JP2009222389A - Pressure sensor and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pressure sensor and its manufacturing method, capable of performing both reduction in the radial size and enhancement in the accuracy of pressure detection. <P>SOLUTION: A side surface 66 side, facing one side surface 65 from among one surface 64a of a sensor chip 60 is electrically connected to one end part 31 of a terminal 30 via a bump 50. Consequently, thermal stress is transmitted only to the side surface 66 side of the sensor chip 60 via the terminal 30 and the bump 50, and the thermal stress will not reach a gauge section 63, unless it crosses in one direction, from the side surface 66 side of the sensor chip 60, up to the side surface 65 side opposed to the side surface 66. Consequently, influence of the thermal stress on the gauge section 63 can be reduced. Moreover, the radial size of the pressure sensor can be reduced, by reducing the length of the one surface 64a of the sensor chip 60, in a direction perpendicular to the direction of introduction of a pressure medium. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a pressure sensor in which one surface of a sensor chip is arranged in parallel to a direction in which a pressure medium is introduced, and a manufacturing method thereof.

  Conventionally, for example, Patent Document 1 proposes a pressure sensor that is miniaturized. Specifically, Patent Document 1 proposes a structure in which a wiring board is provided at one end of a resin case, and a sensor chip formed from a semiconductor substrate is flip-chip bonded to one surface of the wiring board via bumps. Has been.

  The wiring board is electrically connected to a terminal that is insert-molded in the case, and is attached to the case with the surface of the board being directed parallel to the radial direction of the pressure sensor. Further, a gauge part for detecting pressure is provided at the center of the quadrilateral pressure receiving surface of the sensor chip, and bumps are arranged at the four corners of the pressure receiving surface. And a sensor chip, a wiring board, and a terminal are electrically connected by flip chip joining to a wiring board via a bump. As a result, the sensor chip is arranged in parallel to the wiring board, and as a result, the pressure receiving surface of the sensor chip is oriented parallel to the radial direction of the pressure sensor.

As described above, the sensor is miniaturized by making the electrical connection portion of the sensor chip not by wire bonding but by flip chip bonding with a smaller required area.
JP 2006-177925 A

  However, in the above conventional technology, when the pressure sensor is subjected to the ambient temperature or the temperature of the pressure medium, the thermal expansion is caused by the fact that the linear expansion coefficients of the resin case, the metal bump, and the semiconductor sensor chip are different. There is a problem that thermal stress generated by expansion of the resin case having the largest coefficient is transmitted to the semiconductor sensor chip having the smallest coefficient of linear expansion via the wiring board and the bump.

  As described above, since the bumps are provided at the four corners of the pressure receiving surface, the thermal stress is directly transmitted to the gauge portion through paths from the four directions. That is, the gauge part is subjected to thermal stress distortion from four directions. Thereby, the pressure including the pressure generated by the distortion of the thermal stress is detected in the gauge portion. For this reason, the accuracy of pressure detection will deteriorate.

  An object of this invention is to provide the pressure sensor which can make it hard to transmit a thermal stress to a gauge part in view of the said point, and its manufacturing method.

  In order to achieve the above object, according to the first aspect of the present invention, there is provided a housing (10) having a pressure introducing hole (15), and a case (20) in which one end (21) is integrally assembled to the housing (10). The pressure medium is introduced from the opening (13) provided in the one end (11) of the housing (10) to the one end (21) side of the case (20) through the pressure introduction hole (15). The case (20) includes a groove (23) recessed in the pressure medium introduction direction from the tip surface (22) of the one end (21) of the case (20), and one end (31). ) Has a terminal (30) insert-molded in the case (20) so as to be exposed in the groove (23), and one surface (64a) parallel to the pressure medium introduction direction, and the opening portion of the one surface (64a) (13) Pressure detection on the side A sensor chip (60) having a gauge part (63), wherein the bottom side of the groove part (23) of one surface (64a) in the groove part (23) is electrically connected to one end part (31) of the terminal (30); It is characterized by having.

  According to this, the path of the thermal stress transmitted from the terminal (30) to the sensor chip (60) is transmitted only to the bottom side of the groove (23) in one surface (64a) of the sensor chip (60). Moreover, since the gauge part (63) is located in the opening part (13) side of the housing (10) in one surface (64a) of the sensor chip (60), the thermal stress is a groove part ( The gauge part (63) cannot be reached unless it crosses in one direction from the bottom part side of 23) to the opening part (13) side of the housing (10). Therefore, it is possible to make it difficult to transmit thermal stress to the gauge part (63), and it is possible to reduce the influence of thermal stress on the gauge part (63). Thereby, the accuracy of pressure detection can be improved.

  The invention according to claim 2 is characterized in that one surface (64a) of the sensor chip (60) and the other surface (64b) opposite to the one surface (64a) are separated from the housing (10). .

  According to this, the sensor chip (60) is cantilevered with respect to the terminal (30). Therefore, transmission of thermal stress from the other surface (64b) of the sensor chip (60) to the gauge part (63) can be eliminated, and the influence of thermal stress on the gauge part (63) can be reduced.

  As in the third aspect of the invention, the one surface (64a) of the sensor chip (60) can be electrically connected to one end (31) of the terminal (30).

  As in the invention described in claim 4, the surface (66) of the sensor chip (60) facing the bottom of the groove (23) is electrically connected to one end (31) of the terminal (30). Can be.

  In this case, as in the invention described in claim 5, the terminal (30) has one end (31) exposed in the groove (23) bent perpendicular to the pressure medium introduction direction, and the sensor chip. The surface (66) facing the bottom of the groove (23) in (60) can be electrically connected to one end (31) of the terminal (30) bent vertically.

  The invention according to claim 6 is characterized in that the groove (23) has a depth to accommodate the entire sensor chip (60).

  As a result, the sensor chip (60) can be protected from pressure pulsations in which the pressure temporarily increases. Therefore, the pressure sensor can be used in a relatively high pressure environment.

  In the invention according to claim 7, the groove (23) has a depth that the opening (13) side of the sensor chip (60) protrudes from the front end surface (22) of the case (20). And

  Thereby, the responsiveness of the gauge part (63) with respect to a pressure can be improved. Moreover, it can prevent a foreign material entering a groove part (23). In connection with this, the influence of a foreign material can be eliminated in the pressure detection.

  As in the invention according to claim 8, a vent (33) in which a part of the terminal (30) is exposed in the groove (23) is bent to provide a sensor chip (60). It can be electrically connected to the end side of the terminal (30) rather than the vent (33).

  According to the ninth aspect of the present invention, a notch (34) is provided in a portion of the terminal (30) exposed in the groove (23), and the sensor chip (60) is connected to the terminal (30) rather than the notch (34). 30) can be electrically connected to the end side.

  As in the invention described in claim 10, a through hole (35) is provided in a portion exposed in the groove (23) of the terminal (30), and the sensor chip (60) is connected to the terminal ( 30) can also be electrically connected to the end side.

  As in the invention according to claim 11, in the terminal (30) exposed in the groove (23), the sensor chip (60) of the one end (31) of the terminal (30) is electrically connected. The surface is bent so as to be located on the surface side opposite to this surface, and the sensor chip (60) can be electrically connected to the end side of the terminal (30) rather than the bent portion.

  As in the invention described in claim 12, the terminal (30) has one end (31) of the terminal (30) exposed in the groove (23) parallel to the pressure medium introduction direction in the groove (23). The case (20) can be insert-molded so as to be in close contact with the wall surface (23a).

