JP2003166729A - Air-conditioning system of communication unit and information processor room - Google Patents

Air-conditioning system of communication unit and information processor room

Info

Publication number
JP2003166729A
JP2003166729A JP2001367430A JP2001367430A JP2003166729A JP 2003166729 A JP2003166729 A JP 2003166729A JP 2001367430 A JP2001367430 A JP 2001367430A JP 2001367430 A JP2001367430 A JP 2001367430A JP 2003166729 A JP2003166729 A JP 2003166729A
Authority
JP
Japan
Prior art keywords
air
rack
communication
information processing
processing equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001367430A
Other languages
Japanese (ja)
Other versions
JP3842631B2 (en
Inventor
Masanori Inoue
正憲 井上
Atsushi Takahashi
惇 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Takasago Thermal Engineering Co Ltd
Original Assignee
Takasago Thermal Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takasago Thermal Engineering Co Ltd filed Critical Takasago Thermal Engineering Co Ltd
Priority to JP2001367430A priority Critical patent/JP3842631B2/en
Publication of JP2003166729A publication Critical patent/JP2003166729A/en
Application granted granted Critical
Publication of JP3842631B2 publication Critical patent/JP3842631B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • H05K7/20745Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Central Air Conditioning (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an air-conditioning system which saves on the space and the energy on the whole by locally treating the waste heat of high density from a communication unit and information processor room. <P>SOLUTION: A local cooling unit 21 is installed above each passage space part X between rack rows A and B, and rack rows C and D of the rack L with apparatuses 2 such as servers mounted thereon. The local cooling unit 21 is suspended from a ceiling part 25. An opening part 4 is formed in a side surface of the rack L, and a fan 1 is provided on an upper part of the rack L. The conditioned air at low temperature from the local cooling device 21 is taken into the rack L through the opening part 4 to locally treat the waste heat from the apparatuses 2. Since the local cooling unit 21 is installed in a separate and independent manner from the rack L, the static pressure is less fluctuated even when a trouble occurs in a part of the local cooling unit 21. This air-conditioning system can be easily adapted to an existing facility, and the maintainability thereof is excellent. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は,通信・情報処理機
器室等をはじめとする,発熱密度の高い部屋の空調シス
テム及びその運転方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an air conditioning system for a room having a high heat generation density, such as a communication / information processing equipment room, and an operating method thereof.

【0002】[0002]

【従来の技術】多数の電算機を収容しているいわゆる電
算機室などでは,空調負荷のほとんどが顕熱負荷となっ
ており,その床面積当りの平均発熱密度は500w/m
程度である。このような施設では施工やメンテナンス
の容易性,および熱源を分散することができるなどの理
由から,全顕熱処理型のパッケージエアコンが多く使用
されている。また,これらの施設の部屋構造は,多数の
電源ケーブルや信号ケーブルを配線する必要があるため
その多くは二重床構造となっており,床下チャンバを配
線スペースとして利用している。
2. Description of the Related Art In a so-called computer room that accommodates a large number of computers, most of the air conditioning load is sensible heat load, and the average heat generation density per floor area is 500 w / m.
It is about 2 . In such facilities, all sensible heat treatment type packaged air conditioners are often used because of their ease of construction and maintenance, and the ability to disperse heat sources. In addition, the room structure of these facilities requires a large number of power cables and signal cables to be wired, so many of them have a double floor structure, and the underfloor chamber is used as a wiring space.

【0003】パッケージエアコンによる空調においても
床下チャンバを風道として利用しているため,パッケー
ジエアコンは上部吸込み・下部吹き出し方式となってお
り,パッケージエアコンで処理された低温空気を床下チ
ャンバを通じて,電算機などの設置場所に搬送し,機器
下部に設けられた開口部から当該低温空気を機器筐体内
部に供給して機器からの排熱の処理を行っている。
Since the underfloor chamber is also used as an air passage in the air conditioning by the package air conditioner, the package air conditioner has an upper intake / lower air blow system, and low-temperature air treated by the package air conditioner is passed through the underfloor chamber to a computer. Etc., and the low temperature air is supplied to the inside of the equipment casing from the opening provided at the bottom of the equipment to treat the heat exhausted from the equipment.

【0004】従来のこのような空調システムの構成を図
9に示す。使用される全顕熱処理型のパッケージエアコ
ン101は,直膨式冷却コイル102と送風機103と
を有し,直膨式冷却コイル102は機器室Mの外部に設
置されている室外機104と冷媒配管105で結ばれて
いる。この全顕熱処理型のパッケージエアコン101か
ら吹き出される空気の温度は通常15〜20℃であり,
電算機106からの排気(二重床の床下チャンバ107
を通じて電算機106下部の開口部108より供給され
た空気)と機器室Mの床面Fの開口部109から機器室
M内へ吹き出された空気との混合空気,すなわちパッケ
ージエアコン101への戻り空気温度は25℃程度とな
る。したがって,全顕熱処理型のパッケージエアコン1
01での処理温度差は5〜10℃程度となる。現在製品
化されている全顕熱処理型のパッケージエアコン1台当
りの冷却能力は10〜40kW程度であり,機器室M内
の外周壁面に沿って空調熱負荷に応じた台数のパッケー
ジエアコンを設置して室内空調を行っている。
The configuration of such a conventional air conditioning system is shown in FIG. The all sensible heat treatment type packaged air conditioner 101 used has a direct expansion cooling coil 102 and a blower 103, and the direct expansion cooling coil 102 is an outdoor unit 104 installed outside the equipment room M and a refrigerant pipe. It is tied at 105. The temperature of the air blown out from the packaged air conditioner 101 of the total sensible heat treatment is usually 15 to 20 ° C.,
Exhaust from computer 106 (double floor underfloor chamber 107
Through the opening 108 at the bottom of the computer 106) and the air blown into the equipment room M from the opening 109 on the floor surface F of the equipment room M, that is, return air to the package air conditioner 101. The temperature is about 25 ° C. Therefore, the total sensible heat treatment type package air conditioner 1
The processing temperature difference at 01 is about 5 to 10 ° C. The cooling capacity of one packaged air conditioner of all sensible heat treatment type currently commercialized is about 10 to 40 kW, and the number of packaged air conditioners according to the air conditioning heat load is installed along the outer peripheral wall surface in the equipment room M. To perform indoor air conditioning.

【0005】また前記全顕熱処理型のパッケージエアコ
ン101など,一般のパッケージエアコン等の直膨式冷
却コイル102の冷媒蒸発温度の制御目標の範囲は,例
えば2〜6℃程度で一定値となっている。このような空
調機を用いて室内の冷房を行う際の室内湿度は,直膨式
冷却コイル102での減湿量に依存している。この減湿
量は,冷媒蒸発温度や冷房負荷の大きさにより決まる空
調機の運転時間に依存する。したがって,室内湿度を一
定に維持する必要がある室では,別途減湿機や加湿器な
どを設置して湿度管理を行なう必要がある。
Further, the control target range of the refrigerant evaporation temperature of the direct expansion type cooling coil 102 of a general package air conditioner such as the above-mentioned all heat treatment type package air conditioner 101 becomes a constant value at about 2 to 6 ° C., for example. There is. The indoor humidity when cooling the room using such an air conditioner depends on the amount of dehumidification in the direct expansion cooling coil 102. This amount of dehumidification depends on the operating time of the air conditioner, which is determined by the refrigerant evaporation temperature and the size of the cooling load. Therefore, in a room where it is necessary to maintain a constant indoor humidity, it is necessary to separately install a dehumidifier or humidifier to manage the humidity.

【0006】[0006]

【発明が解決しようとする課題】ところでインターネッ
トの普及に伴い,インターネットを利用したビジネスが
増加している。これらのビジネスを展開するために多く
の通信・情報処理施設が建設されている。これら施設内
の通信・情報処理機器室では,図10に示すように,サ
ーバやルータ等の通信・情報処理機器を複数台収納した
ラックLが機器室内に多数並べられている。これらの施
設も空調熱負荷のほとんどが顕熱負荷であり,その発熱
密度は一般的な電算機室よりもかなり大きくなってきて
いる。中には床面積あたりの発熱密度が1000W/m
を超える施設も出てきており,この傾向は当分の間続
くと考えられる。
By the way, with the spread of the Internet, businesses using the Internet are increasing. Many communication and information processing facilities have been built to develop these businesses. In the communication / information processing equipment room in these facilities, as shown in FIG. 10, a large number of racks L accommodating a plurality of communication / information processing equipment such as servers and routers are arranged in the equipment room. Most of the air-conditioning heat load in these facilities is also sensible heat load, and the heat generation density is much higher than that of general computer rooms. Inside has a heat generation density per floor area of 1000 W / m
There are more than two facilities, and this trend is expected to continue for the time being.

【0007】このような発熱密度が高い機器室の空調を
行う場合,前記した電算機室で採用されている従来の全
顕熱処理型パッケージエアコン101の設置台数を熱負
荷に応じて増加する方式では,パッケージエアコン10
1の設置台数が著しく増加し,施設内の機器室壁面だけ
では室内機を設置できなくなるおそれがある。またパッ
ケージエアコンを増設する方式では,室内機の設置スペ
ースの確保が難しくなるばかりではなく,送風量の増加
による送風エネルギーの著しい増加を招くことになる。
さらに機器室の床面積が広くなったり床下チャンバ内の
通信ケーブル量が多くなると,床下チャンバ107内に
均一に送風できなくなり,肝要な通信・情報処理機器に
対する冷却能力にばらつきが生じる。また機器室で局所
的に発熱密度が高いエリアがある場合には,送風量の増
加や送風温度の低温化を図る必要があるが,前記従来シ
ステムでは局所的な対応が難しい。
In the case of performing air conditioning of the equipment room having such a high heat generation density, in the method of increasing the number of installed conventional all sensible heat treatment type package air conditioners 101 used in the computer room according to the heat load. , Package air conditioner 10
The number of units installed in No. 1 will increase significantly, and it may not be possible to install indoor units only on the walls of the equipment room in the facility. In addition, the method of adding a packaged air conditioner not only makes it difficult to secure the installation space for the indoor unit, but also causes a significant increase in blast energy due to an increase in blast volume.
Further, when the floor area of the equipment room becomes large or the amount of communication cables in the underfloor chamber increases, it becomes impossible to uniformly blow air into the underfloor chamber 107, and the cooling capacity for the essential communication / information processing equipment varies. Further, when there is an area where the heat generation density is locally high in the equipment room, it is necessary to increase the air flow rate and lower the air flow temperature, but it is difficult for the conventional system to deal locally.

