JP2009158656A - Light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device capable of securing high reliability even when using a fluorocarbon resin as a sealer instead of a silicone resin. <P>SOLUTION: The light-emitting device 10 includes a base 13 on which a protective element 11 and a light-emitting element 12 are mounted, and a resin sealing portion 14 sealing them. The resin sealing portion 14 includes a first resin sealing portion 14a sealing the light-emitting element 12 and a second resin sealing portion 14b provided between the first resin sealing portion 14a and the outside. The first resin sealing portion 14a is formed of a fluorocarbon resin having a fluorinated polyether skeleton cured in a gel state, and a silicon bridging terminal group. The second resin sealing portion 14b is formed of a fluorocarbon resin having a fluorinated polyether skeleton cured in a rubber state, and a silicon bridging terminal group. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a light emitting device including a light emitting element formed by stacking semiconductors, a base on which the light emitting element is mounted, and a resin sealing portion formed of a fluorine-based resin that seals the light emitting element. .

  When used as a light emitting device mounted on a substrate such as a substrate, a light emitting element formed by stacking semiconductors is sealed with a sealing material for the purpose of protecting the light emitting element. As the sealing material, silicone resin or the like is widely used. However, since the silicone resin has high hygroscopicity, it absorbs moisture in the atmosphere. This moisture has a bad influence such as causing leakage of the light emitting element by reaching the light emitting element. In addition, the silicone resin may be deteriorated by strong ultraviolet rays to be cracked or broken under an environment irradiated with sunlight or the like.

  Therefore, Patent Document 1 describes a light emitting device that employs a fluorine resin having a low hygroscopic property and a high weather resistance as a sealing material instead of a silicone resin. The light-emitting element (light-emitting device) disclosed in Patent Document 1 is obtained by sealing an LED chip (light-emitting element) with a fluorine-based resin having visible light transmittance. The fluorine-based resin facilitates the sealing process. Describes that it is desirable to use a fluororesin in a solution in a solvent.

  However, when a fluorine-based resin dissolved in a solvent is used as a sealing material, the solvent volatilizes during curing and a large volume change occurs. Therefore, when the resin sealing portion for sealing the light emitting element is formed thickly, Cracks occur and can only be formed with a thin film such as a coating material. Therefore, the fluorine-based resin as described in Patent Document 1 is not suitable as a sealing material that requires a certain thickness.

For example, a fluororesin that cures in a gel form is not dissolved in a solvent, so there is little volume change when it is cured. Therefore, the resin sealing part which has low hygroscopic property and weather resistance can be formed by using the fluorine resin hardened | cured in gel form as a sealing material.
JP 2003-8073 A

  However, since the cured gel-like fluorine-based resin has high viscoelasticity with sticky stickiness derived from the gel state, it is difficult to remove when surrounding dust or dust adheres to the surface. Therefore, the gel-like fluorine-based resin may be used only for sealing the semiconductor element. However, when the sealing material for sealing the light emitting element is used, the dust adhering to the surface of the resin sealing portion is used. There is a risk of lowering brightness due to dust and dust. In this case, the gel-like fluorine-based resin has good low hygroscopicity and weather resistance as a sealing material in place of the silicone resin, but it does not take advantage of its properties and is reliable as a light emitting device. Will be low.

  In view of the above, an object of the present invention is to provide a light-emitting device that can ensure high reliability even when a fluorine resin instead of a silicone resin is used as a sealing material.

  In the light emitting device of the present invention, the resin sealing portion that seals the light emitting element mounted on the base includes the first resin sealing portion formed of a gel-like fluororesin covering the entire periphery of the light emitting element, It is provided with the 2nd resin sealing part which has the light transmittance provided between 1 resin sealing part and the exterior, It is characterized by the above-mentioned.

  In the present invention, even if the first resin sealing portion has viscoelasticity, the second resin sealing portion can prevent dust and dirt from directly attaching to the first resin sealing portion. High reliability can be ensured even if a fluorine-based resin instead of a silicone resin is used as the sealing material.

