JP2009205721A - Electron beam lithography system, manufacturing method of master, and manufacturing method of information recording medium - Google Patents

Electron beam lithography system, manufacturing method of master, and manufacturing method of information recording medium Download PDF

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JP2009205721A
JP2009205721A JP2008045347A JP2008045347A JP2009205721A JP 2009205721 A JP2009205721 A JP 2009205721A JP 2008045347 A JP2008045347 A JP 2008045347A JP 2008045347 A JP2008045347 A JP 2008045347A JP 2009205721 A JP2009205721 A JP 2009205721A
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electron beam
track
pattern
concentric
region
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Japanese (ja)
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Yasuhide Fujiwara
Tsuyoshi Hashiguchi
Terumi Kamata
Toshio Watabe
強 橋口
寿夫 渡部
康秀 藤原
照己 鎌田
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Ricoh Co Ltd
株式会社リコー
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Abstract

A pattern consisting of a plurality of micropatterns having a first length and a pattern consisting of a plurality of micropatterns having a second length are mixed in a region in a sector on a substrate surface along a track. Form.
When a pattern is drawn along a concentric track on a substrate, an electron beam is blocked using a first clock signal generated based on a first base length in a first region in a sector. In the second region in the sector, the electron beam is blanked using the second clock signal generated based on the second reference length. As a result, a pattern composed of an arc-shaped micropattern having a first length along the concentric track is accurately formed in the first area in the sector, and the second length is formed in the second area. It becomes possible to form a pattern composed of arc-shaped minute patterns with high accuracy.
[Selection] Figure 5

Description

  The present invention relates to an electron beam drawing apparatus, a master disc manufacturing method, and an information recording medium manufacturing method, and more specifically, an electron beam drawing apparatus that draws a pattern on a substrate using an electron beam, and the electron beam drawing apparatus. The present invention relates to a master manufacturing method for manufacturing a master and an information recording medium manufacturing method for manufacturing an information recording medium using the master.

  The amount of data handled by information devices and the like is rapidly increasing against the background of the increasing speed and speed of the Internet, the expansion of various services such as moving picture distribution, and the widespread use of high-definition image receiving / playback devices. In recent years, a large-capacity optical disk or a large-capacity hard disk drive has been actively developed in order to store and use these increasing amounts of data. In particular, recording media such as hard disks are used in portable devices such as mobile phones, portable music recording and playback devices, and video cameras. Track media and patterned media have been introduced.

  As a method for drawing a pattern on a substrate or the like as a master disk of the recording medium described above, for example, a drawing method using an electron beam drawing apparatus having an X-θ stage described in Patent Document 1 can be considered. In a drawing method using this type of electron beam drawing apparatus, an arbitrary pattern can be drawn and formed on a substrate along a spiral or concentric track.

  In general, the shape of a dot pattern or a line pattern drawn on a substrate depends on an electron beam dose (C (Coulomb) / cm). For this reason, it is best to draw a pattern on the substrate while keeping the electron beam irradiation current constant and moving the electron beam spot on the substrate surface along a predetermined track at a constant speed. Conceivable.

  Therefore, in a method (CLV driving method) for drawing a pattern while moving the incident position of an electron beam on the substrate at a constant speed using the electron beam drawing apparatus described in Patent Document 1 as an example, The region is divided into a plurality of minute regions around the center of rotation of the substrate, and a plurality of minute patterns are drawn on the tracks included in the minute region, thereby finally combining the plurality of minute patterns on the substrate surface. A simple pattern.

JP 2003-317327 A

  Discrete track media related to recording media such as hard disks or recording media such as patterned media usually have a servo area in which arc-shaped identical central angle pattern groups having the same central angle are formed, and a length along the track. In recent years, a method of forming the same length pattern group in the servo area has been proposed in order to further increase the recording capacity. Has been proposed.

  The present invention has been made under such circumstances, and a first object of the present invention is to form a servo area and a data area of each sector formed on the substrate in an arc shape having the same length along the track. An object of the present invention is to provide an electron beam drawing apparatus capable of forming a pattern group with high accuracy.

  A second object of the present invention is to manufacture a master for forming arc-shaped pattern groups having equal lengths along a track in a servo area and a data area of a sector formed on a recording medium. It is to provide a master manufacturing method.

  A third object of the present invention is to provide an information recording medium for manufacturing an information recording medium in which arc-shaped pattern groups having equal lengths along a track are formed in the servo area and data area of each sector. It is to provide a medium manufacturing method.

