JP2009194293A - Electronic component, electronic apparatus and method of manufacturing base member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component, etc. for bearing stress from a printed board, etc. after mounting. <P>SOLUTION: In thin embodiment, a reinforcing member 3 is embedded between external electrodes 17 and 18 of a base 2 in a package such as a glass to improve rigidity of the electronic component 1. In the electronic component 1, a hollow part 9 hermetic-sealed by the base 2 and a lid 5 is formed, and a crystal oscillator 6 is held on an upper surface of the base 2 by a supporting part 7 in the hollow part 9. The base 2 is configured by a glass, and a metal reinforcing member 3 is embedded on a bottom surface side of the base 2. Even if the printed board bends and stress is applied to the electronic component 1 after the external electrodes 17 and 18 of the electronic components 1 are surface-mounted on the printed board, since rigidity of the base 2 is heightened by the reinforcing member 3, breakage of the electronic component 1 due to the stress is effectively suppressed. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component, an electronic device, and a base member manufacturing method, for example, an electronic component in which a crystal resonator is housed in a glass package.

In recent years, surface mount components in which electronic elements such as crystal resonators and semiconductors are housed in packages have been widely used.
The surface mount component has an external electrode on the bottom surface or the like, and is mounted by soldering the external electrode to the surface of the printed circuit board.
As such a package, for example, a ceramic base joined with a metal or glass lid is often used.

In recent years, since a package using ceramics is expensive, a package using glass as a base has been proposed as in Patent Document 1 below.
In this technique, a glass case is bonded by anodic bonding or the like, and a piezoelectric vibrator is accommodated in an internal space.

However, glass has a lower strength than ceramics, and surface mount components are mounted directly on the printed circuit board, so if the printed circuit board bends after mounting, it will receive stress and damage such as cracks in the glass. was there.
Therefore, a technique for strengthening glass by chemical treatment as in Patent Document 2 below has been proposed. In this technique, by replacing sodium ions in the vicinity of the glass surface with potassium ions, stress is applied to the glass surface due to the difference in ion size, thereby increasing the strength of the glass.
Japanese Patent No. 362435 JP 07-212159 A

However, although the strength of the glass can be enhanced by chemical treatment, there is a problem that the strength is lowered due to the thermal history associated with the heat treatment. This seems to be because potassium ions near the glass surface diffuse into the glass.
In addition, the glass case has been warped, the cutting process becomes difficult when the wafer is processed, and the cut surface after glass cutting is not strengthened.

  Accordingly, an object of the present invention is to provide an electronic component that can withstand stress from a printed circuit board after mounting.

In order to achieve the above object, according to the first aspect of the present invention, a base member, an electronic element disposed on one surface side of the base member, and an electrode of the electronic element are electrically connected, and the base From one external electrode disposed on the other surface side of the member, another external electrode, and a position where the one external electrode is formed to a position where the other external electrode is formed, There is provided an electronic component comprising: a reinforcing member for the base member formed on an inner surface or an outer surface of the base member.
According to a second aspect of the present invention, there is provided the electronic component according to the first aspect, wherein the reinforcing member is formed on the base member in a state where compressive stress is applied to the base member.
According to a third aspect of the present invention, there is provided the electronic component according to the first or second aspect, wherein the external electrode is connected to a wiring board by surface mounting.
According to a fourth aspect of the present invention, the base member includes a lid portion that is disposed on the one surface of the base member and forms a cavity portion that is cut off from outside air with the one surface. , Formed by a recess provided in at least one of the one surface of the base member or the surface of the lid portion facing the one surface, and the electronic element is disposed in the cavity portion. The electronic component according to claim 1, claim 2, or claim 3 is provided.
According to a fifth aspect of the present invention, the electronic component according to any one of the first to fourth aspects is provided on a wiring board, and a desired signal is generated by an electric signal output from the electronic component. Provided is an electronic device characterized by its function.
In a sixth aspect of the present invention, a heating step of heating a base member made of glass and having an electronic element disposed on one surface side to a softening point or higher, and other surfaces of the heated base member And a step of embedding the reinforcing member from the side from the position where the one electrode is formed on the other surface side to the position where the other electrode is formed. A member manufacturing method is provided.
The invention according to claim 7 provides the base member manufacturing method according to claim 6, wherein the linear expansion coefficient of the reinforcing member is larger than the linear expansion coefficient of the base member.
According to an eighth aspect of the invention, in the embedding step, the reinforcing member is embedded in the base member in a state in which a tensile tension is applied to the reinforcing member. provide.
According to the ninth aspect of the present invention, from the position where the one electrode is formed on the other surface side of the base member on which the electronic element is disposed on the one surface side, from the position where the one electrode is formed on the other surface side. Provided is a base member manufacturing method comprising: a groove portion forming step for forming a groove portion up to a position where an electrode is formed; and a disposing step for disposing a reinforcing member in the formed groove portion. .
According to a tenth aspect of the present invention, there is provided a method for manufacturing a base member, wherein in the disposing step, the reinforcing member is disposed on the base member in a state where a tensile tension is applied to the reinforcing member.