  According to a first aspect of the present invention, there is provided a light emitting device including a light emitting element formed by stacking semiconductors, a substrate on which the light emitting element is mounted, and a resin sealing portion for sealing the light emitting element. The portion includes a first resin sealing portion formed of a gel-like fluorine-based resin that covers the entire periphery of the light emitting element, and a second resin having a light transmission property provided between the first resin sealing portion and the outside. And a sealing portion.

  As a resin sealing portion for sealing the light emitting element, a second resin sealing portion having light transmittance is provided between the first resin sealing portion formed of gel-like fluorine-based resin and the outside. Even if it is the 1st resin sealing part which has viscoelasticity, it can suppress by a 2nd resin sealing part that dust and dust will adhere directly to the 1st resin sealing part.

  The second invention of the present application is characterized in that, in the first invention, the second resin sealing portion is formed of a rubber-like fluorine-based resin having a fluorinated polyether skeleton and a silicone crosslinking terminal group. It is.

  Although the rubber-like fluororesin having a fluorinated polyether skeleton and a silicone cross-linking terminal group has elasticity when cured, its surface has lower viscoelasticity than the gel-like fluororesin, so that the second resin sealing portion This makes it difficult for dust and dirt to adhere to the surface. Therefore, the rubber-like fluorine-based resin can also function as a cover for the first resin sealing portion.

  According to a third invention of the present application, in the first invention, the second resin sealing portion is formed of a glass plate.

  The second resin sealing portion can also be a glass plate. If it is a glass plate, it has low hygroscopicity and weather resistance and is hard, so it is difficult for dust and dirt to adhere to the surface. Accordingly, the glass plate can also function as a cover for the first resin sealing portion.

  According to a fourth invention of the present application, in any one of the first to third inventions, the first resin sealing portion is formed of a fluorinated resin having a fluorinated polyether skeleton and a silicone crosslinking terminal group. It is a feature.

  The gel-like fluorine-based resin of the first resin sealing portion can be a fluorine-based resin having a fluorinated polyether skeleton and a silicone crosslinking terminal group. Since this fluororesin that cures in a gel form is not dissolved in a solvent, there is little volume change when it is cured. Therefore, the 1st resin sealing part which has low moisture absorption and weather resistance can be formed by using as a sealing material.

(Embodiment 1)
A light emitting device according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of a light emitting device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the light emitting device shown in FIG. FIG. 3 is a circuit diagram of the light emitting device shown in FIG. 4 is a cross-sectional view of a light-emitting element used in the light-emitting device shown in FIG.

  As shown in FIGS. 1 and 2, the light emitting device 10 includes a protection element 11, a light emitting element 12, a base 13, and a resin sealing portion 14.

  The protective element 11 has a light emitting element 12 conductively mounted on the upper surface cathode electrode 11a and the upper surface anode electrode 11b, and a p type semiconductor region is formed on a part of an n type silicon substrate so that an excessive voltage is not applied to the light emitting element 12. Zener diode provided with FIG. 3 shows a circuit diagram in a state where the light emitting element 12 is mounted on the protective element 11. In the first embodiment, the protective element 11 is the Zener diode Z. However, a diode, a capacitor, a resistor, a varistor, or a printed wiring board in which a wiring pattern is formed on an insulating substrate may be used. The protection element 11 is supplied with power by a bottom electrode (not shown) and a wire 15.

  The light emitting element 12 can be, for example, an LED that emits blue light as shown in FIG. In the light emitting element 12, an n layer 12b, a light emitting layer 12c, and a p layer 12d are sequentially stacked on a substrate 12a. An n-side electrode 12e is formed on the n layer 12b, and a reflective electrode 12f and a p-side electrode 12g are formed on the p layer 12d.

  The substrate 12a is formed of n-type GaN, which is a gallium nitride semiconductor, and is formed in a substantially rectangular parallelepiped shape with a side of about 1 mm and a thickness of 200 μm in plan view.

