JP2009199687A - Transfer board manufacturing method, and transfer board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To form a high-quality transfer board having improved smoothness and a small number of defects. <P>SOLUTION: A transfer board manufacturing method includes: a step of placing a mold that has a center hole and a functional shape on the surface on a rotating plate; a step of coating the mold placed on the rotating plate with a liquid curing resin toroidally; a step of placing a film substrate on the coated curing resin for wetting; a step of rotating the rotating plate after the process for placing the film substrate for wetting and thereby spreading the curing resin onto an upper surface of the mold and onto the entire lower surface of the film substrate; a step of curing the curing resin spread by supplying chemical energy through the film substrate; and a step of separating a transfer layer obtained by the process for curing the curing resin and the film substrate from the mold. The transfer board manufacturing method also has a step of placing a member for covering the entire surface of the film substrate on the film substrate before the process for rotating the rotating plate. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a transfer substrate of a member having a functional shape (for example, a pregroove of an optical disc) and a transfer substrate.

  For example, when producing a surface-recording flexible optical disk applicable to a high NA (Numerical Aperture) pickup, first, a flexible transfer substrate is produced using a stamper (mold) having an uneven fine pattern by photolithography.

  This transfer substrate is produced by forming a transfer layer for transferring a fine pattern of a stamper on a film-like substrate using an ultraviolet curable resin or the like. In addition, some substrates are formed by further forming a protective film (hard coat film) on the substrate on which the transfer layer is formed. In addition, there are some which are manufactured by forming a protective film on a film-like substrate to which a fine pattern of a stamper is transferred. This transfer layer or protective film is a stamper (or a film substrate on the stamper) placed on a turntable such as a spinner in order to ensure that the ultraviolet curable resin has curing shrinkage and to ensure the uniformity of the resin film thickness. ) Is coated with an ultraviolet curable resin or the like on a ring and rotated, and the resin spread by centrifugal force is irradiated with ultraviolet rays to cure the resin.

  However, since the rotation using the centrifugal force is performed by shaking off at a high speed, a mist such as an ultraviolet curable resin is generated during the rotation. Therefore, conventionally, mist such as ultraviolet curable resin generated in this way has been forcibly removed using an exhaust means (see, for example, Patent Documents 1 and 2).

In the method described in Patent Document 1, a mist collecting portion is provided below the outer periphery of the rotary table, and after applying a liquid ultraviolet curable resin, the ultraviolet curable resin generated by rotating the disk is used. The mist is sucked under a negative pressure below the disk and exhausted. Further, in the method described in Patent Document 2, in addition to the exhaust ducts being provided above and below the rotary table that holds the disk substrate, a cover member is disposed so as to cover the periphery of the rotary table. Therefore, the mist floating in the cover member blown away from the outer periphery of the disk by centrifugal force is exhausted from the exhaust duct provided below, while the mist floating above the cover member is It is structured to be exhausted from an exhaust duct provided in the.
JP 2007-12197 A Japanese Patent Laid-Open No. 10-309510

  However, according to the method described in Patent Document 1, since the mist blown off by the centrifugal force tends to rise upward, if the negative pressure is sucked downward, there is a risk that the mist reattaches to the surface of the disk. There is sex. Further, since the upper space of the rotary table is covered with the housing of the UV irradiation device, the airflow above the disk is disturbed, and mist is easily adsorbed on the surface of the disk.

  Further, according to the method described in Patent Document 2, if the upper and lower exhaust speeds are the same, there is a place where the relative speed becomes zero, so that the mist in that part continues to float, There is a risk of mist re-adhering to the surface. Even if there is a difference between the upper and lower exhaust speeds, if the exhaust speed of the upper exhaust means is relatively higher than the lower exhaust speed, the mist that can be sucked in the lower direction is caused by the upper exhaust means having a higher exhaust speed. There is a risk of mist re-adhering to the surface of the disk because it is pulled.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a transfer substrate manufacturing method and a transfer substrate capable of manufacturing a high-quality transfer substrate with good smoothness and few defects. .

  In order to solve the above problems, the present invention employs means for solving the problems having the following characteristics.

  The invention described in claim 1 includes a step of placing a mold having a center hole and a functional shape on a surface thereof on a rotating plate, and an annular liquid curable resin on the mold placed on the rotating plate. After the step of coating, the step of placing and contacting the film substrate on the coated curable resin, and the step of placing and contacting the film substrate, the rotating plate is rotated, Spreading the curable resin over the entire upper surface of the mold and the entire lower surface of the film substrate, and curing the curable resin spread by the rotation by supplying chemical energy through the film substrate; In the transfer substrate manufacturing method including the transfer layer obtained by the step of curing the curable resin and the step of peeling the film substrate from the mold, the surface of the film substrate before the step of rotating the rotating plate Whole covering member A step of placing the film on a substrate.

  According to the first aspect of the present invention, in the method for manufacturing a transfer substrate having a functional shape, it is possible to manufacture a high-quality transfer substrate with good smoothness and few defects. In addition, since the curable resin mist does not adhere to the back surface of the film substrate, a high-quality transfer substrate can be manufactured.

  In the invention described in claim 2, the arrangement on the film substrate in the step of arranging on the film substrate is arranged in a non-contact state on the film substrate.

  According to invention of Claim 2, the member which covers the whole surface of the said film substrate and the said film substrate contacts directly by arrange | positioning the member which covers the whole surface of the said film substrate on the said film substrate in a non-contact state. Therefore, when the rotating plate is rotated, the film substrate is not scratched.

  According to a third aspect of the present invention, in the step of disposing on the film substrate, a member covering the entire surface of the film substrate is disposed on the film substrate via a spacer having a smaller surface area than the film substrate. To do.

  According to the third aspect of the present invention, the film substrate and the member covering the entire surface of the film substrate are separable and are not in direct contact with each other by being arranged through the spacer having a smaller surface area than the film substrate. When rotating the rotating plate, no scratches or the like are generated on the film substrate, and the member covering the entire surface of the film substrate can be easily removed.

  In the invention described in claim 4, in the step of disposing on the film substrate, an air stabilizer that covers the entire surface of the film substrate is disposed instead of a member that covers the entire surface of the film substrate.

  According to a fourth aspect of the present invention, when an air stabilizer that covers the entire surface of the film substrate is disposed on the film substrate, surface vibration of the film substrate is suppressed when the rotating plate is rotated. To act as possible, the film substrate is rotated very flat. Thereby, it is possible to form a transfer layer having a very uniform thickness, and at the same time, it is possible to prevent adhesion of the curable resin mist to the film substrate.

  According to a fifth aspect of the present invention, there is provided a step of forming a transfer layer and a film substrate on a mold having a center hole placed on a rotating plate and having a functional shape on the surface, and a liquid on the film substrate. A step of coating the curable resin in an annular shape, a step of placing and contacting the release substrate on the coated curable resin, and a step of placing and contacting the release substrate. A step of rotating the rotating plate to spread the liquid curable resin over the entire upper surface of the film substrate and the entire lower surface of the release substrate, and chemically spreading the curable resin spread by the rotation through the release substrate. Including a step of supplying and curing energy, a step of peeling the release substrate from a protective film obtained by a step of curing the curable resin, and a step of peeling the transfer layer and the film substrate from the mold. Transfer substrate manufacturing method There are, before the step of rotating the rotary plate, a step of disposing a member that covers the entire surface of the release substrate to the peeling substrate.