【0008】さらにまた既述したように,一般のパッケ
ージエアコン101を用いて室内の冷房を行う際に,顕
熱負荷が小さく,且つ外気からの侵入湿分が多い場合に
は,顕熱負荷が小さいために室内温度は比較的早く設定
温度に到達するため,十分な減湿が行われない状態で空
調機が停止することになる。顕熱負荷が大きくなると,
空調機は連続的に運転するようになり,空調機に内蔵さ
れた冷却コイルに結露が生じ,室内空気の露点温度が冷
却コイルの表面温度相当になるまで減湿が行われる。こ
のように一般のパッケージエアコンでは,減湿量が顕熱
負荷の大きさにより変化するため,前記したような電算
機室や通信・情報処理機機室など室内湿度を一定に維持
する必要がある室,部屋では,別途専用の減湿機を設け
なければならず,イニシャルコストを増加させることに
なる。
Furthermore, as described above, when the indoor air conditioner 101 is used for cooling the room, if the sensible heat load is small and the moisture entering from the outside air is large, the sensible heat load is increased. Since it is small, the room temperature reaches the set temperature relatively quickly, so the air conditioner will stop without sufficient dehumidification. When the sensible heat load increases,
The air conditioner operates continuously, and dew condensation occurs on the cooling coil built into the air conditioner, and dehumidification is performed until the dew point temperature of the indoor air reaches the surface temperature of the cooling coil. As described above, in a general packaged air conditioner, the amount of dehumidification changes depending on the magnitude of the sensible heat load, so it is necessary to maintain a constant indoor humidity in the computer room and the communication / information processing machine room as described above. Separate dehumidifiers must be installed in each room, increasing the initial cost.

【0009】また前記した顕熱負荷が大きい場合には,
空調機の運転時間は長くなるが,減湿量は空調機の運転
時間等に依存するため成り行きとなる。減湿量が過多の
場合には,冷却コイルで減湿をしつつ加湿器で加湿を行
うなどの無駄なエネルギーを消費する場合がある。
When the sensible heat load is large,
The operating time of the air conditioner will be longer, but the amount of dehumidification will depend on the operating time of the air conditioner and other factors. When the amount of dehumidification is excessive, wasteful energy may be consumed, such as dehumidifying the cooling coil and humidifying the humidifier.

【0010】本発明は,かかる点に鑑みてなされたもの
であり,通信・情報処理機器を搭載しているラック内の
機器排熱を効果的に処理して空調熱負荷を低減させると
ともに,空調機器の設置スペースを工夫して,前記課題
の解決を図ることをその目的としている。また本発明で
は,パッケージエアコン等の空調装置を用いて前記した
通信・情報処理機機室内全体の空調を行う際に,これら
空調装置間の制御目標値や運転方法を工夫することで,
減湿機などの特別の機器を用いることなく湿度調整(減
湿に係わる調整)を行うことをその目的としている。
The present invention has been made in view of the above point, and effectively treats the exhaust heat of the equipment in the rack in which the communication / information processing equipment is mounted to reduce the air-conditioning heat load, and The purpose is to solve the above problems by devising the installation space of equipment. Further, according to the present invention, when the air conditioner such as a packaged air conditioner is used to perform the air conditioning of the entire communication / information processing machine room, by devising a control target value or an operating method between these air conditioners,
Its purpose is to perform humidity adjustment (adjustment related to dehumidification) without using special equipment such as a dehumidifier.

【0011】[0011]

【課題を解決するための手段】前記目的を達成するた
め,請求項1によれば,通信・情報処理機器を上下方向
に搭載したラックが整列してラック列をなし,当該ラッ
ク列が複数設置されている通信・情報処理機器室等を空
調するシステムであって,前記ラック列間に形成される
空間部の上方に,当該空間部を冷却するための局所冷却
装置が,前記ラック列とは構造的に分離して設けられ,
前記局所冷却装置は,前記通信・情報処理機器室の床面
と対向するように設けられた吹出口と,当該通信・情報
処理機器室内の上部空間の空気を取り入れるための吸込
口を有していることを特徴とする,通信・情報処理機器
室等の空調システムが提供される。
According to a first aspect of the present invention, in order to achieve the above object, racks on which communication / information processing devices are vertically mounted are aligned to form a rack row, and a plurality of the rack rows are installed. A system for air conditioning a communication / information processing equipment room, etc., in which a local cooling device for cooling the space section is provided above the space section formed between the rack rows. Structurally separated,
The local cooling device has an air outlet provided so as to face the floor of the communication / information processing equipment room, and an inlet for taking in air in the upper space of the communication / information processing equipment room. An air conditioning system for communication / information processing equipment rooms is provided.

【0012】このように前記ラック列相互間に形成され
る空間部の上方のみに,ラック列とは構造的に分離し
て,床面と対向した吹出口および機器室上部空間の高温
空気を取り入れるための吸込口を有した局所冷却装置を
配置することで,ラックの入れ替えや移動が自由に行え
るとともに,前記ラック列相互間に形成される空間部の
みを局所的に冷却することが可能となり,当該空間部を
通じてラックの熱負荷を低減させることが可能になる。
さらに局所冷却装置は,ラック列とは構造的に分離独立
して配置されているので,室内機及びラック列の配置の
自由度が向上し,例えば既設の施設においてラックを交
換する場合にも,迅速に対応することが可能である。ま
た局所冷却装置の周囲は開放空間であるため,機器室に
設ける室内機とラックの換気風量とをバランスさせる必
要がなく。室内機及びラックに設ける送風機の風量変更
の自由度も高い。したがって例えば局所冷却装置に設け
る送風機が故障しても,空間部の静圧が変化しないの
で,ラック換気量の変化は殆どなく,ラックに対する冷
却性能の低下が少ない。またラック列が機器室の一部だ
け,又は時期をずらして順次増設されるような場合に
も,増設されたラック列に対応して局所冷却装置も増設
していけばよいため,初期投資額の低減を図ることも出
来る。さらに,ラック列相互間に形成される空間部の上
方に局所冷却装置を設置したので,格別床占有面積の増
大をもたらさない。さらにまた局所冷却装置の周囲は開
放空間であるため,局所冷却装置のメンテナンス性も良
好である。
In this way, the hot air in the air outlet and the upper space of the equipment chamber, which is structurally separated from the rack row and is structurally separated from the rack row, is taken in only above the space formed between the rack rows. By arranging a local cooling device having a suction port for this, racks can be freely exchanged and moved, and only the space formed between the rack rows can be locally cooled. It is possible to reduce the heat load on the rack through the space.
Furthermore, since the local cooling device is structurally separated and arranged independently from the rack row, the degree of freedom in arranging the indoor unit and the rack row is improved. For example, even when the rack is replaced in an existing facility, It is possible to respond promptly. Also, since the area around the local cooling device is an open space, there is no need to balance the ventilation air volume of the rack with the indoor unit installed in the equipment room. There is a high degree of freedom in changing the air volume of the blowers installed in the indoor units and racks. Therefore, for example, even if the blower provided in the local cooling device fails, the static pressure in the space does not change, so that the rack ventilation amount hardly changes and the cooling performance of the rack is not significantly deteriorated. In addition, even if only a part of the equipment room is installed in the rack row, or if the rack rows are added sequentially in a staggered manner, it is sufficient to add local cooling devices corresponding to the added rack rows. Can be reduced. Furthermore, since the local cooling device is installed above the space formed between the rows of racks, there is no increase in the area occupied by the floor. Furthermore, since the surrounding area of the local cooling device is an open space, the maintainability of the local cooling device is good.

【0013】なお,本明細書でいう通信・情報処理機器
室とは,前記した通信・情報処理機器が設置されている
部屋だけを言うのではなく,発熱量が高く,且つ高密度
に発熱機器が設置されている部屋もその対象としてい
る。したがって,電算機室であってもよい。また通信・
情報処理機器とは,サーバーをはじめとして各種のコン
ピュータ装置,通信機器,演算処理器もこれに含まれ
る。
The communication / information processing equipment room referred to in the present specification does not mean only the room in which the above-mentioned communication / information processing equipment is installed. The room where is installed is also the target. Therefore, it may be a computer room. Also communication
The information processing equipment includes various computer devices such as servers, communication equipment, and arithmetic processing units.

【0014】前記ラック列間に形成される空間部の上方
のみに,局所冷却装置を配置する場合は非常に大きい発
熱密度の部屋に対応できるが,それよりもいくぶん小さ
な発熱密度の部屋では,前記通路空間部の上方にのみ
に,局所冷却装置を設置することで,ラック冷却を効率
よく行うことができる。つまり,ラック列が複数ある場
合,各ラック列相互間に形成される空間部の全てに局所
冷却装置を設置するのではなく,1つおきの空間部,つ
まり通路空間部の上方にのみ局所冷却装置を設置するこ
とで,全てのラック列のラック熱負荷を処理することが
可能となる。
When the local cooling device is arranged only above the space formed between the rack rows, a room having a very large heat generation density can be dealt with, but in a room having a heat generation density somewhat smaller than that, By installing the local cooling device only above the passage space, rack cooling can be performed efficiently. In other words, when there are a plurality of rack rows, the local cooling device is not installed in all the space portions formed between the rack rows, but only every other space portion, that is, above the passage space portion, is locally cooled. By installing the equipment, it is possible to handle the rack heat load of all rack rows.

