JP2009188174A - Screen printing method and screen printing system - Google Patents

Screen printing method and screen printing system Download PDF

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JP2009188174A
JP2009188174A JP2008026383A JP2008026383A JP2009188174A JP 2009188174 A JP2009188174 A JP 2009188174A JP 2008026383 A JP2008026383 A JP 2008026383A JP 2008026383 A JP2008026383 A JP 2008026383A JP 2009188174 A JP2009188174 A JP 2009188174A
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substrate
screen
pallet
mask
substrates
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JP4925347B2 (en
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Takeshi Kondo
毅 近藤
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Fuji Corp
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Fuji Machine Manufacturing Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent a print defective substrate from being produced owing to a position shift of a substrate on a palette by a system which positions one screen mask above a plurality of substrates mounted on the palette and screen-prints a predetermined pattern on the plurality of substrates together at a time. <P>SOLUTION: Mask position information regarding positions of printing apertures of the screen mask, mounted on a screen printer 14, corresponding to respective substrates is acquired through image recognition. Then a first component mounting machine 13 determines mounting positions of the respective substrates on the palette 11 based upon the mask position information to stick the respective substrates on the palette 11, and the palette 11 is conveyed to the screen printer 14 to screen-print the predetermined pattern on the plurality of substrates on the palette 11 together at a time. Then the palette 11 is conveyed to a second component mounting machine 15 and a third component mounting machine 16 in order to mount electronic-electric components on the respective substrates 22 on the palette 11 in order. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、パレット上に並べて搭載した複数の基板の上方に１枚のスクリーンマスクを位置させて前記複数の基板に一括して所定のパターンをスクリーン印刷するスクリーン印刷方法及びスクリーン印刷システムに関する発明である。   The present invention relates to a screen printing method and a screen printing system in which a single screen mask is positioned above a plurality of substrates mounted side by side on a pallet and a predetermined pattern is screen-printed collectively on the plurality of substrates. is there.

複数の基板に能率良くスクリーン印刷するために、例えば特許文献１（特開２００５−１４３２５号公報）に記載されているように、１枚のパレット（トレイ）上に複数の基板を並べて搭載し、このパレットをスクリーン印刷機に搬入して、パレット上の複数の基板の上方に１枚のスクリーンマスクを位置させて複数の基板に一括して所定のパターンをスクリーン印刷するようにしたものがある。更に、特許文献１には、パレット上に複数の基板を保持させる方法として、薄くて変形可能なフレキシブル基板の場合は、作業者が目視によってフレキシブル基板をパレットに位置決めして貼り付けることが記載され、また、通常のプリント基板等の場合は、その基板に形成した位置決め穴を、パレットに固定した位置決めピンに嵌合して位置決め保持することが記載されている。   In order to efficiently screen-print on a plurality of substrates, for example, as described in Patent Document 1 (Japanese Patent Application Laid-Open No. 2005-14325), a plurality of substrates are mounted side by side on one pallet (tray), Some pallets are carried into a screen printer, and one screen mask is positioned above a plurality of substrates on the pallet so that a predetermined pattern is screen-printed collectively on the plurality of substrates. Furthermore, in Patent Document 1, as a method for holding a plurality of substrates on a pallet, in the case of a flexible substrate that is thin and deformable, an operator visually positions and affixes the flexible substrate to the pallet. In the case of a normal printed circuit board or the like, it is described that a positioning hole formed in the board is fitted and positioned with a positioning pin fixed to the pallet.

しかし、基板の位置決め穴をパレットの位置決めピンに嵌合して位置決め保持する場合でも、位置決め穴や位置決めピンの製造ばらつきや両者の嵌合のためのクリアランスによって各基板の搭載位置に位置ずれが生じることは避けられない。また、作業者が目視によって基板をパレットに位置決めして貼り付ける場合は、位置決めピンによって機械的に位置決めする場合よりも、各基板の位置ずれが更に大きくなることは避けられない。このため、１枚のスクリーンマスクによって複数の基板に一括してスクリーン印刷する際に、パレット上の各基板の位置ずれによって、各基板のパターン印刷位置に位置ずれが生じて、印刷不良の基板を生産してしまう可能性がある。   However, even when the positioning holes of the board are fitted and held with the positioning pins of the pallet, the mounting positions of the boards are displaced due to the manufacturing variation of the positioning holes and positioning pins and the clearance for fitting them together. It is inevitable. Further, when the operator visually positions the substrates on the pallet and affixes them, it is inevitable that the positional deviation of each substrate will be larger than when mechanically positioning with the positioning pins. For this reason, when screen printing is performed on a plurality of substrates all at once with a single screen mask, the misalignment of each substrate on the pallet causes a misregistration at the pattern printing position of each substrate, and a defective substrate is printed. There is a possibility of producing.