  The invention according to claim 13 is characterized in that a sealing agent (70) is provided in the groove (23) to cover the joint between the sensor chip (60) and the terminal (30). Thereby, this junction part can be protected from a highly corrosive pressure medium, and the corrosion resistance with respect to a severe environment can be improved.

  In the invention according to claim 14, a fixing agent (71) that covers the joint between the sensor chip (60) and the terminal (30) is provided in the groove (23), and the fixing agent (71) A sealing agent (70) having a lower elastic modulus than that of the fixing agent (71) is provided thereon. Thereby, while being able to fix this junction part reliably with a fixing agent (71), this junction part can be protected from a highly corrosive pressure medium.

  In the invention according to claim 15, the sensor chip (60) has a rectangular shape, the long side of the rectangle is parallel to the direction of introduction of the pressure medium, and the short side of the rectangle is perpendicular to the direction of introduction of the pressure medium. It arrange | positions in a groove part (23) so that it may become parallel to.

  Thereby, the length in the direction perpendicular to the introduction direction of the pressure medium can be reduced on one surface (64a) of the sensor chip (60), and the radial size of the pressure sensor can be further reduced. Further, since the gap between the bump (50) and the gauge part (63) can be made long, the transmission of thermal stress from the bump (50) to the gauge part (63) can be further reduced.

  According to the sixteenth aspect of the present invention, the plurality of pads (68) to which the sensor chip (60) is electrically connected to the groove (23) side of the one surface (64a) of the sensor chip (60) are introduced with the pressure medium. The plurality of pads (68) are arranged such that adjacent pads (68) overlap with each other in the introduction direction of the pressure medium.

  Thereby, the length in the direction perpendicular to the introduction direction of the pressure medium can be further reduced on one surface (64a) of the sensor chip (60), and the radial size of the pressure sensor can be further reduced.

  As in the seventeenth aspect, the one end (31) of the terminal (30) and the sensor chip (60) can be electrically connected via the bump (50).

  The invention described in claim 18 is characterized in that the pressure sensor according to the invention described in claim 1 is manufactured. Specifically, a step of preparing a case (20) in which the sensor chip (60) and the terminal (30) are insert-molded, and the other surface (64b) opposite to the one surface (64a) of the sensor chip (60). ) Is held by a jig (81), and the case (20) and the sensor chip (60) are relatively moved to insert the sensor chip (60) into the groove (23), and the sensor chip (60) And a step of electrically connecting the sensor chip (60) to the terminal (30).

  Thus, the sensor chip (60) can be placed in the groove (23) of the case (20) with one surface (64a) of the sensor chip (60) parallel to the pressure medium introduction direction.

  In the invention according to claim 19, in the step of inserting the sensor chip (60) into the groove (23), one surface (64a) of the sensor chip (60) and the other surface (64b) opposite to the one surface (64a). The sensor chip (60) is inserted into the groove (23) so as to be separated from the housing (10).

  Thereby, a cantilever structure in which only the bottom side of the groove (23) of the one surface (64a) of the sensor chip (60) is held by the terminal (30) can be formed. For this reason, stress can be prevented from being transmitted from the housing (10) to the sensor chip (60), and the influence of pressure detection due to thermal stress can be reduced.

  In the step of electrically connecting the sensor chip (60) to the terminal (30) as in the invention described in claim 20, one surface (64a) of the sensor chip (60) is connected to one end of the terminal (30) ( 31) can be electrically connected.

  As in the invention described in claim 21, in the step of electrically connecting the sensor chip (60) to the terminal (30), the surface (66) of the sensor chip (60) facing the bottom of the groove (23). Can be electrically connected to one end (31) of the terminal (30).

  In this case, as in the invention described in claim 22, the terminal (30) has one end (31) exposed in the groove (23) bent perpendicularly to the direction of introduction of the pressure medium, and the sensor chip. In the step of electrically connecting (60) to the terminal (30), one end of the terminal (30) in which the surface (66) facing the bottom of the groove (23) of the sensor chip (60) is bent vertically. (31) can be electrically connected.

  In the invention according to claim 23, in the step of preparing the case (20) in which the terminal (30) is insert-molded, the terminal (30) is exposed to a portion exposed in the groove (23) of the terminal (30). In the step of preparing a bent portion (33) in which a part of the portion is bent, and electrically connecting the sensor chip (60) to the terminal (30), the terminal ( 30), the sensor chip (60) is electrically connected to the end side.

  According to this, the rigidity of the one end part (31) of the terminal (30) can be reduced, that is, the one end part (31) can be easily bent. That is, if the sensor chip (60) is strongly pressed against one end (31) of the terminal (30), the sensor chip (60) may be broken, and if the sensor chip (60) is pressed weakly, the terminal (30) may be pressed. There is a possibility of not joining. This also depends on the positional accuracy and flatness accuracy of the one end (31) of the terminal (30). However, since one end (31) of the terminal (30) is easily bent, the sensor chip (60) is moved by the jig (81) in a direction perpendicular to the pressure medium introduction direction. Even if 60) is pressed with a certain force, one end (31) of the terminal (30) is easily bent. For this reason, the force which presses down the sensor chip (60) by the bending of the one end (31) of the terminal (30) is absorbed by the vent (33), and the sensor chip (60) can be removed without destroying the sensor chip (60). It can be electrically connected to one end (31) of the terminal (30). Further, when the terminal (30) is insert-molded into the case (20), the positional accuracy and flatness accuracy of the terminal (30) can be relaxed.

  In the invention according to claim 24, in the step of preparing the case (20) in which the terminal (30) is insert-molded, a portion of the terminal (30) exposed in the groove (23) is provided as the terminal (30). In the step of preparing a notch (34) and electrically connecting the sensor chip (60) to the terminal (30), the sensor is located closer to the end of the terminal (30) than the notch (34). The chip (60) is electrically connected.

  Such a notch (34) can also reduce the positional accuracy and flatness accuracy of the one end (31) of the terminal (30), as in the invention described in claim 23.

  In the invention of claim 25, in the step of preparing the case (20) in which the terminal (30) is insert-molded, a portion of the terminal (30) exposed in the groove (23) as the terminal (30) In the step of electrically connecting the sensor chip (60) to the terminal (30), the end of the terminal (30) is located closer to the end of the terminal (30) than the through hole (35). The sensor chip (60) is electrically connected.

  Such a through hole (35) can also reduce the positional accuracy and flatness accuracy of the one end (31) of the terminal (30), as in the invention described in claim 23.

  In the invention of claim 26, in the step of preparing the case (20) in which the terminal (30) is insert-molded, the sensor chip (of the one end (31) of the terminal (30) is used as the terminal (30). In the step of preparing a bent surface so that the surface to which 60) is electrically connected is located on the surface opposite to this surface, and electrically connecting the sensor chip (60) to the terminal (30), The sensor chip (60) is electrically connected to the end side of the terminal (30) rather than the bent portion.

  Thus, by bending the one end portion (31) of the terminal (30), the positional accuracy and flatness accuracy of the one end portion (31) of the terminal (30) can be increased as in the invention described in claim 23. Can be lowered.

  Further, when the one end (31) of the terminal (30) is viewed from the one end (21) side of the case (20), the one end (31) of the terminal (30) on the plane perpendicular to the pressure medium introduction direction is shown. The area can be increased. Thereby, the position of the one end part (31) of the terminal (30) can be easily recognized, and the sensor chip (60) can be easily integrated with the terminal (30).

