TWI812495B - Image sensor chip light source machine module structure - Google Patents

Image sensor chip light source machine module structure Download PDF

Info

Publication number
TWI812495B
TWI812495B TW111137718A TW111137718A TWI812495B TW I812495 B TWI812495 B TW I812495B TW 111137718 A TW111137718 A TW 111137718A TW 111137718 A TW111137718 A TW 111137718A TW I812495 B TWI812495 B TW I812495B
Authority
TW
Taiwan
Prior art keywords
light
light source
emitting
several
module structure
Prior art date
Application number
TW111137718A
Other languages
Chinese (zh)
Other versions
TW202416728A (en
Inventor
黃鄭隆
Original Assignee
松翰股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松翰股份有限公司 filed Critical 松翰股份有限公司
Priority to TW111137718A priority Critical patent/TWI812495B/en
Priority to CN202211303920.1A priority patent/CN117894799A/en
Application granted granted Critical
Publication of TWI812495B publication Critical patent/TWI812495B/en
Publication of TW202416728A publication Critical patent/TW202416728A/en

Links

Abstract

一種影像感測晶片光源機模組架構,包括一載板、數個發光元件、數個導光柱、數個光學透鏡及固定組件,數個該發光元件採用陣列分佈於該載板上,該載板為電路板且控制數個該發光元件發光,該發光元件為能產生四種光線且混光為一光源的LED燈珠,四種光線分別為藍白光、藍母綠光、綠白光、以及紅白光,該固定組件將該載板、數個導光柱及光學透鏡依序固定在一起,且使該發光元件對應著該導光柱及該光學透鏡,藉此該發光元件產生的四種光線經混光後輸出,經該導光柱多次反射、漫射混光形成全光譜光源,最後經該光學透鏡折射輸出均勻分佈的平行光源。An image sensing chip light source machine module structure includes a carrier board, several light-emitting elements, several light guide columns, several optical lenses and fixed components. Several of the light-emitting elements are distributed on the carrier board in an array. The carrier board The board is a circuit board and controls several light-emitting elements to emit light. The light-emitting elements are LED lamp beads that can produce four kinds of light and mix the light into one light source. The four kinds of light are blue-white light, blue-green light, green-white light, and Red and white light, the fixing component fixes the carrier plate, several light guide columns and optical lenses together in sequence, and makes the light-emitting element correspond to the light guide column and the optical lens, whereby the four kinds of light generated by the light-emitting element pass through After mixing, the light is output, reflected multiple times by the light guide column, diffused and mixed to form a full spectrum light source, and finally refracted by the optical lens to output a uniformly distributed parallel light source.

Description

影像感測晶片光源機模組架構Image sensing chip light source module architecture

本發明為一種光源機模組架構的技術領域,尤其指一種影像感測晶片光源機模組架構。The present invention is in the technical field of a light source module architecture, and in particular, to an image sensing chip light source module architecture.

影像感測器(Image Sensor)除了电荷耦合器件(Charge-coupled Device,CCD)外,互補式金屬氧化物半導體(Complementary Metal-Oxide-Semiconductor,CMOS)目前也隨著半導體製程技術的逐漸成熟,良率不斷地提昇,CMOS以其優秀的可靠性、隨機視窗讀取能力、抗輻射能力、非破壞性資料讀取方式,讓業者逐漸採用CMOS替代CCD。CCD感測器與CMOS感測器都由矽晶圓製造而成,能對可見光及近紅外線光譜的感應,以將影像入射光(光)轉換成電壓(電),晶片在組裝成產品前需要採用均勻光源進行測試,以確保晶片在出廠前的光學性能符合設計要求。In addition to Charge-coupled Device (CCD), Image Sensor (Image Sensor), Complementary Metal-Oxide-Semiconductor (CMOS) are also currently maturing with the gradual maturity of semiconductor process technology. The efficiency continues to increase. CMOS, with its excellent reliability, random window reading ability, radiation resistance, and non-destructive data reading method, has gradually led the industry to replace CCD with CMOS. Both CCD sensors and CMOS sensors are made of silicon wafers and can sense visible light and near-infrared spectrum to convert the incident light (light) of the image into voltage (electricity). The wafer needs to be assembled before being assembled into a product. A uniform light source is used for testing to ensure that the optical performance of the wafer meets the design requirements before leaving the factory.