According to a first aspect of the present invention, an area of a substrate surface in which a plurality of sectors are defined around a predetermined reference point using an electron beam along an equi-pitch concentric track centered on the reference point. An electron beam lithography apparatus that forms a plurality of patterns on the concentric tracks by exposure, wherein the irradiation apparatus irradiates the electron beam toward an irradiation position on the substrate surface; A moving device that relatively moves the substrate to move the irradiation position at a constant speed along a predetermined equal pitch spiral track; deflects the electron beam irradiated toward the irradiation position on the spiral track; A deflector for injecting the electron beam onto the predetermined concentric track; a first length pattern is formed along the concentric track in a first region of the plurality of sectors on the substrate; A blanking device for blanking the electron beam so that a pattern having a second length is formed along the concentric track in a second area other than the first area of the sector. In the ranking device, N 1 is the number of first unit tracks when the concentric tracks are divided for each of the first lengths while the irradiation position moves in the first region. The distance between the position on the spiral track corresponding to the exposure start position on the concentric track and the reference point is R 1 , the pitch between the adjacent concentric tracks is P, and the relative movement of the irradiation position with respect to the spiral track Assuming that the speed is V, a value calculated using the formula 2π · R 1 / (V · N 1 ) ± π · P / (V · N 1 2 ) is an initial value, and the formula ± 2π · P / (V · N 1 2) is calculated using the Based on the first clock signal determined values as increasing or decreasing value, an electron beam drawing apparatus, characterized in that for blanking the electron beam.

  According to this, the substrate is relatively moved along the spiral track with respect to the irradiation position of the electron beam, and the electron beam irradiated toward the irradiation position is deflected by the deflecting device, thereby being along the concentric track with respect to the substrate. Exposure is performed. In the first area in the sector, the electron beam is blanked based on the first clock signal generated based on the first reference length. For this reason, it is possible to accurately form a pattern formed of an arc-shaped minute pattern having a track length of the first length along the concentric track in the first region in the sector. Then, in the second area in the sector, the electron beam is blanked based on the second clock signal generated based on the second reference length, so that the concentric track is formed in the second area in the sector. Accordingly, it is possible to accurately form a pattern composed of an arc-shaped minute pattern whose length in the track direction is the second length.

  According to a second aspect of the present invention, there is provided an information recording medium master comprising: a step of drawing a pattern on a substrate by the electron beam drawing apparatus of the present invention; and a step of developing the pattern formed on the substrate. It is a manufacturing method.

  According to this, the master disc has a pattern composed of a plurality of minute patterns whose length along the track is the first length in the area corresponding to the sector of the information recording medium, and the length in the track direction is the second. Are formed in a mixed state with a pattern composed of a plurality of minute patterns having a length of. Then, by using this master, the pattern in the sector of the information recording medium has a pattern composed of a plurality of minute patterns whose length along the track is the first length, and the length in the track direction is the second length. It is possible to form a pattern composed of a plurality of micropatterns having a length.

  From a third viewpoint, the present invention is an information recording medium manufacturing method for manufacturing an information recording medium by transferring a pattern to the recording medium using the master disk of the present invention.

  According to this, in the area in the sector of the information recording medium, a pattern composed of a plurality of minute patterns whose length along the track is the first length, and a plurality of patterns whose length in the track direction is the second length. Are formed in a mixed state.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows a schematic configuration of an electron beam drawing apparatus 100 according to the present embodiment. The electron beam drawing apparatus 100 draws a fine pattern on the surface of the substrate W by irradiating the surface of the substrate W with an electron beam in an environment where the degree of vacuum is about 10 −4 Pa, for example. An electron beam drawing apparatus. The electron beam drawing apparatus 100 according to the present embodiment moves the substrate W relative to the irradiation unit 10 described later to move the irradiation position of the irradiation unit 10 along the spiral track STr shown in FIG. by deflecting the electron beam towards the irradiation position from the rotation center o a common center and a plurality of concentric tracks CTr 1 exposure on ~CTr n (drawing) starting position SP 1 to SP n of the substrate W, concentric circular tracks drawing a pattern along the CTr 1 ~CTr n. Further, in the present embodiment, sectors S1 to S4 having a central angle θs are defined in a region centered on the rotation center o of the substrate W as shown in FIG. Has been. Each of the sectors S1 to S4 includes a sectoral boundary, a first area AL1 having a substantially rectangular shape defined by a dotted line separated by a distance L1 from the boundary, and a second area AL2 other than that.

  As shown in FIG. 1, the electron beam drawing apparatus 100 includes an irradiation unit 10 that irradiates a substrate W with an electron beam, a rotary table unit 30 that includes a rotary table 31 on which the substrate W is placed, and a rotary table unit 30. A rectangular parallelepiped vacuum chamber 40, a pulse signal generation device 21, a format signal generation device 22, a deflection signal generation device 23, a rotation drive control device 25, a feed drive control device 26, and the like. It has a control system and a controller 20 that controls the above-mentioned units in an integrated manner.

  The rotary table unit 30 is disposed on the bottom wall surface inside the vacuum chamber 40. The rotary table unit 30 supports a rotary table 31 on which the substrate W is placed, a rotary mechanism 32 that rotates the rotary table 31 at a predetermined rotational speed around a vertical axis, and a rotary mechanism 32 that is movable in the X-axis direction. A moving stage 34 and a slide unit 33 for driving the moving stage 34 in the X-axis direction with a predetermined stroke are provided.

