JP2009167323A - Surface-coated resin base body and method and apparatus for producing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for producing a resin base body having a resin layer, which rarely comprises a homopolymer derived from a monomer and has an excellent surface state, on the surface thereof. <P>SOLUTION: The apparatus for producing the surface-coated resin base body is provided with: a gaseous mixture generation part for mixing one or a plurality of monomer gases with an inert gas by predetermined concentration to generate one gaseous mixture comprising one or the plurality of monomers of the predetermined concentration; a normal-pressure corona discharge part for converting a plasma the gaseous mixture into a plasma stream; a holder for holding the resin base body; and a plasma stream irradiation part for irradiating the surface of the resin base body with the plasma stream to graft-polymerize the monomers in the gaseous mixture to the resin on the surface of the resin base body and form the resin layer. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a surface-coated resin substrate, a manufacturing method thereof, and a manufacturing apparatus thereof.

  It is required to modify the surface of the resin substrate by various methods. For example, a resin base made of a fluororesin such as PCTFE (hereinafter referred to as a fluororesin base) has low water vapor and oxygen permeability. Therefore, the use of a fluororesin substrate has the advantage that the deterioration of organic dyes used in image display devices such as electronic paper can be prevented. Further, since the fluororesin substrate has a low dielectric constant and excellent high frequency characteristics, when used as a flexible substrate, there is an advantage that a thin flexible wiring substrate can be obtained as compared with a conventional polyimide substrate.

In a substrate for an image display device, a flexible substrate, etc., it is usually necessary to laminate another component member (for example, a wiring or an interlayer insulating film) on the substrate, but the fluororesin substrate has poor surface adhesion. For this reason, other laminated components may be easily peeled off.
By the way, a method for improving surface characteristics by treating the surface of a resin substrate by corona discharge has been known for a long time. However, this method has a problem that the effect of the modification cannot be maintained for a long time, and particularly in the case of a fluororesin substrate, the effect maintaining time is extremely short.

Therefore, a method has been proposed in which the surface of the fluororesin substrate is treated by a low-pressure plasma method in an inert gas atmosphere such as He, and then an acrylic resin graft resin layer is formed on the treated surface (Japanese Patent Application Laid-Open No. Hei 7). -164600 gazette: Patent Document 1). Specifically, a fluororesin substrate such as PTFE (polytetrafluoroethylene: trade name Teflon (registered trademark)) or FEP (perfluoroethylene propylene copolymer) is treated by glow discharge of He gas under low pressure, and after treatment The surface coating resin substrate is obtained by immersing the substrate in a monomer solution corresponding to the acrylic resin to form a monomer layer, and heating the monomer layer to form a graft resin layer.
JP 7-164600 A

In the above publication, as a method for forming the graft resin layer, a method comprising a plasma treatment step under a low pressure, a step of immersing the substrate in a monomer solution, and a step of heating the monomer layer is described. The graft resin layer obtained by such a method may include not only a graft polymer but also a homopolymer of an acrylic resin due to the monomer solution adhering to the substrate more than necessary during immersion. there were. When such a homopolymer is included in the graft resin layer, there is a problem that the adhesive strength of the graft resin layer is lowered, and there is a problem that the surface state of the graft resin layer becomes poor. The latter problem has been a cause of poor conduction and insulation failure when another constituent member (for example, wiring, interlayer insulating film) is further laminated on the graft resin layer.
Further, in the above publication, since a low-pressure plasma treatment process, an immersion process, and a heating process are required to form the graft resin layer, it is desired to shorten the formation time.

In view of the above-mentioned problems, the inventors of the present invention, as a result of intensive studies, used a plasma flow of a monomer and an inert gas obtained by atmospheric pressure corona discharge treatment to form the resin and monomer on the surface of the resin substrate. Surprisingly, it has been found that by performing graft polymerization, a resin substrate having a surface with a resin layer having a very small amount of monomer-derived homopolymer and having a good surface state has been achieved.
Thus, according to the present invention, a mixed gas generating unit for mixing a single or a plurality of monomer gases with an inert gas at a predetermined concentration to generate one mixed gas containing a single or a plurality of monomers having a predetermined concentration; An atmospheric pressure corona discharge part for converting the mixed gas into a plasma flow; a holder for holding the resin substrate; and irradiating the surface of the resin substrate with the plasma flow, and a resin on the surface of the resin substrate. There is provided an apparatus for producing a surface-coated resin substrate, comprising a plasma flow irradiation unit for graft polymerization of the monomer to form a resin layer.

