JP2009200078A - Substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can make smooth shift from a development stage to a mass-production stage and enables the productivity thereof to be improved. <P>SOLUTION: The substrate processing apparatus 11 is used to manufacture an organic EL device, a liquid crystal device, a semiconductor device, etc., each having a substrate 12 to be processed. The substrate processing apparatus 11 has a first processing chamber 13a to a fifth processing chamber 13e, and a conveyance chamber 14 and, for example, the processing chambers 13a to 13e are arranged linearly along a side surface of the conveyance chamber 14. Each of the processing chambers 13a to 13e can deliver and receive the substrate 12 to and from the conveyance chamber 14 through first gate valves 15. Further, each of the processing chambers 13a to 13e is connected to its adjacent processing chambers 13 through second gate valves 16. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus for processing a substrate to be processed in an atmosphere different from air.

  The above-described substrate processing apparatus is used when manufacturing an organic EL (Electro Luminescence) device, a liquid crystal device, a semiconductor device, and the like, and has a plurality of processing chambers that perform processing (heating, film formation, etc.) on a substrate to be processed. Yes. In the substrate processing apparatus, there are an in-line method and a cluster method as described in Patent Document 1 as an arrangement configuration of processing chambers.

  FIG. 4 is a schematic plan view showing the configuration of the inline-type substrate processing apparatus 101. In the in-line type substrate processing apparatus 101, for example, a plurality of processing chambers 102 adjusted to an atmosphere different from the atmosphere (for example, a vacuum atmosphere) are arranged in a processing order and linearly. The substrate processing apparatus 101 has a merit that a predetermined amount of processing can be performed on a large number of substrates to be processed 103, but has a demerit that it is not suitable for a small number of processes in which film types are not limited in a trial production or development stage.

  FIG. 5 is a schematic plan view showing the configuration of the cluster type substrate processing apparatus 111. The cluster-type substrate processing apparatus 111 is adjusted to a vacuum atmosphere, for example, and includes a transfer robot 114 that transfers the target substrate 113 to each processing chamber 112. This substrate processing apparatus 111 has a merit that the conditions (processing chambers) can be freely determined and can control the conditions independently, but has a demerit that production (mass production) efficiency is low.

  Therefore, the processing efficiency is improved by using the cluster type substrate processing apparatus 111 in the trial production or development stage and using the inline type substrate processing apparatus 101 in the mass production stage.

JP 2006-190894 A

  However, if the apparatus is changed from the cluster type substrate processing apparatus 111 to the inline type substrate processing apparatus 101, the processing conditions change due to the difference in the structure of the apparatus or the transfer method, and the quality cannot be reproduced. As a result, processing conditions are verified and re-executed, and production is delayed. In addition, since the two substrate processing apparatuses 101 and 111 are used, there is a problem that equipment costs are required.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A substrate processing apparatus according to this application example includes a plurality of processing chambers adjusted to an atmosphere different from the atmosphere, and a transfer chamber having a transfer robot for transferring a substrate to be processed to the plurality of processing chambers. And the plurality of processing chambers are arranged adjacent to each other and are connected so that adjacent processing chambers can exchange the substrate to be processed, and each of the plurality of processing chambers and the A transfer chamber is connected to the substrate to be transferred.

  According to this configuration, each processing chamber is provided with a transfer chamber for transferring the substrate to be processed, and the adjacent processing chambers are connected to each other so that the substrate to be processed can be exchanged. Processing can be performed by selecting from among processing chambers (e.g., equivalent to a cluster method), and processing is performed by transporting substrates to be processed in order from the end of a plurality of processing chambers without using a transfer robot. (For example, it corresponds to an inline method). Thus, for example, after selecting a processing chamber in the prototype or development stage and determining processing conditions, processing can be performed in the same processing chamber (substrate processing apparatus) in a mass production stage in which processing is performed sequentially from the end of the processing chamber. it can. Therefore, it is possible to carry out under almost the same processing conditions as in the development stage, and it is possible to smoothly shift from the development stage to the mass production stage from processing condition determination to productivity verification and further to mass production. As a result, productivity can be improved.

  Application Example 2 In the substrate processing apparatus according to the application example described above, each of the plurality of processing chambers and the transfer chamber are connected to each other through a first gate valve so that the adjacent processing chambers are connected to each other. Are preferably connected to each other via a second gate valve.

  According to this configuration, since the transfer chamber and the processing chamber and the processing chamber and the processing chamber are connected via the gate valve, for example, when the maintenance of the processing chamber is performed, the transfer chamber and other processing chambers are adversely affected. Maintenance can be performed without giving In the above case, the atmosphere in each processing chamber can be maintained at a predetermined atmosphere without abruptly changing.

