JP2009204524A - Laminated ceramic electronic component, electronic component connection structure of the same, and gas sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated ceramic electronic component for ensuring the conductivity between a through-hole and an electrode terminal, and improving a bonding strength between a ceramic substrate and the electrode terminal, and its electronic component connection structure. <P>SOLUTION: The laminated ceramic electronic component 1 includes: the ceramic substrate 10 comprising a plurality of stacked ceramic layers; an inner lead 11 embedded into the substrate 10; the electrode terminal 12 formed on the outer surface of the substrate 10; and the through-hole 13 formed in the substrate 10 so as to provide the conductivity between the electrode terminal 12 and the inner lead 11. The electrode terminal 12 includes a plurality of different stacked terminal layers 120 having different material compositions. Out of the terminal layers 120, the terminal layer 120 for clamping at least one of the other terminal layers 120 with the substrate 10 is directly connected to the through-hole 13. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a multilayer ceramic electronic component, its electronic component connection structure, and a gas sensor.

Conventionally, as shown in FIG. 7, a ceramic base 90 formed by laminating a plurality of ceramic layers, an internal lead portion 91 built in the base 90, and a plurality of terminals formed on the outer surface 900 of the base 90. A multilayer ceramic electronic component 9 such as a multilayer gas sensor element having an electrode terminal 92 formed by stacking layers 920 is known (see Patent Documents 1 and 2).
In the ceramic electronic component 9, a through hole 93 for electrically connecting the electrode terminal 92 and the internal lead portion 91 is formed in the base body 90.

  The plurality of terminal layers 920 are formed of, for example, two layers. Of the two terminal layers 920, a terminal layer 920 disposed outside (hereinafter referred to as an outer terminal layer 921) and a terminal layer 920 disposed inside (hereinafter referred to as an inner terminal layer 922). ) And a mixture of metals and ceramics, but the material compositions are different from each other.

The inner terminal layer 922 is directly connected to the through hole 93.
On the other hand, the outer terminal layer 921 is in contact with a contact fitting 94 that is electrically connected to an external power source, as shown in FIG. That is, the contact fitting 94 is electrically connected to the through hole 93 via the outer terminal layer 921 and the inner terminal layer 922.

JP 2004-264262 A Japanese Patent Laid-Open No. 2007-22908

However, the conventional multilayer ceramic electronic component 9 has the following problems. That is, when the contact fitting 94 is slid and disposed at a predetermined position on the outer terminal layer 921, the electrode terminal 92 is pressed by the contact fitting 94, and the electrode terminal 92 and the base body 90 are peeled off. There is a risk that.
As a result, even the through hole 93 and the inner terminal layer 922 are peeled off, and it may be difficult to achieve electrical conduction between the two.

On the other hand, in order to increase the bonding strength between the inner terminal layer 922 and the base body 90, it is conceivable to increase the mixing ratio of ceramic to metal in the inner terminal layer 922.
However, if the ceramic mixing ratio in the inner terminal layer 922 is too large, the bonding strength between the inner terminal layer 922 and the base body 90 increases, but the electrical resistance of the inner terminal layer 922 increases, and the multilayer ceramic electronic component 9 There is a risk that it may be difficult to ensure electrical continuity between the contact fitting 94 and the through hole 93 to be brought into contact with the surface.
That is, in the above configuration, it is difficult to achieve both the improvement of the bonding strength between the inner terminal layer 922 and the base body 90 and the securing of electrical conduction between the through hole 93 and the inner terminal layer 922.

  In view of such a conventional problem, it is possible to achieve both of ensuring electrical conduction between the through hole and the electrode terminal and improving the bonding strength between the ceramic base and the electrode terminal. An object of the present invention is to provide a multilayer ceramic electronic component, a connecting structure for the electronic component, and a gas sensor.

According to a first aspect of the present invention, there is provided a ceramic base formed by laminating a plurality of ceramic layers, an internal lead portion built in the base, an electrode terminal formed on an outer surface of the base, the electrode terminal, and the above A multilayer ceramic electronic component having a through hole formed in the base for electrically connecting an internal lead part,
The electrode terminal is formed by laminating a plurality of terminal layers having different material compositions,
Of the plurality of terminal layers, an outer terminal layer sandwiching at least an inner terminal layer which is a terminal layer in contact with the base is directly connected to the through hole. It exists in a ceramic electronic component (Claim 1).

The function and effect of the present invention will be described.
In the present invention, the outer terminal layer is directly connected to the through hole. Thereby, it is possible to achieve both of ensuring electrical continuity between the through hole and the electrode terminal and improving the bonding strength between the electrode terminal and the substrate.