そこで、特許文献１のスクリーン印刷機では、パレットと各基板にそれぞれ位置認識マークを形成し、パレットに搭載した各基板の位置認識マークとパレットの位置認識マークをそれぞれカメラで撮像して、その撮像画像を画像処理してパレット上の各基板の位置ずれ量を測定し、予め設定された許容値を越える位置ずれ量の基板を除外し、残りの基板の位置ずれ量の平均値を演算して、その位置ずれ量の平均値を用いてスクリーンマスクに対してパレットの位置を補正して、パレット上の複数の基板に一括してスクリーン印刷するようにしている。
特開２００５−１４３２５号公報（第２頁〜第５頁、図１、図２等参照） Therefore, in the screen printing machine of Patent Document 1, position recognition marks are formed on the pallet and each substrate, respectively, and the position recognition mark and the position recognition mark of each pallet mounted on the pallet are imaged by a camera, respectively. Image processing is performed to measure the amount of misalignment of each board on the pallet, excluding boards whose misalignment exceeds a preset tolerance, and calculating the average of the misalignment of the remaining boards The position of the pallet is corrected with respect to the screen mask using the average value of the positional deviation amounts, and screen printing is collectively performed on a plurality of substrates on the pallet.
Japanese Patent Laying-Open No. 2005-14325 (refer to pages 2 to 5, FIG. 1, FIG. 2, etc.)

しかしながら、上記特許文献１のスクリーン印刷機では、パレット上に位置ずれ量が許容値を越える基板が存在する場合に、位置ずれ量が許容値を越える基板も他の基板と一緒にスクリーン印刷されるため、位置ずれ量が許容値を越える基板がそのまま印刷不良基板になってしまい、印刷不良基板の生産を未然に防止できない。しかも、スクリーンマスクの製造ばらつきによるスクリーンマスクの印刷用開口部の位置ずれに起因する印刷位置のずれに対しては全く対応できない。   However, in the screen printing machine disclosed in Patent Document 1, when there is a substrate on the pallet where the amount of positional deviation exceeds the allowable value, the substrate whose positional deviation amount exceeds the allowable value is screen-printed together with other substrates. Therefore, a substrate whose positional deviation amount exceeds the allowable value becomes a defective print substrate as it is, and the production of the defective print substrate cannot be prevented beforehand. Moreover, it is impossible to cope with a printing position shift caused by a screen mask printing position shift due to a manufacturing variation of the screen mask.

本発明はこのような事情を考慮してなされたものであり、従ってその目的は、パレット上の基板の位置ずれやスクリーンマスクの印刷用開口部の位置ずれに起因する印刷不良基板の生産を未然に防止できるスクリーン印刷方法及びスクリーン印刷システムを提供することにある。   The present invention has been made in view of such circumstances, and therefore the object of the present invention is to prevent the production of defective print substrates due to the displacement of the substrate on the pallet and the displacement of the printing opening of the screen mask. Another object of the present invention is to provide a screen printing method and a screen printing system that can be prevented.

上記目的を達成するために、本発明は、パレット上に並べて搭載した複数の基板の上方に１枚のスクリーンマスクを位置させて前記複数の基板に一括して所定のパターンをスクリーン印刷する技術において、前記スクリーンマスクの各基板に対応する印刷用開口部の位置又はその位置を特定する位置情報（以下これらを「マスク位置情報」という）を実測又は入力するマスク位置情報取得工程（マスク位置情報取得手段）と、前記マスク位置情報に基づいて前記パレットに対する各基板の搭載位置を位置決めして各基板を前記パレットに粘着させる基板粘着工程（基板粘着手段）と、前記パレットに粘着した前記複数の基板の上方に前記スクリーンマスクを位置させて両者を位置合わせした状態で前記複数の基板に所定のパターンをスクリーン印刷する印刷工程とを実行するようにしたものである。   In order to achieve the above object, the present invention relates to a technique for screen printing a predetermined pattern collectively on a plurality of substrates by positioning one screen mask above a plurality of substrates mounted side by side on a pallet. A mask position information acquisition step (mask position information acquisition) for actually measuring or inputting the position of the printing opening corresponding to each substrate of the screen mask or position information for specifying the position (hereinafter referred to as “mask position information”) Means), a substrate adhering step (substrate adhering means) for adhering each substrate to the pallet by positioning the mounting position of each substrate on the pallet based on the mask position information, and the plurality of substrates adhering to the pallet With the screen mask positioned above the screen, a predetermined pattern is screened on the plurality of substrates in a state where both are aligned. It is obtained so as to perform a printing step of printing.

要するに、本発明では、スクリーンマスクの各基板に対応する印刷用開口部の位置に関するマスク位置情報を実測又は入力した後に、そのマスク位置情報に基づいてパレットに対する各基板の搭載位置を位置決めして各基板をパレットに粘着させるため、スクリーンマスクの製造ばらつきによるスクリーンマスクの印刷用開口部の位置ずれがあったとしても、実際に使用するスクリーンマスクの印刷用開口部の位置に合わせてパレットに対する各基板の搭載位置を位置決めして各基板をパレットに粘着させることができ、パレット上の各基板の位置とスクリーンマスクの印刷用開口部の位置との位置合わせ精度を高めることができる。これにより、パレット上の基板の位置ずれやスクリーンマスクの印刷用開口部の位置ずれに起因する印刷不良基板の生産を未然に防止することができる。   In short, in the present invention, after actually measuring or inputting the mask position information related to the position of the printing opening corresponding to each substrate of the screen mask, the mounting position of each substrate on the pallet is determined based on the mask position information. Since the substrate is adhered to the pallet, each substrate relative to the pallet is matched to the position of the printing opening of the screen mask that is actually used, even if there is a displacement of the printing opening of the screen mask due to manufacturing variations of the screen mask. The position of each of the substrates can be adhered to the pallet, and the alignment accuracy between the position of each substrate on the pallet and the position of the printing opening of the screen mask can be increased. As a result, it is possible to prevent the production of defective print substrates due to the displacement of the substrate on the pallet or the displacement of the printing opening of the screen mask.

