JP2009199851A - Repairing device and method of organic electroluminescent panel - Google Patents

Repairing device and method of organic electroluminescent panel Download PDF

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JP2009199851A
JP2009199851A JP2008039700A JP2008039700A JP2009199851A JP 2009199851 A JP2009199851 A JP 2009199851A JP 2008039700 A JP2008039700 A JP 2008039700A JP 2008039700 A JP2008039700 A JP 2008039700A JP 2009199851 A JP2009199851 A JP 2009199851A
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film
organic
panel
absorbing member
laser
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JP4990182B2 (en
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Mitsutoshi Akatsu
光俊 赤津
Hiromasa Okada
博正 岡田
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AITESU KK
Ites Co Ltd
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Ites Co Ltd
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<P>PROBLEM TO BE SOLVED: To provide a repairing device and method for a flexible organic EL panel enabled to suppress damage of a defective point from affecting the surroundings as much as possible. <P>SOLUTION: The repairing device 10 is provided with a laser irradiating device 12 and a heat-absorbing member 14. In the repairing method, (1) the heat-absorbing member 14 is arranged in front of a first film 22, (2) the laser irradiating device 12 is moved toward above the defective point 36, and laser is irradiated on the point 36. Because of the laser irradiation, a metal electrode 34 at the defective point 36 is evaporated, and the defective point ceases to emit light. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、フレキシブルな有機ELパネルのリペア装置およびリペア方法に関するものである。   The present invention relates to a repair device and a repair method for a flexible organic EL panel.

近年、有機ELパネルが実用化されるなどして注目されている。有機ELパネルは、液晶パネルと異なり、フレキシブルに構成することもできる。   In recent years, attention has been paid to the practical use of organic EL panels. Unlike the liquid crystal panel, the organic EL panel can be configured flexibly.

図5に示すフレキシブルな有機ELパネル20は、光透過性の第1フィルム22と、第1フィルム22と対向する第2フィルム24と、第1フィルム22と第2フィルム24の間に形成された有機EL素子26とを含む。有機EL素子26は、第1フィルム22の上に積層形成されている。有機EL素子26を封止するために、フィルム22,24の周縁同士を接着剤28によって接着している。必要に応じて第2フィルム24と有機EL素子26を接着剤で接着する。図5では有機EL素子26は1つであるが、実際は多数の有機EL素子26が縦横に配列されている。   A flexible organic EL panel 20 shown in FIG. 5 is formed between a light transmissive first film 22, a second film 24 facing the first film 22, and the first film 22 and the second film 24. And an organic EL element 26. The organic EL element 26 is laminated on the first film 22. In order to seal the organic EL element 26, the peripheral edges of the films 22 and 24 are bonded together with an adhesive 28. The 2nd film 24 and the organic EL element 26 are adhere | attached with an adhesive agent as needed. In FIG. 5, the number of the organic EL elements 26 is one, but actually, a large number of organic EL elements 26 are arranged vertically and horizontally.

有機EL素子26は、第1フィルム側から透明電極30、有機層32、金属電極34の順番に積層された構造である。透明電極30はITOなどであり、金属電極34はAlなどである。透明電極30がアノードになり、金属電極34がカソードになる。図5では有機層32は1層になっているが、アノード側から順番にホール注入層、ホール輸送層、発光層、電子輸送層、電子注入層が積層された構造であっても良い。発光層で電子と正孔が再結合し、電子が基底状態から励起状態になり、さらに電子が基底状態に戻るときに発光する。第1フィルム側から光が出射されるため、第1フィルムは光透過性であり、第2フィルムは光透過性の有無は関係ない。   The organic EL element 26 has a structure in which a transparent electrode 30, an organic layer 32, and a metal electrode 34 are laminated in this order from the first film side. The transparent electrode 30 is ITO or the like, and the metal electrode 34 is Al or the like. The transparent electrode 30 becomes an anode and the metal electrode 34 becomes a cathode. In FIG. 5, the organic layer 32 is a single layer, but a structure in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are stacked in order from the anode side may be used. In the light-emitting layer, electrons and holes are recombined, so that light is emitted when the electrons change from the ground state to the excited state and further return to the ground state. Since light is emitted from the first film side, the first film is light transmissive, and the second film is irrelevant whether light transmissive or not.

フィルム22,24や有機EL素子26がフレキシブルであるので、有機ELパネル20がフレキシブルになる。液晶パネルとは異なり、任意に湾曲させて使用することができる。   Since the films 22 and 24 and the organic EL element 26 are flexible, the organic EL panel 20 becomes flexible. Unlike a liquid crystal panel, it can be arbitrarily curved and used.

なお、フィルム22,24の代わりに硬質のガラス基板62とキャップ64を使用した有機ELパネル60がある(図6)。この有機ELパネル60は、液晶パネルと同様に任意に湾曲させることはできない。ガラス基板62の厚みは約700μmであり、フィルム22,24の厚みは約100μmである。フレキシブルな有機ELパネル20の方がかなり薄い。   In addition, there is an organic EL panel 60 using a hard glass substrate 62 and a cap 64 instead of the films 22 and 24 (FIG. 6). The organic EL panel 60 cannot be arbitrarily curved like the liquid crystal panel. The glass substrate 62 has a thickness of about 700 μm, and the films 22 and 24 have a thickness of about 100 μm. The flexible organic EL panel 20 is considerably thinner.