【0015】前記ラックは,請求項1の場合には各ラッ
ク列相互間に形成される空間部に面した部分に開口部を
有し,請求項2の場合には通路空間部に面した部分にの
み開口部を有し,さらにラック上部にはラック内雰囲気
をラック外に排気するための送風機が設けられているこ
とが望ましい。前記送風機の運転により,空間部又は通
路空間部に給気されている局所冷却装置の空調空気を積
極的に開口部からラック内に取り入れることができ,ラ
ック内に搭載されている通信・情報処理機器などの排熱
処理をさらに効果的に実施することが出来る。このよう
な構造のラックを用いる場合には,二重床が無い部屋に
おいてもラック内に搭載されている通信・情報処理機器
などの排熱処理を効果的に実施することが可能である。
したがって,二重床設置のための費用を削減することが
でき,又二重床が無い既設の機器室の改修も容易に行う
ことができる。
In the case of claim 1, the rack has an opening in a portion facing the space formed between the rack rows, and in the case of claim 2, the rack facing the passage space. It is desirable to have an opening only at the top and to provide a blower at the top of the rack to exhaust the atmosphere inside the rack to the outside of the rack. By operating the blower, the conditioned air of the local cooling device that is supplied to the space portion or the passage space portion can be positively taken into the rack from the opening, and the communication / information processing installed in the rack Exhaust heat treatment of equipment and the like can be carried out more effectively. When a rack having such a structure is used, it is possible to effectively carry out heat treatment for exhausting heat from communication / information processing equipment installed in the rack even in a room without a double floor.
Therefore, the cost for installing the double floor can be reduced, and the existing equipment room without the double floor can be easily repaired.

【0016】ラック上部に送風機がなくても,例えばラ
ックに搭載されている通信・情報処理機器は固有の送風
機を有しかつ各当該送風機による給排気方向が,前記ラ
ックに搭載されている各通信・情報処理機器間で揃って
いる構成であってもよい。この場合は,サーバー等の通
信・情報処理機器に装備されているそのような固有の送
風機(通常は小型の送風機が一般的である)の稼働のみ
で,空間部や通路空間部から空調空気をラック内に取り
入れ,排気することができる。これによって当該通信・
情報処理機器の排熱処理を実施することも可能である。
Even if there is no blower at the top of the rack, for example, the communication / information processing device mounted on the rack has its own blower, and the direction of air supply / exhaust by each blower is related to each communication mounted on the rack. -It may be a configuration in which the information processing devices are arranged. In this case, the operation of such a unique blower (usually a small blower is generally used) installed in the communication / information processing equipment such as the server is used to supply the conditioned air from the space portion or the passage space portion. Can be taken into the rack and exhausted. This communication
It is also possible to carry out waste heat treatment of the information processing equipment.

【0017】かかる作用に鑑みれば,各通信・情報処理
機器が装備している送風機による給排気方向は,例えば
各通信・情報処理機器の特定の側面に揃ってかかる送風
機が設けられるなどして,前記ラックに搭載されている
各通信・情報処理機器間で揃っていることが好ましい。
In view of the above operation, the air blowers installed in the communication / information processing devices are arranged such that the air blowers are arranged in a specific side face of each communication / information processing device. It is preferable that all the communication / information processing devices mounted on the rack are prepared.

【0018】前記ラックが床下チャンバを構成する二重
床上に設置されている場合,前記ラック列相互間に形成
される空間部の下面には,前記床下チャンバに通ずる開
口部が形成され,さらに既述したように,前記ラック上
部にラック内雰囲気をラック外に排気するための送風機
が設けられていたり,各通信・情報処理機器が装備して
いる送風機による給排気方向が揃っていることが好まし
い。この場合,床下チャンバ内の静圧は機器室内の静圧
よりも高くなっている必要があり,床下チャンバ内には
局所冷却装置以外の空調装置によって空調空気が供給さ
れている。したがって,前記床下チャンバに通ずる開口
部では空調空気が二重床内から機器室内へ吹き出され
る。前記各ラック列相互間に形成される空間部のうち,
上部空間に局所冷却装置が設置されている空間部又は通
路空間部では,局所冷却装置から吹き出された空調空気
と床面開口部から吹き出された空調空気が混合され,ラ
ック側面に形成された開口部より吸いこまれ,ラック内
部に積層された機器の冷却を行った後に,ラック上部の
送風機や通信機器等が有する送風機により排気される。
また,上部空間に局所冷却装置が設置されていない空間
部では床開口部から吹き出された空調空気は室内雰囲気
の空調用として用いられる。そしてそのように二重床に
ラックが設置され,ラック列間に形成される空間部やラ
ック下面に,床下チャンバに通ずる開口が形成されてい
ると,ラックの側面からラック内に空調空気を導入でき
る。通信機器等はラック内の棚,スロットに水平に搭載
されているから,側面から導入することで,直接各通信
機器等冷却することができ,効率がよい。
When the rack is installed on a double floor that constitutes an underfloor chamber, an opening communicating with the underfloor chamber is formed on the lower surface of the space formed between the rows of racks. As described above, it is preferable that a blower for exhausting the atmosphere in the rack to the outside of the rack is provided at the upper part of the rack, or that the blower provided in each communication / information processing device has the same air supply / exhaust direction. . In this case, the static pressure in the underfloor chamber needs to be higher than the static pressure in the equipment room, and conditioned air is supplied to the underfloor chamber by an air conditioner other than the local cooling device. Therefore, the conditioned air is blown out of the double floor into the equipment room at the opening communicating with the underfloor chamber. Of the space formed between the rack rows,
In the space or passage space where the local cooling device is installed in the upper space, the conditioned air blown out from the local cooling device and the conditioned air blown out from the floor opening are mixed, and the opening formed on the side of the rack is mixed. After being sucked in from the section and cooling the equipment stacked inside the rack, it is exhausted by the blower in the upper part of the rack or the blower of the communication equipment.
In the space where the local cooling device is not installed in the upper space, the conditioned air blown out from the floor opening is used for air conditioning the indoor atmosphere. When the racks are installed on the double floor and the openings leading to the underfloor chambers are formed in the space formed between the rows of racks and the underside of the racks, conditioned air is introduced into the rack from the side of the rack. it can. Since the communication devices are mounted horizontally on the racks and slots in the rack, they can be cooled directly by introducing them from the side, which is efficient.

【0019】前記床下チャンバに通ずる開口部には,当
該開口部を通過する空気量を調整するための空気量調整
機構を設けることが好ましい。空気量調整機構は,例え
ば床パネル毎に調整が可能で,床開口部からの空調空気
の吹出し量や吹出しパターンを任意に変更することがで
きる。したがって上部空間に局所冷却装置が設置されて
いる空間部や通路空間部では,空調空気の混合パターン
や気流形状を任意に変更することが可能となる。空気量
調整機構としては,例えば開口部の開口率を段階的にあ
るいは連続的に変化させることができるシャッタが挙げ
られる。
It is preferable that the opening communicating with the underfloor chamber is provided with an air amount adjusting mechanism for adjusting the amount of air passing through the opening. The air amount adjusting mechanism can be adjusted for each floor panel, for example, and the amount and the pattern of the conditioned air blown out from the floor opening can be arbitrarily changed. Therefore, in the space portion where the local cooling device is installed in the upper space and the passage space portion, it is possible to arbitrarily change the mixing pattern and the air flow shape of the conditioned air. As the air amount adjusting mechanism, for example, a shutter that can change the aperture ratio of the opening portion stepwise or continuously can be used.

【0020】前記ラック上部にラック内雰囲気をラック
外に排気するための送風機を複数台設置した場合,排気
の温度を設置温度以下にするために,これらの送風機を
例えば台数制御装置等によって,運転台数制御すること
で,機器の発熱が少ないラックでの余分な空気搬送エネ
ルギを低減することができる。
When a plurality of air blowers for exhausting the atmosphere inside the rack to the outside of the rack are installed on the upper part of the rack, these air blowers are operated by, for example, a unit number control device in order to keep the temperature of the exhaust gas below the installation temperature. By controlling the number of units, it is possible to reduce excess air-carrying energy in a rack where the heat generation of equipment is low.

【0021】前記局所冷却装置は,各局所冷却装置毎に
下部のラック列間に形成される空間部又は通路空間部の
温度に基づいて各局所冷却装置の冷却能力を制御するよ
うにすれば,効率的で且つ適切なラック列間に形成され
る空間部又は通路空間部の空調を実施して,ラックの排
熱処理を行うことができる。また,発熱密度が高いエリ
アにおいては,局所冷却装置の冷却能力を部分的に増大
させるような運転が可能であるため発熱負荷の空間的な
ばらつきにも対応可能である。また,局所冷却装置の一
部が故障して停止した場合にも,局所冷却装置の冷却能
力を部分的に増大させるような運転を行うことにより,
ラック列間に形成される空間部や通路空間部の温度上昇
を抑制することが可能となる。
If the local cooling device controls the cooling capacity of each local cooling device based on the temperature of the space or passage space formed between the lower rack rows for each local cooling device, It is possible to efficiently perform the air conditioning of the space portion or the passage space portion formed between the rack rows and perform the exhaust heat treatment of the rack. Further, in an area where the heat generation density is high, it is possible to operate so as to partially increase the cooling capacity of the local cooling device, so that it is possible to cope with spatial variations in the heat generation load. In addition, even if a part of the local cooling device fails and stops, by performing an operation that partially increases the cooling capacity of the local cooling device,
It is possible to suppress the temperature rise of the space portion and the passage space portion formed between the rack rows.

【0022】前記局所冷却装置は,冷却手段として直膨
コイルを有し,さらに当該直膨コイルの冷媒蒸発温度
を,処理空気の露点温度よりも高く制御するようにすれ
ば,結露水が発生することがなく,ラック等に搭載され
る通信・情報処理機器等に水漏れなどによって不測の事
態を与えることを防止できる。この場合,必要に応じて
機器室内の雰囲気が設定露点温度と一致するように,外
気を減湿処理して室内に供給する外気調和機や,室内空
気の露点温度が外気調和機の故障などで設定値を上回っ
た場合に設定値にまで減湿するための減湿装置を設ける
ことで,そのようないわゆる渇きコイル運転制御が容易
に行える。
The local cooling device has a direct expansion coil as a cooling means, and if the refrigerant evaporation temperature of the direct expansion coil is controlled to be higher than the dew point temperature of the treated air, condensed water is generated. In this way, it is possible to prevent unforeseen circumstances from being caused by water leaks etc. to the communication / information processing equipment mounted on the rack or the like. In this case, if necessary, the outside air conditioner that dehumidifies the outside air to supply it indoors so that the atmosphere inside the equipment room matches the set dew point temperature, or the dew point temperature of the indoor air may be a failure of the outside air conditioner. Such a so-called thirst coil operation control can be easily performed by providing a dehumidifying device for dehumidifying to a set value when the set value is exceeded.

