JP2009194093A - Cooling system of electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently cool electronic equipment having a high calorific value and requiring a precise operation, e.g., a computer or a server, at a low running cost. <P>SOLUTION: A cooling system of electronic equipment includes server rooms 14A and 14B each provided with a plurality of servers 28, and evaporators 34 disposed closely to the servers 28 and cooling the servers 28 by evaporating refrigerant with heat generated from the servers 28, a cooling tower 38 disposed higher than the evaporators 34 and condensing the evaporated refrigerant by cooling the refrigerant with outside air and spray water, and a circulation line 40 for circulating the refrigerant naturally between the evaporators 34 and the cooling tower 38. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic device cooling system, and more particularly to an electronic device cooling system for efficiently cooling an electronic device that requires precise operation of a computer, a server, and the like and generates a large amount of heat from itself.

  In recent years, with the improvement of information processing technology and the development of the Internet environment, the amount of information processing required has increased, and a data processing center for processing a large amount of various types of information has attracted attention as a business. A large number of electronic devices such as computers and servers are gathered in a server room of this data processing center, for example, and are continuously operated day and night. In general, the rack mount method is the mainstream for installing electronic devices in a server room. The rack mount system is a system in which racks (casings) that divide and store electronic devices into functional units are stacked in a cabinet, and a large number of such cabinets are arranged and arranged on the floor of a server room. Electronic devices that process such information are rapidly increasing in processing speed and processing capacity, and the amount of heat generated from the electronic devices is steadily increasing.

  On the other hand, these electronic devices require a certain temperature environment for operation, and the temperature environment for normal operation is set to be relatively low. Cause trouble. For this reason, the fact is that the air conditioning power for operating the air conditioner for cooling the server room is also greatly increasing, not only from the viewpoint of cost reduction in corporate management, but also from the viewpoint of conservation of the global environment, There is an urgent need to reduce air conditioning power.

  From such a background, as seen in Patent Document 1 and Patent Document 2, techniques for efficiently cooling electronic devices have been proposed. In Patent Document 1, a rear cover, a front cover, and a side-mounted cooling air subframe are attached to an electronic device, and a fan and a heat exchanger are provided in the cooling air subframe, so that It has been proposed to form a flow path through which cold air flows in a closed loop.

Further, in Patent Document 2, in a computer room air conditioning system including an electronic equipment storage rack group in which an evaporator and a fan are mounted, cooling air taken from outside flows into an internal space under the floor. The electronic device stored in the electronic device storage rack is cooled through the evaporator, and the condenser mounted on the back surface of the electronic device storage rack is cooled to flow in the space above or above the electronic device storage rack. However, it has been proposed to discharge to the outside through a ventilator. Moreover, although patent document 3 is not invention of cooling of an electronic device, the technique which circulates a refrigerant | coolant naturally between an evaporator and a condenser is introduced.
JP-T-2006-507676 JP 2004-232927 A JP 2007-127315 A

  By the way, the cooling system of the conventional electronic device can expect the effect of reducing the air-conditioning power of an air conditioner by using not only the cooling by an air conditioner but also the cooler directly attached to the electronic device. .

  However, while the air conditioning power is reduced, the operating power of the cooler directly attached to the electronic device is added, so that it is still not sufficient from the viewpoint of total energy saving. Accordingly, there is a demand for further reduction in running cost by energy saving. In particular, energy saving is demanded in that it is directly attached to an electronic device and cooled.

  The present invention has been made in view of such circumstances, and can efficiently cool an electronic device that requires precise operation such as a computer and a server and generates a large amount of heat from itself at a low running cost. An object is to provide a cooling system for electronic equipment.

  According to a first aspect of the present invention, in order to achieve the above object, a refrigerant is generated by heat generated from the electronic device and a device room in which a plurality of electronic devices are arranged, respectively, in proximity to the electronic device. An evaporator that cools the electronic device by vaporizing, a cooling tower that is provided at a higher position than the evaporator, cools the refrigerant by outside air and sprinkling, and condenses the vaporized refrigerant, and the evaporation And a circulation line through which the refrigerant naturally circulates between the cooling tower and the cooling tower.

  The present inventor has recently paid attention to the fact that the amount of heat generated from a plurality of electronic devices arranged in a device room increases rapidly, and high-temperature heat (high-temperature air) is generated from the electronic devices. A condenser (refrigerator) is provided for a long period of time throughout the year between an evaporator provided in the vicinity of each electronic device and a cooling tower provided at a higher position than the evaporator to cool the refrigerant with outside air or water spray. We obtained knowledge that it is possible to construct a circulation line that naturally circulates refrigerant without the need for cold water and a compressor.

  That is, according to claim 1, the refrigerant that flows through the evaporator while maintaining the high-temperature heat generated (discharged) from the electronic device (usually having a fan that takes in and exhausts air from the device room) By directly exchanging heat and promoting the evaporation of the refrigerant, it is possible to obtain transport power for transporting the evaporated refrigerant gas to a cooling tower installed higher than the evaporator. Furthermore, since the refrigerant gas evaporated by the evaporator is heated, the cooling capacity for condensing the evaporated refrigerant gas into a refrigerant liquid can be reduced. Therefore, it is possible to use a cooling tower that cools the refrigerant with outside air or water spray instead of the condenser (supplying cold water from the refrigerator). The cooled and condensed refrigerant liquid flows down to the evaporator located below the cooling tower, thereby constructing a circulation line in which the refrigerant naturally circulates between the evaporator and the cooling tower.

  By constructing the natural circulation line in this way, the transportation power cost of the refrigerant is not required, and the cooling tower that cools the refrigerant with outside air or water spray is used on the cooling side of the circulation line, so that the heat source load for cooling is reduced. The running cost for cooling the refrigerant can be greatly reduced.

  A second aspect of the present invention provides the heat exchanger for cooling the refrigerant according to the first aspect, and a flow path for the refrigerant connected to the circulation line, wherein the heat exchanger has a parallel relationship with the cooling tower. And a parallel control mechanism for controlling a refrigerant amount of the refrigerant flowing from the circulation line to the parallel line.

  The second aspect defines the control of the refrigerant flowing through the cooling tower and the heat exchanger when the heat exchanger is arranged so as to have a parallel relationship with the cooling tower.

  According to claim 2, as a means for cooling the refrigerant, in addition to the cooling tower, a heat exchanger for cooling the refrigerant is connected in parallel to the circulation line so as to have a parallel relationship with the cooling tower, The amount of refrigerant flowing to the heat exchanger was controlled by the parallel control mechanism. Thereby, the cooling tower and the heat exchanger can be efficiently utilized so that the running cost is minimized according to the cooling load required for condensing the refrigerant gas evaporated in the evaporator.

