequently, the coating main transport mechanism T1 moves to a position facing one lower antireflection film coating processing unit BARC. The lower antireflection coating application unit BARC includes a substrate W on which a lower antireflection coating has already been formed. The coating main transport mechanism T1 unloads the substrate W in the lower antireflection film coating processing unit BARC by the holding arm 57 that does not hold the substrate W, and also receives the substrate W received from the placement unit P1. It is carried into the coating processing unit BARC for the lower antireflection film (step S3). In the following description, when the transport mechanism T accesses other various processing units, it is assumed that the processing unit already has a substrate W that has been subjected to predetermined processing.

  The antireflection coating application unit BARC starts a predetermined process for the newly loaded substrate W (step S3).

  Specifically, the substrate W carried into the lower anti-reflection coating application unit BARC is placed on the rotation holding unit 32 in a horizontal posture. The rotation holding unit 32 rotates while holding the substrate W. The articulated arm portion 39 bends and stretches and operates in a substantially horizontal plane, and the lifting shaft 38 moves up and down with respect to the base 37. When the grip 41 is moved to a position where the predetermined nozzle 35 is held by the nozzle holder by this operation, the grip 41 holds the nozzle 35. When the gripping part 41 holds the nozzle 35, the lifting shaft 38 and the articulated arm 39 are operated again, and the held nozzle 35 is moved to a position approximately above the center of the substrate W. The nozzle 35 discharges the processing liquid for the lower antireflection film onto the substrate W. The processing liquid even supplied to the surface of the substrate W spreads over the entire surface of the substrate W. The processing liquid discarded from the peripheral edge of the substrate W is collected by the cup 33. In this way, the processing liquid for the lower antireflection film is applied to the substrate W, and the lower antireflection film is formed on the substrate W.

  After the predetermined processing, the nozzle moving mechanism 36 moves the nozzle 35 to a position off the upper side of the substrate W. And if the nozzle 35 currently hold | maintained is moved to a nozzle holder, the holding part 31 will detach | leave the nozzle 35 and will hold | maintain the nozzle 35 to a nozzle holder.

  The main transport mechanism T1 for coating places the substrate W carried out from the coating processing unit BARC for the lower antireflection film on the placement part P2 (step S4).

  Thereafter, the coating main transport mechanism T1 accesses the mounting portion P1 again and repeats the above-described operation. Then, the substrate W is transferred to each lower antireflection film coating unit BARC. As a result, each of the lower antireflection coating application processing units BARC processes the substrate W in parallel.

  In the above description of the operation and FIGS. 11 and 12, the operation of transporting the substrate W to the thermal processing unit PHP1 and the operation of processing the substrate W by the thermal processing unit PHP1 are omitted for convenience. That is, actually, the substrate W is heat-treated by the heat-treatment unit PHP1 before and / or after the substrate W is treated by the lower anti-reflection coating application unit BARC. Also in the following description, the operation related to the heat treatment unit PHP1 is omitted.

[Main transport mechanism T2 for coating]
The application main transport mechanism T2 moves to a position facing the mounting portion P3. The substrate W delivered to the placement part P2 is transported and placed on the placement part P3 by an inter-placement part transport mechanism TP described later. The application main transport mechanism T2 receives the substrate W placed on the placement part P3 (step S5). The coating main transport mechanism T2 carries the received substrate W into one resist film coating processing unit RESIST and unloads the processed substrate W from the processing unit RESIST (step S6).

  The resist film coating unit RESIST starts processing the newly loaded substrate W (step S6). The specific operation is substantially the same as the operation of the lower antireflection film coating processing unit BARC except that the processing liquid to be applied is a resist film material. Thus, a resist film is formed on the lower antireflection film formed on the substrate W.

  The application main transport mechanism T2 places the substrate W carried out of the resist film application processing unit RESIST on the placement part P4 (step S7).

  Thereafter, the coating main transport mechanism T2 accesses the mounting portion P3 again, repeats the above-described operation, and transports the substrate W to each resist film coating processing unit RESIST. Thereby, each resist film coating processing unit RESIST processes the substrate W in parallel.

[Main transport mechanism for application T3]
The transport of the substrate W by the coating main transport mechanism T3 is substantially the same as the above-described coating main transport mechanisms T1 and T2. That is, the substrate W is transferred from the mounting portion P5 to each upper antireflection coating application unit TARC (steps S8 and S9), and the processed substrate W is placed from each upper antireflection coating application unit TARC. Transport to part P6 (steps S9, S10). Such an operation is repeated by the coating main transport mechanism T3.

