JP2009201091A - Contact type image sensor device with built-in optical element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce a manufacturing cost of the entire contact type image sensor device, and to overcome the problems of the increase in the cubic volume or assembly errors resulting from using a conventional GRIN image formation optical element. <P>SOLUTION: This device is provided with a circuit board module 1, a luminescence module 2a electrically connected to and installed on the circuit board module 1, and an image sensor module 3 which has a photosensitive element set 30 electrically connected to and installed on the side of the luminescence module 2a on the circuit board module 1 and electrically connected to and installed on the circuit board module 1, and a micro condensing element set 31 installed on the photosensitive element set 30, wherein a light beam which is emitted with the luminescence module 2a to a document makes scattered light generate and the photosensitive element set 30 of the image sensor module 3 receives the scattered light from the document, so that an image of the document is detected. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a contact-type image sensor device, and more particularly to a contact-type image sensor device with a built-in optical element that can omit a GRIN (Gradient Reflective Index) imaging optical element.

  1 and 2 are an exploded perspective view and a side sectional view of a conventional contact image sensor device, respectively. As shown in the figure, the conventional contact type image sensor device includes a package housing 10 ', a circuit board module 20', an upper cover glass 30 ', an image sensor element 40', and a GRIN imaging optical element (Gradient Reflective Index). 50 'and light emitting element 60'.

The upper cover glass 30 'and the circuit board module 20' are respectively installed at the upper and lower ends of the package housing 10 ', thereby forming upper and lower spaces 100' and 200 '. The image sensor element 40 'is installed on the circuit board module 20' and located in a lower space 200 'of the package housing 10'.
The GRIN imaging optical element 50 'is installed between the upper and lower spaces 100' and 200 'of the package housing 10', and the light emitting element 60 'is installed in the upper space 100'. , Located lateral to the GRIN imaging optical element 50 '. With this configuration, scattered light L2 ′ is generated by emitting a light beam L1 ′ from the light emitting element 60 ′ to the document D, and the scattered light L2 ′ of the document D is generated by the GRIN imaging optical element 50 ′. Can be detected to the image sensor element 40 ', whereby the image of the document D can be detected.

  As can be seen from FIGS. 1 and 2, the GRIN imaging optical element 50 'is an indispensable element in the conventional contact image sensor device. However, by using the GRIN imaging optical element 50 ', the volume of the conventional contact image sensor device becomes enormous, and an assembly error tends to occur during assembly. Further, since the GRIN imaging optical element 50 'is expensive, there is a drawback that the manufacturing cost of the conventional contact image sensor device is increased.

The present inventor proposes the present invention in which the above-mentioned drawbacks are solved by careful research, and the above-mentioned disadvantages can be effectively eliminated by utilizing science, and the design is rational.
An image sensor device using the GRIN imaging optical element is described in, for example, Patent Document 1 (a SELFOC lens array having the same meaning as the GRIN imaging optical element is used as the imaging means).
JP 2003-125182 A

  An object of the present invention is to significantly reduce the manufacturing cost of the entire contact image sensor device by omitting the GRIN imaging optical element, and to increase the volume by using the conventional GRIN imaging optical element. It is an object of the present invention to provide a contact-type image sensor device with a built-in optical element that can solve the problem of assembly errors.

  Further, the present invention absorbs light reflection by the plurality of light shielding elements by installing light shielding elements made of a plurality of non-transmissive materials on both sides of each photosensitive element using coating or other molding methods. It is an object of the present invention to provide a contact type image sensor that can suppress the influence of stray light on a plurality of photosensitive elements and that can suppress the influence of optical crosstalk among the plurality of photosensitive elements. Thereby, the contrast of the image received by the plurality of photosensitive elements can be improved.

In order to achieve the above object, according to the present invention, a contact image sensor device with a built-in optical element of the present invention includes a circuit board module, a light emitting module, and an image sensor module.
The light emitting module is electrically connected and installed on the circuit board module. The image sensor module is electrically connected to the circuit board module and is located on the side of the light emitting module.
In addition, the image sensor module includes a photosensitive element set electrically installed on the circuit board module and a micro condensing element set installed on the photosensitive element set.
As a result, the luminous flux emitted from the light emitting module to the document generates scattered light, and the photosensitive element set of the image sensor module receives the scattered light from the document, thereby detecting the image of the document. .