That is, according to the above configuration, it is not always necessary to sufficiently increase the conductivity of the inner terminal layer. Therefore, it is possible to easily improve the bonding strength between the electrode terminal and the substrate by including a large amount of a material that can improve the bonding strength between the substrate and the base material in addition to the conductive material.
On the other hand, by increasing the content of the conductive material in the outer terminal layer that does not require a sufficiently high bonding strength with the substrate, electrical conduction between the through hole and the electrode terminal can be easily ensured.

  As described above, according to the present invention, the multilayer ceramic electronic component capable of ensuring both electrical continuity between the through hole and the electrode terminal and improving the bonding strength between the ceramic base and the electrode terminal. Can be provided.

  A second invention is an electronic component connection structure using the multilayer ceramic electronic component according to any one of claims 6 to 8, wherein the electrode terminal is electrically connected to a contact fitting contacting the electrode terminal. And the contact metal fitting is configured to slide a portion other than a projection surface of the through hole on the outer terminal layer in the stacking direction of the plurality of terminal layers to make contact with the electrode terminal. It exists in a component connection structure (Claim 10).

The electrode terminal is electrically connected to the contact metal fitting, and the contact metal fitting is brought into contact with the electrode terminal by sliding a portion other than the projection surface of the through hole onto the outer terminal layer. Thereby, it can prevent that the junction part of a through hole and an outer side terminal changes.
That is, since the through hole and the outer terminal layer contain a large amount of metal, when the contact fitting is slid at the joint portion between the two, the joint portion is likely to be deformed. Therefore, it is possible to prevent the joint portion between the through hole and the outer terminal from being deformed by sliding the contact fitting at a portion other than the joint portion between the through hole and the outer terminal layer in the electrode terminal.

  Thus, according to the present invention, it is possible to provide an electronic component connection structure that can prevent the through hole and the electrode terminal from being peeled off.

A third invention is a gas sensor comprising the gas sensor element according to claim 9 (claim 12).
ADVANTAGE OF THE INVENTION According to this invention, while being able to ensure electrical continuity fully, the gas sensor element which is hard to produce peeling of an electrode, ie, the gas sensor element excellent in reliability, can be obtained. For this reason, the gas sensor excellent in reliability can be obtained.

  Thus, according to the present invention, it is possible to provide a gas sensor with excellent reliability.

  In the first invention (Invention 1) and the second invention (Invention 10), the electrode terminal can be formed by, for example, mixing a metal and a ceramic, and mixing a metal and a glass component. For example, it can be formed by various compositions.

In the first invention (invention 1), it is preferable that the outermost terminal layer of the plurality of terminal layers is the outer terminal layer (invention 2).
In this case, conduction between the through hole and the electrode terminal can be easily ensured. That is, the outer terminal layer is directly connected to the contact fitting. Since the outer terminal layer and the through hole are further directly connected, electrical conduction between the through hole and the contact fitting can be easily ensured.

The electrode terminal is preferably formed by mixing a metal and a ceramic.
In this case, it is possible to sufficiently increase the bonding strength between the ceramic base and the electrode terminal while sufficiently ensuring electrical conduction between the through hole and the electrode terminal.

The inner terminal layer preferably has a higher ceramic content than the other terminal layers.
In this case, the bonding strength between the inner terminal layer and the substrate can be further increased. That is, the bonding strength between the electrode terminal and the substrate can be further improved.

The electrode terminal may be formed by mixing Pt (platinum) and one or both of Al ₂ O ₃ (alumina) and ZrO ₂ (zirconia) (Claim 5).
Even in this case, it is possible to obtain a multilayer ceramic electronic component that can sufficiently exhibit the effects of the present invention.

The electrode terminal is preferably composed of two layers of the inner terminal layer and the outer terminal layer, and the outer terminal layer is the outermost layer of the electrode terminal.
In this case, since the configuration of the electrode terminal can be simplified, the multilayer ceramic electronic component of the present invention can be easily manufactured.

The outer terminal layer and the inner terminal layer contain metal and ceramic, and the mixing ratio of the ceramic to the metal is 9 to 25% by weight in the outer terminal layer. Is preferably 40% by weight or less (claim 7).
In this case, the effects of the present invention can be more effectively exhibited.
The ceramic mixing ratio in the inner terminal layer is preferably larger than the ceramic mixing ratio in the outer terminal layer.

On the other hand, when the ceramic mixing ratio in the outer terminal layer is less than 9% by weight, the outer terminal layer and the inner terminal layer may be peeled off by sliding of the contact fitting 2.
Further, when the ceramic mixing ratio in the outer terminal layer exceeds 25% by weight, it may be difficult to ensure conduction between the through hole and the outer terminal layer. Moreover, when the ceramic mixing ratio in an inner side terminal layer exceeds 40 weight%, there exists a possibility that the adhesive strength of an outer side terminal layer and an inner side terminal layer may fall by sliding of a contact metal fitting.