  The rotary table 31 is a circular plate-like member, and is held by a rotation mechanism 32 so as to be rotatable around a vertical axis.

  The rotation mechanism 32 rotates the rotation table 31 at a predetermined rotation number based on a control signal supplied from the rotation drive control device 25.

  The moving stage 34 supports the rotating mechanism 32 and is held by a slide unit 33 so as to be movable in the X-axis direction.

  The slide unit 33 moves the moving stage 34 in the X axis direction at a predetermined speed based on a control signal supplied from the feed drive control device 26.

  Further, in the rotary table unit 30 configured as described above, the rotation angle of the rotary table 31 and the position of the moving stage 34 are detected by the rotation angle detector 37 and the position detector 38, respectively, and the rotation angle detector 37 is detected. The position detector 38 outputs a pulse signal corresponding to the rotation angle of the rotary table 31 and the position of the moving stage 34.

  The irradiation unit 10 includes a casing 11 whose longitudinal direction is the Z-axis direction, and an electron gun 12, a magnetic lens 13, a blanking electrode 14, and an aperture member 15 that are sequentially arranged from the upper side to the lower side of the casing 11. , A deflection electrode 16 and an objective lens 17.

  The casing 11 is a cylindrical casing that is open at the bottom, and is fitted into an opening formed on the upper surface of the vacuum chamber 40 without any gap from above. And the part located in the inside of the vacuum chamber 40 becomes a taper shape in which the diameter becomes small toward -Z direction.

  The electron gun 12 is disposed inside the casing 11. The electron gun 12 is a thermal field emission type electron gun that emits electrons extracted from the cathode by heat and an electric field, and emits, for example, an electron beam having a diameter of about 20 to 50 nm downward (−Z direction).

  The magnetic field lens 13 is an annular lens disposed below the electron gun 12, and applies power in a focusing direction to an electron beam emitted downward from the electron gun 12.

  The blanking electrode 14 has a pair of rectangular plate-like electrodes arranged so as to face each other at a predetermined interval in the X-axis direction. The blanking electrode 14 receives a blanker control signal Bsig supplied from the format signal generator 22. Accordingly, the electron beam that has passed through the magnetic lens 13 is deflected in the + X direction as indicated by a dotted line in the figure.

  The aperture member 15 is a plate-like member provided with an opening through which an electron beam passes in the center. The aperture member 15 is arranged so that the opening is located near the point where the electron beam that has passed through the blanking electrode 14 converges.

  The deflection electrode 16 is disposed below the aperture member 15. The deflection electrode 16 has a pair of electrodes arranged so as to face each other in the X-axis direction and a pair of electrodes arranged so as to face each other in the Y-axis direction, and generates a deflection signal. In response to a deflection control signal Dsig supplied from the device 23, the electron beam that has passed through the aperture member 15 is deflected in the X-axis direction or the Y-axis direction.

  The objective lens 17 is disposed below the deflection electrode 16 and converges the electron beam that has passed through the deflection electrode 16 onto the surface of the substrate W placed on the rotary table 31.

  In the irradiation unit 10 configured as described above, the electron beam emitted from the electron gun 12 is focused by passing through the magnetic lens 13 and is near the opening (hereinafter referred to as a crossover point) provided in the aperture member 15. ) Is once crossed. Next, the shape of the electron beam that has passed through the crossover point is shaped by passing through the aperture member 15 while diverging. Then, the objective lens 17 converges to a predetermined irradiation position on the surface of the substrate W placed on the rotary table 31.

  Hereinafter, for convenience of explanation, the irradiation position is a position on the substrate W on which an electron beam that is not deflected by the deflection electrode 16 is incident, and refers to a position on the axis of the irradiation unit 10 including the objective lens 17. To do. The position where the electron beam on the substrate W actually enters is referred to as an incident position. In the present embodiment, the relative position between the irradiation unit 10 and the rotary table 31 is adjusted so that the irradiation position described above is positioned on a straight line that passes through the rotation center of the substrate W and is parallel to the X axis.

  In the irradiation unit 10, the blanking electrode 14 is controlled based on the blanker control signal Bsig, and the electron beam is deflected in the X-axis direction, whereby the electron beam is shielded by the aperture member 15, and the electron beam with respect to the substrate W Blanking is being performed. Further, the deflection electrode 16 is controlled based on the deflection control signal Dsig, and the electron beam is deflected in the X-axis direction or the Y-axis direction, so that the irradiation position of the electron beam on the substrate W is adjusted. Yes.

  FIG. 4 is a block diagram of the pulse signal generator 21. As shown in FIG. 4, the pulse signal generation device 21 has a reference clock generation device 21a, a formatter drive clock generation device 21b, a deflection clock generation device 21c, a rotation command pulse generation device 21d, and a feed command pulse generation device 21e. is doing.