  Application Example 3 In the substrate processing apparatus according to the application example, it is preferable that the plurality of processing chambers are arranged linearly.

  According to this configuration, since the processing chambers are arranged in a straight line, for example, in mass production in which a predetermined processing is continuously performed, it is possible to improve the transportability and to perform the processing efficiently. .

  Application Example 4 In the substrate processing apparatus according to the application example, the transfer chamber is formed in a substantially rectangular shape according to the length of the plurality of process chambers arranged in a straight line, and the transfer robot is It is preferable that the transfer chamber is provided so as to be linearly movable in the direction from end to end of the plurality of processing chambers.

  According to this configuration, since the transfer robot can transfer the substrate to be processed to each processing chamber by the reciprocation of the linear movement, it can be moved by a relatively simple operation. It can be conveyed to each processing chamber.

  Application Example 5 In the substrate processing apparatus according to the application example described above, it is preferable that a preliminary chamber is connected to the processing chamber.

  According to this configuration, since the preliminary chamber is connected to the processing chamber, for example, the preliminary chamber is used as the processing chamber, the substrate to be processed after the processing is evaluated, and the preparation for performing the processing is performed. Can be done.

  Application Example 6 In the substrate processing apparatus according to the application example described above, it is preferable that an extension unit capable of expanding the processing chamber is provided in the processing chamber or the spare chamber.

  According to this configuration, since the expansion portion is provided in the processing chamber, it is possible to easily add a processing chamber when another processing chamber is provided and processing is desired.

  FIG. 1 is a schematic plan view showing the structure of the substrate processing apparatus. Hereinafter, the structure of the substrate processing apparatus will be described with reference to FIG.

  As shown in FIG. 1, the substrate processing apparatus 11 is an apparatus used when manufacturing an organic EL device, a liquid crystal device, a semiconductor device, and the like provided with a substrate to be processed 12, and includes a plurality of processing chambers 13 (first processing). A chamber 13a to a fifth processing chamber 13e) and a transfer chamber 14;

  Here, processing performed on the substrate 12 to be processed will be described. For example, in the case of manufacturing an organic EL device, a metal film forming process and a sealing process such as a CVD (Chemical Vapor Deposition) method, a sputtering method, and a vapor deposition method in a vacuum atmosphere with respect to an element substrate as the substrate 12 to be processed. A patterning process using a photolithography technique, an organic film sealing process under a nitrogen atmosphere, and a printing process using an inkjet technique are performed. Hereinafter, for example, the structure of the substrate processing apparatus 11 that performs vacuum deposition processing will be described.

  Each of the first processing chamber 13 a to the fifth processing chamber 13 e can exchange the substrate 12 to be processed with the transfer chamber 14. Specifically, the processing chambers 13a to 13e are connected to the transfer chamber 14 through a first gate valve 15 (a partition valve) so as to be able to communicate therewith. The processing chambers 13 a to 13 e are arranged in a straight line along the side surface of the transfer chamber 14, and the adjacent processing chambers 13 are connected to each other via the second gate valve 16. .

  The first processing chamber 13a to the fifth processing chamber 13e are adjusted to a vacuum atmosphere as an atmosphere different from the air. Specifically, each of the first processing chamber 13a to the fifth processing chamber 13e is provided with a vacuuming mechanism (not shown) for creating a vacuum atmosphere. Further, the first processing chamber 13a to the fifth processing chamber 13e are holders (trays) (not shown) that place and transfer the substrate 12 to be processed in the adjacent processing chamber 13 when the substrate processing apparatus 11 is used as an inline system. Is provided.

  More specifically, each of the processing chambers 13a to 13e is provided with a transport roller (linear transport mechanism) for transporting the holder in order from the first processing chamber 13a to the fifth processing chamber 13e. The holder is linearly conveyed from the first processing chamber 13a toward the fifth processing chamber 13e by the rotation of the conveyance roller. In addition, it has the structure where the conveyance roller is not provided in the part of the 2nd gate valve 16 provided between process chambers 13a-13e. That is, when passing between the two processing chambers 13, the transport roller in one of the processing chambers 13 may be in contact with the holder, and the holder can be transported.

  In addition, a rotation mechanism that holds the holder and rotates it together with the substrate to be processed 12 is provided on the upper part of the holder. Each of the processing chambers 13a to 13e is provided with a holding mechanism that holds the holder rotatably. The substrate 12 to be processed fixed to the holder is subjected to processing through the fifth processing chamber 13e in order from the first processing chamber 13a while linearly moving or rotating.