進行影像感測器檢測時,所提供的均勻光源,最佳標準光源為仿太陽光(或日光),顯色指數(Color Rendering Index,CRI)值為 100,如此能讓影像感測器對應光源產生正確的反應訊號,以利檢測作業的進行。但是一般若是採用發光二極體(LED)作為光源,通常無法達到CRI 100的要求,因此輔助手段是利用電腦軟體修改相關參數,盡量符合測試需求,如此容易讓影像影測器在檢測時,若出現瑕疵訊號,有時無法確認是影像感測器本身問題,還是因光源問題造成影像感測器失真,為此本發明提供一種以LED為光源的影像感測晶片光源機模組架構。When performing image sensor testing, the uniform light source provided, the best standard light source is simulated sunlight (or daylight), and the color rendering index (Color Rendering Index, CRI) value is 100, which allows the image sensor to correspond to the light source Generate correct response signals to facilitate the detection operation. However, if light-emitting diodes (LEDs) are generally used as light sources, they usually cannot meet the requirements of CRI 100. Therefore, the auxiliary method is to use computer software to modify relevant parameters to meet the test requirements as much as possible. This makes it easier for the image detector to detect if When a defective signal occurs, it is sometimes impossible to determine whether it is a problem with the image sensor itself or a problem with the light source that causes image sensor distortion. For this reason, the present invention provides an image sensing chip light source module structure using LED as the light source.

本發明之主要目的係提供一種影像感測晶片光源機模組架構,雖然是採用LED作為光源,但是將四種不同顏色的光線,但利用多次混光設計,獲得全光譜且分佈均勻的光源,滿足影像感測晶片測試所需。The main purpose of the present invention is to provide an image sensing chip light source machine module structure. Although LED is used as the light source, four different colors of light are used to obtain a full spectrum and uniformly distributed light source using multiple light mixing designs. , to meet the needs of image sensing chip testing.

為實現前述目的,本發明採用了如下技術方案:In order to achieve the aforementioned objectives, the present invention adopts the following technical solutions:

本發明為一種影像感測晶片光源機模組架構,包括一載板、數個發光元件、數個導光柱、數個光學透鏡及固定組件,數個該發光元件採用陣列分佈於該載板上,該載板為電路板且控制數個該發光元件發光,該發光元件能產生四種光線且混光為一光源的LED燈珠,四種光線分別為藍白光、藍母綠光、綠白光、以及紅白光,該固定組件將該載板、數個導光柱及光學透鏡依序固定在一起,且使每一個該發光元件對應著一個該導光柱及該光學透鏡。藉此數個該發光元件產生的四種光線先經混光後射出,經該導光柱多次反射、漫射混光形成均勻的全光譜光源,最後經該光學透鏡折射角度輸出均勻分佈的平行光源。The invention is an image sensing chip light source machine module structure, which includes a carrier board, several light-emitting elements, several light guide pillars, several optical lenses and fixed components. Several of the light-emitting elements are distributed on the carrier board in an array. , the carrier board is a circuit board and controls several light-emitting elements to emit light. The light-emitting elements can produce four kinds of light and mix them into LED lamp beads as a light source. The four kinds of light are blue-white light, blue-green light, and green-white light. , and red and white light. The fixing component fixes the carrier plate, several light guide columns and optical lenses together in sequence, and makes each light-emitting element correspond to one of the light guide columns and the optical lens. In this way, the four kinds of light generated by several light-emitting elements are first mixed and then emitted. They are reflected multiple times by the light guide column, diffused and mixed to form a uniform full-spectrum light source, and finally are refracted by the optical lens to output uniformly distributed parallel light. light source.

作為較佳優選實施方案之一,該發光元件包括光源晶粒、霧面膜及出光透鏡,該光源晶粒設有四個發光區域,四個發光區域分別能產生四種不同的光線,分別為藍白光、藍母綠光、綠白光以及紅白光,該霧面膜設置於數個該發光區域上,使四種光線經初步的混光,該出光透鏡為一凸透鏡且具有一霧面的出光面,該出光透鏡內部具有一容置空間,使該霧面膜及該發光區域皆密閉該容置空間中。As one of the better preferred embodiments, the light-emitting element includes a light source chip, a fog mask and a light-emitting lens. The light source chip is provided with four light-emitting areas. The four light-emitting areas can produce four different light rays, namely blue. White light, turquoise light, green-white light and red-white light, the fog mask is arranged on several of the light-emitting areas, so that the four kinds of light are initially mixed. The light-emitting lens is a convex lens and has a matte light-emitting surface. There is an accommodating space inside the light-emitting lens, so that the fog mask and the light-emitting area are sealed in the accommodating space.

作為較佳優選實施方案之一,該出光透鏡為限制出光角度於60度內的光學透鏡。As one of the better preferred embodiments, the light-emitting lens is an optical lens that limits the light-emitting angle to 60 degrees.

作為較佳優選實施方案之一,該霧面膜的透光率為50%~70%,霧度為60%~80%。As one of the better preferred embodiments, the light transmittance of the matte mask is 50% to 70%, and the haze is 60% to 80%.