Further, according to the present invention, a single or a plurality of monomer gases are mixed with an inert gas at a predetermined concentration to generate one mixed gas containing a single or a plurality of monomers having a predetermined concentration, Surface coating characterized by converting into a plasma flow by pressure corona discharge, irradiating the surface of the resin substrate with the plasma flow, and graft-polymerizing the resin and the monomer on the surface of the resin substrate to form a resin layer A method for producing a resin substrate is provided.
Furthermore, according to the present invention, there is provided a surface-coated resin substrate obtained by the above production method, comprising a resin substrate, a surface of the resin substrate and a graft-polymerized resin layer.

According to the production apparatus and production method of the present invention, it is possible to obtain a surface-coated resin substrate having a monomer layer-derived homopolymer and a resin layer having a good surface state on the surface.
Further, the plasma flow irradiation unit is freely movable so that the plasma flow can be irradiated to a desired position of the resin substrate, and / or the holder is a resin substrate mounting tool, and the mounting tool is a resin In the case of having a substrate transport function, the resin layer can be continuously formed on a desired position of the resin substrate and / or on the resin substrate.
The surface-coated resin substrate of the present invention has a high adhesive strength of the resin layer. In addition, since the surface state is good, there is an advantage that even if another layer is laminated on the resin layer, defects such as cracks are hardly generated in the other layer.

In the apparatus of the present invention, the graft polymerization of the resin and the monomer on the surface of the resin substrate is performed by a corona discharge (normal pressure corona discharge) under normal pressure (atmospheric pressure) of a mixed gas of inert gas and monomer gas. This is performed by irradiating a resin substrate as an object to be processed with a plasma flow. The inventors presume that graft polymerization is performed as follows in the present invention.
That is, as described in the above publication, conventionally, radicals are generated on the surface of the substrate by plasma processing the surface of the resin substrate. When the monomer comes into contact with the generated radical, the monomer is graft-polymerized on the resin substrate to form a resin layer.

  On the other hand, in the present invention, radicals are generated on the surface of the resin substrate irradiated with the plasma flow, and the monomer becomes vapor plasma in the plasma flow. The generated radicals and vapor plasma preferentially cause graft polymerization, and as a result, a resin layer is formed. In the method of the present invention, since a plasma flow containing a monomer is used as compared with the conventional method, self-polymerization of the monomer can be further suppressed.

  By the way, in the above publication, homopolymerization of the monomer is unavoidable when plasma treatment is performed in the presence of the resin substrate and the monomer, but this publication forms a resin layer on the resin substrate by immersion. Therefore, the inventors have speculated that this is because the resin layer is formed after the plasma treatment. On the other hand, in the present invention, since the resin layer is formed at a time from the monomer by the plasma flow by the gas phase method, it is not necessary to form the monomer layer or to newly form the resin layer after the discharge treatment. According to the publication, homopolymerization can be suppressed.

  The resin substrate that can be used in the present invention is not particularly limited as long as the portion irradiated with the plasma flow is a resin. Specific examples of the resin constituting the resin substrate include ethylene-tetrafluoroethylene copolymer (ETFE), polyvinyl fluoride resin (PVF), tetrafluoroethylene-perfluoroether copolymer (PFA), and tetrafluoro. Ethylene-hexafluoropropylene copolymer (FEP), polytetrafluoroethylene (PTFE), vinylidene fluoride resin (PVdF), trifluorochloroethylene resin (PCTFE), ethylene-trifluorochloroethylene copolymer resin (ECTFE), etc. Examples of the resin include fluororesin, polyethylene resin (PE), polypropylene resin (PP), polystyrene resin (PS), acrylonitrile butadiene styrene resin (ABS), and polyimide resin. Further, the resin may contain additives such as pigments, fillers and lubricants.

The entire resin base may be made of a resin, or may be a base having a structure in which a non-resin is coated with a resin. Examples of non-resins include metals, glass, silicon, and known semiconductor thin films.
The shape of the resin substrate is not particularly limited, and examples thereof include a film shape, a sheet shape, a plate shape, a prismatic shape, a columnar shape, and a cylindrical shape.

  Next, the monomer is not particularly limited, and any known monomer can be used. Examples thereof include acrylic monomers such as acrylic acid or derivatives thereof, methacrylic acid or derivatives thereof, acetylene monomers, and alcohol monomers.