  According to the present invention, by providing a reinforcing member on an electronic component, it is possible to withstand stress from a printed circuit board or the like after mounting.

(1) Outline of Embodiment In this embodiment, the reinforcing member 3 is embedded between the external electrodes 17 and 18 of the base 2 (FIG. 1) in a package such as glass to increase the rigidity of the electronic component 1.
In the electronic component 1, a hollow portion 9 hermetically sealed by the base 2 and the lid 5 is formed, and the crystal resonator 6 is held on the upper surface of the base 2 by the support portion 7 in the hollow portion 9.
The base 2 is made of glass, and a metal reinforcing member 3 is embedded on the bottom surface side of the base 2.

The metal of the reinforcing member 3 is an alloy having a linear expansion coefficient substantially equal to that of glass, and the glass is not damaged due to a difference in expansion between the glass and the metal.
After the external electrodes 17 and 18 of the electronic component 1 are surface-mounted on the printed circuit board, even if the printed circuit board is bent and stress is applied to the electronic component 1, the rigidity of the base 2 is high by the reinforcing member 3, so 1 can be effectively suppressed.
The reinforcing member 3 can be embedded, for example, by heating the base 2 to a softening point or more and pushing the reinforcing member 3 in the direction toward the inside of the base 2 from the bottom surface side of the base 2. By having it, the strength of the package is improved.

(2) Details of Embodiment Each drawing of FIG. 1 is a diagram showing an electronic component 1 according to the present embodiment.
The electronic component 1 is configured by housing an electronic element in a rectangular parallelepiped glass case, and FIG. 1A shows the electronic component 1 viewed from a direction perpendicular to the longitudinal direction (short direction). FIG. 1B shows the electronic component 1 as viewed in the longitudinal direction (the direction of arrow A in FIG. 1A). The internal configuration of the electronic component 1 is indicated by a dotted line.

When the electronic component 1 is mounted, the bottom surfaces of the external electrodes 17 and 18 are bonded to the printed circuit board.
Therefore, in the present embodiment, the side facing the printed circuit board of the electronic component 1 at the time of mounting is referred to as the bottom surface side, the opposite side is referred to as the top surface side, and the direction from the bottom surface side to the top surface side is referred to as the height direction. The direction perpendicular to the direction is called the printed circuit board surface direction.

The crystal resonator 6 is configured by, for example, a tuning fork type crystal resonator, and a tuning fork type base is held by the support portion 7.
Although not shown, an electrode is provided on the tuning fork arm of the crystal resonator 6, and the crystal resonator 6 can be transmitted at a predetermined frequency by supplying a predetermined pulse to the electrode.
The support unit 7 holds the crystal unit 6 in a cantilever position with respect to the base 2 so that the tuning fork arm of the crystal unit 6 can vibrate in the space in the cavity 9.
Internal wirings 11 and 12 are formed on the upper surface of the base 2 so as to be electrically connected to electrodes installed on the tuning fork arm of the crystal resonator 6.