作為較佳優選實施方案之一,該藍白光的色溫為96,000K~12,000K,該藍母綠光的色溫為4,000K~5,000K,該綠白光的色溫為5,000K~6,000K,該紅白光的色溫為500K~2,000K。As one of the better preferred embodiments, the color temperature of the blue-white light is 96,000K~12,000K, the color temperature of the blue-green light is 4,000K~5,000K, the color temperature of the green-white light is 5,000K~6,000K, and the red-white light The color temperature is 500K~2,000K.

作為較佳優選實施方案之一,該光學透鏡為凸透鏡,為限制出光角度於10度內的石英透鏡。As one of the better preferred embodiments, the optical lens is a convex lens and a quartz lens that limits the light emission angle to within 10 degrees.

作為較佳優選實施方案之一,該導光柱周圍四個垂直面另設有反射鏡面,該反射鏡面以噴塗鏡面銀的材料或直接黏貼全反射反光片所構成。As one of the preferred embodiments, the four vertical surfaces around the light guide column are additionally provided with reflective mirror surfaces. The reflective mirror surfaces are made of materials sprayed with mirror silver or directly pasted with total reflection reflective sheets.

作為較佳優選實施方案之一,該固定組件包括第一格子板、第二格子板、第三格子板,該第一格子板、該第二格子板及該第三格子板皆為數目相同的方型陣列的格子狀板材,該第一格子板及該第二格子板用於將該光學透鏡邊緣固定於兩者之間,該第二格子板及第三格子板將該導光柱固定於兩者之間,該載板則固定於該第三格子板底部,且在每個格子區域由一個該發光元件對應著該導光柱及該光學透鏡。As one of the better preferred embodiments, the fixing component includes a first grid plate, a second grid plate, and a third grid plate, and the first grid plate, the second grid plate, and the third grid plate are all of the same number. A square array of grid-like plates. The first grid plate and the second grid plate are used to fix the edge of the optical lens between them. The second grid plate and the third grid plate fix the light guide column on both sides. In between, the carrier plate is fixed on the bottom of the third grid plate, and in each grid area, one of the light-emitting elements corresponds to the light guide column and the optical lens.

與現有技術相比,本發明影像感測晶片光源機模組架構,以能產生四種光線且混光為一光源的LED燈珠作為發光元件,並由藍白光、藍母綠光、綠白光以及紅白光四種光線混光後,再經該導光柱多次反射、折射、漫反射混光,之後由該光學透鏡折射輸出,實現須全光譜光源且均勻照明之作為測試光源的目的,滿足影像感測晶片的測試要求。Compared with the existing technology, the image sensing chip light source machine module structure of the present invention uses LED lamp beads that can produce four kinds of light and mix the light into one light source as the light-emitting element, and consists of blue-white light, blue-emerald green light, and green-white light. After mixing the four kinds of light, red and white light, it is reflected, refracted and diffusely reflected multiple times by the light guide column, and then refracted and output by the optical lens, achieving the purpose of using a full-spectrum light source and uniform illumination as a test light source to meet the requirements Testing requirements for image sensing chips.

下面將結合具體實施例和附圖,對本發明的技術方案進行清楚、完整地描述。需要說明的是,當元件被稱為「安裝於或固定於」另一個元件,意指它可以直接在另一個元件上或者也可以存在居中的元件。當一個元件被認為是「連接」另一個元件,意指它可以是直接連接到另一個元件或者可能同時存在居中元件。在所示出的實施例中,方向表示上、下、左、右、前和後等是相對的,用於解釋本案中不同部件的結構和運動是相對的。當部件處於圖中所示的位置時,這些表示是恰當的。但是,如果元件位置的說明發生變化,那麼認為這些表示也將相應地發生變化。The technical solution of the present invention will be clearly and completely described below with reference to specific embodiments and drawings. It should be noted that when an element is referred to as being "mounted or secured to" another element, it means that it can be directly on the other element or intervening elements may also be present. When an element is said to be "connected" to another element, this means that it can be directly connected to the other element or that intervening elements may also be present. In the illustrated embodiment, directions indicating up, down, left, right, front and back, etc. are relative and are used to explain that the structure and movement of different components in this case are relative. These representations are appropriate when the parts are in the position shown in the figures. However, if the description of a component's location changes, it is assumed that these representations will change accordingly.