In order to achieve the above object, the contact image sensor device with a built-in optical element according to the present invention includes a circuit board module, a light emitting module, an image sensor module, and a light shielding module.
The light emitting module is electrically connected and installed on the circuit board module. The image sensor module is electrically connected to the circuit board module and is located on the side of the light emitting module.
The image sensor module further includes a photosensitive element set electrically installed on the circuit board module and a micro condensing element set installed on the photosensitive element set. The photosensitive element set includes a plurality of photosensitive elements. The light shielding module has a plurality of light shielding elements. The plurality of light shielding elements are respectively installed on both sides of each photosensitive element.
As a result, the luminous flux emitted from the light emitting module to the document generates scattered light, and the photosensitive element set of the image sensor module receives the scattered light from the document, thereby detecting the image of the document. .

According to the present invention, by eliminating the use of GRIN imaging optical elements, not only the manufacturing cost of the contact image sensor device as a whole is significantly reduced, but also a plurality of non-transmissive light shielding elements are installed on both sides of each photosensitive element. This suppresses the influence of stray light and light crosstalk on the photosensitive element.
Accordingly, it is possible to improve the contrast of images received by the plurality of photosensitive elements.

  Hereinafter, the features and technical contents of the present invention will be described in detail with reference to the drawings. However, the drawings and the like are for reference and description, and the present invention is not limited thereto.

3 and 4 are a perspective conceptual view and a side conceptual view, respectively, of the first embodiment of the contact image sensor device with a built-in optical element according to the present invention.
As shown in the figure, the present invention is a contact type image sensor device having a built-in optical element, which includes a circuit board module (PCB module) 1, a light emitting module (light emitting module) 2a, and an image sensor module (image sensing module). module) 3 and a protection layer 4.

  The light emitting module 2 a is electrically installed on the circuit board module 1. In the first embodiment of the present invention, the light emitting module 2a is a plurality of light emitting elements 20a arranged in a line. The light emitting module 2a can be selected from fluorescent lamps, electroluminescence, light emitting diodes, and other light emitting devices according to user needs. Moreover, the arrangement | sequence system of the said light emitting module 2a is not limited in this invention, Arbitrary arrangement | sequence methods (for example, 2 rows or 3 rows) and all the arrangement shapes are applicable in this invention.

  The image sensor module 3 is electrically installed on the circuit board module 1 and is located on the side of the light emitting module 2a. The image sensor module 3 includes a light sensing element set 30 that is electrically installed on the circuit board module 1 and a micro light collecting element set (micro) that is installed on the photosensitive element set 30. light condensing element set) 31. In the first embodiment, the micro condensing element set 31 is made of a polymer material.

  The photosensitive element set 30 includes a plurality of photosensitive elements 300, and is an array type contact image sensor (array CIS (Contact Image Sensor)) or a linear contact type image sensor (linear CIS).

  The micro condensing element set 31 includes a plurality of micro condensing elements 310, and each micro condensing element 310 has a plano-convex lens and a lenticular lens (biconvex) according to different design needs. lens) or each micro condensing element 310 may be a spherical lens or an aspheric lens.

  The protective layer 4 is formed on the photosensitive element set 30 and the micro condensing element set 31 so as to protect the photosensitive element set 30 and the micro condensing element set 31. In other words, the protective layer 4 is formed on the image sensor module 3 to protect the image sensor module 3. Further, the protective layer 4 is made of a transmissive material, and examples thereof include a paint, an orderly arranged optical fiber bundle, and a micro channel array (MCA). Its thickness is in the range of 0.1 to 10 mm. Since the image sensor module 3 is protected by the protective layer 4, it can be protected from the outside (for example, scratches, scratches, etc.), and the image sensor quality of the image sensor module 3 can be maintained.

  In such a configuration, the light emitting module 2a emits a light beam L1a to the document D to generate scattered light L2a, and the photosensitive element set 30 of the image sensor module 3 directly scatters from the document D. The image of the document D is detected by receiving the light L2a (different from receiving the light through the conventional GRIN imaging optical element 50 ').