有機ELパネル20は多数の有機EL素子26が縦横に配列されており、全ての有機EL素子26を無欠陥で製造することはかなり難しい。例えば、クリーンルームで有機ELパネル20を製造するが、製造装置で発生する埃などによって電極間がショートまたは低抵抗化する場合がある。欠陥箇所36で電流がリークし、輝点となって表示品位を落とす。   The organic EL panel 20 has a large number of organic EL elements 26 arranged vertically and horizontally, and it is quite difficult to manufacture all the organic EL elements 26 without defects. For example, the organic EL panel 20 is manufactured in a clean room, but there are cases where the electrodes are short-circuited or reduced in resistance due to dust generated in the manufacturing apparatus. The current leaks at the defective portion 36 and becomes a bright spot, degrading the display quality.

そのため、有機ELパネル20の製造過程で欠陥を検出し、リペアをおこなうのが普通である。例えば、第1フィルム側から欠陥を検出し、欠陥箇所36にレーザーLを照射する。レーザーLによって欠陥箇所36の金属電極34を蒸発させ、欠陥箇所36を高抵抗化する。リペアによって欠陥箇所36が発光しなくなり、使用者が欠陥箇所36を認識しにくくなる。   For this reason, it is common to detect a defect during the manufacturing process of the organic EL panel 20 and perform repair. For example, a defect is detected from the first film side, and the defect portion 36 is irradiated with a laser L. The metal electrode 34 at the defective portion 36 is evaporated by the laser L, and the defective portion 36 is increased in resistance. The defective portion 36 does not emit light by the repair, and it becomes difficult for the user to recognize the defective portion 36.

図7に示すように、金属電極34を蒸発させる熱量がQ1であるとする。リペア時、この熱量Q1よりも非常に高い熱量Q2が有機層32に与えられている。この理由は、(1)金属電極34に与える熱量以外に、有機層32に吸収などされる熱量を考慮すると、レーザーLの出力を上げる必要があり、(2)レーザーLが有機層32を通過するため、有機層32には金属電極34に与える熱量よりも大きくなるためである。   As shown in FIG. 7, it is assumed that the amount of heat for evaporating the metal electrode 34 is Q1. At the time of repair, the organic layer 32 is given a heat quantity Q2 that is much higher than the heat quantity Q1. This is because (1) it is necessary to increase the output of the laser L in consideration of the amount of heat absorbed by the organic layer 32 in addition to the amount of heat given to the metal electrode 34, and (2) the laser L passes through the organic layer 32. This is because the amount of heat applied to the metal electrode 34 is larger in the organic layer 32.

また、フレキシブルな有機ELパネル20は、厚みが非常に薄く、ガラス基板62のような熱を逃がすための材料が少ないため、欠陥箇所36の周囲にも多量の熱が伝導される。具体的には、図6の有機ELパネル60であればガラス基板62に矢印のTbで示すような熱伝導が生じるが、フレキシブルな有機ELパネル20の熱伝導は矢印のTaの方向のみである(図5)。欠陥箇所36の周囲の有機EL素子26が熱によってダメージを受ける場合がある。リペアによって非発光領域が広くなり、表示品位を落とすこととなる。   In addition, since the flexible organic EL panel 20 is very thin and has a small amount of material for releasing heat, such as the glass substrate 62, a large amount of heat is also conducted around the defect portion 36. Specifically, in the case of the organic EL panel 60 of FIG. 6, heat conduction as indicated by the arrow Tb occurs in the glass substrate 62, but the heat conduction of the flexible organic EL panel 20 is only in the direction of the arrow Ta. (FIG. 5). The organic EL element 26 around the defective portion 36 may be damaged by heat. The non-light emitting area is widened by repair, and the display quality is lowered.

欠陥箇所の周囲に熱が伝わらないようにレーザーLの出力を小さくすると、リペアがおこなえない。   If the output of the laser L is reduced so that heat is not transmitted to the periphery of the defective portion, repair cannot be performed.

金属電極側からレーザーLを照射すれば有機層32にレーザーLが照射されることがない。有機層32へ与えられる熱量も小さく、有機層32のダメージを小さくできると考えられる。しかし、金属電極34は不透明であり、欠陥箇所36を認識することができない。したがって、金属電極側からのレーザー照射はおこなわれていない。第2フィルム24が不透明になると、同様に欠陥箇所36を認識することができず、レーザーLによって第2フィルム24も損傷してしまう。   If the laser L is irradiated from the metal electrode side, the organic layer 32 is not irradiated with the laser L. It is considered that the amount of heat given to the organic layer 32 is small, and damage to the organic layer 32 can be reduced. However, the metal electrode 34 is opaque and the defective portion 36 cannot be recognized. Therefore, laser irradiation from the metal electrode side is not performed. When the second film 24 becomes opaque, the defective portion 36 cannot be recognized in the same manner, and the second film 24 is also damaged by the laser L.

