JP2009184247A - Manufacturing method of liquid jetting head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a liquid jetting head, with which variation of displacement of each piezoelectric element can be adjusted within an extremely short period of time. <P>SOLUTION: The manufacturing method of the liquid jetting head includes: an inspection process for inspecting the displacement of each of a plurality of piezoelectric elements 300; and a displacement adjustment process which is executed when the plurality of piezoelectric elements 300 have the variation of the displacement, according to the inspection result of the inspection process and which decreases the displacement of the piezoelectric elements 300, in such a manner that a driving signal is input from the side of a common electrode common in the plurality of piezoelectric elements 300, to selectively displace the predetermined piezoelectric element 300 whose displacement is relatively high. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a liquid ejecting head that ejects liquid droplets, and in particular, pressurizes ink supplied to a pressure generating chamber communicating with a nozzle that ejects ink droplets with a piezoelectric element, thereby ejecting ink droplets from the nozzles. The present invention relates to a method for manufacturing an inkjet recording head to be ejected.

  A typical example of the liquid ejecting head is an ink jet recording head that ejects ink droplets from nozzles. As an ink jet recording head, for example, a part of a pressure generation chamber communicating with a nozzle for ejecting ink droplets is configured by a vibration plate, and the vibration plate is deformed by a piezoelectric element to pressurize ink in the pressure generation chamber. Some eject ink droplets from nozzles. In addition, as a piezoelectric element employed in an ink jet recording head, for example, an element composed of a pair of electrodes and a piezoelectric layer sandwiched between these electrodes is known.

  When manufacturing such an ink jet recording head, each piezoelectric element is formed with high accuracy using a photolithographic method or the like so that the displacement characteristics of each piezoelectric element are made uniform. However, the displacement amount of each piezoelectric element may vary.

  If the amount of displacement of the piezoelectric element varies, the width of the line (line width) drawn by the droplets ejected from each nozzle varies, and the print quality deteriorates. For this reason, it is necessary to appropriately adjust the variation in the displacement amount of each piezoelectric element in the manufacturing process.

  Here, in order to adjust the displacement amount of the piezoelectric element, for example, a drive signal having a higher voltage and higher frequency than that in actual use is applied to the piezoelectric element by a predetermined number of pulses in the same manner as in actual use to drive the piezoelectric element. A technique for performing the aging process is known (see Patent Document 1).

JP 2004-202849 A (Claim 1 etc.)

  Such an aging process is generally performed for all piezoelectric elements. For example, the aging process is selectively performed for a predetermined piezoelectric element, or for each piezoelectric element. It is considered that the variation in the displacement amount of each piezoelectric element as described above can be adjusted by changing the execution conditions of the aging process.

  However, since it takes a very long time to adjust the variation of the displacement amount of each piezoelectric element by such an aging process, there is a problem that the manufacturing efficiency is remarkably lowered.

  Such a problem exists not only in an ink jet recording head that ejects ink droplets but also in other liquid ejecting heads that eject droplets other than ink.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a method of manufacturing a liquid ejecting head capable of adjusting variation in the displacement amount of each piezoelectric element in an extremely short time.

The present invention that solves the above-described problems is a flow path forming substrate in which a plurality of pressure generating chambers communicating with a nozzle for ejecting droplets are arranged in parallel, and each pressure generating chamber is provided on one side of the flow path forming substrate. A method for manufacturing a liquid ejecting head comprising a pair of electrodes provided in the manner described above and a piezoelectric element composed of a piezoelectric layer sandwiched between the electrodes, wherein the displacement amount of each of the plurality of piezoelectric elements is inspected. And a plurality of the piezoelectric elements based on the inspection results of the inspection process and the displacement amount of the plurality of piezoelectric elements are varied, and a drive signal is input relatively from the common electrode side common to the plurality of piezoelectric elements. The liquid ejecting head manufacturing method further includes a displacement adjusting step of reducing a displacement amount of the piezoelectric element by selectively displacing a predetermined piezoelectric element having a high displacement amount.
In the present invention, the displacement amount of the piezoelectric element can be reduced in a very short time by the displacement adjustment step, and the variation in the displacement amount of the piezoelectric element can be adjusted relatively easily. Therefore, manufacturing efficiency can be greatly improved.

