JP2009158544A - Method of cooling mounted component - Google Patents

Method of cooling mounted component Download PDF

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JP2009158544A
JP2009158544A JP2007332015A JP2007332015A JP2009158544A JP 2009158544 A JP2009158544 A JP 2009158544A JP 2007332015 A JP2007332015 A JP 2007332015A JP 2007332015 A JP2007332015 A JP 2007332015A JP 2009158544 A JP2009158544 A JP 2009158544A
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printed wiring
wiring board
cooling
component
components
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JP4858428B2 (en
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Kazuaki Mino
和明 三野
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Fuji Electric Co Ltd
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Fuji Electric Systems Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of cooling mounted components, capable of efficiently cooling heat-generating components even if the components are mounted on only one surface of a printed wiring board and improving the mounting density of the components. <P>SOLUTION: The plurality of components are each mounted on a printed wiring board so that the thickness of plate-like members each clamped between the mounted components and the printed wiring board may increase from upstream to downstream of a cooling air stream for cooling the mounted components. Thus, a cooling air can be efficiently fed to the mounted components. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、実装部品の冷却方法に係り、特にプリント配線板の一方の面に実装された複数の実装部品を冷却するに好適な実装部品の冷却方法に関する。   The present invention relates to a mounted component cooling method, and more particularly to a mounted component cooling method suitable for cooling a plurality of mounted components mounted on one surface of a printed wiring board.

従来、プリント配線板に実装された発熱部品（例えば、電力用半導体素子）は、この発熱部品の周囲に冷却風が強制的または自然的に供給されて冷却されている。しかしながらこのような冷却方法は、冷却風が供給される風上に位置する実装部品は、効果的に冷却できるものの、冷却風の風下側に位置する実装部品は、風上側の実装部品が発する熱によって冷却風が暖められるため、冷却効果が低下するという問題があった。
また図３に示すように基板３の一方の面に配線導体２を有するプリント配線板に、複数の発熱部品（実装部品）１ａ，１ｂ，１ｃが実装された状態を模式的に示す断面図を参照すればわかるように冷却風の上流側に位置する実装部品１ａには、その側面に冷却風が当たる風量が多い。その一方で、冷却風の下流側に位置する実装部品１ｂ，１ｃは、冷却風が当たる風量が減少するため冷却効果が低下するという問題もある。
もちろん風下側に配置される実装部品に低損失で発熱の少ない部品を用いればよいものの、低損失の部品はコストが高く、装置が高価になるという新たな問題が生じる。
そこでこの種の問題を解決するためになされた回路モジュールの放熱実装構造が提唱されている（例えば、特許文献１参照）。この回路モジュールの放熱実装構造は、冷却風の気流方向に対して実装部品を斜めになるようにプリント配線板に実装することで、各実装部品が冷却風の流れを妨げることなく冷却風を均等に各実装部品に与えるように工夫がなされている。 Conventionally, a heat generating component (for example, a power semiconductor element) mounted on a printed wiring board is cooled by forcibly or naturally supplying cooling air around the heat generating component. However, although such a cooling method can effectively cool a mounted component located on the windward side to which cooling air is supplied, the mounted component located on the leeward side of the cooling air is not heated by the mounted component on the windward side. As a result, the cooling air is warmed, and the cooling effect is reduced.
3 is a cross-sectional view schematically showing a state in which a plurality of heat generating components (mounting components) 1a, 1b, and 1c are mounted on a printed wiring board having a wiring conductor 2 on one surface of a substrate 3, as shown in FIG. As can be seen, the mounting component 1a positioned on the upstream side of the cooling air has a large amount of air that the cooling air hits on its side surface. On the other hand, the mounting components 1b and 1c located on the downstream side of the cooling air have a problem that the cooling effect is reduced because the amount of air that the cooling air hits decreases.
Of course, it is only necessary to use a low-loss and low-heat-generating component for the mounting component disposed on the leeward side, but the low-loss component has a new problem that the cost is high and the device is expensive.
In view of this, a circuit module heat dissipating mounting structure has been proposed in order to solve this type of problem (see, for example, Patent Document 1). The heat dissipation mounting structure of this circuit module is achieved by mounting the mounting components on the printed wiring board so that the mounting components are inclined with respect to the airflow direction of the cooling air. The device is devised to give to each mounted part.