なお、欠陥箇所36の座標がわかり、有機ELパネル20の角にアライメントマークを設ければ、コンピュータ制御によってレーザー照射装置52を欠陥箇所36まで自動的に移動させ、金属電極側からレーザーLを照射できるように考えられる。しかし、有機EL素子26は非常に微細であり、最終的なレーザー照射位置を目視によって確認し、必要に応じてレーザー照射位置を微調整する。金属電極側からの自動でのレーザー照射は、微調整ができないために失敗するおそれが高い。   If the coordinates of the defective portion 36 are known and an alignment mark is provided at the corner of the organic EL panel 20, the laser irradiation device 52 is automatically moved to the defective portion 36 by computer control, and the laser L is irradiated from the metal electrode side. It can be thought of as possible. However, the organic EL element 26 is very fine, and the final laser irradiation position is visually confirmed, and the laser irradiation position is finely adjusted as necessary. Automatic laser irradiation from the metal electrode side is likely to fail because fine adjustment is not possible.

特許文献1にレーザーを利用したリペア方法が開示されている。しかし、引用文献1は、液晶パネル用のアレイ基板のリペアであって有機ELパネルについてではない。引用文献1は、透明電極側からレーザーを照射しており、有機ELパネルに単純に適用すれば欠陥の周囲にもダメージを与えてしまう。引用文献1はアレイ基板のリペアであり、封止はおこなっていない。有機EL素子は酸素や水分によって劣化するため、引用文献1の方法でリペアをおこなうためには不活性ガス雰囲気中でおこなわなければならず、非常に難しい。   Patent Document 1 discloses a repair method using a laser. However, the cited document 1 is a repair of an array substrate for a liquid crystal panel, not an organic EL panel. Cited Document 1 irradiates a laser from the transparent electrode side, and if it is simply applied to an organic EL panel, it also damages the periphery of the defect. Cited Document 1 is repairing an array substrate, and sealing is not performed. Since the organic EL element is deteriorated by oxygen or moisture, in order to perform the repair by the method of the cited document 1, it must be performed in an inert gas atmosphere, which is very difficult.

特許文献2は、レーザーで欠陥部分を除去した後、再び有機層を形成する方法が開示されている。引用文献2は、有機層の分子鎖の切断に特化した波長のレーザーを照射している。しかし、発光効率を向上させるために有機層が複数層になることが一般的であり、特許文献2の方法によって材料の異なる複数の層を全て除去できるのかが問題となる。この点については、特許文献2には開示されていない。有機層の発光を確認するためには有機層を2枚の電極で挟み込む必要があるが、引用文献2の方法であれば上方の電極を形成できず、発光を確認することはできない。   Patent Document 2 discloses a method of forming an organic layer again after removing a defective portion with a laser. Cited Document 2 irradiates a laser having a wavelength specialized for cutting a molecular chain of an organic layer. However, in order to improve the light emission efficiency, the organic layer is generally a plurality of layers, and it is a problem whether all the plurality of layers made of different materials can be removed by the method of Patent Document 2. This point is not disclosed in Patent Document 2. In order to confirm the light emission of the organic layer, it is necessary to sandwich the organic layer between the two electrodes. However, according to the method of Cited Document 2, the upper electrode cannot be formed, and the light emission cannot be confirmed.

特許文献3に有機ELパネルのリペア装置が開示されている。しかし、ガラス基板を利用した有機ELパネルに対しての装置であり、フレキシブルな有機ELパネルに対するリペア装置ではない。なお、特許文献4は有機ELパネルにダメージを与えずに検査をおこなう装置であり、検査後のリペアに関するものではない。   Patent Document 3 discloses an organic EL panel repair device. However, it is an apparatus for an organic EL panel using a glass substrate, and is not a repair apparatus for a flexible organic EL panel. Note that Patent Document 4 is an apparatus that performs an inspection without damaging the organic EL panel, and does not relate to a repair after the inspection.

特開2000−347217号公報JP 2000-347217 A 特開2004−119243号公報JP 2004-119243 A 特開2007−42498号公報JP 2007-42498 A 特開2005−83951号公報JP 2005-83951 A

本発明の目的は、フレキシブルな有機ELパネルに対して、欠陥部分の周囲へのダメージを極力小さくしたリペア装置およびリペア方法を提供することにある。   The objective of this invention is providing the repair apparatus and repair method which made the damage to the circumference | surroundings of a defective part as small as possible with respect to a flexible organic electroluminescent panel.

上述したように有機ELパネルは、光透過性の第1フィルムと第2フィルムの間に有機EL素子を有する。有機EL素子は、第1フィルム側から透明電極、有機層、金属電極が順番に積層されている。有機EL素子を封止するために第1フィルムと第2フィルムの周縁部は接着剤で接着されている。   As described above, the organic EL panel has an organic EL element between the light transmissive first film and the second film. In the organic EL element, a transparent electrode, an organic layer, and a metal electrode are sequentially laminated from the first film side. In order to seal the organic EL element, the peripheral portions of the first film and the second film are bonded with an adhesive.