この場合、マスク位置情報は、予め、作業者がスクリーンマスクの印刷用開口部の位置を実測して制御装置に入力するようにしても良いが、スクリーン印刷機に装備されたカメラでスクリーンマスクを撮像してその撮像画像を画像処理してマスク位置情報を実測するようにしても良い。このようにすれば、実際に使用するスクリーンマスクの撮像画像に基づいて精度の高いマスク位置情報を自動的に取得することができる。   In this case, the mask position information may be entered in advance by the operator by actually measuring the position of the screen mask printing opening, and entering the screen mask with a camera installed in the screen printer. The mask position information may be actually measured by imaging and processing the captured image. In this way, highly accurate mask position information can be automatically acquired based on the captured image of the screen mask that is actually used.

また、基板粘着工程で、部品実装機の吸着ノズルで基板を吸着してパレットに粘着させる作業を行うようにすると良い。このようにすれば、部品実装機に装備された吸着ノズルの位置決め機能を使用して基板をパレットの目標とする搭載位置に正確に粘着させることができる。   Further, in the substrate adhesion step, it is preferable to perform an operation of adsorbing the substrate by the adsorption nozzle of the component mounting machine and adhering it to the pallet. If it does in this way, the board | substrate can be correctly adhere | attached on the mounting position made into the target of a pallet using the positioning function of the suction nozzle with which the component mounting machine was equipped.

以下、本発明を実施するための最良の形態を具体化した２つの実施例１，２を説明する。   Hereinafter, two Examples 1 and 2, which embody the best mode for carrying out the present invention, will be described.

本発明の実施例１を図１乃至図３に基づいて説明する。
本実施例１のスクリーン印刷・実装システムは、図１に示すように、パレット１１を搬送する搬送経路１２に沿って、第１の部品実装機１３、スクリーン印刷機１４、第２の部品実装機１５、第３の部品実装機１６等を順番に配置し、これら各装置１３〜１６の制御部（図示せず）と生産管理コンピュータ１７との間で各種の制御信号やデータ信号を送受信することで、各装置１３〜１６の動作を制御するようにしている。 A first embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 1, the screen printing / mounting system according to the first embodiment includes a first component mounting machine 13, a screen printing machine 14, and a second component mounting machine along a conveyance path 12 that conveys the pallet 11. 15, the third component mounting machine 16 and the like are arranged in order, and various control signals and data signals are transmitted and received between the control units (not shown) of these devices 13 to 16 and the production management computer 17. Thus, the operations of the devices 13 to 16 are controlled.

第１の部品実装機１３は、吸着ノズル２１（図２参照）をＸ−Ｙ−Ｚ方向及びθ方向（水平回転方向）に駆動する機能を備え、吸着ノズル２１で基板２２を吸着して、後述するマスク位置情報に基づいてパレット１１に対して該基板２２を位置決めして粘着させる作業を繰り返して、パレット１１上に複数の基板２２を粘着させる。   The first component mounting machine 13 has a function of driving the suction nozzle 21 (see FIG. 2) in the XYZ direction and the θ direction (horizontal rotation direction). The operation of positioning and adhering the substrate 22 to the pallet 11 on the basis of mask position information described later is repeated to adhere a plurality of substrates 22 on the pallet 11.

この場合、基板２２は、プリント基板、セラミック基板、フレキシブル基板等、どのような材質の基板であっても良い。パレット１１の上面には、基板２２を着脱可能に粘着保持するための粘着層が形成されている。   In this case, the substrate 22 may be a substrate of any material such as a printed circuit board, a ceramic substrate, or a flexible substrate. An adhesive layer is formed on the top surface of the pallet 11 to hold the substrate 22 in a detachable manner.

また、基板２２には、複数（例えば２個）の位置認識マーク２３が形成され、第１の部品実装機１３に装備されたカメラ（図示せず）で、吸着ノズル２１に吸着した基板２２の位置認識マーク２３を撮像してその撮像画像を画像処理することで、吸着ノズル２１に対する基板２２の吸着位置のＸ−Ｙ方向及びθ方向のずれ量を認識して、吸着ノズル２１に吸着した基板２２をパレット１１に粘着する際に、吸着ノズル２１のＸ−Ｙ方向及びθ方向の動作量を基板２２の吸着位置のずれ量に応じて補正するようにしている。   In addition, a plurality of (for example, two) position recognition marks 23 are formed on the substrate 22, and the substrate 22 adsorbed to the adsorption nozzle 21 by a camera (not shown) installed in the first component mounter 13. By capturing the position recognition mark 23 and processing the captured image, the amount of displacement of the suction position of the substrate 22 relative to the suction nozzle 21 in the XY direction and the θ direction is recognized, and the substrate sucked by the suction nozzle 21 When adhering 22 to the pallet 11, the operation amount of the suction nozzle 21 in the X-Y direction and the θ direction is corrected in accordance with the shift amount of the suction position of the substrate 22.