  In the upper antireflection coating application unit TARC, a processing liquid for the upper antireflection coating is applied to the substrate W (step S9). Thereby, an upper antireflection film is formed on the resist film on the substrate W.

[Inspection main transport mechanism T4]
The inspection main transport mechanism T4 moves to a position facing the mounting portion P11. The substrate W paid out from the development block B2 is placed on the placement part P11 by the development main transport mechanism T5. The inspection main transport mechanism T4 receives the substrate W placed on the placement part P11 (step S18). The inspection main transport mechanism T4 carries the received substrate W into the inspection unit MI and unloads the processed substrate W from the inspection unit MI (S19).

  The inspection unit MI measures and inspects the line width of the pattern formed on the newly loaded substrate W (step S19). The inspection main transport mechanism T4 places the substrate W unloaded from the inspection unit MI on the placement part P12 (step S20).

  After that, the inspection main transport mechanism T4 accesses the mounting portion P11 again, repeats the above-described operation, and transports the substrate W to each inspection unit MI. Thereby, each inspection unit MI processes the substrate W in parallel.

  In the description of the operation of the inspection main transport mechanism T4 described above, the heat treatment unit PHP1 is omitted for convenience. The heat treatment in the heat treatment unit PHP1 corresponding to the inspection main transport mechanism T4 is performed in association with the inspection in the inspection unit MI and in association with the development processing in the development processing unit DEV.

[Transfer mechanism between loading parts TP]
The inter-mounting part transport mechanism TP moves to a position facing the mounting part P2. The substrate W paid out from the coating main transport mechanism T1 is placed on the placement portion P2. The inter-mounting part transport mechanism TP receives the substrate W placed on the placing part P2 (step S4), and places the received substrate W on the placing part P3 (step S5).

  Subsequently, the inter-mounting part transport mechanism TP receives the substrate W placed on the placing part P4 (step S7), and places the received substrate W on the placing part P5 (step S8). Note that the substrate W paid out by the application main transport mechanism T2 is placed on the placement portion P4.

  Further, the inter-mounting part transport mechanism TP receives the substrate W placed on the placing part P6 (step S7). The inter-mounting unit transport mechanism TP rotates and moves to a position facing the IF unit 5. And the received board | substrate W is mounted in the mounting part P7 (step S8).

  After that, the inter-mounting part transport mechanism TP accesses the mounting part P2 again and repeats the above-described operation to move the substrate W up and down between the mounting parts P2 and P3 and between the mounting parts P4 and P5. Further, the substrate W delivered from the coating block B1 to the placement unit P6 is transported to the IF unit 5 through the placement unit P7. When the substrate W is transported from the coating block B1 to the IF unit 5, the substrate W does not pass through the development block B2.

[Development main transport mechanism T5]
The development main transport mechanism T5 moves to a position facing the mounting portion P10. The substrate W paid out by the first transport mechanism _TIFA is placed on the placement unit P10. The development main transport mechanism T5 holds the substrate W placed on the placement part P10 (step S16). Subsequently, the development main transport mechanism T5 moves to a position facing one development processing unit DEV. In this development processing unit DEV, there is a substrate W on which development processing has already been performed. The development main transport mechanism T5 unloads the processed substrate W from the development processing unit DEV, and loads the substrate W received from the placement unit P10 into the development processing unit DEV (step S17).

  The development processing unit DEV starts processing on the newly loaded substrate W (step S17). Specifically, the substrate W carried into the development processing unit DEV is placed on the rotation holding unit 71 in a horizontal posture. The rotation holding unit 71 rotates the substrate W. The supply unit 75 pivots to a position approximately above the center of the substrate W, and supplies the developer to the substrate W. Thereby, the development processing unit DEV develops the substrate W.

  The development main transport mechanism T5 places the substrate W unloaded from the development processing unit DEV on the placement unit P11 (step S18).

  Thereafter, the developing main transport mechanism T5 accesses the mounting portion P10 again and repeats the above-described operation. Then, the substrate W is transported to each development processing unit DEV. Thereby, the development processing units DEV develop the substrate W in parallel.

[IF transport mechanism T _IF to first transport mechanism T _IFA ]
The first transport mechanism _{T IFA} accesses the mounting portion P7, receives the substrate W placed on the placing part P7 (step S11). The first transport mechanism _TIFA moves to a position facing the placement unit P8, and places the received substrate W on the placement unit P8 (step S12).