  A third aspect of the present invention is the method according to the second aspect, wherein the parallel control mechanism includes an outside air temperature sensor that measures an outside air temperature, and an amount of refrigerant that is provided in the parallel line and that allows refrigerant gas returning from the evaporator to flow through the heat exchanger. By calculating the parallel valve to be adjusted and the ability to cool the refrigerant in the cooling tower from the measurement result of the outside air temperature sensor, and adjusting the opening amount of the parallel valve from the calculation result, And a parallel control unit that controls the amount of refrigerant flowing through the exchanger.

  The cooling capacity of the cooling tower greatly depends on the outside air temperature. Therefore, by configuring as in claim 3, a part of the refrigerant flowing through the circulation line can automatically flow to the heat exchanger according to the fluctuation of the outside air temperature. It is only necessary to supplement the shortage with a heat exchanger. Thereby, running cost can be further reduced.

  In short, it is only necessary that the cooling system operator sets the summer, intermediate, and winter so that the cooling tower can effectively use the outside air temperature. Here, the summer season is generally from June to July, the middle spring season is from March to May, the middle autumn season is from September to November, and the winter season is from December to February. That is not a problem.

  A fourth aspect of the present invention is the method according to the second aspect, wherein the parallel control mechanism is provided in a cooling tower outlet sensor for measuring a refrigerant temperature and / or a refrigerant pressure at the cooling tower outlet and the parallel line, and returns from the evaporator. A parallel valve that adjusts the amount of refrigerant flowing through the heat exchanger and a parallel valve that adjusts the opening of the parallel valve so that the measurement result of the cooling tower outlet sensor becomes a predetermined value. And a parallel control unit that controls the amount of refrigerant to flow.

  Claim 4 is another aspect of the parallel control mechanism, and the cooling capacity of the cooling tower at the time of measurement is measured by measuring the refrigerant temperature or refrigerant pressure of the cooling tower outlet sensor provided at the outlet of the cooling tower. Can be grasped. Therefore, it is possible to adjust the opening amount of the parallel valve based on the measurement result so that a part of the refrigerant flowing through the circulation line automatically flows to the heat exchanger. Need only be supplemented with a heat exchanger. Thereby, running cost can be further reduced.

  A fifth aspect of the present invention provides the heat exchanger for cooling the refrigerant according to the first aspect, and a flow path for the refrigerant connected to the circulation line, wherein the heat exchanger has a serial relationship with the cooling tower. A series line configured to have the refrigerant returning from the evaporator pass through the cooling tower and then reach the heat exchanger, and a series for controlling the cooling capacity of the heat exchanger. And a control mechanism.

  The fifth aspect defines the control of the refrigerant flowing through the cooling tower and the heat exchanger when the heat exchanger is arranged in series with the cooling tower.

  According to claim 5, since the refrigerant gas returning from the evaporator is first cooled in the cooling tower and then flows to the heat exchanger, and the serial control mechanism for controlling the cooling capacity of the heat exchanger is provided. Only the lack of cooling capacity in the cooling tower can be supplemented with a heat exchanger. Thereby, the cooling tower and the heat exchanger can be efficiently utilized so that the running cost is minimized according to the cooling load required for condensing the refrigerant gas evaporated in the evaporator. As a result, the running cost can be further reduced.

  A sixth aspect of the present invention is the method according to the fifth aspect, wherein the serial control mechanism cools the refrigerant flowing through the heat exchanger and a heat exchange outlet sensor that measures a refrigerant temperature and / or refrigerant pressure at the heat exchanger outlet. A primary refrigerant valve that adjusts a refrigerant amount of the primary refrigerant, and a series control unit that controls the primary refrigerant valve based on a measurement result of the heat exchange outlet sensor, and the series control unit includes: The primary refrigerant valve is controlled so that the measurement result of the heat exchange outlet sensor becomes a predetermined value.

  Here, the predetermined value refers to a temperature or pressure required for the natural circulation of the refrigerant in the circulation line.

  According to claim 6, by managing the measurement result of the heat exchange outlet sensor to be a predetermined value, when the refrigerant sequentially flows from the cooling tower to the heat exchanger, the heat exchanger has the cooling capacity of the cooling tower. It becomes possible to control the heat quantity of the primary refrigerant so that only the shortage is supplemented. Therefore, useless cooling energy is not required in the heat exchanger.

  As a result, the outdoor temperature, which is the cold source of the cooling tower, can be effectively utilized regardless of the summer, intermediate, and winter periods, and the running cost can be further reduced.

  A seventh aspect of the present invention is the method according to the fifth or sixth aspect, wherein the serial control mechanism includes a cooling tower outlet sensor for measuring a refrigerant temperature and / or a refrigerant pressure at the cooling tower outlet, and a refrigerant gas returning from the evaporator as the heat. Based on the measurement result of the bypass line that can flow to the exchanger, the bypass valve that adjusts the flow rate of the refrigerant gas flowing through the bypass line, the adjustment valve that is provided at the cooling tower outlet, and the cooling tower outlet sensor A series control unit that controls the bypass valve and the adjustment valve, and the series control unit controls the bypass valve and the adjustment valve so that a measurement result of the cooling tower outlet sensor becomes a predetermined value. It is characterized by that.

  Here, the predetermined value refers to a temperature or pressure required for the natural circulation of the refrigerant in the circulation line.

  According to the seventh aspect of the present invention, when the outside air temperature rises and the cooling capacity of the cooling tower decreases, for example, in the summer, when the total amount of refrigerant gas returning from the evaporator passes through the cooling tower, the refrigerant naturally circulates all the refrigerant gas. It is not possible to cool down to the temperature and pressure required to do so, and the cooling capacity of the available cooling towers cannot be fully utilized. However, by operating the bypass valve and the adjustment valve so that the measurement result of the cooling tower outlet sensor becomes a predetermined value, the flow rate of the refrigerant gas flowing to the cooling tower is controlled, and the refrigerant having a predetermined temperature and pressure is supplied to the cooling tower outlet. Will be obtained. Therefore, useless cooling energy is not required in the heat exchanger.

  This makes it possible to effectively use the outside air temperature, which is the cooling heat source of the cooling tower, regardless of the outside air conditions in the summer, intermediate and winter seasons, thereby further reducing the running cost.

  An eighth aspect of the present invention is the method according to the sixth or seventh aspect, wherein the serial control mechanism includes an outside temperature sensor that measures an outside temperature, a bypass line that allows a refrigerant gas returning from the evaporator to flow to the heat exchanger, A bypass valve that adjusts the flow rate of the refrigerant gas flowing through the bypass line, and the series control unit sets all the adjustment valves when the measurement result of the outside air temperature sensor reaches a predetermined value or more in the summer. The bypass valve is fully opened and the bypass gas is fully opened, and the return of the refrigerant gas to the cooling tower is blocked and all the refrigerant gas is led to the heat exchanger.