尚、吸着ノズル２１に基板２２を吸着する前に、カメラで基板２２の位置認識マーク２３を撮像して基板２２の位置を認識して、常に基板２２の決められた一定の吸着位置（例えば中心位置）を正確に吸着ノズル２１で吸着できるように、吸着動作時に吸着ノズル２１のＸ−Ｙ方向及びθ方向の動作量を基板２２の位置認識結果に応じて補正するようにしても良い。   Before adsorbing the substrate 22 to the adsorption nozzle 21, the position recognition mark 23 of the substrate 22 is imaged with a camera to recognize the position of the substrate 22, and a fixed adsorption position (for example, the center) of the substrate 22 is always determined. The amount of movement of the suction nozzle 21 in the X-Y direction and θ direction may be corrected according to the position recognition result of the substrate 22 so that the suction nozzle 21 can suck the position accurately.

スクリーン印刷機１４は、パレット１１上に粘着した複数の基板２２の上方にスクリーンマスク２４（図３参照）を位置させて両者を位置合わせした状態で複数の基板２２にクリーム半田、導体ペースト等で所定のパターンをスクリーン印刷する。図３に示すように、スクリーンマスク２４には、複数の基板２２に所定のパターンをスクリーン印刷するための複数組の印刷用開口部２５が形成され、更に、このスクリーンマスク２４には、各組の印刷用開口部２５の位置（各基板２２の印刷位置）に対応してそれぞれ複数（例えば２個）の位置認識マーク２６が形成され、各組の印刷用開口部２５の位置（各基板２２の印刷位置）に対応する位置認識マーク２６をカメラ２７で撮像してその撮像画像を画像処理することで、各組の印刷用開口部２５の位置（各基板２２の印刷位置）を認識してそれらの位置情報であるマスク位置情報を取得するようにしている。尚、各組の印刷用開口部２５をカメラ２７で撮像して各組の印刷用開口部２５の位置（各基板２２の印刷位置）を画像認識するようにしても良い。   The screen printing machine 14 positions the screen mask 24 (see FIG. 3) above the plurality of substrates 22 adhered on the pallet 11 and aligns them with the solder paste, conductor paste, etc. A predetermined pattern is screen printed. As shown in FIG. 3, the screen mask 24 is formed with a plurality of sets of printing openings 25 for screen-printing a predetermined pattern on the plurality of substrates 22. A plurality of (for example, two) position recognition marks 26 are formed corresponding to the positions of the printing openings 25 (printing positions of the respective substrates 22), and the positions of the printing openings 25 of the respective sets (each of the substrates 22). The position recognition mark 26 corresponding to the printing position) is imaged by the camera 27 and the captured image is processed to recognize the position of each set of printing openings 25 (printing position of each substrate 22). The mask position information that is the position information is acquired. Alternatively, each set of printing openings 25 may be imaged with a camera 27 so that the position of each set of printing openings 25 (printing position of each substrate 22) is recognized as an image.

第２の部品実装機１５と第３の部品実装機１６は、吸着ノズル（図示せず）で電子・電気部品を吸着して、スクリーン印刷後の各基板２２の所定位置に該電子・電気部品を実装する。   The second component mounting machine 15 and the third component mounting machine 16 suck the electronic / electrical components with a suction nozzle (not shown), and place the electronic / electrical components on a predetermined position of each substrate 22 after screen printing. Is implemented.

以上のように構成したスクリーン印刷・実装システムでは、スクリーン印刷機１４のスクリーンマスク２４が取り替えられる毎に、そのスクリーンマスク２４の各組の印刷用開口部２５の位置（各基板２２の印刷位置）に対応する位置認識マーク２６をカメラ２７で撮像してその撮像画像を画像処理することで、各組の印刷用開口部２５の位置（各基板２２の印刷位置）を認識して、それらの位置情報であるマスク位置情報を取得する（マスク位置情報取得工程／マスク位置情報取得手段）。   In the screen printing / mounting system configured as described above, each time the screen mask 24 of the screen printer 14 is replaced, the position of each printing opening 25 of the screen mask 24 (printing position of each substrate 22). The position recognition mark 26 corresponding to the image is picked up by the camera 27 and the picked-up image is processed to recognize the positions of the printing openings 25 of each set (printing positions of the respective substrates 22). The mask position information that is information is acquired (mask position information acquisition step / mask position information acquisition means).