The outer terminal layer preferably has a thickness of 12 μm or more, and the inner terminal layer preferably has a thickness of 8 μm or more.
In this case, even if the contact fitting is slid on the outer terminal layer, it is possible to sufficiently prevent the through hole and the outer terminal layer, and the outer terminal layer and the inner terminal layer from peeling off. That is, when the thickness of the outer terminal layer is 12 μm or more, it is possible to sufficiently suppress the separation of the through hole and the outer terminal layer even when the contact fitting is slid on the outer terminal layer. Moreover, when the thickness of the inner terminal layer is 8 μm or more, the outer terminal layer and the inner terminal layer can be sufficiently prevented from being peeled even when the contact fitting is slid on the outer terminal layer.

The multilayer ceramic electronic component is preferably a gas sensor element that detects a specific gas concentration in a gas to be measured.
In this case, the effect of the present invention can be effectively exhibited. That is, with the recent tightening of environmental regulations, a highly accurate gas sensor element has been demanded. For this reason, in the gas sensor element, it is important to ensure both the electrical continuity between the contact fitting and the electrode terminal and the improvement of the bonding strength between the electrode terminal and the substrate. Therefore, by applying the present invention to a gas sensor element, it is possible to obtain a gas sensor element that can effectively exhibit the effects of the present invention.

In the second invention (invention 10), the contact fitting is separated from the end edge of the through hole by 0.35 mm or more in a direction orthogonal to the stacking direction of the plurality of terminal layers, and the inner terminal layer has the above-mentioned. It is preferable that the electrode terminal is brought into contact with a portion separated by 0.6 mm or more in the direction orthogonal to the stacking direction of the plurality of terminal layers from the end closest to the through hole.
In this case, the effect of the present invention can be exhibited more reliably.

  On the other hand, when the contact fitting slides at a position where the distance from the edge of the through hole is less than 0.35 mm in the direction orthogonal to the laminating direction, and the distance from the end in the inner terminal layer is the laminating When sliding at a position of less than 0.6 mm in a direction perpendicular to the direction, it may be difficult to sufficiently prevent the outer terminal layer from peeling off the substrate.

(Example 1)
A multilayer ceramic electronic component 1 according to an embodiment of the present invention will be described with reference to FIGS.
As shown in FIGS. 1 and 3, the multilayer ceramic electronic component 1 of the present example includes a ceramic base 10 formed by laminating a plurality of ceramic layers, an internal lead portion 11 built in the base 10, and a base 10. Electrode terminal 12 formed on the outer surface 100 of the substrate, and a through hole 13 formed in the base 10 for electrically connecting the electrode terminal 12 and the internal lead portion 11 to each other.

The electrode terminal 12 is formed by laminating a plurality of terminal layers 120 having different material compositions.
Out of the plurality of terminal layers 120, the outer terminal layer 121 sandwiching at least the inner terminal layer 122, which is the terminal layer 120 in contact with the base body 10, is directly connected to the through hole 13.

The multilayer ceramic electronic component 1 will be described in detail.
In this example, the multilayer ceramic electronic component 1 is a multilayer gas sensor element that is disposed in an exhaust system of an internal combustion engine such as an automobile as shown in FIG. 2 and detects a specific gas concentration in a gas to be measured. Hereinafter, the multilayer ceramic electronic component 1 is appropriately referred to as a multilayer gas sensor element 14.

The gas sensor element 14 is a laminated gas sensor element having the ceramic base 10 formed by laminating a plurality of ceramic layers as described above.
An internal lead portion 11 is disposed inside the base body 10. The internal lead portion 11 is connected at its distal end to, for example, a heater for heating the gas sensor element 14 or a measurement electrode (not shown) for detecting a specific gas concentration.

As shown in FIG. 2, the electrode terminals 12 are disposed on the outer surfaces 100 on both sides of the base body 10 in the stacking direction of the plurality of ceramic layers.
In this example, the electrode terminal 12 is formed by laminating two terminal layers 120 as shown in FIG.
Hereinafter, the terminal layer 120 stacked on the outside of the two terminal layers 120 is referred to as an outer terminal layer 121, and the terminal layer 120 stacked on the inner side of the outer terminal layer 121 is referred to as an inner terminal layer 122.

The outer terminal layer 121 is directly connected to the through hole 13 as shown in FIGS. Specifically, the outer terminal layer 121 is also formed in a through-hole 123 provided to connect the through hole 13 and the outer terminal layer 121 in the inner terminal layer 122. It is connected.
In this example, the through portion 123 and the through hole 13 that penetrate in the thickness direction of the inner terminal layer 122 have the same diameter. However, as shown in FIGS. The inner diameter of the penetrating portion 123 of the layer 122 and the inner diameter of the through hole 13 may be different.