除非另有定義,本文所使用的所有技術和科學術語與屬於本發明技術領域的技術人員通常理解的含義相同。本文中所使用的術語只是為了描述具體實施例的目的,不是旨在限制本發明。本文所使用的術語「和/或」包括一個或多個相關的所列項目的任意的和所有的組合。Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein is for the purpose of describing specific embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

如圖1、圖2及圖3所示,為本發明之立體圖、分解圖及剖面圖。本發明影像感測晶片光源機模組架構包括一載板1、數個發光元件2、數個導光柱3、數個光學透鏡4及固定組件5,數個該發光元件2以陣列方式分佈於該載板1上,該載板1為電路板,用以控制數個該發光元件2發光。該發光元件2為一種能產生四種光線且混光為一光源的LED燈珠,四種光線分別為藍白光、藍母綠光、綠白光、以及紅白光,該固定組件5用以將該載板1、數個導光柱3及光學透鏡4依序固定在一起,讓每一個該發光元件2對應著一個該導光柱3及一個該光學透鏡4。As shown in Figures 1, 2 and 3, they are perspective views, exploded views and cross-sectional views of the present invention. The image sensing chip light source machine module structure of the present invention includes a carrier board 1, a plurality of light-emitting elements 2, a number of light guide columns 3, a number of optical lenses 4 and a fixed component 5. The plurality of light-emitting elements 2 are distributed in an array. On the carrier board 1, the carrier board 1 is a circuit board for controlling a plurality of the light-emitting elements 2 to emit light. The light-emitting element 2 is an LED lamp bead that can produce four kinds of light and mix the light into one light source. The four kinds of light are blue and white light, blue and green light, green and white light, and red and white light. The fixing component 5 is used to attach the light to the light source. The carrier board 1 , several light guide columns 3 and optical lenses 4 are fixed together in sequence, so that each light-emitting element 2 corresponds to one light guide column 3 and one optical lens 4 .

如圖4所示,本發明該發光元件2產生的四種光線先經混光後射出,經該導光柱3多次反射、反覆漫反射混光成均勻光源,最後經該光學透鏡4限制折射角度輸出均勻分佈的平行光源,此平行光源為一全光譜的光源,顯色指數CRI 值至少達90以上。As shown in Figure 4, the four kinds of light generated by the light-emitting element 2 of the present invention are first mixed and then emitted. They are reflected multiple times by the light guide column 3, repeatedly diffusely reflected and mixed into a uniform light source, and finally are refracted by the optical lens 4 to limit the refraction. The angle outputs a uniformly distributed parallel light source. This parallel light source is a full spectrum light source with a color rendering index CRI value of at least 90.

接著就各構件的結構作一詳細的說明:Next, a detailed description of the structure of each component is given:

該載板1為一電路板,用以承載數個發光元件2,也可設有數個陶瓷散熱片11承載該發光元件2,以利散熱。數個該發光元件2以方型陣列分佈,透過電路板外接的電源及控制器,精確地控制該發光元件2的光線亮度及顏色。The carrier board 1 is a circuit board for carrying several light-emitting components 2. It may also be provided with several ceramic heat sinks 11 to carry the light-emitting components 2 to facilitate heat dissipation. Several of the light-emitting elements 2 are distributed in a square array, and the brightness and color of the light-emitting elements 2 are accurately controlled through the power supply and controller external to the circuit board.