  According to the fifth aspect of the present invention, in the method for producing a transfer substrate having a functional shape, it is possible to produce a high-quality transfer substrate having good smoothness and few defects. In addition, since the curable resin mist does not adhere to the back surface of the film substrate or the back surface of the release substrate, a high-quality transfer substrate can be manufactured.

  According to a sixth aspect of the present invention, there is provided a step of forming a transfer film substrate on a mold having a central hole placed on a rotating plate and having a functional shape on the surface, and a liquid on the transfer film substrate. After the step of coating the curable resin in an annular shape, the step of placing and contacting the release substrate on the coated curable resin, and the step of placing and contacting the release substrate, the rotation A step of rotating the plate to spread the liquid curable resin over the entire upper surface of the film substrate and the lower surface of the release substrate, and the curable resin spread by the rotation with chemical energy via the release substrate. And a step of peeling the release substrate from the protective film obtained by the step of hardening the curable resin, and a step of peeling the protective film and the transfer film substrate from the mold. Transfer substrate manufacturing method Oite, before the step of rotating the rotary plate, a step of disposing a member that covers the entire surface of the release substrate to the peeling substrate.

  According to the sixth aspect of the present invention, it is possible to manufacture a high-quality transfer substrate with good smoothness and few defects. In addition, since the curable resin mist does not adhere to the back surface of the transfer film substrate or the back surface of the release substrate, a high-quality transfer substrate can be manufactured.

  In a seventh aspect of the invention, in the step of arranging on the release substrate, a member covering the entire surface of the release substrate is arranged on the release substrate via a spacer having a smaller surface area than the release substrate. To do.

  According to the seventh aspect of the present invention, the release substrate and the member covering the entire surface of the release substrate are separable and are not in direct contact with each other by being arranged via a spacer having a smaller surface area than the release substrate. When the rotating plate is rotated, no scratches or the like are generated on the release substrate, and the member covering the entire surface of the release substrate can be easily removed.

  In the invention described in claim 8, in the step of disposing on the release substrate, an air stabilizer that covers the entire surface of the release substrate is disposed instead of a member that covers the entire surface of the release substrate.

  According to the invention described in claim 8, by arranging an air stabilizer that covers the entire surface of the release substrate on the release substrate, when the rotating plate is rotated, surface vibration of the release substrate is suppressed. In order to act as possible, the release substrate is rotated extremely flat. As a result, it is possible to form a protective film having a very uniform thickness, and at the same time, it is possible to prevent the curable resin from being deposited on the release substrate.

  The invention described in claim 9 is a transfer substrate manufactured by the transfer substrate manufacturing method according to any one of claims 1 to 8.

  According to the ninth aspect of the present invention, in the transfer substrate manufacturing method according to any one of the first to eighth aspects, it is possible to manufacture a transfer substrate having good smoothness and few defects. Moreover, since the curable resin mist does not adhere to the back surface of the film substrate or the transfer substrate and the back surface of the release substrate, a high-quality transfer substrate can be produced.

  According to the present invention, it is possible to provide a transfer substrate manufacturing method capable of manufacturing a high-quality transfer substrate with good smoothness and few defects.

  Next, the best mode for carrying out the present invention will be described with reference to the drawings. In FIGS. 1, 5, 6 and 7 for explaining the embodiments described below, the right side of each layer (including the substrate, stamper, etc.) shown in the figure is the shaft side on which a rotating plate (turn table) described later rotates. The left side is the rotation end.

(First embodiment)
FIG. 1 is a diagram for explaining a method for producing a surface recording type or optical substrate transmission type optical disc according to the present invention.

  First, as shown in FIG. 1A, a disk-shaped mold having a pregroove shape 30 formed by, for example, photolithography on a magnet 20 of a turntable 10 that is a rotating plate, and having a center hole. A stamper 40 is placed.

  Next, about 0.5 cc of the photocurable resin 50-1 is applied in the vicinity of the center hole of the stamper 40. In application, for example, the photocurable resin 50-1 is applied in an annular shape using a plunger pump or the like. Moreover, in this embodiment, a thermosetting resin etc. can also be used instead of a photocurable resin.

  Next, a PC (Poly Carbonate) film substrate 60 having a center hole is placed and wetted on the coated photocurable resin 50-1.

  Here, for example, an acrylate monomer material or the like is used as the photocurable resin 50-1, and a high bar pump CV or the like manufactured by Unicontrols can be used as the plunger pump. For the PC film substrate 60, for example, Teijin Pure Ace can be used.

  Next, as shown in FIG. 1B, a wafer spacer 80 is placed on the PC film substrate 60 via a disk spacer 70. The disk spacer 70 is preferably a spacer having a surface area smaller than that of the PC film substrate 60. For example, an inner diameter of 15 mm, an outer diameter of 32 mm, and a thickness of 1.2 mm can be used. The wafer spacer 80 is preferably a member that covers the entire surface of the PC film substrate 60. For example, an inner diameter 15 mm, an outer diameter 150 mm, a thickness 90 μm, or the like of a Stacrine NB flat manufactured by Japan Airtech Co., Ltd. may be used. it can.

  Here, by using the disk spacer 70, the PC film substrate 60 and the wafer spacer 80 are arranged in a separable state and do not directly contact each other. As a result, no scratches or the like are generated on the film substrate 60 when the turntable described later is rotated, and a high-quality transfer substrate with few defects can be manufactured.

  Further, when the disk spacer 70 is not used, it is preferable to dispose the wafer spacer 80 on the PC film substrate 60 in a non-contact state. As a result, no scratches or the like are generated on the film substrate 60 when the turntable described later is rotated, and a high-quality transfer substrate with few defects can be manufactured.

  Next, the turntable 10 is rotated at a predetermined speed for a predetermined time. The turntable 10 is rotated at approximately 3000 rpm for 20 seconds when the photocurable resin 50-1 spreads inward from the recording area of the stamper 40 due to, for example, capillary action. The rotation speed and rotation time in the present embodiment are not limited to this in the present invention, and are arbitrarily set depending on, for example, the radius of the stamper 40 and the PC film substrate 60, the material of the photocurable resin 50-1, and the like. .

  By the rotation, as shown in FIG. 1C, the photocurable resin 50-1 spreads over the upper surface of the stamper 40 and the entire lower surface of the PC film substrate 60. Further, since the rotation is swung away at high speed using centrifugal force, the photocurable resin 50-1 spreads between the stamper 40 and the PC film substrate 60, and a transfer formed by the photocurable resin 50-1 described later. The layer 52-1 is a layer having a uniform thickness.