  Here, it is preferable that the waveform of the drive signal input to the piezoelectric element in the adjustment step is a triangular wave. Thus, by inputting a drive signal having a relatively simple waveform to the piezoelectric element, the displacement amount of the piezoelectric element can be reduced in a shorter time.

  Moreover, it is preferable to provide the aging process which inputs a drive signal to the said piezoelectric element from the individual electrode side independent by each piezoelectric element and drives the said piezoelectric element before the said test | inspection process. Thereby, the displacement adjustment process can be performed in a state where the displacement of the piezoelectric element is stable, and the variation in the displacement amount of the piezoelectric element can be adjusted more reliably.

  In the inspection step, it is preferable that a discharge result drawn by droplets ejected from each nozzle is measured. Thereby, the dispersion | variation in the displacement amount of a piezoelectric element can be adjusted more reliably.

  Further, in the inspection step, instead of measuring the discharge result drawn by the droplets, the amount of droplets ejected from each nozzle may be measured. Thereby, the displacement amount of the piezoelectric element can be inspected relatively easily.

Hereinafter, the present invention will be described in detail based on embodiments.
(Embodiment 1)
FIG. 1 is an exploded perspective view showing a schematic configuration of an ink jet recording head which is an example of a liquid ejecting head manufactured by a manufacturing method according to Embodiment 1 of the present invention, and FIG. It is a principal part top view of a head, FIG.2 (b) is AA 'sectional drawing of Fig.2 (a).

  As shown in the figure, the flow path forming substrate 10 is made of a silicon single crystal substrate having a crystal plane orientation of (110), and an elastic film 50 made of an oxide film is formed on one surface thereof. The flow path forming substrate 10 is anisotropically etched from the other side, so that the flow path forming substrate 10 has a plurality of pressure generating chambers 12 partitioned by a plurality of partition walls 11 in the width direction (short side). Direction). In addition, an ink supply path 13 and a communication path 14 are partitioned by a partition wall 11 at one end in the longitudinal direction of the pressure generating chamber 12 of the flow path forming substrate 10. In addition, a communication portion 15 constituting a part of the reservoir 100 serving as a common ink chamber for each pressure generating chamber 12 is formed at one end of the communication passage 14.

  Further, on the opening surface side of the flow path forming substrate 10, a nozzle plate 20 in which a nozzle 21 communicating with the vicinity of the end of each pressure generating chamber 12 on the side opposite to the ink supply path 13 is formed is adhesive or heat. It is fixed by a welding film or the like. The nozzle plate 20 is made of glass ceramics, a silicon single crystal substrate, stainless steel, or the like.

  On the other hand, an elastic film 50 made of an oxide film is formed on the side opposite to the opening surface of the flow path forming substrate 10, and an oxide film made of a material different from that of the elastic film 50 is formed on the elastic film 50. An insulating film 55 made of is laminated. On the insulator film 55, a piezoelectric element 300 including a lower electrode film 60, a piezoelectric layer 70, and an upper electrode film 80 is formed. In general, one of the pair of electrodes constituting the piezoelectric element 300 functions as a common electrode common to the plurality of piezoelectric elements 300, and the other electrode functions as an individual electrode independent of each piezoelectric element 300. To do. For example, in this embodiment, the lower electrode film 60 is used as a common electrode for the piezoelectric elements 300, and the upper electrode film 80 is used as an individual electrode for each piezoelectric element 300. Of course, there is no problem even if this is reversed for the convenience of the drive circuit and wiring. In the present embodiment, the elastic film 50, the insulator film 55, and the lower electrode film 60 function as a vibration plate. However, the present invention is not limited to this. For example, the elastic film 50 and the insulator film 55 are not provided. In addition, only the lower electrode film 60 may function as a diaphragm. Further, the piezoelectric element 300 itself may substantially serve as a diaphragm. Further, each upper electrode film 80 which is an individual electrode of the piezoelectric element 300 is drawn from the vicinity of the end on the ink supply path 13 side and extended to the insulator film 55, for example, from gold (Au) or the like. Lead electrode 90 is connected.