  The n layer 12b is an n-type semiconductor layer formed by laminating GaN, AlGaN or the like on the substrate 12a and having a layer thickness of 0.5 μm to 5 μm. It is also possible to provide a buffer layer made of GaN, InGaN or the like between the n layer 12b and the substrate 12a.

  The light emitting layer 12c has a thickness of 0.001 μm to 0.005 μm for InGaN or the like as a well layer and a thickness of 0.005 μm to 0.02 μm for a GaN or the like as a barrier layer. They are stacked with multiple quantum well structures stacked alternately.

  The p layer 12d is a p-type semiconductor layer formed by laminating AlGaN on the light emitting layer 12c and having a layer thickness of 0.05 μm to 0.5 μm.

  The n-side electrode 12e is formed by laminating the light-emitting layer 12c and the p-layer 12d on the n-layer 12b and then removing the light-emitting layer 12c, the p-layer 12d, and a part of the n-layer 12b by dry etching. It is formed on the n layer 12b exposing the region for forming 12e.

  The reflective electrode 12f is formed of Ag on the p layer 12d and reflects light from the light emitting layer 12c to the substrate 12a. The reflective electrode 12f may be a multilayer including an Ag layer in order to improve contact with the p layer 12d and the p-side electrode 12g.

  The p-side electrode 12g is formed on the reflective electrode 12f. The light emitting element 12 configured as above is flip-chip mounted so that the n-side electrode 12e is conductively mounted on the upper surface cathode electrode 11a of the protective element 11 and the p-side electrode 12g is electrically mounted on the upper surface anode electrode 11b with the upper and lower sides reversed. ing.

  As shown in FIGS. 1 and 2, the base body 13 is provided with a recess 13b in a base body 13a formed in a rectangular parallelepiped shape, and the protection element 11 and the light emitting element 12 are mounted on the bottom of the recess 13b. The base 13 is provided with a bottom cathode electrode 13v and a bottom anode electrode 13w formed of a metal film on the bottom surface of the base body 13a. The bottom cathode electrode 13v is conductively connected to the wire connection pattern 13s on the mounting surface B1 of the base body 13a on which the protection element 11 is mounted via the through-hole wiring 13x. The bottom anode electrode 13w is conductively connected to the die bonding connection pattern 13t on the mounting surface B1 connected to the protection element 11 through the through-hole wiring 13y.

  The inner peripheral wall surface of the recess 13b of the base body 13a is formed on the reflection surface 13c whose opening area gradually increases as it goes in the traveling direction of light from the light emitting element 12. Here, the reflection surface 13c of the base 13 will be described in detail.

  The base body 13a can be formed of Amodel (registered trademark), which is a polyphthalamide resin, for example. When the base body 13a is made of polyphthalamide resin, the reflective surface 13c, which is the inner peripheral wall surface of the recess 13b, is a silicon dioxide film, or a two-layer film in which a silicon dioxide film is formed on an aluminum film or a silver film. It can be a close contact surface.

  The base body 13a can be made of ceramic in addition to polyphthalamide resin. When the base body 13a is made of ceramic, the reflective surface 13c is made of a silicon dioxide film or a two-layer film in which a silicon dioxide film is formed on a silver film. It can be a surface.

  When the reflecting surface 13c is a silicon dioxide film, it can be formed by sputtering. The aluminum film or the silver film can be formed by vapor deposition.

  The resin sealing portion 14 includes a first resin sealing portion 14a and a second resin sealing portion 14b.

  The 1st resin sealing part 14a is formed with the hardened gel-like fluororesin, and is sealing by covering the whole circumference | surroundings of the light emitting element 12. FIG. The first resin sealing portion 14a contains silicon dioxide as a viscosity adjusting material. The first resin sealing portion 14a can be formed by filling the recess 13b with a fluorine-based resin by a potting method. This gel-cured fluorine-based resin can be a fluorine-based resin having a fluorinated polyether skeleton and a silicone crosslinking terminal group, and is used by “SHIN-ETSU SIFEL (registered trademark)” manufactured by Shin-Etsu Chemical Co., Ltd. it can.

