JP2009216531A5 - - Google Patents

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JP2009216531A5
JP2009216531A5 JP2008060432A JP2008060432A JP2009216531A5 JP 2009216531 A5 JP2009216531 A5 JP 2009216531A5 JP 2008060432 A JP2008060432 A JP 2008060432A JP 2008060432 A JP2008060432 A JP 2008060432A JP 2009216531 A5 JP2009216531 A5 JP 2009216531A5
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light
substrate
measuring apparatus
measurement object
stage
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JP5147468B2 (en
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Claims (14)

計測対象物を移動するステージと、前記計測対象物に広帯域光を照射する光源と、分光器と、前記分光器により分光された光を検出し、検出した光を電気信号として出力する二次元撮像素子と、該出力された電気信号を演算処理し前記計測対象物の物理情報を求める演算処理部と、を有する計測装置であって、
前記二次元撮像素子の垂直転送方向、及び前記ステージの移動方向と直交する方向、及び前記分光器の入射スリットの長手方向が一致するように配置され、
前記二次元撮像素子は、垂直転送方向にビニング処理を行い、
前記演算処理部は、前記ビニング処理をされて得られた信号を用いて前記物理情報を求めることを特徴とする計測装置。 A stage for moving the measurement object, a light source for irradiating a broadband light to the measurement object, the minute and the optical unit detects the light dispersed by the spectroscope, the two outputs of the detected light as an electrical signal dimensional an imaging element, a total measuring apparatus that have a, an operation processing unit for an electric signal which is the output to the arithmetic processing obtaining physical information of the measurement object,
The vertical transfer direction of the two-dimensional imaging device, the direction orthogonal to the moving direction of the stage, and the longitudinal direction of the entrance slit of the spectrometer are arranged to coincide with each other,
The two-dimensional imaging device performs binning processing vertical transfer direction,
The arithmetic processing unit, the physical information meter measuring device you and obtains the using signal obtained by the binning process. 前記光源は、独立して照射強度を調整可能な複数の光源を有し、当該複数の光源からの光が前記計測対象物を介して前記二次元撮像素子の複数の画素群に入射するようにしたことを特徴とする請求項１に記載の計測装置。 The light source has a plurality of light sources whose irradiation intensity can be adjusted independently, so that light from the plurality of light sources is incident on a plurality of pixel groups of the two-dimensional imaging element via the measurement object. total measuring apparatus according to claim 1, characterized in that the. 前記複数の光源から光をライン状に整形して前記計測対象物に照射するバンドルファイバを更に有し、
前記バンドルファイバの出射面のライン状配列の長手方向は、前記分光器の入射スリットの長手方向と一致することを特徴とする請求項２に記載の計測装置。 Further comprising a bundle fiber for irradiating the measurement object shape the light in a line shape from the plurality of light sources,
Longitudinal direction of the line-shaped arrangement of the emitting surface of the bundle fiber, total measuring apparatus according to claim 2, characterized in that coincides with the longitudinal direction of the entrance slit of the spectrometer. 前記複数の光源の光を計測対象物に照射し、前記画素群ごとの電気信号の強度を計測し、計測された強度に基づいて複数の光源の強度を調整した後に、再度、前記計測対象物の計測を行うことを特徴とする請求項２に記載の計測装置。 The light of the plurality of light sources irradiating the measurement object, the intensity of the electric signal of each of the pixel groups is measured, after adjusting the intensity of the plurality of light sources based on the measured intensity, again, the measurement object total measuring apparatus according to claim 2, wherein the performing of measurements. 前記二次元撮像素子のフレーム単位で前記ステージをステップ駆動させる制御部を更に有し、
前記分光器は、前記計測対象物の１ラインの領域をそれぞれ一度に分光し、
前記計測装置は、前記分光器によって分光された光の電気信号を一次元位置情報と波長情報として取り込み、前記一次元位置情報と前記波長情報から二次元位置情報と波長情報を得ることを特徴とする請求項１に記載の計測装置。 A control unit for step-driving the stage in frame units of the two-dimensional image sensor;
The spectroscope separates each region of one line of the measurement object at a time,
The measuring device takes in an electrical signal of light separated by the spectrometer as one-dimensional position information and wavelength information, and obtains two-dimensional position information and wavelength information from the one-dimensional position information and the wavelength information. total measuring apparatus according to claim 1. 前記ステージを等速走査駆動させる制御部を更に有し、前記二次元撮像素子の１フレーム間に移動する範囲の１ライン上について積算される前記電気信号を取り込むことを特徴とする請求項１に記載の計測装置。 2. The electric signal which is further integrated with respect to one line of the range which moves between 1 frame of the said two-dimensional image pick-up element is further included in the control part which drives the said stage at constant speed, The electric signal is taken in. total measuring device according. 前記計測装置は、計測対象物としての基板の表面形状を計測する表面形状計測装置であり、
前記計測装置は、
前記光源からの広帯域光を計測光と参照光とに分割し、前記計測光を前記基板の表面に入射させ、前記参照光を参照ミラーに入射させる分割手段と、
前記基板の表面で反射した計測光と前記参照ミラーで反射した参照光とを合成する合波手段と、
を更に有し、
前記分光器は、合成された前記計測光と前記参照光の１ライン上の領域を分光することを特徴とする請求項１に記載の計測装置。 Before SL meter measuring device is a surface shape measuring apparatus for measuring the surface shape of the substrate as the measurement object,
Before Symbol total of measuring apparatus,