  In this case, since one end (31) of the terminal (30) is inclined with respect to the pressure medium introduction direction, the sensor chip (60) is also inclined with respect to the pressure medium introduction direction. Integrated.

  In the invention of claim 27, in the step of preparing the case (20) in which the terminal (30) is insert-molded, one end (31) of the terminal (30) exposed in the groove (23) is the groove (23 ) In close contact with the wall surface (23a) parallel to the introduction direction of the pressure medium.

  Thereby, since the terminal (30) is disposed along the wall surface (23a) parallel to the introduction direction of the pressure medium in the groove portion (23), the terminal (30) is inserted into the case (20) when the terminal (30) is inserted. 30) The positional accuracy and flatness accuracy of the one end portion (31) can be improved.

  In the step of electrically connecting the sensor chip (60) to the terminal (30) as in the invention described in claim 28, the one end (31) of the terminal (30) and the sensor chip via the bump (50) (60) can be electrically connected.

  In the invention according to claim 29, in the step of preparing the case (20), when the sensor chip (60) is electrically connected to the terminal (30) as the case (20), the sensor chip (60). What has the groove part (23) of the depth which accommodates the whole is prepared, It is characterized by the above-mentioned.

  Thereby, problems, such as a sensor chip (60) hitting a part of manufacturing apparatus, can be avoided and handling of a case (20) can be made easy.

  In the invention according to claim 30, in the step of preparing the case (20), when the sensor chip (60) is electrically connected to the terminal (30) as the case (20), the sensor chip (60). Of these, one having a groove (23) having a depth projecting from the front end surface (22) of the case (20) on one side (65) side is prepared.

  In the invention according to claim 31, in the step of preparing the sensor chip (60), a rectangular chip is prepared as the sensor chip (60), and the sensor chip (60) is electrically connected to the terminal (30). The process is characterized in that the long side of the rectangle is parallel to the introduction direction of the pressure medium, and the short side of the rectangle is parallel to the direction perpendicular to the introduction direction of the pressure medium.

  As a result, the length in the direction perpendicular to the direction of introduction of the pressure medium on the one surface (64a) of the sensor chip (60) can be further reduced, and a pressure sensor with a further reduced radial size of the pressure sensor is manufactured. be able to.

  In addition, the code | symbol in the bracket | parenthesis of each said means shows the correspondence with the specific means as described in embodiment mentioned later.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the same or equivalent parts are denoted by the same reference numerals in the drawings.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. The pressure sensor shown in the present embodiment is mounted on, for example, an automobile, and is used for a pressure sensor that detects fuel pressure, lubricating oil pressure of an engine or drive system, refrigerant pressure of an air conditioner, exhaust gas pressure, or the like. .

  FIG. 1 is a schematic cross-sectional view of a pressure sensor according to a first embodiment of the present invention. 2 is an enlarged view of a portion A in FIG. 1, and FIG. As shown in FIG. 1, the pressure sensor includes a housing 10 and a case 20.

  The housing 10 is a hollow metal case processed by cutting, cold forging, or the like, and a screw portion 12 that can be screw-coupled to an object to be measured is formed on the outer peripheral surface of the one end portion 11 of the housing 10. ing. In addition, a pressure introducing hole 15 penetrating from the opening 13 formed at one end of the housing 10 to the other end 14 side of the housing 10 is extended to the one end 11 of the housing 10. Serves as a pressure introduction passage. In such a housing 10, the pressure medium enters the other end 14 side from the opening 13 of the housing 10 through the pressure introducing hole 15.

  Hereinafter, the direction in which the pressure medium moves from the opening 13 of the one end portion 11 of the housing 10 toward the other end portion 14 in the pressure introduction passage is referred to as the pressure medium introduction direction.

  The case 20 serves as a connector for outputting a signal indicating the pressure value detected by the pressure sensor to the outside, and by molding a resin such as PPS (polyphenylene sulfide) or PBT (polybutylene terephthalate). It is formed. In the present embodiment, the case 20 has a cylindrical shape, for example.

  A groove portion 23 that is recessed from the distal end surface 22 in the pressure medium introduction direction is provided on the distal end surface 22 of the one end portion 21 of the case 20. The case 20 is formed with a plurality of insert-molded terminals 30 made of a metal rod-like member. One end 31 of each terminal 30 is insert-molded in the case 20 so as to be exposed in the groove 23.

  On the other hand, the other end 32 of the terminal 30 is disposed so as to be exposed in the opening 25 provided in the other end 24 of the case 20. That is, the other end 24 provided with the opening 25 in the case 20 is configured as a connector part in the pressure sensor together with the other end 32 of each terminal 30 located in the opening 25. That is, an external connector (not shown) is connected to the opening 25 and is electrically connected to the ECU or the like of the automobile via the wiring member. As the material of the terminal 30, for example, a conductive material such as copper is employed.

  Further, a groove portion 26 is provided in a side portion of the case 20 so as to be recessed in a direction perpendicular to the pressure medium introduction direction. The terminal 30 is exposed at the bottom of the groove 26. The circuit board 40 is installed on the terminal 30 exposed in the groove 26.

  The circuit board 40 has a function of outputting a drive signal to the gauge unit 63 (to be described later), outputting a detection signal to the outside, inputting an electrical signal from the gauge unit 63, performing calculation and amplification processing, and outputting the signal to the outside The control circuit etc. which have are formed. The groove part 26 is closed with a lid 27, for example, and the circuit board 40 is protected from the outside.

  Further, the case 20 has a sensor chip 60 that is electrically connected to one end 31 of the terminal 30 via the bump 50.

  As shown in FIG. 2, the sensor chip 60 includes a first silicon substrate 61a as a plate-like base and a second silicon substrate 61b disposed on the first silicon substrate 61a. . Further, a cavity 62 is provided in a laminated structure constituted by the silicon substrates 61a and 61b. The cavity 62 is configured by covering the concave portion formed by etching or the like on the surface side of the second silicon substrate 61b facing the first silicon substrate 61a with the first silicon substrate 61a. That is, the cavity 62 is configured as a pressure reference chamber that is hermetically sealed and has a constant pressure such as a vacuum. The first silicon substrate 61a as a base may be a glass material.

  And the part corresponding to the cavity 62 in the surface on the opposite side to the side which faces the 1st silicon substrate 61a among the 2nd silicon substrates 61b is comprised as a diaphragm as a sensing part. The diaphragm is provided with a gauge portion 63 for detecting pressure, and a surface of the diaphragm opposite to the surface on the first silicon substrate 61a side is a pressure receiving surface. A bridge circuit is formed in the gauge portion 63 by impurity injection / diffusion, etc., and a change in resistance value of the bridge circuit due to the distortion of the diaphragm is detected.

  As shown in FIG. 2 and FIG. 3, the gauge portion 63 has a side surface 65 side perpendicular to the one surface 64 a out of one surface 64 a of the second silicon substrate 61 b opposite to the side facing the first silicon substrate 61 a. The bump 50 is arranged on the side surface 66 side facing the one side surface 65 of the one surface 64a. That is, the gauge portion 63 is disposed on the opening 13 side of the housing 10 on the one surface 64 a of the sensor chip 60.

  The gauge portion 63 is electrically connected to the pad 68 via a wiring 67 extending from the one side surface 65 side of the second silicon substrate 61 b to the side surface 66 side facing the one side surface 65. As a result, the pressure received by the diaphragm is converted into an electrical signal by the gauge portion 63, and this electrical signal is input to the circuit board 40 via the wiring 67, the pad 68, the bump 50, and the terminal 30. A part of the wiring 67 and the pad 68 is covered and protected by a protective film 69.