  In the first embodiment, the first resin sealing portion 14a contains a phosphor 14x (not shown in FIG. 1) that is excited by light from the light emitting element 12 and converts the wavelength. Since the light emitting element 12 emits blue light, if the phosphor 14x emits light of yellow which is a complementary color of blue, the first resin sealing portion 14a emits white by mixing blue and yellow. Can be made. As the phosphor 14x, a silicate phosphor or a YAG phosphor can be used.

  The 2nd resin sealing part 14b is provided between the 1st resin sealing part 14a and the exterior by arrange | positioning as a cover on the 1st resin sealing part 14a. For example, a silicone resin can be used for the second resin sealing portion 14b as long as it is not sticky and sticky when cured. When the second resin sealing portion 14b is formed of a silicone resin, there is no problem because the light emitting element 12 is sealed by the first resin sealing portion 14a even if it contains moisture due to hygroscopicity. However, since the silicone resin has low weather resistance as described above, it is still not preferable as a sealing material for forming the second resin sealing portion 14b.

  Therefore, it is desirable that the second resin sealing portion 14b be a fluorinated resin having a fluorinated polyether skeleton and a silicone cross-linking end group that is hardened into a harder rubber than a gel. “SHIN-ETSU SIFEL” manufactured by Shin-Etsu Chemical Co., Ltd. can be used as the rubber-like fluororesin that forms the second resin sealing portion 14b. This rubber-based curable resin has low hygroscopicity and weather resistance.

  Moreover, the 2nd resin sealing part 14b may be formed by forming into a film on the 1st resin sealing part 14a using the fluorine resin melt | dissolved in the solvent described in patent document 1 as a coating material. . When using a fluororesin in which the second resin sealing portion 14b is dissolved in a solvent, it may be thinner than the first resin sealing portion 14a, so that the thickness does not affect the volume change when cured. Is desirable. Furthermore, a glass plate can also be used as the second resin sealing portion 14b. When the second resin sealing portion 14b is a glass plate, a disk-shaped glass plate is fitted on the first resin sealing portion 14a formed in advance, and is fixed with an adhesive, thereby fixing the second resin sealing portion. 14b can be formed.

  Here, the fluororesin that hardens into a harder rubber than a gel means a resin having a hardness that can be measured with a JIS 6253 type A spring hardness tester. For example, if it is a hard fluororesin having a hardness of 10 or more, it can be measured with a spring hardness tester. Moreover, it has the hardness which can be measured with the durometer A (made by Shore Co.) prescribed | regulated by ASTM (American Society for Testing and Materials). Also, a fluororesin of 45 or more with a durometer D that is harder than a fluororesin that cures in a rubber-like manner or a fluororesin that can be measured with a durometer D has a lower viscoelasticity than a rubber-like one, and can be adopted. Is possible.

  In the form of a fluorinated resin and rubber that harden into a gel having a fluorinated polyether skeleton and a silicone cross-linking end group that form the resin sealing portion 14 (first resin sealing portion 14a, second resin sealing portion 14b) Since the fluorinated resin to be cured is solvent-free, there is little change in volume even when the resin is cured. Therefore, even if the resin sealing portion 14 is formed by the potting method, cracks and cracks do not occur. Suitable as a stop material.

  However, since the first resin sealing portion 14a formed of the cured gel-like fluorine-based resin has high viscoelasticity with a sticky sticky surface derived from the gel state, the resin sealing portion If only the first resin sealing portion 14a is formed as 14 and the surface of the first resin sealing portion 14a is exposed, there is a risk of lowering of luminance due to dust and dirt adhering to the surface. In the light emitting device 10 according to the first embodiment, the second resin sealing portion 14b formed of a rubber-like fluorine-based resin cured on the first resin sealing portion 14a or a glass plate is provided. The rubbery fluororesin is an elastic body that is elastic even in a cured state, but its surface has low adhesiveness. Moreover, since it is hard if it is a glass plate, adhesiveness is still lower. Accordingly, since the second resin sealing portion 14b has lower viscoelasticity than the first resin sealing portion 14a, even if the second resin sealing portion 14b is exposed to the outside, dust or dirt is present on the surface. Hard to adhere.