  The reference clock generation device 21a generates and outputs a reference clock signal CLK having a predetermined frequency that serves as a reference when controlling each device constituting the electron beam drawing apparatus 100. In the present embodiment, the reference clock signal CLK is a signal whose value becomes a high level every period T as shown in FIG. 5 as an example.

  The deflection clock generation device 21c, the rotation command pulse generation device 21d, and the feed command pulse generation device 21e are respectively based on the reference clock signal CLK generated by the reference clock generation device 21a, and the deflection clock signal Dclk and the rotation command. A pulse signal Tclk and a feed pulse signal Sclk are generated and output, respectively.

  In this embodiment, the rotation drive control device 25 compares the rotation command pulse signal Tclk from the pulse signal generation device 21 with the pulse signal from the rotation angle detector 37, and according to the comparison result. By driving the rotation mechanism 32, the substrate W is rotated at a predetermined rotation speed, and the feed drive control device 26 receives the feed pulse signal Sclk from the pulse signal generation device 21 and the pulse from the position detector 38. By comparing the signal and driving the slide unit 33 according to the comparison result, the substrate W is moved in the X-axis direction at a predetermined speed. In the electron beam drawing apparatus 100, the rotation drive control device 25 and the feed drive control device 26 cooperate in this way, so that the irradiation position of the irradiation unit 10 is a substrate along the spiral track STr shown in FIG. It moves on W at a constant speed.

The deflection signal generator 23 generates a deflection control signal Dsig in synchronization with the deflection clock signal Dclk from the pulse signal generator 21 and supplies the deflection control signal Dsig to the deflection electrode 16. FIG. 6 shows a deflection control signal Dsig generated by the deflection signal generator 23. As shown in FIG. 6, the deflection control signal Dsig is a sawtooth signal that becomes zero each time the total rotation angle θ tot of the substrate W increases by 2π. By supplying this signal to the deflection electrode 16, the incident position of the electron beam moves in the X-axis direction at a speed equal to the moving speed in the X-axis direction with respect to the substrate W during one rotation of the substrate W, and blanking. is not incident position of the electron beam is positioned sequentially on concentric tracks CTr n. Thus, the incident position of the electron beam, the writing start position SP n of the respective concentric track CTr n, along respective concentric tracks CTr n, encircling the center o.

The formatter drive clock generation device 21 b generates a formatter drive clock signal Fclk based on the reference clock signal CLK under the instruction of the controller 20 and supplies it to the format signal generation device 22. In the present embodiment, as shown in FIG. 7 as an example, among the areas in the sector central angle [theta] s, the length along the concentric tracks CTr n in the first region AL1 minute pattern of the first reference length ΔL1 the draw a pattern to minimize component, the second region AL2, draws a pattern length along the concentric circular tracks CTr n is a minimum component of the fine pattern of the second reference length [Delta] L2. A procedure for generating the formatter drive clock signal Fclk will be described below.

While feeding the X-axis direction together with the rotating the substrate W, in the case of performing exposure by moving at a constant speed the irradiation position of the electron beam along the spiral track from the exposure start position SP 1 in FIG. 2, the exposure start position the length L of the spiral track STr between the SP 1 to the position BP 'on the spiral track is represented by the following formula (1). However, R 0 is the distance from the rotation center o of the substrate W to the exposure start position SP 1 , and θ tot is the total rotation angle of the substrate W until the irradiation position moves from the exposure start position SP 1 to the position BP ′. Yes, P is the pitch of the spiral track STr. Further, the sign of the two items in the expression (1) is + when the irradiation position is moved from the inside to the outside of the substrate W along the spiral track STr, and from the outside to the inside of the substrate W along the spiral track STr. It is-when moving the irradiation position.

L = R 0 · (θ tot ) ± P · (θ tot ) 2 / (4 · π) (1)

When the speed of the upper spiral track irradiation position of the electron beam moves to is V, the time T the irradiation position of the electron beam is moved from the reference position SP 1 to the position BP 'on the spiral track STr following formula (2) Indicated by

T = L / V
= R 0 · (θ tot ) / V ± P · (θ tot ) 2 / (4 · π · V) (2)

An arcuate pattern of central angle [Delta] [theta], the case of forming a region in a sector along a concentric track CTr n is, for example, the incident position of the electron beam along either concentric tracks CTr n in FIG While moving, it is necessary to blank the electron beam at a predetermined timing.

Concentric tracks CTr n, when the number of time obtained by dividing an arc the center angle (reference angle) [Delta] [theta] and N, an angle a reference angle [Delta] [theta] and an integer multiple (integer combination angle) .theta.k is represented by the following formula (3) . Then, the following equation (4) can be derived from the equations (2) and (3). Note that k is an integer consecutive with 0, 1, 2,.