Both the outer terminal layer 121 and the inner terminal layer 122 are formed by mixing metal and ceramic. Specifically, in the outer terminal layer 121 and the inner terminal layer 122, for example, Pt (platinum) can be used as the metal, and as the ceramic, for example, one of Al ₂ O ₃ (alumina) and ZrO ₂ (zirconia) or Both can be used.

In addition, the inner terminal layer 122 has a larger ceramic / metal mixing ratio than the outer terminal layer 121. Specifically, the mixing ratio of the ceramic to the metal in the outer terminal layer 121 is, for example, 9 to 25% by weight, and the mixing ratio of the ceramic to the metal in the inner terminal layer 122 is, for example, 40% by weight or less.
Each terminal layer 120 can be formed by mixing a metal and ceramic with other materials, or can be formed of metal, ceramic and unavoidable impurities.

The outer terminal layer 121 has a thickness t1 of 12 μm or more, and the inner terminal layer 122 has a thickness t2 of 8 μm or more. The thicknesses t1 and t2 are average thicknesses in the stacking direction of the terminal layers 120, as shown in FIG.
The through hole 13 can be formed using the same material as that of the outer terminal layer 121, for example.

Next, an example of a method for manufacturing the stacked gas sensor element 14 of this example will be described.
First, the substrate 10 is produced by laminating a plurality of ceramic layers. At this time, an internal lead portion 11 connected to, for example, a heater or a measurement electrode is formed inside the base body 10, and a through hole 13 connected to the internal lead portion 11 is formed in the base body 10. .

Next, the through hole 13 is filled with, for example, the same material as that of the outer terminal layer 121.
Next, the inner terminal layer 122 is formed on the outer surface 100 of the base body 10 so as not to cover the through hole 13.
Next, the outer terminal layer 121 is laminated on the outer side of the inner terminal layer 122 to form the gas sensor element 14 of this example.

Next, a contact method between the electrode terminal 12 and the contact fitting 2 in the laminated gas sensor element 14 of this example will be described.
As shown in FIG. 2, the electrode terminal 12 is formed on the outer surface 100 on both sides of the base body 10 in the stacking direction of the plurality of ceramic layers, and the contact metal fitting 2 is sandwiched from both sides in the stacking direction. Connected.

  Then, as shown by an arrow A in FIG. 1, the contact fitting 2 slides toward the electrode terminal 12 from the end portion 101 on the side where the electrode terminal 12 is formed in the axial direction of the base body 10. The terminal 12 is disposed at a predetermined position. Further, the contact fitting 2 slides in a region in a range from the end portion 101 to a portion other than the projection surface of the through hole 13 on the outer terminal layer 121 in the stacking direction of the plurality of terminal layers 120 to thereby form the electrode terminal 12. Contacted with.

  Specifically, as shown in FIGS. 3 to 5, the contact fitting 2 is separated from the end 130 of the through hole 13 by 0.35 mm or more in the direction orthogonal to the stacking direction of the plurality of terminal layers 120, and on the inner side. The terminal layer 122 is brought into contact with the electrode terminal 12 at an end portion closest to the through hole 13, that is, at a portion separated by 0.6 mm or more from the end edge 124 of the through portion 123 in a direction orthogonal to the stacking direction of the plurality of terminal layers 120. .

That is, the distance X from the edge 130 of the through hole 13 shown in FIGS. 3 to 5 to the sliding position of the contact fitting 2 is 0.35 mm or more, and from the edge 124 of the through-hole 123 shown in FIGS. The contact fitting 2 is slid at a position where the distance Y to the sliding position of the contact fitting 2 is 0.6 mm or more.
In this example, it is necessary to slide the contact metal fitting 2 at a position where the distance Y is 0.6 mm or more. That is, as shown in FIG. 3, the inner diameter of the through-hole 123 provided in the inner terminal layer 122 and the inner diameter of the through hole 13 are approximately the same size, so that the distance Y is 0.6 mm or more. This is because the distance X is necessarily 0.35 mm or more.

Moreover, in FIG. 4, it is necessary to slide the contact metal fitting 2 at a position where the distance Y is 0.6 mm or more. That is, in this case as well, as in the case of FIG. 3, if the distance Y is 0.6 mm or more, the distance X is necessarily 0.35 mm or more.
Further, in FIG. 5, it is necessary to slide the contact fitting 2 at a position where the distance X is 0.35 mm or more and the distance Y is 0.6 mm or more.

Below, the effect of this example is demonstrated.
In this example, the outer terminal layer 121 is directly connected to the through hole 13. Thereby, it is possible to achieve both of ensuring electrical continuity between the through hole 13 and the electrode terminal 12 and improving the bonding strength between the electrode terminal 12 and the substrate 10.

