JP2009231406A - Electronic circuit unit and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic circuit unit that achieves improvement of its versatility, and a manufacturing method thereof. <P>SOLUTION: The electronic circuit unit is provided with a first insulating substrate (3), which includes a cover (40), having each mounting leg (46), and the upper face (4) covered with the cover while including each first side-face electrode (10) formed on each side face (8, 9) continuous to the upper face and brought into contact with each mounting leg, a second insulating substrate (13), which includes the lower face (14) facing a circuit substrate and each second side-face electrode (20) formed on each side face (18, 19) continuous to the lower face and connectable to the circuit substrate, and an insulating means (23) formed between the first side-face electrodes and the second side-face electrodes so as to electrically separate between the first side-face electrodes and the second side-face electrodes. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic circuit unit suitable for use in a short-range wireless communication device and the like, and a method for manufacturing the unit.

This type of electronic circuit unit is configured by laminating insulating substrates, and a wiring pattern is provided at an appropriate position on the upper surface of the insulating substrate. Various electronic components are mounted on the pattern to form a desired electric circuit.
Further, the upper surface is covered with a metal cover, and the cover shields the wiring pattern and the electronic component from the outside. And the electronic circuit unit which attached this cover is disclosed (for example, refer patent document 1).

  Specifically, the electronic circuit unit has a plurality of side electrodes on the side surface of the insulating substrate, and the side electrodes are formed over the entire periphery of the insulating substrate. Among these, a part of the side electrodes and the mounting legs of the cover are joined by solder, and the cover is fixed to the insulating substrate. The remaining side electrodes and signal lines from the mother board are joined by soldering, and the lower surface of the insulating substrate faces the mother board.

JP 2001-7588 A

However, the above-described conventional technique has a problem that the versatility of the electronic circuit unit cannot be improved.
This is because each of the side electrodes described above is formed so as to penetrate the upper surface side and the lower surface side of the insulating substrate, and in this case, each side electrode serves to fix the mounting leg of the cover, or from the motherboard. This is because it is limited to one of the roles of connecting or fixing the signal line.

More specifically, if the cover is required to have a complete shield on the top surface of the insulating substrate, if the cover mounting legs are fixed to all the side electrodes, all of these side electrodes are attached to the mounting legs. This is because it becomes a fixing electrode, that is, a GND electrode, and the side electrode cannot be used as a wiring electrode of the signal line.
Accordingly, an object of the present invention is to provide an electronic circuit unit that solves the above-described problems and improves the versatility of the electronic circuit unit, and a method for manufacturing the unit.

  A first invention for achieving the above object has a cover having a mounting leg and an upper surface covered with the cover, and has a first side electrode formed on a side surface continuous with the upper surface and contacting the mounting leg. A first insulating substrate, a second insulating substrate having a lower surface facing the circuit substrate, a second insulating substrate formed on a side surface connected to the lower surface, and having a second side electrode connectable to the circuit substrate; An insulating means is provided between the side electrode and the second side electrode and electrically isolates the first side electrode and the second side electrode.

According to the first invention, the first insulating substrate has an upper surface, and the upper surface is covered with the cover. The first insulating substrate has a first side electrode on a side surface continuous with the upper surface thereof, and the first side electrode abuts against a mounting leg of the cover.
On the other hand, the second insulating substrate has a lower surface, and this lower surface faces the circuit board. Further, the second insulating substrate has a second side electrode on a side surface continuous with the lower surface thereof, and the second side electrode is configured to be connectable to the circuit board.

  Here, an insulating means is formed between the first side electrode and the second side electrode, and these side electrodes are electrically separated. As a result, the first side electrode and the second side electrode can play separate roles, and the versatility of the electronic circuit unit is greatly improved as compared with the conventional case.

According to a second invention, in the configuration of the first invention, the insulating means is a third insulating substrate different from the first insulating substrate and the second insulating substrate, and the third insulating substrate is the first insulating substrate. It is formed between the side electrode and the second side electrode, and electrically separates the first side electrode and the second side electrode.
According to the second invention, in addition to the action of the first invention, the third insulating substrate is a substrate different from the first insulating substrate and the second insulating substrate, and the third insulating substrate. Is formed between the side electrodes, so that electrical separation of the side electrodes can be achieved more reliably.