  On the other hand, the mist 90 of the photocurable resin 50-1 is generated by the rotation. The mist 90 tends to rise upward as described above, but as shown in FIG. 1C, a wafer spacer 80 covering the entire surface of the PC film substrate 60 is placed close to the PC film substrate 60. Therefore, the mist 90 adheres on the wafer spacer 80. Thus, the wafer spacer 80 functions as a mist prevention material. Thereby, since the mist 90 does not adhere to the back surface of the PC film substrate 60, smoothness is good, and a high-quality transfer substrate can be manufactured.

  Next, as shown in FIG. 1D, the disk spacer 70 and the wafer spacer 80 on the PC film substrate 60 are removed. As described above, the wafer spacer 80 on the PC film substrate 60 is placed via the disk spacer 70. As a result, the wafer spacer 80 covering the entire surface of the PC film substrate 60 and the PC film substrate 60 are not in direct contact with each other, so that the wafer spacer 80 can be easily removed, and a high-quality transfer substrate with few defects can be manufactured. .

  Next, as shown in FIG. 1D, on the photocurable resin 50-1 spreading over the entire upper surface of the stamper 40 and the entire lower surface of the PC film substrate 60 through the PC film substrate 60, for example, light energy or the like. Supply chemical energy, etc. Thereby, the photocurable resin 50-1 is cured. Further, by this curing, a transfer layer 52-1 is formed on the stamper 40, and the transfer layer 52-1 and the PC film substrate 60 are bonded.

In addition, as provision of light energy etc., it is preferable to irradiate for about 5 seconds, for example using the pulse UV irradiation apparatus RC-500B (3000mW / cm < ² >) by a xenon company. Moreover, when a thermosetting resin is used instead of the photocurable resin 50-1, thermal energy or the like can be applied.

  Next, as shown in FIG. 1 (E), with the stamper 40 and the transfer layer 52-1 in close contact with each other, about 0.5 cc of the photocurable resin 50-2 is further provided near the center hole of the PC film substrate 60. Apply. In the application, for example, the photocurable resin 50-2 is applied in an annular shape using a plunger pump or the like. Moreover, in this embodiment, a thermosetting resin etc. can be used instead of a photocurable resin, for example.

  Next, the release substrate 100 is placed and wetted on the coated photocurable resin 50-2. Here, for example, an acrylate monomer material or the like is used for the photocurable resin 50-2, and a high bar pump CV or the like manufactured by Unicontrols can be used for the plunger pump, for example. The release substrate 100 may be made of, for example, a polyethylene terephthalate (PET) substrate (Toyobo Cosmo Shine A4100) or the like having a release property even after the photocurable resin 50-2 is cured.

  Next, as shown in FIG. 1F, a wafer spacer 80 is mounted on the separation substrate 100 with a disk spacer 70 interposed therebetween. The disk spacer 70 is preferably a spacer having a surface area smaller than the surface area of the release substrate 100. For example, an inner diameter of 15 mm, an outer diameter of 32 mm, and a thickness of 1.2 mm can be used. Wafer spacer 80 is preferably a member that covers the entire surface of release substrate 100. For example, STAKLIN NB flat manufactured by Nippon Airtech Co., Ltd. can have an inner diameter of 15 mm, an outer diameter of 150 mm, a thickness of 90 μm, and the like. .

  Here, by using the disk spacer 70, the release substrate 100 and the wafer spacer 80 are arranged in a separable state and do not directly contact each other. As a result, no scratches or the like are generated on the peeling substrate 100 during the turntable rotation described later, and a high-quality transfer substrate with few defects can be manufactured.

  Further, when the disk spacer 70 is not used, it is preferable that the wafer spacer 80 is disposed on the release substrate 100 in a non-contact state. As a result, no scratches or the like are generated on the peeling substrate 100 during the turntable rotation described later, and a high-quality transfer substrate with few defects can be manufactured.

  Next, the turntable 10 is rotated at a predetermined speed for a predetermined time. The turntable 10 is rotated at about 3000 rpm for 20 seconds when the photocurable resin 50-2 spreads inward from the recording area of the stamper 40 due to, for example, capillary action. Note that the rotation speed and rotation time in the present embodiment are not limited to this in the present invention. For example, depending on the radius of the stamper 40, the PC film substrate 60, and the release substrate 100, the material of the photocurable resin 50-2, and the like. Set arbitrarily.

  1G, the photocurable resin 50-2 spreads over the upper surface of the PC film substrate 60 and the entire lower surface of the release substrate 100. Further, since the rotation is shaken off at high speed using centrifugal force, the photocurable resin 50-2 spreads between the PC film substrate 60 and the release substrate 100, and a photocurable resin 50-2 described later is formed. The film thickness uniformity of the protective film 56-1 can be ensured.

  On the other hand, the mist 90 of the photocurable resin 50-2 is generated by the rotation. The mist 90 tends to soar upward as described above, but as shown in FIG. 1G, a wafer spacer 80 that covers the surface of the release substrate 100 is disposed close to the release substrate 100. Therefore, the mist 90 adheres on the wafer spacer 80. Thus, the wafer spacer 80 functions as a mist prevention material. Thereby, since the mist 90 does not adhere to the back surface of the peeling substrate 100, smoothness is good, and a high-quality transfer substrate can be manufactured.

  Next, as shown in FIG. 1H, the disk spacer 70 and the wafer spacer 80 on the separation substrate 100 are removed. As described above, the wafer spacer 80 on the release substrate 100 is placed via the disk spacer 70. Thereby, since the wafer spacer 80 covering the surface of the release substrate 100 and the release substrate 100 are not in direct contact with each other, the wafer spacer 80 can be easily removed, and a high-quality transfer substrate with few defects can be manufactured.

  Next, as shown in FIG. 1H, on the photocurable resin 50-2 spread over the entire upper surface of the PC film substrate 60 and the entire lower surface of the release substrate 100 through the release substrate 100, for example, light energy or the like. Supply chemical energy, etc. Thereby, the photocurable resin 50-2 is cured. Further, by this curing, a protective film (hard coat film) 56-1 is formed on the PC film substrate 60, and the PC film substrate 60 is bonded.

In addition, as provision of light energy etc., it is preferable to irradiate for about 5 seconds, for example using the pulse UV irradiation apparatus RC-500B (3000mW / cm < ² >) by a xenon company. Moreover, when a thermosetting resin etc. are used instead of the photocurable resin 50-2, a thermal energy etc. can also be provided.

  Here, FIG. 2 is a diagram showing an example of the surface state of the protective film produced in the first embodiment of the present invention. As shown in FIG. 2, the surface of the protective film 56-1 was formed with good smoothness.

  Next, as shown in FIG. 1I, the peeling substrate 100 and the stamper 40 are peeled from the transfer layer 52-1, the PC film substrate 60, and the protective film 56-1. Thereby, the transfer substrate 70 including the transfer layer 52-1, the PC film substrate 60, and the protective film 56-1 is produced.

  Here, FIG. 3 is a diagram illustrating an example of the surface states of the transfer layer 52-1 and the protective film 56-1 of the transfer substrate 70 manufactured in the first embodiment of the present invention. As shown in FIG. 3, the transfer substrate 70 in which the transfer layer 52-1 and the protective film 56-1 with smooth surfaces were formed above and below the PC film substrate 60 was obtained.