The base 2 is a plate-like member made of glass, and a crystal resonator 6 held by the support portion 7 is attached to the upper surface.
As the material of the base 2, for example, soda glass having any advantage that is inexpensive and capable of anodic bonding is used, and the thickness is, for example, 0.1 to 2 [mm], preferably 0.1 to 0.5. It is about [mm].

In addition to soda glass, borosilicate glass, alkali-free glass, crystallized glass (sometimes tempered) may be used.
Here, the base 2 functions as a base member, and the crystal unit 6 functions as an electronic element disposed on one surface side (upper surface side) of the base member (base 2).

In the base 2, through holes (through holes) are formed from the internal wirings 11 and 12 on the top surface to the bottom surface, and through electrodes 13 and 14 are formed in the through holes, respectively.
The through electrodes 13 and 14 are formed, for example, by solidifying a metal rod or a conductive paste.
The reinforcing member 3 is embedded in the longitudinal direction on the bottom surface side of the base 2, and the through electrodes 13 and 14 are formed at positions that do not buffer with the reinforcing member 3 on the side of the reinforcing member 3.

The external electrodes 17 and 18 are electrically connected to the electrodes formed on the tuning fork arm of the crystal resonator 6 through the through electrodes 13 and 14 and the internal wirings 11 and 12.
For example, when the external electrode 17 is one external electrode, the external electrode 18 functions as another external electrode.
The external electrodes 17 and 18 are electrodes to be connected to the wiring board (printed board) by surface mounting, and function as external electrodes that are electrically connected to the electrodes of the electronic element (quartz crystal unit 6).

  The external electrodes 17 and 18 will be described in more detail. The external electrodes 17 and 18 are formed of an adhesion layer (formed by sputtering or the like) such as Cr, Ti or W as a base and a single material such as Au, Cu, Ag, Al or Ni. -It has a composite, single layer, multiple layer sputter layer (thickness is about 5 [nm] to 1 [μm]), and the intermediate layer is plated with Cu, Ni, Ni-P, etc. (1 to 10 [ [mu] m]) and the surface layer has a composite / single-layer / multi-layer plating layer (10 [nm] to 10 [[mu] m]) of Sn, solder, Pd, Au, Ag, or the like. Alternatively, a conductive paste containing metal particles such as Ag and glass frit can be used.

The reinforcing member 3 is composed of, for example, a columnar metal bar, and is embedded across both ends along the longitudinal center line of the base 2.
The reinforcing member 3 is embedded in order to increase the rigidity of the base 2. Even if stress is applied to the electronic component 1 due to the printed circuit board being bent after the electronic component 1 is mounted on the printed circuit board, the reinforcing member 3 is rigid. Therefore, damage to the base 2 and the lid 5 can be suppressed.

As will be described later, the reinforcing member 3 is embedded by heating the base 2, and the electronic component 1 is heated at the time of surface mounting on a printed circuit board, so that the reinforcing member 3 has a linear expansion coefficient close to that of glass. (Glass ratio is 80 to 120%, preferably 90 to 110%, more preferably 100%).
Specifically, the reinforcing member 3 can be made of, for example, an alloy containing at least two elements of Fe, Ni, and Co.
Thereby, it can prevent that the base 2 is damaged by the expansion | swelling difference by the heat | fever of glass and the reinforcement member 3. FIG.

Moreover, if the reinforcing member 3 is embedded in the base 2 in a state in which it exerts a compressive stress on the base 2, the strength of the base 2 can be further increased. This principle is used, for example, in reinforced reinforced concrete.
As a method of disposing the reinforcing member 3 so as to exert a compressive stress on the base 2, for example, the reinforcing member 3 is embedded in the base 2 in a state where both ends of the reinforcing member 3 are clamped and mechanical tension is applied. After the base 2 is fixed, there are some which cut both end portions of the reinforcing member 3 protruding from the base 2.

