JP2009164450A - Solder drawing device and method of manufacturing wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To highly accurately apply solder to a required part on a printed circuit board. <P>SOLUTION: A calculation processing part 15 calculates positions on the printed circuit board 30 of recognition marks 31 and 32 from images imaged by imaging cameras 12 and 13, calculates an expansion ratio of the printed circuit board 30 with respect to its design dimension on the basis of the calculated positions of the recognition marks 31 and 32 and recognition mark position information indicating the design positions of the recognition marks 31 and 32, corrects discharge position information indicating a design target position for solder discharge on the printed circuit board 30 on the basis of the expansion ratio, and outputs corrected discharge position information indicating a corrected target position for solder discharge to a control part 20. The control part 20 moves a dispenser 14 on the basis of the corrected discharge position information supplied from the calculation processing part 15, and controls a dispenser drive part 19 and the dispenser 14 so as to discharge the prescribed amount of solder to the corrected target position for solder discharge. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a solder drawing apparatus that draws solder by drawing on a printed board used in an electronic device or the like, and a method for manufacturing a wiring board.

  In order to mount surface mount components on a printed circuit board, it is common to mount the components by printing and applying the necessary solder paste on the printed circuit board, then heat-treating the printed circuit board to melt and resolidify the solder. Has been done.

A screen printing method is known as a technique for printing and applying a desired solder to a necessary portion on a printed board. In this screen printing method, as shown in FIG. 4, a solder paste is printed on the printed circuit board 1 through a printing mask 3 provided with openings 4 corresponding to the solder printing locations 2 on the printed circuit board 1. Desired solder application is performed (for example, refer to Patent Document 1).
JP 2006-351724 A

  In the screen printing method as described above, as shown in FIG. 5, when there is a dimensional difference due to a finishing tolerance or expansion / contraction between the printed circuit board 1 and the printing mask 3, a solder printing position mismatch occurs. This inconsistency could not be resolved.

  For example, a certain amount of error always occurs in the actual finished size of the printed circuit board. According to the JIS standard, a tolerance of ± 0.1 mm is allowed for a substrate having a substrate size of 100 mm or less. In the screen printing method, as shown in FIG. 5, the print mask 3 can be accurately aligned with a certain point of the printed circuit board 1, but the printed circuit board 1 and the print mask 3 are separated from the point. A positional deviation corresponding to the finished dimensional difference will occur.

  In recent years, the miniaturization of parts has progressed, and parts with a side dimension of about 0.3 mm and other pin parts with a lead width of about 0.25 mm have begun to be generalized. In some cases, mounting defects may occur due to misalignment.

  Some solder printing methods do not use a printing mask, such as a dispense method. In this case, the printing conditions are corrected according to the state of the printed circuit board, the viscosity of the solder paste to be printed, etc., but the correction target is the relative value between the reference point on the printed circuit board and the print data reference point similar to the screen printing method. This is control of the number of times of ejection for optimizing the position and the amount of printed solder, and adjustment of the ejection position according to the control, and print position correction is not performed in consideration of the finished dimensions of each printed circuit board.

  The present invention has been made in view of the above, and an object of the present invention is to provide a solder drawing apparatus and a method of manufacturing a wiring board that can apply solder to a necessary portion on a printed board with high accuracy.

  In order to achieve the above object, a solder drawing apparatus according to the present invention is a solder drawing apparatus that draws solder on a substrate and draws the solder in a first direction and a second direction orthogonal to the first direction. Imaging means for imaging the substrate on which a plurality of recognition marks are arranged separately from each other; calculation means for calculating positions on the substrate of the plurality of recognition marks from images captured by the imaging means; Calculated by the calculating means, storage means for storing recognition mark position information indicating the design position of the recognition mark on the substrate and discharge position information indicating the designed solder discharge target position on the substrate. Based on the recognized mark position and the recognized mark position information stored in the storage means, the expansion / contraction ratio in the first and second directions with respect to the design dimension of the substrate is calculated. Correction means for correcting the discharge position information based on the expansion / contraction ratio to generate corrected discharge position information indicating the corrected solder discharge target position, discharge means for discharging solder onto the substrate, and Drive means for moving the discharge means, and control means for causing the discharge means to move the discharge means based on the corrected discharge position information and causing the discharge means to discharge solder to the corrected solder discharge target position. It is characterized by providing.