  As described above, in the transfer substrate 70 manufactured by the above manufacturing method, when the turntable 10 is rotated, the wafer spacers 80 covering the entire surface of the transfer substrate 70 are arranged close to each other on the PC film substrate 60 and the release substrate 100. . Thereby, since the mist 90 of the photocurable resin 50 generated when the turntable 10 is rotated does not adhere to the back surface of the PC film substrate 60 and the back surface of the release substrate 100, the transfer layer 52-1 having good smoothness and The protective film 56-1 can be formed.

  Further, on the PC film substrate 60 and the release substrate 100, a wafer spacer 80 is disposed via a disk spacer 70 having an area smaller than each surface area. Thereby, when the turntable 10 is rotated, the PC film substrate 60 or the peeling substrate 100 and the wafer spacer 80 are not in direct contact with each other, so that no scratch is generated. Similarly, the wafer spacer 80 can be easily removed. This makes it possible to manufacture a high-quality transfer substrate with few defects.

  Therefore, the transfer substrate 70 manufactured by the above manufacturing method is a high-quality transfer substrate with good smoothness and few defects.

Here, FIG. 4 is a diagram showing reproduction signal characteristics and RF signal characteristics of the disc manufactured in the first embodiment of the present invention. Note that FIG. 4 shows the surface run-out acceleration (M / s ² ) at the rotation angle (Rotation angle / deg) and the residual focus error after the focus servo operation (Residual axial run-out focus focus (μm)). Is shown. According to the first embodiment of the present invention, a disk on which a recording film is formed has a good focus and tracking, and a disk with good reflectance (RF signal) having a flat reproduction signal characteristic as shown in FIG. 4 is obtained. I was able to.

(Second Embodiment)
Next, a second embodiment according to the present invention will be described. FIG. 5 is a diagram for explaining a method for producing a surface recording type or optical substrate transmission type optical disc according to the present invention.

  Here, the second embodiment of the present invention described below describes a manufacturing method for forming a protective film on a transfer film substrate to which the pre-groove shape 30 of the stamper 40 is transferred.

  First, as shown in FIG. 5A, a PC (having a center hole on a stamper 40 having a pre-groove shape 30 formed by, for example, photolithography or the like and further having a center hole. (Poly Carbonate) film substrate 60 is placed. For the PC film substrate 60, for example, Teijin Pure Ace can be used.

  Next, the entire surface of the stamper 40 and the PC film substrate 60 is heated and pressurized uniformly using the upper and lower heaters 110 and 120, for example.

  Specifically, from the state shown in FIG. 5A, as shown in FIG. 5B, for example, the stamper 40 heated to 150 ° C. is imprinted on the PC film substrate 60 at about 14 MPa for 20 minutes. Note that the PC film substrate 60 can be prevented from being bent by uniformly heating the entire surface from above and below using the upper and lower heaters 110 and 120.

  As a result, the pre-groove shape 30 of the stamper 40 is transferred to the PC film substrate 60, and the transfer film substrate 66 is formed on the stamper 40.

  Next, as shown in FIG. 5C, the upper and lower heaters 110 and 120 are released, and the stamper 40 and the transfer film substrate 66 are cooled. In cooling, for example, cooling may be performed at normal temperature, or cooling may be performed by temperature control using a cooling unit that circulates cooling water or the like through the heater to lower the temperature.

  Next, as shown in FIG. 5D, the stamper 40 and the transfer film substrate 66 are placed on the magnet 20 of the turntable 10 as a rotating plate in a state where the stamper 40 and the transfer film substrate 66 are in close contact with each other.

  Next, about 0.5 cc of the photocurable resin 50-3 is applied in the vicinity of the center hole of the transfer film substrate 66. In the application, the photocurable resin 50-3 is applied in an annular shape using, for example, a plunger pump. Moreover, in this embodiment, a thermosetting resin etc. can be used instead of a photocurable resin, for example.

  Next, the release substrate 100 is placed and wetted on the coated photocurable resin 50-3. Here, for example, an acrylate monomer material or the like is used for the photo-curable resin 50-3, and a high bar pump CV or the like manufactured by Unicontrols can be used for the plunger pump, for example. Moreover, as the peeling substrate 100, for example, a polyethylene terephthalate (PET) substrate (Toyobo Cosmo Shine A4100) having a peeling property even after the photocurable resin 50-3 is cured can be used.

  Next, as shown in FIG. 5E, a wafer spacer 80 is mounted on the release substrate 100 with a disk spacer 70 interposed therebetween. The disk spacer 70 is preferably a spacer having a surface area smaller than the surface area of the release substrate 100. For example, an inner diameter of 15 mm, an outer diameter of 32 mm, and a thickness of 1.2 mm can be used. Wafer spacer 80 is preferably a member that covers the entire surface of release substrate 100. For example, STAKLIN NB flat manufactured by Nippon Airtech Co., Ltd. can have an inner diameter of 15 mm, an outer diameter of 150 mm, a thickness of 90 μm, and the like. .

  Here, by using the disk spacer 70, the release substrate 100 and the wafer spacer 80 are arranged in a separable state and do not directly contact each other. As a result, no scratches or the like are generated on the peeling substrate 100 during the turntable rotation described later, and a high-quality transfer substrate with few defects can be manufactured.

  Further, when the disk spacer 70 is not used, it is preferable that the wafer spacer 80 is disposed on the release substrate 100 in a non-contact state. As a result, no scratches or the like are generated on the peeling substrate 100 during the turntable rotation described later, and a high-quality transfer substrate with few defects can be manufactured.

  Next, the turntable 10 is rotated at a predetermined speed for a predetermined time. The turntable 10 is rotated at about 3000 rpm for 20 seconds when the photocurable resin 50-3 spreads inward from the recording area of the stamper 40 due to, for example, capillary action. Note that the rotation speed and rotation time in the present embodiment are not limited to this in the present invention. For example, depending on the radius of the stamper 40, the transfer film substrate 66, and the release substrate 100, the material of the photocurable resin 50-3, and the like. Set arbitrarily.

  By the rotation, the photocurable resin 50-3 spreads over the entire upper surface of the transfer film substrate 66 and the lower surface of the release substrate 100 as shown in FIG. Further, since the rotation is swung away at high speed using centrifugal force, the photocurable resin 50-3 spreads between the transfer film substrate 66 and the release substrate 100, and a photocurable resin 50-3 described later is formed. The film thickness uniformity of the protective film 56-2 can be ensured.

  On the other hand, the mist 90 of the photocurable resin 50-3 is generated by the rotation. The mist 90 tends to rise upward as described above, but as shown in FIG. 5F, a wafer spacer 80 that covers the surface of the release substrate 100 is disposed close to the release substrate 100. Therefore, the mist 90 adheres on the wafer spacer 80. Thus, the wafer spacer 80 functions as a mist prevention material. Thereby, since the mist 90 does not adhere to the back surface of the peeling substrate 100, smoothness is good, and a high-quality transfer substrate can be manufactured.