Here, the lower electrode film 60 constituting the piezoelectric element 300 is made of a metal material such as platinum (Pt) or iridium (Ir). As a material of the piezoelectric layer 70, lead zirconate titanate (PZT) is preferably used, but is not particularly limited as long as the displacement can be sufficiently obtained in actual use. Other ferroelectric piezoelectricity A material, or a relaxor ferroelectric material in which a metal such as niobium, nickel, magnesium, bismuth, or yttrium is added thereto is used. As the composition, for example, PbTiO ₃ (PT), PbZrO ₃ (PZ), Pb (Zr _x Ti _1-x ) O ₃ (PZT), Pb (Mg _1/3 Nb _2/3 ) O ₃ —PbTiO ₃ (PMN-PT), Pb (Zn _1/3 Nb _2/3 ) O ₃ -PbTiO ₃ (PZN-PT), Pb (Ni _1/3 Nb _2/3 ) O ₃ -PbTiO ₃ (PNN-PT), _{Pb (In 1/2 Nb 1/2) O} 3 -PbTiO 3 (PIN-PT), Pb (Sc 1/2 Ta 1/2) O 3 -PbTiO 3 (PST-PT), Pb (Sc 1/2 _{nb 1/2) O 3 -PbTiO 3 (} PSN-PT), biScO 3 -PbTiO 3 (BS-PT), BiYbO 3 -PbTiO 3 (BY-PT) and the like. Similarly to the lower electrode film 60, the upper electrode film 80 is made of platinum (Pt), iridium (Ir), or a metal material such as a laminate or alloy thereof.

  On the flow path forming substrate 10 on which the piezoelectric element 300 is formed, a protective substrate 30 having a piezoelectric element holding portion 31 having a space that does not hinder the movement of the piezoelectric element 300 in a region facing the piezoelectric element 300. Bonded by an adhesive 35. Note that the piezoelectric element holding portion 31 only needs to have a space that does not hinder the movement of the piezoelectric element 300, and the space may be sealed or not sealed.

  In addition, the protective substrate 30 is provided with a reservoir portion 32 in a region facing the communication portion 15, and this reservoir portion 32 is communicated with the communication portion 15 of the flow path forming substrate 10 as described above, so that each pressure is provided. A reservoir 100 serving as a common ink chamber for the generation chamber 12 is configured. In addition, a through hole 33 that penetrates the protective substrate 30 in the thickness direction is provided in a region between the piezoelectric element holding portion 31 and the reservoir portion 32 of the protective substrate 30, and the lower electrode film 60 is provided in the through hole 33. And the tip of the lead electrode 90 are exposed.

  As a material for such a protective substrate 30, it is preferable to use a material substantially the same as the coefficient of thermal expansion of the flow path forming substrate 10, for example, glass, ceramic material, etc. A silicon single crystal substrate is preferably used.

  In addition, a drive circuit (not shown) for driving the piezoelectric element 300 is fixed on the protective substrate 30, and the drive circuit and the lead electrode 90 are electrically connected via a connection wiring made of a conductive wire such as a bonding wire. Connected.

  On the protective substrate 30, a compliance substrate 40 including a sealing film 41 and a fixing plate 42 is bonded. Here, the sealing film 41 is made of a material having low rigidity and flexibility, and one surface of the reservoir portion 32 is sealed by the sealing film 41. The fixing plate 42 is made of a hard material such as metal. Since the region of the fixing plate 42 facing the reservoir 100 is an opening 43 that is completely removed in the thickness direction, one surface of the reservoir 100 is sealed only with a flexible sealing film 41. Has been.