According to a third invention, in the configuration of the second invention, the first side surface electrode is recessed from the periphery of the upper surface toward the inside of the upper surface, and has a first recessed portion for fixing the inner surface of the mounting leg with solder. The third insulating substrate has a first exposed portion that is exposed from the first recessed portion to the side surface of the first insulating substrate below the first recessed portion and faces the tip of the mounting leg. It is characterized by having.
According to the third invention, in addition to the operation of the second invention, the cover mounting leg is housed in the first recess, and the inner side surface thereof is fixed to the first side electrode by soldering. Therefore, as compared with the case where the mounting legs are simply fixed to the side surface of the first insulating substrate with solder, the mounting legs can be firmly fixed with a large amount of solder, and the reliability of the electronic circuit unit is improved. In addition, since the mounting legs do not protrude outward from the side surface of the first insulating substrate, it contributes to downsizing of the electronic circuit unit.

According to a fourth aspect of the invention, in the configuration of the third aspect of the invention, the first recess is formed on the entire periphery of the periphery of the first insulating substrate.
According to the fourth invention, in addition to the operation of the third invention, the first side electrode and the second side electrode are further electrically separated. It can be easily fixed to the periphery with solder over the entire periphery. As a result, the cover can be fixed most firmly to the first insulating substrate, and a complete shield of the upper surface by this cover can also be handled.

According to a fifth invention, in the configuration of the third or fourth invention, the second side surface electrode is recessed from the periphery of the lower surface toward the inner side of the lower surface, and the inner surface of the signal line from the circuit board is fixed with solder. The third insulating substrate has a second recessed portion, and the third insulating substrate is exposed from the second recessed portion to the side surface of the second insulating substrate on the upper side of the second recessed portion, and faces the tip of the signal line. It has two exposed parts.
According to the fifth invention, in addition to the effects of the third and fourth inventions, the signal line from the circuit board is also housed in the second recess and fixed to the second side electrode with solder. Compared with the case where the signal line is simply fixed to the side surface of the second insulating substrate with solder, the signal line can be firmly fixed with a large amount of solder, and the connection between the signal line and the second side surface electrode is external. Can be easily confirmed, and contributes to improving the reliability of the electronic circuit unit. Further, since this signal line does not protrude outward from the side surface of the second insulating substrate, this also contributes to downsizing of the electronic circuit unit.

A sixth invention is characterized in that, in the configuration of the fifth invention, the second recess is formed on the entire periphery of the periphery of the second insulating substrate.
According to the sixth invention, in addition to the operation of the fifth invention, the first side electrode and the second side electrode are further electrically separated, so that the signal line from the circuit board is also second. The entire periphery of the insulating substrate can be easily fixed with solder. As a result, a large number of signal lines are secured, and the signal lines can be effectively used separately for wiring and fixing.

According to a seventh invention, in the structures of the first to sixth inventions, each insulating substrate is made of ceramic.
According to the seventh invention, in addition to the operations of the first to sixth inventions, if the first and second insulating substrates, and further the third insulating substrate are formed of a ceramic multilayer substrate, a fine wiring pattern can be obtained. The versatility of the electronic circuit unit can be further improved.

An eighth aspect of the invention is an electronic circuit unit manufacturing method in which a side electrode for fixing a mounting leg of a cover is formed on a side surface of a unit body, and the side electrode is formed by cutting along a cutting line.
Specifically, in the vicinity of the periphery of the ceramic substrate before firing, a step of drilling a plurality of large-diameter through holes on the cutting line, a step of filling the large-diameter through holes with conductive paste, A step of drilling a small-diameter through hole on the cutting line on the inner side, and disposing another ceramic substrate having no large-diameter through hole between the plurality of ceramic substrates having the small-diameter through hole, and at least A step of laminating three or more ceramic substrates, a step of compressing the laminated ceramic substrates to form a unit body, and a step of cutting the compressed ceramic substrate along a cutting line to form side electrodes. Firing the laminated ceramic substrate that has been cut and formed with a dent that is roughly halved of the small-diameter through hole, and the mounting legs are placed in the dent and the cover is made using solder. And a step of fixing the surface electrode.

  According to the eighth invention, another ceramic substrate not having this through hole is sandwiched between a plurality of ceramic substrates having large and small through holes, and these are laminated. In other words, if the laminated ceramic substrate is laminated after drilling and the laminated ceramic substrate is cut along the cutting line, the side surfaces of the ceramic substrates having large and small through holes are electrically separated from each other. Each side electrode can be easily insulated.