  A first preliminary chamber 21 and a second preliminary chamber 22 are arranged on both sides of the processing chambers 13a to 13e. The first preliminary chamber 21 and the second preliminary chamber 22 are used, for example, to newly add a process to be performed on the substrate 12 as a processing chamber, or to connect and expand a plurality of processing chambers 13. .

  When the substrate processing apparatus 11 is used as an inline method, the first preliminary chamber 21 is used, for example, when a holder and the substrate to be processed 12 are combined, or when the substrate to be processed 12 and a mask (not shown) are combined. You may make it use. In this case, the second preliminary chamber 22 may be used when the substrate 12 to be processed is removed from the holder.

  The first preliminary chamber 21 is connected to the transfer chamber 14 and the first processing chamber 13a through the two gate valves 15 and 16 so as to communicate with each other. Similarly, the second preliminary chamber 22 is connected to the transfer chamber 14 and the fifth processing chamber 13e via the two gate valves 15 and 16 so as to communicate with each other. The second preliminary chamber 22 is provided with a second gate valve 16 and a third gate valve 23 as expansion portions for expanding the processing chamber 13.

  The transfer chamber 14 is formed, for example, in a substantially rectangular shape, and has a length equivalent to the length from the first preliminary chamber 21 to the second preliminary chamber 22. The transfer chamber 14 is set to a vacuum atmosphere as an atmosphere different from the atmosphere. More specifically, similarly to the processing chambers 13a to 13e, a evacuation mechanism (not shown) for making the transfer chamber 14 in a vacuum atmosphere is provided in the transfer chamber 14.

  In the transfer chamber 14, a transfer robot 24 that transfers the substrate 12 to be processed to the process chambers 13a to 13e in a vacuum atmosphere is disposed. More specifically, the transfer robot 24 is arranged so as to be capable of linearly reciprocating in the direction (distance) from the first auxiliary chamber 21 to the second auxiliary chamber 22 arranged adjacent to the transfer chamber 14. Yes. In addition, the transfer robot 24 includes an arm 24a that can pick up and place the substrate 12 to be processed. By using the transfer robot 24, the substrate 12 to be processed can be transferred to the processing chambers 13a to 13e.

  FIG. 2 is a schematic diagram showing an operation when the substrate processing apparatus is operated as a cluster system. Hereinafter, the operation of the substrate processing apparatus when operated in the cluster system will be described with reference to FIG.

  Note that the cluster type substrate processing apparatus 11 described below is used in the same manner as the conventional cluster type, and is used when the film forming state is used while evaluating the film formation state in a trial production or development stage. To do. Hereinafter, the substrate 12 to be processed is transferred, for example, in the order of the first processing chamber 13a, one third processing chamber 13c, the second processing chamber 13b, the fourth processing chamber 13d, and the fifth processing chamber 13e. It will be described as processing. Further, the first gate valve 15 and the second gate valve 16 are normally closed.

  First, the substrate 12 to be processed is carried into the transfer chamber 14 from a load lock chamber (not shown). The inside of the transfer chamber 14 is adjusted to a vacuum atmosphere.

  Next, the target substrate 12 is processed in the first processing chamber 13a. First, the substrate 12 to be processed is transferred from the transfer chamber 14 to the first processing chamber 13a. At this time, the first gate valve 15 is changed from the closed state to the open state to be in a communication state. Further, the substrate 12 to be processed is transferred using the transfer robot 24. After the conveyance, the first gate valve 15 is changed from the open state to the closed state. Hereinafter, description of the operation of the first gate valve 15 is omitted. In the first processing chamber 13a, for example, the substrate to be processed 12 is subjected to vapor deposition.

  Next, the target substrate 12 is processed in the third processing chamber 13c. First, the substrate 12 to be processed is transferred from the first processing chamber 13a to the transfer chamber 14 using the transfer robot 24, and then the transfer robot 24 is linearly moved to a position near the third processing chamber 13c. Then, the substrate 12 to be processed is transferred to the third processing chamber 13c. Thereafter, in the third processing chamber 13c, for example, a deposition process is performed on the substrate 12 to be processed.

  Thereafter, similarly, the substrate to be processed 12 is processed in the order of the second processing chamber 13b, the fourth processing chamber 13d, and the fifth processing chamber 13e. When the processing is completed, the substrate 12 to be processed is unloaded from an unload lock chamber (not shown).

  In this way, by operating the substrate processing apparatus 11 as a cluster system, the processing chambers 13a to 13e can be freely selected or changed in order, which can cope with a small processing quantity and can perform the deposition process. Conditions can be efficiently determined (specifically, processing conditions and quality control items for film thickness, dimensions, particles, etc. are determined).