  According to an eighth aspect of the present invention, the control is performed by adding the outside air temperature to the configuration of the serial control mechanism of the sixth or seventh aspect. That is, for example, in summer when the outside air temperature becomes high and the cooling capacity of the cooling tower is most reduced, the cooling effect of the refrigerant may be hardly obtained even if the cooling tower is used. At this time, using both the cooling tower and the heat exchanger is problematic in terms of running cost. Therefore, the outside air temperature that causes such a problem is grasped in advance, and when the measured outside air temperature sensor exceeds a predetermined value (above the grasped temperature), the adjustment valve and the bypass valve are controlled to cool from the evaporator. The flow of the refrigerant gas returning to the tower is cut off so that it flows all through the heat exchanger. Thereby, the running cost can be further reduced, for example, in summer when the cooling capacity of the cooling tower is reduced most.

  A ninth aspect of the present invention provides the air conditioner according to any one of the first to eighth aspects, wherein the high-temperature air sucked from the equipment room is cooled and returned to the equipment room; And an air conditioning circulation line that circulates between the cooling section of the machine.

  According to the ninth aspect of the present invention, the refrigerant in the circulation line having a low running cost for cooling the refrigerant is also used as a cold heat source of the air conditioner for cooling the inside of the electronic equipment room with the cold air. Thereby, the running cost for operating an air conditioner can also be reduced.

  Further, by using an air conditioner and an evaporator for cooling an electronic device in combination, a conventional air-conditioning system (floor blowing air-conditioning disclosed in Japanese Patent Application Laid-Open No. 2004-232927 circulates air in the entire equipment room for air conditioning. Compared with the system), it is possible to suppress the occurrence of heat accumulation (local high temperature part) in the equipment room, and it is possible to increase the supply air temperature from the air conditioner that air-conditions the whole. Therefore, in the present invention, the vaporization (evaporation) temperature of the refrigerant may be higher than in the prior art, and the capacity of the cooling tower can be fully utilized. Therefore, supplying the refrigerant in the circulation line to the cooling unit of the air conditioner contributes to both energy saving of the air conditioner and performance of the cooling tower.

  A tenth aspect of the present invention is the method according to the ninth aspect, wherein the plurality of electronic devices are grouped into a plurality of groups, and group heat exchangers are provided in the number of the groups grouped in the middle of the circulation line. A main circulation line through which a refrigerant circulates between a cooling tower and / or a heat exchanger and the group heat exchanger, a cooling unit for the group heat exchanger, the evaporator and / or the air conditioner, It is comprised with the circulation line for groups in which a refrigerant | coolant circulates between.

  According to the tenth aspect, the circulation line is provided between the cooling tower and / or the heat exchanger and the group heat exchanger via the group heat exchanger provided for each group of the grouped electronic devices. By configuring the main circulation line through which the refrigerant circulates and the group circulation line through which the refrigerant circulates between the group heat exchanger and the evaporator and / or the cooling unit of the air conditioner, Driving can be cut off.

  Thereby, even if an abnormality occurs in one group, for example, an evaporator, or the flow of the refrigerant stops, the abnormality does not spread to other groups. Therefore, it is possible to prevent an abnormality from occurring in the cooling of all electronic devices disposed in the device room.

  The refrigerant flowing through the main circulation line and the group circulation line may be the same type or different types.

  An eleventh aspect according to any one of the first to tenth aspects is provided in a refrigerant gas flow path at the evaporator outlet position in the circulation line, and is discharged from the evaporator and a flow rate adjusting means for adjusting a refrigerant flow rate. And a controller for controlling the flow rate adjusting means, wherein the controller controls the flow rate adjusting means so that the temperature sensor becomes a predetermined value.

  According to the eleventh aspect, when the refrigerant flow rate is controlled in the refrigerant liquid channel side as in the prior art by controlling the refrigerant flow rate in the refrigerant gas channel on the evaporator outlet side, In comparison, the refrigerant operating temperature can be increased. Thereby, operation to the high temperature side of vaporization (evaporation) temperature is attained, and refrigerant | coolant operating temperature can be made high and heat source temperature can be made high. Therefore, it is possible to prevent the vaporization (evaporation) temperature from being lowered, which contributes to prevention of condensation in the evaporator.

  A twelfth aspect according to any one of the first to eleventh aspects is characterized in that the electronic device is a server and the device room is a server room.

  The present invention can be applied to all electronic devices that require precise operation and generate a large amount of heat from itself. However, when the electronic device is a server and the device room is a server room, a further effect is expected. Because it can.

  As described above, according to the electronic device cooling system of the present invention, an electronic device that requires precise operation of a computer and a server and generates a large amount of heat from itself can be efficiently cooled at a low running cost. can do.

  Hereinafter, preferred embodiments of a cooling system for an electronic device according to the present invention will be described in detail with reference to the accompanying drawings. Note that an example of a server disposed in a server room will be described as an example of an electronic device.

(First embodiment)
FIG. 1 is a conceptual diagram showing a cooling system 10 for an electronic device according to a first embodiment of the present invention.

  As shown in FIG. 1, server rooms 14 </ b> A and 14 </ b> B are formed on the first floor and the second floor in the two-story building 12. Underfloor chambers 22A and 22B are formed on the back sides of the floor surfaces 20A and 20B on the first floor and the second floor, respectively. A plurality of air outlets (not shown) are arranged on the floor surfaces 20A and 20B, and cold air from an air conditioner 78 (see FIG. 3) described later passes from the floor surfaces 20A and 20B to the server through the underfloor chambers 22A and 22B. It is blown out into the rooms 14A and 14B. The air outlet is preferably disposed in the vicinity of the front side of each server 28, and the cold air blown out thereby is supplied to the server 28, whereby the server 28 can be efficiently cooled.

  As shown in FIG. 2, a server rack 26 is disposed in the server rooms 14A and 14B, and a plurality of servers 28 are stored in a stacked state in the server rack 26. The server rack 26 is preferably provided with a moving caster 24 so as to be movable. The server 28 includes a fan 30, and heat generated in the server 28 is exhausted from the server 28 by sucking and exhausting the air in the server rooms 14 </ b> A and 14 </ b> B as indicated by an arrow 32. Note that the number of the two-story building 12, the server rooms 14A and 14B, the number of server racks 26 arranged in the server rooms 14A and 14B, and the number of servers 28 stacked in the server rack 26 shown in FIG. Etc. are examples, and are not limited to FIGS. 1 and 2. Further, as shown in FIG. 1, each server 28 housed in the server rack 26 is provided with an evaporator 34. In FIG. 1, the server 28 is illustrated instead of the server rack 26 so that the relationship between the server 28 and the evaporator 34 can be easily understood.