In addition, the reinforcing member 3 is configured so that the linear expansion coefficient of the reinforcing member 3 and the base 2 are substantially equal to each other, but the linear expansion coefficient of the reinforcing member 3 is slightly larger than that of the base 2, and the reinforcing member 3 and the base 2 are heated. However, the reinforcing member 3 may be embedded in the base 2.
When the base 2 is cooled after the embedding, the reinforcing member 3 exerts a compressive stress on the base 2 because the linear expansion coefficient of the reinforcing member 3 is larger than that of the base 2.
Regardless of which method is used, stress may be partially generated depending on the shape of the base 2 or the reinforcing member 3, and thus it is desirable to consider these shapes and positions.

When the printed circuit board is bent after mounting the electronic component 1 on the printed circuit board, the electronic component 1 receives stress from the external electrodes 17 and 18 because the electronic component 1 is fixed to the printed circuit board by the external electrodes 17 and 18.
Since the reinforcing member 3 is disposed for the purpose of resisting the stress from the external electrodes 17 and 18, it is disposed at least over the position where the external electrodes 17 and 18 are formed.
For this reason, the arrangement range of the reinforcing member 3 is between the inner ends of the external electrodes 17 and 18 (L1 in FIG. 1A), preferably between the centers of the external electrodes 17 and 18 (L2 in the same), Preferably, it is between both outer ends of the external electrodes 17 and 18 (L3).

The lid (lid) 5 is made of glass, metal, or the like, and has a concave portion for accommodating the crystal resonator 6 with the center portion being hollowed out.
The amount of dents in the concave portion of the lid 5 is, for example, about 0.05 to 1.5 [mm], and can be processed by etching, sand blasting, hot pressing or the like.
The opening of the lid 5 is bonded to the base 2 using anodic bonding or a bonding material, and a cavity 9 for housing the crystal resonator 6 is formed by the upper surface of the base 2 and the concave portion of the lid 5.

The cavity 9 is hermetically sealed by the lid 5 and the base 2 and shielded from the outside air. For example, the cavity 9 is hermetically sealed such that a vacuum is maintained or a predetermined gas is sealed.
Thus, since the cavity 9 is hermetically sealed, preventing damage to the base 2 by the reinforcing member 3 is extremely important for improving the reliability of the electronic component 1.

  Here, the lid 5 is disposed on one surface (upper surface) of the base member (base 2), and forms a cavity portion (cavity portion 9) that is blocked from outside air with the one surface. It functions as a lid, and the electronic element (crystal resonator 6) is disposed in the cavity (cavity 9).

The electronic component 1 configured as described above is mounted on the surface of the printed circuit board by soldering the bottom surfaces of the external electrodes 17 and 18 to the printed circuit board or by fixing them with Au bumps, conductive adhesive, or the like. The
The electronic component 1 is used as a transmission device in electronic devices such as personal computers, watches, and game machines.
In the present embodiment, the crystal resonator 6 is used as an electronic element. However, other electronic elements that emit electrical signals, such as ICs, semiconductors, sensors, piezoelectric elements, and other electronic device chips, can be used. .

Each drawing in FIG. 2 is a diagram for explaining a procedure for embedding the reinforcing member 3 in the base 2 and shows the electronic component 1 as viewed in the longitudinal direction with the bottom surface of the base 2 facing upward.
First, the base 2 is heated above the softening point of the glass (heating step), and the reinforcing member 3 is applied to the center of the bottom surface 10 of the base 2 as shown in FIG. Press toward the inside (embedding step).