如圖5a及圖5b所示,該發光元件2能產生四種光線且混光為一光源的LED燈珠,為達良好的混光效果,本發明結構中另有著不同的設計,該發光元件2包括光源晶粒21、霧面膜22及出光透鏡23,該光源晶粒21具有四個發光區域211,四個發光區域211配合晶粒及以不同的螢光鍍膜能產生四種不同的光線,分別為藍白光、藍母綠光、綠白光以及紅白光,如圖6所示,該藍白光212的色溫為9,000K~12,000K,主峰波長值介於459~499nm,在本實施例主峰波長為479nm,為偏藍的白光。該藍母綠光213色溫為4,000K~5,000K,主峰波長值介於455~495nm,在本實施例主峰波長為475nm,為介於藍錄的白光。該綠白光214的色溫為5,000K~6,000K,主峰波長值介於524~564nm,在本實施例主峰波長為544nm,為偏綠的日光。該紅白光215的色溫為500K~2,000K,主峰波長值介於600~640nm,在本實施例主峰波長為620nm,為偏紅的白光。該霧面膜22設置於該光源晶粒21的數個該發光區域211上,使四種光線經初步混光形成一光源,該霧面膜22的透光率為50%~70%,霧度60%~80%。該出光透鏡23為一凸透鏡,為能限制出光角度於60度內的光學透鏡,該出光透鏡23內部具有一容置空間231,使該霧面膜22及該光源晶粒21的該發光區域211皆密閉該容置空間231中,該出光透鏡23外表面為出光面232,該出光面232為一霧面,是以蝕刻或噴砂處理形成霧面。前述四種光線經該霧面膜22混光後,先經該出光透鏡23折射後限縮了出光角度,最後經霧面的該出光面232再次混光,如圖7所示,形成均勻的全光譜光源。As shown in Figure 5a and Figure 5b, the light-emitting element 2 can produce four kinds of light and mix the light into an LED lamp bead as a light source. In order to achieve a good light mixing effect, the structure of the present invention has different designs. The light-emitting element 2 2 includes a light source chip 21, a fog mask 22 and a light-emitting lens 23. The light source chip 21 has four light-emitting areas 211. The four light-emitting areas 211 can produce four different lights with the chip and different fluorescent coatings. They are blue-white light, blue-green light, green-white light and red-white light respectively. As shown in Figure 6, the color temperature of the blue-white light 212 is 9,000K~12,000K, and the main peak wavelength is between 459~499nm. In this embodiment, the main peak wavelength It is 479nm, which is bluish white light. The color temperature of the blue-green light 213 is 4,000K~5,000K, and the main peak wavelength is between 455~495nm. In this embodiment, the main peak wavelength is 475nm, which is white light between blue and blue. The color temperature of the green-white light 214 is 5,000K~6,000K, and the main peak wavelength is between 524~564nm. In this embodiment, the main peak wavelength is 544nm, which is greenish sunlight. The color temperature of the red and white light 215 is 500K~2,000K, and the main peak wavelength is between 600~640nm. In this embodiment, the main peak wavelength is 620nm, which is reddish white light. The fog mask 22 is disposed on a plurality of the light-emitting areas 211 of the light source chip 21 to allow four kinds of light to be initially mixed to form a light source. The fog mask 22 has a light transmittance of 50% to 70% and a haze of 60 %~80%. The light-emitting lens 23 is a convex lens, which is an optical lens that can limit the light-emitting angle within 60 degrees. The light-emitting lens 23 has an accommodating space 231 inside, so that the fog mask 22 and the light-emitting area 211 of the light source chip 21 are both In the sealed accommodating space 231, the outer surface of the light-emitting lens 23 is a light-emitting surface 232, and the light-emitting surface 232 is a matte surface, which is formed by etching or sandblasting. After the aforementioned four kinds of light are mixed by the fog mask 22, they are first refracted by the light-emitting lens 23 and then the light-emitting angle is limited. Finally, they are mixed again by the light-emitting surface 232 of the matte surface, as shown in Figure 7, forming a uniform overall light. Spectral light source.

該導光柱3為具有全反射的導光材料,當光線由一端面進入後,因光線無法穿透壁面進入介質不同的空氣中,因此只能不斷地經壁面反射且朝另一端前進,本發明藉由該導光柱3讓光線內部不斷反射、漫反射使混光效果更佳,但因應光線種類或需求,本實施例中該導光柱3的長度介於10mm~100mm。另外本發明在該導光柱3周圍四個垂直面設有反射鏡面,該反射鏡面可為噴塗鏡面銀的材料或直接黏貼全反射反光片,達到讓光源全反射送到該光學透鏡4。The light guide column 3 is a light guide material with total reflection. When light enters from one end surface, since the light cannot penetrate the wall surface and enter the air with a different medium, it can only continue to be reflected by the wall surface and move toward the other end. The present invention The light guide column 3 allows internal reflection and diffuse reflection of light to achieve a better light mixing effect. However, depending on the type of light or requirements, the length of the light guide column 3 in this embodiment is between 10 mm and 100 mm. In addition, the present invention is provided with reflective mirror surfaces on four vertical surfaces around the light guide column 3. The reflective mirror surfaces can be made of materials sprayed with mirror silver or directly pasted with total reflection reflective sheets to achieve total reflection of the light source and send it to the optical lens 4.

該光學透鏡4為凸透鏡,為能限制出光角度於10度內的石英光學透鏡,本實施例中是該光學透鏡4的限制出光角度為7度。如此經導光柱3輸出的光源,經該光學透鏡4限制角度折射後,將形成分佈均勻的平行光輸出,以滿足本發明作為影像感測晶片測試光源的要求。The optical lens 4 is a convex lens and is a quartz optical lens that can limit the light emission angle to 10 degrees. In this embodiment, the limited light emission angle of the optical lens 4 is 7 degrees. In this way, the light source output through the light guide column 3 will form uniformly distributed parallel light output after being refracted by the optical lens 4 to limit the angle, thereby meeting the requirements of the present invention as a light source for image sensing chip testing.