Specifically, acrylic monomers such as acrylic acid, methyl acrylate, ethyl acrylate, butyl acrylate, isobutyl acrylate, t-butyl acrylate, 2-ethylhexyl acrylate, lauryl acrylate, tridecyl acrylate, acrylic Stearyl acid, cyclohexyl acrylate, propyl acrylate, benzyl acrylate, isopropyl acrylate, sec-butyl acrylate, acrylic acid, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, dimethylaminoethyl acrylate, acrylic acid Diethylaminoethyl, glycidyl acrylate, tetrahydrofurfuryl acrylate, allyl acrylate, ethylene glycol diacrylate, triethylene glycol diacrylate, tetraethyl diacrylate Glycol, 1,3-butylene glycol diacrylate, trimethylolpropane triacrylate, 2-ethoxyethyl acrylate, ethoxyethoxyethyl acrylate, 2-methoxyethyl acrylate, phenoxyethyl acrylate, phenoxypolyethylene glycol acrylate, acrylic Acrylic acid such as dimethylaminoethyl methyl chloride salt or a derivative thereof,
Methacrylic acid, methyl methacrylate, ethyl methacrylate, butyl methacrylate, isobutyl methacrylate, t-butyl methacrylate, 2-ethylhexyl methacrylate, lauryl methacrylate, tridecyl methacrylate, stearyl methacrylate, cyclohexyl methacrylate, propyl methacrylate , Benzyl methacrylate, isopropyl methacrylate, sec-butyl methacrylate, methacrylic acid, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, dimethylaminoethyl methacrylate, diethylaminoethyl methacrylate, glycidyl methacrylate, tetrahydromethacrylate Furfuryl, allyl methacrylate, ethylene glycol dimethacrylate, triethylene glycol dimethacrylate, dimethacryl Tetraethylene glycol, 1,3-butylene glycol dimethacrylate, trimethylolpropane trimethacrylate, 2-ethoxyethyl methacrylate, ethoxyethoxyethyl methacrylate, 2-methoxyethyl methacrylate, phenoxyethyl methacrylate, phenoxypolyethylene methacrylate Examples thereof include methacrylic acid such as glycol, dimethylaminoethyl methyl chloride salt, and glycidyl methacrylate, or derivatives thereof.

An example of the acetylene-based monomer is propargyl alcohol.
The above monomers may be used singly or in combination.
Among the above monomers, acrylic acid, 2-hydroxyethyl methacrylate, glycidyl methacrylate, and propargyl alcohol are preferable.

  The inert gas means a gas that is not reactive with the resin substrate or the monomer. Examples of such a gas include noble gases such as helium and argon, nitrogen gas, and air. Here, since oxygen has a function of deactivating radicals, it is preferable that oxygen be as small as possible. Therefore, it is more preferable to use rare gas or nitrogen gas. The flow rate of the inert gas can be set to 10 to 100 L / min.

The inert gas and the monomer gas are mixed, and the obtained mixed gas is supplied to the atmospheric pressure corona discharge unit by the mixed gas generation unit. The mixing can be performed, for example, by joining the inert gas supply path and the monomer gas supply path, optionally via a flow meter and a valve.
In the case of acrylic acid, the concentration of the monomer gas can be set to 1200 to 1400 ppm (vol) as an example.

  The monomer gas can be used as it is when the monomer itself is gaseous at room temperature, and can be used as a gas by heating in the case of liquid and solid. When the monomer gas is liquefied at room temperature or liquefied by heating, the monomer gas may be obtained by bubbling the liquid. The monomer gas may use the inert gas as a carrier gas (for example, a flow rate of 1 to 5 L / min).

The mixed gas may be pressurized in order to avoid the influence of surrounding gas when the resin base is irradiated with the plasma flow. The pressure in this case can be about 1100 to 2000 hPa.
The configuration of the mixed gas generation unit is not particularly limited as long as one mixed gas can be supplied to the atmospheric pressure corona discharge unit.

  Next, in the atmospheric pressure corona discharge part, the mixed gas is converted into a plasma flow by atmospheric pressure corona discharge. The normal pressure does not strictly mean 1 atmospheric pressure (1013 hPa), and may be pressurized in the range of 1100 to 2000 hPa as necessary. If pressure is applied, it is possible to prevent an unintended gas (for example, oxygen in the air) from flowing into the plasma atmosphere.