  As shown in FIG. 1, a cooling coil 36 is provided inside the evaporator 34, and the refrigerant liquid flowing in the cooling coil 36 evaporates with high-temperature air generated from the server 28, thereby removing the heat of vaporization from the surroundings and gasifying. To do. Thereby, the high-temperature air discharged from the server 28 itself or the server 28 is cooled.

  On the other hand, a cooling tower 38 is provided on the roof of the building 12, and a circulation line 40 through which the refrigerant naturally circulates is formed between the cooling tower 38 and each of the evaporators 34 described above. That is, in the cooling tower 38, a spiral pipe 41 through which a refrigerant flows is accommodated, and a sprinkling pipe 42 that sprinkles water into the spiral pipe 41 is provided above the spiral pipe 41. In addition, a fan 44 is provided above the sprinkling pipe 42, and by taking outside air from the side opening of the cooling tower 38 and discharging it from the top opening, a counter current is formed between the water to be sprinkled and the taken outside air. Thereby, outside air is taken in and cooled to be lower than the temperature.

  Between a cooling coil 36 provided in the evaporator 34 and a helical pipe 41 provided in the cooling tower 38, a return pipe 46 (refrigerant gas) for returning the refrigerant gas gasified by the evaporator 34 to the cooling tower 38. Piping) and a supply pipe 48 (refrigerant liquid pipe) for supplying the refrigerant liquid liquefied by cooling and condensing the refrigerant gas in the cooling tower 38 to the evaporator 34.

  The return pipe 46 and the supply pipe 48 are branched on the way, so that the evaporator 34 of the server 28 disposed in the server room 14A on the first floor through the underfloor chambers 22A and 22B on the first floor or the second floor, and the second floor. To the evaporator 34 of the server 28 disposed in the server room 14B. In such a configuration, due to the rapid increase in the amount of heat generated from the server 28 in recent years, the high-temperature heat generated (discharged) from the server 28 is directly heat-exchanged with the refrigerant flowing through the evaporator 34 in a high-temperature state, thereby generating By promoting the evaporation of the refrigerant, it is possible to obtain transport power for transporting the evaporated refrigerant gas to the cooling tower 38 installed at a higher position than the evaporator 34. As the refrigerant to be used, chlorofluorocarbon, HFC (hydrofluorocarbon) as an alternative chlorofluorocarbon, or the like can be used. In addition, water can be used if it is used at a pressure lower than atmospheric pressure. Here, the expression “refrigerant” includes both a gaseous refrigerant gas and a liquid refrigerant liquid. In FIG. 1, the flow direction of the refrigerant gas is indicated by white arrows, The direction of flow is indicated by black arrows.

  Thereby, a circulation line 40 for natural circulation of the refrigerant is formed between the evaporator 34 and the cooling tower 38. That is, the evaporator 34, the cooling tower 38, and the circulation line 40 constitute a non-powered heat pipe in which a refrigerant is sealed. Further, since the amount of heat generated from the server 28 is increased and a high-temperature refrigerant gas can be formed, the cooling temperature for condensing the refrigerant gas can be set higher, and the refrigerant gas can be condensed even with the cooling capacity of the cooling tower 38. The condensed refrigerant liquid flows down to the evaporator 34 located below the cooling tower 38.

  Each evaporator 34 is provided with a temperature sensor 50 that measures the temperature of the wind after the high-temperature air discharged from the server 28 is cooled by the evaporator 34, and at the outlet of the cooling coil 36, A valve 52 (flow rate adjusting means) for adjusting the supply flow rate (refrigerant flow rate) of the refrigerant supplied to the cooling coil 36 is provided. A controller (not shown) automatically adjusts the opening of the valve 52 based on the temperature measured by the temperature sensor 50. As a result, when the temperature of the wind after being cooled by the evaporator 34 becomes too lower than the set temperature, the opening of the valve 52 is reduced and the supply flow rate of the refrigerant is reduced. Thus, since the cooling load for cooling a refrigerant | coolant can be made small by not increasing the supply flow rate of a refrigerant | coolant more than necessary, sufficient cooling capability can be exhibited only by the cooling in the cooling tower 38. FIG.

  More specifically, the server 28 takes in the air in the server rooms 14 </ b> A and 14 </ b> B by the fan 30 and is heated, and heat exchange is performed between the heated high-temperature air and the refrigerant in the evaporator 34. The cooled wind is measured by the temperature sensor 50.

  On the other hand, unlike the conventional compression air conditioning system, the refrigerant natural circulation system requires a condensation temperature lower than the vaporization (evaporation) temperature. Therefore, if the evaporation temperature can be set high, the condensation temperature, ie, the cooling tower 38 can be set. In this case, the temperature of the outside air used can be increased, and the cooling capacity of the cooling tower 38 can be utilized even under a higher temperature outside air condition. That is, the cooling tower alone can be cooled even in the intermediate period (spring and autumn) when the outside air temperature is relatively high, and the operation of the refrigerator 68 can be suppressed to reduce the running cost.

  In addition to the cooling tower 38, a heat exchanger 54 having a larger cooling capacity than the cooling tower 38 is installed on the roof of the building 12, and the heat exchanger 54 is a parallel line 64 branched from the circulation line 40. Is provided. That is, as shown in FIG. 1, the parallel return pipe 58 and the parallel supply pipe 60 branched from the return pipe 46 and the supply pipe 48 are connected to the secondary coil 62 of the heat exchanger 54. As a result, the heat exchanger 54 is arranged in parallel with the cooling tower 38 in the refrigerant flow.

  The primary coil 66 of the heat exchanger 54 is connected to a chilled water supply pipe 70 and a chilled water return pipe 72 from the refrigerator 68, and a liquid feed pump 74 is provided in the chilled water supply pipe 70. Thereby, the cold water (primary refrigerant) manufactured by the refrigerator 68 exchanges heat with the refrigerant (secondary refrigerant) in the heat exchanger 54 to cool the refrigerant. In addition, the power consumption of the refrigerator 68 can be reduced by connecting the refrigerator 68 and the cooling tower 76 which is different from the cooling tower 38 described above to serve as a cooling heat source for the refrigerator 68. The structure of the cooling tower 76 is the same as that of the cooling tower 38 described above.

  In addition, the parallel return pipe 58 is provided with a parallel valve 59, a closing valve 61 is provided near the cooling tower 38 in the supply line 48, and a valve 69 is also provided in the cold water supply pipe 70 through which cold water flows. It is done. On the other hand, an outside air temperature sensor 63 for measuring the outside air temperature is provided in the vicinity of the cooling tower 38, and temperature sensors 65 and 67 are provided at the cooling tower outlet (refrigerant liquid side) and the heat exchanger outlet (refrigerant liquid side), respectively. Provided. The measurement results of the temperature sensors 63, 65, and 67 are sequentially input to the parallel control unit 71, and the parallel control unit 71 controls the valves 59, 61, and 69 based on the measurement results. Thereby, a parallel control mechanism is formed. Although the temperature sensors 65 and 67 are provided at the cooling tower outlet and the heat exchanger outlet, a pressure sensor (not shown) for measuring the pressure of the refrigerant flowing in the pipe may be provided. Both 67 and the pressure sensor may be provided.