FIG. 5 is a conceptual side view when the micro condensing element set in the first embodiment of the contact-type image sensor device with a built-in optical element according to the present invention is electrically connected to the energy transfer electrode set. is there.
As shown in the figure, the contact-type image sensor device of the first embodiment of the present invention further includes a power transmitting electrode set 5 that is electrically connected to the micro condensing element set 31. The energy transmission electrode set 5 includes a plurality of energy transmission electrodes 50. A pair of energy transfer electrodes 50 are installed on both sides of each micro condensing element 310 and are electrically connected to the power supply P.

  The energy transfer electrode set 5 changes the mirror curvature of the micro light collecting element set 31 by applying a voltage from the power source P to the micro light collecting element set 31 (dotted line in the figure). In other words, each of the pair of energy transfer electrodes 50 changes the mirror curvature of each micro condensing element 310 by the action of thermal expansion and contraction caused by the power supply P applying a voltage to each micro condensing element 310. Let the auto focus function be achieved.

  6 and 7 are a perspective conceptual view and a side conceptual view, respectively, of a second embodiment of the contact-type image sensor device with a built-in optical element according to the present invention. As can be seen from the figure, the second embodiment is different from the first embodiment in that the protective layer 4 of the first embodiment is omitted. The contact-type image sensor device with a built-in optical element according to the second embodiment includes a light emitting module 2b including at least one light emitting element 20b and a light guide element 21b installed on the side of the at least one light emitting element 20b. The light guide element 21 b corresponds to the image sensor module 3.

  In the above configuration, first, the light beam Lb emitted from the light emitting element 20b to the light guide element 21b is transmitted to the document D as the light beam L1b through the light guide element 21b to generate scattered light L2b. Further, when the photosensitive element set 30 of the image sensor module 3 directly receives the scattered light L2b from the document D (different from the conventional way through the GRIN imaging optical element 50 '), Detect images.

8 and 9 are a perspective conceptual view and a side conceptual view, respectively, of a third embodiment of the contact image sensor device with a built-in optical element according to the present invention. As can be seen from the drawing, the third embodiment differs from the first embodiment in the contact-type image sensor device with a built-in optical element of the third embodiment, and further, the light emitting module 2 a and the image sensor module 3. The transparent cover 6 is installed above the screen.
In this configuration, the light beam L1a emitted from the light emitting module 2a to the document D through the transmission cover 6 generates scattered light L2a, and the photosensitive element set 30 of the image sensor module 3 is connected to the transmission cover from the document D. 6, the image of the document D is detected.

10 and 11 are a perspective conceptual view and a side conceptual view, respectively, of a fourth embodiment of the contact image sensor device with a built-in optical element according to the present invention. As shown in the figure, the fourth embodiment differs from the second embodiment in that the light emitting module 2b and the image sensor module 3 are further included in the contact image sensor device with a built-in optical element of the fourth embodiment. The transparent cover 6 is installed above the screen.
With this configuration, the light beam L1b emitted from the light emitting module 2b to the document D through the transmission cover 6 generates scattered light L2b, and further, the photosensitive element set 30 of the image sensor module 3 is transferred from the document D to the transmission cover. 6, the image of the document D is detected.

12 and 13 are a perspective view conceptual diagram of a fifth embodiment of a contact-type image sensor device with a built-in optical element according to the present invention and a 6-6 cross-sectional view of FIG. 12, respectively.
As shown in the figure, the fifth embodiment differs from the first embodiment in that the photosensitive element set 30a is composed of a plurality of photosensitive elements 300a and the plurality of photosensitive elements 300a are different from each other in the fifth embodiment. It is a point that is separated by a predetermined distance. The micro light collecting element set 31a includes a plurality of micro light collecting elements 310a, and the plurality of micro light collecting elements 310a are respectively installed on the plurality of photosensitive elements 300a.

  In the fifth embodiment, the contact image sensor device with a built-in optical element according to the present invention further includes a light shielding module 7 having a plurality of light shielding elements 70. The plurality of light shielding elements 70 are respectively installed on both sides of each photosensitive element 300a. The plurality of light shielding elements 70 are made of a non-transmissive material. The plurality of light shielding elements 70 are respectively installed on both sides of each photosensitive element 300a by coating or an arbitrary molding method. The plurality of light shielding elements 70 absorb light reflection, thereby not only suppressing the influence of stray light on the plurality of photosensitive elements 300a but also suppressing the influence of optical crosstalk between the plurality of photosensitive elements 300a. it can. Accordingly, the contrast of images received by the plurality of photosensitive elements 300a is improved.