That is, according to the above configuration, it is not always necessary to sufficiently increase the conductivity of the inner terminal layer 122. Therefore, in addition to the conductive material, the inner terminal layer 122 contains a material that can improve the bonding strength with the base 10, thereby easily improving the bonding strength between the electrode terminal 12 and the base 10. be able to.
On the other hand, the electrical conduction between the through hole 13 and the electrode terminal 12 can be easily ensured by increasing the content of the conductive material in the outer terminal layer 121 that does not require a sufficiently high bonding strength with the substrate 10. be able to.

In addition, since the electrode terminal 12 includes the two terminal layers 120 of the outer terminal layer 121 and the inner terminal layer 122, the configuration of the electrode terminal 12 can be simplified.
As a result, the multilayer ceramic electronic component 1 of the present invention can be easily manufactured.

Further, since the outer terminal layer 121 and the inner terminal layer 122 are formed by mixing a metal and a ceramic, the ceramic base and the electrode terminal are sufficiently secured while ensuring sufficient electrical conduction between the through hole 13 and the electrode terminal. The bonding strength between the two can be sufficiently increased.
In particular, the outer terminal layer and the inner terminal layer have a ceramic-to-metal mixing ratio of 9 to 25% by weight in the outer terminal layer and 40% by weight or less in the inner terminal layer. The effect can be exhibited more effectively.

Further, as described above, since the inner terminal layer 122 has a higher ceramic content than the outer terminal layer 121, the bonding strength between the inner terminal layer 122 and the substrate 10 can be further increased. That is, the bonding strength between the electrode terminal 12 and the substrate 10 can be further improved.
Moreover, since the electrode terminal 12 is formed by mixing Pt (platinum) and one or both of Al ₂ O ₃ (alumina) and ZrO ₂ (zirconia), the effect of the present invention is effective. Can be demonstrated.

  Further, since the outer terminal layer 121 has a thickness t1 of 12 μm or more, and the inner terminal layer 122 has a thickness t2 of 8 μm or more, the through hole 13 can be obtained even when the contact fitting 2 is slid on the outer terminal layer 121. And the outer terminal layer 121, and the outer terminal layer 121 and the inner terminal layer 12 can be sufficiently prevented from peeling off. That is, when the thickness t1 of the outer terminal layer 121 is 12 μm or more, the through hole 13 and the outer terminal layer 121 are sufficiently prevented from peeling even when the contact fitting 2 is slid on the outer terminal layer 121. can do. In addition, when the thickness t2 of the inner terminal layer 122 is 8 μm or more, it is sufficient that the outer terminal layer 121 and the inner terminal layer 122 are separated even when the contact fitting 2 is slid on the outer terminal layer 121. Can be suppressed.

  Moreover, since the multilayer ceramic electronic component 1 is the gas sensor element 14 that detects the specific gas concentration in the gas to be measured, it is possible to obtain a gas sensor element that can effectively exhibit the effects of the present invention. That is, with the recent tightening of environmental regulations, a highly accurate gas sensor element has been demanded. Therefore, in the gas sensor element, it is important to achieve both of ensuring electrical continuity between the contact fitting 2 and the electrode terminal 12 and improving the bonding strength between the electrode terminal 2 and the base 10. Therefore, by applying the present invention to the gas sensor element, it is possible to obtain the gas sensor element 14 that can effectively exhibit the effects of the present invention.

The electrode terminal 12 is electrically connected to the contact fitting 2, and the contact fitting 2 is brought into contact with the electrode terminal 12 by sliding a portion other than the projection surface of the through hole 13 on the outer terminal layer 121. Thereby, it can prevent that the junction part of the through hole 13 and the outer side terminal layer 121 deform | transforms.
That is, since the through hole 13 and the outer terminal layer 121 contain a large amount of metal, when the contact fitting is slid at the joint portion between the two, the joint portion is likely to be deformed. Therefore, peeling of the through hole 13 and the outer terminal layer 121 can be prevented by sliding the contact fitting 2 in a portion other than the joint portion between the through hole 13 and the outer terminal layer 121 in the electrode terminal 12.

  In particular, in this example, the contact metal fitting 2 is separated from the edge 130 of the through hole 13 by 0.35 mm or more in the direction orthogonal to the stacking direction of the plurality of terminal layers 120 and is most apart from the through hole 13 in the inner terminal layer 122. The electrode terminals 12 are brought into contact with each other at a portion separated by 0.6 mm or more in the direction orthogonal to the stacking direction of the plurality of terminal layers 120 from the near end portion 124. Therefore, the effect of this invention can be exhibited more reliably.

  As described above, according to this example, the multilayer ceramic electronic component capable of ensuring both electrical continuity between the through hole and the electrode terminal and improving the bonding strength between the ceramic base and the electrode terminal. And the electronic component connection structure can be provided.