  By the way, since the gel-like fluororesin forming the first resin sealing portion 14a has high adhesion to the base body 13a formed of polyphthalamide resin, the first resin sealing portion 14a is attached to the base body 13a. Firmly fix. However, the rubber-like fluororesin forming the second resin sealing portion 14b has low adhesion with the base body 13a formed of polyphthalamide resin. In the light emitting device 10 according to Embodiment 1 of the present invention, since the silicon dioxide film is provided on the inner peripheral wall surface (reflective surface 13c) of the recess 13b provided in the base body 13a, the second resin sealing Adhesion between the portion 14b and the base 13 can be ensured. Therefore, the first resin sealing portion 14a is exposed when the second resin sealing portion 14b is peeled off from the base 13, and the brightness is reduced due to dust or dirt adhering to the surface of the first resin sealing portion 14a. Can be prevented.

  In addition to the silicon dioxide film as the reflecting surface 13c, a two-layer film in which a silicon dioxide film is formed on an aluminum film or a silver film, or when the base body 13a is ceramic, no film is applied. Even if the ceramic of the base body 13a is used as the boundary surface as it is, it acts as a close contact surface with the second resin sealing portion 14b, so that it is possible to ensure the close contact with the resin sealing portion 14.

  Further, when the adhesion surface is made of a silicon dioxide film, it becomes a substantially transparent film. Therefore, an aluminum film or a silver film is formed on the substrate body 13a made of polyphthalamide resin or ceramic, and a silicon dioxide film is further formed. Thus, it is possible to ensure reflectivity while ensuring adhesion. When formed of an aluminum film, the reflectance is inferior to that of a silver film, but it is inexpensive, so there is also a cost advantage. Moreover, when a silicon dioxide film is formed on the base body 13a formed of white ceramic, it is possible to ensure adhesion with the resin sealing portion 14 while taking advantage of the reflectivity of the base body 13a itself.

  In the light emitting device 10 according to the first embodiment, only the inner peripheral wall surface of the recess 13b is used as a close contact surface. However, the electrode on which the protective element 11 is mounted is a boundary surface with the resin sealing portion 14. A silicon dioxide film or the like may be applied to the bottom of the recess 13b except for the close contact surface. In addition, when the second resin sealing portion 14b is made of a glass plate without being formed of a rubber-based fluororesin, it is possible to omit the adhesion surface formed with silicon dioxide or the like. It is.

  Thus, even if the 1st resin sealing part 14a is formed with the gel-like fluorine system resin which has the sticky stickiness derived from a gel state and has high viscoelasticity, the 1st resin sealing part 14a and the exterior By providing the second resin sealing portion 14b between them, the first resin sealing portion 14a with sticky stickiness is not exposed, so that it is difficult for dust and dirt to adhere thereto. Therefore, the light emitting device 10 can ensure high reliability even if the first resin sealing portion 14a is formed using a fluorine-based resin instead of the silicone resin as a sealing material.

  In the light emitting device 10 according to the first embodiment, the phosphor 14x is contained in the first resin sealing portion 14a, but the second resin sealing portion 14b is used instead of the first resin sealing portion 14a. You may make it contain the fluorescent substance 14x. By doing so, since the phosphor 14x can be moved away from the light emitting element 12, the influence of heat from the light emitting element 12 to the phosphor 14x can be reduced. As a result, it is possible to suppress a decrease in light emission efficiency (wavelength conversion efficiency) of the phosphor 14x due to heat.

  Next, a modification of the light emitting device according to the first embodiment will be described with reference to FIG. FIG. 5 is a cross-sectional view showing a modification of the light emitting device according to the first embodiment. In FIG. 5, the same components as those in FIG.