In addition, in each ceramic substrate sandwiching another ceramic substrate not having this through hole, it is only necessary to make a large and small through hole on the cutting line, and the through hole of one ceramic substrate and the through hole of the other ceramic substrate A positional relationship with the hall is not required.
Therefore, unlike the conventional case, the side electrode penetrates the upper surface and the lower surface of the substrate, and if the formation of large and small through holes fails, the laminated insulating substrate becomes a defective product. The yield of the unit body can be improved. As a result, the manufacturing cost of the electronic circuit unit can be reduced as compared with the case where the large and small through holes are formed after the substrates are stacked.

  According to the present invention, it is possible to provide an electronic circuit unit that can electrically separate the side electrodes arranged in the vertical direction and achieve a great improvement in versatility of the electronic circuit unit, and a method for manufacturing the unit. it can.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the drawings.
The electronic circuit unit 1 of this form is mounted on, for example, a short-range wireless communication device, and includes a unit main body 2 and a metal shield cover (cover) 40 as shown in FIG.
The unit main body 2 of this embodiment is formed by laminating three ceramic substrates (LTCC substrates) by low temperature firing, and is formed in a substantially rectangular plate shape.

  Specifically, as shown in FIGS. 1 and 2, the unit main body 2 includes an upper layer substrate (first insulating substrate) 3 located on the cover 40 side, and an upper surface 4 having a peripheral edge formed by four sides. It has a lower surface 7 (FIG. 5). Four side surfaces 8 and 9 are formed on the periphery of the upper surface 4 and the lower surface 7, the side surface 8 and the side surface 9 are adjacent to each other, and the side surfaces 9 and 9 are configured to face each other.

A desired wiring pattern 5 is provided at an appropriate position on the upper surface 4, and various electronic components 6 are mounted on the pattern 5 to form a desired electric circuit.
On the other hand, a plurality of semicircular side electrodes (first side electrodes) 10 are formed on the side surfaces 8 and 9 in plan view. Specifically, the side electrode 10 of the present embodiment is made of a conductive paste mainly composed of silver (Ag), and is formed on the entire periphery of the upper substrate 3. In the case of driving with the voltage of the natural resonance frequency (λ), it is formed on each of the side surfaces 8 and 9 at an interval corresponding to λ / 4.

In this embodiment, four side electrodes 10 are formed on each side surface 8 and three side electrodes 10 are formed on each side surface 9, but the number is not limited to this number.
Further, the side electrode 10 has a dent (first dent) 11 that is recessed from the periphery of the upper surface 4 toward the inside of the upper surface 4 (FIG. 3). The upper substrate 3 is provided so as to penetrate the lower surface 7.

In this embodiment, all the side electrodes 10 function as GND electrodes for fixing the cover 40.
As shown in FIG. 1, the cover 40 has a box shape and has a substantially rectangular upper surface 41. The upper surface 41 is formed in a similar shape to the upper surface 4 of the upper substrate 3, and four side surfaces 42 and 44 are formed on the periphery of the upper surface 41, and the side surface 42 and the side surface 44 are adjacent to each other. Constructed in confrontation.

  At the lower end portions of the side surfaces 42, 44, the same number of legs (attachment legs) 46 as the side electrodes 10 are extended downward, and when the cover 40 is placed on the upper substrate 3, The inner side surfaces of the portions 46 are in contact with the recessed portions 11 respectively. And after putting all the leg parts 46 in each dent part 11, each leg part 46 is fixed to the side electrode 10 with solder.

On the other hand, the unit main body 2 has a lower layer substrate (second insulating substrate) 13 located on the side opposite to the cover 40 side, and has an upper surface 14 and a lower surface 17 whose peripheral edges are formed by four sides. (Figs. 2 and 5). An external connection land or the like is provided at an appropriate position on the lower surface 17.
The lower surface 17 is formed to have substantially the same size as the upper surface 4 of the upper substrate 3. The peripheral surfaces of the upper surface 14 and the lower surface 17 are also formed with four side surfaces 18 and 19, and the side surface 18 and the side surface 19 are adjacent to each other. The side surfaces 19 are configured to face each other.

  Similarly to the side electrodes 10 of the upper substrate 3, the side electrodes (second side electrodes) 20 made of a conductive paste mainly composed of silver (Ag) are also provided on the side surfaces 18 and 19. A plurality of peripheral edges are formed over the entire circumference. The side electrode 20 also has a recessed portion (second recessed portion) 21 that is recessed from the periphery of the lower surface 17 toward the inside of the lower surface 17 (FIG. 3), and the recessed portion 21 includes the upper surface 14 and the lower surface 17. Are provided on the lower layer substrate 13.