θk = Δθ · k = 2π · k / N (3)
T · k = 2π · R 0 · k / (V · N) ± π · P · k 2 / (V · N 2 ) (4)

  From the above equation (4), the time interval (cycle) at which the unit pattern having the center angle as the reference angle Δθ is drawn is represented by the following equation (5).

Δt (k) = t (k + 1) −t (k)
= 2π · R 0 / (V · N) ± π · P · (2k + 1) / (V · N 2 )
... (5)

The formula (5), while moving the irradiation position along the spiral track STr by deflecting the electron beam, the period for forming the unit pattern center angle along concentric tracks CTr n is a reference angle Δθ is The initial value is given by the following equation (6), and the increase / decrease value is given by the following equation (7).

2π · R 0 / (V · N) ± π · P / (V · N 2 ) (6)
± 2π · P · (V · N 2 ) (7)

Meanwhile, each arcuate micropattern length to be formed is ΔL along the concentric circular tracks CTr n, but the central angle for each track is different, in a fine pattern on the same track with each other the central angle Are the same. Therefore, the N of the formula (6) and (7), by substituting the number N L when the length of the concentric tracks CTr n is divided into a circular arc (unit tracks) of [Delta] L, the area within a sector the length along the concentric circular tracks CTr n it is possible to calculate the initial value and decrement value of the clock signal for forming a unit pattern of [Delta] L.

Formatter driving clock generation apparatus 21b of the electron-beam exposure apparatus 100, along a concentric track CTr n in the first region AL1 sector, a clock signal for forming a unit pattern of length .DELTA.L1 (first reference length) L1clk is generated and output. Specifically, a clock signal L1clk having an initial value given by the following equation (8) and an increase / decrease value given by the following equation (9) is generated, and this clock signal L1clk is output to the format signal generating device 22. Incidentally, N L1 is the number of when the concentric circular tracks CTr n length obtained by dividing an arc (first unit track) of .DELTA.L1, R 1 is exposure starting position on concentric tracks CTr n of the first region AL1 Is the distance between the position on the spiral track corresponding to (irradiation position on the spiral track STr) and the rotation center o of the substrate W.

2π · R 1 / (V · N L1 ) ± π · P / (V · N L1 2 ) (8)
± 2π · P · (V · N L1 2 ) (9)

As shown in FIG. 5, the clock signal L1clk is a signal that becomes a high level in a cycle defined by the above equations (8) and (9). This clock signal L1clk may constitute a drawing time TL1n when drawing a pattern length along the concentric circular tracks CTr n as can be seen by reference to FIGS. 5 and 7 is the first reference length ΔL1 as a unit Is done.

Next, the formatter driving clock generator 21b, when drawing on the first region AL1 ends, along a concentric track CTr n in the second region AL2 sectors, the unit of length [Delta] L2 (second reference length) A clock signal L2clk for forming a pattern is generated and output. The determination at the end of drawing in the first area AL1 is based on the fact that the number of clocks of the reference clock signal CLK is counted from the start of drawing in the first area AL1, and the count result has become a preset value. Done.

Specifically, a clock signal L2clk having an initial value given by the following equation (10) and an increase / decrease value given by the following equation (11) is generated, and this clock signal L2clk is output to the format signal generating device 22. Incidentally, N L2 is the number of when the concentric circular tracks CTr n length obtained by dividing the circular arc (second unit track) of [Delta] L2, R 2 is exposure starting position on concentric tracks CTr n of the second region AL2 Is the distance between the position on the spiral track corresponding to (irradiation position on the spiral track STr) and the rotation center o of the substrate W.

2π · R 2 / (V · N L2 ) ± π · P / (V · N L2 2 ) (10)
± 2π · P · (V · N L2 2 ) (11)

As shown in FIG. 5, the clock signal L2clk is a signal that becomes a high level in a cycle defined by the above equations (10) and (11). This clock signal L2clk may constitute a drawing time TL2m when drawing a pattern length along the concentric circular tracks CTr n as can be seen by reference to FIGS. 5 and 7 is the second reference length ΔL2 as a unit Is done.

  Next, when the drawing based on the clock signal L2clk to the second area is completed, the formatter drive clock generator 21b continues the blanking of the electron beam while the irradiation position moves to the end of the second area. The clock signal SEclk is generated and output to the format signal generator 22. The determination at the end of drawing based on the clock signal L2clk is based on the fact that the number of clocks of the reference clock signal CLK is counted from the start of drawing in the second area AL2, and the counting result becomes a preset value. Done.

  The purpose of this clock signal to generate SEclk is, for example, as shown in FIG. 8, when a unit pattern having a second reference length ΔL2 along the track is formed in the second area AL2, the second area This is because the area SA whose length in the track direction is smaller than the second reference length ΔL2 needs to be a non-exposed area in AL2. In addition, when it is desired to adjust the number of minute patterns formed in the second area AL2, it is necessary to make the area SA not exposed at the end of the second area AL2. Note that NL1 and NL2 in FIG. 8 represent natural numbers in the present embodiment, and for NL2, the second area AL2 has a fan shape, and therefore increases from the inner concentric track to the outer concentric track. .