Then, the reinforcing member 3 is pushed into the base 2 from the bottom surface 10 as shown in FIG.
Then, as shown in FIG. 2C, when the reinforcing member 3 is pressed and pushed in until reaching a predetermined depth in the base 2, and then the base 2 is cooled, the base 2 in which the reinforcing member 3 is provided. Is formed.

  If the reinforcing member 3 is not completely embedded in the base 2 and the surface of the reinforcing member 3 is exposed to the bottom surface 10 of the base 2 and the bottom surface 10 of the base 2 is to be insulated, the bottom surface 10 of the reinforcing member 3 is used. An insulating film (adhesive, oxide film, glass paste, etc.) is coated on the surface to ensure insulation.

Moreover, in this Embodiment, although the base 2 was comprised with glass, it is also possible to comprise with another raw material, such as ceramics, for example.
For example, when the base 2 is made of ceramics, it can be manufactured by firing in a state where the reinforcing member 3 is embedded in a ceramic material.

In the electronic component 1 configured as described above, the following effects can be obtained.
(1) Since the rigidity of the base 2 is increased by the reinforcing member 3, the deformation of the base 2 can be suppressed even if stress is applied to the base 2. For this reason, even if the base 2 is made of glass, the possibility of breakage can be effectively reduced.
(2) Since the rigidity can be increased without strengthening the glass of the base 2, adverse effects associated with glass strength treatment such as warping can be avoided.
(3) By making the linear expansion coefficient of the material of the base 2 and the material of the reinforcing member 3 comparable, even if the electronic component 1 is heated, the base 2 can be prevented from being damaged due to the difference in expansion coefficient.

  In the present embodiment, two external electrodes 17 and 18 are formed on the electronic component 1, one (for example, the external electrode 17) as one external electrode and the other (for example, the external electrode 18). , And the reinforcing member is disposed from the position of one external electrode to the position of the other external electrode. However, when the electronic component 1 has three or more external electrodes, for example, One of the two separated external electrodes may be one external electrode and the other may be the other external electrode, and a reinforcing member may be disposed between the positions of the two external electrodes.

Next, a modified example of the arrangement form of the reinforcing member with respect to the base 2 will be described.
Each drawing in FIG. 3 is a diagram for explaining such a modification. First, as shown in FIG. 3A, rectangular grooves 21 are formed over both longitudinal ends on the center line of the bottom surface 10 of the base 2. Form (groove part forming step).
The groove 21 can be formed by, for example, hot pressing, etching, blade, laser processing, or the like.

Next, as shown in FIG. 3B, a metal reinforcing member 22 having a rectangular cross section that fits into the groove portion 21 is fitted into the groove portion 21 and bonded (arrangement step).
For the bonding, for example, the glass can be heated and fused to the softening point or higher, bonded with a low melting point glass paste, or bonded with solder or an adhesive.
Also in this case, if the reinforcing member 22 is fused and bonded so as to exert a compressive stress on the base 2, the strength of the base 2 can be further increased.

Further, when the reinforcing member 22 is fitted into the groove portion 21 as described above, the reinforcing member 22 is exposed on the bottom surface 10 of the base 2. However, if the bottom surface 10 of the base 2 is to be electrically insulated, the insulating member 22 is insulated. A film (adhesive, oxide film, glass paste, etc.) is coated to ensure insulation.
Thereby, the reinforcing member 22, the external electrode 17 and the external electrode 18 can be insulated from each other, and when the electronic component 1 is surface-mounted on the printed circuit board, the insulation between the bottom surface of the electronic component 1 and the printed circuit board is achieved. Can be secured.
In the present modification, the cross-sectional shape of the groove 21 is rectangular, but the present invention is not limited to this. For example, the groove 21 can be formed in an arc shape, a triangular shape, or the like.