When the electronic circuit unit 1 is mounted with the lower surface 17 of the lower layer substrate 13 facing the motherboard (circuit substrate) of the short-range wireless communication device, all the side electrodes 20 are wiring electrodes for signal lines from the motherboard. Alternatively, it functions as a GND electrode for fixing the signal line.
This wiring electrode is connected to a wiring pattern 5 formed on the upper surface 4 of the upper substrate 3 through a through hole or the like.

By the way, the unit main body 2 of this embodiment has an intermediate layer substrate (third insulating substrate) 23 between the upper layer substrate 3 and the lower layer substrate 13.
Specifically, the intermediate layer substrate 23 has an upper surface 24 and a lower surface 27 each having a peripheral edge formed by four sides (FIG. 8). The upper surface 24 and the lower surface 27 are the lower surface 7 of the upper substrate 3 and the lower substrate 13. The upper surface 14 and the lower surface 27 are also formed with substantially the same size as the upper surface 14, and the peripheral surfaces of the upper surface 24 and the lower surface 27 are also formed with four side surfaces 28 and 29, and the side surfaces 28 and 29 are adjacent to each other. (Fig. 2).

On the other hand, unlike the above-described upper layer substrate 3 and lower layer substrate 13, the intermediate layer substrate 23 does not have side electrodes.
Specifically, the side surfaces 28 and 29 of the intermediate layer substrate 23 are disposed between the side electrode 10 of the upper layer substrate 3 and the side electrode 20 of the lower layer substrate 13. It functions as an insulating means that is electrically separated from the side electrode 20.

  More specifically, as shown in FIGS. 3 and 4, the intermediate layer substrate 23 is exposed on the lower side of the recessed portion 11 from the recessed portion 11 to the side surfaces 8 and 9 of the upper layer substrate 3. The first exposed portion 24a is opposed to the tip of the leg portion 26. The space defined by the recess 11 and the exposed portion 24a holds the solder.

Further, the intermediate layer substrate 23 has an exposed portion (second exposed portion) 27 a that is exposed from the recessed portion 21 to the side surfaces 18 and 19 of the lower layer substrate 13 on the upper side of the recessed portion 21. The exposed portion 27a faces the tip of the signal line.
As described above, the electronic circuit unit 1 in which the side electrode 10 and the side electrode 20 are electrically separated by the intermediate layer substrate 23 is manufactured through the following steps.

Specifically, first, three raw insulating substrates (green sheets) before firing are prepared. In addition, although formation of the one unit main body 2 is demonstrated in the following FIGS. 5-9, this insulating substrate is comprised by the magnitude | size which can form the several unit main body 2 simultaneously.
First, a large-diameter through hole 50 is formed in two of the three insulating substrates described above. The two insulating substrates correspond to the upper layer substrate 3 and the lower layer substrate 13.

Specifically, as shown in FIG. 5, the two insulating substrates are partitioned by virtual cutting lines 56 and 57 that intersect vertically and horizontally (indicated by a one-dot chain line in the figure). The size defined by the lines 56 and 57 corresponds to the size of one unit body 2.
In the case of this embodiment, four through holes 50 are formed on the cutting line 56 and three through holes 50 are formed on the cutting line 57 by a press.

Next, each through hole 50 is filled with the conductive paste 52 using a squeegee (FIG. 6). After the paste 52 is dried, a through hole 54 having a smaller diameter than the through hole 50 is formed.
Specifically, as shown in FIG. 7, the small-diameter through-hole 54 is formed on the virtual cutting lines 56 and 57 by a press at a substantially central position of the large-diameter through-hole 50. It is formed by punching only the substantially central portion of the paste 52.

As described above, first, two insulating substrates having holes having a small diameter are formed, and then three insulating substrates are stacked.
That is, as shown in FIG. 8, an intermediate layer that does not have even a large-diameter through hole 50 between insulating substrates corresponding to the upper substrate 3 and the lower substrate 13, which is drilled to a small-diameter through hole 54. An insulating substrate corresponding to the substrate 23 is sandwiched between the lower surface 7 of the upper layer substrate 3 and the upper surface 24 of the intermediate layer substrate 23, and the lower surface 27 of the intermediate layer substrate 23 and the upper surface 14 of the lower layer substrate 3 are brought into contact with each other. Then, an insulating substrate corresponding to the unit main body 2 stacked in the vertical direction is configured. Then, the laminated insulating substrate is compressed and molded (FIG. 9).