  Next, as shown in FIG. 5G, the disk spacer 70 and the wafer spacer 80 on the separation substrate 100 are removed. As described above, the wafer spacer 80 on the release substrate 100 is placed via the disk spacer 70. Thereby, since the wafer spacer 80 covering the surface of the release substrate 100 and the release substrate 100 are not in direct contact with each other, the wafer spacer 80 can be easily removed, and a high-quality transfer substrate with few defects can be manufactured.

  Next, as shown in FIG. 5G, for example, light energy or the like is formed on the photocurable resin 50-3 spread over the entire upper surface of the transfer film substrate 66 and the entire lower surface of the release substrate 100 via the release substrate 100. Supply chemical energy, etc. Thereby, the photocurable resin 50-3 is cured. In addition, a protective film (hard coat film) 56-2 is formed on the transfer film substrate 66 by this curing. The surface of the protective film 56-2 formed in this way showed a state of good smoothness equivalent to that shown in FIG.

In addition, as provision of light energy etc., it is preferable to irradiate for about 5 seconds, for example using the pulse UV irradiation apparatus RC-500B (3000mW / cm < ² >) by a xenon company. Moreover, when a thermosetting resin etc. are used instead of the photocurable resin 50-3, a thermal energy etc. can also be provided.

  Next, as shown in FIG. 5H, the peeling substrate 100 and the stamper 40 are peeled from the transfer film substrate 66 and the protective film 56-2. Thereby, a transfer substrate 72 composed of the transfer film substrate 66 and the protective film 56-2 is produced. In this way, a transfer substrate 72 in which a protective film 56-2 having a smooth surface equivalent to that shown in FIG. 3 was formed on the transfer film substrate 66 was obtained.

  In the transfer substrate 72 manufactured by the above manufacturing method, when the turntable 10 is rotated, a wafer spacer 80 that is a member that covers the release substrate 100 is disposed close to the release substrate 100. Thereby, since the mist 90 of the photocurable resin 50 generated when the turntable rotates does not adhere to the back surface of the release substrate 100, it is possible to form the protective film 56-2 having good smoothness.

  A wafer spacer 80 is disposed on the release substrate 100 via a disk spacer 70 having an area smaller than the surface area of the release substrate 100. Thereby, when the turntable 10 is rotated, the peeling substrate 100-1 and the wafer spacer 80 are not in direct contact with each other, so that no scratch is generated. Similarly, when the wafer spacer 80 is removed, the removal becomes easy. This makes it possible to manufacture a high-quality transfer substrate with few defects.

  Therefore, the transfer substrate 72 manufactured by the above manufacturing method is a high-quality transfer substrate with good smoothness and few defects.

According to the second embodiment of the present invention, the disk on which the recording film is formed has good focus and tracking, and the reproduction signal characteristic equivalent to that shown in FIG. 4 has a flat reflectance (RF signal). Could get. Note that FIG. 4 illustrates the surface runout acceleration (m / s ² ) at the rotation angle (Rotation angle / deg) and the residual focus error after the focus servo operation (Residual axial runout focus drive (μm)). Is shown.

(Third embodiment)
Next, a third embodiment according to the present invention will be described. FIG. 6 is a diagram for explaining a method for producing a surface recording type or optical substrate transmission type optical disc according to the present invention.

  Here, the third embodiment of the present invention described below describes a manufacturing method for forming a transfer layer, a film substrate, and a protective film using an air stabilizer instead of the wafer spacer used in the first embodiment. .

  First, as shown in FIG. 6A, a disc-shaped mold having a pregroove shape 30 formed by, for example, photolithography on the magnet 20 of the turntable 10 which is a rotating plate, and having a center hole. A stamper 40 is placed.

  Next, about 0.5 cc of the photocurable resin 50-4 is applied in the vicinity of the center hole of the stamper 40. In application, the photocurable resin 50-4 is applied in an annular shape using, for example, a plunger pump. Moreover, in this embodiment, a thermosetting resin etc. can also be used instead of a photocurable resin.

  Next, a PC (Poly Carbonate) film substrate 60 having a central hole is placed and wetted on the coated photocurable resin 50-4. Here, for example, an acrylate monomer material or the like is used as the photocurable resin 50-4, and a plunger pump such as a high bar pump CV manufactured by Unicontrols can be used. For the PC film substrate 60, for example, Teijin Pure Ace can be used.

  Next, as shown in FIG. 6B, the turntable 10 is rotated at a predetermined speed for a predetermined time. The turntable 10 is rotated at about 3000 rpm for 20 seconds when the photocurable resin 50-4 spreads inward from the recording area of the stamper 40 due to, for example, capillary action. In the present invention, the rotation speed and the rotation time in the present embodiment are not limited to this, and are arbitrarily set depending on, for example, the material of the stamper 40, the film substrate 60, and the photocurable resin 50-4.

  Moreover, in the state which is rotating the turntable 10, as shown to FIG. 6 (B), the air stabilizer 130 is arrange | positioned on the PC film board | substrate 60. FIG. At this time, it is preferable that the air stabilizer 130 covers the entire surface of the PC film substrate 60, and the arrangement of the air stabilizer 130 on the PC film substrate 60 is such that the air stabilizer 130 is close to the PC film substrate 60. preferable. As the air stabilizer 130, for example, a brass plate having a center hole inner diameter of 32 mm, an outer diameter of 125 mm, and a thickness of 6 mm can be used.

  The air stabilizer 130 functions to stabilize and suppress the surface shake of the PC film substrate 60 when the turntable 10 is rotated by the aerodynamic pressure. Therefore, the PC film substrate 60 rotates extremely flat. To do. Thereby, the photocurable resin 50-4 spreading between the stamper 40 and the PC film substrate 60 has a uniform thickness, and the transfer layer 52-2 formed by being cured by supplying light energy or the like described later is The layer has a very uniform thickness.

  Furthermore, as shown in FIG. 6 (C), since the air stabilizer 130 covering the surface of the PC film substrate 60 is disposed close to the PC film substrate 60, the photocurable resin 50-4 is provided. The mist 90 adheres to the air stabilizer 130. Thus, the air stabilizer 130 also functions as a mist prevention material. Thereby, since the mist 90 does not adhere to the back surface of the PC film substrate 60, smoothness is good, and a high-quality transfer substrate can be manufactured.

  Next, as shown in FIG. 6D, the air stabilizer 130 is retracted, and the photocurable resin 50 spreads over the upper surface of the stamper 40 and the entire lower surface of the PC film substrate 60 via the PC film substrate 60. -4 is supplied with chemical energy such as light energy. Thereby, the photocurable resin 50-4 is cured. Further, by this curing, a transfer layer 52-2 is formed on the stamper 40, and the transfer layer 52-2 and the PC film substrate 60 are bonded.

In addition, as provision of light energy etc., it is preferable to irradiate for about 5 seconds, for example using the pulse UV irradiation apparatus RC-500B (3000mW / cm < ² >) by a xenon company. Moreover, when a thermosetting resin is used instead of the photocurable resin 50-4, thermal energy or the like can be applied.