  Here, the preferable form of the control method by the parallel control mechanism is demonstrated.

  In the first control method, the parallel control unit 71 calculates the ability of the cooling tower 38 to cool the refrigerant from the measurement result of the outside temperature sensor 63, and the opening amount of the parallel valve 59 is calculated from the calculation result. By adjusting, the amount of the refrigerant flowing through the heat exchanger 54 is controlled. Thereby, the cooling tower 38 and the heat exchanger 54 can be used efficiently so that the running cost is minimized according to the cooling load necessary for condensing the refrigerant gas evaporated in the evaporator 34.

  Since the cooling capacity of the cooling tower 38 greatly depends on the outside air temperature, by controlling as described above, a part of the refrigerant flowing in the circulation line 40 is automatically heat exchanger 54 according to the fluctuation of the outside air temperature. Therefore, only the shortage of the cooling capacity of the cooling tower 38 needs to be supplemented by the heat exchanger 54. Thereby, running cost can be further reduced.

  In the second control method, the parallel control unit 71 adjusts the opening amount of the parallel valve 59 so that the measurement result of the temperature sensor 65 at the outlet of the cooling tower becomes a predetermined value. Control the amount of refrigerant flowing. Thereby, the cooling capacity which the cooling tower 38 has at the time of a measurement can be grasped | ascertained by measuring the refrigerant | coolant temperature of a cooling tower exit. Therefore, by automatically adjusting the opening amount of the parallel valve 59 based on the measurement result, a part of the refrigerant flowing through the circulation line 40 can be automatically flowed to the heat exchanger 54. Only the shortage of the cooling capacity of 38 may be supplemented by the heat exchanger 54. Thereby, running cost can be further reduced.

  Moreover, when performing these control methods, the temperature of the refrigerant supplied to the evaporator 34 can be determined by measuring the temperature sensor 67 provided at the outlet of the heat exchanger. Therefore, if the opening degree of the valve 69 of the cold water supply pipe 70 is controlled based on the measurement result, it is possible to prevent the refrigerant from being cooled more than necessary by the heat exchanger 54. Furthermore, in the summer when the cooling capacity of the cooling tower 38 is the lowest, the combined use of the cooling tower 38 and the heat exchanger 54 may be disadvantageous in terms of running cost. When the temperature measured by the temperature sensor 63 reaches a predetermined value or more, the running cost can be further reduced by closing the closing valve 61.

  Thus, by having two cooling means of the cooling tower 38 and the heat exchanger 54 and sharing their respective roles, stable operation of the cooling system can be ensured and running for cooling the refrigerant is possible. Cost can be reduced.

(Second Embodiment)
FIG. 3 is a conceptual diagram showing a cooling system 100 for an electronic device according to the second embodiment of the present invention. The same members and configurations as those in the first embodiment are omitted.

  The cooling system 100 of the second embodiment is provided with an air conditioner 78 for cooling the server rooms 14A and 14B in the configuration of the cooling system 10 of the first embodiment, and circulates as a cooling heat source of the air conditioner 78. The refrigerant of line 40 is used.

  That is, as shown in FIG. 3, machine rooms 80A and 80B are provided adjacent to the server rooms 14A and 14B, respectively, and air conditioners 78 are installed in the machine rooms 80A and 80B, respectively. Further, a suction duct 79 that sucks the air in the server rooms 14A and 14B into the air conditioner 78 through the machine rooms 80A and 80B penetrates the partition wall 82 that partitions the server rooms 14A and 14B and the machine rooms 80A and 80B. One end of the suction duct 79 is connected to the cooling unit 84 of the air conditioner 78. In addition, one end of the blowout duct 81 is connected to the blower 86 of the air conditioner, and the other end extends through the partition wall 82 and extends to the underfloor chambers 22A and 22B. As a result, the air taken into the air conditioner 78 via the suction duct 79 is cooled by the cooling unit 84 of the air conditioner 78, and blown out to the underfloor chambers 22 </ b> A and 22 </ b> B via the blowout duct 81 by the blower 86. 20A and 20B are blown out to the server rooms 14A and 14B. In this case, it is preferable to form the air outlets (not shown) of the floor surfaces 20 </ b> A and 20 </ b> B so that cold air is blown out near the front surface of the server 28. The front surface of the server 28 is the opposite side of the evaporator 34.

  The cooling unit 84 of the air conditioner 78 is connected to an air conditioning circulation line 88 branched from the circulation line 40. That is, the air conditioning supply pipe 88 </ b> A and the air conditioning return pipe 88 </ b> B constituting the air conditioning circulation line 88 are connected to the cooling unit 84 of the air conditioner 78.

  According to the cooling system of the second embodiment configured as described above, the following effects can be exhibited in addition to the effects of the first embodiment described above.

  That is, the refrigerant in the circulation line 40 having a low running cost for cooling the refrigerant is used as a cold heat source for the air conditioner 78 for cooling the server rooms 14A and 14B with cold air. Thereby, the running cost for operating the air conditioner 78 can also be reduced. Further, by using the air conditioner 78 and the evaporator 34 that cools the server 28 together, the air in the entire electronic equipment room is circulated by the conventional air-conditioning system (floor blowing air-conditioning disclosed in JP-A-2004-232927). Compared to the air conditioning system), it is possible to suppress the occurrence of heat pools (local high temperature parts) in the server rooms 14A and 14B, and to increase the temperature of the supply air from the air conditioner 78 that air-conditions the whole. Therefore, in the present invention, the vaporization (evaporation) temperature of the refrigerant may be higher than in the prior art, and the capacity of the cooling tower 38 can be fully utilized.

  Therefore, supplying the refrigerant in the circulation line 40 to the cooling unit 84 of the air conditioner 78 contributes to both energy saving of the air conditioner 78 and performance of the cooling tower 38.

(Third embodiment)
FIG. 4 is a conceptual diagram showing a cooling system 200 for an electronic device according to the third embodiment of the present invention. Note that the same members and configurations as those of the second embodiment are omitted.

  In the cooling system 200 of the third embodiment, in addition to the configuration of the cooling system 100 of the second embodiment, a plurality of servers 28 including the evaporator 34 are grouped to cut each other into groups. It is configured to be able to be operated in the state.