Splitting means for dividing broadband light from the light source into measurement light and reference light, causing the measurement light to be incident on the surface of the substrate, and causing the reference light to be incident on a reference mirror;
Combining means for combining the measurement light reflected by the surface of the substrate and the reference light reflected by the reference mirror;
Further comprising
The spectrometer, total measuring apparatus according to claim 1, characterized in that the partial light areas on one line of the reference light and combined the measurement light. 前記光源は、独立して照射強度を調整可能な複数の光源を有し、
前記計測装置は、
前記複数の光源からの光を一つのライン状にまとめて前記分割手段へ導くバンドルファイバと、
前記バンドルファイバの出射面と前記基板が光学的に共役となるように配置された結像光学系と、
を更に有し、
前記ファイバの出射面のライン状配列の長手方向は、前記分光器の入射スリットの長手方向と一致することを特徴とする請求項７に記載の計測装置。 The light source has a plurality of light sources capable of independently adjusting the irradiation intensity,
The measuring device is
A bundle fiber that guides the light from the plurality of light sources to the dividing means in a single line;
An imaging optical system arranged so that the exit surface of the bundle fiber and the substrate are optically conjugate,
Further comprising
Longitudinal direction of the line-shaped arrangement of the emitting surface of the fiber, total measuring apparatus according to claim 7, characterized in that coincides with the longitudinal direction of the entrance slit of the spectrometer. 前記ビニング処理を行う前記二次元撮像素子の画素数Ｎは、Vscanを前記ステージの走査方向の走査速度、Pscanを前記ステージの走査方向の計測ピッチ、Fを前記二次元撮像素子のフレームレートとすると、次の式で決定される自然数であることを特徴とする請求項６に記載の計測装置。
Frame rate of the number of pixels N of the two-dimensional imaging device for performing binning processing, the scanning direction of the scanning speed of the stage V scan, the scanning direction of the measuring pitch of the stage P scan, said F two-dimensional imaging element When a total measuring apparatus according to claim 6, characterized in that a natural number which is determined by the following equation.
前記ビニング処理を行う前記二次元撮像素子の画素数Ｎは、M1を前記二次元撮像素子の垂直転送方向の画素数、Pvを入射スリットの長手方向に必要な画素分解能とすると、次の式で決定される自然数であることを特徴とする請求項６に記載の計測装置。
The number N of pixels of the two-dimensional image sensor that performs the binning process is expressed by the following equation, where M 1 is the number of pixels in the vertical transfer direction of the two-dimensional image sensor and Pv is the pixel resolution required in the longitudinal direction of the entrance slit. total measuring apparatus according to claim 6, characterized in that a natural number in determined.
前記ビニング処理を行う方向と、前記基板の表面に垂直な方向とを一致させることを特徴とする請求項１０に記載の計測装置。 Total measuring apparatus according to claim 10, wherein the direction for performing the binning processing, to match the direction perpendicular to the surface of the substrate. 前記演算処理部が、前記電気信号をフーリエ変換することにより、前記基板の高さ情報を求めることを特徴とする請求項７に記載の計測装置。 The arithmetic processing unit, by Fourier transforming the electrical signal, a total measuring apparatus according to claim 7, wherein the determination of the height information of the substrate. 光源からの光を利用して基板を露光する露光装置であって、
前記基板を支持する基板ステージと、
原版のパターンの像を前記基板に投影する投影光学系と、
前記基板の表面位置を検出する請求項７に記載の計測装置と、
前記表面形状計測装置の計測結果に基づいて前記投影光学系の結像位置に前記基板の表面位置を合わせるように前記基板ステージを駆動する制御部と、
を有することを特徴とする露光装置。 An exposure apparatus that exposes a board by using light from a light source,
And the substrate stage that Soo supporting the substrate,
A projection optical system for projecting an image of the pattern of the original plate onto the substrate,
A total measuring apparatus according to claim 7 to detect the surface position of the substrate,
A controller that drives the substrate stage so as to align the surface position of the substrate with the imaging position of the projection optical system based on the measurement result of the surface shape measuring device;
An exposure apparatus comprising: 請求項１３に記載の露光装置によって基板を露光するステップと、
前記露光された基板を現像するステップと、
を有するデバイスの製造方法。 Exposing the substrate with the exposure apparatus according to claim 13;
Developing the exposed substrate;
A method of manufacturing a device having
JP2008060432A 2008-03-11 2008-03-11 Measuring apparatus and exposure apparatus Active JP5147468B2 (en)

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JP5787483B2 (en) 2010-01-16 2015-09-30 キヤノン株式会社 Measuring apparatus and exposure apparatus
KR20160021301A (en) 2010-11-12 2016-02-24 에베 그룹 에. 탈너 게엠베하 Measuring device and method for measuring layer thicknesses and defects in a wafer stcak
JP6196119B2 (en) * 2013-10-11 2017-09-13 大塚電子株式会社 Shape measuring apparatus and shape measuring method
JP2015166751A (en) * 2015-07-03 2015-09-24 エーファウ・グループ・エー・タルナー・ゲーエムベーハー Measuring device and method for measuring layer thicknesses and defects in wafer stack
WO2021172274A1 (en) * 2020-02-28 2021-09-02 キヤノン株式会社 Identification device

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