該固定組件5是用於將該載板1、數個導光柱3及光學透鏡4依序固定在一起,讓每一個發光元件2、與相對應的該導光柱3及該光學透鏡4依序在同一光軸上。該固定組件5的結構可為單件或多件式,並不以此為限,本發明僅提供其中一種作說明。在本實施例中,該固定組件5包括第一格子板51、第二格子板52、第三格子板53,前述格子板皆為正方型陣列分佈,其中該第一格子板51及第二格子板52用於將該光學透鏡4邊緣固定於兩者之間,該第二格子板52及第三格子板53將該導光柱3固定於兩者之間,該載板1則固定於該第三格子板53底部,各構件之間再以螺絲或黏膠加以鎖固,即可固定整體的結構。The fixing component 5 is used to fix the carrier plate 1, several light guide columns 3 and optical lenses 4 together in sequence, so that each light-emitting element 2, the corresponding light guide column 3 and the optical lens 4 can be sequentially fixed. on the same optical axis. The structure of the fixing component 5 can be single-piece or multi-piece, but is not limited thereto. The present invention only provides one of them for illustration. In this embodiment, the fixing component 5 includes a first grid plate 51, a second grid plate 52, and a third grid plate 53. The aforementioned grid plates are all distributed in a square array, wherein the first grid plate 51 and the second grid plate The plate 52 is used to fix the edge of the optical lens 4 between them, the second grid plate 52 and the third grid plate 53 fix the light guide column 3 between them, and the carrier plate 1 is fixed on the third At the bottom of the three grid plates 53, each component is locked with screws or glue to fix the overall structure.

綜合以上所述,本發明影像感測晶片光源機模組架構,是利用該發光元件2產生四種光線並混光而成一光源,四種光線分別為藍白光、藍母綠光、綠白光以及紅白光之後,再經導光柱3多次反射、折射、漫反射混光,如圖7所示,實現了全光譜光源和均勻照明的目的,最後輸出光源色溫於4500~5000K。最後再經限制出光角度於10度內的該光學透鏡4,形成均勻分佈的平行光源,平行光源顯色指數CRI 值達95以上,滿足作為影像感測晶片之光源的要求。Based on the above, the image sensing chip light source machine module structure of the present invention uses the light-emitting element 2 to generate four kinds of light and mix the light to form a light source. The four kinds of light are blue-white light, turquoise-green light, green-white light and After the red and white light is mixed with multiple reflections, refractions, and diffuse reflections through the light guide 3, as shown in Figure 7, the purpose of full-spectrum light source and uniform illumination is achieved, and the final output light source color temperature is 4500~5000K. Finally, the optical lens 4 limits the light emission angle to within 10 degrees to form a uniformly distributed parallel light source. The color rendering index CRI value of the parallel light source reaches more than 95, which meets the requirements of being a light source for an image sensing chip.

以上所述者,僅為本發明之較佳實施例而已,並非用來限定本發明實施例之範圍。即凡依本發明申請專利範圍所作的均等變化及修飾,皆為本發明之專利範圍所涵蓋。The above are only preferred embodiments of the present invention and are not intended to limit the scope of the embodiments of the present invention. That is to say, all equivalent changes and modifications made in accordance with the patentable scope of the present invention are covered by the patentable scope of the present invention.

1:載板1: Carrier board

11:陶瓷散熱片11: Ceramic heat sink

2:發光元件2:Light-emitting components

21:光源晶粒21:Light source crystal

211:發光區域211: Luminous area

212:藍白光212: blue and white light

213:藍母綠光213: Blue emerald light

214:綠白光214:Green white light

215:紅白光215: red and white light

22:霧面膜22: Mist mask

23:出光透鏡23:Light exit lens

231:容置空間231: Accommodation space

232:出光面232: Shiny surface

3:導光柱3:Light guide column

4:光學透鏡4: Optical lens

5:固定組件5: Fixed components

51:第一格子板51:The first grid plate

52:第二格子板52:Second grid plate

53:第三格子板53:The third grid plate

圖1為本發明之立體圖。Figure 1 is a perspective view of the present invention.

圖2為本發明之分解圖。Figure 2 is an exploded view of the present invention.

圖3為本發明之剖面圖。Figure 3 is a cross-sectional view of the present invention.

圖4為本發明之光線路徑圖。Figure 4 is a light path diagram of the present invention.

圖5a為本發明單一發光元件的剖面放大圖。Figure 5a is an enlarged cross-sectional view of a single light-emitting element of the present invention.

圖5b為本發明單一發光晶粒的俯視圖。Figure 5b is a top view of a single luminescent die of the present invention.

圖6為本發明發光元件所產生四種不同光線的光譜圖。Figure 6 is a spectrum diagram of four different light rays generated by the light-emitting element of the present invention.

圖7為本發明混光後形成的光源的光譜圖。Figure 7 is a spectrum diagram of the light source formed after light mixing according to the present invention.