  In such an ink jet recording head of this embodiment, ink is taken in from an external ink supply means (not shown), filled with ink from the reservoir 100 to the nozzle 21, and then pressure is generated according to the recording signal from the drive circuit. A drive signal is input from the upper electrode film 80 side to the piezoelectric element 300 corresponding to the chamber 12, and the elastic film 50, the insulator film 55, the lower electrode film 60, and the piezoelectric layer 70 are bent and deformed to thereby form each pressure generating chamber. The pressure inside the nozzle 12 increases and ink droplets are ejected from the nozzle 21.

  Hereinafter, a method for manufacturing such an ink jet recording head will be described. 3 and 4 are cross-sectional views in the longitudinal direction of the pressure generating chamber. First, as shown in FIG. 3A, a silicon dioxide film 51 constituting the elastic film 50 is formed on the surface of a flow path forming substrate wafer 110 which is a silicon wafer, and this elastic film 50 (silicon dioxide film 51). On top of this, for example, an insulator film 55 made of zirconium oxide is formed.

  Next, as shown in FIG. 3B, the piezoelectric element 300 is formed on the insulator film 55. Specifically, first, for example, a lower electrode film 60 made of platinum or the like is formed on the entire surface of the insulator film 55 and patterned into a predetermined shape, and then, for example, a piezoelectric body made of lead zirconate titanate (PZT) or the like. The layer 70 and the upper electrode film 80 made of a metal such as platinum are sequentially stacked. Then, the upper electrode film 80 and the piezoelectric layer 70 are patterned to form the piezoelectric element 300.

  Next, as shown in FIG. 3C, a lead electrode 90 made of a metal layer 91 such as gold (Au) is formed. That is, the metal layer 91 is formed over the entire surface of the flow path forming substrate wafer 110, and the lead electrode 90 is formed by patterning the metal layer 91 for each piezoelectric element 300.

  Next, as shown in FIG. 4A, a protective substrate wafer 130, which is a silicon wafer, is bonded to the piezoelectric element 300 side of the flow path forming substrate wafer 110 with an adhesive 35. The protective substrate wafer 130 has a piezoelectric element holding portion 31, a reservoir portion 32, and a through hole 33 formed in advance.

  Next, as shown in FIG. 4B, the surface of the flow path forming substrate wafer 110 opposite to the protective substrate wafer 130 is processed so that the flow path forming substrate wafer 110 has a predetermined thickness. Next, as shown in FIG. 4C, a protective film 52 having a predetermined pattern is formed on the surface of the flow path forming substrate wafer 110 to serve as a mask when forming the ink flow path such as the pressure generating chamber 12. By using this protective film 52 as a mask, the flow path forming substrate wafer 110 is anisotropically etched (wet etching), thereby forming the pressure generating chamber 12, the ink supply path 13, the communication path 14, and the communication section 15.

  Thereafter, unnecessary portions of the outer peripheral edge portions of the flow path forming substrate wafer 110 and the protective substrate wafer 130 are removed by cutting, for example, by dicing. Then, the nozzle plate 20 having the nozzles 21 formed on the surface of the flow path forming substrate wafer 110 opposite to the protective substrate wafer 130 is bonded, and the compliance substrate 40 is bonded to the protective substrate wafer 130. The flow path forming substrate wafer 110 or the like is divided into one chip size flow path forming substrate 10 or the like as shown in FIG.

  Thus, after dividing | segmenting into each chip size, the aging process which drives each piezoelectric element 300 and stabilizes the amount of displacement is implemented. At this time, a predetermined drive signal is input to each piezoelectric element 300 from the upper electrode film 80 side which is an individual electrode. By performing such an aging process, the piezoelectric layer 70 constituting the piezoelectric element 300 is polarized and the internal stress of the diaphragm, particularly the internal stress of the lower electrode film 60 constituting the diaphragm is alleviated. . Thereby, the fluctuation | variation of the displacement amount of the piezoelectric element 300 at the time of actual use is suppressed remarkably small.