  Thereafter, when the insulating substrate corresponding to the compressed unit main body 2 is cut along the cutting lines 56 and 57, as shown in FIG. 10, the side surface of the unit main body 2, more specifically, the side surface 8, 9 includes a plurality of side electrodes 10 each having a recessed portion 11 in which a small-diameter through hole 54 is substantially divided, and at the same time, a plurality of side electrodes 20 having recessed portions 21 on side surfaces 18 and 19 of the lower layer substrate 13. Is formed. As a result, the side electrodes 10 and 20 facing each other in the vertical direction are all separated by the intermediate layer substrate 23.

  Next, the insulating substrate corresponding to the unit main body 2 having the side electrodes 10 and 20 is fired, and then the electronic component 6 is mounted on the wiring pattern 5 on the upper surface 4. Subsequently, the leg portion 46 of the cover 40 is accommodated in the recessed portion 11 of the side electrode 10, and when the inner side surface of the leg portion 46 and the recessed portion 11 are joined by solder, the cover 40 is fixed to the side electrode 10, and the wiring The pattern 5 and the electronic component 6 are covered.

By the way, the unit main body 2 described above may be configured without the intermediate layer substrate 23.
Specifically, the side electrodes 10 and 20 described above face each other in the vertical direction via the exposed portions 24a and 27a of the intermediate layer substrate 23 (FIGS. 3 and 4). On the other hand, FIG. 11 also shows the side electrodes 10A formed on the side surfaces 8 and 9 of the upper substrate 3 and the side electrodes 20A formed on the side surfaces 18 and 19 of the lower substrate 13. The side electrodes 10A and the side electrodes 20A are not opposed to each other in the vertical direction, and are alternately arranged.

  An insulating portion (insulating means) 25 extending in the horizontal direction is formed between the lower end portion of the side electrode 10A and the upper end portion of the side electrode 20A. In this case as well, the GND electrode Thus, the side electrode 10A and the side electrode 20A which is the wiring electrode can be electrically separated.

  As described above, according to the present embodiment, the upper substrate 3 has the upper surface 4, the wiring pattern 5 is formed on the upper surface 4, the electronic component 6 is mounted, and the metal cover 40 is covered. Further, the upper substrate 3 has side electrodes 10 (10A) on side surfaces 8 and 9 connected to the upper surface 4 thereof, and the side electrodes 10 (10A) are in contact with the leg portions 46 of the cover 40.

  On the other hand, the lower layer substrate 13 has a lower surface 17 on which an external connection land or the like is formed and faces the motherboard. In addition, the lower layer substrate 13 has side electrodes 20 (20A) on side surfaces 18 and 19 connected to the lower surface 17, and the side electrodes 20 (20A) are configured to be connectable to signal lines from the mother board. The

  Here, an intermediate layer substrate 23 (or insulating portion 25) is formed between the side electrode 10 (10A) and the side electrode 20 (20A), and the side electrode 10 (10A) and the side electrode 20 (20A) Electrically separated. As a result, the side electrode 10 (10A) and the side electrode 20 (20A) can each play a separate role, and the electronic circuit unit 1 of the electronic circuit unit 1 can be compared with the conventional case where each side electrode is electrically connected. Versatility is greatly improved.

  1 to 10, the intermediate layer substrate 23 is a substrate different from the upper layer substrate 3 and the lower layer substrate 13, and the intermediate layer substrate 23 is formed between the side electrodes 10 and 20. Therefore, electrical separation of the side electrodes 10 and 20 can be achieved more reliably.

  Furthermore, the leg part 46 of the cover 40 is stored in the recessed part 11 of the upper substrate 3, and the inner side surface of the leg part 46 is fixed to the side electrode 10 (10A) with solder. Therefore, compared with the case where the legs are simply fixed to the side surfaces 8 and 9 of the upper substrate 3 with solder, the legs can be firmly fixed with a large amount of solder, and the reliability of the electronic circuit unit 1 is improved. Further, since the leg portion 46 does not protrude outward from the side surfaces 8 and 9 of the upper substrate 3, it contributes to downsizing of the electronic circuit unit 1.