このマスク位置情報は、スクリーン印刷機１４の制御部から生産管理コンピュータ１７に送信され、更に、この生産管理コンピュータ１７から第１の部品実装機１３の制御部に送信される。尚、スクリーン印刷機１４の制御部からマスク位置情報を第１の部品実装機１３の制御部に直接送信するようにしても良い。   The mask position information is transmitted from the control unit of the screen printing machine 14 to the production management computer 17, and further transmitted from the production management computer 17 to the control unit of the first component mounting machine 13. The mask position information may be directly transmitted from the control unit of the screen printing machine 14 to the control unit of the first component mounting machine 13.

その後、第１の部品実装機１３に空のパレット１１を搬入して所定位置で停止させる。この後、第１の部品実装機１３の吸着ノズル２１に基板２２を吸着し、その基板２２の位置認識マーク２３をカメラで撮像してその撮像画像を画像処理することで、吸着ノズル２１に対する基板２２の吸着位置のＸ−Ｙ方向及びθ方向のずれ量を認識して、吸着ノズル２１に吸着した基板２２をパレット１１に粘着する際に、吸着ノズル２１のＸ−Ｙ方向及びθ方向の動作量を基板２２の吸着位置のずれ量に応じて補正した上で、該基板２２をパレット１１に粘着する。以上のような動作を繰り返して、マスク位置情報に基づいてパレット１１に対する各基板２２の搭載位置を位置決めして複数の基板２２をパレット１１に粘着させる（基板粘着工程／基板粘着手段）。   Thereafter, the empty pallet 11 is carried into the first component mounter 13 and stopped at a predetermined position. Thereafter, the substrate 22 is sucked to the suction nozzle 21 of the first component mounting machine 13, the position recognition mark 23 of the substrate 22 is picked up by a camera, and the picked-up image is image-processed, whereby the substrate for the suction nozzle 21 is processed. When the substrate 22 adsorbed by the adsorption nozzle 21 is adhered to the pallet 11 by recognizing the deviation amounts of the adsorption position of the adsorption nozzle 21 in the XY direction and θ direction, the operation of the adsorption nozzle 21 in the XY direction and θ direction is performed. The substrate 22 is adhered to the pallet 11 after the amount is corrected in accordance with the shift amount of the suction position of the substrate 22. The operation as described above is repeated to position the mounting positions of the respective substrates 22 on the pallet 11 based on the mask position information and to adhere the plurality of substrates 22 to the pallet 11 (substrate adhesion process / substrate adhesion means).

この際、パレット１１に基準位置認識マークを形成して、この基準位置認識マークの位置を画像認識して、この基準位置認識マークの位置を基準にしてパレット１１に対する各基板２２の搭載位置を位置決めするようにしても良い。パレット１１に基準位置認識マークが形成されていない場合は、最初にパレット１１に粘着した基板２２の位置認識マーク２３の位置を基準にして、２枚目以降の基板２２の搭載位置を位置決めするようにすれば良い。   At this time, a reference position recognition mark is formed on the pallet 11, the position of the reference position recognition mark is image-recognized, and the mounting position of each substrate 22 on the pallet 11 is positioned based on the position of the reference position recognition mark. You may make it do. When the reference position recognition mark is not formed on the pallet 11, the mounting position of the second and subsequent substrates 22 is positioned with reference to the position of the position recognition mark 23 of the substrate 22 adhered to the pallet 11 first. You can do it.

この後、基板２２が粘着されたパレット１１を、第１の部品実装機１３からスクリーン印刷機１４へ搬送して、該パレット１１をスクリーン印刷機１４内の印刷テーブル（図示せず）に保持させると共に、該パレット１１上の複数の基板２２の上方にスクリーンマスク２４を位置させた状態にする。この際、スクリーン印刷機１４のカメラ２７で、パレット１１上の各基板２２の位置認識マーク２３の中から例えば２つの位置認識マーク２３を撮像してスクリーンマスク２４の印刷用開口部２５に対するパレット１１上の基板２２の位置ずれ量を認識し、その位置ずれ量に応じて、該パレット１１を保持する印刷テーブルの位置をＸ−Ｙ方向及びθ方向に補正することで、スクリーンマスク２４の印刷用開口部２５に対してパレット１１上の基板２２を位置合わせした状態にする。   Thereafter, the pallet 11 to which the substrate 22 is adhered is conveyed from the first component mounting machine 13 to the screen printing machine 14, and the pallet 11 is held on a printing table (not shown) in the screen printing machine 14. At the same time, the screen mask 24 is positioned above the plurality of substrates 22 on the pallet 11. At this time, for example, two position recognition marks 23 are picked up from the position recognition marks 23 of each substrate 22 on the pallet 11 by the camera 27 of the screen printer 14, and the pallet 11 with respect to the printing opening 25 of the screen mask 24. For the printing of the screen mask 24 by recognizing the amount of positional deviation of the upper substrate 22 and correcting the position of the printing table holding the pallet 11 in the XY and θ directions according to the amount of positional deviation. The substrate 22 on the pallet 11 is aligned with the opening 25.