  By the way, regardless of whether or not such an aging process is performed, variation may occur in the displacement amount of the piezoelectric elements 300 arranged in parallel. If there is a variation in the displacement amount of each piezoelectric element 300 in a state where the piezoelectric element 300 is formed, the variation in the displacement amount of the piezoelectric element 300 still exists even if the aging process is performed on all the piezoelectric elements 300. If there is such variation in the displacement amount of the piezoelectric element, when printing is performed, the width (line width) of the line drawn by the ink droplets ejected from each nozzle 21 varies, and the print quality is reduced. There is a problem that it falls.

  FIG. 5 shows the relationship between the positions of nozzles arranged in a row (nozzle positions) and the discharge results of ink droplets (droplets) corresponding to each nozzle, for example, the line widths of ruled lines drawn by ejecting ink droplets. It is a graph to show. When the displacement amount of each piezoelectric element is uniform, the line width becomes substantially uniform as shown by a dotted line in FIG. However, if there is variation in the displacement amount of each piezoelectric element 300, the line width in the vicinity of the specific nozzle position P0 becomes significantly narrower than the line width corresponding to the other nozzle positions, as shown by the solid line in FIG. Sometimes. That is, the displacement amount of the piezoelectric element 300 corresponding to a specific nozzle position may be significantly lower than the displacement amount of the piezoelectric element 300 corresponding to another nozzle position.

  Therefore, in this embodiment, after performing the aging process, an inspection process for inspecting the displacement amount of the piezoelectric element 300 is performed, and a drive signal is input to the predetermined piezoelectric element 300 from the common electrode side common to the plurality of piezoelectric elements 300. Then, a displacement adjustment step for suppressing the displacement amount of the piezoelectric element 300 by selectively displacing is performed as necessary.

  In the inspection process, specifically, for example, the width of the line (line width) drawn by the ink droplets ejected from each nozzle is actually measured. That is, by measuring the line width, the displacement amount of each piezoelectric element is estimated, and the presence or absence of variation in the displacement amount of each piezoelectric element 300 is inspected. And when the variation | change_quantity has arisen in the displacement amount of each piezoelectric element 300, a displacement adjustment process is implemented. Of course, if there is no variation, it is not necessary to perform the displacement adjustment process.

  In the inspection process, instead of the line width, for example, various ejection characteristics such as the speed of the ejected ink droplet and the weight of the ejected ink droplet may be measured. For example, as shown in FIG. 6, there is a clear correlation between the line width and various ejection characteristics such as the speed (ink droplet speed) when ink droplets are ejected from the nozzles. Therefore, the displacement amount of the piezoelectric element 300 can also be estimated by measuring the ink droplet velocity.

  In the displacement adjustment process, the implementation conditions, for example, determination of the target piezoelectric element 300, drive signal input time (drive count), voltage magnitude, and the like are determined based on the line width measured in the inspection process. Then, based on the implementation conditions determined based on the inspection process, a drive signal is input to the predetermined piezoelectric element 300 from the common electrode side and selectively displaced. In the present embodiment, since the lower electrode film 60 constitutes a common electrode, a drive signal is input from the lower electrode film 60 side in the displacement adjustment step.

  By carrying out such a displacement adjustment process, that is, by displacing the piezoelectric element 300 by inputting a drive signal to the piezoelectric element 300 from the electrode opposite to that at the time of actual use or the aging process, the piezoelectric element 300 is displaced for a very short time. Thus, the displacement amount of the piezoelectric element 300 can be suppressed, and the variation in the displacement amount of the piezoelectric elements 300 arranged in parallel can be adjusted.