Concentric tracks CTr n, when the number of time obtained by dividing the circular arc (third unit track) corresponding to the concentric circular tracks CTr n included in the area SA and N 3, the time TSE required for the irradiation position crosses the area SA It is given by R 3 is the distance between the irradiation position and the center of rotation of the substrate W when blanking by the clock signal L2clk is completed.

TSE = 2π · R 3 / (V · N 3 ) ± π · P / (V · N 3 2 ) (12)

  In the formatter drive clock generation device 21b, as can be understood from FIG. 5, the clock signal that becomes high level after the time TSE defined by the above equation (12) has elapsed after the blanking by the clock signal L2clk is completed. SEclk is generated and output to the format signal generator 22.

  That is, in the formatter drive clock generation device 21b, as described above, the clock signal L1clk is generated while the irradiation position moves in the first region of the sector, and the clock signal L2clk is generated while the irradiation position moves in the second region. And then the clock signal SEclk is generated. As a result, a formatter drive clock signal Fclk as shown in FIG. 5 is generated as a result, and the formatter drive clock signal Fclk is output to the format signal generator 22.

The format signal generator 22 generates a blanker control signal Bsig including drawing information from the controller 20 in synchronization with the rise of the formatter drive clock signal Fclk, and supplies this blanker control signal Bsig to the blanking electrode 14. Thus, among the areas in the sector, the first region AL1, pattern length along the concentric circular tracks CTr n is a minimum component of the fine pattern of the first reference length ΔL1 is drawn, the second region AL2 In addition, a pattern having a minute pattern whose length along the concentric track CTrn is the second reference length ΔL2 as a minimum component is drawn. Then, blanking of the electron beam is performed until time TSE elapses after drawing based on the clock signal L2clk is completed.

  As an example, the controller 20 is a control computer including a CPU, a memory for storing programs and parameters for controlling the irradiation unit 10 and the rotary table unit 30. For example, based on a command from a user, the controller 20 can perform the following operations on the formatter drive clock generation device 21b, the deflection clock generation device 21c, the rotation command pulse generation device 21d, and the feed command pulse generation device 21e. A command or the like is supplied to draw a pattern on the substrate W. Further, drawing information and the like are supplied to the format signal generator 22.

As described above, in the electron beam lithography apparatus 100 according to the present embodiment, the substrate W is relatively moved along the spiral track STr with respect to the irradiation position of the electron beam, and the electron beam irradiated toward the irradiation position is by being deflected by the deflection electrodes 16, the exposure along a concentric track CTr n with respect to the substrate W is performed. At that time, in the first region AL1 in the sector, the electron beam based on the clock signal L1clk generated based on the first reference length ΔL1 is blanking, in the first region AL1, the concentric circular tracks CTr n A pattern consisting of an arc-shaped minute pattern having a length along the first reference length ΔL1 is accurately formed. In the second region AL2 in the sector, the electron beam based on the clock signal L2clk generated based on the second reference length ΔL2 are blanking, the second region AL2, length along a concentric track CTr n is However, a pattern composed of an arc-shaped minute pattern having the second reference length ΔL2 is accurately formed.

  Further, the formatter drive clock generation device 21b that generates the formatter drive clock signal Fclk may be configured as shown in FIG. 9 or FIG.

  The formatter drive clock generator 21b shown in FIG. 9 includes a first clock generator 52 that generates a clock signal L1clk, a second clock generator 53 that generates a clock signal L2clk, and a sector length adjustment clock generator that generates a clock signal SEclk. 54, a selection unit 56 that selects one of the input signals L1clk, L2clk, and SEclk based on the selection information SEL, and outputs the selected signal as a formatter drive clock signal Fclk, and a first clock generator The data TA-Data, TL-Data, and TSE-Data for generating each clock signal are supplied to the unit 52, the second clock generation unit 53, and the sector length adjustment clock generation unit 54, and to the selection unit 56 Formatter drive clock for supplying selection information SEL It constituted by forming the control unit 51.

  The formatter drive clock generation control unit 51 is supplied from the controller 20, and generates a formatter drive clock signal Fclk corresponding to the exposure pattern to be exposed. The clock cycle corresponds to the data Cnt-Data and the clock signals L1clk, L2clk, SEclk. Data storage unit for holding data related to the clock (hereinafter referred to as clock cycle data), clock number data, data for controlling the output order of each clock, and a counting means for counting the number of output clocks of each clock signal Yes. Then, according to the number of area formation clocks prepared in advance for each area to be formed, the clock cycle data is updated for each of the clock generation units 52 to 54 and the output control of the clock switching control signal SEL is performed. As a result, the formatter drive clock signal Fclk is generated as a continuous formatter drive clock that does not include a cyclic error.