  The method for manufacturing a wiring board according to the present invention is a method for manufacturing a wiring board having a step of drawing solder by drawing on the board, and includes a first direction and a second direction orthogonal to the first direction. Imaging the substrate on which a plurality of recognition marks are arranged apart from each other in a direction, calculating a position of the plurality of recognition marks on the substrate from the captured images, and calculating the plurality of calculated Based on the position of the recognition mark on the substrate and the recognition mark position information indicating the design position of the plurality of recognition marks on the substrate, the first and second directions with respect to the design dimension of the substrate A step of calculating an expansion / contraction ratio, and correcting the discharge position information indicating the designed solder discharge target position on the substrate based on the calculated expansion / contraction ratio, and correcting the solder discharge target position Generating a correction discharging position information indicating, on the basis of the corrected ejection position information, characterized by comprising a step of discharging the solder on the corrected solder discharge target position.

  According to the present invention, it is possible to apply solder to a necessary portion on a printed circuit board with high accuracy.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic configuration diagram of a solder drawing apparatus according to an embodiment of the present invention. As shown in FIG. 1, the solder drawing apparatus 10 according to the present embodiment includes a guide rail 11, imaging cameras 12 and 13, a dispenser 14, an arithmetic processing unit 15, a storage unit 16, and an imaging camera drive unit 17. , 18, a dispenser driving unit 19, and a control unit 20.

  The guide rail 11 has a stopper 21, and positions and holds the printed circuit board 30 conveyed by a conveyance mechanism (not shown) by the stopper 21.

  The pair of imaging cameras 12 and 13 are provided above the printed circuit board 30 held on the guide rail 11, and are parallel to the printed circuit board 30 and perpendicular to the X direction that is the extending direction of the guide rail 11. It is configured to be movable in the Z direction orthogonal to the direction and both the X direction and the Y direction. The imaging cameras 12 and 13 image the printed circuit board 30 held in a state of being positioned on the guide rail 11.

  The dispenser 14 is provided above the printed circuit board 30 held by the guide rail 11 so as to be movable in the X, Y, and Z directions. The dispenser 14 has a nozzle 22 at the tip thereof, and is attached to the printed circuit board 30 through the nozzle 22. Dispense the solder paste toward.

  The arithmetic processing unit 15 calculates the positions on the printed circuit board 30 of the recognition marks 31 and 32 arranged on the printed circuit board 30 from the images supplied from the imaging cameras 12 and 13.

  The arithmetic processing unit 15 also determines the X direction and the design dimension of the printed circuit board 30 based on the calculated positions of the recognition marks 31 and 32 and the recognition mark position information indicating the design positions of the recognition marks 31 and 32. A correction discharge position indicating the corrected solder discharge target position by calculating the expansion ratio in the Y direction and correcting the discharge position information indicating the designed solder discharge target position on the printed circuit board 30 based on the expansion ratio. Generate information.

  The storage unit 16 includes board design information including recognition mark position information indicating design positions of the recognition marks 31 and 32 on the printed circuit board 30 and discharge position information indicating design solder discharge target positions on the printed circuit board 30. Is stored in advance.

  The imaging camera driving units 17 and 18 move the imaging cameras 12 and 13, respectively, under the control of the control unit 20.

  The dispenser driving unit 19 moves the dispenser 14 under the control of the control unit 20.

  The control unit 20 controls driving of the imaging camera driving units 17 and 18. Further, the control unit 20 moves the dispenser 14 based on the corrected discharge position information supplied from the arithmetic processing unit 15, and dispenses a predetermined amount of solder to the corrected solder discharge target position. And controls the dispenser 14.

  Next, the operation of the solder drawing apparatus 10 will be described with reference to the flowchart shown in FIG.

  When the printed circuit board 30 is transported by a transport mechanism (not shown) and positioned and held by the stopper 21 on the guide rail 11, the imaging cameras 12 and 13 capture the printed circuit board 30 in step S10, and the obtained image is obtained. Is output to the arithmetic processing unit 15. At the time of this imaging, the control unit 20 controls the imaging camera driving units 17 and 18 based on the recognition mark position information stored in the storage unit 16 to design the recognition marks 31 and 32 on the printed circuit board 30. The imaging cameras 12 and 13 are moved to the positions in the upper X direction and the Y direction and the position in the Z direction optimal for imaging.