  Next, as shown in FIG. 6 (E), with the stamper 40 and the transfer layer 52-2 being in close contact with each other, the photocurable resin 50-5 is further added to the vicinity of the center hole of the PC film substrate 60 by about 0.00. Apply 5cc. In the application, the photocurable resin 50-5 is applied in an annular shape using, for example, a plunger pump. Moreover, in this embodiment, a thermosetting resin etc. can be used instead of a photocurable resin, for example.

  Next, the release substrate 100 is placed and wetted on the coated photocurable resin 50-5. Here, for example, an acrylate monomer material or the like is used as the photocurable resin 50-5, and a high bar pump CV or the like manufactured by Unicontrols can be used as the plunger pump, for example. Further, as the release substrate 100, for example, a polyethylene terephthalate (PET) substrate (Toyobo Cosmo Shine A4100) or the like having release properties even after the photocurable resin 50-5 is cured can be used.

  Next, as shown in FIG. 6F, the turntable 10 is rotated at a predetermined speed for a predetermined time. The turntable 10 is rotated at about 3000 rpm for 20 seconds when the photocurable resin 50-5 spreads inward from the recording area of the stamper 40 due to, for example, capillary action. In the present invention, the rotation speed and rotation time in the present embodiment are not limited to this, and are arbitrarily set depending on, for example, the material of the stamper 40, the film substrate 60, the release substrate 100, and the photocurable resin 50-5. The

  Moreover, in the state which is rotating the turntable 10, as shown to FIG. 6 (F), the air stabilizer 130 is arrange | positioned on the PC film board | substrate 60. FIG. At this time, it is preferable that the air stabilizer 130 covers the entire surface of the PC film substrate 60, and the arrangement of the air stabilizer 130 on the PC film substrate 60 is such that the air stabilizer 130 is close to the PC film substrate 60. preferable. As the air stabilizer 130, for example, a brass plate having a center hole inner diameter of 32 mm, an outer diameter of 125 mm, and a thickness of 6 mm can be used.

  The air stabilizer 130 exhibits a function of stabilizing and suppressing surface vibration of the peeling substrate 100 when the turntable 10 is rotated by aerodynamic pressure, and thus the peeling substrate 100 rotates extremely flat. Thereby, the photocurable resin 50-5 spread between the PC film substrate and the release substrate 100 has a uniform thickness, and is formed by being cured by supplying light energy or the like which will be described later. Becomes a film having a very uniform thickness.

  Further, as shown in FIG. 6 (G), an air stabilizer 130 that covers the entire surface of the release substrate 100 is disposed close to the release substrate 100. The mist 90 is deposited on the air stabilizer 130. Thus, the air stabilizer 130 also functions as a mist prevention material. Thereby, since the mist 90 does not adhere to the back surface of the peeling substrate 100, smoothness is good, and a high-quality transfer substrate can be manufactured.

  Next, as shown in FIG. 6 (H), the air stabilizer 130 is retracted, and the photocurable resin 50 spreads over the upper surface of the PC film substrate 60 and the entire lower surface of the release substrate 100 via the release substrate 100. For example, chemical energy such as light energy is supplied onto -5. Thereby, the photocurable resin 50-5 is cured. In addition, a protective film (hard coat film) 56-3 is formed on the PC film substrate 60 by this curing. The surface of the protective film 56-3 formed in this way showed a state of good smoothness equivalent to that shown in FIG.

In addition, as provision of light energy etc., it is preferable to irradiate for about 5 seconds, for example using the pulse UV irradiation apparatus RC-500B (3000mW / cm < ² >) by a xenon company. Moreover, when a thermosetting resin etc. are used instead of the photocurable resin 50-5, a thermal energy etc. can also be provided.

  Next, as shown in FIG. 6I, the release substrate 100 and the stamper 40 are peeled from the transfer layer 52-2, the PC film substrate 60, and the protective film 56-3. Thereby, the transfer substrate 74 including the transfer layer 52-2, the PC film substrate 60, and the protective film 56-3 is produced. The transfer substrate 74 thus produced was formed with a transfer layer 52-2 and a protective film 56-3 having smooth surfaces equivalent to those shown in FIG. 3 above and below the PC film substrate 60.

  When the turntable 10 is rotated, the transfer substrate 74 manufactured by the above manufacturing method is disposed on the PC film substrate 60 and the release substrate 100 in close proximity to the air stabilizer 130 that is a member that covers the entire surface. is doing. Thereby, since the mist 90 of the photocurable resin 50 generated when the turntable rotates does not adhere to the back surface of the PC film substrate 60 and the back surface of the release substrate 100, the transfer layer 52-2 and the protective film 56- having good smoothness. 3 can be formed.

  Further, the air stabilizer 130 stabilizes and suppresses the respective surface shakes of the PC film substrate 60 or the peeling substrate 100 by the aerodynamic pressure when the turntable is rotated. The substrate 100 rotates extremely flat. Thereby, the transfer layer 52-2 and the protective film 56-3 to be formed are layers and films having a very uniform thickness.

  Therefore, the transfer substrate 74 manufactured by the above manufacturing method is a high-quality transfer substrate with good smoothness and few defects.

According to the third embodiment of the present invention, the disc on which the recording film is formed has good focus and tracking, and the reproduction signal characteristic equivalent to that shown in FIG. 4 has a flat reflectance (RF signal). Could get. Note that FIG. 4 illustrates the surface runout acceleration (m / s ² ) at the rotation angle (Rotation angle / deg) and the residual focus error after the focus servo operation (Residual axial runout focus drive (μm)). Is shown.

(Fourth embodiment)
Next, a fourth embodiment according to the present invention will be described. FIG. 7 is a diagram for explaining a method for producing a surface recording type or optical substrate transmission type optical disc according to the present invention.

  Here, the fourth embodiment of the present invention described below describes a manufacturing method for forming a transfer film substrate and a protective film using an air stabilizer instead of the wafer spacer used in the second embodiment.

  First, as shown in FIG. 7A, a PC (having a center hole on a stamper 40 having a pre-groove shape 30 formed by, for example, photolithography or the like and further having a center hole. (Poly Carbonate) film substrate 60 is placed. For the PC film substrate 60, for example, Teijin Pure Ace can be used.

  Next, the entire surface of the stamper 40 and the PC film substrate 60 is heated and pressurized uniformly using the upper and lower heaters 110 and 120, for example.

  Specifically, from the state shown in FIG. 7A, as shown in FIG. 7B, for example, the stamper 40 heated to 150 ° C. is imprinted on the PC film substrate 60 at 14 MPa for 20 minutes. Note that the PC film substrate 60 can be prevented from being bent by uniformly heating the entire surface from above and below using the upper and lower heaters 110 and 120.

  As a result, the pre-groove shape 30 of the stamper 40 is transferred to the PC film substrate 60, and the transfer film substrate 66 is formed on the stamper 40.

  Next, as shown in FIG. 7C, the upper and lower heaters 110 and 120 are released, and the stamper 40 and the transfer film substrate 66 are cooled. In cooling, for example, cooling may be performed at normal temperature, or cooling may be performed by temperature control using a cooling unit that circulates cooling water or the like through the heater to lower the temperature.

  Next, as shown in FIG. 7D, the stamper 40 and the transfer film substrate 66 are placed on the magnet 20 of the turntable 10 which is a rotating plate in a state where the stamper 40 and the transfer film substrate 66 are in close contact with each other.