有機ELパネルのリペア装置は、熱吸収部材と、欠陥箇所にレーザーを照射するレーザー照射装置とを含む。有機ELパネルに熱吸収部材を取り付けた上でレーザー照射をおこなう。   The repair device of the organic EL panel includes a heat absorbing member and a laser irradiation device that irradiates a defective portion with a laser. Laser irradiation is performed after attaching a heat absorbing member to the organic EL panel.

有機ELパネルと熱吸収部材の隙間を満たす液体を含み、その液体はフッ素系の不活性液体を含む。熱吸収部材は光透過性のガラス板を含む。   A liquid that fills the gap between the organic EL panel and the heat absorbing member is included, and the liquid includes a fluorine-based inert liquid. The heat absorbing member includes a light transmissive glass plate.

リペア装置を使用したリペア方法は、(1)有機ELパネルの前面に熱吸収部材を配置し、(2)熱吸収部材を介して欠陥箇所に第1フィルム側からレーザーを照射する。   In the repair method using the repair device, (1) a heat absorbing member is arranged on the front surface of the organic EL panel, and (2) a laser is irradiated from the first film side to the defective portion through the heat absorbing member.

上記(1)の前に、熱吸収部材が配置される予定の箇所の前面に液体を塗布し、熱吸収部材が配置されたときに熱吸収部材と有機ELパネルとの隙間が液体で満たされるようにする。   Before the above (1), a liquid is applied to the front surface of the place where the heat absorbing member is to be disposed, and when the heat absorbing member is disposed, the gap between the heat absorbing member and the organic EL panel is filled with the liquid. Like that.

本発明によると、レーザー照射によって発生した熱が熱吸収部材に伝導されるため、有機層の熱によるダメージを極力抑えることができる。リペアによって非発光領域を広げるおそれが小さい。有機ELパネルと熱吸収部材との間を液体で満たすことによって、有機ELパネルから熱吸収部材への熱伝導を効率良くおこなうことができる。熱吸収部材が光透過性のガラス板であれば、熱吸収部材はレーザー照射の邪魔にならない。液体がフッ素系の不活性液体であれば、有機ELパネルを液体によって劣化させることはない。   According to the present invention, since heat generated by laser irradiation is conducted to the heat absorbing member, damage due to heat of the organic layer can be suppressed as much as possible. There is little risk of expanding the non-light emitting area by repair. By filling the space between the organic EL panel and the heat absorbing member with a liquid, heat conduction from the organic EL panel to the heat absorbing member can be efficiently performed. If the heat absorbing member is a light transmissive glass plate, the heat absorbing member does not interfere with laser irradiation. If the liquid is a fluorine-based inert liquid, the organic EL panel is not deteriorated by the liquid.

本発明の実施形態について図面を用いて説明する。リペアされるフレキシブルな有機ELパネルは、従来技術で説明した有機ELパネルと同じであり、有機ELパネルについての説明は省略する。   Embodiments of the present invention will be described with reference to the drawings. The flexible organic EL panel to be repaired is the same as the organic EL panel described in the related art, and the description of the organic EL panel is omitted.

本発明のリペア装置10は、従来と同じようにレーザーLによってリペアをおこなう装置である(図1)。リペア装置10は、レーザー照射装置12と熱吸収部材14を備える。   The repair device 10 of the present invention is a device that performs repair with a laser L as in the conventional case (FIG. 1). The repair device 10 includes a laser irradiation device 12 and a heat absorption member 14.

レーザー照射装置12は、YAG、エキシマ、半導体、ガスなどの種々のレーザー照射装置である。レーザーLの波長は約200〜1100nmであり、出力は約2x10−3〜4×10−2mJである。レーザーLによって欠陥箇所36の金属電極34を蒸発させて欠陥箇所36を高抵抗化する。 The laser irradiation device 12 is various laser irradiation devices such as YAG, excimer, semiconductor, and gas. The wavelength of the laser L is about 200 to 1100 nm, and the output is about 2 × 10 −3 to 4 × 10 −2 mJ. The metal electrode 34 at the defective portion 36 is evaporated by the laser L to increase the resistance of the defective portion 36.

熱吸収部材14はガラス板を使用する。熱吸収部材14は第1フィルム22の前面に接するように配置される。本説明で第1フィルム22の前面は、透明電極20とは反対側の面である。   The heat absorbing member 14 uses a glass plate. The heat absorbing member 14 is disposed in contact with the front surface of the first film 22. In the present description, the front surface of the first film 22 is a surface opposite to the transparent electrode 20.