  Next, in step S <b> 20, the arithmetic processing unit 15 determines the positions of the recognition marks 31 and 32 on the printed circuit board 30 of the recognition marks 31 and 32 arranged on the printed circuit board 30 from the images supplied from the imaging cameras 12 and 13. Is calculated.

  Here, the recognition marks 31 and 32 are arranged on the printed circuit board 30 so as to be separated from each other in the X direction and the Y direction. For example, as shown in FIG. It is arranged near the vertex of.

  As the positions of the recognition marks 31 and 32, the coordinates of the center of gravity of the recognition marks 31 and 32 are calculated with the origin at the lower left apex of the printed board 30 positioned on the guide rail 11 by the stopper 21.

Here, as shown in FIG. 3, assuming that the calculated position of the recognition mark 31 is (X ₁ , Y ₁ ) and the position of the recognition mark 32 is (X ₂ , Y ₂ ), in step S30, the arithmetic processing unit 15 Calculates a dimension D _X = X ₂ −X ₁ in the X direction between the recognition marks 31 and 32 and a dimension D _Y = Y ₂ −Y ₁ in the Y direction.

Also, if the design positions of the recognition marks 31 and 32 included in the recognition mark position information stored in the storage unit 16 are (X ₁ ′, Y ₁ ′) and (X ₂ ′, Y ₂ ′), respectively, The arithmetic processing unit 15 has a design dimension _{X X} '= X ₂ ' -X ₁ 'between the recognition marks 31 and 32, and a design dimension _{Y Y} ' = Y ₂ '-Y _{1 in} the Y direction. 'Is calculated.

Next, in step S <b> 30, the arithmetic processing unit 15 determines the dimensions D _X and D _{Y in} the X and Y directions between the recognition marks 31 and 32 and the designed dimensions D _X and Y directions between the recognition marks 31 and 32. ', _{D Y'} difference between _{ΔD X = D X -D X '} , ΔD Y = D Y -D Y' is calculated.

Next, in step S40, the arithmetic processing unit 15 determines whether or not at least one of ΔD _X and ΔD _Y is equal to or greater than a predetermined threshold value. [Delta] D _X, at least one of the [Delta] D _Y is, if a predetermined threshold value or more (step S40: YES), the process proceeds to step S50, [Delta] D _X, if both [Delta] D _Y is smaller than the predetermined threshold value (step S40: NO) Proceed to step S60.

In step S <b> 50, the arithmetic processing unit 15 calculates the X-direction expansion / contraction ratio D _X / D _X ′ and the Y-direction expansion / contraction ratio D _Y / D _Y ′ with respect to the design dimension of the printed circuit board 30. And the arithmetic processing part 15 correct | amends the discharge position information memorize | stored in the memory | storage part 16 based on the calculated expansion / contraction rate, and produces | generates the correction | amendment discharge position information which shows the corrected solder discharge target position.

Here, the discharge position information stored in the storage unit 16 is information indicating the coordinates of the designed solder discharge target position on the printed circuit board 30 with the lower left vertex of the printed circuit board 30 positioned by the stopper 21 as the origin. It is. The arithmetic processing unit 15 multiplies the X and Y coordinates of the solder discharge target position in this design by the expansion and contraction rates D _X / D _X 'and D _Y / D _Y ' in the X and Y directions, respectively. The coordinates of the discharge target position are calculated, and the corrected discharge position information indicating the corrected solder discharge target position is output to the control unit 20. When only one of ΔD _X and ΔD _Y is equal to or greater than a predetermined threshold, for example, when only ΔD _X is equal to or greater than the predetermined threshold, the solder discharge target position may be corrected only in the X direction.

  Next, in step S <b> 60, when the control unit 20 receives the corrected discharge position information from the arithmetic processing unit 15, the dispenser 14 is assigned to each of the solder discharge target positions corrected by the dispenser driving unit 19 based on the corrected discharge position information. Are sequentially moved, and a predetermined amount of solder is discharged to the positions via the nozzle 22 by the dispenser 14. In this way, the solder paste is drawn on the printed circuit board 30.

When both ΔD _X and ΔD _Y are smaller than the predetermined threshold (step S40: NO), the control unit 20 controls the dispenser driving unit 19 and the dispenser 14 using the discharge position information stored in the storage unit 16. Then, a predetermined amount of solder is discharged to a designed solder discharge target position.