(Example 2)
This example is an example of another form of the gas sensor element 14 shown in Example 1, as shown in FIG.
In other words, in this example, the inner terminal layer 122 is not formed with a through portion (see reference numeral 123 in FIG. 1) for connecting the through hole 13 and the outer terminal layer 121. And the outer side terminal layer 121 is laminated | stacked on the outer side of the inner side terminal layer 122 so that the edge 125 of the sliding direction (direction of arrow A in FIG. 6) of the contact metal fitting 2 in the inner side terminal layer 122 may be covered. It is directly connected to the hole 13.
Others have the same configuration and effects as the first embodiment.

(Example 3)
In this example, the contact metal fitting 2 is slid on the outer terminal layer 121 of the multilayer ceramic electronic component produced by variously changing the thickness t1 of the outer terminal layer 121 and the thickness t2 of the inner terminal layer 122, so that each multilayer ceramic This is an example of examining whether a defect occurs in an electronic component.
In addition, the code | symbol used in this example is based on the code | symbol used in FIG.

First, the mixing ratio of ceramic to metal in the outer terminal layer 121 is 17%, the mixing ratio of ceramic to metal in the inner terminal layer 122 is 30%, the thickness t2 of the inner terminal layer 122 is constant at 15 μm, and the outer terminal layer In each multilayer ceramic electronic component 1 manufactured by changing the thickness t1 of 121 in the range of 4 to 39 μm, it was examined whether or not a failure occurred by sliding the contact fitting 2 on the outer terminal layer 121.
In addition, by sliding the contact metal fitting 2 on the outer terminal layer 121 while pressing the outer terminal layer 121 with a force of 10 N by the contact metal fitting 2 having a contact portion having a curvature radius of 0.1 mm, each multilayer ceramic electronic Judgment was made as to whether or not a defect occurred in the part.

The measurement results are shown in Table 1. “◯” in the table indicates that no failure occurred in the multilayer ceramic electronic component, and “X” indicates that a failure occurred in which the inner terminal layer 122 and the substrate 10 peeled in the multilayer ceramic electronic component.
In addition, the presence or absence of peeling was determined by whether or not the outer surface 100 of the substrate 10 under the electrode terminal 12 was exposed.

As can be seen from Table 1, when the thickness t1 of the outer terminal layer 121 is 12 μm or more, problems can be prevented in the multilayer ceramic electronic component.
On the other hand, when the thickness t1 of the outer terminal layer 121 is less than 12 μm, there occurs a problem that the inner terminal layer 122 and the outer terminal layer 121 are separated.

  Next, the mixing ratio of the ceramic to the metal in the outer terminal layer 121 is 17%, the mixing ratio of the ceramic to the metal in the second terminal 122 layer is 30%, and the thickness t1 of the outer terminal layer 121 is constant at 25 μm. In each ceramic electronic component 1 manufactured by changing the thickness t2 of the terminal layer 122 in the range of 4 to 48 μm, it was examined whether or not a failure occurred by sliding the contact fitting 2 on the outer terminal layer 121.

The measurement results are shown in Table 2. In the table, “◯” indicates that no failure occurred in the multilayer ceramic electronic component, and “X” indicates that a failure occurred in which the outer terminal layer 121 and the inner terminal layer 122 peeled in the multilayer ceramic electronic component.
Note that the criteria for peeling are the same as described above.

As can be seen from Table 2, when the thickness t2 of the inner terminal layer 122 is 8 μm or more, problems in the multilayer ceramic electronic component can be prevented.
On the other hand, when the thickness t2 of the inner terminal layer 122 is less than 8 μm, there arises a problem that the base 10 and the inner terminal layer 122 are peeled off.

  As can be seen from Tables 1 and 2, when the thickness of the outer terminal layer 121 is 12 μm or more and the thickness of the inner terminal layer 122 is 8 μm or more, it is possible to prevent problems in the multilayer ceramic electronic component.

Example 4
In this example, the contact fitting 2 is slid on the outer terminal layer 121 of a multilayer ceramic electronic component manufactured by variously changing the ceramic mixing ratio of the outer terminal layer 121 and the 122 ceramic mixing ratio of the inner terminal layer. This is an example of investigating whether or not a failure occurs in the multilayer ceramic electronic component.
In addition, the code | symbol used in this example is based on the code | symbol used in FIG.

  First, the thickness t1 of the outer terminal layer 121 is 25 μm, the thickness t2 of the inner terminal layer 122 is 15 μm, the mixing ratio of ceramic to metal in the inner terminal layer 122 is constant at 30%, and the ceramic to metal in the outer terminal layer 121 is constant. In each laminated ceramic electronic component produced by varying the mixing ratio of 3 to 30% by weight, it was examined whether or not a failure occurred by sliding with the contact fitting 2 on the outer terminal layer.