【0023】また本発明が提案する空調方法によれば,
前記した専用の減湿装置を設けることなく,いわゆる渇
きコイル運転制御が容易に行えるすなわち,前記通信・
情報処理機器室等内に空調空気を供給する空調装置を別
途複数台有し,これらの空調装置は,直膨式の冷却コイ
ルを内蔵するものとし,前記空調装置のうちの一部の空
調装置の冷媒蒸発温度の制御目標値は,他の空調装置の
冷媒蒸発温度の制御目標値よりも低く設定し,室内空気
の露点温度が高くなってきた場合には,優先的に前記一
部の空調装置の冷却コイルを結露させるようにしてもよ
い。これによって専用の減湿装置を設けることなく,室
内空気の露点温度を変更することができ,局所冷却装置
や他の空調装置の渇きコイル運転制御が容易に行える
According to the air conditioning method proposed by the present invention,
The so-called thirst coil operation control can be easily performed without providing the above-mentioned dedicated dehumidifier, that is, the communication /
A plurality of air conditioners for supplying air-conditioned air are separately provided in the information processing equipment room, etc., and these air conditioners have a built-in direct expansion type cooling coil. The control target value of the refrigerant evaporation temperature of is set lower than the control target value of the refrigerant evaporation temperature of the other air conditioner, and when the dew point temperature of the indoor air becomes higher, the part of the air conditioning is given priority. The cooling coil of the device may be condensed. This makes it possible to change the dew point temperature of indoor air without installing a dedicated dehumidifier, and to easily control the operation of the thirst coil of the local cooling device and other air conditioners.

【0024】この場合,例えば前記一部の空調装置の冷
媒蒸発温度の設定値を,他の空調装置の冷媒蒸発温度の
設定値よりも低い範囲内で変更することにより,室内空
気の露点温度を変更してもよい。また前記一部の空調装
置は,室内空気の露点温度が設定値を下回った時以外
は,室内温度に拘わらず連続して運転を行うようにして
もよい。この時他の空調装置は,室内温度が設定値に近
づくと冷却能力の調整を行い,顕熱負荷に見合った運転
を行うことで,空調システム全体として冷却能力の調整
が図られる。
In this case, for example, the dew point temperature of the room air is changed by changing the set value of the refrigerant evaporation temperature of the one part of the air conditioners within a range lower than the set value of the refrigerant evaporation temperature of the other air conditioners. You may change it. Further, some of the air conditioners may be continuously operated regardless of the room temperature except when the dew point temperature of the room air is lower than the set value. At this time, the other air conditioners adjust the cooling capacity when the room temperature approaches the set value, and operate in accordance with the sensible heat load to adjust the cooling capacity of the entire air conditioning system.

【0025】このような空調方法は,顕熱負荷が潜熱負
荷に比べて著しく大きい通信機器湿・電算機室に特に適
している。なお,顕熱負荷がさらに小さくなった場合に
は,空調装置の冷媒蒸発温度は徐々に低下し,これに伴
い室内空気の露点温度も低下する。そして,室内空気温
度と露点温度の双方が設定値を下回ったときに,前記一
部の空調装置停止するように運転を行うことで,余分な
減湿や冷却によるエネルギー消費を無くすことができ
る。
Such an air-conditioning method is particularly suitable for a communication equipment humidity / computer room in which the sensible heat load is significantly larger than the latent heat load. When the sensible heat load is further reduced, the refrigerant evaporation temperature of the air conditioner gradually decreases, and the dew point temperature of the indoor air also decreases accordingly. Then, when both the indoor air temperature and the dew point temperature are lower than the set values, the operation is performed so that the part of the air conditioners is stopped, so that it is possible to eliminate energy consumption due to excessive dehumidification and cooling.

【0026】[0026]

【発明の実施の形態】以下に,本発明の好ましい実施の
形態を図面に基いて説明する。図1は第1の実施の形態
にかかる空調システムを有する通信・情報処理機器室な
どの機器室R内の様子の概要を示している。この図示の
例では,室内に通信・情報処理機器を搭載したラックL
の列が4列設置されており,ラック列A〜B間およびラ
ック列C〜D間は各々通路空間部Xを形成している。な
お,ラック列B〜C間はラック列間に形成された空間部
Yを形成している。
BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an outline of a state in an equipment room R such as a communication / information processing equipment room having an air conditioning system according to the first embodiment. In the illustrated example, a rack L in which communication / information processing equipment is mounted indoors
4 are installed, and a passage space X is formed between the rack rows A and B and between the rack rows C and D. A space Y formed between the rack rows B to C is formed.

【0027】この種の通信・情報処理機器室で,従来か
ら使用されているラックLは前面と背面に保守,点検用
の開閉自在な扉(図示せず)が設けられており,各ラッ
クLの寸法は同じ列内では同一となっている場合が多
い。また,このラックLに搭載されるサーバ等の機器
は,ラックL内に設けられているレール(図示せず)上
に固定され,多段に積層されている。
A rack L that has been conventionally used in a communication / information processing equipment room of this type is provided with a freely openable / closable door (not shown) for maintenance and inspection on the front and back sides. Often the dimensions are the same in the same row. Devices such as servers mounted on the rack L are fixed on rails (not shown) provided in the rack L and are stacked in multiple stages.

【0028】また,本実施の形態では,ラック列1列毎
に各ラックLの前面又は背面同士が向かい合う形をとっ
ているが,このように通路空間部XにラックLの前面同
士が向かい合うように設置することが望ましい。この様
な通路空間部Xは,通常900mm程度の幅を有してい
る。各ラックLの天板部には,ラックL内の雰囲気をラ
ック外に排気するための送風機1が設置されている。
Further, in the present embodiment, the front surface or the back surface of each rack L is opposed to each other in each row of racks, but the front surfaces of the racks L are opposed to each other in the passage space X in this way. It is desirable to install in Such a passage space portion X usually has a width of about 900 mm. A blower 1 for exhausting the atmosphere inside the rack L to the outside of the rack is installed on the top plate portion of each rack L.

【0029】ラックL自体は図2に示したように,サー
バーなど各種通信・情報処理機器等の機器2を内部に収
納するためのケーシング3を有しており,このケーシン
グ3の通路空間部Xに面した側面には,各々開口部4が
形成されている。開口部4はパンチングメタルの孔であ
ってもよく,あるいはスリット等で形成してもよい。当
該側面に開閉扉がある場合には,開閉扉自体をパンチン
グメタルで形成したり,開閉扉にスリットを設けるよう
にして,開口部4を創出してもよい。
As shown in FIG. 2, the rack L itself has a casing 3 for accommodating various communication / information processing equipment 2 such as a server, and the passage space X of the casing 3 Openings 4 are formed on the side surfaces facing each other. The opening 4 may be a hole of punching metal, or may be formed by a slit or the like. When there is an opening / closing door on the side surface, the opening / closing door itself may be formed of punching metal, or the opening / closing door may be provided with a slit to create the opening 4.

【0030】図3にも示すように,機器室Rは二重床構
造を有しており,床面Fの下には床下チャンバ11が形
成されている。各ラックLは床面Fの上に設置されてお
り,ラックL下部の床面Fには床下チャンバ11に通ず
る開口12が設けられている。さらに,床面Fのラック
設置部以外の場所にも,必要に応じて床下チャンバ11
に通ずる開口13,14が設けられている。
As shown in FIG. 3, the equipment room R has a double floor structure, and an underfloor chamber 11 is formed below the floor surface F. Each rack L is installed on the floor surface F, and the floor surface F below the rack L is provided with an opening 12 communicating with the underfloor chamber 11. Further, if necessary, the underfloor chamber 11 may be placed in a place other than the rack installation section on the floor surface F as well.
There are openings 13 and 14 communicating with each other.

【0031】床面Fの各開口12,13,14には開口
率を任意に変更することが可能な空気量調整機構,例え
ばシャッター等が設置されており,より多くの冷却空気
が必要なラック付近には重点的に空調空気を供給するこ
とが出来るようになっている。またかかる開口率の調整
により,通路空間部X内の気流形状の調整ができ,全て
のラックLに一様に空調空気を供給することが可能とな
っている。
Each of the openings 12, 13, 14 on the floor F is provided with an air amount adjusting mechanism capable of arbitrarily changing the opening ratio, for example, a shutter or the like, and a rack that requires more cooling air. Air-conditioned air can be supplied to nearby areas. Further, by adjusting the opening ratio, it is possible to adjust the shape of the air flow in the passage space portion X, and it is possible to uniformly supply the conditioned air to all the racks L.

【0032】各通路空間部Xの上方には,ラック列とは
構造的に分離して,局所冷却装置21が複数台設置され
ている。局所冷却装置21は,下部の床面Fと対向した
吹出し口22及び機器室Rの上部空間の高温空気を取り
入れるための吸込口23と,送風機24を有しており,
低温の空調空気を下部の通路空間部Xに供給し,且つラ
ックLから排気された高温空気を吸込み,処理してい
る。局所冷却装置21の設置台数は通路空間部Xに面し
たラックLの発熱密度の大きさによって決められる。
A plurality of local cooling devices 21 are installed above each passage space X, structurally separated from the rack row. The local cooling device 21 has an outlet 22 facing the lower floor surface F, an inlet 23 for taking in high temperature air in the upper space of the equipment room R, and a blower 24.
The low-temperature conditioned air is supplied to the lower passage space X, and the high-temperature air exhausted from the rack L is sucked and processed. The number of the local cooling devices 21 installed is determined by the heat generation density of the rack L facing the passage space portion X.

【0033】局所冷却装置21は,例えば室Rの天井部
25から吊下されて,ラック列とは構造的に分離して設
置される。従って局所冷却装置21の周囲は開放空間と
なっている。これに限らず,例えばラックLとは独立し
て床面Fから立設した支柱や架台上に局所冷却装置21
を設置してもよい。
The local cooling device 21 is hung from the ceiling 25 of the room R, for example, and is structurally separated from the rack row. Therefore, the area around the local cooling device 21 is an open space. Not limited to this, for example, a local cooling device 21 is installed on a support or a stand that is erected from the floor F independently of the rack L.
May be installed.