  Here, in the displacement adjustment step, for example, when a drive signal in which the bias voltage applied to the lower electrode film 60 is −20 V and the drive voltage (amplitude) is 40 V is input to the piezoelectric element 300 and the application time is changed. The reduction rate of the line width was examined. The result is shown in the graph of FIG. As can be seen from the graph shown in FIG. 7, the line width decreases according to the time during which the displacement adjustment process is performed (input time of the drive signal). It can also be seen that the displacement of the piezoelectric element 300 decreases to about 80% in a very short time of several seconds. As can be seen from this result, the displacement adjustment process for driving the piezoelectric element 300 by inputting a drive signal from the common electrode side to the piezoelectric element 300 reduces the amount of displacement of the piezoelectric element 300 in an extremely short time. In addition, the amount of displacement can be reduced by a predetermined amount by changing the input time of the drive signal.

  Note that the amount of displacement of the piezoelectric element 300 can be suppressed particularly efficiently by changing the input time of the drive signal. However, for example, other parameters may be changed. For example, the displacement amount of the piezoelectric element 300 can be reduced by a predetermined amount by changing the bias voltage while keeping the input time of the drive signal and the drive voltage (amplitude) constant. Further, for example, the displacement amount of the piezoelectric element 300 can be decreased by a predetermined amount by changing the drive voltage (amplitude) while keeping the input time of the drive signal and the bias voltage constant.

  In this embodiment, in the displacement adjustment step, drive signals are input to the plurality of piezoelectric elements 300 adjacent to the piezoelectric element 300 corresponding to the nozzle position P0 (see FIG. 5) with a narrow line width, and the input time is adjusted. As a result, the displacement amounts of the plurality of piezoelectric elements 300 are reduced stepwise. That is, a drive signal is input to a plurality of piezoelectric elements 300 in the vicinity of the nozzle position P0, and the drive signal input time is increased for the piezoelectric elements 300 that are closer to the nozzle position P0. In addition, the inclination angle of the change in the line width in the vicinity of the nozzle position P0 is made gentler than before the displacement adjustment step (solid line in FIG. 5).

  By adjusting the displacement amount of the predetermined piezoelectric element 300 in this way, it is possible to substantially improve the print quality. In the case of this embodiment, the line width itself varies even after the displacement adjustment process is performed, but since there is no sudden change in the line width between adjacent nozzles, the print quality is improved to the extent that there is no problem in actual use. be able to. That is, the print quality can be improved to such an extent that variations in line width cannot be recognized with the naked eye.

  In the present embodiment, only the displacement amount of the piezoelectric element 300 in the vicinity of the nozzle position P0 is adjusted. Of course, the displacement adjustment process is performed on the piezoelectric elements 300 corresponding to all the nozzles except the nozzle having a narrow line width. For example, as indicated by a two-dot chain line in FIG. 5, the line widths corresponding to all the nozzles may substantially match the line width of the nozzle position P0. Thereby, the print quality can be further improved.

  The waveform of the drive signal input to the piezoelectric element 300 in the displacement adjustment step is not particularly limited. For example, the frequency of a sin wave, a rectangular wave, or the like is preferably a single waveform, and in particular, a triangular wave. preferable. With such a simple waveform, the piezoelectric element 300 can be driven a predetermined number of times in a relatively short time, and the time for performing the displacement adjustment process can be further shortened. In addition, the load on the piezoelectric element 300 and the load on the drive circuit that drives the piezoelectric element 300 can be suppressed.

  The aging process may be performed after the displacement adjustment process, but is preferably performed before the displacement adjustment process as in the present embodiment. Thereby, manufacturing efficiency can be improved without performing a displacement adjustment process wastefully. As described above, the aging process is performed to drive the piezoelectric element 300 to suppress the variation of the displacement amount. This aging process also serves as a part of the screening process for determining / selecting the quality of the piezoelectric element. ing. In other words, after performing the aging process, the inspection element inspects the displacement amount of the piezoelectric element to determine / select the quality of the piezoelectric element 300. The displacement adjustment process is carried out for Therefore, it is not necessary to carry out the displacement adjustment process wastefully, and manufacturing efficiency can be improved.