  That is, as shown in FIG. 4, a plurality of servers 28 provided with the evaporator 34 are grouped into a plurality of groups. In the case of FIG. 4, the server 28 installed in the server room 14A on the first floor is grouped as one group, and the server 28 installed in the server room 14B on the second floor is grouped as another group. The grouping method is not limited to the above, and the grouping can be further finely divided.

  In addition, two group heat exchangers 90 having the number of groups divided in the middle of the circulation line 40 are provided, and the circulation line 40 is connected to the cooling tower 38 and / or the heat exchanger 54 and the group heat exchanger. The main circulation line 40 </ b> A in which the refrigerant circulates between 90 and the group circulation line 40 </ b> B in which the refrigerant circulates between the group heat exchanger 90 and the evaporator 34.

  In the second embodiment, the refrigerant flowing through the circulation line 40 is directly supplied to the cooling unit 84 of the air conditioner 78 as a cooling source of the air conditioner 78. In the third embodiment, the air conditioner 78 The machines 78 were also grouped into two groups: an air conditioner 78 installed in the machine room 80A on the first floor and an air conditioner 78 installed in the machine room 80B on the second floor. The group circulation line 40B of the corresponding group is connected to the cooling unit 84 of each air conditioner 78.

  According to the cooling system 200 of the third embodiment configured as described above, the following effects can be exhibited in addition to the effects of the second embodiment.

  That is, if an abnormality occurs in one group, for example, the evaporator 34, or the flow of the refrigerant stops, the abnormality does not spread to other groups. Therefore, it is possible to prevent an abnormality from occurring in the cooling of all the servers 28 arranged in the server rooms 14A and 14B. In addition, by dividing the air conditioners 78 into groups, even if an abnormality such as the refrigerant flow stopping in one group occurs, the abnormality spreads to the cooling unit 84 of the air conditioners 78 of other groups. There is no.

(Fourth embodiment)
FIG. 5 is a conceptual diagram showing an electronic device cooling system 300 according to a fourth embodiment of the present invention, and FIG. 1 is changed so that the cooling tower 38 and the heat exchanger 54 are arranged in series. It is a thing. In addition, in the first embodiment, the case where the cooling tower 38 and the heat exchanger 54 are installed so as to have a parallel arrangement relationship has been described. Will be described with the same reference numerals.

  As shown in FIG. 5, the refrigerant gas vaporized in the evaporator 34 reaches the cooling tower 38 via the return supply 46 of the circulation line 40, where it is cooled to become a refrigerant liquid, and then returned to the series line 73. It flows to the heat exchanger 54 via the pipe 75. In the heat exchanger 54, the refrigerant liquid further cooled by heat exchange with the primary refrigerant (cold water) flows to the supply pipe 48 of the circulation line 40 via the forward pipe 77 of the series line 73. As a result, the heat exchanger 54 is arranged in series with respect to the cooling tower 38 in the refrigerant flow.

  Further, a valve 69 and a regulating valve 87 are provided at the cold water supply pipe 70 and the cooling tower outlet, respectively, and an outside air temperature sensor 63 near the cooling tower 38, and a temperature sensor 65 at the cooling tower outlet and the heat exchanger outlet, respectively. , 67 are provided. Further, a bypass line 83 that allows the refrigerant gas returning from the evaporator 34 to flow to the heat exchanger 54 is provided, and a bypass valve 85 is provided in the bypass line 83. In order to distinguish the bypass line 83 from the series line described above, the bypass line 83 is shown in the waveform in FIG. The measurement results of the temperature sensors 63, 65, and 67 are input to the series control unit 89, and the series control unit 89 controls the valves 69, 85, and 87 based on the measurement results. Thereby, a serial control mechanism is formed. In FIG. 5, the temperature sensors 65 and 67 are arranged at the cooling tower outlet and the heat exchanger outlet, respectively. However, a pressure sensor for measuring the pressure of the refrigerant flowing in the pipe can be provided. Both may be provided.

  Here, the preferable form of the control method by the control mechanism for series is demonstrated.

  In the summer, when the cooling capacity of the cooling tower 38 decreases, the serial control unit 89 increases the cooling load of the heat exchanger 54, but manages so that the measurement result of the heat exchange outlet sensor becomes a predetermined value. When the refrigerant sequentially flows from the cooling tower 38 to the heat exchanger 54, the heat quantity of the primary refrigerant can be controlled so that the heat exchanger 54 supplements only the insufficient cooling capacity of the cooling tower 38. Become. Therefore, useless cooling energy is not required in the heat exchanger 54.

  In addition, since the cooling capacity of the cooling tower 38 varies depending on the outside air temperature, if the amount of the refrigerant flowing through the spiral pipe 41 in the cooling tower 38 is too large in summer or intermediate period, the temperature necessary for natural circulation of the refrigerant. It may not be possible to cool down. Therefore, the flow rate of the refrigerant gas to the cooling tower 38 is controlled by operating the opening of the bypass valve 85 provided in the bypass line and the adjustment valve 87 provided at the cooling tower outlet, and the measurement result of the temperature sensor 65 at the cooling tower outlet is What is necessary is just to manage so that it may become a predetermined value. Accordingly, the outdoor temperature that is the cold source of the cooling tower 38 can be effectively utilized regardless of the summer, intermediate, and winter periods, and the running cost can be further reduced.

  Here, the predetermined value refers to a temperature or pressure required for the natural circulation of the refrigerant in the circulation line.

  As described above, in the fourth embodiment of the present invention, even when the cooling tower 38 and the heat exchanger 54 are arranged in series, the refrigerant gas returning from the evaporator 34 is first cooled by the cooling tower 38 and then subjected to heat exchange. Since only the insufficient cooling of the cooling tower 38 needs to be supplemented by the heat exchanger 54 by passing through the cooler 54, the cooling air of the outside air can be effectively utilized throughout the year in the cooling tower 38.

  Further, as a further preferable aspect of the series control mechanism, when the series control unit 89 reaches a predetermined value or more in the summer, the adjustment valve 87 is fully closed and the bypass valve is closed. 85 is fully opened, the return of the refrigerant gas from the evaporator 34 to the cooling tower 38 is cut off, and all is led to the heat exchanger 54. Thereby, the running cost in summer can be further reduced.

  It should be noted that the second embodiment or the third embodiment described above can be combined with the configuration in which the cooling tower 38 and the heat exchanger 54 of the fourth embodiment are arranged in series.

(Summary of the present invention)
As described above, according to the electronic device cooling system of the present invention, an electronic device that requires precise operation such as a computer and a server and generates a large amount of heat from itself can be efficiently cooled at a low running cost for the following reason. can do.