【0034】局所冷却装置21は,冷却コイル26を有
している。冷却コイル26は,直膨型の冷却コイルであ
り,図2に示すように機器室Rの外部に設置されている
室外機27との間を冷媒配管28で接続されている。冷
媒は,冷媒流量を調節するための電子膨張弁29を通過
して,冷却コイル26に供給されるようになっている。
冷媒配管28は,例えば機器室R内の上部を通ってお
り,1台の室外機27に対して数台の局所冷却装置21
を接続することが可能である。なお室外機27は空冷,
水冷いずれのタイプも使用できる。
The local cooling device 21 has a cooling coil 26. The cooling coil 26 is a direct expansion type cooling coil, and is connected to an outdoor unit 27 installed outside the equipment room R by a refrigerant pipe 28 as shown in FIG. The refrigerant passes through an electronic expansion valve 29 for adjusting the refrigerant flow rate and is supplied to the cooling coil 26.
The refrigerant pipe 28 passes through, for example, the upper part in the equipment room R, and several local cooling devices 21 are provided for one outdoor unit 27.
It is possible to connect. The outdoor unit 27 is air-cooled,
Both types of water cooling can be used.

【0035】局所冷却装置21は,各々に下部の通路空
間部Xの温度を検出するための温度センサ(図示せ
ず),および冷媒蒸発温度を検出するための温度センサ
(図示せず)を有しており,これらの信号処理や電子膨
張弁29の開度調節を行わせるためのコントローラ・電
源ボックス(図示せず)を有している。さらに各局所冷
却装置21全体の運転を制御・監視したり,圧縮機の運
転容量を決定するためのコントローラ(図示せず)は室
外機27に装備されている。
Each of the local cooling devices 21 has a temperature sensor (not shown) for detecting the temperature of the lower passage space X and a temperature sensor (not shown) for detecting the refrigerant evaporation temperature. It also has a controller / power supply box (not shown) for controlling these signals and adjusting the opening of the electronic expansion valve 29. Further, the outdoor unit 27 is equipped with a controller (not shown) for controlling and monitoring the operation of each local cooling device 21 as a whole and for determining the operating capacity of the compressor.

【0036】室外機27及び各局所循環装置21のコン
トローラ同士は,逐次データのやり取りを行うことによ
り,安定した運転制御を行っている。この時,冷却コイ
ル26の冷媒蒸発温度は,機器室R内の室内露点温度よ
りも高く制御されており,通常は乾きコイルとして運転
されるようになっている。また,局所冷却装置21の筐
体底板は,少なくとも冷却コイル26の直下において
は,防水パンを兼用しており,万一結露により結露水が
発生した場合にはこの底板内に溜まり,下部のラックL
内の機器2に結露水がかからないように配慮されてい
る。さらに結露水が前記底板内に溜まり,一定量を超え
ると結露センサ(図示せず)により警報および強制運
転,電子膨張弁29の強制閉や室外機27の圧縮機の停
止などを行うようにコントローラのプログラムに組み込
まれている。
The outdoor unit 27 and the controllers of the local circulation devices 21 perform stable operation control by sequentially exchanging data. At this time, the refrigerant evaporation temperature of the cooling coil 26 is controlled to be higher than the room dew point temperature in the equipment room R, and normally, it is operated as a dry coil. In addition, the housing bottom plate of the local cooling device 21 also serves as a waterproof pan at least immediately below the cooling coil 26, and should dew condensation occur due to dew condensation, it will be collected in this bottom plate and the lower rack. L
Care is taken to prevent condensation water from splashing on the equipment 2 inside. Further, when dew condensation water collects in the bottom plate and exceeds a certain amount, a dew condensation sensor (not shown) performs an alarm and a forced operation, a forced closing of the electronic expansion valve 29, a stop of the compressor of the outdoor unit 27, and the like. Built into the program.

【0037】そのような局所冷却装置21の乾きコイル
運転を確実に行わせるために,機器室R内には,外気処
理ユニット31が設置されている。この外気処理ユニッ
ト31は,例えば冷却コイル32と送風機33を備えて
おり,導入外気OAを湿度調整した後に,機器室R内に
供給するように構成されている。
In order to reliably perform such dry coil operation of the local cooling device 21, an outside air processing unit 31 is installed in the equipment room R. The outside air processing unit 31 includes, for example, a cooling coil 32 and a blower 33, and is configured to supply the introduced outside air OA into the equipment room R after humidity adjustment.

【0038】機器室R内には,さらにパッケージエアコ
ン34が設置されている。このパッケージエアコン34
は,従来の全顕熱処理型パッケージエアコンであり,直
膨コイル35,送風機36を備え,室外機37とは冷媒
配管38によって結ばれている。そして床下チャンバ1
1内に,例えば15℃〜20℃程度の空調空気を供給し
ている。パッケージエアコン34は,機器室Rの壁面に
配置されており,通路空間部X以外の空調や,通路空間
部Xの冷却の補助的役割を果たしている。
In the equipment room R, a package air conditioner 34 is further installed. This package air conditioner 34
Is a conventional all sensible heat treatment type package air conditioner, which includes a direct expansion coil 35 and a blower 36, and is connected to an outdoor unit 37 by a refrigerant pipe 38. And the underfloor chamber 1
For example, conditioned air having a temperature of about 15 ° C. to 20 ° C. is supplied to the inside of the unit 1. The packaged air conditioner 34 is disposed on the wall surface of the equipment room R, and plays an auxiliary role for air conditioning other than the passage space portion X and for cooling the passage space portion X.

【0039】本実施の形態にかかる空調システムは,以
上のように構成されており,各ラックLからの排熱は,
ラックL上部の送風機1によってラックLの上方へ排出
され,機器室R内上部の空気と共に,局所冷却装置21
の吸込口23から吸い込まれて,冷却コイル26によっ
て冷却処理される。冷却処理された空気,例えば18℃
の冷却空気は,送風機24によって,各通路空間部Xの
床面Fに向けて吹き出される。
The air conditioning system according to the present embodiment is configured as described above, and the exhaust heat from each rack L is
The blower 1 on the upper part of the rack L discharges the upper part of the rack L and, together with the air on the upper part of the equipment room R, the local cooling device 21.
Is sucked in through the suction port 23 and cooled by the cooling coil 26. Cooled air, eg 18 ° C
The cooling air is blown out toward the floor surface F of each passage space portion X by the blower 24.

【0040】前記冷却空気は,ラックLの前面に設けら
れている開口部4からラックL内に導入され機器2の排
熱を処理する。一方床下チャンバ11内には,パッケー
ジエアコン34からの空調空気,例えば15℃〜20℃
の空気が吹き出されており,当該空調空気はラックLの
底部の開口12を通じてラックL内に流れ込み,機器2
の排熱を処理する。また床下チャンバ11からの空調空
気は,通路空間部Xの床面Fに設けた開口14からも通
路空間部Xに吹き出されており,ラックLの前面に設け
られている開口部4からラックL内に導入され機器2の
排熱を処理している。したがってラックL内部の機器2
の冷却効果は,従来よりも各段に向上している。この場
合の床下チャンバ11内の静圧は機器室R内の静圧より
高くなっている。
The cooling air is introduced into the rack L through the opening 4 provided on the front surface of the rack L to process the exhaust heat of the equipment 2. On the other hand, in the underfloor chamber 11, conditioned air from the package air conditioner 34, for example, 15 ° C. to 20 ° C.
Air is blown out, and the conditioned air flows into the rack L through the opening 12 at the bottom of the rack L, and the equipment 2
To handle the exhaust heat. The conditioned air from the underfloor chamber 11 is also blown to the passage space X from the opening 14 provided on the floor F of the passage space X, and the rack L is opened from the opening 4 provided at the front of the rack L. It is introduced into the inside to treat the exhaust heat of the device 2. Therefore, the device 2 inside the rack L
The cooling effect of is improved at each stage compared to the conventional one. The static pressure in the underfloor chamber 11 in this case is higher than the static pressure in the equipment room R.

【0041】また図3は,床下チャンバ11の静圧が機
器室R内の静圧よりも低くなった場合を示しているが,
これは全ラックLの送風機1の総排気量が増大し,全顕
熱処理型のパッケージエアコン34の総送風量を超えた
場合に起こる。この場合は床下チャンバ11へ通ずる床
面の開口13,14での空気の流れは,機器室R内から
床下チャンバ11へ向かう。通路空間部Xの空調空気は
ラックLの側面に設けられた開口部4からラックL内へ
吸いこまれる空気の流れと,床面の開口14から床下チ
ャンバ11へ一度吸いこまれたあと,再びラックLの底
部の開口12よりラックL内へ吸い込まれる空気の流れ
がある。この場合は,通路空間部Xの床面Fの開口14
の面積や開口率を大きくすることで,より局所的な空気
の循環を形成することができるため空気の混合ロスが少
なくなる。
Further, FIG. 3 shows a case where the static pressure in the underfloor chamber 11 becomes lower than the static pressure in the equipment room R.
This occurs when the total exhaust amount of the blowers 1 of all the racks L is increased and exceeds the total blow amount of all the sensible heat treatment type package air conditioners 34. In this case, the air flow in the openings 13, 14 on the floor that communicates with the underfloor chamber 11 is directed from the inside of the equipment room R to the underfloor chamber 11. The conditioned air in the passage space portion X is sucked into the rack L from the opening 4 provided on the side surface of the rack L, and once sucked into the underfloor chamber 11 from the opening 14 on the floor surface, and then the rack L is again sucked. There is a flow of air sucked into the rack L through the opening 12 at the bottom of the. In this case, the opening 14 on the floor surface F of the passage space portion X
By increasing the area and the aperture ratio, it is possible to form more local air circulation, and thus the air mixing loss is reduced.