  The sensor chip 60 has a rectangular plate shape, and the long side of the rectangle is arranged in parallel to the introduction direction of the pressure medium, and the short side of the rectangle is arranged perpendicular to the introduction direction of the pressure medium. In this case, one surface 64a of the second silicon substrate 61b is parallel to the pressure medium introduction direction, the one side surface 65 side is directed to the pressure introduction hole 15 side, and the side surface 66 side facing the one side surface 65 is directed to the groove portion 23 side. It has been. One surface 64 a faces the terminal 30.

  That is, the sensor chip 60 has a cantilever structure in which one side surface 65 side is free, and the side surface 66 side facing the one side surface 65 is fixed to the one end portion 31 of the terminal 30 via the bump 50. It has a so-called vertical structure. That is, in the groove part 23, the bottom part side of the groove part 23 of the one surface 64 a is joined to the one end part 31 of the terminal 30. Due to the arrangement structure of the sensor chip 60, the one surface 64 a of the sensor chip 60 and the other surface 64 b opposite to the one surface 64 a are separated from the housing 10. According to this, the sensor chip 60 is influenced by the terminal 30 and the case 20 only from the side surface 66 side of the one surface 64a. The housing 10 is not affected by thermal stress.

  Further, as shown in FIG. 3, the gauge portion 63 is disposed on one side surface 65 of the second silicon substrate 61 b, and the pad 68 is disposed on the side surface 66 side facing the one side surface 65. For this reason, the distance between the gauge part 63 and the pad 68 is longer than the short side of the rectangle.

  The groove portion 23 has a depth such that one side surface 65 side (opening portion 13 side of the housing 10) of the sensor chip 60 protrudes from the front end surface 22 of the case 20. According to this, since the pressure medium easily comes into contact with the pressure receiving surface, it becomes possible to improve the responsiveness of the gauge portion 63 to the pressure. Since the entry of foreign matter into the shallow groove 23 can be prevented, the influence of the foreign matter at the time of pressure detection is also eliminated.

  Further, a sealing agent 70 is provided in the groove 23 to cover the joint between the sensor chip 60 and the bump 50 and the joint between the bump 50 and the terminal 30. As the sealing agent 70, for example, a fluorine resin is employed. The sealing agent 70 can protect the joint from a highly corrosive pressure medium, and the corrosion resistance against severe environments is increased.

  The housing 10 is assembled to one end portion 21 of the case 20 having the above configuration. That is, the housing recess 16 is formed in the other end 14 of the housing 10, and the one end 21 of the case 20 is inserted into the housing recess 16. Further, as shown in FIG. 1, an annular groove (O-ring groove) 28 surrounding the groove 23 is formed on the front end surface 22 of the case 20, and an O-ring 29 for sealing is disposed in the groove 28. Has been. The end of the housing 10 on the side of the housing recess 16 is caulked to the one end 21 of the case 20, thereby forming the caulking portion 17, sealing the inside of the housing 10, and assembling the housing 10 and the case 20 together. It is the composition which was made. Thus, the pressure medium is introduced from the opening 13 provided at the one end 11 of the housing 10 to the one end 21 side of the case 20 through the pressure introduction hole 15.

Next, a method for manufacturing the case 20 including the sensor chip 60 and a method for manufacturing the pressure sensor will be described. First, a method for manufacturing the case 20 including the sensor chip 60 will be described with reference to FIG. 4. First, the sensor chip 60 shown in FIGS. 2 and 3 is manufactured by a semiconductor process, and bumps 50 are provided on the pads 68. Prepare something. A case 20 in which the terminal 30 is insert-molded is prepared.

  Thereafter, for example, the front end surface 22 of the case 20 is photographed with a camera, and the position of the one end 31 of the terminal 30 in the groove 23 is recognized by image processing. The movement of the jigs 80 and 81 in the subsequent processes is performed based on the position of the terminal 30 obtained by image processing.

  Next, in the step shown in FIG. 4A, in the groove portion 23, the one end portion 31 of the terminal 30 is not bent on the opposite side of the one end portion 31 of the terminal 30 to the surface to which the bump 50 is bonded. A jig 80 for supporting is arranged.

  Subsequently, in the step illustrated in FIG. 4B, the other surface 64 b of the sensor chip 60 opposite to the one surface 64 a is held by the jig 81. In this case, the sensor chip 60 is held by the jig 81 by, for example, a vacuum chuck method. Then, the sensor chip 60 is inserted into the groove portion 23 by moving the jig 81 in the pressure medium introduction direction with the one surface 64a provided with the bumps 50 facing the terminal 30 side. In this case, the position of the sensor chip 60 may be fixed and the case 20 side may be moved, and the case 20 and the sensor chip 60 may be moved relatively.

  In the step shown in FIG. 4C, the jig 81 is moved to the terminal 30 side in a direction perpendicular to the pressure medium introduction direction, and the bump 50 is brought into contact with the terminal 30. In this case, the sensor chip 60 is moved to the jig 80 side by the jig 81 so that all the bumps 50 are in contact with the one end portion 31 of each terminal 30.

  Thereafter, the contact portion between the bump 50 and the terminal 30 is heated by, for example, ultrasonic waves, and the bumps 50 and the terminal 30 are ultrasonically bonded. And the sealing agent 70 is filled in the groove part 23. Further, the circuit board 40 is provided on the terminal 30 exposed in the groove portion 26 provided on the side portion of the case 20, and the lid 27 is provided on the groove portion 26. The circuit board 40 may be installed on the case 20 before the sensor chip 60 is integrated with the case 20. Thus, the case 20 including the sensor chip 60 is completed.

  Next, a manufacturing method of the pressure sensor will be described. The case 20 assembled with the sensor chip 60 as described above is prepared. Further, an O-ring 29 is disposed in the groove 28 of the front end surface 22 of the case 20. On the other hand, the housing 10 provided with the screw part 12, the pressure introduction hole 15, and the accommodation recessed part 16 is prepared.

  Subsequently, the one end 21 of the case 20 is fitted into the housing recess 16 of the housing 10. Thereafter, the caulking portion 17 is formed by caulking the end portion of the housing 10 to the one end portion 21 of the case 20. Thus, by integrating the housing 10 and the case 20, the case 20 and the housing 10 are assembled and fixed by the caulking portion 17. In this way, the pressure sensor shown in FIG. 1 is completed.

  The basic pressure detection operation of the pressure sensor will be described. The pressure sensor is attached to the engine or the like in the vehicle as described above via the screw portion 12 of the housing 10. For example, engine oil as a pressure medium is introduced into the pressure sensor from the opening 13 of the housing 10 through the pressure introduction hole 15.

  Then, the introduced pressure is applied to the diaphragm of the sensor chip 60. Then, an electrical signal corresponding to the applied pressure is output as a sensor signal from the gauge unit 63, and is input to the circuit of the circuit board 40 via the wiring 67, the pad 68, the bump 50, and the terminal 30, and the signal processing of the sensor signal Is done.

  The sensor signal processed by the circuit of the circuit board 40 is transmitted again to the external circuit via the terminal 30 and, for example, oil pressure is detected. In this way, pressure detection by the pressure sensor is performed.

  Next, the path of thermal stress in the pressure sensor will be described. In the situation where pressure detection is performed as described above, the pressure sensor receives heat depending on the pressure medium and the ambient temperature. The case 20 is made of resin, the terminals 30 and the bumps 50 are metal, and the sensor chip 60 provided with the gauge portion 63 is a semiconductor. Therefore, the case 20 has the largest linear expansion coefficient, followed by metal and semiconductor.