  In this embodiment, the pressure generation chamber 12 is formed on the flow path forming substrate 10 and the nozzle plate 20 is joined to the flow path forming substrate 10 and then the aging process is performed. If it is after forming the piezoelectric element 300, it will not specifically limit. For example, an aging process may be performed after the piezoelectric element 300 is formed and before the pressure generation chamber 12 is formed. That is, the aging process may be performed in a state where the displacement of the piezoelectric element 300 is restricted. Thereby, since the polarization of the piezoelectric material can be fixed, sufficient aging can be performed at a lower voltage than in actual use.

(Other embodiments)
As mentioned above, although embodiment of this invention was described, of course, this invention is not limited to the above-mentioned embodiment. For example, in the above-described embodiment, the thin film type ink jet recording head manufactured by applying the film forming and lithography processes is taken as an example. However, the present invention is not limited to this. For example, a green sheet is pasted. The present invention can also be applied to a thick film type ink jet recording head formed by such a method.

  In the above-described embodiment, an example of a method for manufacturing an ink jet recording head that ejects ink has been described as an example of a method for manufacturing a liquid ejecting head. However, the present invention is intended for a wide range of liquid ejecting heads. . Examples of the liquid ejecting head include a recording head used for an image recording apparatus such as a printer, a color material ejecting head used for manufacturing a color filter such as a liquid crystal display, an organic EL display, and an electrode formation such as an FED (field emission display). Electrode material ejecting heads used in manufacturing, bioorganic matter ejecting heads used in biochip production, and the like.

It is an exploded perspective view showing an example of an ink jet recording head. 2A and 2B are a plan view and a cross-sectional view illustrating an example of an ink jet recording head. FIG. 4 is a cross-sectional view illustrating the recording head manufacturing method according to the first embodiment. FIG. 4 is a cross-sectional view illustrating the recording head manufacturing method according to the first embodiment. It is a graph which shows the relationship between a nozzle position and line | wire width. It is a graph which shows the relationship between an ink drop speed and line | wire width. It is a graph which shows the relationship between the input time of a drive signal, and the reduction | decrease amount of a line width.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 Flow path formation board | substrate, 12 Pressure generation chamber, 13 Communication part, 14 Ink supply path, 20 Nozzle plate, 21 Nozzle, 30 Protection board, 31 Piezoelectric element holding part, 32 Reservoir part, 40 Compliance board, 50 Elastic film, 60 Lower electrode film, 70 piezoelectric layer, 80 upper electrode film, 100 reservoir, 300 piezoelectric element

Claims (5)

A flow path forming substrate in which a plurality of pressure generating chambers communicating with nozzles for ejecting liquid droplets are arranged side by side, and a pair of electrodes provided on one side of the flow path forming substrate corresponding to each pressure generating chamber; A method for manufacturing a liquid jet head comprising a piezoelectric element comprising a piezoelectric layer sandwiched between the electrodes,
An inspection process for inspecting the displacement amount of each of the plurality of piezoelectric elements, and a common process common to the plurality of piezoelectric elements, which are performed when there are variations in the displacement amounts of the plurality of piezoelectric elements based on the inspection results of the inspection process. And a displacement adjusting step of reducing a displacement amount of the piezoelectric element by selectively displacing a predetermined piezoelectric element having a relatively large displacement amount by inputting a drive signal from the electrode side. Manufacturing method of the head.   The method of manufacturing a liquid jet head according to claim 1, wherein the waveform of the drive signal input to the piezoelectric element in the adjustment step is a triangular wave.   3. The aging process for driving the piezoelectric element by inputting a driving signal to the piezoelectric element from the individual electrode side independent of each piezoelectric element before the inspection process. Manufacturing method of the liquid jet head of the present invention.   The method of manufacturing a liquid ejecting head according to claim 1, wherein in the inspection step, a discharge result drawn by droplets ejected from each nozzle is measured.   The method of manufacturing a liquid ejecting head according to claim 1, wherein in the inspection step, the amount of liquid droplets ejected from each nozzle is measured.

Images