【0042】さらに本実施の形態では,機器室R内に外
気処理ユニット31が設置されているので,局所冷却装
置21の乾きコイル運転を確実に行わせることが可能と
なっており,結露の発生が極力抑えられている。
Further, in the present embodiment, since the outside air processing unit 31 is installed in the equipment room R, the dry coil operation of the local cooling device 21 can be surely performed, and dew condensation occurs. Is suppressed as much as possible.

【0043】そして本実施の形態では,局所冷却装置2
1は,各ラック列とは構造的に分離して設置されている
ために,既設の施設への追加工事などでは,施工性の面
でも優れている。また機器室Rの一部エリアのラックL
の発熱量が多くなったような場合には,発熱量が多くな
ったエリアにのみ局所冷却装置21を設置すればよく,
発熱負荷の偏在に対しても対応が可能である。かかる場
合も工事が簡単である。また局所冷却装置21自体の保
守を行う際にも,局所冷却装置21の周囲は開放空間で
あるから,作業性も良好である。
In the present embodiment, the local cooling device 2
1 is structurally separated from each rack row, so it is also excellent in workability when it is added to an existing facility. In addition, a rack L in a part of the equipment room R
If the amount of heat generated by the device is increased, the local cooling device 21 may be installed only in the area where the amount of generated heat is increased.
It is possible to deal with uneven distribution of heat load. Even in such a case, the construction is easy. Further, even when the local cooling device 21 itself is maintained, workability is good because the surrounding area of the local cooling device 21 is an open space.

【0044】図4は通路空間部Xでの局所冷却装置21
の温度制御方法と,気流形状の調整例を示し,ある通路
空間部X内の様子を示している。この例では,各局所冷
却装置21a〜21eは,ラック列に沿って等間隔に設
置されている。そしてその下部の通路空間部X内の温度
を温度センサTで検出し,設定温度に近づくように冷却
能力を調整されるように制御装置(図示せず)によって
制御が行なわれている。例えば,1台の局所冷却装置2
1bが故障した場合には,その周囲の通路空間部Xの温
度も上昇するが,故障した局所冷却装置21bに隣接す
る他の局所冷却装置21aや局所冷却装置21cの冷却
能力を増加させることで,通路空間部Xの温度上昇は僅
かなものとなる。またこの例では,通路空間部Xにおけ
る床面Fの開口14の吹出し位置を,平面からみて,ち
ょうど各局所冷却装置21間の位置に配置しており,局
所冷却装置21a〜21eからの空調空気の供給量が比
較的少ないエリアの空調空気量を補うことができる。ま
た局所冷却装置21a〜21eの送風機24の稼働台数
の制御を行うことで,ラックLからの排気の温度調整を
実施するようにしてもよい。例えば負荷が少ない場合に
は,より実際的に対処することができる。
FIG. 4 shows the local cooling device 21 in the passage space portion X.
The temperature control method and the example of adjusting the air flow shape are shown, and the inside of a certain passage space portion X is shown. In this example, the local cooling devices 21a to 21e are installed at equal intervals along the rack row. Then, the temperature inside the passage space portion X below that is detected by the temperature sensor T, and control is performed by a control device (not shown) so that the cooling capacity is adjusted so as to approach the set temperature. For example, one local cooling device 2
When 1b fails, the temperature of the passage space X around it also rises, but by increasing the cooling capacity of other local cooling devices 21a and 21c adjacent to the failed local cooling device 21b. The temperature rise in the passage space portion X is slight. Further, in this example, the blowout position of the opening 14 of the floor surface F in the passage space portion X is arranged exactly between the local cooling devices 21 when viewed from the plane, and the conditioned air from the local cooling devices 21a to 21e is arranged. It is possible to supplement the conditioned air amount in an area where the supply amount of the The temperature of exhaust gas from the rack L may be adjusted by controlling the operating number of the blowers 24 of the local cooling devices 21a to 21e. For example, when the load is low, it can be dealt with more practically.

【0045】図5は,外調機31以外に,潜熱処理用パ
ッケージエアコン41を設置した例を示している。通
常,取り入れ外気OAは,外調機31で湿度調整を行い
機器室Rへ供給される。局所冷却装置21の乾きコイル
運転を行うためには室内露点温度制御が重要であるが,
万一外調機31が故障,又は性能低下した場合に備え
て,潜熱処理用パッケージエアコン41が少数台設置さ
れている。
FIG. 5 shows an example in which a package air conditioner 41 for latent heat treatment is installed in addition to the external air conditioner 31. Normally, the intake outside air OA is supplied to the equipment room R after the humidity is adjusted by the outside air conditioner 31. In order to perform the dry coil operation of the local cooling device 21, indoor dew point temperature control is important,
A small number of package air conditioners 41 for latent heat treatment are installed in case the external air conditioner 31 fails or its performance deteriorates.

【0046】潜熱処理用パッケージエアコン41の冷却
コイルでの冷媒蒸発温度Tを,局所冷却装置21の冷
媒蒸発温度Tよりも低く,且つ設定露点温度Tより
も高くする(T>T>T)ことにより,外調機3
1の異常時の湿度調整を可能としている。また潜熱処理
用パッケージエアコン41の台数は,例えば発熱密度1
000W/m,外気取り入れ量が機器室Rの換気回数
で毎時0.5回程度の場合には,部屋全体の冷却能力の
5%程度の容量の潜熱処理用パッケージエアコン41を
設置すればよく,図示するように壁面に設置されている
全顕熱処理型パッケージエアコン35の一部を入れ替え
て潜熱処理用パッケージエアコン41を設置すればよ
い。
The refrigerant evaporation temperature T S in the cooling coil of the latent heat treatment package air conditioner 41 is set lower than the refrigerant evaporation temperature T E of the local cooling device 21 and higher than the set dew point temperature T R (T E > T). by S> T R) that, outside conditioning equipment 3
It is possible to adjust the humidity in case of abnormality 1. The number of package air conditioners 41 for latent heat treatment is, for example, 1
If the external air intake rate is 000 W / m 2 and the ventilation rate of the equipment room R is about 0.5 times per hour, it is sufficient to install the latent heat treatment package air conditioner 41 having a capacity of about 5% of the cooling capacity of the entire room. As shown, the latent heat treatment package air conditioner 41 may be installed by replacing a part of the entire sensible heat treatment type package air conditioner 35 installed on the wall surface.

【0047】以上の例では,ラックLが設置されている
床は二重床であったが,本発明は,図6に示したよう
に,二重床が無い室に対しても適用可能である。この場
合には,パッケージエアコン34は,外調機31と同
様,上部吹出し,下部吸い込みの構成とする。かかる二
重床が無い室に本発明を適用することで,冷却能力増強
にも対応が可能である。したがって,既設の機器室に対
して本発明は容易に対処することが可能である。
In the above example, the floor on which the rack L is installed is a double floor, but the present invention can be applied to a room without a double floor as shown in FIG. is there. In this case, the packaged air conditioner 34, like the external air conditioner 31, is configured to blow out from the upper portion and suck into the lower portion. By applying the present invention to a room without such a double floor, it is possible to cope with an increase in cooling capacity. Therefore, the present invention can easily cope with the existing equipment room.

【0048】また以上の例では,局所冷却装置21の乾
きコイル運転を確実に行わせるために,機器室R内に
は,外気処理ユニット31と共に潜熱処理用パッケージ
エアコン41を設置していたが,そのような減湿用の外
気処理ユニット31を設置することなく,図7に示した
ように,パッケージエアコン34のうちの一部のパッケ
ージエアコン34aの運転制御を変えることによって,
かかる乾きコイル運転を実施して局所冷却装置21の冷
却コイルの結露を防止するようにしてもよい。
In the above example, in order to ensure the dry coil operation of the local cooling device 21, the package air conditioner 41 for latent heat treatment is installed in the equipment room R together with the outside air processing unit 31. By changing the operation control of a part of the package air conditioners 34a, as shown in FIG. 7, without installing such an outside air processing unit 31 for dehumidification,
The dry coil operation may be performed to prevent dew condensation on the cooling coil of the local cooling device 21.

【0049】すなわち,パッケージエアコン34aの冷
媒蒸発温度の制御目標値を,他のパッケージエアコン3
4の冷媒蒸発温度の制御目標値よりも低く設定してお
り,機器室R内の湿分を優先的にパッケージエアコン3
4aの冷却コイルで結露させるようにしている。これに
よって,機器室R内の露点温度の上昇は抑えられ,さら
に冷媒蒸発温度がほぼ一定の値で制御されているため,
減湿量が過多になり露点温度が設定値よりも下がること
もない。
That is, the control target value of the refrigerant evaporation temperature of the package air conditioner 34a is set to the other package air conditioner 3
4 is set to be lower than the control target value of the refrigerant evaporation temperature, and the moisture in the equipment room R is given priority to the package air conditioner 3
The cooling coil 4a is used for dew condensation. As a result, the rise in the dew point temperature in the equipment room R is suppressed, and the refrigerant evaporation temperature is controlled at a substantially constant value.
The dehumidifying temperature will not drop below the set value due to excessive dehumidification.

【0050】またこれらの空調機の運転方法の他の例と
しては,例えばパッケージエアコン34の処理風量を少
なくすることにより,減湿用のパッケージエアコンとし
て用いることが可能である。つまり同じ冷却コイルの仕
様でも処理風量を少なくすることにより,パッケージエ
アコン34よりも冷媒蒸発温度を低く維持しやすくでき
るため,本発明の実施においては好ましい運転状態とな
る。またパッケージエアコン34aに,風量可変機能と
冷媒蒸発温度の制御目標値の変更機能を持たせること
で,ハードウェア的には同一の空調機を用いることがで
きるため,空調負荷条件(顕熱負荷と潜熱負荷の割合)
に応じて各パッケージエアコン34を顕熱処理型あるい
は減湿用に随時変更が可能となり,フレキシビリティも
高くなる。
As another example of the operating method of these air conditioners, it is possible to use the package air conditioner 34 as a package air conditioner for dehumidification by reducing the amount of treated air. That is, even if the specifications of the cooling coil are the same, it is possible to easily maintain the refrigerant evaporation temperature lower than that of the packaged air conditioner 34 by reducing the processing air volume, which is a preferable operating state in the practice of the present invention. Further, since the packaged air conditioner 34a is provided with the air volume changing function and the function of changing the control target value of the refrigerant evaporation temperature, the same air conditioner can be used in terms of hardware, so that the air conditioning load condition (sensible heat load and sensible heat load Ratio of latent heat load)
Accordingly, the package air conditioner 34 can be changed to a sensible heat treatment type or dehumidifying type at any time, and flexibility is enhanced.