  In the light emitting device 10x according to the modification of the first embodiment, the third resin sealing portion 14c that covers the entire light emitting element 12 is provided in the first resin sealing portion 14a. The third resin sealing portion 14c may be formed of a silicone resin or a fluorine resin. Even when the third resin sealing portion 14c is formed of a highly hygroscopic silicone resin, the first resin sealing portion 14a and the second resin sealing portion 14b are formed of a fluorine resin having a low hygroscopic property. Therefore, it is possible to prevent moisture in the atmosphere from reaching the light emitting element 12.

(Embodiment 2)
A light-emitting device according to Embodiment 2 of the present invention will be described with reference to FIGS. FIG. 6 is a plan view showing a light emitting device according to Embodiment 2 of the present invention. 7 is a cross-sectional view of the light emitting device shown in FIG. In the second embodiment, since the light emitting element having the same configuration as that shown in FIGS. 1 and 2 can be used, the same reference numerals are given in FIGS. 6 and 7 and description thereof is omitted.

  The light emitting device 20 shown in FIGS. 6 and 7 includes a protective element 22 and a light emitting element 12 mounted on a base 21 that is a rectangular printed wiring board. The base 21 is provided with a bottom cathode electrode 21v and a bottom anode electrode 21w formed of a metal film on the bottom of a base body 21a formed of ceramic. The bottom cathode electrode 21v is electrically connected to the top cathode electrode 21s on the mounting surface B2 of the base body 21a on which the protection element 22 and the light emitting element 12 are mounted via a through-hole wiring 21x. The bottom anode electrode 21w is conductively connected to the top anode electrode 21t on the mounting surface B2 through the through-hole wiring 21y. The protective element 22 and the light emitting element 12 are conductively connected with the polarity of the anode and the cathode matched so as to straddle the upper surface cathode electrode 21s and the upper surface anode electrode 21t.

  The protection element 22 is a Zener diode and has the same function as the protection element 11 (see FIGS. 1 and 2) used in the light emitting device according to Embodiment 1. The difference is that an electrode (not shown) is provided on the bottom surface of the protection element 22, and the light emitting element 12 is connected to the upper surface cathode electrode 21s and the upper surface anode electrode 21t formed on the base 21.

  The light emitting element 12 is sealed by the first resin sealing portion 23. The light emitting element 12 sealed by the first resin sealing portion 23 is sealed by the second resin sealing portion 24 together with the protection element 22.

  The first resin sealing portion 23 is formed of a fluorinated resin having silicon fluoride (not shown) as a viscosity adjusting material and a phosphor 23a and having a fluorinated polyether skeleton and a silicone crosslinking terminal group. This 1st resin sealing part 23 is formed with the fluorine-type resin hardened | cured in the gel form mentioned above. After mounting the light emitting element 12 on the base 21, the first resin sealing portion 23 arranges a printing plate in which an opening serving as a peripheral wall surrounding the entire periphery of the light emitting element 12 is arranged, and the fluorine-based resin is placed in this opening It can be formed by a screen printing method in which it is filled and molded with a squeegee or the like.

  The 2nd resin sealing part 24 is formed with the fluorine resin which has the fluorinated polyether frame | skeleton containing the silica (not shown) as a viscosity modifier, and a silicone crosslinked terminal group. This fluororesin can be used as a rubber-like resin. After forming the first resin sealing portion 23, the second resin sealing portion 24 is provided with a printing plate in which an opening serving as a peripheral wall surrounding the entire periphery of the base 21 is disposed, and the opening is filled with resin. It can be formed by a screen printing method of molding by leveling with a squeegee or the like.

  Thus, even if the 1st resin sealing part 23 is formed with the gel-like fluororesin which has the sticky stickiness derived from a gel state and has high viscoelasticity, the 1st resin sealing part 23 and the exterior By providing the second resin sealing portion 24 therebetween, the first resin sealing portion 23 with sticky stickiness is not exposed, so that dust and dirt are difficult to adhere. Therefore, the light emitting device 10 can ensure high reliability even if the first resin sealing portion 14a is formed using a fluorine-based resin instead of the silicone resin as a sealing material.