尚、パレット１１の基準位置認識マークの位置を基準にしてパレット１１に対する各基板２２の搭載位置が位置決めされている場合は、パレット１１の基準位置認識マークの位置を画像認識して、スクリーンマスク２４の印刷用開口部２５に対するパレット１１上の基板２２の位置ずれ量を認識するようにしても良い。   When the mounting position of each substrate 22 on the pallet 11 is positioned on the basis of the position of the reference position recognition mark on the pallet 11, the position of the reference position recognition mark on the pallet 11 is image-recognized, and the screen mask 24 The positional deviation amount of the substrate 22 on the pallet 11 with respect to the printing opening 25 may be recognized.

このようにして、スクリーンマスク２４の印刷用開口部２５に対してパレット１１上の基板２２を位置合わせした状態で、スクリーンマスク２４上でスキージ（図示せず）を移動させてパレット１１上の複数の基板２２に一括して所定のパターンをスクリーン印刷する。   In this way, a squeegee (not shown) is moved on the screen mask 24 in a state where the substrate 22 on the pallet 11 is aligned with the printing opening 25 of the screen mask 24, and a plurality of pallets 11 on the pallet 11 are moved. A predetermined pattern is screen-printed on the substrate 22 at once.

スクリーン印刷後、スクリーン印刷機１４から、パレット１１を第２の部品実装機１５、第３の部品実装機１６へ順次搬送し、各部品実装機１５，１６の吸着ノズルで電子・電気部品を吸着して、パレット１１上のスクリーン印刷後の各基板２２の所定位置に電子・電気部品を順次実装する。   After screen printing, the pallet 11 is sequentially transferred from the screen printer 14 to the second component mounter 15 and the third component mounter 16, and the electronic / electrical components are sucked by the suction nozzles of the component mounters 15 and 16. Then, electronic / electrical components are sequentially mounted at predetermined positions on each substrate 22 after screen printing on the pallet 11.

以上説明した本実施例１によれば、スクリーンマスク２４の各基板２２に対応する印刷用開口部２５の位置に関するマスク位置情報を画像認識により取得した後に、そのマスク位置情報に基づいてパレット１１に対する各基板２２の搭載位置を位置決めして各基板２２をパレット１１に粘着させるため、スクリーンマスク２４の製造ばらつきによるスクリーンマスク２４の印刷用開口部２５の位置ずれがあったとしても、実際に使用するスクリーンマスク２４の印刷用開口部２５の位置に合わせてパレット１１に対する各基板２２の搭載位置を位置決めして各基板２２をパレット１１に粘着させることができ、パレット１１上の各基板２２の位置とスクリーンマスク２４の印刷用開口部２５の位置との位置合わせ精度を高めることができる。これにより、パレット１１上の基板２２の位置ずれやスクリーンマスク２４の印刷用開口部２５の位置ずれに起因する印刷不良基板の生産を未然に防止することができる。   According to the first embodiment described above, after the mask position information related to the position of the printing opening 25 corresponding to each substrate 22 of the screen mask 24 is obtained by image recognition, the pallet 11 is selected based on the mask position information. Since the mounting position of each substrate 22 is positioned and each substrate 22 is adhered to the pallet 11, even if there is a positional deviation of the printing opening 25 of the screen mask 24 due to manufacturing variations of the screen mask 24, it is actually used. Each substrate 22 can be adhered to the pallet 11 by positioning the mounting position of each substrate 22 on the pallet 11 in accordance with the position of the printing opening 25 of the screen mask 24, and the position of each substrate 22 on the pallet 11. The alignment accuracy with the position of the printing opening 25 of the screen mask 24 can be increased. Thereby, it is possible to prevent the production of a printed defective substrate due to the positional deviation of the substrate 22 on the pallet 11 and the positional deviation of the printing opening 25 of the screen mask 24.

この場合、マスク位置情報は、予め、作業者がスクリーンマスク２４の印刷用開口部２５の位置を実測して生産管理コンピュータ１７（又は第１の部品実装機１３の制御部）に入力するようにしても良いが、本実施例１のように、スクリーン印刷機１４に装備されたカメラ２７でスクリーンマスク２４を撮像してその撮像画像を画像処理してマスク位置情報を実測するようにすれば、実際に使用するスクリーンマスク２４の撮像画像に基づいて精度の高いマスク位置情報を自動的に取得することができる。   In this case, the mask position information is input in advance to the production management computer 17 (or the control unit of the first component mounting machine 13) by the operator actually measuring the position of the printing opening 25 of the screen mask 24. However, as in the first embodiment, if the screen mask 24 is imaged by the camera 27 provided in the screen printing machine 14 and the captured image is processed to measure the mask position information, Highly accurate mask position information can be automatically acquired based on the captured image of the screen mask 24 actually used.

また、本実施例１では、基板粘着工程で、第１の部品実装機１３の吸着ノズル２１で基板２２を吸着してパレット１１に粘着させる作業を行うようにしているので、第１の部品実装機１３に装備された吸着ノズル２１の位置決め機能を使用して基板２２をパレット１１の目標とする搭載位置に正確に粘着させることができる。   In the first embodiment, in the board adhering step, the operation of adsorbing the substrate 22 by the adsorption nozzle 21 of the first component mounting machine 13 and adhering it to the pallet 11 is performed. Using the positioning function of the suction nozzle 21 provided in the machine 13, the substrate 22 can be accurately adhered to the target mounting position of the pallet 11.