【0051】また1台の室内機に複数台の室内機が接続
するタイプの高顕熱処理型パッケージエアコン(マルチ
タイプ)では,前記した処理風量の変更の他に運転する
室内機の台数を少なくすることで,冷媒蒸発温度を低く
維持しやすくすることもできる。
In addition, in the high visible heat treatment type package air conditioner (multi-type) of the type in which a plurality of indoor units are connected to one indoor unit, the number of operating indoor units should be reduced in addition to the above-mentioned change of the processing air volume. Thus, it is possible to easily keep the refrigerant evaporation temperature low.

【0052】図8は,あるパッケージエアコンの吸込み
空気温度に対応する冷却コイル表面温度を冷媒蒸発温度
毎に試算した例を示す。冷却コイルの表面温度は,主と
して冷媒蒸発温度・処理空気温度・冷却コイル内外の熱
伝達率で決定される。なお,冷却コイル外側の熱伝達率
は,冷却コイルの通過風速によって変化する。冷却コイ
ルの表面温度は伝熱抵抗を無視すると,式(1)で表さ
れる。 t=tin+hout/(hin+hout)×(Tout−tin) …(1) ここで, t:冷却コイル表面温度[℃] tin :低温流体(冷媒)の平均温度[℃] Tout:高温流体(空気)の平均温度[℃] hin :管外基準に換算した管内表面熱伝達率[kW
/(mK)] hout:管外表面熱伝達率[kW/(mK)]
FIG. 8 shows an example in which the cooling coil surface temperature corresponding to the intake air temperature of a certain package air conditioner is calculated for each refrigerant evaporation temperature. The surface temperature of the cooling coil is mainly determined by the refrigerant evaporation temperature, the process air temperature, and the heat transfer coefficient inside and outside the cooling coil. The heat transfer coefficient outside the cooling coil changes depending on the air velocity passing through the cooling coil. The surface temperature of the cooling coil is expressed by equation (1), ignoring the heat transfer resistance. t w = t in + h out / (h in + h out) × (T out -t in) ... (1) where, t w: cooling coil surface temperature [℃] t in: average temperature of the cryogen (coolant) [° C.] T out : Average temperature of high temperature fluid (air) [° C.] h in : Surface heat transfer coefficient in tube [kW] converted to outside standard
/ (M 2 K)] h out : Outer surface heat transfer coefficient [kW / (m 2 K)]

【0053】例えば,処理空気温度(吸込み空気温度)
が27℃の条件で減湿用パッケージエアコン34aの冷
媒蒸発温度を6℃で運転した場合には,冷却コイル表面
温度は12℃になる。通過空気は冷却コイル表面で冷却
されて露点温度が12℃程度になるまで減湿される。し
たがって,他のパッケージエアコン34においても同様
な試算を行い,冷媒蒸発温度の制御目標値を,冷却コイ
ル表面温度が12℃よりも高くなるように設定すれば,
常に乾きコイルで運転することができる。また,パッケ
ージエアコン34aの冷媒蒸発温度を任意に変更するこ
とで,室内空気の露点温度を変化させることも可能であ
る。
For example, processing air temperature (suction air temperature)
When the refrigerant vaporization temperature of the dehumidifying package air conditioner 34a is operated at 6 ° C. under the condition of 27 ° C., the cooling coil surface temperature becomes 12 ° C. The passing air is cooled on the surface of the cooling coil and dehumidified until the dew point temperature reaches about 12 ° C. Therefore, if the same trial calculation is performed for the other packaged air conditioners 34 and the control target value of the refrigerant evaporation temperature is set so that the cooling coil surface temperature is higher than 12 ° C.,
It can always be operated with a dry coil. Also, the dew point temperature of the room air can be changed by arbitrarily changing the refrigerant evaporation temperature of the packaged air conditioner 34a.

【0054】その他,減湿用の一部のパッケージエアコ
ン34aを,室内空気の露点温度が設定値を下回った時
以外は,室内温度に拘わらず連続して運転を行うように
したり,室内空気の露点温度が設定値を下回り,且つ室
内空気の温度が設定値を下回った時のみに運転を停止す
るようにしてもよい。
In addition, some of the packaged air conditioners 34a for dehumidification can be continuously operated regardless of the indoor temperature or the indoor air can be operated except when the dew point temperature of the indoor air is lower than the set value. The operation may be stopped only when the dew point temperature is below the set value and the temperature of the room air is below the set value.

【0055】なお前記実施の形態で使用した局所冷却装
置は,両側に吸込口23を有し,かつ冷却コイル26
も,当該吸込口23と同じ方向で垂直に設けられていた
構成であったが,本発明で適用できる局所冷却装置は,
かかる構成に限られるものではない。例えば吸込口,吹
出口とも床面に対面した方向に向けられ,かつ吸込口,
吹出口とも空間部や通路空間部の長手方向に沿って並ん
で配置され,また冷却コイルも局所冷却装置内のチャン
バ内に,吸込口から吹出口へと流れる気流の方向と直角
に配置されているタイプのものももちろん使用できる。
この場合,送風機もシロッコファンを用いることができ
る。かかる構成の局所冷却装置では,冷却コイルの下部
に設置するドレンパンが設置しやすいという面もある。
The local cooling device used in the above embodiment has the suction ports 23 on both sides and has the cooling coil 26.
Also, although the structure was provided vertically in the same direction as the suction port 23, the local cooling device applicable in the present invention is
The configuration is not limited to this. For example, both the inlet and outlet are oriented in the direction facing the floor, and the inlet,
The air outlets are arranged side by side along the longitudinal direction of the space and passage space, and the cooling coil is also placed in the chamber of the local cooling device at a right angle to the direction of the air flow from the suction port to the air outlet. Of course, the existing type can also be used.
In this case, a sirocco fan can also be used as the blower. In the local cooling device having such a configuration, it is easy to install the drain pan installed under the cooling coil.

【0056】[0056]

【発明の効果】本発明によれば,通信・情報処理機器か
らの高密度の排熱がある施設において,省スペース・省
エネルギの下で適切な排熱処理を実施することができ
る。しかも保守等の作業が容易である。また本発明の空
調方法によれば,かかつ施設において空調機器の簡単な
機能追加と運転方法の工夫により,低コスト・高フレキ
シビリティな湿度制御を容易に実施することが可能とな
る。
According to the present invention, appropriate waste heat treatment can be carried out in a facility having high density waste heat from communication / information processing equipment while saving space and energy. Moreover, maintenance work is easy. Further, according to the air conditioning method of the present invention, it is possible to easily implement low-cost and high-flexibility humidity control in the facility by simply adding the function of the air conditioning equipment and devising the operation method.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施の形態にかかる空調システムが適
用された機器室の概略を示す説明図である。
FIG. 1 is an explanatory diagram showing an outline of an equipment room to which an air conditioning system according to an embodiment of the present invention is applied.

【図2】図1の実施の形態にかかる空調システムにおい
て,ラック内に空調空気を取り入れるときの様子を示す
説明図である。
FIG. 2 is an explanatory diagram showing a state when conditioned air is taken into a rack in the air conditioning system according to the embodiment of FIG.

【図3】図1の実施の形態にかかる空調システムにおい
て,床下チャンバの静圧が機器室内の静圧よりも低くな
った場合の,空気の流れを示す説明図である。
FIG. 3 is an explanatory diagram showing an air flow when the static pressure in the underfloor chamber becomes lower than the static pressure in the equipment chamber in the air conditioning system according to the embodiment in FIG. 1.

【図4】本発明において運転制御の一例を説明するため
の通路空間部内の様子を示す側面図である。
FIG. 4 is a side view showing a state in the passage space portion for explaining an example of operation control in the present invention.

【図5】本発明の他の実施の形態にかかる空調システム
が適用された機器室の概略を示す説明図である。
FIG. 5 is an explanatory diagram showing an outline of an equipment room to which an air conditioning system according to another embodiment of the present invention is applied.

【図6】本発明を二重床のない機器室に適用した例を示
す説明図である。
FIG. 6 is an explanatory diagram showing an example in which the present invention is applied to an equipment room without a double floor.

【図7】本発明の別の実施の形態にかかる空調システム
が適用された機器室の概略を示す説明図である。
FIG. 7 is an explanatory diagram showing an outline of an equipment room to which an air conditioning system according to another embodiment of the present invention is applied.

【図8】処理空気の乾球温度と冷却コイル表面温度との
関係を示すグラフである。
FIG. 8 is a graph showing a relationship between a dry-bulb temperature of treated air and a cooling coil surface temperature.

【図9】従来技術の説明図である。FIG. 9 is an explanatory diagram of a conventional technique.

【図10】一般的な通信・情報処理機器室の概要を示す
斜視図である。
FIG. 10 is a perspective view showing an outline of a general communication / information processing equipment room.