  FIG. 3 is a schematic diagram showing an operation when the substrate processing apparatus is operated as an inline method. Hereinafter, the operation of the substrate processing apparatus when operated in an inline manner will be described with reference to FIG.

  The in-line substrate processing apparatus 11 described below is used in the same manner as the conventional in-line method, and is used in productivity verification and mass production after determining the film formation conditions in prototyping and development. It shall be. Hereinafter, the description will be made assuming that the substrate 12 is processed in the order of the first processing chamber 13a to the fifth processing chamber 13e. Note that the first gate valve 15 and the second gate valve 16 change from a closed state to an open state when communicating. Hereinafter, description of the operation of the gate valves 15 and 16 is omitted.

  First, the substrate 12 to be processed is carried into the transfer chamber 14 from a load lock chamber (not shown). The inside of the transfer chamber 14 is adjusted to a vacuum atmosphere.

  Next, preparation for processing in the processing chambers 13 a to 13 e is performed in the first preliminary chamber 21. First, the substrate to be processed 12 is transferred from the transfer chamber 14 to the first preliminary chamber 21 using the transfer robot 24. Here, the target substrate 12 and the mask are combined, and the target substrate 12 is set in a holder.

  Next, the target substrate 12 is processed in the first processing chamber 13a. First, the substrate 12 to be processed is transferred from the first preliminary chamber 21 to the first processing chamber 13a. The holder on which the substrate 12 to be processed is placed is sent from the first preliminary chamber 21 to the first processing chamber 13 a by the rotational force of the transport roller as a linear transport mechanism provided in the first preliminary chamber 21. The substrate 12 to be processed is subjected to predetermined processing in the first processing chamber 13a. If necessary, the holder 12 may be held by the holding mechanism, and the substrate to be processed 12 may be processed while the holder is rotated by the rotating mechanism.

  Thereafter, similarly, the substrate to be processed 12 is transferred (passed) in the order from the first processing chamber 13a to the fifth processing chamber 13e, and the substrate to be processed 12 is processed. When the processing in the fifth processing chamber 13e is completed, the substrate 12 to be processed is continuously transferred to the second preliminary chamber 22. And in the 2nd preliminary | backup chamber 22, the to-be-processed substrate 12 is removed from a holder.

  Finally, the substrate 12 to be processed is unloaded from an unload lock chamber (not shown). First, the transfer robot 24 picks up the substrate 12 to be processed from the second preliminary chamber 22. After that, the transfer robot 24 transfers the target substrate 12 to the unload lock chamber, and carries the target substrate 12 out of the unload lock chamber.

  As described above, by operating the substrate processing apparatus 11 as an inline method, it is possible to verify productivity, quality, and process management based on processing conditions obtained by experiments using the cluster method. In addition, since the same substrate processing apparatus 11 is used as a cluster method and an inline method, it is possible to suppress changes in processing conditions, and it is possible to reduce re-verification of processing conditions.

  As described above in detail, according to the substrate processing apparatus 11 of the present embodiment, the following effects can be obtained.

  (1) According to this embodiment, each of the processing chambers 13a to 13e includes the transfer chamber 14 for transferring the substrate 12 to be processed, and the adjacent processing chambers 13a to 13e are connected to each other so that the substrate 12 can be exchanged. Therefore, processing can be performed by selecting from the processing chambers 13 a to 13 e using the transfer robot 24 (for example, a cluster method), and the processing chambers 13 a to 13 e can be selected without using the transfer robot 24. It is also possible to carry out processing by conveying the substrate 12 to be processed in order from the end (for example, in-line method). Thereby, for example, after selecting the processing chambers 13a to 13e in the trial production or development stage and determining the processing conditions, the same processing chamber 13 (substrate processing) is performed in the mass production stage in which processing is sequentially performed from the end of the processing chambers 13a to 13e. Processing can be carried out in the apparatus 11). Therefore, it is possible to carry out under almost the same processing conditions as in the development stage, and it is possible to smoothly shift from the development stage to the mass production stage from processing condition determination to productivity verification and further to mass production. As a result, productivity can be improved.

  (2) According to the present embodiment, since one substrate processing apparatus 11 can cope with the verification experiment from the development stage to the mass production stage and further mass production, it is possible to suppress such capital investment. Furthermore, the evaluation man-hours required for reexamination of processing conditions can be suppressed.

  (3) According to the present embodiment, the processing chambers 13a to 13e and the processing chambers 13a to 13e and the transfer chamber 14 are connected via the first gate valve 15 or the second gate valve 16, For example, when performing maintenance, the maintenance can be performed without lowering the vacuum atmosphere in the processing chambers 13 and the transfer chamber 14 other than the processing chamber 13 in which maintenance is performed.