熱吸収部材14は、欠陥箇所36が視認できてレーザーLが透過できるように、光透過性である。熱吸収部材14の厚みは約700μmであり、熱伝導率は約0.6〜1Wm−1−1である。第1フィルム22の厚みが非常に薄いため、熱吸収部材14を配置した構造は、ガラス基板を用いた有機ELパネルと近似する。したがって、ガラス基板を用いた有機ELパネルと同じように、リペアで発生した熱を熱吸収部材14に逃がすことができる。 The heat absorbing member 14 is light transmissive so that the defective portion 36 can be visually recognized and the laser L can be transmitted. The thickness of the heat absorbing member 14 is about 700 μm, and the thermal conductivity is about 0.6 to 1 Wm −1 K −1 . Since the thickness of the 1st film 22 is very thin, the structure which has arrange | positioned the heat absorption member 14 approximates the organic electroluminescent panel using a glass substrate. Therefore, the heat generated by the repair can be released to the heat absorbing member 14 as in the case of the organic EL panel using the glass substrate.

リペアをおこなう際、有機ELパネル20は第1フィルム22が上方を向くようにする。第1フィルム20の前面に熱吸収部材14を配置したときに、熱吸収部材14が自重で第1フィルム22と密接するようにするためである。熱吸収部材14と第1フィルム22とが密接することにより、熱伝導が良くなる。なお、第1フィルム22は上方に対して多少斜めを向いていても良い。   When repairing, the organic EL panel 20 is arranged so that the first film 22 faces upward. This is because when the heat absorbing member 14 is disposed on the front surface of the first film 20, the heat absorbing member 14 is in close contact with the first film 22 by its own weight. When the heat absorbing member 14 and the first film 22 are in close contact with each other, heat conduction is improved. The first film 22 may be slightly inclined with respect to the upper side.

熱吸収部材14は、欠陥箇所36とその周辺において熱が吸収されればよいので、第1フィルム22を全て覆う大きさは必要なく、図2のリペア装置10bのように第1フィルム22の一部を覆う熱吸収部材14bであっても良い。第1フィルム22を全て覆う大きさの熱吸収部材14であれば、欠陥箇所36の位置に関係なく熱吸収部材14を第1フィルム22の上に置けばリペアをおこなうことができ、作業効率が良い。   Since the heat absorbing member 14 only needs to absorb heat at the defect portion 36 and its periphery, the heat absorbing member 14 does not need to have a size that covers the entire first film 22. The heat absorption member 14b which covers a part may be sufficient. If it is the heat absorption member 14 of the magnitude | size which covers all the 1st films 22, it can repair by placing the heat absorption member 14 on the 1st film 22 regardless of the position of the defect location 36, and work efficiency is high. good.

その他、リペア装置10は有機ELパネル20の保持台、レーザー照射装置12を支持して欠陥箇所36の上方にレーザー照射装置12を移動させる手段、欠陥箇所36を拡大表示する手段、リペア装置10の動作を制御するコンピュータなどを含む。コンピュータ制御によって、レーザー照射装置12を欠陥箇所36の付近まで移動させた後、欠陥箇所36を拡大表示させ、目視しながらレーザー照射位置を微調整する。熱吸収部材14を自動的に配置するロボットを備えても良い。また、リペア装置10は有機ELパネル20を点灯させる手段を備える。レーザーLの照射位置を調節するために、有機ELパネル20を点灯させて欠陥箇所36がわかるようにする。   In addition, the repair device 10 is a holder for the organic EL panel 20, a means for supporting the laser irradiation device 12, a means for moving the laser irradiation device 12 above the defective portion 36, a means for enlarging and displaying the defective portion 36, Includes computers that control operations. After the laser irradiation apparatus 12 is moved to the vicinity of the defect portion 36 by computer control, the defect portion 36 is enlarged and displayed, and the laser irradiation position is finely adjusted while visually observing. A robot that automatically arranges the heat absorbing member 14 may be provided. In addition, the repair device 10 includes means for lighting the organic EL panel 20. In order to adjust the irradiation position of the laser L, the organic EL panel 20 is turned on so that the defective portion 36 can be identified.

リペアをおこなう前に欠陥箇所36を検出する必要があるが、本発明では欠陥箇所36の検出方法は特に限定されない。例えば、従来技術で示した特許文献4などに開示された方法を使用しても良い   Although it is necessary to detect the defective part 36 before performing repair, the detection method of the defective part 36 is not specifically limited in this invention. For example, the method disclosed in Patent Document 4 shown in the prior art may be used.

リペア装置10を使用したリペア方法は、(1)第1フィルム22の前面に熱吸収部材14を配置し、(2)レーザー照射装置12を欠陥箇所36の上まで移動させて、欠陥箇所36にレーザー照射する。レーザー照射によって欠陥箇所36の金属電極34が蒸発し、欠陥箇所36が発光しなくなる。   The repair method using the repair device 10 is as follows: (1) the heat absorbing member 14 is disposed on the front surface of the first film 22; (2) the laser irradiation device 12 is moved over the defect portion 36; Laser irradiation. The metal electrode 34 at the defective portion 36 is evaporated by the laser irradiation, and the defective portion 36 does not emit light.