Next, _the first transport mechanism _{T IFA} receives a wafer W from the mounting portion P9 (step S14), and moves to a position opposed to the thermal processing unit PHP2. The first transport mechanism _{T IFA} takes out a previously post-exposure baking (PEB) wafer W treated by thermal processing unit PHP2, carries the wafer W received from the mounting portion P9 in the thermal processing unit PHP2. In the heat treatment unit PHP2, the newly loaded substrate W is heat treated (step S15). Thereby, a post-exposure heating (PEB) process is performed on the substrate W. The first transport mechanism _{T IFA} transports a portion 10 mounting a wafer W taken out of the thermal processing unit PHP2 (step S16).

Thereafter, _the first transport mechanism T _IFA and repeats the above operation to access the mounting portion P7 again.

[IF transport mechanism T _IF to second transport mechanism T _IFB ]
The second transport mechanism T _IFB takes out the substrate W from the placement part P8 and transports it to the exposure apparatus EXP. When the exposed substrate W delivered from the exposure machine EXP is received, it is transported to the mounting portion P9.

Thereafter, the second transport mechanism T _IFB accesses the placement unit P7 again and repeats the above-described operation.

  Thus, according to the substrate processing apparatus which concerns on an Example, adjacent coating processing units 31 are arranged in the diagonal direction with respect to the said conveyance path | route R by planar view, respectively. For this reason, compared with the space | interval of adjacent coating processing units 31, the distance with respect to the direction of the conveyance path | route R of this space | interval can be shortened. The “interval” may be a distance between adjacent coating processing units 31 that is spaced apart (corresponding to the spacings d1 and d2 specified in FIG. 6), or the center of the adjacent coating processing units 31. A distance between the points O (corresponding to a distance between the center points Oa and Ob and a distance between the center points Ob and Oc specified in FIG. 6) may be used.

  Therefore, the length (total length) of the coating processing units 31 arranged in the horizontal direction in the transporting path R direction can be shortened compared to the case where the coating processing units 31 are arranged in parallel with the transporting path R. it can. For this reason, the length (distance between the point Qa and the point Qb) of the conveyance path R of the coating main conveyance mechanism T can be shortened. Further, the installation space of the coating processing unit 31 can be made compact. As a result, the installation area of the coating main transport mechanism T1 and the coating processing unit 31 can be reduced.

  In addition, since the orthogonal projections on the vertical plane including the transport path R do not overlap each other in each coating processing unit 31, the coating main transport mechanism T can directly face the coating processing unit 31. For this reason, when the coating main transport mechanism T transports the substrate W to each coating processing unit 31, it can be avoided that the coating main transport mechanism T passes over the substrate W held by another coating processing unit 31. Thereby, the influence which the operation | movement of the application | coating main conveyance mechanism T has on the application | coating process unit 31 and the supply part 34 can be suppressed. As a result, the processing quality of the substrate W in each coating processing unit 31 can be suitably managed. Furthermore, since the coating processing units 31 are close to each other, the installation area can be further reduced.

  Further, since the coating processing unit 31 is provided on the side opposite to the side where the coating main transport mechanism T is provided and includes a supply unit 34 that supplies the processing liquid to the substrate W, the supply unit 34 is used for coating. Interference with the main transport mechanism T can be suppressed.

  In addition, since the coating processing unit 31 is arranged on the first virtual curve L1 curved in a convex shape on the side where the coating main transport mechanism T is provided in plan view, each coating processing unit 31 is supplied from the supply unit 34. Variation in the distance up to can be suppressed. For this reason, even if the supply part 34 is single, a process liquid can be suitably supplied with respect to the some coating processing unit 31, respectively.

  The first virtual curve L1 is a substantially arc centered on the virtual straight line Lm in plan view. For this reason, the application | coating processing unit 31 can be arrange | positioned symmetrically with respect to the virtual straight line Lm, and the utilization efficiency of a space can be improved. Further, the supply unit 34 can easily access each coating processing unit 31, respectively.

  In addition, since the nozzle 35 and the nozzle moving mechanism 36 are provided separately, the plurality of nozzles 35 can be selectively moved by the single nozzle moving mechanism 36. Thereby, compared with the case where the nozzle moving mechanism fixedly connected with each nozzle 35 is provided, the structure of the supply part 34 can be simplified.

  Further, the nozzle 35 is disposed on the opposite side of the coating processing unit 31 from the side on which the coating main transport mechanism T is provided, and the side of the nozzle 35 opposite to the side on which the coating main transport mechanism T is provided. By disposing the nozzle moving mechanism 36 in the nozzle moving mechanism 36, the nozzle moving mechanism 36 may interfere with the coating main transport mechanism T when the nozzle moving mechanism 36 holds the nozzle 35 and when the held nozzle 35 is detached. Therefore, the turning amount (angle) of the nozzle moving mechanism 36 can be kept small.