  The corona discharge conditions are not particularly limited as long as a plasma flow including an inert gas plasma atmosphere and a monomer vapor plasma can be formed. Specifically, the frequency of an applied voltage of 1 kHz to 100 kHz is applied to a pair of corona discharge electrodes (corona discharge electrode units), although it varies slightly depending on the type of inert gas used and the configuration of the atmospheric pressure corona discharge unit. It is preferable to apply a voltage having a discharge voltage of 1 kV to 20 kV, a pulse modulation frequency of 10 Hz to 200 Hz, and a pulse duty of 10% to 90%. Note that the plasma flow can be discharged from, for example, two plasma flow irradiation units with one power supply device.

When the frequency is lower than 1 kHz, the temperature of the plasma becomes high, and there is a possibility that the workpiece is thermally damaged. On the other hand, when the frequency is higher than 100 kHz, the processing time may be long because the plasma density is low.
Further, when the discharge voltage is lower than 1 kV, the discharge becomes unstable and may stop. On the other hand, when the voltage is higher than 20 kV, the discharge becomes strong and arc discharge occurs, resulting in high-temperature plasma, which may cause thermal damage to the processed material.
When the pulse modulation frequency is lower than 10 Hz, there is a possibility that the discharge becomes intermittent and the processing time becomes long. On the other hand, when the frequency is higher than 200 Hz, the plasma flare blown out from the plasma flow irradiation unit is shortened, so that the processing area may be reduced.

Further, when the pulse duty is lower than 10%, the plasma density may be lowered and the plasma flare may be shortened. On the other hand, if it is higher than 90%, the plasma temperature may be high.
More preferable frequency, discharge voltage, pulse modulation frequency and pulse duty are 10 kHz to 50 kHz, 5 kV to 15 kV, 30 Hz to 100 Hz, 30% to 70%.

In addition, it is preferable to perform corona discharge until the resin layer of desired thickness is obtained. Specifically, it is preferably performed for 10 to 100 seconds. Polymerization for too long is not preferred because the amount of monomer homopolymer increases.
Any commercially available apparatus can be used for the atmospheric pressure corona discharge part, and among them, Plasmastream PSC1002 manufactured by Pearl Industry Co., Ltd. can be suitably used.

Next, the obtained plasma flow is irradiated to the resin substrate as the object to be processed by the plasma flow irradiation unit, and the monomer is graft-polymerized with the resin on the surface of the resin substrate, so that the resin derived from the monomer on the resin substrate surface. Form a layer.
The plasma flow irradiation part usually has the shape of a nozzle, and the shape of the discharge port at the tip thereof can be deformed according to the desired resin layer formation speed, the shape of the resin layer, etc., circular, elliptical, square Any shape such as a rectangle may be used. Further, a plurality of plasma flow irradiation units may be connected to the normal pressure corona discharge unit in accordance with the shape and size of the resin substrate.

Further, the plasma flow irradiation unit may be freely movable so that a desired position of the resin substrate can be irradiated with the plasma flow. By being movable, the resin layer can be continuously formed at a desired position of the resin substrate and / or on the resin substrate.
Further, the plasma flow from the plasma flow irradiation unit may flow directly or indirectly. The flow rate of the plasma flow is usually preferably 10 to 150 L / min, more preferably 10 to 100 L / min, although it depends on the corona discharge conditions.

  Moreover, the resin base | substrate may be hold | maintained at the holder at the time of plasma flow irradiation. The configuration of the holder is not particularly limited as long as it can hold the resin substrate. Further, the holder may have a function of transporting the resin substrate. By having the transport function, the resin layer can be continuously formed at a desired position of the resin substrate and / or on the resin substrate. Specifically, a belt conveyor can be used.

  Furthermore, the holder may be provided with a heating and cooling means for the resin base as required. The temperature of the polymerization system during corona discharge is usually room temperature (about 25 ° C.). However, depending on the type of monomer used, it may be preferable to heat and cool the polymerization system. By providing the heating and cooling means, the temperature can be easily adjusted. For example, when using a monomer having a high boiling point, it is preferable to maintain the gas phase by heating.

  Further, when the resin substrate is a film, a plasma flow irradiation unit may be installed in a path for moving the resin substrate from the untreated resin substrate winding roll to the treated resin substrate winding roll. In this case, the mounting tool for the resin base is not necessary, and the holder is a core material for the roll.