従来とは異なり、第1フィルム22の前面に熱吸収部材14を取り付けている。このことにより、レーザー照射時に発生する熱を熱吸収部材14に伝導させることができ、有機層32に伝導される熱量を小さくすることができる。有機層32のダメージを極力抑えることができる。   Unlike the prior art, the heat absorbing member 14 is attached to the front surface of the first film 22. As a result, heat generated during laser irradiation can be conducted to the heat absorbing member 14, and the amount of heat conducted to the organic layer 32 can be reduced. Damage to the organic layer 32 can be suppressed as much as possible.

第1フィルム22と熱吸収部材14の表面は、肉眼では平坦に見えていてもマクロ的には微細な凹凸がある。また、有機ELパネル20はフレキシブルであり、肉眼では平坦に見えていてもマクロ的には湾曲している場合がある。したがって、有機ELパネル20と熱吸収部材14を完全に密接させることはかなり難しい。第1フィルム22の前面に熱吸収部材14を配置しただけでは、微細な隙間が発生する場合がある。   Even if the surfaces of the first film 22 and the heat absorbing member 14 appear flat to the naked eye, they have fine irregularities on a macro scale. Further, the organic EL panel 20 is flexible, and may be curved macroscopically even if it looks flat with the naked eye. Therefore, it is quite difficult to bring the organic EL panel 20 and the heat absorption member 14 into close contact with each other. If the heat absorbing member 14 is simply disposed on the front surface of the first film 22, a fine gap may occur.

そこで、第1フィルム22と熱吸収部材14との隙間に液体16を満たすようにする。液体16によって第1フィルム22から熱吸収部材14に効率良く熱伝導が発生するようにする。説明の便宜上、図1では液体16が層状になっているが、実際は第1フィルム22と熱吸収部材14の隙間を満たす。   Therefore, the liquid 16 is filled in the gap between the first film 22 and the heat absorbing member 14. Heat is efficiently generated from the first film 22 to the heat absorbing member 14 by the liquid 16. For convenience of explanation, the liquid 16 is layered in FIG. 1 but actually fills the gap between the first film 22 and the heat absorbing member 14.

液体16はフッ素系の不活性液体を使用する。液体16の一例としては、ガルデン(商品名)やフロリナート(商品名)などが挙げられる。これらの液体16は、空気よりも熱伝導率が高く、熱吸収部材14への熱伝導を補助する。フッ素系の不活性液体であるので、有機ELパネル20を劣化させにくい。   As the liquid 16, a fluorine-based inert liquid is used. Examples of the liquid 16 include Galden (trade name) and Florinato (trade name). These liquids 16 have higher thermal conductivity than air, and assist heat conduction to the heat absorbing member 14. Since it is a fluorine-based inert liquid, the organic EL panel 20 is hardly deteriorated.

第1フィルム22と熱吸収部材14との隙間に液体16を満たすために、上記(1)の前に液体16を第1フィルム22の前面に塗布する。リペア装置10は、液体16を塗布するためのディスペンサーを備える。液体16の塗布は、欠陥箇所36とその周辺に塗布されるようにすれば良く、第1フィルム22の全面に液体16を塗布する必要はない。コンピュータ制御によって、ディスペンサーが自動的に欠陥箇所36に液体16を塗布するようにしても良い。複数の欠陥箇所36があれば、全ての欠陥箇所36に液体16を塗布する。リペア後、熱吸収部材14を取り除き、液体16を拭き取る。熱吸収部材14の取り除きと液体16の拭き取りを自動的におこなうロボットを備えても良い。   In order to fill the liquid 16 in the gap between the first film 22 and the heat absorbing member 14, the liquid 16 is applied to the front surface of the first film 22 before (1). The repair device 10 includes a dispenser for applying the liquid 16. The liquid 16 may be applied to the defective portion 36 and its periphery, and it is not necessary to apply the liquid 16 to the entire surface of the first film 22. The dispenser may automatically apply the liquid 16 to the defective portion 36 under computer control. If there are a plurality of defective portions 36, the liquid 16 is applied to all the defective portions 36. After the repair, the heat absorbing member 14 is removed and the liquid 16 is wiped off. A robot that automatically removes the heat absorbing member 14 and wipes the liquid 16 may be provided.

第1フィルム22と熱吸収部材14との隙間を液体16で満たすことによって、第1フィルム22から熱吸収部材14への熱伝導を良くできる。有機層32への熱のダメージを極力小さくすることができる。   By filling the gap between the first film 22 and the heat absorbing member 14 with the liquid 16, heat conduction from the first film 22 to the heat absorbing member 14 can be improved. Heat damage to the organic layer 32 can be minimized.

以上、本発明の実施形態について説明したが、本発明は上記の実施形態に限定されるものではない。例えば、熱吸収部材14はガラス板15aと金属板15bを組み合わせた熱吸収部材14cであっても良い(図3)。金属板15bの中央にガラス板15aがある。レーザーLを照射するときは、ガラス板15aをレーザーLが通過するようにする。ガラス板15aは少なくともレーザーLが通過する大きさを有していればよい。金属板15bは熱伝導率がガラス板15aより高く、熱を多く吸収する。   As mentioned above, although embodiment of this invention was described, this invention is not limited to said embodiment. For example, the heat absorbing member 14 may be a heat absorbing member 14c in which a glass plate 15a and a metal plate 15b are combined (FIG. 3). There is a glass plate 15a in the center of the metal plate 15b. When the laser L is irradiated, the laser L passes through the glass plate 15a. The glass plate 15a should just have the magnitude | size which the laser L passes at least. The metal plate 15b has a higher thermal conductivity than the glass plate 15a and absorbs a lot of heat.