  (A) Adopting the refrigerant natural circulation system and utilizing the difference in height between the positions of the evaporator 34 and the cooling tower 38 and the difference in processing temperature eliminates the need for refrigerant (heat) conveyance power. In the natural refrigerant circulation system, the system operates when the difference ΔT between the air temperature discharged from the evaporator 34 and measured by the temperature sensor 50 and the air temperature at which the refrigerant is cooled by the cooling tower 38 is 5 ° C. or more, and without power. Refrigerant can be conveyed. In a conventional central air-conditioning type cooling system, about 10% of the total power required for the system is occupied by pump power for transporting the refrigerant, and the pump power required for this refrigerant transport (also referred to as heat transport) can be reduced.

  Further, in recent years, the amount of heat generated from the server 28 is rapidly increased, and high-temperature heat (high-temperature air) is generated from the server 28, so that the above ΔT is increased compared to the conventional case. As the ΔT increases, the heat transfer amount (the heat treatment amount of the system) increases. Although the heat transfer amount varies depending on the specifications of the heat exchanger 54, it is possible to cool about half of the server heat generation at ΔT = 15 ° C. (when the server heat generation is 15 kW) A heat treatment of 7.5 kW at ΔT = 15 ° C. and 15 kW at ΔT = 30 ° C. is possible. Server rack exhaust (air temperature on the evaporator side) is usually about 40 ° C., and if the outside air temperature is 25 ° C. (corresponding to ΔT = 15 ° C.) or less, half of the server heat generation is cooled by outside air only. If the temperature is 10 ° C. (corresponding to ΔT = 30 ° C.) or less, the entire amount of server heat generation can be treated with the outside air. For example, in Tokyo, the time when the outside air temperature is 10 ° C. or less is about 2600 hours (about 30% of the total number of hours), and if the operation using the outside air cooling is performed only at the outside air temperature 10 ° C. or less, the heat load of the heat source is conventionally Can also be reduced by 30%. In addition, the number of hours of the outside air temperature of 10 ° C. to 25 ° C. is about 40% of the total number of hours, and during this period (intermediate period), if 50% of the server heat generation is performed by outside air treatment using outside air, Thermal load can be reduced by 50% compared to the conventional case.

  (B) By adopting a cooling tower 38 for cooling the refrigerant gas and effectively using the cold heat of the low temperature outside air in the winter and intermediate periods (spring and autumn), the heat source equipment (in the past, the compressor of the packaged air conditioner) ) Can reduce the amount of cooling heat produced. In fact, the efficiency of a conventional packaged air conditioner: COP [Cooling energy to manufacture (kW) / Input power (kW)] is 2 to 2.5, but the cooling with the use of outside air according to the present invention increases the COP to 30 or more. Become.

  (C) A local heat accumulation can be prevented by performing local cooling for each server 28 using the evaporator 34 close to the server 28.

  For example, in a data processing center facility, an air temperature condition for normal operation is specified for a server mounted in a server rack, and the intake air condition is generally 25 ° C. or less although it varies slightly depending on the server.

  On the other hand, in the conventional floor blowing type air conditioning, the supply air temperature from the package air conditioner is about 18 ° C., and the return air temperature to the air conditioner is about 26 ° C. In actual operation, the server rack exhaust (usually about 40 ° C.) and the supply air are partially mixed and sucked into the server rack. Therefore, in order to satisfy the server rack suction air temperature of 25 ° C., the supply air temperature This is because the temperature must be low (the actual air temperature is about 18 ° C.).

  On the other hand, when the server rack is cooled by the local heat treatment unit method, the outlet air temperature of 25 ° C. is satisfied. Therefore, even if the supply air temperature is not low, that is, higher than 18 ° C., the server intake air The temperature 25 ° C. can be satisfied, and for example, the supply air temperature 23 ° C. can be increased 5 ° C. as compared with the conventional 18 ° C. Normally, in a package air-conditioning type cooling system, the efficiency (COP) can be improved by about 3% by raising the supply air temperature by 1 ° C. By increasing the supply air temperature by 5 ° C, the COP is about 15%. Can be improved.

  In order to prevent heat accumulation due to such local cooling, conventionally, air conditioning air supplied from the air conditioner 78 to the server rooms 14A and 14B is lowered in temperature, thereby preventing the effect of heat accumulation on the electronic devices such as the server 28. Was. However, when the supply air temperature is lowered in this way, the refrigerant gas temperature vaporized by the evaporator 34 becomes too low. As a result, the set temperature of the refrigerant means for cooling and condensing the refrigerant gas must be lowered, and a cooling means with a very low cooling capacity such as the cooling tower 38 cannot be used.

  On the other hand, in the present invention, the refrigerant cooled in the cooling tower 38 is supplied to the cooling unit 84 of the air conditioner 78 so that the supply air temperature does not become too low. Therefore, it is possible to use a cooling means having a large cooling capacity. Further, since the supply air temperature can be raised, the COP of the entire cooling system can be improved. In this case, even with a configuration in which the refrigerant cooled by the cooling tower 38 is supplied to the cooling unit 84 of the air conditioner 78, heat accumulation can be sufficiently prevented, and there is no problem at all.

  In the present invention, the cooling tower 38 is disposed above the evaporator 34 so that the refrigerant is naturally circulated. However, for example, a refrigerant pump (not shown) is provided in the supply pipe 48 and the branch supply pipe 60 of the circulation line 40. Thus, the refrigerant can be transported by the refrigerant pump without being naturally circulated. As a result, in the positional relationship between the evaporator 34 and the cooling tower 38, the cooling tower 38 does not have to be arranged above the evaporator 34, and the arrangement of the evaporator 34 and the cooling tower 38 is not restricted and is free. Can be arranged.

  Although the cooling systems 10, 100, and 200 in the first to third embodiments described above have been described using the server 26 as an electronic device, the present invention requires precise operation and generates heat from itself. It can be applied to all electronic devices having a large amount.

1 is a conceptual diagram illustrating a first embodiment of an electronic device cooling system according to the present invention; Explanatory drawing explaining a server and a server rack FIG. 3 is a conceptual diagram illustrating a second embodiment of a cooling system for an electronic device according to the present invention. Schematic diagram for explaining a third embodiment of the cooling system for electronic equipment of the present invention Conceptual diagram for explaining a fourth embodiment of a cooling system for electronic equipment according to the present invention.