  In addition, embodiment is not limited above, It can also implement with the following forms.

(Modification 1)
The substrate processing apparatus 11 described above is not limited to disposing the processing chambers 13 a to 13 e on one side surface of the transfer chamber 14. For example, the processing chamber 13 may be disposed around the transfer chamber 14. In this case, by providing the arm 24 a of the transfer robot 24 with a rotation mechanism, the substrate 12 to be processed can be transferred to the processing chamber 13.

(Modification 2)
The first preliminary chamber 21 and the second preliminary chamber 22 described above are not limited to the combination of the holder and the substrate 12 to be processed or the processing chamber 13 is expanded. An evaluation may be performed.

(Modification 3)
The above-described substrate processing apparatus 11 is not limited to processing in a vacuum atmosphere, and may be applied to processing in a nitrogen atmosphere or processing in other atmospheres, for example. Moreover, it is not limited to a vapor deposition process, For example, you may make it perform a heat treatment, a cooling process, a plasma process, etc.

(Modification 4)
The substrate processing apparatus 11 operated in the above-described inline method is not limited to delivering the substrate 12 to be processed to the outside via the transfer chamber 14, but directly to the outside without passing the transfer chamber 14. Also good.

(Modification 5)
In the case of operating in the above-described inline method, the process is not limited to one end from the first processing chamber 13a to the fifth processing chamber 13e, and if necessary, for example, using the transfer robot 24 again. The processing may be repeated from the first processing chamber 13a to the fifth processing chamber 13e.

(Modification 6)
The above-described substrate processing apparatus 11 is not limited to the configuration in which the first processing chamber 13a to the fifth processing chamber 13e are arranged in one row. For example, the processing chamber 13 may be further provided in two rows. Good.

(Modification 7)
The transfer chamber 14 described above is not limited to a rectangular shape, and may be, for example, a circular shape, an elliptical shape, or a polygonal shape. Even in this case, the processing chambers are arranged around the transfer chamber 14 and the adjacent processing chambers 13 are provided so as to communicate with each other.

The schematic plan view which shows the structure of a substrate processing apparatus. The schematic diagram which shows operation | movement at the time of operating a substrate processing apparatus by a cluster system. The schematic diagram which shows operation | movement at the time of operating a substrate processing apparatus by an in-line system. The schematic top view which shows the structure of the conventional in-line system substrate processing apparatus. FIG. 6 is a schematic plan view showing the structure of a conventional cluster type substrate processing apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Substrate processing apparatus, 12 ... Substrate to be processed, 13 ... Processing chamber, 13a ... First processing chamber, 13b ... Second processing chamber, 13c ... Third processing chamber, 13d ... Fourth processing chamber, 13e ... Fifth processing Chamber, 14 ... transfer chamber, 15 ... first gate valve, 16 ... second gate valve, 21 ... first reserve chamber, 22 ... second reserve chamber, 23 ... third gate valve, 24 ... transfer robot, 24a ... arm .

Claims (6)

A plurality of processing chambers adjusted to an atmosphere different from the atmosphere;
A transfer chamber having a transfer robot for transferring a substrate to be processed to the plurality of process chambers;
Have
The plurality of processing chambers are arranged adjacent to each other, and adjacent processing chambers are connected to be able to exchange the substrate to be processed, and each of the plurality of processing chambers and the transfer chamber Is connected so as to be able to exchange the substrate to be processed. The substrate processing apparatus according to claim 1,
Each of the plurality of processing chambers and the transfer chamber are connected to be able to communicate with each other via a first gate valve.
The adjacent processing chambers are connected to each other through a second gate valve so as to communicate with each other. The substrate processing apparatus according to claim 1 or 2, wherein
The substrate processing apparatus, wherein the plurality of processing chambers are linearly arranged. The substrate processing apparatus according to claim 3, wherein
The transfer chamber is formed in a substantially rectangular shape according to the length of the plurality of processing chambers arranged in a straight line,
The substrate processing apparatus, wherein the transfer robot is provided so as to be linearly movable in a direction from end to end of the plurality of processing chambers in the transfer chamber. A substrate processing apparatus according to any one of claims 1 to 4,
A substrate processing apparatus, wherein a preliminary chamber is connected to the processing chamber. A substrate processing apparatus according to any one of claims 1 to 5,
The substrate processing apparatus, wherein the processing chamber or the preliminary chamber is provided with an expansion unit capable of expanding the processing chamber.

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