  Next, about 0.5 cc of photocurable resin 50-6 is applied in the vicinity of the center hole of the transfer film substrate 66. In the application, the photocurable resin 50-6 is applied in an annular shape using, for example, a plunger pump. Moreover, in this embodiment, a thermosetting resin etc. can be used instead of a photocurable resin, for example.

  Next, the release substrate 100 is placed and wetted on the coated photocurable resin 50-6. Here, for example, an acrylate monomer material or the like is used as the photocurable resin 50-6, and a high bar pump CV or the like manufactured by Unicontrols can be used as the plunger pump. Further, as the release substrate 100, for example, a polyethylene terephthalate (PET) substrate (Toyobo Cosmo Shine A4100) having a release property even after the photocurable resin 50-6 is cured can be used.

  Next, as shown in FIG. 7E, the turntable 10 is rotated at a predetermined speed for a predetermined time. The rotation of the turntable 10 is performed at about 3000 rpm for 20 seconds when, for example, the photocurable resin 50-6 spreads inward from the recording area of the stamper 40 due to a capillary phenomenon. The rotation speed and rotation time in the present embodiment are not limited to this in the present invention, and are arbitrarily set depending on, for example, the material of the stamper 40, the transfer film substrate 66, the release substrate 100, and the photocurable resin 50-6. Is done.

  Further, in the state where the turntable 10 is rotated, the air stabilizer 130 is disposed on the PC film substrate 60 as shown in FIG. At this time, it is preferable that the air stabilizer 130 covers the entire surface of the release substrate 100, and the arrangement of the air stabilizer 130 on the release substrate 100 is preferably close to the release substrate 100. As the air stabilizer 130, for example, a brass plate having a center hole inner diameter of 32 mm, an outer diameter of 125 mm, and a thickness of 6 mm can be used.

  The air stabilizer 130 exhibits a function of stabilizing and suppressing surface vibration of the peeling substrate 100 when the turntable 10 is rotated by aerodynamic pressure, and thus the peeling substrate 100 rotates extremely flat. As a result, the photocurable resin 50-6 spreading between the transfer film substrate 66 and the release substrate 100 has a uniform thickness, and is formed by being cured by supplying light energy or the like, which will be described later. Becomes a film having a very uniform thickness.

  Further, as shown in FIG. 7F, an air stabilizer 130 that covers the entire surface of the release substrate 100 is disposed close to the release substrate 100. The mist 90 is deposited on the air stabilizer 130. Thus, the air stabilizer 130 also functions as a mist prevention material. Thereby, since the mist 90 does not adhere to the back surface of the peeling substrate 100, smoothness is good, and a high-quality transfer substrate can be manufactured.

  Next, as shown in FIG. 7G, the air stabilizer 130 is retracted, and the photocurable resin 50 spreads over the upper surface of the transfer film substrate 66 and the entire lower surface of the release substrate 100 via the release substrate 100. For example, chemical energy such as light energy is supplied onto -6. Thereby, the photocurable resin 50-6 is cured. In addition, a protective film (hard coat film) 56-4 is formed on the transfer film substrate 66 by this curing. The surface of the protective film 56-4 formed in this way showed a state of good smoothness equivalent to that shown in FIG.

In addition, as provision of light energy etc., it is preferable to irradiate for about 5 seconds, for example using the pulse UV irradiation apparatus RC-500B (3000mW / cm < ² >) by a xenon company. Moreover, when a thermosetting resin etc. are used instead of the photocurable resin 50-6, a thermal energy etc. can also be provided.

  Next, as shown in FIG. 7H, the peeling substrate 100 and the stamper 40 are peeled from the transfer film substrate 66 and the protective film 56-4. As a result, a transfer substrate 76 composed of the transfer film substrate 66 and the protective film 56-4 is produced. In the transfer substrate 76 thus produced, a protective film 56-4 having a smooth surface equivalent to that shown in FIG. 3 was formed on the transfer film substrate 66.

  In the transfer substrate 76 manufactured by the above manufacturing method, an air stabilizer 130 that is a member that covers the entire surface of the release substrate 100 is disposed close to the release substrate 100 when the turntable 10 is rotated. Thereby, since the mist 90 of the photocurable resin 50 generated when the turntable rotates does not adhere to the back surface of the release substrate 100, it is possible to form the protective film 56-4 with good smoothness.

  Further, since the air stabilizer 130 stabilizes and suppresses the surface shake of the release substrate 100 by aerodynamic pressure when the turntable rotates, the release substrate 100 rotates extremely flat. Thereby, the protective film 56-4 to be formed is a film having a very uniform thickness.

  Therefore, the transfer substrate 76 manufactured by the above manufacturing method is a high-quality transfer substrate with good smoothness and few defects.

According to the fourth embodiment of the present invention, the disk on which the recording film is formed has good focus and tracking, and the reproduction signal characteristic equivalent to that shown in FIG. 4 has a flat reflectance (RF signal). Could get. Note that FIG. 4 illustrates the surface runout acceleration (m / s ² ) at the rotation angle (Rotation angle / deg) and the residual focus error after the focus servo operation (Residual axial runout focus drive (μm)). Is shown.

<Comparison with the present invention>
In comparison with the first embodiment described above, an example in which a transfer substrate was manufactured on a PC film substrate or a release substrate without using a disk spacer and a wafer spacer, and further, the transfer layer and the PC film substrate were peeled from the stamper. An example of forming a protective film in the state will be described below.

(Comparative Example 1)
In Comparative Example 1, in the same process as in the first embodiment, after the step of applying a photocurable resin on the stamper and placing and contacting the PC film substrate, a disk spacer, In this example, the turntable is rotated without placing the wafer spacer to obtain the transfer substrate. Here, FIG. 8 is a diagram showing an example of a back surface state of the PC film substrate manufactured in Comparative Example 1. FIG. As shown in FIG. 8, mist of a photo-curing resin has adhered to the back surface of the PC film substrate. FIG. 9 is a diagram showing reproduction signal characteristics and RF signal characteristics of the disk manufactured in Comparative Example 1. As shown in FIG. 9, noise was generated in the recording / reproducing signal of the disk manufactured in Comparative Example 1.

(Comparative Example 2)
In Comparative Example 2, in the same process as in the first embodiment, when the turntable is rotated, the curable resin mist adhering to the back surface of the PC film substrate is wiped with Ben cotton moistened with isopropyl alcohol. This is an example of obtaining a transfer substrate. To completely remove the mist, it was necessary to rub strongly. Further, since the pressing force at the time of wiping was not uniform, the thickness of the transfer layer varied, and good servo signal characteristics could not be obtained for the disk produced in Comparative Example 2.

(Comparative Example 3)
Comparative Example 3 is a process of forming a protective film (hard coat film) in the same process as in the first embodiment, and the turntable is rotated without placing the disk spacer and wafer spacer on the release substrate. This is an example of obtaining a transfer substrate. Since the disk spacer and the wafer spacer were not placed, the mist of the photo-curing resin adhered to the release substrate. Here, FIG. 10 is a diagram showing an example of the surface state of the protective film produced in Comparative Example 3. FIG. As shown in FIG. 10, although the release substrate was peeled off in the final process, the optical shape was transferred to the protective film in a form following the mist form. The recording / reproducing signal of the disk manufactured in Comparative Example 3 showed a signal equivalent to that shown in FIG. 9, and noise was easily generated.