  In this way, the solder paste is applied on the printed circuit board 30. Thereafter, the components are mounted on the printed circuit board 30 to which the solder paste is applied, the printed circuit board 30 is heated by a reflow furnace to melt the solder paste, and then cooled, so that the solder paste is once melted and solidified. The component is mounted on the surface of the printed circuit board 30.

  As described above, according to the present embodiment, the expansion / contraction ratio with respect to the design dimension of the printed circuit board 30 to be actually drawn is calculated, and the solder paste is discharged to the solder discharge target position corrected using the expansion / contraction ratio. Therefore, it is possible to apply the solder to the necessary portion on the printed circuit board 30 with high accuracy. This also enables high-quality component mounting.

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the components without departing from the scope of the invention in the implementation stage. Various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiments.

  For example, in the solder drawing apparatus 10 according to the above-described embodiment, an example in which the two imaging cameras 12 and 13 and the imaging camera driving units 17 and 18 that move them are provided has been described. However, the imaging camera 13 and the imaging camera driving unit 18 are provided. The recognition marks 31 and 32 may be sequentially imaged by one imaging camera 12 and the imaging camera drive unit 17.

  In addition, when the design positions of the recognition marks 31 and 32 on the printed circuit board 30 to be drawn are within a predetermined range in advance, or a region is defined by a plurality of imaging cameras regardless of the positions of the recognition marks 31 and 32. If the image is shared, it is not necessary to provide a mechanism for moving the imaging camera. Further, if an imaging camera having a sufficiently large viewing angle with respect to the size of the printed circuit board 30 is used, the number of imaging cameras may be one and a mechanism for moving the imaging camera may not be provided.

1 is a schematic configuration diagram of a solder drawing apparatus according to an embodiment of the present invention. It is a flowchart which shows operation | movement of the solder drawing apparatus shown in FIG. It is a top view of a printed circuit board. It is a figure for demonstrating a screen printing system. It is a figure for demonstrating the position shift of the printed circuit board and printing mask in a screen printing system.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Solder drawing apparatus, 11 ... Guide rail, 12, 13 ... Imaging camera, 14 ... Dispenser, 15 ... Arithmetic processing part, 16 ... Memory | storage part, 17, 18 ... Imaging camera drive part, 19 ... Dispenser drive part, 20 ... Control part, 21 ... stopper, 22 ... nozzle, 30 ... printed circuit board, 31, 32 ... recognition mark.

Claims (2)

A solder drawing apparatus that draws solder by drawing on a substrate,
Imaging means for imaging the substrate on which a plurality of recognition marks are arranged separately in a first direction and a second direction orthogonal to the first direction;
Calculation means for calculating positions of the plurality of recognition marks on the substrate from images picked up by the image pickup means;
Storage means for storing recognition mark position information indicating design positions on the substrate of the plurality of recognition marks, and discharge position information indicating design solder discharge target positions on the substrate;
Based on the recognition mark position calculated by the calculation means and the recognition mark position information stored in the storage means, the expansion / contraction ratio in the first and second directions with respect to the design dimension of the substrate is calculated, and this Correcting means for correcting the discharge position information based on an expansion / contraction ratio and generating corrected discharge position information indicating the corrected solder discharge target position;
Discharging means for discharging solder onto the substrate;
Drive means for moving the discharge means;
A solder drawing apparatus comprising: a control unit that moves the ejection unit by the driving unit based on the corrected ejection position information, and causes the ejection unit to eject solder to the corrected solder ejection target position. . A method of manufacturing a wiring board having a step of drawing solder by drawing on a board,
Imaging the substrate on which a plurality of recognition marks are arranged apart from each other in a first direction and a second direction orthogonal to the first direction;
Calculating the positions of the plurality of recognition marks on the substrate from the captured images;
Based on the calculated positions of the plurality of recognition marks on the substrate and recognition mark position information indicating design positions of the plurality of recognition marks on the substrate, the first relative to the design dimensions of the substrate. And calculating the expansion / contraction ratio in the second direction;
Correcting the discharge position information indicating the designed solder discharge target position on the substrate based on the calculated expansion / contraction ratio, and generating corrected discharge position information indicating the corrected solder discharge target position;
And a step of discharging solder to the corrected solder discharge target position based on the corrected discharge position information.

Images