  Furthermore, since the side electrode 10 (10A) and the side electrode 20 (20A) are electrically separated, the leg portion 46 of the cover 40 is easily fixed to the periphery of the upper substrate 3 with solder over the entire circumference. it can. As a result, the cover 40 can be fixed most firmly to the upper substrate 3, and the entire shield by the cover 40 can be dealt with.

Further, the signal line from the mother board is also housed in the recessed portion 21 of the lower layer substrate 13 and is fixed to the side electrode 20 (20A) with solder. Compared to the case, it can be firmly fixed with a large amount of solder.
Moreover, the connection between the signal line and the side electrode 20 (20A) can be easily confirmed from the outside, which also contributes to the improvement of the reliability of the electronic circuit unit 1. Further, since this signal line does not protrude outward from the side surfaces 18 and 19 of the lower layer substrate 13, this also contributes to downsizing of the electronic circuit unit 1.

Further, since the side electrode 10 (10A) and the side electrode 20 (20A) are electrically separated, the signal line from the mother board can be easily fixed to the peripheral edge of the lower layer substrate 13 with solder over the entire circumference. As a result, a large number of installation locations of the signal lines are secured, and the signal lines can be effectively used separately for the wiring electrodes and the GND electrodes.
Further, if the upper layer substrate 3, the lower layer substrate 13, and the intermediate layer substrate 23 are formed of a ceramic multilayer substrate, a fine wiring pattern can be formed, and the versatility of the electronic circuit unit 1 can be further improved.

Furthermore, according to the manufacturing method of the electronic circuit unit 1 described above, the intermediate layer substrate 23 not having the through holes 50 and 54 is interposed between the upper layer substrate 3 having the large and small through holes 50 and 54 and the lower layer substrate 13. These are sandwiched and stacked.
That is, if the stacked unit bodies 2 are stacked after the through holes 50 and 54 are drilled and the stacked unit bodies 2 are cut along the cutting lines 56 and 57, the upper substrate 3 and the lower substrate 13 having the recessed portions 11 and 12 are mutually connected. It will be in the state isolate | separated electrically and each side electrode 10 and 20 can be insulated easily.

Further, in the upper layer substrate 3 and the lower layer substrate 13, it is only necessary to drill large and small through holes 50 and 54 on the virtual cutting lines 56 and 57, respectively, and the through holes 50 and 54 of the upper layer substrate 3 and the lower layer substrate 13. The positional relationship with the through holes 50 and 54 is not required.
Therefore, if each side electrode penetrates the upper surface and the lower surface of the substrate as in the conventional case, if the drilling of large and small through holes fails, the laminated insulating substrate becomes a defective product. Compared to the above, the yield of the unit main body 2 can be improved. That is, if the above-described drilling of the large and small through holes 50 and 54 fails, only the failed insulating substrate corresponding to the upper layer substrate 3 or the lower layer substrate 13 needs to be replaced. .

As a result, the manufacturing cost of the electronic circuit unit 1 can be reduced as compared with the case where a large or small through hole is formed after laminating a resin or ceramic substrate.
The present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the claims. For example, a part of the configurations of the above embodiments can be omitted or arbitrarily combined so as to be different from the above.

  Moreover, in the said Example, although the upper layer board | substrate 3, the lower layer board | substrate 13, and the intermediate | middle layer board | substrate 23 were each comprised by the single layer, it is not necessarily limited to this form, Each may be comprised by the multilayer. In this case, the upper surface of the uppermost layer of the unit body is covered with the cover, and the lower surface of the lowermost layer faces the motherboard.

  Furthermore, as described above, if the side electrodes 10 and 20 (10A and 20A) have the recessed portions 11 and 21, the leg portion 46 and the signal line can be firmly fixed with a large amount of solder, and a small electronic circuit can be obtained. Although there exists an effect that the unit 1 can be comprised, it does not need to have the dent parts 11 and 21. FIG. That is, in this case, the legs 46 and the signal lines may be directly fixed to the side surfaces 8 and 9 of the substrate 3 and the side surfaces 18 and 19 of the substrate 13 with solder.

  Furthermore, in addition to the short-range wireless communication device described above, the present invention can be applied to various devices as long as a cover for shielding or protecting an electronic device to be mounted is provided.