(Comparative Example 4)
Comparative Example 4 is an example in which a transfer substrate was obtained in the same process as in the first embodiment, with the transfer layer and the PC film substrate peeled from the stamper in the step of forming a protective film (hard coat film). . In order to form a protective film (hard coat film), it is necessary to hold the transfer surface without peeling off the stamper, the transfer layer, and the PC film substrate, and the transfer surface is contaminated.

  FIG. 11 is a diagram illustrating an example of the suction holes of the turntable. When the protective film is formed while adsorbing the transfer surface with a magnet, the turntable has an adsorption hole as shown in FIG. 11, so that the transfer layer and the PC film substrate are pulled during adsorption. Here, FIG. 12 is a diagram illustrating an example of the surface state before adsorption of the transfer layer and the PC film substrate prepared in Comparative Example 4. FIG. FIG. 13 is a diagram showing an example of the surface state after adsorption of the protective film produced in Comparative Example 4. As shown in FIG. 13, since the protective film (hard coat film) is formed following the dent, a dent shape is generated on the surface of the protective film. The recording / reproducing signal of the disk manufactured in Comparative Example 4 shows a signal equivalent to that shown in FIG. 9, and noise is likely to occur.

  As described above, according to the present invention, it is possible to provide a transfer substrate manufacturing method and a transfer substrate capable of manufacturing a high-quality transfer substrate with good smoothness and few defects.

  The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to such specific embodiments, and various modifications can be made within the scope of the gist of the present invention described in the claims. Can be changed.

It is a figure explaining the manufacturing method of the surface recording type | mold or optical substrate transmissive optical disc which concerns on 1st Embodiment of this invention. It is a figure which shows an example of the surface state of the resin film produced in 1st Embodiment of this invention. It is a figure which shows an example of the surface state of the transfer layer and protective film which were produced in 1st Embodiment of this invention. It is a figure which shows the reproduction signal characteristic and RF signal characteristic of the disc produced in 1st Embodiment of this invention. It is a figure explaining the manufacturing method of the surface recording type | mold or optical substrate transmissive optical disc which concerns on 2nd Embodiment of this invention. It is a figure explaining the manufacturing method of the surface recording type | mold or optical substrate transmissive optical disc which concerns on 3rd Embodiment of this invention. It is a figure explaining the manufacturing method of the surface recording type | mold or optical substrate transmissive optical disc which concerns on 4th Embodiment of this invention. It is a figure which shows an example of the back surface state of the PC film board produced by the comparative example 1. FIG. It is a figure which shows the reproduction signal characteristic of the disk produced by the comparative example 1, and RF signal characteristic. 6 is a diagram illustrating an example of a surface state of a protective film manufactured in Comparative Example 3. FIG. It is a figure which shows an example of the suction hole of a turntable. It is a figure which shows an example of the surface state before adsorption | suction of the transfer layer produced in the comparative example 4, and PC film board | substrate. It is a figure which shows an example of the surface state after adsorption | suction of the protective film produced in the comparative example 4.

Explanation of symbols

10 Turntable (Rotating plate)
20 Magnet 30 Pre-groove shape 40 Stamper (type)
50 Photocurable resin 52 Transfer layer 56 Protective film (hard coat film)
60 PC film substrate 66 Transfer film substrate 70 Disc spacer 80 Wafer spacer 90 Mist 100 Release substrate 110, 120 Upper and lower heaters 130 Air stabilizer

Claims (9)

A step of placing a mold having a central hole and a functional shape on a surface thereof on a rotating plate, a step of applying a liquid curable resin in an annular shape on the die placed on the rotating plate, and the coating After the step of placing and contacting the film substrate on the cured curable resin and the step of placing and contacting the film substrate, the rotating plate is rotated so that the curable resin is placed on the upper surface of the mold and A step of spreading the entire lower surface of the film substrate; a step of curing the curable resin spread by the rotation by supplying chemical energy through the film substrate; and a step of curing the curable resin. In the transfer substrate manufacturing method including the step of peeling the obtained transfer layer and the film substrate from the mold,
Prior to the step of rotating the rotating plate, the method includes the step of placing a member covering the entire surface of the film substrate on the film substrate.   The transfer substrate manufacturing method according to claim 1, wherein in the step of arranging on the film substrate, the arrangement on the film substrate is arranged in a non-contact state on the film substrate.   The step of disposing on the film substrate includes disposing a member covering the entire surface of the film substrate on the film substrate via a spacer having a smaller surface area than the film substrate. 3. A method for producing a transfer substrate according to 2.   3. The step of disposing on the film substrate includes disposing an air stabilizer that covers the entire surface of the film substrate, instead of a member that covers the entire surface of the film substrate. Transfer substrate manufacturing method. A step of forming a transfer layer and a film substrate on a mold having a central hole placed on a rotating plate and having a functional shape on the surface, and a liquid curable resin is coated on the film substrate in an annular shape And the step of placing and contacting the release substrate on the coated curable resin, and the step of placing and contacting the release substrate, the rotating plate is rotated to rotate the liquid A step of spreading a curable resin over the entire upper surface of the film substrate and the lower surface of the release substrate, a step of curing the curable resin spread by the rotation by supplying chemical energy through the release substrate, and In a transfer substrate manufacturing method including a step of peeling the release substrate from a protective film obtained by a step of curing the curable resin, and a step of peeling the transfer layer and the film substrate from the mold.
Prior to the step of rotating the rotating plate, the method includes the step of placing a member covering the entire surface of the release substrate on the release substrate. A step of forming a transfer film substrate on a mold having a central hole placed on a rotating plate and having a functional shape on the surface, and a liquid curable resin is coated on the transfer film substrate in an annular shape After the step, the step of placing and contacting the release substrate on the coated curable resin, and the step of placing and contacting the release substrate, the rotating plate is rotated to cure the liquid Spreading the curable resin over the entire upper surface of the film substrate and the lower surface of the release substrate, supplying the chemical energy through the release substrate and curing the curable resin spread by the rotation, In a transfer substrate manufacturing method including a step of peeling the release substrate from a protective film obtained by a step of curing a curable resin, and a step of peeling the protective film and the transfer film substrate from the mold.
Prior to the step of rotating the rotating plate, the method includes a step of arranging a member covering the entire surface of the release substrate on the release substrate.   6. The step of disposing on the release substrate includes disposing a member covering the entire surface of the release substrate on the release substrate via a spacer having a surface area smaller than that of the release substrate. 6. The method for producing a transfer substrate according to 6.   7. The step of disposing on the release substrate includes disposing an air stabilizer that covers the entire surface of the release substrate instead of a member that covers the entire surface of the release substrate. Transfer substrate manufacturing method.   A transfer substrate manufactured by the transfer substrate manufacturing method according to claim 1.