  An example of the manufacturing apparatus of the present invention is shown in FIG. The apparatus of FIG. 1 is provided with the mounting tool 5 which mounts the mixed gas production | generation part 1, the atmospheric pressure corona discharge part 2, the plasma flow irradiation part 3, and the resin base | substrate 4. FIG. In FIG. 1, the normal pressure corona discharge unit 2 and the plasma flow irradiation unit 3 are integrated. However, the present invention is not limited to this, and the plasma flow irradiation unit provided with a plasma flow separately from the normal pressure corona discharge unit 2 is provided. 3 may be introduced.

The mixed gas generation unit 1 includes an inert gas supply device 6 and a monomer gas supply device 7. The mixed gas generation unit 1 may be provided with a flow meter and a flow rate control function so that these gases can be supplied in a constant amount.
The normal pressure corona discharge unit 2 includes a device main body 8 equipped with an AC power source, a transformer, and the like, and a discharge unit 10 connected to the device main body 8. A mixed gas is supplied from the mixed gas generator 1 to the discharge unit 10.

A gas outlet 11 is opened at the lower end surface of the discharge unit 10, and a pair of electrodes 12 are symmetrically arranged on both sides of the gas outlet. When a pulse voltage is applied to the pair of electrodes 12, corona discharge occurs between the electrodes. A plasma flow generated by corona discharge can be irradiated from the gas outlet 11.
The gas outlet 11 of the plasma flow irradiation unit 3 can be freely moved in the direction of the surface of the resin substrate by a driving device (not shown).
The mounting tool 5 is a belt conveyor type device and has a transport function capable of transporting the resin base 4 in the left-right direction with respect to the paper surface.

  A method for forming a resin layer on the resin substrate 4 using the apparatus of FIG. 1 will be described. First, the resin base 4 is placed on the mounting tool 5. Next, a voltage is applied to the electrode 12 from the apparatus body 8 to cause corona discharge. Next, a plasma flow is formed by flowing the mixed gas from the mixed gas generation unit 1 to the atmospheric pressure corona discharge unit 2. By irradiating the surface of the resin base material 4 with a plasma flow and forming radicals on the vapor plasma of the monomer and the resin substrate 4, the radicals and the monomer of the resin substrate 4 are graft-polymerized to form a resin layer.

  In addition to the manufacturing apparatus of FIG. 1, the manufacturing apparatus shown in FIGS. These apparatuses are provided with a plurality of pairs of atmospheric pressure corona discharge units 2 and plasma flow irradiation units 3. In these figures, configurations other than the normal pressure corona discharge unit 2, the plasma flow irradiation unit 3, and the resin substrate 4 are omitted, but a mixed gas generation unit is connected to the normal pressure corona discharge unit. Specifically, in FIG. 2, two sets of the atmospheric pressure corona discharge unit 2 and the plasma flow irradiation unit 3 are provided for the resin base 4, and three sets are provided in FIG. 4. FIG. 3 is a schematic cross-sectional view taken along line AA in FIG. If an apparatus having the structure shown in these figures is used, a resin layer can be easily formed on the surface of the resin substrate even if the shape of the resin substrate is complicated.

The surface-coated resin substrate obtained by the apparatus of the present invention has a very good surface condition because the resin layer on the surface thereof contains few monomer homopolymers. Moreover, since there are few homopolymers, the adhesiveness of the resin layer itself to the resin substrate is very good.
The thickness of the resin layer is not particularly limited, but is preferably 10 μm or less from the viewpoint of suppressing the generation of a homopolymer. A more preferable thickness is 0.01 μm to 1 μm.

  Furthermore, since the surface-coated resin substrate has the above-mentioned good properties, even if another thin film such as a metal film or an insulating film is formed on the resin layer, defects such as cracks are unlikely to occur in the other thin film. . Therefore, the surface-coated resin substrate can be suitably used as a material for electronic components such as flexible image display devices and flexible wiring boards.

Examples of the material for the metal film include copper, silver, and gold. Examples of the method for forming the metal film include vapor phase methods such as vapor deposition and sputtering, and liquid phase methods such as plating. As the plating method, when a conductive resin is used for the resin substrate, an electrolytic plating method can be used. Also, an electroless plating method can be used.
Examples of the material of the insulating film include polyimide. Examples of the method for forming the insulating film include heat treatment imidization.

EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited to these examples.
Example 1
A surface-coated fluororesin substrate was manufactured using the apparatus shown in FIG. In addition, for the atmospheric pressure corona discharge part 2, Plasmastream PSC1002 manufactured by Pearl Industry Co., Ltd. was used. The pair of electrodes 12 in the atmospheric pressure corona discharge part 2 is a tungsten rod of 2 mmΦ, and has the same outer shape (length 5 cm, mounting interval 3 cm, tip discharge part bent in a letter shape), and these The distance between the electrodes was 0.5 to 3 cm.

  On the mounting tool 5, a fluororesin film (Teflon PFA Film Teflon (registered trademark); PFA; length 15cm, width 10cm, thickness 0.1mm, manufactured by Deyupon) was placed as the resin base 4. Subsequently, the normal pressure corona discharge part 2 was installed so that the distance of the upper surface of a fluororesin film and the lower end surface of a discharge unit (head) might be set to about 10 mm.

  Monomer gas was supplied from the monomer gas supply device 7. Specifically, an acrylic monomer is prepared by filling a storage tank equipped with a heater with an acrylic acid monomer (special grade manufactured by Wako Pure Chemical Industries, Ltd .; 100% undiluted solution) and bubbling with Ar gas while heating to 45 ° C. Generated steam. The obtained acrylic monomer vapor is flowed at a flow rate of 3 L / min together with Ar gas as a carrier gas, and combined with an inert gas having a flow rate of 100 L / min supplied from the inert gas supply device 6 and mixed. Got gas.

  Next, a high voltage (about 12 kV) of a high frequency (20 kHz) is applied to the pair of electrodes 12 while flowing the mixed gas into the atmospheric pressure corona discharge unit 2 at a flow rate of 103 L / min, in the presence of the mixed gas. A plasma flow was obtained by generating a corona discharge. As discharge conditions other than the above, the pulse modulation frequency was 60 Hz, and the pulse duty was 50%. The fluororesin film was exposed to this plasma flow for 240 seconds. As a result, a fluororesin film whose surface was coated with a polyacrylic acid resin layer was obtained. An SEM photograph of the surface of the obtained film is shown in FIG. 5 (2000 times). An SEM photograph of the surface of the untreated film before coating with the resin layer is shown in FIG. 6 (2000 times). The SEM photograph was taken using an E-SEM-2700 manufactured by Nikon Corporation with an acceleration voltage of 15 kV.

Example 2
Resin layer of polyacrylic acid in the same manner as in Example 1 except that the fluororesin film as the resin substrate 4 is replaced with VALFLON (PTFE; length 15 cm, width 10 cm, thickness 0.1 mm) manufactured by Nippon Valqua Industries, Ltd. A fluororesin film coated with was obtained.

Example 3
The fluororesin film as the resin substrate 4 is replaced with VALFLON (PTFE; length 15 cm, width 10 cm, thickness 0.1 mm) manufactured by Nippon Valqua Industries, and 2-hydroxyethyl methacrylate is used instead of the acrylic acid monomer. A fluororesin film coated with a resin layer of poly (2-hydroxyethyl methacrylate) was obtained in the same manner as in Example 1 except that.

Example 4
The fluororesin film as the resin substrate 4 is replaced with VALFLON (PTFE; length 15 cm, width 10 cm, thickness 0.1 mm) manufactured by Nippon Valqua Industries, Ltd., except that propargyl alcohol is used instead of acrylic acid monomer. In the same manner as in Example 1, a fluororesin film coated with a resin layer of polypropargyl alcohol was obtained.

Example 5
The fluororesin film as the resin substrate 4 is replaced with VALFLON (PTFE; length 15 cm, width 10 cm, thickness 0.1 mm) manufactured by Nippon Valqua Industries, Ltd., except that glycidyl methacrylate is used instead of acrylic acid monomer. In the same manner as in Example 1, a fluororesin film coated with a resin layer of polyglycidyl methacrylate was obtained.

Comparative Example 1
The fluororesin film was exposed to the plasma flow in the same manner as in Example 1 except that no monomer gas was supplied and corona discharge was generated in an Ar gas atmosphere supplied at 10 L / min.
Thereafter, the fluororesin film was immediately immersed in an acrylic acid monomer solution (special grade manufactured by Wako Pure Chemical Industries, Ltd .; 100% stock solution) and subjected to a graft polymerization treatment for 30 minutes. As a result, a fluororesin film whose surface was coated with a polyacrylic acid resin layer was obtained. The SEM photograph of the surface of the obtained film is shown in FIG. 7 (2000 times).