As described above, according to the present invention, the conventional GRIN imaging optical element 50 'can be omitted, so that the manufacturing cost of the entire contact image sensor device can be reduced, and the volume of the conventional GRIN imaging optical element 50' can be reduced. The problem of increase and assembly error can be solved.
Further, according to the present invention, in the fifth embodiment, by installing a plurality of non-transmissive light shielding elements 70 on both sides of each photosensitive element 300a, the influence of stray light or light crosstalk on the photosensitive element 300a can be suppressed. The contrast of images received by the plurality of photosensitive elements 300a can be improved.

  The above is merely a better embodiment of the present invention, and the present invention is not limited thereby. Equivalent changes made based on the scope of claims and the description of the present invention are not limited thereto. All modifications are within the scope of the claims of the present invention.

It is a perspective exploded view of a conventional contact image sensor device. It is side surface sectional drawing of the conventional contact-type image sensor apparatus. 1 is a perspective view conceptual diagram of a first embodiment of a contact-type image sensor device with a built-in optical element according to the present invention. 1 is a side conceptual view of a first embodiment of a contact-type image sensor device with a built-in optical element according to the present invention. It is a side surface conceptual diagram in case the micro condensing element set of 1st embodiment of the contact-type image sensor apparatus with a built-in type optical element which concerns on this invention is electrically connected to an energy transmission electrode set. It is a perspective view conceptual diagram of 2nd embodiment of the contact-type image sensor apparatus with a built-in optical element which concerns on this invention. It is a side surface conceptual diagram of 2nd embodiment of the contact-type image sensor apparatus with a built-in optical element which concerns on this invention. It is a perspective view conceptual diagram of 3rd embodiment of the contact-type image sensor apparatus with a built-in optical element which concerns on this invention. It is a side surface conceptual diagram of 3rd embodiment of the contact-type image sensor apparatus with a built-in optical element which concerns on this invention. It is a perspective view conceptual diagram of 4th embodiment of the contact-type image sensor apparatus with a built-in optical element which concerns on this invention. It is a side surface conceptual diagram of 4th embodiment of the contact-type image sensor apparatus with a built-in optical element which concerns on this invention. It is a perspective view conceptual diagram of 5th embodiment of the contact-type image sensor apparatus with a built-in type optical element of this invention. It is 6-6 sectional drawing of FIG.

Explanation of symbols

1 circuit board module 2a light emitting module 2b light emitting module 20a light emitting element 20b light emitting element 21b light guide element 3 image sensor module 3a image sensor module 30 photosensitive element set 30a photosensitive element set 300 photosensitive element 300a photosensitive element 31 micro condensing element set 31a micro Light collecting element set 310 Micro light collecting element 310a Micro light collecting element 4 Protective layer 5 Energy transmission electrode set 50 Energy transmission electrode 6 Transmission cover 7 Light shielding module 70 Light shielding element L1a Light flux Lb, L1b Light flux L2a Scattered light L2b Scattered light D Document P Power supply

Claims (5)

A circuit board module;
A light emitting module that is electrically connected and installed on the circuit board module;
A photosensitive element set that is electrically connected and installed on the side of the light emitting module on the circuit board module, and a photosensitive element set that is electrically connected and installed on the circuit board module and the photosensitive element set. An image sensor module having a micro condensing element set;
With
A built-in light beam emitted from the light emitting module to a document generates scattered light, and a photosensitive element set of the image sensor module receives the scattered light from the document and detects an image of the document. -Type image sensor device with a mold optical element.   2. The contact image sensor device with built-in optical elements according to claim 1, wherein the photosensitive element set is one of an array contact image sensor and a linear contact image sensor.   The micro condensing element set includes a plurality of micro condensing elements, and each of the plurality of micro condensing elements is a plano-convex lens, a lenticular lens, a spherical lens, or an aspheric lens. 2. A contact-type image sensor device with a built-in optical element according to 1.   Furthermore, an energy transmission electrode set electrically connected to the micro light collecting element set is provided, and a mirror surface curvature of the micro light collecting element set is changed by applying a voltage to the micro light collecting element set by a power source. The contact image sensor device with a built-in optical element according to claim 1.   2. The contact image sensor device with built-in optical element according to claim 1, further comprising a light shielding module, wherein the light shielding module has a plurality of light shielding elements installed on both sides of each photosensitive element.

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