Table 3 shows the measurement results. In the table, “◯” indicates that no trouble occurred in the multilayer ceramic electronic component, and “×” indicates that the outer terminal layer 121 and the inner terminal layer 122 are peeled or the through hole 13 and the outer terminal layer in the multilayer ceramic electronic component. This indicates that a malfunction such as a decrease in electrical continuity with 121 has occurred.
Note that the criteria for peeling are the same as those in Example 3.
Further, by measuring the conductivity between the outer terminal layer 121 and the internal lead part 11 with a tester, it was determined whether or not the conductivity between the through hole 13 and the outer terminal layer 121 was lowered.

As can be seen from Table 3, when the mixing ratio of the ceramic to the metal in the outer terminal layer 121 is 9 to 25% by weight, it is possible to prevent problems from occurring in the multilayer ceramic electronic component.
On the other hand, when the mixing ratio was less than 9% by weight, there was a problem that the outer terminal layer 121 and the inner terminal layer 122 were peeled off. Moreover, when the said mixing ratio exceeded 25 weight%, the malfunction that the electroconductivity with the outer side terminal layer 121 and the through hole 13 fell occurred.

  Next, the thickness t1 of the outer terminal layer 121 is 25 μm, the thickness t2 of the inner terminal layer 122 is 15 μm, the mixing ratio of the ceramic to the metal in the outer terminal layer 121 is constant at 17%, and the metal in the inner terminal layer 122 is In a multilayer ceramic electronic component produced by changing the mixing ratio of the ceramic in the range of 20 to 47% by weight, it was examined whether or not a failure occurred by sliding on the outer terminal layer 121.

Table 4 shows the measurement results. In the table, “◯” indicates that no trouble occurred in the multilayer ceramic electronic component, and “×” indicates that the inner terminal layer 122 and the base 10 are separated from each other in the multilayer ceramic electronic component, or the outer terminal layer 121 and the inner terminal layer 122 are separated. Indicates that a defect such as peeling occurs.
Note that the criteria for peeling are the same as those in Example 3.

As can be seen from Table 4, when the mixing ratio of the ceramic to the metal in the inner terminal layer 122 is set to 40% by weight or less, problems in the multilayer ceramic electronic component can be prevented.
On the other hand, when the mixing ratio exceeds 40% by weight, there is a problem that the outer terminal layer 121 and the inner terminal layer 122 are peeled off due to the sliding of the contact fitting 2.

As can be seen from Tables 3 and 4, when the mixing ratio of the ceramic to the metal in the outer terminal layer 121 is 9 to 25% by weight, and the mixing ratio of the ceramic to the metal in the inner terminal layer 122 is 40% by weight or less. Can prevent problems in the multilayer ceramic electronic component.
The ceramic mixing ratio in the inner terminal layer 122 is preferably larger than the ceramic mixing ratio in the outer terminal layer 121.

(Example 5)
In this example, the distance from the end edge 130 of the through hole 13 to the sliding position of the contact fitting 2 (hereinafter referred to as distance X) and the distance from the end edge 124 of the through portion 123 to the sliding position of the contact fitting 2 are shown. This is an example in which whether or not a failure occurs in the multilayer ceramic electronic component when the contact fitting 2 is slid with various changes (hereinafter referred to as distance Y) is shown.
In addition, the code | symbol used in this example is based on the code | symbol used in FIG.

First, when the distance Y was made constant, and the distance X was varied in the range of 0 to 0.9 mm and the contact metal fitting 2 was slid, it was examined whether or not a failure occurred in the multilayer ceramic electronic component. .
Table 5 shows the measurement results. In the table, ○ indicates that no failure occurred in the multilayer ceramic electronic component, and × indicates that a failure occurred in the multilayer ceramic electronic component in which the joint portion between the through hole 13 and the outer terminal layer 121 was deformed. Show.
Note that the criteria for peeling are the same as those in Example 3.

As can be seen from Table 5, when the contact fitting 2 is slid at a position where the distance X is 0.35 mm or more, there is no problem in the multilayer ceramic electronic component.
On the other hand, when the contact fitting 2 is slid at a position where the distance Y is less than 0.35 mm, there is a problem that the joint portion between the through hole 13 and the outer terminal layer 121 is deformed.

  In this example, the experiment was performed with the distance Y fixed, but it is considered that the same result can be obtained even if the experiment is performed by varying the distance X while varying the distance Y.

In addition, when the distance X was made constant and the distance Y was varied in the range of 0 to 1 mm and the contact fitting 2 was slid, it was examined whether or not a failure occurred in the multilayer ceramic electronic component.
Table 6 shows the measurement results. “◯” in the table indicates that no failure occurred in the multilayer ceramic electronic component, and “X” indicates that a failure occurred in which the outer terminal layer 121 and the substrate 10 were separated in the multilayer ceramic electronic component.
Note that the criteria for peeling are the same as those in Example 3.
Table 6 shows the measurement results.