1:載板 1: Carrier board

11:陶瓷散熱片 11: Ceramic heat sink

2:發光元件 2:Light-emitting components

3:導光柱 3:Light guide column

4:光學透鏡 4: Optical lens

5:固定組件 5: Fixed components

51:第一格子板 51:The first grid plate

52:第二格子板 52:Second grid plate

53:第三格子板 53:The third grid plate

Claims (10)

一種影像感測晶片光源機模組架構,包括載板、數個發光元件、數個導光柱、數個光學透鏡及固定組件,數個該發光元件採用陣列分佈於該載板上,該載板為電路板且控制數個該發光元件發光,該發光元件為能產生四種光線且混光為一光源的LED燈珠,四種光線分別為藍白光、藍母綠光、綠白光、以及紅白光,該固定組件將該載板、數個導光柱及光學透鏡依序固定在一起,且使每一個該發光元件對應著一個該導光柱及該光學透鏡,其中該發光元件包括光源晶粒、霧面膜及出光透鏡,該光源晶粒設有四個發光區域,四個發光區域分別能產生四種不同的光線,分別為藍白光、藍母綠光、綠白光以及紅白光,該霧面膜設置於數個該發光區域上,使四種光線經初步的混光,該出光透鏡為凸透鏡且具有霧面的出光面,該出光透鏡內部具有一容置空間,使該霧面膜及該發光區域皆密閉該容置空間中。 An image sensing chip light source machine module structure, including a carrier board, several light-emitting elements, several light guide columns, several optical lenses and fixed components. Several of the light-emitting elements are distributed on the carrier board in an array. The carrier board It is a circuit board and controls several light-emitting elements to emit light. The light-emitting elements are LED lamp beads that can produce four kinds of light and mix the light into one light source. The four kinds of light are blue and white light, blue and emerald green light, green and white light, and red and white light. Light, the fixing component fixes the carrier plate, several light guide posts and optical lenses together in sequence, and makes each light-emitting element correspond to one of the light guide posts and the optical lens, wherein the light-emitting element includes a light source chip, Mist mask and light-emitting lens. The light source chip is equipped with four light-emitting areas. The four light-emitting areas can produce four different kinds of light, namely blue-white light, blue-green light, green-white light and red-white light. The fog mask is set The four light rays are preliminarily mixed on several of the light-emitting areas. The light-emitting lens is a convex lens and has a matte light-emitting surface. There is an accommodation space inside the light-emitting lens, so that the matte mask and the light-emitting area are both Seal the containment space. 如請求項1所述之影像感測晶片光源機模組架構,該出光透鏡為限制出光角度於60度內的光學透鏡。 For the image sensing chip light source module structure described in claim 1, the light emission lens is an optical lens that limits the light emission angle to within 60 degrees. 如請求項1所述之影像感測晶片光源機模組架構,該霧面膜的透光率為50%-70%,霧度為60%-80%。 According to the image sensing chip light source module structure described in claim 1, the light transmittance of the fog mask is 50%-70%, and the haze is 60%-80%. 如請求項1所述之影像感測晶片光源機模組架構,該藍白光的色溫為9,000K~12,000K。 According to the image sensing chip light source module structure described in claim 1, the color temperature of the blue-white light is 9,000K~12,000K. 如請求項1所述之影像感測晶片光源機模組架構,該藍母綠光的色溫為4,000K~5,000K。 According to the image sensing chip light source module structure described in claim 1, the color temperature of the blue emerald light is 4,000K~5,000K. 如請求項1所述之影像感測晶片光源機模組架構,該綠白光的色溫為5,000K~6,000K。 For the image sensing chip light source module structure described in claim 1, the color temperature of the green-white light is 5,000K~6,000K. 如請求項1所述之影像感測晶片光源機模組架構,該紅白光的色溫為500K~2,000K。 For the image sensing chip light source module structure described in claim 1, the color temperature of the red and white light is 500K~2,000K. 如請求項1所述之影像感測晶片光源機模組架構,該光學透鏡為凸透鏡,為限制出光角度於10度內的石英透鏡。 As for the image sensing chip light source module structure described in claim 1, the optical lens is a convex lens and is a quartz lens that limits the light emission angle to within 10 degrees. 如請求項1所述之影像感測晶片光源機模組架構,該導光柱周圍四個垂直面另設有反射鏡面,該反射鏡面以噴塗鏡面銀的材料或直接黏貼全反射反光片所構成。 According to the image sensing chip light source module structure described in claim 1, the four vertical surfaces around the light guide column are also provided with reflective mirrors. The reflective mirrors are made of materials sprayed with mirror silver or directly pasted with total reflection reflective sheets. 如請求項1所述之影像感測晶片光源機模組架構,該固定組件包括第一格子板、第二格子板、第三格子板,該第一格子板、該第二格子板及該第三格子板皆為數目相同的方型陣列的格子狀板材,該第一格子板及該第二格子板用於將該光學透鏡邊緣固定於兩者之間,該第二格子板及第三格子板將該導光柱固定於兩者之間,該載板則固定於該第三格子板底部,且在每個格子區域由一個該發光元件對應著該導光柱及該光學透鏡。 As for the image sensing chip light source module structure described in claim 1, the fixed component includes a first grid plate, a second grid plate, a third grid plate, the first grid plate, the second grid plate and the third grid plate. The three grid plates are all grid-shaped plates with the same number of square arrays. The first grid plate and the second grid plate are used to fix the edge of the optical lens between them. The second grid plate and the third grid plate The plate fixes the light guide column between the two, the carrier plate is fixed on the bottom of the third grid plate, and in each grid area, one of the light-emitting elements corresponds to the light guide column and the optical lens.
TW111137718A 2022-10-04 2022-10-04 Image sensor chip light source machine module structure TWI812495B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW111137718A TWI812495B (en) 2022-10-04 2022-10-04 Image sensor chip light source machine module structure
CN202211303920.1A CN117894799A (en) 2022-10-04 2022-10-24 Image sensing chip light source machine module structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111137718A TWI812495B (en) 2022-10-04 2022-10-04 Image sensor chip light source machine module structure