【符号の説明】[Explanation of symbols]

1 送風機 2 機器 4 開口部 11 床下チャンバ 12,13,14 開口 21 局所冷却装置 22 吹出口 23 吸込口 26 冷却コイル 27 室外機 31 外気処理ユニット 34 パッケージエアコン A,B,C,D ラック列 F 床面 L ラック R 機器室 X 通路空間部 Y 空間部 1 blower 2 equipment 4 openings 11 Underfloor chamber 12, 13, 14 openings 21 Local cooling system 22 Outlet 23 Suction port 26 cooling coil 27 outdoor unit 31 Outdoor air treatment unit 34 Package Air Conditioner A, B, C, D rack row F floor L rack R equipment room X passage space Y space section

Claims (17)

【特許請求の範囲】[Claims] 【請求項1】 通信・情報処理機器を上下方向に搭載し
たラックが整列してラック列をなし,当該ラック列が複
数設置されている通信・情報処理機器室等を空調するシ
ステムであって,前記ラック列間に形成される空間部の
上方に,当該空間部を冷却するための局所冷却装置が,
前記ラック列とは構造的に分離して配置され,前記局所
冷却装置は,前記通信・情報処理機器室の床面と対向す
るように設けられた吹出口と,当該通信・情報処理機器
室内の上部空間の空気を取り入れるための吸込口を有し
ていることを特徴とする,通信・情報処理機器室等の空
調システム。
1. A system for air-conditioning a communication / information processing equipment room or the like in which racks having communication / information processing equipment mounted vertically are aligned to form a rack row, and a plurality of such rack rows are installed. Above the space formed between the rack rows, a local cooling device for cooling the space is provided.
The local cooling device is structurally separated from the row of racks, and the local cooling device is provided in an outlet provided so as to face the floor of the communication / information processing equipment room, and in the communication / information processing equipment room. An air conditioning system for a communication / information processing equipment room or the like, which has a suction port for taking in air from the upper space.
【請求項2】 前記ラック相互列間に形成される空間部
のうち,対面する2つのラック列毎に形成される空間部
を通路空間部とし,当該通路空間部の上方にのみ前記局
所冷却装置が配置されていることを特徴とする,請求項
1に記載の通信・情報処理機器室等の空調システム。
2. The local cooling device is provided only above the passage space portion, among the space portions formed between the rack mutual rows, a space portion formed for every two facing rack rows. The air-conditioning system for a communication / information processing equipment room or the like according to claim 1, wherein
【請求項3】 前記ラックは,空間部に面した部分に開
口部を有し,さらに前記ラック上部には,ラック内雰囲
気をラック外に排気するための送風機が設けられている
ことを特徴とする,請求項1に記載の通信・情報処理機
器室等の空調システム。
3. The rack has an opening at a portion facing the space, and a blower for exhausting an atmosphere inside the rack to the outside of the rack is provided at an upper portion of the rack. An air conditioning system for a communication / information processing equipment room according to claim 1.
【請求項4】 前記ラックは,通路空間部に面した部分
に開口部を有し,さらに前記ラック上部には,ラック内
雰囲気をラック外に排気するための送風機が設けられて
いることを特徴とする,請求項2に記載の通信・情報処
理機器室等の空調システム。
4. The rack has an opening at a portion facing a passage space, and a blower for exhausting an atmosphere inside the rack to the outside of the rack is provided at an upper portion of the rack. An air conditioning system for a communication / information processing equipment room according to claim 2.
【請求項5】 前記ラックは,空間部に面した部分に開
口部を有し,さらに当該ラックに搭載されている通信・
情報処理機器は固有の送風機を有しかつ各当該送風機に
よる給排気方向は,前記ラックに搭載されている各通信
・情報処理機器間で揃っていることを特徴とする,請求
項1に記載の通信・情報処理機器室等の空調システム。
5. The communication rack mounted on the rack has an opening at a portion facing the space.
The information processing device has its own blower, and the air supply / exhaust direction by each blower is the same for each communication / information processing device mounted on the rack. Air conditioning system for communication / information processing equipment rooms, etc.
【請求項6】 前記ラックは,通路空間部に面した部分
に開口部を有し,さらに当該ラックに搭載されている通
信・情報処理機器は固有の送風機を有しかつ各当該送風
機による給排気方向は,前記ラックに搭載されている各
通信・情報処理機器間で揃っていることを特徴とする,
請求項2に記載の通信・情報処理機器室等の空調システ
ム。
6. The rack has an opening at a portion facing the passage space, and the communication / information processing equipment mounted on the rack has its own blower, and air supply and exhaust by each blower are provided. The direction is the same for each communication / information processing device mounted on the rack.
An air conditioning system for a communication / information processing equipment room according to claim 2.
【請求項7】 前記ラックは床下チャンバを構成する二
重床上に設置されるとともに,ラック列間に形成される
空間部における床面には前記床下チャンバに通ずる開口
が形成されていることを特徴とする,請求項1,2,
3,4,5又は6のいずれかに記載の通信・情報処理機
器室等の空調システム。
7. The rack is installed on a double floor constituting an underfloor chamber, and an opening communicating with the underfloor chamber is formed on a floor surface in a space formed between rows of racks. Claims 1, 2,
An air conditioning system for a communication / information processing equipment room or the like according to any one of 3, 4, 5 and 6.
【請求項8】 前記ラックの下面と対面する床面には,
前記床下チャンバに通ずる開口が形成されていることを
特徴とする,請求項7に記載の通信・情報処理機器室等
の空調システム。
8. The floor surface facing the lower surface of the rack,
The air-conditioning system for a communication / information processing equipment room according to claim 7, wherein an opening communicating with the underfloor chamber is formed.
【請求項9】 前記床下チャンバに通ずる開口に,当該
開口を通過する空気量を調整するための空気量調整機構
を有することを特徴とする,請求項7又は8のいずれか
に記載の通信・情報処理機器室等の空調システム。
9. The communication according to claim 7, wherein the opening communicating with the underfloor chamber has an air amount adjusting mechanism for adjusting the amount of air passing through the opening. Air conditioning systems for information processing equipment rooms, etc.
【請求項10】 前記ラック上部のラック内雰囲気をラ
ック外に排気するための送風機が複数台設置され,当該
排気の温度を設定温度以下にするために,前記送風機は
台数制御されていることを特徴とする,請求項3,4,
5,6,7,8又は9のいずれかに記載の通信・情報処
理機器室等の空調システム。
10. A plurality of blowers are installed for exhausting the atmosphere in the rack above the rack to the outside of the rack, and the number of the blowers is controlled in order to keep the temperature of the exhaust below a set temperature. Claims 3, 4, characterized
An air conditioning system for a communication / information processing equipment room or the like according to any one of 5, 6, 7, 8 and 9.
【請求項11】 各局所冷却装置毎に下部のラック列相
互間に形成される空間部の温度の測定結果に基づいて,
各局所冷却装置の冷却能力が制御されていることを特徴
とする,請求項1,2,3,4,5,6,7,8,9又
は10のいずれかに記載の通信・情報処理機器室等の空
調システム。
11. Based on the measurement results of the temperature of the space formed between the lower rack rows for each local cooling device,
The communication / information processing device according to any one of claims 1, 2, 3, 4, 5, 6, 7, 8, 9 or 10, wherein the cooling capacity of each local cooling device is controlled. Air conditioning system for rooms.
【請求項12】 前記局所冷却装置は,冷却手段として
直膨コイルを有し,さらに前記直膨コイルの冷媒蒸発温
度が処理空気の露点温度よりも高く制御されていること
を特徴とする,請求項1,2,3,4,5,6,7,
8,9,10又は11のいずれかに記載の通信・情報処
理機器室等の空調システム。
12. The local cooling device has a direct expansion coil as a cooling means, and the refrigerant evaporation temperature of the direct expansion coil is controlled to be higher than the dew point temperature of the treated air. Items 1, 2, 3, 4, 5, 6, 7,
8. An air conditioning system for a communication / information processing equipment room or the like according to any one of 8, 9, 10 and 11.
【請求項13】 前記通信・情報処理機器室等内の雰囲
気の湿度を調整するための空調装置を別途有しているこ
とを特徴とする,請求項12に記載の通信・情報処理機
器室等の空調システム。
13. The communication / information processing equipment room or the like according to claim 12, further comprising an air conditioner for adjusting the humidity of the atmosphere in the communication / information processing equipment room or the like. Air conditioning system.
【請求項14】 請求項1,2,3,4,5,6,7,
8,9,10,11又は12のいずれかに記載の通信・
情報処理機器室等の空調システムを用いて行う空調方法
であって,前記通信・情報処理機器室等内に空調空気を
供給する空調装置を別途複数台有し,これらの空調装置
はいずれも直膨式の冷却コイルを内蔵するものであり,
前記空調装置のうちの一部の空調装置の冷媒蒸発温度の
制御目標値は,他の空調装置の冷媒蒸発温度の制御目標
値よりも低く設定され,室内空気の露点温度が高くなっ
てきた場合には,優先的に前記一部の空調装置の方の冷
却コイルを結露させることを特徴とする,空調方法。
14. Claims 1, 2, 3, 4, 5, 6, 7,
The communication according to any one of 8, 9, 10, 11 or 12
An air conditioning method using an air conditioning system for an information processing equipment room or the like, wherein a plurality of air conditioning devices for supplying air conditioning air are separately provided in the communication / information processing equipment room, etc. It has a built-in inflatable cooling coil,
When the control target value of the refrigerant evaporation temperature of some of the air conditioners is set lower than the control target value of the refrigerant evaporation temperature of other air conditioners, and the dew point temperature of the room air becomes high. In the air conditioning method, the cooling coil of one of the air conditioners is preferentially condensed.
【請求項15】 前記一部の空調装置の冷媒蒸発温度の
設定値を,他の空調装置の冷媒蒸発温度の設定値よりも
低い範囲内で変更することにより,室内空気の露点温度
を変更することを特徴とする,請求項14に記載の空調
方法。
15. The dew point temperature of indoor air is changed by changing the set value of the refrigerant evaporation temperature of the part of the air conditioners within a range lower than the set value of the refrigerant evaporation temperature of the other air conditioners. The air conditioning method according to claim 14, characterized in that
【請求項16】 前記一部の空調装置は,室内空気の露
点温度が設定値を下回った時以外は,室内温度に拘わら
ず連続して運転を行うことを特徴とする,請求項14又
は15に記載の空調方法。
16. The part of the air conditioner is continuously operated regardless of the room temperature except when the dew point temperature of the room air is lower than a set value. Air conditioning method described in.
【請求項17】 前記一部の空調装置は,室内空気の露
点温度が設定値を下回り,且つ室内空気の温度が設定値
を下回った時のみに運転を停止することを特徴とする,
請求項14,15又は16のいずれかに記載の空調方
法。
17. The part of the air conditioner is stopped only when the dew point temperature of the room air is lower than a set value and the temperature of the room air is lower than the set value.
The air conditioning method according to claim 14, 15, or 16.
JP2001367430A 2001-11-30 2001-11-30 Air conditioning systems for communication / information processing equipment rooms, etc. Expired - Fee Related JP3842631B2 (en)

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Application Number Priority Date Filing Date Title
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