  In addition, the nozzle 35 is disposed on a second virtual curve L2 that is curved in a convex shape on the side where the application main transport mechanism T is provided in plan view. For this reason, the dispersion | variation in the distance from the nozzle moving mechanism 36 to each nozzle 35 can be suppressed effectively. Therefore, the nozzle moving mechanism 36 can easily access each of the plurality of nozzles 35.

  Further, since the second virtual curve L2 is a substantially circular arc centered on a point on the virtual straight line Lm in plan view, the nozzles 35 can be arranged substantially symmetrically with respect to the virtual straight line Lm. Therefore, the space utilization efficiency can be further increased.

  Further, since the base 37 of the nozzle moving mechanism 36 is arranged on the virtual straight line Lm in plan view, and the articulated arm portion 39 is configured to be pivotable about a point on the virtual straight line Lm, the nozzle moving mechanism No. 36 can move the nozzle 35 to the left and right of the virtual straight line Lm. As a result, the movable range of the nozzle 35 can be increased.

  Further, since the nozzle moving mechanism 36 can turn in a substantially horizontal plane and can move back and forth in the turning radius direction, the nozzle 35 can be moved to an arbitrary position in the horizontal plane.

  Further, since the nozzle moving mechanism 36 includes a base 37, a lifting shaft 38, an articulated arm portion 39, and a gripping portion 41, the nozzle moving mechanism 36 preferably rotates in a substantially horizontal plane, and , Can move forward and backward in the turning radius direction.

  The present invention is not limited to the above-described embodiment, and can be modified as follows.

  (1) In the above-described embodiment, each coating processing unit 31 is disposed on the first virtual curve L1 that is curved in a convex shape on the side on which the coating main transport mechanism T1 is provided in plan view. It is not limited to this. That is, any arrangement can be selected as long as the adjacent coating processing units 31 are arranged so as to be obliquely arranged with respect to the transport path R in plan view.

  Please refer to FIG. FIG. 13 is a plan view showing a schematic configuration of a substrate processing apparatus according to a modification. As shown in the figure, the coating processing units 31 may be arranged in a staggered manner. The third imaginary line L3 connecting the center points O of the adjacent coating processing units 31 has a “zigzag shape”. Even with such an arrangement, the length in the direction of the transport path R can be shortened. Further, even when the number of coating processing units 31 increases, the length in the direction orthogonal to the transport path R does not increase.

  Or you may arrange | position each application | coating processing unit 31 on the virtual curve curved concavely in the side by which the main conveyance mechanism is provided by planar view.

  (2) In the above-described embodiment, it has been described that it is preferable to bring the coating processing units 31 close to each other as long as the orthogonal projections of the coating processing units 31 on the vertical plane including the transport path R do not overlap each other. However, it is not limited to this. In other words, if the operation of the coating main transport mechanism T does not affect the substrate W itself held by each coating processing unit 31, the same effect can be obtained even if the orthogonal projection is changed appropriately so that the orthogonal projections are slightly overlapped. Play.

  (3) In the above-described embodiment, the coating processing unit 31 is provided on one side in the substantially horizontal direction orthogonal to the transport path R, but the present invention is not limited to this. That is, the application processing unit 31 may be changed to be disposed on both sides of the transport path R.

  (4) In the above-described embodiment, the supply unit 34 is disposed on the opposite side of the coating processing unit 31 from the side on which the coating main transport mechanism T is provided. However, the present invention is not limited to this. The supply part 34 can be arrange | positioned in arbitrary positions. That is, you may change so that the supply part 34 may be arrange | positioned in the arbitrary positions of the circumference | surroundings of the coating process unit 31 and four sides.

  (5) In the above-described embodiment, each nozzle 35 is arranged on the side opposite to the side where the coating main transport mechanism T of the coating processing unit 31 is provided, and the coating main transport mechanism T for the nozzle 35 is provided. The nozzle moving mechanism 36 is disposed on the side opposite to the side on which it is disposed, but the present invention is not limited to this. The positional relationship between these two can also be selected as appropriate.

  (6) In the above-described embodiment, the single supply unit 34 supplies the processing liquid to each substrate W held by the three coating processing units 31, but the present invention is not limited to this. A supply unit 34 may be provided for each coating processing unit 31 so that one supply unit 34 supplies the processing liquid to one coating processing unit 31.