In the above, the reinforcing member 22 formed in advance in the groove portion 21 is fitted, but the reinforcing member 22 can also be disposed by filling the groove portion 21 with metal.
Each figure of FIG. 4 is a figure for demonstrating the procedure which fills the groove part 21 with a metal.
First, as shown in FIG. 4A, a rectangular groove portion 21 is formed over both ends in the longitudinal direction on the center line of the bottom surface 10 of the base 2 (groove portion forming step). This step is the same as in FIG.
Then, a base metalizing 25 is formed on the inner wall surface of the groove 21 by electroless plating or sputtering.

Next, as shown in FIG. 2B, the metal layer 26 is grown by electroplating or electroless plating, and the reinforcing member 22 is formed (arranged) as shown in FIG. Setting step).
In this way, the groove portion 21 can be filled with metal by a plating method. Alternatively, the molten metal can be poured into the groove portion 21 and solidified to form the reinforcing member 22.

Next, various modifications of the cross-sectional shape of the reinforcing member embedded in the base 2 will be described.
Each drawing in FIG. 5 is a diagram showing a cross-sectional shape example of the reinforcing member embedded in the base 2. The reinforcing members in any of the figures are also formed in a column shape and are formed over both ends of the base 2 in the longitudinal direction.
The reinforcing member 31 in FIG. 5A has a rectangular cross section, and the longitudinal direction of the cross section is the height direction of the base 2.
Since it is conceivable that a stress that causes the base 2 to bend in the longitudinal direction acts on the electronic component 1 from the printed board, the length in the height direction of the cross section of the reinforcing member 31 is thus set to the printed board surface. When it is larger than the length in the direction, the secondary moment of the section of the base 2 can be increased with a smaller amount of the material of the reinforcing member, and the rigidity of the electronic component 1 can be effectively improved.

The reinforcing member 32 in FIG. 5B has a triangular cross section, and is embedded in the base 2 so that the base of the triangle is parallel to the printed circuit board surface.
When the cross section of the reinforcing member 32 is formed in this way, when the base 2 is heated and the reinforcing member 32 is pushed into the bottom surface of the base 2, the cross sectional shape of the reinforcing member 32 exhibits the same effect as the wedge, and more easily. It can be embedded in the base 2.

The reinforcing member 33 in FIG. 5C is configured by a hollow metal pipe having a circular cross section. By forming the reinforcing member 33 in the shape of a pipe, the amount of material required for the reinforcing member can be reduced as compared with the reinforcing member 3 of FIG. 1 while maintaining the rigidity of the electronic component 1.
The reinforcing member 34 in FIG. 5D is configured by a hollow metal pipe having a rectangular cross section. By forming the reinforcing member 34 in the shape of a pipe in the same manner as the reinforcing member 33, the amount of material required for the reinforcing member can be reduced while maintaining the rigidity of the electronic component 1.

The reinforcing member 35 in FIG. 5 (e) is constituted by a columnar member having an H-shaped cross section.
The reinforcing member 35 is embedded so that parallel portions at both ends of the H-shape are in the height direction, and effectively resists bending in the longitudinal direction of the base 2.
In this way, the reinforcing member 35 exhibits good rigidity similarly to the H-shaped steel used in construction by forming the cross section in an H shape.

The reinforcing member 36 in FIG. 5F is configured by a columnar member having a concave cross section.
The reinforcing member 36 is embedded so that parallel portions at both ends of the concave shape are in the height direction, and effectively resists the bending of the base 2 in the longitudinal direction.

In the embodiment and the modification described above, a columnar member is embedded in the base 2 to make it a reinforcing member. However, a reinforcing member can be disposed outside the base 2.
Each drawing of FIG. 6 is a diagram showing an electronic component 1 according to such a modification.
6A shows the electronic component 1 viewed from a direction perpendicular to the longitudinal direction, and FIG. 6B shows the electronic component 1 in the longitudinal direction (the direction of arrow A in FIG. 6A). ) Shows what I saw.
The internal configuration of the electronic component 1 such as the internal wirings 11 and 12 is not shown in order to avoid complication of the drawing.