  Further, if the base body 21a is formed of white ceramic, the adhesion between the first resin sealing portion 23 and the second resin sealing portion 24 can be ensured while taking advantage of the reflectivity of the base body 21a itself. .

  In the light emitting device 20 according to the second embodiment, the base body 21a is formed of ceramic so that a new film is not formed as a close contact surface. However, the base body 21a is a resin substrate. In this case, as in the light emitting device 10 according to the first embodiment, a two-layer structure in which a silicon dioxide film is formed on the surface of the base body 21a or a silicon dioxide film is formed on an aluminum film or a silver film. The film can be a close contact surface.

  Further, in the light emitting device 20 according to the second embodiment, the first resin sealing portion 23 contains the phosphor 23a, and the second resin sealing portion 24 covers the entire first resin sealing portion 23. The phosphor 23 a may be contained in the second resin sealing portion 24 instead of the first resin sealing portion 23.

  Further, the second resin sealing portion 24 may use a light-transmitting silicone resin instead of using a fluorine-based resin that is cured in a rubber shape. Even if the second resin sealing portion 24 is formed of a silicone resin having a high hygroscopic property, the first resin sealing portion 23 formed of a fluorine resin having a low hygroscopic property is used as the light emitting element 12 and the second resin sealing portion 24. Therefore, it is possible to prevent moisture in the atmosphere from reaching the light emitting element 12.

  In the present invention, high reliability can be ensured even when a fluorine resin instead of a silicone resin is used as a sealing material. Therefore, a light emitting element, a substrate on which the light emitting element is mounted, and fluorine that seals the light emitting element. It is suitable for a light emitting device provided with a resin sealing portion formed of a system resin.

The top view of the light-emitting device which concerns on embodiment of this invention Sectional drawing of the light-emitting device shown in FIG. Circuit diagram of the light-emitting device shown in FIG. Sectional drawing of the light emitting element used for the light-emitting device shown in FIG. Sectional drawing which shows the modification of the light-emitting device which concerns on this Embodiment 1. FIG. The top view which shows the light-emitting device which concerns on Embodiment 2 of this invention. Sectional drawing of the light-emitting device shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,10x Light-emitting device 11 Protection element 11a Upper surface cathode electrode 11b Upper surface anode electrode 12 Light emitting element 12a Substrate 12b N layer 12c Light emitting layer 12d P layer 12e N side electrode 12f Reflective electrode 12g P side electrode 13 Base 13a Base body 13b Recess 13s Wire Connection pattern 13t Die bond connection pattern 13v Bottom cathode electrode 13w Bottom anode electrode 13x Through hole wiring 13y Through hole wiring 14 Resin sealing portion 14a First resin sealing portion 14b Second resin sealing portion 14c Third resin sealing portion 14x Fluorescence Body 15 Wire 20 Light emitting device 21 Base 21a Base body 21s Upper surface cathode electrode 21t Upper surface anode electrode 21v Bottom surface cathode electrode 21w Bottom surface anode electrode 21x Through-hole wiring 21y Through-hole wiring 22 Protection element 23 1st resin sealing part 23a Phosphor 24 2nd resin sealing part

Claims (4)

In a light emitting device including a light emitting element formed by stacking semiconductors, a base on which the light emitting element is mounted, and a resin sealing portion that seals the light emitting element,
The resin sealing portion is
A first resin sealing portion formed of a gel-like fluorine-based resin covering the entire periphery of the light emitting element;
A light emitting device comprising: a second resin sealing portion having light permeability provided between the first resin sealing portion and the outside. 2. The light emitting device according to claim 1, wherein the second resin sealing portion is formed of a rubber-like fluorine-based resin having a fluorinated polyether skeleton and a silicone crosslinking terminal group. The light emitting device according to claim 1, wherein the second resin sealing portion is formed of a glass plate. 4. The light-emitting device according to claim 1, wherein the first resin sealing portion is formed of a fluorine-based resin having a fluorinated polyether skeleton and a silicone crosslinking terminal group.

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