It is a perspective view of the electronic circuit unit of a present Example. It is a perspective view in the state where a cover was removed from the unit of FIG. It is an enlarged view of the side electrode of FIG. It is arrow sectional drawing by the IV-IV line of FIG. FIG. 5 is an explanatory diagram relating to a process of forming a large-diameter through hole in the method for manufacturing the unit of FIG. 1. It is explanatory drawing regarding the filling process of a paste in the manufacturing method of the unit of FIG. FIG. 5 is an explanatory diagram relating to a process for forming a small-diameter through hole in the unit manufacturing method of FIG. 1. It is explanatory drawing regarding the lamination process of three ceramic substrates in the manufacturing method of the unit of FIG. It is explanatory drawing regarding the compression process of a ceramic substrate in the manufacturing method of the unit of FIG. It is explanatory drawing regarding the cutting process of a ceramic substrate in the manufacturing method of the unit of FIG. It is an enlarged view of the side electrode in another Example.

Explanation of symbols

1 Electronic circuit unit 2 Unit body 3 Upper layer substrate (first insulating substrate)
4 Upper surface 8, 9 Side surface 10, 10A Side electrode (first side electrode)
11 dent (first dent)
13 Lower layer substrate (second insulating substrate)
17 Lower surface 18, 19 Side surface 20, 20A Side electrode (second side electrode)
21 dent (second dent)
23 Intermediate layer substrate (third insulating substrate, insulating means)
24a exposed part (first exposed part)
25 Insulation part (insulation means)
27a exposed part (second exposed part)
40 Cover 46 Leg (Mounting leg)
50 Large-diameter through hole 52 Conductive paste 54 Small-diameter through hole 56, 57 Cutting line

Claims (8)

A cover having mounting legs;
A first insulating substrate having an upper surface covered with the cover and having a first side electrode formed on a side surface continuous with the upper surface and contacting the mounting leg;
A second insulating substrate having a lower surface facing the circuit board and having a second side electrode formed on a side surface connected to the lower surface and connectable to the circuit board;
Insulating means that is formed between the first side electrode and the second side electrode and electrically isolates the first side electrode and the second side electrode. A featured electronic circuit unit. The electronic circuit unit according to claim 1,
The insulating means includes
A third insulating substrate different from the first insulating substrate and the second insulating substrate;
The third insulating substrate is formed between the first side electrode and the second side electrode, and electrically separates the first side electrode and the second side electrode. An electronic circuit unit characterized by that. The electronic circuit unit according to claim 2,
The first side electrode has a first recess that is recessed from the periphery of the upper surface toward the inside of the upper surface, and fixes the inner surface of the mounting leg with solder,
The third insulating substrate is exposed from the first recessed portion to the side surface of the first insulating substrate below the first recessed portion, and faces the front end of the mounting leg. An electronic circuit unit characterized by having a protruding portion. The electronic circuit unit according to claim 3,
The electronic circuit unit according to claim 1, wherein the first recess is formed on the entire periphery of the first insulating substrate. The electronic circuit unit according to claim 3 or 4,
The second side surface electrode has a second recess that is recessed from the periphery of the lower surface toward the inside of the lower surface, and fixes the inner surface of the signal line from the circuit board with solder,
The third insulating substrate is exposed from the second recessed portion to the side surface of the second insulating substrate on the upper side of the second recessed portion, and is exposed to the tip of the signal line. An electronic circuit unit comprising a portion. The electronic circuit unit according to claim 5,
The electronic circuit unit according to claim 2, wherein the second recess is formed on the entire periphery of the periphery of the second insulating substrate. The electronic circuit unit according to any one of claims 1 to 6,
Each of the insulating substrates is made of ceramic and is an electronic circuit unit. A side electrode for fixing a mounting leg of the cover is formed on a side surface of the unit body, and is a method of manufacturing an electronic circuit unit that is cut along a cutting line to form the side electrode.
In the vicinity of the periphery of the ceramic substrate before firing, a step of drilling a plurality of large-diameter through holes on the cutting line;
Filling the large diameter through hole with a conductive paste;
Drilling a small diameter through hole inside the large diameter through hole and on the cutting line;
Disposing another ceramic substrate not having the large-diameter through hole between the plurality of ceramic substrates having the small-diameter through hole, and laminating at least three ceramic substrates;
Compressing the laminated ceramic substrate to form the unit body;
Cutting the compressed ceramic substrate along the cutting line to form the side electrodes;
Firing the laminated ceramic substrate formed with a cut portion that is substantially cut in half by dividing the small-diameter through hole;
A method of manufacturing an electronic circuit unit, comprising: placing the mounting leg in the recess, and fixing the cover to the side electrode using solder.

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