  When the pressure sensor is heated by the pressure medium or the ambient temperature, the case 20 expands, and thermal stress accompanying the expansion is transmitted to the sensor chip 60 via the terminals 30 and the bumps 50. However, in this embodiment, since the sensor chip 60 has a cantilever structure with respect to the terminal 30, the thermal stress faces one side 65 of the one surface 64 a of the sensor chip 60 through the terminal 30 and the bump 50. Is transmitted only to the side surface 66 side. The thermal stress generated in the case 20 is transmitted to the sensor chip 60 through such a path.

  Here, since the gauge portion 63 is located on the one side surface 65a of the one surface 64a of the sensor chip 60, the thermal stress is on the side surface 66 side opposite to the one side surface 65 of the sensor chip 60 provided with the bumps 50. To one side 65 side in one direction. As described above, in the sensor chip 60, the path of the thermal stress to the gauge part 63 is only in one direction, and the thermal stress transmitted to the bump 50 must be transmitted from end to end of the sensor chip 60. Therefore, the thermal stress is difficult to be transmitted to the gauge portion 63, and the thermal stress reaching the gauge portion 63 is reduced. As a result, the gauge part 63 can detect only the pressure of the pressure medium without being affected by the thermal stress.

  As described above, in this embodiment, the sensor chip 60 has a cantilever structure with respect to the terminal 30, and the sensor chip 60 has a vertically mounted structure so that the pressure receiving surface is parallel to the pressure medium introduction direction. It is characterized by that.

  According to this, the transmission path of the thermal stress generated in the case 20 can be made only on the side surface 66 side of the sensor chip 60, and the heat transmission path to the gauge portion 63 can be unidirectional. . As a result, it is possible to make it difficult to transmit the thermal stress to the gauge part 63, so that the pressure caused by the thermal stress can be prevented from being detected by the gauge part 63, and as a result, the pressure detection can be made highly accurate. it can.

  Further, since the rectangular sensor chip 60 is placed vertically, the width of the one surface 64a of the sensor chip 60 can be reduced, the size of the pressure sensor in the radial direction can be reduced, and the pressure sensor can be downsized. Can be

(Second Embodiment)
In the present embodiment, only different parts from the first embodiment will be described. In the first embodiment, the terminal 30 is connected to the terminal 30 via the bump 50 provided on the one surface 64a of the sensor chip 60. However, in the present embodiment, the bump 30 is provided on the side surface 66 of the sensor chip 60 to provide the terminal 30. It is characterized in that it is connected to one end 31.

  FIG. 5 is a partial cross-sectional view of the pressure sensor according to the present embodiment, and is an enlarged cross-sectional view of part A of FIG. As shown in this figure, one end 31 of the terminal 30 insert-molded in the case 20 is bent perpendicularly to the direction of introduction of the pressure medium.

  The configuration of the sensor chip 60 is the same as that shown in FIG. However, in the present embodiment, the side surface 66 of the sensor chip 60 that faces the bottom of the groove 23 is electrically connected to the one end 31 of the terminal 30. Specifically, the bump 50 is provided on the side surface 66 facing the one side surface 65 of the sensor chip 60. The bump 50 is bonded to one end 31 of the terminal 30 that is bent perpendicularly to the introduction direction of the pressure medium, and the sensor chip 60 is electrically connected to the terminal 30.

  The bump 50 is formed on the pad 68 provided on the side surface 66 by the wiring 67 extending from the one surface 64 a of the sensor chip 60 to the side surface 66. On the other hand, a wiring 67 may be provided between the first silicon substrate 61a and the second silicon substrate 61b, and the wiring 67 may be extended to the side surface 66. In this case, when the sensor chip 60 is manufactured, the bump 50 is provided on the side surface of the groove formed by the half cut after performing a half cut to leave a part of the wafer, and the wafer is diced and cut. What has the bumps 50 provided on the side surface 66 can be obtained.

  The groove portion 23 is filled with a sealing agent 70. As a result, the joint portion between the one end portion 31 of the terminal 30 and the bump 50 that is bent perpendicularly to the introduction direction of the pressure medium, and the joint portion between the side surface 66 (pad 68) of the sensor chip 60 and the bump 50 are covered. Protected.

  Next, a method of manufacturing the case 20 having the form shown in FIG. 5 will be described with reference to FIG. First, the sensor chip 60 in which the bumps 50 are provided on the side surface 66 of the one surface 64a facing the one side surface 65 is prepared. In addition, the terminal 30 is insert-molded in the case 20, and one end 31 of the terminal 30 in the groove 23 is bent perpendicularly to the pressure medium introduction direction using a jig.

  Subsequently, the front end surface 22 of the case 20 is photographed with a camera, and the position of the one end portion 31 of the terminal 30 is grasped by image processing.

  Next, as shown in FIG. 6, the other surface 64b of the sensor chip 60 opposite to the one surface 64a is held by a jig 81, a side surface 66 provided with bumps 50, and a terminal 30 bent vertically. The one end part 31 of this is made to oppose. Then, by moving the jig 81 in the pressure medium introduction direction, the bump 50 and the terminal 30 are brought into contact with each other, and the one end 31 of the terminal 30 is pressed by the bump 50.

  Thereafter, the bump 50 and the terminal 30 are ultrasonically bonded. Thus, the case 20 assembled with the sensor chip 60 shown in FIG. 5 is completed. When manufacturing a pressure sensor, the case 20 may be assembled to the housing 10.

  As described above, the one end 31 of the terminal 30 is bent perpendicularly to the pressure medium introduction direction, and the bumps 50 are provided on the side surfaces 66 of the sensor chip 60, whereby the sensor chip 60 is arranged in the pressure medium introduction direction. Just move it to For this reason, an assembly | attachment process can be simplified.

(Third embodiment)
In the present embodiment, only portions different from the first and second embodiments will be described. In the first and second embodiments, the groove 23 has such a depth that the sensor chip 60 protrudes from the front end surface 22 of the case 20. However, in this embodiment, the groove 23 has a depth that accommodates the entire sensor chip 60. The feature is that it is.

  FIG. 7 is a partial cross-sectional view of the pressure sensor according to the present embodiment, and is an enlarged cross-sectional view of a portion A in FIG. As shown in this figure, one side surface 65 of the sensor chip 60 is located closer to the terminal 30 than the front end surface 22 of the case 20. Thereby, the entire sensor chip 60 is accommodated in the groove 23.

  Thus, by arranging the sensor chip 60 in the groove 23, the sensor chip 60 can be prevented from being affected by a temporary high pressure due to pressure pulsation. In addition, since the sensor chip 60 does not hit a part of the manufacturing apparatus or the like, the pressure sensor can be easily handled in manufacturing.

(Fourth embodiment)
In the present embodiment, only parts different from the first to third embodiments will be described. The present embodiment is characterized in that a vent is provided at one end 31 of the terminal 30.

  FIG. 8 is a partial cross-sectional view of the pressure sensor according to the present embodiment, and is an enlarged cross-sectional view of part A of FIG. As shown in this figure, a vent 33 in which a part of the one end 31 is bent is provided at one end 31 of the terminal 30 exposed in the groove 23. The bump 50 is bonded to the end portion side of the terminal 30 with respect to the vent 33. The number of vents 33 is not limited to one.