Comparative Example 2
A fluororesin film whose surface was coated with a resin layer of polyacrylic acid was obtained in the same manner as in Comparative Example 1 except that the acrylic acid monomer solution was replaced with a 50 vol% aqueous solution of acrylic acid monomer.

Comparative Examples 3-4
The surface is the same as in Comparative Examples 1 and 2, except that the fluororesin film as the resin substrate 4 is changed to VALFLON (PTFE; length 15 cm, width 10 cm, thickness 0.1 mm) manufactured by Nippon Valqua Industries, Ltd. A fluororesin film coated with a polyacrylic acid resin layer was obtained.

The films obtained in Examples 1 to 5 and Comparative Examples 1 to 4 were washed with pure water, dried, and subjected to contact angle measurement, peel test, and elemental analysis as follows.

(Contact angle measurement)
The contact angles of the films of Examples 1 to 5 and Comparative Examples 1 to 4 were measured. Further, the contact angle of PFA before treatment was also measured. For the measurement of the contact angle, an automatic solid surface energy analyzer CA-VE type manufactured by Kyowa Interface Science Co., Ltd. was used. After the landing, a 1000 msec water droplet was measured and analyzed by the θ / 2 method.
In addition, wettability is so high that a contact angle is small, and it means that the other layer formed on a film is hard to peel.

(Peel test)
The peeling test (T type) of Examples 1 to 5 and Comparative Examples 1 to 4 was performed. Moreover, the peeling test of the PFA film before a process was also performed.
The peel test was performed as follows. That is, the length of a film cut out to a width of 25 mm and a length of 100 mm on an Al plate coated with an epoxy adhesive (E-set manufactured by Konishi Co., Ltd.) with a baker-type applicator (made by Tester Sangyo Co., Ltd.) at a thickness of 250 μm The 50 mm portion was bonded, and the adhesive was cured by allowing it to stand at room temperature (about 25 ° C.) for 24 hours while applying a 5N load. Thereafter, the Al plate was peeled off at a rate of 100 mm / min, and the tensile strength at that time was measured by an autograph AG-10kNG manufactured by Shimadzu Corporation.

(Elemental analysis)
Elemental analysis of Example 1 and the untreated film was performed by ESCA method using ESCA-3300 manufactured by Kratos. The measurement was performed under the conditions of an X-ray source of MgKα (1253.3 eV), an excitation voltage of 8 kV, and a current current of 30 mA.

The results of contact angle measurement, peel test, and elemental analysis are shown in Tables 1 to 3, respectively.

Table 1 shows the following.
From Examples 1 to 5 and Comparative Examples 1 to 4, the contact angle of the obtained surface-coated fluororesin film is remarkably lowered by subjecting the monomers to gas phase polymerization under plasma flow. Therefore, when another layer is laminated | stacked on this film, the adhesiveness of another layer and a film can be improved. This improvement is supported by Table 2 below.

Table 2 shows the following.
From Examples 1-5 and Comparative Examples 1-4, the tensile strength of the surface-coated fluororesin films obtained can be significantly increased by subjecting the monomers to gas phase polymerization under plasma flow. Therefore, when another layer is laminated | stacked on this film, the adhesiveness of another layer can be improved.

Table 3 shows the following.
Compared to the untreated film, the oxygen component increases and the fluorine component decreases. Therefore, it can be seen that a polyacrylic acid resin layer is formed on the film.

Moreover, according to the SEM photograph of FIGS.
It can be seen from FIG. 6 which is an unprocessed SEM photograph and FIG. 7 of Comparative Example 1 that the film of Comparative Example 1 has irregularities formed on the surface. This unevenness is formed from a homopolymer of acrylic acid monomer, and it is estimated from Tables 1 and 2 that the homopolymer deteriorates the contact angle and tensile strength. On the other hand, in FIG. 5 which is the SEM photograph of Example 1, irregularities cannot be confirmed. Therefore, it is estimated that there are very few homopolymers and most acrylic acid monomers are graft-polymerized on the film.