図４に示す本発明の実施例２では、パレット１１を搬送する搬送経路３２に沿って、スクリーン印刷機３３、第１の部品実装機３４、第２の部品実装機３５等を順番に配置し、これら各装置３３〜３５の制御部（図示せず）と生産管理コンピュータ３６との間で各種の制御信号・データ信号を送受信することで、各装置３３〜３５の動作を制御するようにしている。以下の説明では、前記実施例１と実質的に同一の部分には同一の符号を付して説明を省略又は簡略化する。   In the second embodiment of the present invention shown in FIG. 4, a screen printing machine 33, a first component mounting machine 34, a second component mounting machine 35, etc. are arranged in order along the transport path 32 that transports the pallet 11. The operation of each of the devices 33 to 35 is controlled by transmitting and receiving various control signals and data signals between the control unit (not shown) of each of the devices 33 to 35 and the production management computer 36. Yes. In the following description, substantially the same parts as those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

本実施例２では、空のパレット１１をスクリーン印刷機３３を通過させて第１の部品実装機３４まで搬送し、この第１の部品実装機３４で、前記実施例１と同様の方法で、マスク位置情報に基づいてパレット１１に対する各基板２２の搭載位置を位置決めして複数の基板２２をパレット１１に粘着させる。   In the second embodiment, the empty pallet 11 is transported to the first component mounting machine 34 through the screen printing machine 33, and the first component mounting machine 34 uses the same method as in the first embodiment. Based on the mask position information, the mounting position of each substrate 22 on the pallet 11 is positioned, and the plurality of substrates 22 are adhered to the pallet 11.

この後、基板２２が粘着されたパレット１１を、第１の部品実装機３４から逆方向（上流方向）に搬送してスクリーン印刷機３３に搬入し、前記実施例１と同様の方法で、パレット１１上の複数の基板２２の上方にスクリーンマスク２４を位置させてスクリーンマスク２４の印刷用開口部２５に対してパレット１１上の基板２２を位置合わせした状態で、スクリーンマスク２４上でスキージを動作させてパレット１１上の複数の基板２２に一括して所定のパターンをスクリーン印刷する。   Thereafter, the pallet 11 to which the substrate 22 is adhered is conveyed in the reverse direction (upstream direction) from the first component mounting machine 34 and carried into the screen printer 33, and the pallet 11 is subjected to the same method as in the first embodiment. The squeegee is operated on the screen mask 24 in a state where the screen mask 24 is positioned above the plurality of substrates 22 on the substrate 11 and the substrate 22 on the pallet 11 is aligned with the printing opening 25 of the screen mask 24. Then, a predetermined pattern is screen-printed collectively on the plurality of substrates 22 on the pallet 11.

スクリーン印刷後、スクリーン印刷機３３から、パレット１１を第１の部品実装機３４を通過させて第２の部品実装機３５まで搬送し、この第２の部品実装機３５の吸着ノズルで電子・電気部品を吸着して、パレット１１上のスクリーン印刷後の各基板２２に電子・電気部品を実装する。尚、パレット１１に基板２２を粘着させる第１の部品実装機３４においても、パレット１１上のスクリーン印刷後の各基板２２に電子・電気部品を実装するようにしても良い。   After screen printing, the pallet 11 is transported from the screen printer 33 through the first component mounter 34 to the second component mounter 35, and electronic / electrical is picked up by the suction nozzle of the second component mounter 35. The components are sucked and electronic / electrical components are mounted on each substrate 22 after screen printing on the pallet 11. In the first component mounting machine 34 that adheres the substrate 22 to the pallet 11, electronic / electrical components may be mounted on each substrate 22 after screen printing on the pallet 11.

以上説明した本実施例２では、スクリーン印刷機３３の上流側に部品実装機が配置されていない従来の部品実装ラインと同じ装置の配列順序でも、本発明を適用して実施でき、前記実施例１と同様の効果を得ることができる。   In the second embodiment described above, the present invention can be applied even in the same arrangement order as the conventional component mounting line in which the component mounting machine is not arranged on the upstream side of the screen printing machine 33. 1 can be obtained.

その他、本発明は、スクリーン印刷・実装システムを構成する各装置の台数や配列順序を適宜変更しても良い等、種々変更して実施できる。   In addition, the present invention can be implemented with various changes such as the number of devices constituting the screen printing / mounting system and the arrangement order may be appropriately changed.