  Further, the formatter drive clock generation device 21b shown in FIG. 10 generates a clock that is generated based on the reference clock signal CLK based on the set cycle data and that is generated and output after the set cycle. A periodic clock generator 63, a periodic data selector 62 for switching the periodic data T-Data given to the periodic clock generator 63 according to a region to be formed, and a formatter drive clock generation controller 61. .

  The formatter drive clock generation controller 61 is supplied from the controller 20 and generates a formatter drive clock signal Fclk corresponding to the exposure pattern to be exposed. The clock cycle corresponds to the data Cnt-Data and the clock signals L1clk, L2clk, SEclk. Data storage unit for holding data related to the clock (hereinafter referred to as clock cycle data), clock number data, data for controlling the output order of each clock, and a counting means for counting the number of output clocks of each clock signal Yes. Then, according to the number of area formation clocks prepared in advance for each area to be formed, the clock cycle data is updated for each of the clock generation units 52 to 54 and the output control of the clock switching control signal SEL is performed. As a result, the formatter drive clock signal Fclk is generated as a continuous formatter drive clock that does not include a cyclic error.

  In the present embodiment, the case where a pattern is drawn along a concentric track has been described. However, the present invention is not limited to this, and the present invention is also suitable when a pattern is drawn along a spiral track.

  The present invention is also suitable for manufacturing discrete track media and patterned media that are being considered for use in hard disk media.

  FIGS. 11 and 12 are schematic diagrams of exposure patterns of discrete track media and patterned media formed by exposure using the electron beam drawing apparatus according to the present invention. In each of the media shown in FIGS. 11 and 12, a servo area including a track address, a sector address, a tracking burst pattern, and the like is formed in the first area, and a continuous groove or a groove is formed in the second area. A data area composed of dot patterns arranged at an equal pitch in the track direction is formed over the entire exposure area. Since the servo area pattern needs to form a continuous pattern across the track, pattern exposure is performed with a track pitch equivalent to the exposure beam diameter, and when forming the data area, the track that does not expose the pattern is inserted. The entire exposure is performed while performing.

  In addition, a master for manufacturing an information recording medium can be manufactured by drawing a pattern on a substrate using the electron beam drawing apparatus according to the present invention and then developing the substrate. By using this master, an area in the sector of the information recording medium can be divided into a pattern composed of a plurality of minute patterns of the first length and a plurality of minute patterns of the second length along the track. Are formed in a mixed pattern.

  Also, by using the electron beam drawing apparatus of the present invention, a master disc on which an information recording media pattern is drawn by a single continuous CLV drive exposure operation can be created. As a result, a high accuracy can be achieved in a short period of time. A master having an information recording media pattern can be manufactured.

  As described above, the electron beam drawing apparatus of the present invention is suitable for drawing a pattern on a substrate. The master production method of the present invention is suitable for producing a master of an information recording medium. The information recording medium manufacturing method of the present invention is suitable for manufacturing an information recording medium.

It is a figure which shows schematic structure of the electron beam drawing apparatus which concerns on one Embodiment of this invention. It is a figure which shows the spiral track and concentric track which were prescribed | regulated on the substrate surface. It is a figure which shows the structure of the sector prescribed | regulated on the substrate surface. It is a block diagram of a pulse signal generation device. It is a figure for demonstrating the production | generation process of a formatter drive clock signal. It is a figure which shows a deflection control signal. It is a figure which shows the pattern formed on the board | substrate. It is a figure which shows the area | region along the track | truck in a sector roughly. It is a block diagram (the 1) of a formatter drive clock generator. It is a block diagram (the 2) of a formatter drive clock generation apparatus. It is FIG. (1) which shows the recording medium manufactured using the electron beam drawing apparatus concerning this embodiment. It is FIG. (2) which shows the recording medium manufactured using the electron beam drawing apparatus concerning this embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Irradiation unit, 11 ... Casing, 12 ... Electron gun, 13 ... Magnetic lens, 14 ... Blanking electrode, 15 ... Aperture member, 16 ... Deflection electrode, 17 ... Objective lens, 20 ... Controller, 21 ... Pulse signal generator 21a ... Reference clock generator, 21b ... Formatter drive clock generator, 21c ... Deflection clock generator, 21d ... Rotation command pulse generator, 21e ... Feed command pulse generator, 22 ... Format signal generator, 23 ... Deflection signal Generation device 25 ... Rotation drive control device 26 ... Feed drive control device 30 ... Rotation table unit 31 ... Rotation table 32 ... Rotation mechanism 33 ... Slide unit 34 ... Moving stage 37 ... Rotation angle detector 38 ... position detector, 40 ... vacuum chamber, 51 ... formatter drive clock generation Control unit 52... First clock generation unit 53. Second clock generation unit 54. Sector length adjustment clock generation unit 56. Selection unit 63. Periodic clock generation unit 100. , CLK ... reference clock signal, L1clk, L2clk ... clock signal, Fclk ... formatter drive clock signal, Bsig ... blanker control signal, Dclk ... deflection clock signal, Dsig ... deflection control signal, Tclk ... rotation command pulse signal, Sclk ... send pulse Signal, AL1 ... first region, AL2 ... second region, CTr ... concentric track, STr ... spiral track.