欠陥部分36の第1フィルム22の上に液体16を塗布してから熱吸収部材14を取り付けたが、熱吸収部材14に液体16を塗布してから第1フィルム22に熱吸収部材14を取り付けても良い。   The heat absorbing member 14 is attached after applying the liquid 16 on the first film 22 of the defective portion 36, but the heat absorbing member 14 is attached to the first film 22 after applying the liquid 16 to the heat absorbing member 14. May be.

封止するときに両フィルムの周縁を接着しただけであれば、第2フィルム24と金属電極34との間が接着されていないために隙間ができ、熱が第2フィルム24に伝わりにくい。しかし、第2フィルム24と金属電極34とが接着剤で接着されていれば、有機層32や金属電極34で発生した熱が第2フィルム24にも伝導される。したがって、第2フィルム24からも熱を吸収することができる。この場合、図4のリペア装置10cのように第2フィルム24の前面に熱吸収部材14を取り付けても良い。第1フィルム側からレーザーLを照射するので、第2フィルム側の熱吸収部材14を透明にする必要はなく、熱伝導率の高い金属であっても良い。熱吸収部材14と有機ELパネル20の保持台とが一体となっていても良い。本説明で第2フィルム24の前面は、金属電極34とは反対側の面である。   If only the peripheral edges of both films are bonded at the time of sealing, a gap is formed because the second film 24 and the metal electrode 34 are not bonded, and heat is not easily transmitted to the second film 24. However, if the second film 24 and the metal electrode 34 are bonded with an adhesive, the heat generated in the organic layer 32 and the metal electrode 34 is also conducted to the second film 24. Therefore, heat can be absorbed also from the second film 24. In this case, you may attach the heat absorption member 14 to the front surface of the 2nd film 24 like the repair apparatus 10c of FIG. Since the laser L is irradiated from the first film side, it is not necessary to make the heat absorbing member 14 on the second film side transparent, and a metal having high thermal conductivity may be used. The heat absorbing member 14 and the holding base for the organic EL panel 20 may be integrated. In this description, the front surface of the second film 24 is the surface opposite to the metal electrode 34.

また、上記の実施形態と同様に、第2フィルム24と熱吸収部材14との隙間に液体16を満たし、熱伝導を良くする。熱吸収部材14に液体16を塗布してから第2フィルム24に熱吸収部材14を取り付けても良い。   Similarly to the above embodiment, the gap between the second film 24 and the heat absorbing member 14 is filled with the liquid 16 to improve heat conduction. The heat absorbing member 14 may be attached to the second film 24 after the liquid 16 is applied to the heat absorbing member 14.

第1フィルム22と第2フィルム24の両側に熱吸収部材14を取り付けるようにし、熱を吸収するようにしても良い。第1フィルム22と熱吸収部材14との隙間、および第2フィルム24と熱吸収部材14との隙間に液体16を満たして、熱伝導を良くする。   The heat absorbing member 14 may be attached to both sides of the first film 22 and the second film 24 to absorb heat. The gap between the first film 22 and the heat absorbing member 14 and the gap between the second film 24 and the heat absorbing member 14 are filled with the liquid 16 to improve heat conduction.

液体16をディスペンサーで自動的に塗布する以外に、オペレーターが手動で塗布しても良い。有機ELパネル20にダメージを与えないのであれば、フッ素系の不活性液体に限定されることはなく、熱伝導率の高い液体を使用しも良い。液体16に金属微粉末を混入させ、液体16の熱伝導率を高めても良い。なお、金属微粉末の量が多いとレーザーLの減衰が大きくなるので、レーザーLの出力と減衰を考慮して金属粉末の量を決定する。   In addition to automatically applying the liquid 16 with a dispenser, the operator may apply it manually. As long as the organic EL panel 20 is not damaged, the organic EL panel 20 is not limited to a fluorine-based inert liquid, and a liquid having high thermal conductivity may be used. Metal fine powder may be mixed into the liquid 16 to increase the thermal conductivity of the liquid 16. Since the attenuation of the laser L increases when the amount of the metal fine powder is large, the amount of the metal powder is determined in consideration of the output and attenuation of the laser L.

その他、本発明は、その主旨を逸脱しない範囲で当業者の知識に基づき種々の改良、修正、変更を加えた態様で実施できるものである。   In addition, the present invention can be carried out in a mode in which various improvements, modifications, and changes are added based on the knowledge of those skilled in the art without departing from the spirit of the present invention.