  The vent 33 plays a role of reducing the rigidity of the one end portion 31 of the terminal 30. When the rigidity of the one end portion 31 of the terminal 30 is lowered, the one end portion 31 of the terminal 30 is easily bent by the vent 33 in a direction perpendicular to the introduction direction of the pressure medium.

  The bump 50 is joined to the terminal 30 provided with such a vent 33 as follows. First, the case 20 in which the terminal 30 is insert-molded is prepared. In this case, the terminal 30 provided with the vent 33 may be insert-molded into the case 20, or after the terminal 30 is insert-molded into the case 20, the vent 33 may be formed using a jig.

  Then, the sensor chip 60 is moved using the jig 81, and the bump 50 is brought into contact with the end side of the vent 33. Thereafter, ultrasonic bonding is performed.

  In such joining, the vent 33 is not provided at the one end 31 of the terminal 30, and when the bump 50 is joined to the terminal 30, the terminal 30 is inserted into the case 20 in advance in the groove 23. The position accuracy of each exposed terminal 30 and the flatness accuracy of each surface to which the bump 50 is bonded must be ensured. This is because if the flatness accuracy of each terminal 30 is poor and the force for pressing the bumps 50 is weak, the bumps 50 may not be joined to the terminals 30. Conversely, if the bumps 50 are pressed firmly against the one end 31 of the terminal 30 in order to securely bond all the bumps 50, the pressing force is also applied to the sensor chip 60, and the sensor chip 60 may break.

  However, as in this embodiment, the vent 33 is provided at one end 31 of the terminal 30 to make it easier to bend at the one end 31 so that the jig 81 can move the sensor chip 60 in a direction perpendicular to the pressure medium introduction direction. Even if the bump 50 is pressed with a certain force, the bent 33 can absorb the force pressing the bump 50 by bending the one end 31 of the terminal 30.

  According to this, since the bump 50 can be pressed against the terminal 30 with a certain strong force, all the bumps 50 can be brought into contact with the terminal 30 reliably. Therefore, the bump 50 can be bonded to the terminal 30 without destroying the sensor chip 60. Further, when the terminal 30 is insert-molded into the case 20, it is not necessary to ensure the flatness of each surface to which the bump 50 is bonded in each terminal 30 exposed in the groove 23. The positional accuracy and flatness accuracy can be relaxed.

  In the second embodiment, when the vent 33 according to the present embodiment is adopted, any one of the portion parallel to the pressure medium introduction direction and the portion perpendicular to the pressure medium introduction direction of the one end portion 31 of the terminal 30 is selected. Either one or both may be provided.

(Fifth embodiment)
In the present embodiment, only portions different from the first to fourth embodiments will be described. This embodiment is characterized in that a notch is provided in one end 31 of the terminal 30.

  FIG. 9 is a partial cross-sectional view of the pressure sensor according to the present embodiment, and is an enlarged cross-sectional view of part A of FIG. As shown in this figure, a notch 34 is provided in one end 31 of the terminal 30 exposed in the groove 23 in a part of the one end 31. The bump 50 is bonded to the end portion side of the terminal 30 with respect to the notch 34. The number of notches 34 is not limited to one.

  Such a notch 34 also allows the one end 31 of the terminal 30 to have a degree of freedom in a direction perpendicular to the pressure medium introduction direction.

(Sixth embodiment)
In the present embodiment, only parts different from the first to fifth embodiments will be described. The present embodiment is characterized in that a through hole is provided in one end portion 31 of the terminal 30.

  FIG. 10 is a partial cross-sectional view of the pressure sensor according to the present embodiment, and is an enlarged cross-sectional view of part A of FIG. As shown in this figure, a through hole 35 is provided in one end 31 of the terminal 30 exposed in the groove 23 in a part of the one end 31. The bump 50 is joined to the end portion side of the terminal 30 with respect to the through hole 35. The number of through holes 35 is not limited to one, and the size of the holes may not be constant.

  Such a through-hole 35 can also provide the one end 31 of the terminal 30 with a degree of freedom in a direction perpendicular to the pressure medium introduction direction.

(Seventh embodiment)
In the present embodiment, only parts different from the first to sixth embodiments will be described. This embodiment is characterized in that one end 31 of the terminal 30 is bent.

  FIG. 11 is a partial cross-sectional view of the pressure sensor according to the present embodiment, and is an enlarged cross-sectional view of part A of FIG. As shown in this figure, the end surface 31 of the terminal 30 exposed in the groove portion 23 is bent so that the surface to which the bump 50 is joined is located on the surface side opposite to this surface. The bump 50 is bonded to the end portion side of the terminal 30 rather than the bent portion of the one end portion 31.

  That is, the tip portion of the one end portion 31 of the terminal 30 is inclined with respect to the pressure medium introduction direction. According to this, when the position of the one end portion 31 of the terminal 30 is recognized by performing image processing on the image photographed by the camera, the area of the one end portion 31 to be photographed can be increased. Thereby, since it becomes easy to grasp | ascertain the position of a joining surface, the bump 50 can be joined easily.

  When the sensor chip 60 is assembled to the terminal 30, after the position of the terminal 30 is confirmed by image processing as described above, the sensor chip 60 is held by the jig 81 and is parallel to the bent one end 31. The sensor chip 60 is tilted by the jig 81. Then, as shown in FIGS. 4B and 4C, the sensor chip 60 is moved while being tilted, and the bumps 50 are brought into contact with the bent portion of the terminal 30 for ultrasonic bonding. In this way, as shown in FIG. 11, the sensor chip 60 can be assembled to the terminal 30 while being tilted with respect to the pressure medium introduction direction.

  Thus, by bending the one end portion 31 of the terminal 30, the positional accuracy of the terminal 30 and the flatness accuracy of the surface to which the bump 50 is bonded can be lowered, and the insert molding of the terminal 30 into the case 20 can be performed. It can be done easily.

(Eighth embodiment)
In the present embodiment, only parts different from the first to seventh embodiments will be described. In the present embodiment, the position accuracy of the terminal 30 and the flatness accuracy of the surface to which the bump 50 is joined are increased when the terminal 30 is insert-molded by using the wall surface of the groove 23 parallel to the pressure medium introduction direction. It is a feature.

  FIG. 12 is a partial cross-sectional view of the pressure sensor according to the present embodiment, and is an enlarged cross-sectional view of part A of FIG. As shown in this figure, one end 31 of the terminal 30 exposed in the groove 23 is in close contact with the wall surface 23 a parallel to the pressure medium introduction direction in the groove 23 and is insert-molded in the case 20.

  In this way, by performing the insert molding of the terminal 30 using the wall surface 23a parallel to the introduction direction of the pressure medium, a process, a jig, etc. for ensuring the positional accuracy and flatness accuracy of the terminal 30 during the insert molding. It becomes unnecessary. Moreover, since the one end part 31 of the terminal 30 exposed in the groove part 23 is arrange | positioned along the wall surface 23a of the groove part 23, the position accuracy of the terminal 30 and the precision of flatness are high. Therefore, the bump 50 can be reliably bonded to the terminal 30.

  In addition, variations in the load and stroke of the jig 81 when the sensor chip 60 is pressed against the terminal 30 can be reduced. Thereby, management of the load of the jig 81 in a manufacturing apparatus becomes easy.

(Ninth embodiment)
In the present embodiment, only parts different from the first to eighth embodiments will be described. In each of the above embodiments, only the sealing agent 70 is filled in the groove 23. However, the present embodiment is characterized in that the fixing agent and the sealing agent 70 are stacked in the groove 23.