Claims (5)

  1. By using an electron beam, an area of the substrate surface in which a plurality of sectors are defined with a predetermined reference point as the center is exposed along an equi-pitch concentric track with the reference point as the center, thereby exposing the region on the concentric track. An electron beam drawing apparatus for forming a plurality of patterns,
    An irradiation device for irradiating the electron beam toward an irradiation position on the substrate surface;
    A moving device that moves the substrate relative to the irradiation device to move the irradiation position at a constant speed along a predetermined equal pitch spiral track;
    A deflecting device that deflects the electron beam irradiated toward the irradiation position on the spiral track, and causes the electron beam to enter the predetermined concentric track;
    A pattern having a first length is formed along the concentric track in the first region of the plurality of sectors on the substrate, and the second region other than the first region of the sector is formed along the concentric track. And a blanking device for blanking the electron beam so that a second length pattern is formed,
    The blanking device is configured such that the number of first unit tracks when the concentric tracks are divided by the first length while the irradiation position moves in the first region is N 1 , and the first region is the first region. R 1 is the distance between the position on the spiral track corresponding to the exposure start position on the concentric track and the reference point, P is the pitch between the adjacent concentric tracks, and the spiral track is at the irradiation position. Let the relative movement speed be V,
    The value calculated by using the formula 2π · R 1 / (V · N 1 ) ± π · P / (V · N 1 2 ) is an initial value, and the formula ± 2π · P / (V · N 1 2 ) is An electron beam drawing apparatus, wherein the electron beam is blanked based on a first clock signal determined by using a value calculated by using an increase / decrease value.
  2. In the blanking device, the number of second unit tracks when the concentric tracks are divided by the second length while the irradiation position moves in the second region is N 2 , and the second region R 2 is the distance between the position on the spiral track corresponding to the exposure start position on the concentric track and the reference point, P is the pitch between the adjacent concentric tracks, and the spiral track is at the irradiation position. Let the relative movement speed be V,
    A value calculated by using the formula 2π · R 2 / (V · N 2 ) ± π · P / (V · N 2 2 ) is an initial value, and the formula ± 2π · P / (V · N 2 2 ) is The electron beam drawing apparatus according to claim 1, wherein the electron beam is blanked based on a second clock signal determined by using a value calculated by using the value as an increase / decrease value.
  3. The blanking device, after performing blanking based on the second clock signal, while the irradiation position moves in the second region,
    Corresponding to a path on the spiral track where the irradiation position has moved while blanking is performed based on the first clock signal and the second clock signal from a central angle corresponding to the concentric track in the sector. The remaining angle minus the center angle is taken as the reference angle,
    The number of third unit tracks when the concentric tracks are divided for each reference angle is N 3 , and the irradiation position on the spiral track and the reference point when blanking based on the second clock signal is completed The distance is R 3 , the pitch between the adjacent concentric tracks is P, the relative movement speed of the irradiation position with respect to the track is V,
    The electron beam is blocked on the basis of a third clock signal determined based on a value calculated using the formula 2π · R 3 / (V · N 3 ) ± π · P / (V · N 3 2 ). The electron beam drawing apparatus according to claim 2, wherein ranking is performed.
  4. A step of drawing a pattern on the substrate by the electron beam drawing apparatus according to claim 1;
    Developing a pattern formed on the substrate; and a method for producing an information recording medium master.
  5.   An information recording medium manufacturing method for manufacturing an information recording medium by transferring a pattern to the recording medium using the master disk according to claim 4.
JP2008045347A 2008-02-27 2008-02-27 Electron beam lithography system, manufacturing method of master, and manufacturing method of information recording medium Pending JP2009205721A (en)

Priority Applications (1)

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Applications Claiming Priority (1)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06243468A (en) * 1993-02-18 1994-09-02 Matsushita Electric Ind Co Ltd Optical disk device and optical disk
JP2002367241A (en) * 2001-06-11 2002-12-20 Pioneer Electronic Corp Information recording device and information recording medium method as well as recording medium
JP2003317327A (en) * 2002-04-22 2003-11-07 Ricoh Co Ltd Formatter driving clock generating method, formatter driving command pulse train generating method, optical master disk exposing apparatus, and optical recording medium

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06243468A (en) * 1993-02-18 1994-09-02 Matsushita Electric Ind Co Ltd Optical disk device and optical disk
JP2002367241A (en) * 2001-06-11 2002-12-20 Pioneer Electronic Corp Information recording device and information recording medium method as well as recording medium
JP2003317327A (en) * 2002-04-22 2003-11-07 Ricoh Co Ltd Formatter driving clock generating method, formatter driving command pulse train generating method, optical master disk exposing apparatus, and optical recording medium

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