Explanation of symbols

  10, 100, 200, 300 ... cooling system, 12 ... building, 14A ... first floor server room, 14B ... second floor server room, 16A ... first floor ceiling surface, 16B ... second floor ceiling surface, 20A ... 1 Floor of floor, 20B ... Floor of 2nd floor, 22A ... Underfloor chamber of 1st floor, 22B ... Underfloor chamber of 2nd floor, 24 ... Casters, 26 ... Server rack, 28 ... Server, 30 ... Server fan, 32 ... Hot air, 34 ... evaporator, 36 ... cooling coil, 38 ... cooling tower, 40 ... circulation line, 40A ... main circulation line, 40B ... group circulation line, 41 ... spiral pipe, 42 ... sprinkling pipe, 44 ... cooling Tower fan, 46 ... return pipe, 48 ... supply pipe, 50 ... temperature sensor, 52 ... valve, 54 ... heat exchanger, 58 ... parallel return pipe, 59 ... parallel valve, 60 ... parallel supply pipe, 61 ... Stop valve, 62 ... secondary coil, 63 ... outside air temperature sensor, 64 ... branch circulation line, 65 ... temperature sensor at cooling tower outlet, 66 ... primary coil, 67 ... temperature sensor at heat exchanger outlet, 68 ... refrigerator, 69 ... valve, 70 ... cold water supply pipe, 71 ... parallel control section, 72 ... cold water return pipe, 74 ... liquid feed pump, 75 ... return pipe, 76 ... cooling tower, 77 ... forward pipe, 78 ... Air conditioner 79 ... Suction duct, 80A ... First floor machine room, 80B ... Second floor machine room, 81 ... Outlet duct, 82 ... Bulkhead, 83 ... Bypass line, 84 ... Cooling part of air conditioner, 85 ... Bypass valve 86 ... Air conditioning fan, 87 ... Adjusting valve, 88 ... Air conditioning circulation line, 88A ... Air conditioning supply pipe, 88B ... Air conditioning return pipe, 89 ... Series controller, 90 ... Group heat exchanger

Claims (12)

An equipment room with a plurality of electronic devices,
An evaporator that is provided near each of the electronic devices, and that cools the electronic device by evaporating a refrigerant with heat generated from the electronic device;
A cooling tower that is provided at a higher position than the evaporator, cools the refrigerant by outside air and sprinkling, and condenses the vaporized refrigerant;
An electronic device cooling system comprising: a circulation line through which the refrigerant naturally circulates between the evaporator and the cooling tower. A heat exchanger for cooling the refrigerant;
A flow path of the refrigerant connected to the circulation line, the parallel line provided so that the heat exchanger has a parallel relationship with the cooling tower;
The electronic device cooling system according to claim 1, further comprising: a parallel control mechanism configured to control a refrigerant amount of the refrigerant flowing from the circulation line to the parallel line. The parallel control mechanism is:
An outside temperature sensor for measuring the outside temperature;
A parallel valve that is provided in the parallel line and adjusts the amount of refrigerant through which the refrigerant gas returning from the evaporator flows into the heat exchanger;
By calculating the ability of the cooling tower to cool the refrigerant from the measurement result of the outside air temperature sensor, and adjusting the opening amount of the parallel valve from the calculation result, the amount of refrigerant flowing to the heat exchanger is calculated. The electronic device cooling system according to claim 2, further comprising a parallel control unit that controls the electronic device cooling system. The parallel control mechanism is:
A cooling tower outlet sensor for measuring the refrigerant temperature and / or refrigerant pressure at the cooling tower outlet;
A parallel valve that is provided in the parallel line and adjusts an amount of refrigerant flowing from the evaporator to the heat exchanger.
A parallel control unit that controls the amount of refrigerant flowing through the heat exchanger by adjusting the opening amount of the parallel valve so that the measurement result of the cooling tower outlet sensor becomes a predetermined value. The electronic device cooling system according to claim 2. A heat exchanger for cooling the refrigerant;
A flow path for the refrigerant connected to the circulation line, wherein the heat exchanger is provided in series with the cooling tower, and the refrigerant returning from the evaporator passes through the cooling tower. And a series line in which the line is configured to reach the heat exchanger,
The electronic apparatus cooling system according to claim 1, further comprising: a serial control mechanism that controls a cooling capacity of the heat exchanger. The serial control mechanism is:
A heat exchange outlet sensor for measuring the refrigerant temperature and / or refrigerant pressure at the heat exchanger outlet;
A primary refrigerant valve for adjusting a refrigerant amount of a primary refrigerant for cooling the refrigerant flowing through the heat exchanger;
A series control unit that controls the primary refrigerant valve based on a measurement result of the heat exchange outlet sensor,
The series control unit includes:
6. The electronic apparatus cooling system according to claim 5, wherein the primary refrigerant valve is controlled so that a measurement result of the heat exchange outlet sensor becomes a predetermined value. The serial control mechanism is:
A cooling tower outlet sensor for measuring the refrigerant temperature and / or refrigerant pressure at the cooling tower outlet;
A bypass line through which refrigerant gas returning from the evaporator can flow to the heat exchanger;
A bypass valve for adjusting the flow rate of the refrigerant gas flowing through the bypass line;
An adjustment valve provided at the cooling tower outlet;
A series control unit that controls the bypass valve and the regulating valve based on the measurement result of the cooling tower outlet sensor,
The series control unit includes:
The electronic device cooling system according to claim 5 or 6, wherein the bypass valve and the adjustment valve are controlled so that a measurement result of the cooling tower outlet sensor becomes a predetermined value. The serial control mechanism is:
An outside temperature sensor for measuring the outside temperature;
A bypass line through which refrigerant gas returning from the evaporator can flow to the heat exchanger;
A bypass valve for adjusting a flow rate of the refrigerant gas flowing through the bypass line,
The series control unit includes:
In the summer, when the measurement result of the outside air temperature sensor reaches a predetermined value or more, the adjustment valve is fully closed and the bypass valve is fully opened to prevent the return of the refrigerant gas to the cooling tower. The electronic apparatus cooling system according to claim 6, wherein the electronic apparatus cooling system is led to the heat exchanger. An air conditioner that cools the high-temperature air sucked from the equipment room and returns the air to the equipment room;
The cooling of an electronic device according to any one of claims 1 to 8, further comprising an air-conditioning circulation line that branches off from the circulation line and circulates the refrigerant between the air-cooling unit and the cooling unit. system. Grouping the plurality of electronic devices into a plurality of groups, and providing a group heat exchanger for the number of groups grouped in the middle of the circulation line,
The main circulation line through which the refrigerant circulates between the cooling tower and / or heat exchanger and the group heat exchanger, the group heat exchanger, the evaporator, and / or the circulation line. The electronic apparatus cooling system according to claim 9, wherein the electronic apparatus cooling system is configured with a group circulation line in which a refrigerant circulates between the cooling unit of the air conditioner. A flow rate adjusting means for adjusting a refrigerant flow rate, provided in a refrigerant gas flow path at the evaporator outlet position in the circulation line;
A temperature sensor for detecting the temperature of air discharged from the evaporator;
A controller for controlling the flow rate adjusting means,
The electronic device cooling system according to claim 1, wherein the controller controls the flow rate adjusting unit so that the temperature sensor becomes a predetermined value.   The electronic device cooling system according to claim 1, wherein the electronic device is a server and the device room is a server room.

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