  FIG. 13 is a partial cross-sectional view of the pressure sensor according to the present embodiment, and is an enlarged cross-sectional view of a portion A in FIG. As shown in this figure, a fixing agent 71 is provided in the groove 23 to cover the joint between the sensor chip 60 and the bump 50 and the joint between the bump 50 and the terminal 30. The fixing agent 71 firmly fixes the connection between the terminal 30 and the sensor chip 60. For example, an epoxy resin having a high elastic modulus is used.

  Further, a sealing agent 70 having a lower elastic modulus than the fixing agent 71 is provided on the fixing agent 71. The sealing agent 70 protects the joint from a harsh environment. For example, a fluorine resin is used. As described above, the joint portion can be protected by the two layers of the fixing agent 71 having a high elastic modulus and the sealing agent 70 having a low elastic modulus.

(Other embodiments)
Combinations of the above embodiments are possible. For example, when one end 31 of the terminal 30 is bent perpendicularly to the pressure medium introduction direction, a vent 33 shown in FIG. 8 is provided in a portion of the one end 31 parallel to the pressure medium introduction direction. A notch 34 shown in FIG. 9 may be provided in a portion of the one end portion 31 in a direction perpendicular to the pressure medium introduction direction. Further, any one of the vent 33, the notch 34, and the through hole 35 according to the fourth to sixth embodiments may be combined with the one end portion 31 of the bent terminal 30 according to the seventh embodiment.

  In each of the above embodiments, the pads 68 are arranged in a line in a direction perpendicular to the direction of introduction of the pressure medium as shown in FIG. 3, but may be arranged as shown in FIG. In other words, the plurality of pads 68 arranged in the direction perpendicular to the pressure medium introduction direction are arranged such that adjacent pads 68 overlap in the pressure medium introduction direction. Thereby, the length in the direction perpendicular to the introduction direction of the pressure medium on the one surface 64a of the sensor chip 60 can be further reduced as compared with the case shown in FIG.

  In each of the above embodiments, the rectangular plate-shaped sensor chip 60 has been described. However, the shape of the sensor chip 60 is not limited to a rectangle, and may be a square. If the distance between the bump 50 and the gauge portion 63 is made longer and the size of the pressure sensor in the radial direction is made smaller, the sensor chip 60 is preferably rectangular.

  The configuration of the pressure sensor shown in FIG. 1 is an example, and is not limited to this. For example, the sensor signal output from the gauge unit 63 is processed by a processing circuit in the circuit board 40, but the processing circuit in the circuit board 40 may be provided in the sensor chip 60. In this case, the processing circuit is provided between the pad 68 and the gauge portion 63 in the second silicon substrate 61b.

  In each of the above embodiments, the bump 50 is used when the one end 31 of the terminal 30 and the sensor chip 60 are electrically connected. However, the electrical connection method is not limited to the bump 50, and other methods may be used. It doesn't matter. For example, electrical connection using a conductive paste such as a silver paste is also possible.

It is a schematic sectional drawing of the pressure sensor which concerns on 1st Embodiment of this invention. It is the A section enlarged view of FIG. FIG. 3 is a view taken in the direction of arrow B in FIG. It is the figure which showed the manufacturing process which attaches a sensor chip to a case. It is a partial cross section figure of the pressure sensor concerning a 2nd embodiment of the present invention. In 2nd Embodiment, it is the figure which showed the manufacturing process which assembles | attaches a sensor chip to a case. It is a partial cross section figure of the pressure sensor concerning a 3rd embodiment of the present invention. It is a partial cross section figure of the pressure sensor concerning a 4th embodiment of the present invention. It is a partial cross section figure of the pressure sensor concerning a 5th embodiment of the present invention. It is a partial cross section figure of the pressure sensor concerning a 6th embodiment of the present invention. It is a partial cross section figure of the pressure sensor concerning a 7th embodiment of the present invention. It is a partial cross section figure of the pressure sensor concerning an 8th embodiment of the present invention. It is a partial cross section figure of the pressure sensor concerning a 9th embodiment of the present invention. In other embodiment, it is the figure which showed arrangement | positioning of the pad in a sensor chip.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Housing 13 Opening part 15 Pressure introducing hole 20 Case 21 One end part 22 Case End face 23 Groove part 30 Terminal 31 One end part of terminal 50 Bump 60 Sensor chip 63 Gauge part 64a One side of sensor chip 65 One side of sensor chip 66 Sensor chip Side of

Claims (31)