As can be seen from Table 6, when the distance Y is 0.6 mm or more, there is no defect in the multilayer ceramic electronic component.
On the other hand, when the distance Y was less than 0.6 mm, peeling occurred between the outer terminal layer 121 and the substrate 10.

  In this example, the experiment was performed with the distance X fixed, but it is considered that the same result can be obtained even if the experiment is performed with the distance Y varied while the distance X is varied.

  As can be seen from Tables 5 and 6, the distance X from the edge 130 of the through hole 13 in the direction orthogonal to the stacking direction of the plurality of terminal layers 120 is 0.35 mm or more, and the through hole in the inner terminal layer 122 When the distance Y in the direction orthogonal to the stacking direction of the plurality of terminal layers 120 from the end closest to 13 is 0.6 mm or more, it is possible to prevent the occurrence of problems in the multilayer ceramic electronic component.

Sectional drawing which shows the state in which the laminated ceramic electronic component and contact metal fitting in Example 1 are contacting. The side view which shows the state in which the laminated ceramic electronic component and contact metal fitting in Example 1 are contacting. Sectional drawing of the multilayer ceramic electronic component in which the internal diameter of the through hole in Example 1 is the same magnitude | size as the internal diameter of the penetration part formed in the inner side terminal layer. Sectional drawing of the multilayer ceramic electronic component in which the internal diameter of the through hole in Example 1 is smaller than the internal diameter of the penetration part formed in the inner side terminal layer. Sectional drawing of the multilayer ceramic electronic component in which the internal diameter of a through hole in Example 1 is larger than the internal diameter of the penetration part formed in the inner side terminal layer. Sectional drawing in Example 2 which shows the state which the multilayer ceramic electronic component and the contact metal fitting are contacting. Sectional drawing which shows the state in which the laminated ceramic electronic component and contact metal fitting are contacting in a prior art example.

Explanation of symbols

1 Multilayer ceramic electronic component 1
10 Substrate 11 Internal Lead 12 Electrode Terminal 120 Terminal Layer 13 Through Hole

Claims (12)

A ceramic base formed by laminating a plurality of ceramic layers, an internal lead part built in the base, an electrode terminal formed on the outer surface of the base, and the electrode terminal and the internal lead part are electrically connected A multilayer ceramic electronic component having a through hole formed in the base body for electrical conduction,
The electrode terminal is formed by laminating a plurality of terminal layers having different material compositions,
Of the plurality of terminal layers, an outer terminal layer sandwiching at least an inner terminal layer which is a terminal layer in contact with the base is directly connected to the through hole. Ceramic electronic components.   2. The multilayer ceramic electronic component according to claim 1, wherein a terminal layer laminated on the outermost side among the plurality of terminal layers is the outer terminal layer.   3. The multilayer ceramic electronic component according to claim 1, wherein the electrode terminal is formed by mixing a metal and a ceramic.   4. The multilayer ceramic electronic component according to claim 1, wherein the inner terminal layer has a higher ceramic content than other terminal layers. 5. 5. The multilayer ceramic electronic component according to claim 1, wherein the electrode terminal is a mixture of Pt and one or both of Al ₂ O ₃ and ZrO ₂ .   The electrode terminal according to any one of claims 1 to 5, wherein the electrode terminal includes two layers of the inner terminal layer and the outer terminal layer, and the outer terminal layer is an outermost layer of the electrode terminal. Multilayer ceramic electronic components.   In Claim 6, the said outer side terminal layer and the said inner side terminal layer contain a metal and a ceramic, The mixing ratio of the ceramic with respect to a metal is 9-25 weight% in the said outer side terminal layer, A multilayer ceramic electronic component comprising 40% by weight or less in the inner terminal layer.   8. The multilayer ceramic electronic component according to claim 6, wherein the outer terminal layer has a thickness of 12 μm or more, and the inner terminal layer has a thickness of 8 μm or more.   9. The multilayer ceramic electronic component according to claim 1, wherein the multilayer ceramic electronic component is a gas sensor element that detects a specific gas concentration in a gas to be measured.   It is an electronic component connection structure using the multilayer ceramic electronic component according to any one of claims 6 to 8, wherein the electrode terminal is electrically connected to a contact fitting that contacts the electrode terminal, and the contact The metal part connection structure according to claim 1, wherein a part other than a projection surface of the through hole on the outer terminal layer in the stacking direction of the plurality of terminal layers slides in contact with the electrode terminal.   11. The contact fitting according to claim 10, wherein the contact fitting is separated from the end of the through hole by 0.35 mm or more in a direction orthogonal to the stacking direction of the plurality of terminal layers, and is the end closest to the through hole in the inner terminal layer. An electronic component connection structure, wherein the electrode terminal is brought into contact with a portion separated by 0.6 mm or more in a direction orthogonal to the stacking direction of the plurality of terminal layers from the portion.   A gas sensor comprising the gas sensor element according to claim 9.

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