リペア装置の構成を示す図である。It is a figure which shows the structure of a repair apparatus. 熱吸収部材が第1フィルムの一部を覆うように構成した図である。It is the figure comprised so that a heat absorption member might cover a part of 1st film. 熱吸収部材をガラス板と金属で構成した図である。It is the figure which comprised the heat absorption member with the glass plate and the metal. 第2フィルムの前面に熱吸収部材を配置した図である。It is the figure which has arrange | positioned the heat absorption member in the front surface of the 2nd film. 従来のリペア装置の構成を示す図である。It is a figure which shows the structure of the conventional repair apparatus. 従来のリペア装置をガラス基板を用いた有機ELパネルに適用した図である。It is the figure which applied the conventional repair apparatus to the organic electroluminescent panel using a glass substrate. リペア時の有機層と金属電極の温度変化を示した図である。It is the figure which showed the temperature change of the organic layer and metal electrode at the time of repair.

符号の説明Explanation of symbols

10:リペア装置
12:レーザー照射装置
14:熱吸収部材
16:液体
20:有機ELパネル
22、24:フィルム
26:有機EL素子
28:接着剤
30:透明電極
32:有機層
34:金属電極
36:欠陥箇所
L:レーザー
10: Repair device 12: Laser irradiation device 14: Heat absorption member 16: Liquid 20: Organic EL panel 22, 24: Film 26: Organic EL element 28: Adhesive 30: Transparent electrode 32: Organic layer 34: Metal electrode 36: Defect location L: Laser

Claims (5)

光透過性の第1フィルムと、
前記第1フィルムと対向する第2フィルムと、
前記第1フィルムと第2フィルムの間に形成され、第1フィルム側から透明電極、有機層、金属電極が順番に積層された有機EL素子と、
を含む有機ELパネルの欠陥箇所をリペアする有機ELパネルのリペア装置であって、
前記第1フィルム、第2フィルム、またはその両方の前面に配置される熱吸収部材と、
前記欠陥箇所にレーザーを照射するレーザー照射装置と、
を含むリペア装置。
A light transmissive first film;
A second film facing the first film;
An organic EL element formed between the first film and the second film, in which a transparent electrode, an organic layer, and a metal electrode are sequentially laminated from the first film side;
An organic EL panel repair device for repairing a defective portion of an organic EL panel including
A heat absorbing member disposed on the front surface of the first film, the second film, or both;
A laser irradiation device for irradiating the defect portion with a laser; and
Repair device including
前記有機ELパネルと熱吸収部材の隙間を満たす液体を含む請求項1のリペア装置。 The repair apparatus of Claim 1 containing the liquid with which the clearance gap between the said organic electroluminescent panel and a heat absorption member is included. 前記熱吸収部材が光透過性のガラス板を含み、前記液体がフッ素系の不活性液体を含む請求項2のリペア装置。 The repair device according to claim 2, wherein the heat absorbing member includes a light transmissive glass plate, and the liquid includes a fluorine-based inert liquid. 光透過性の第1フィルムと、
前記第1フィルムと対向する第2フィルムと、
前記第1フィルムと第2フィルムの間に形成され、第1フィルム側から透明電極、有機層、金属電極が順番に積層された有機EL素子と、
を含む有機ELパネルの欠陥箇所を、レーザーでリペアする有機ELパネルのリペア方法であって、
前記第1フィルム、第2フィルム、またはその両方の前面に熱吸収部材を配置するステップと、
前記欠陥箇所にレーザーを照射するステップと、
を含むリペア方法。
A light transmissive first film;
A second film facing the first film;
An organic EL element formed between the first film and the second film, in which a transparent electrode, an organic layer, and a metal electrode are sequentially laminated from the first film side;
A method for repairing an organic EL panel in which a defective portion of an organic EL panel including a laser is repaired with a laser,
Disposing a heat absorbing member on the front surface of the first film, the second film, or both;
Irradiating the defect with a laser;
Including repair method.
前記第1フィルム、第2フィルム、またはその両方と熱吸収部材との隙間に液体を満たすステップを含む請求項4のリペア方法。 The repair method of Claim 4 including the step which fills the liquid into the clearance gap between a said 1st film, a 2nd film, or both, and a heat absorption member.
JP2008039700A 2008-02-21 2008-02-21 Organic EL panel repair device and repair method Expired - Fee Related JP4990182B2 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003217849A (en) * 2002-01-29 2003-07-31 Sanyo Electric Co Ltd Manufacturing method for organic electroluminescence element
JP2004079432A (en) * 2002-08-21 2004-03-11 Nitto Denko Corp Transparent gas barrier member and organic electroluminescent element using it
JP2007299770A (en) * 1998-04-02 2007-11-15 Cambridge Display Technol Ltd Flexible base substrate for organic device, organic device, and its manufacturing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007299770A (en) * 1998-04-02 2007-11-15 Cambridge Display Technol Ltd Flexible base substrate for organic device, organic device, and its manufacturing method
JP2003217849A (en) * 2002-01-29 2003-07-31 Sanyo Electric Co Ltd Manufacturing method for organic electroluminescence element
JP2004079432A (en) * 2002-08-21 2004-03-11 Nitto Denko Corp Transparent gas barrier member and organic electroluminescent element using it

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