A housing (10) having a pressure introduction hole (15) and a case (20) in which one end (21) is integrally assembled to the housing (10) are provided, and one end (11) of the housing (10) A pressure sensor in which a pressure medium is introduced from the provided opening (13) to the one end (21) side of the case (20) through the pressure introduction hole (15),
The case (20)
A groove (23) recessed in the introduction direction of the pressure medium from the tip surface (22) at one end (21) of the case (20);
A terminal (30) insert-molded in the case (20) such that one end (31) is exposed in the groove (23);
The surface (64a) parallel to the introduction direction of the pressure medium has a gauge portion (63) for detecting pressure on the opening (13) side of the surface (64a), and the groove portion (23) In the first surface (64a), the bottom of the groove (23) has a sensor chip (60) electrically connected to one end (31) of the terminal (30). Pressure sensor.   The pressure according to claim 1, wherein one surface (64a) of the sensor chip (60) and the other surface (64b) opposite to the one surface (64a) are separated from the housing (10). Sensor.   The pressure sensor according to claim 1 or 2, wherein the one surface (64a) of the sensor chip (60) is electrically connected to one end (31) of the terminal (30).   The surface (66) of the sensor chip (60) facing the bottom of the groove (23) is electrically connected to one end (31) of the terminal (30). Or the pressure sensor of 2. The terminal (30) has one end (31) exposed in the groove (23) bent perpendicular to the direction of introduction of the pressure medium,
A surface (66) of the sensor chip (60) facing the bottom of the groove (23) is electrically connected to one end (31) of the vertically bent terminal (30). The pressure sensor according to claim 4.   The pressure sensor according to any one of claims 1 to 5, wherein the groove (23) is deep enough to accommodate the entire sensor chip (60).   The groove (23) has a depth such that the opening (13) side of the sensor chip (60) protrudes from a tip surface (22) of the case (20). The pressure sensor as described in any one of thru | or 5.   A portion of the terminal (30) exposed in the groove (23) is provided with a bent portion (33) in which a portion of the portion is bent, and the sensor chip (60) is provided with the vent ( The pressure sensor according to any one of claims 1 to 7, wherein the pressure sensor is electrically connected to the end side of the terminal (30) rather than 33).   A portion of the terminal (30) that is exposed in the groove (23) is provided with a notch (34), and the sensor chip (60) is located on the terminal (30) more than the notch (34). The pressure sensor according to claim 1, wherein the pressure sensor is electrically connected to an end of the pressure sensor.   A portion of the terminal (30) exposed in the groove (23) is provided with a through hole (35), and the sensor chip (60) is located in the terminal (30) more than the through hole (35). The pressure sensor according to claim 1, wherein the pressure sensor is electrically connected to an end of the pressure sensor.   In the terminal (30) exposed in the groove (23), the surface of the one end (31) of the terminal (30) to which the sensor chip (60) is electrically connected is opposite to this surface. 2. The sensor chip (60) is bent so as to be positioned on a surface side, and the sensor chip (60) is electrically connected to an end side of the terminal (30) rather than the bent portion. The pressure sensor as described in any one of thru | or 7.   In the terminal (30), one end (31) of the terminal (30) exposed in the groove (23) is in close contact with the wall surface (23a) parallel to the introduction direction of the pressure medium in the groove (23). The pressure sensor according to claim 1, wherein the pressure sensor is insert-molded in the case (20).   The sealing part (70) which covers the junction part of the said sensor chip (60) and the said terminal (30) is provided in the said groove part (23), The one of Claim 1 thru | or 12 characterized by the above-mentioned. The pressure sensor according to one.   A fixing agent (71) is provided in the groove (23) to cover the joint between the sensor chip (60) and the terminal (30), and the fixing agent is provided on the fixing agent (71). The pressure sensor according to any one of claims 1 to 12, wherein a sealing agent (70) having a lower elastic modulus than (71) is provided.   The sensor chip (60) has a rectangular shape, and the long side of the rectangle is parallel to the introduction direction of the pressure medium, and the short side of the rectangle is parallel to the direction perpendicular to the introduction direction of the pressure medium. The pressure sensor according to any one of claims 1 to 14, wherein the pressure sensor is arranged in the groove (23) as described above.   A plurality of pads (68) to which the sensor chip (60) is electrically connected to the groove (23) side of one surface (64a) of the sensor chip (60) is perpendicular to the pressure medium introduction direction. The plurality of pads (68) are arranged such that adjacent pads (68) overlap in the pressure medium introduction direction. The pressure sensor as described in any one.   The one end (31) of the terminal (30) and the sensor chip (60) are electrically connected to each other through a bump (50). The described pressure sensor. A housing (10) having a pressure introduction hole (15) and a case (20) in which one end (21) is integrally assembled to the housing (10) are provided, and one end (11) of the housing (10) A pressure sensor in which a pressure medium is introduced from the provided opening (13) to the one end (21) side of the case (20) through the pressure introduction hole (15),
The case (20)
A groove (23) recessed in the introduction direction of the pressure medium from the tip surface (22) at one end (21) of the case (20);
A terminal (30) insert-molded in the case (20) such that one end (31) is exposed in the groove (23);
The surface (64a) parallel to the introduction direction of the pressure medium has a gauge portion (63) for detecting pressure on the opening (13) side of the surface (64a), and the groove portion (23) The pressure sensor has a sensor chip (60) electrically connected to one end (31) of the terminal (30) on the side (64a) opposite to the opening (13). A manufacturing method of
Preparing the case (20) in which the sensor chip (60) and the terminal (30) are insert-molded;
The other surface (64b) opposite to the one surface (64a) of the sensor chip (60) is held by a jig (81), and the case (20) and the sensor chip (60) are relatively moved. Inserting the sensor chip (60) into the groove (23),
A step of electrically connecting the sensor chip (60) to the terminal (30) after inserting the sensor chip (60) into the groove (23). Method.   In the step of inserting the sensor chip (60) into the groove (23), one surface (64a) of the sensor chip (60) and the other surface (64b) opposite to the one surface (64a) are formed on the housing (10). The method of manufacturing a pressure sensor according to claim 18, wherein the sensor chip (60) is inserted into the groove (23) so as to be separated from the groove.   In the step of electrically connecting the sensor chip (60) to the terminal (30), the one surface (64a) of the sensor chip (60) is electrically connected to one end (31) of the terminal (30). The method for manufacturing a pressure sensor according to claim 18, wherein the pressure sensor is connected.   In the step of electrically connecting the sensor chip (60) to the terminal (30), a surface (66) of the sensor chip (60) facing the bottom of the groove (23) is formed on the terminal (30). The method of manufacturing a pressure sensor according to claim 18 or 19, wherein the pressure sensor is electrically connected to the one end (31). The terminal (30) has one end (31) exposed in the groove (23) bent perpendicular to the direction of introduction of the pressure medium,
In the step of electrically connecting the sensor chip (60) to the terminal (30), a surface (66) of the sensor chip (60) facing the bottom of the groove (23) is bent vertically. The method for manufacturing a pressure sensor according to claim 21, wherein the pressure sensor is electrically connected to one end (31) of the terminal (30). In the step of preparing the case (20) in which the terminal (30) is insert-molded, a part of the terminal (30) is exposed to a portion of the terminal (30) exposed in the groove (23). Prepare a bent (33) bent bent,
In the step of electrically connecting the sensor chip (60) to the terminal (30), the sensor chip (60) is electrically connected to the end side of the terminal (30) with respect to the vent (33). The method for manufacturing a pressure sensor according to any one of claims 18 to 22, wherein: In the step of preparing the case (20) in which the terminal (30) is insert-molded, the terminal (30) is notched (34) in a portion of the terminal (30) exposed in the groove (23). Prepare what is provided,
In the step of electrically connecting the sensor chip (60) to the terminal (30), the sensor chip (60) is electrically connected to the end of the terminal (30) from the notch (34). The method of manufacturing a pressure sensor according to any one of claims 18 to 22, wherein In the step of preparing the case (20) in which the terminal (30) is insert-molded, a through hole (35) is formed as a part of the terminal (30) exposed in the groove (23) as the terminal (30). Prepare what is provided,
In the step of electrically connecting the sensor chip (60) to the terminal (30), the sensor chip (60) is electrically connected to the end of the terminal (30) from the through hole (35). The method of manufacturing a pressure sensor according to any one of claims 18 to 22, wherein In the step of preparing the case (20) in which the terminal (30) is insert-molded, the sensor chip (60) of the one end (31) of the terminal (30) is electrically used as the terminal (30). Prepare one that is bent so that the surface to be connected is located on the opposite side of this surface,
In the step of electrically connecting the sensor chip (60) to the terminal (30), the sensor chip (60) is electrically connected to the end portion side of the terminal (30) rather than the bent portion. The method for manufacturing a pressure sensor according to any one of claims 18 to 22, wherein:   In the step of preparing the case (20) in which the terminal (30) is insert-molded, one end (31) of the terminal (30) exposed in the groove (23) is the groove (23). The method for manufacturing a pressure sensor according to any one of claims 18 to 22, wherein the pressure sensor is closely attached to a wall surface (23a) parallel to the introduction direction of the pressure medium.   In the step of electrically connecting the sensor chip (60) to the terminal (30), the one end (31) of the terminal (30) and the sensor chip (60) are electrically connected via the bump (50). The method of manufacturing a pressure sensor according to claim 18, wherein the pressure sensor is connected to the pressure sensor.   In the step of preparing the case (20), when the sensor chip (60) is electrically connected to the terminal (30), the entire sensor chip (60) is stored as the case (20). 29. The method for manufacturing a pressure sensor according to claim 18, wherein a member provided with the groove portion (23) having a depth is prepared.   In the step of preparing the case (20), as the case (20), when the sensor chip (60) is electrically connected to the terminal (30), one side surface of the sensor chip (60). 29. The structure according to any one of claims 18 to 28, wherein a member provided with the groove (23) having a depth projecting from the front end surface (22) of the case (20) is prepared. The manufacturing method of the pressure sensor of description. In the step of preparing the sensor chip (60), a rectangular chip is prepared as the sensor chip (60),
In the step of electrically connecting the sensor chip (60) to the terminal (30), the long side of the rectangle is parallel to the introduction direction of the pressure medium, and the short side of the rectangle is in the introduction direction of the pressure medium. 31. The method of manufacturing a pressure sensor according to claim 18, wherein the pressure sensor is parallel to the vertical direction.

Images