Example 6
It was coated with a polyacrylic acid resin layer in the same manner as in Example 1 except that the contact time with the plasma flow was 0 minute, 1 minute, 2 minutes, 3 minutes, 4 minutes, 5 minutes and 10 minutes. A fluororesin film was obtained. Note that the contact time of 0 minutes means that a substrate without a resin layer was used.
The obtained film was subjected to a peel test in the same manner as in Example 1. The obtained result is shown in FIG.
Next, a copper film was formed on the resin layer by a plating method. The formation conditions are as follows.

First, the resin layer was immersed in 40 ml of an HCl solution containing 40 g / liter of SnCl ₂ to perform a sensitizing treatment and then washed with water.
Next, the resin layer was immersed in 5 ml of an HCl solution containing 0.5 g / liter of PbCl ₂ to be activated, and then washed with water.
Furthermore, the resin layer was immersed in a 10% aqueous solution of NaOH to wash with alkali and then with water.

Next, the resin layer is applied to a plating solution containing 3.5 g / liter of CuSO ₄ , 34 g / liter of Rochelle salt, 3 g / liter of Na ₂ CO ₃ , 7 g / liter of NaOH, and 13 ml / liter of formalin (37%). It immersed in electroless copper plating by being immersed for 3 minutes.
Then, the base | substrate provided with the copper plating layer on the resin layer was obtained by attaching to water washing and drying. The copper plating layer was subjected to the same peel test as the resin layer. The results are shown in FIG. From FIG. 8, it can be seen that the resin layer and the copper plating layer obtained by contacting with the plasma flow have a high tensile strength.

It is the schematic of the manufacturing apparatus of the surface coating resin base | substrate of this invention. It is the schematic of the manufacturing apparatus of the surface coating resin base | substrate of this invention. It is the schematic of the manufacturing apparatus of the surface coating resin base | substrate of this invention. It is the schematic of the manufacturing apparatus of the surface coating resin base | substrate of this invention. 2 is a SEM photograph of the film obtained in Example 1. It is a SEM photograph of a PFA film. 2 is a SEM photograph of the film obtained in Comparative Example 1. It is a graph which shows the peeling test result of Example 6.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mixed gas production | generation part 2 Normal pressure corona discharge part 3 Plasma flow irradiation part 4 Resin base | substrate 5 Mounting tool 6 Inert gas supply apparatus 7 Monomer gas supply apparatus 8 Apparatus main body 10 Discharge unit 11 Gas jet nozzle 12 A pair of electrodes

Claims (8)

  Mixing a single or a plurality of monomer gases with an inert gas at a predetermined concentration, a mixed gas generating unit for generating a single mixed gas containing a single or a plurality of monomers having a predetermined concentration, and the mixed gas as a plasma flow An atmospheric pressure corona discharge part for converting to a resin, a holder for holding the resin substrate, and irradiating the surface of the resin substrate with the plasma flow to graft polymerize the resin and the monomer on the surface of the resin substrate. And a plasma flow irradiation unit for forming a resin layer.   The apparatus for producing a surface-coated resin substrate according to claim 1, wherein the plasma flow irradiation unit is freely movable so that a plasma flow can be irradiated to a desired position of the resin substrate.   The apparatus for producing a surface-coated resin substrate according to claim 1 or 2, wherein the holder is a resin substrate mounting device, and the mounting device has a function of conveying the resin substrate.   Single or multiple monomer gases are mixed with an inert gas at a predetermined concentration to generate a single mixed gas containing a single or multiple monomers of a predetermined concentration, and the mixed gas is converted into a plasma flow by atmospheric pressure corona discharge Then, the surface of the resin substrate is irradiated with the plasma flow, and a resin layer is formed by graft polymerization of the resin on the surface of the resin substrate and the monomer.   The corona discharge is applied to a corona discharge electrode at a frequency of an applied voltage of 1 kHz to 100 kHz, a discharge voltage of 1 kV to 20 kV, a pulse modulation frequency of 10 Hz to 200 Hz, and a pulse duty of 10% to 90%. The method for producing a surface-coated resin substrate according to claim 4, wherein   A surface-coated resin substrate obtained by the production method according to claim 4, comprising a resin substrate, a surface of the resin substrate and a graft-polymerized resin layer.   The surface-coated resin substrate according to claim 6, wherein the resin substrate is a fluororesin substrate.   Furthermore, the surface coating resin base | substrate of Claim 6 or 7 provided with the metal film formed by the plating method on the said resin layer.