In this modification, a plate-like reinforcing member 41 is disposed on the side surface in the longitudinal direction of the base 2 to increase the rigidity.
The reinforcing member 41 is made of, for example, a metal plate and is attached to the entire side surface of the base 2 using an adhesive or the like.
Since the reinforcing member 41 is affixed in the height direction of the base 2, the reinforcing member 41 counteracts the base 2 even if a stress that causes the base 2 to bend in the longitudinal direction acts from the printed circuit board. Stiffness can be obtained.

7 is a view showing an example in which a reinforcing member is disposed on the entire side surface of the electronic component 1.
FIG. 7A shows the electronic component 1 as viewed from a direction perpendicular to the longitudinal direction, and FIG. 7B shows the electronic component 1 in the longitudinal direction (the direction of arrow A in FIG. 7A). ) Shows what I saw. The internal configuration of the electronic component 1 such as the internal wirings 11 and 12 is not shown in order to avoid complication of the drawing.
As described above, the rigidity of the electronic component 1 can be further increased by disposing the reinforcing member 42 on the entire side surface in the longitudinal direction of the electronic component 1 (that is, on the entire side surface of the base 2 and the lid 5).

It is a figure showing the electronic component which concerns on this Embodiment. It is a figure for demonstrating the procedure which embeds a reinforcement member in a base. It is a figure for demonstrating the modification of the arrangement | positioning form of a reinforcement member. It is a figure for demonstrating the procedure which fills a groove part with a metal. It is the figure which showed the cross-sectional shape example of the reinforcement member embedded in a base. It is a figure for demonstrating the example which arrange | positions a reinforcement member outside the base. It is a figure for demonstrating the other example which arrange | positions a reinforcement member outside the base.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 2 Base 3 Reinforcing member 5 Lid 6 Crystal oscillator 7 Support part 9 Cavity part 10 Bottom face 11 Internal wiring 12 Internal wiring 13 Through electrode 14 Through electrode 17 External electrode 18 External electrode

Claims (10)

A base member;
An electronic element disposed on one side of the base member;
One external electrode electrically connected to the electrode of the electronic element and disposed on the other surface side of the base member, and another external electrode;
From the position where the one external electrode is formed to the position where the other external electrode is formed, a reinforcing member for the base member formed on the inside or outside surface of the base member,
An electronic component comprising:   The electronic component according to claim 1, wherein the reinforcing member is formed on the base member in a state in which a compressive stress is applied to the base member.   The electronic component according to claim 1, wherein the external electrode is connected to a wiring board by surface mounting. A lid portion that is disposed on the one surface of the base member and that forms a cavity portion that is blocked from outside air with the one surface;
The cavity is formed by a recess provided in at least one of the one surface of the base member or the surface of the lid facing the one surface,
The electronic component according to claim 1, wherein the electronic element is disposed in the cavity.   The electronic component according to any one of claims 1 to 4 is provided on a wiring board, and a desired function is exhibited by an electric signal output from the electronic component. Electronics. A heating step of heating the base member, which is made of glass and on which the electronic element is disposed on one surface side, to a softening point or higher;
An embedding step of embedding a reinforcing member from the side of the other surface of the heated base member from the position where one electrode is formed on the other surface side to the position where another electrode is formed;
The base member manufacturing method characterized by comprising.   The base member manufacturing method according to claim 6, wherein a linear expansion coefficient of the reinforcing member is larger than a linear expansion coefficient of the base member.   The base member manufacturing method according to claim 6, wherein in the embedding step, the reinforcing member is embedded in the base member in a state where a tensile tension is applied to the reinforcing member. From the position where one electrode is formed on the other surface side of the base member on which the electronic element is disposed on the one surface side to the position where the other electrode is formed. A groove forming step for forming the groove,
A disposing step of disposing a reinforcing member in the formed groove;
The base member manufacturing method characterized by comprising.   In the arranging step, the reinforcing member is arranged on the base member in a state where a tensile tension is applied to the reinforcing member.

Images