本発明の実施例１のスクリーン印刷・実装システムの構成例を概略的に示す図である。1 is a diagram schematically illustrating a configuration example of a screen printing / mounting system according to a first embodiment of the present invention. スクリーン印刷機に装備されるスクリーンマスクとカメラを説明する図である。It is a figure explaining the screen mask and camera with which a screen printing machine is equipped. 第１の部品実装機の吸着ノズルで吸着した基板をパレットに粘着させる方法を説明する図である。It is a figure explaining the method to adhere | attach the board | substrate adsorbed with the adsorption nozzle of the 1st component mounting machine on a pallet. 本発明の実施例２のスクリーン印刷・実装システムの構成例を概略的に示す図である。It is a figure which shows roughly the structural example of the screen printing and mounting system of Example 2 of this invention.

符号の説明Explanation of symbols

１１…パレット、１２…搬送経路、１３…第１の部品実装機、１４…スクリーン印刷機、１５…第２の部品実装機、１６…第３の部品実装機、１７…生産管理コンピュータ、２１…吸着ノズル、２２…基板、２３…位置認識マーク、２４…スクリーンマスク、２５…印刷用開口部、２６…位置認識マーク、２７…カメラ、３２…搬送経路、３３…スクリーン印刷機、３４…第１の部品実装機、３５…第２の部品実装機、３６…生産管理コンピュータ   DESCRIPTION OF SYMBOLS 11 ... Pallet, 12 ... Conveyance path | route, 13 ... 1st component mounting machine, 14 ... Screen printer, 15 ... 2nd component mounting machine, 16 ... 3rd component mounting machine, 17 ... Production management computer, 21 ... Suction nozzle, 22 ... substrate, 23 ... position recognition mark, 24 ... screen mask, 25 ... printing opening, 26 ... position recognition mark, 27 ... camera, 32 ... conveyance path, 33 ... screen printer, 34 ... first Component mounting machine, 35 ... second component mounting machine, 36 ... production management computer

Claims (3)

パレット上に並べて搭載した複数の基板の上方に１枚のスクリーンマスクを位置させて前記複数の基板に一括して所定のパターンをスクリーン印刷する方法において、
前記スクリーンマスクの各基板に対応する印刷用開口部の位置又はその位置を特定する位置情報（以下これらを「マスク位置情報」という）を実測又は入力するマスク位置情報取得工程と、
前記マスク位置情報に基づいて前記パレットに対応する各基板の搭載位置を位置決めして各基板を前記パレットに粘着させる基板粘着工程と、
前記パレットに粘着した前記複数の基板の上方に前記スクリーンマスクを位置させて両者を位置合わせした状態で前記複数の基板に所定のパターンをスクリーン印刷する印刷工程と
を含むことを特徴とするスクリーン印刷方法。 In a method of screen printing a predetermined pattern collectively on the plurality of substrates by positioning one screen mask above the plurality of substrates mounted side by side on the pallet,
A mask position information acquisition step of measuring or inputting position information (hereinafter referred to as “mask position information”) for specifying the position of the printing opening corresponding to each substrate of the screen mask or the position;
A substrate adhesion step of positioning each substrate mounting position corresponding to the pallet based on the mask position information to adhere each substrate to the pallet;
A screen printing process comprising: printing a predetermined pattern on the plurality of substrates in a state in which the screen mask is positioned above the plurality of substrates adhered to the pallet and the two are aligned. Method. 前記マスク位置情報取得工程では、前記印刷工程で使用するスクリーン印刷機に装備されたカメラで前記スクリーンマスクを撮像してその撮像画像を画像処理して前記マスク位置情報を実測し、
前記基板粘着工程では、部品実装機の吸着ノズルで前記基板を吸着して前記パレットに粘着させる作業を行うことを特徴とする請求項１に記載のスクリーン印刷方法。 In the mask position information acquisition step, the screen mask is imaged by a camera equipped in a screen printing machine used in the printing step, the captured image is image-processed, and the mask position information is measured,
2. The screen printing method according to claim 1, wherein in the substrate adhesion step, an operation of adsorbing the substrate by an adsorption nozzle of a component mounting machine and adhering the substrate to the pallet is performed. パレット上に並べて搭載した複数の基板の上方に１枚のスクリーンマスクを位置させて前記複数の基板に一括して所定のパターンをスクリーン印刷するスクリーン印刷システムにおいて、
前記スクリーンマスクの各基板に対応する印刷用開口部の位置又はその基準位置となる情報（以下これらを「マスク位置情報」という）を実測又は入力するマスク位置情報取得手段と、
前記マスク位置情報に基づいて前記パレットに対応する各基板の搭載位置を位置決めして各基板を前記パレットに粘着させる基板粘着手段とを
備えていることを特徴とするスクリーン印刷システム。 In a screen printing system that screen-prints a predetermined pattern collectively on the plurality of substrates by positioning one screen mask above the plurality of substrates mounted side by side on the pallet,
Mask position information acquisition means for actually measuring or inputting the position of the printing opening corresponding to each substrate of the screen mask or information serving as a reference position thereof (hereinafter referred to as “mask position information”);
A screen printing system comprising: substrate adhesion means for positioning a mounting position of each substrate corresponding to the pallet based on the mask position information and causing the substrate to adhere to the pallet.
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JP2014079907A (en) * 2012-10-15 2014-05-08 Panasonic Corp Screen printing device, analyser of failure cause in screen printing, and analysis method of failure cause

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