  (7) In the above-described embodiment, the nozzle moving mechanism 36 includes the articulated arm portion 39, but the present invention is not limited to this. If the nozzle 35 can be moved to the position above the substrate W and the position above the substrate W, the mechanism constituting the nozzle moving mechanism 36 can be appropriately selected and changed.

  (8) In the above-described embodiment, the coating processing units 31 are arranged so as to be arranged obliquely with respect to the transport path R in plan view, but the present invention is not limited to this. For example, the development processing units DEV arranged in the horizontal direction may be arranged so as to be arranged in an oblique direction with respect to the conveyance path of the development main conveyance mechanism T5.

  (9) You may change so that each structure of the substrate processing apparatus demonstrated by the Example and each modification mentioned above may be combined suitably.

It is a top view which shows schematic structure of the substrate processing apparatus which concerns on an Example. It is a schematic side view which shows arrangement | positioning of the processing unit which a substrate processing apparatus has. It is a schematic side view which shows arrangement | positioning of the processing unit which a substrate processing apparatus has. It is each vertical sectional view of the aa arrow in FIG. It is each vertical sectional view of the bb arrow in FIG. It is a plane detailed drawing of the principal part of an application block. FIG. 7 is a vertical sectional view taken along arrow aa in FIG. 6. FIG. 7 is a vertical sectional view taken along the line bb in FIG. 6. It is a perspective view of the main transport mechanism for application. It is a control block diagram of the substrate processing apparatus which concerns on an Example. It is a flowchart which shows a series of processes performed to a board | substrate. It is a figure which shows typically the operation | movement which each conveyance mechanism repeats, respectively. It is a top view which shows schematic structure of the substrate processing apparatus which concerns on a modification.

Explanation of symbols

1 ... Indexer part (ID part)
3 ... Processing unit 5 ... Interface unit (IF unit)
DESCRIPTION OF SYMBOLS 27 ... Blocking plate 31 ... Application | coating processing unit 34 ... Supply part 35 ... Nozzle 36 ... Nozzle movement mechanism 37 ... Base 38 ... Elevating shaft 39 ... Articulated arm part 39a ... 1st link part 39b ... 2nd link part 41 ... Grasp Unit 90 ... Control unit B1 ... Application block B2 ... Development block BARC ... Lower antireflection coating application unit RESIST ... Resist coating application unit TARC ... Upper antireflection coating application unit DEV ... Development processing unit PHP1, PHP2 ... Heat treatment unit MI ... inspection unit T _ID ... ID transport mechanism T1, T2, T3 ... coating main transport mechanism T4 ... inspection main transport mechanism T5 ... development main transport mechanism TP ... inter-mounting section transport mechanism T _IF ... IF Transport mechanism P: placement unit A ... transport region R ... transport path L1 ... first virtual curve L2 ... 2 virtual curve L3 ... third imaginary line EXP ... exposure machine C ... cassette W ... substrate

Claims (7)

In a substrate processing apparatus for processing a substrate,
A main transport mechanism for transporting the substrate;
A plurality of processing units that are provided on one side in a substantially horizontal direction orthogonal to the transport path of the main transport mechanism and hold a substrate;
With
Adjacent processing units are arranged so as to be arranged in an oblique direction with respect to the transport path in plan view,
The main transport mechanism transports a substrate along the transport path and transports the substrate to the processing unit. The substrate processing apparatus according to claim 1,
In each processing unit, the orthogonal projections on the vertical plane including the transfer path do not overlap each other. In the substrate processing apparatus of Claim 1 or Claim 2,
A substrate processing apparatus, wherein processing units are arranged in a staggered pattern. In the substrate processing apparatus of Claim 1 or Claim 2,
The substrate processing apparatus, wherein the processing unit is arranged on a first virtual curve that is curved in a convex shape on the side where the main transport mechanism is provided in plan view. In the substrate processing apparatus in any one of Claims 1-4,
A substrate processing apparatus, comprising: a supply unit that is provided on a side opposite to a side on which a main transport mechanism of the processing unit is provided, and supplies a processing liquid to the substrate. The substrate processing apparatus according to claim 5,
Supply section
A plurality of nozzles that are disposed on the side opposite to the side where the main transport mechanism of the processing unit is provided, and that discharge processing liquid;
A nozzle moving mechanism that is provided on the side opposite to the side on which the main transport mechanism of the nozzle is provided, and that selectively holds one nozzle and moves it above the substrate;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 6,
The substrate processing apparatus, wherein the nozzle moving mechanism is capable of turning in a substantially horizontal plane and capable of moving back and forth in the turning radius direction.

Images