Publications (2)

Publication Number Publication Date
TWI812495B true TWI812495B (en) 2023-08-11
TW202416728A TW202416728A (en) 2024-04-16

Family

ID=88586029

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111137718A TWI812495B (en) 2022-10-04 2022-10-04 Image sensor chip light source machine module structure

Country Status (2)

Country Link
CN (1) CN117894799A (en)
TW (1) TWI812495B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM329175U (en) * 2007-08-03 2008-03-21 Logistic Technology Co Ltd Apparatus of image formation
TW200937950A (en) * 2008-02-25 2009-09-01 Lite On Semiconductor Corp CIS (Contact Image Sensor) having embedded optical elements
CN102812395A (en) * 2010-02-24 2012-12-05 夏普株式会社 Display device and television receiver
CN109709743A (en) * 2019-01-09 2019-05-03 深圳市光鉴科技有限公司 A kind of structured light projection instrument and 3D camera

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM329175U (en) * 2007-08-03 2008-03-21 Logistic Technology Co Ltd Apparatus of image formation
TW200937950A (en) * 2008-02-25 2009-09-01 Lite On Semiconductor Corp CIS (Contact Image Sensor) having embedded optical elements
CN102812395A (en) * 2010-02-24 2012-12-05 夏普株式会社 Display device and television receiver
CN109709743A (en) * 2019-01-09 2019-05-03 深圳市光鉴科技有限公司 A kind of structured light projection instrument and 3D camera

Also Published As

Publication number Publication date
CN117894799A (en) 2024-04-16

Similar Documents

Publication Publication Date Title
US8247959B2 (en) Solid state illumination system with improved color quality
CN102859257B (en) Compact mixed light LED light engine and narrow beam white led lamps and use its high CRI
US8998444B2 (en) Solid state lighting devices including light mixtures
EP2304309B1 (en) Solid state lighting devices including light mixtures
US10295153B2 (en) Optical system for producing uniform illumination
CN104302969B (en) The improved colimated light system for LED illumination device
EP2089656B2 (en) Methods and apparatus for providing uniform projection lighting
US7821194B2 (en) Solid state lighting devices including light mixtures
US7973917B2 (en) Method using concentrator for measuring luminous flux of LED
US20130003363A1 (en) Reverse total internal reflection features in linear profile for lighting applications
US20110037409A1 (en) High efficiency lighting device including one or more saturated light emitters, and method of lighting
TW200425548A (en) Light-source
US20090225529A1 (en) Spherically emitting remote phosphor
CN104995450A (en) Automated color tuning of an LED based illumination device
WO2020125263A1 (en) Led packaging surface shielding structure
KR20170025287A (en) LED module having lighting color mixing and blue light blocking functions and lighting apparatus having the same
TWI812495B (en) Image sensor chip light source machine module structure
CN204067435U (en) A kind of LED device and light source module and light source module
JP2013045530A (en) Light emitting device and lighting fixture
US7201494B2 (en) Lighting system of adjustable color temperature
KR100574628B1 (en) LED module using Color film
Moreno et al. Color uniformity of the light distribution from several cluster configurations of multicolor LEDs
CN208538902U (en) LED package and high transparency LED light
CN205645874U (en) Device of phosphor powder board and components of a whole that can function independently of LED light source
TWI557947B (en) Led unit