あるいは、別の冷却方法として、プリント配線板の両面に実装部品を配置することで発熱部品を効果的に冷却する方法も一般によく用いられている。
特開平６−９７６２３号公報 Alternatively, as another cooling method, a method of effectively cooling a heat-generating component by arranging mounting components on both surfaces of a printed wiring board is generally used.
JP-A-6-97623

しかしながら、前述した特許文献１に開示される回路モジュールの放熱実装構造は、冷却風の気流方向に対して斜めになるように実装部品をプリント配線板に実装しなければならず、その分、プリント配線板の面積が増大し、引いてはプリント配線板を組み込んだ装置が大きくなるという問題があった。
あるいはプリント配線板に例えば電解コンデンサや磁気部品などが実装され、その高さ方向に制約がある場合は、プリント配線板の両面に部品を配置することができず、放熱効果を高めることができないという問題もある。
本発明は、上述した課題を解決するためになされたもので、その目的とするところは、プリント配線板の一方の面だけにしか部品が実装できない場合であっても効果的に発熱部品の冷却を可能とし、更には部品の実装密度を高めることができる実装部品の冷却方法を提供することにある。 However, the circuit module heat dissipation mounting structure disclosed in Patent Document 1 described above requires mounting components to be mounted on a printed wiring board so as to be inclined with respect to the airflow direction of the cooling air. There is a problem that the area of the wiring board increases, and the apparatus incorporating the printed wiring board becomes larger.
Or, for example, when an electrolytic capacitor or a magnetic component is mounted on the printed wiring board and there is a restriction in the height direction, the components cannot be arranged on both sides of the printed wiring board, and the heat dissipation effect cannot be increased. There is also a problem.
The present invention has been made to solve the above-described problems, and the object of the present invention is to effectively cool a heat generating component even when the component can be mounted only on one surface of a printed wiring board. It is another object of the present invention to provide a method for cooling a mounted component that can increase the mounting density of components.

上述した目的を達成するべく本発明の実装部品の冷却方法は、複数の実装部品をプリント配線板の一方の面に実装した実装部品の冷却方法であって、
複数の前記実装部品は、該実装部品をそれぞれ冷却する冷却気流の風上から風下に向かって該実装部品と前記プリント配線板との間に挟着される板状部材の板厚を増加させて実装したことを特徴としている。
上述の実装部品の冷却方法は、風下側に位置する実装部品ほど、プリント配線板の板面からの高さが高い位置に実装され、各実装部品に均等に冷却風を供給することができ、効果的に実装部品を冷却する。
また前記板状部材は、金属導体であることを特徴としている。この金属導体は、好ましくは熱伝導特性に優れた例えば銅またはアルミニウムであることが望ましい。
上述の実装部品の冷却方法は、実装部品とプリント配線板との間に熱伝導特性に優れた銅またはアルミニウム等の金属導体を挟着するように構成しているので、この金属導体を介して実装部品の熱をプリント配線板に伝達することができ、より効果的に実装部品を冷却できる。
あるいは前記板状部材は、前記プリント配線板と異なる別のプリント配線板であることを特徴としている。つまり、冷却風の風下側に位置する部品が実装される箇所のプリント配線板の積層数（積層枚数）を増加させることで、風下側に位置する実装部品ほど、プリント配線板の板面からの高さが高い位置に実装され、各実装部品に均等に冷却風を供給することができ、効果的に実装部品を冷却する。 In order to achieve the above-described object, the mounting component cooling method of the present invention is a mounting component cooling method in which a plurality of mounting components are mounted on one surface of a printed wiring board,
The plurality of mounted components increase the plate thickness of the plate-like member sandwiched between the mounted component and the printed wiring board from the windward side of the cooling airflow that cools each of the mounted components. It is characterized by being implemented.
The mounting component cooling method described above is mounted at a position where the height from the board surface of the printed wiring board is higher as the mounting component located on the leeward side, and cooling air can be evenly supplied to each mounting component. Effectively cools mounted components.
The plate member is a metal conductor. The metal conductor is preferably made of, for example, copper or aluminum having excellent heat conduction characteristics.
The mounting component cooling method described above is configured such that a metal conductor such as copper or aluminum having excellent heat conduction characteristics is sandwiched between the mounting component and the printed wiring board. The heat of the mounted component can be transmitted to the printed wiring board, and the mounted component can be cooled more effectively.
Alternatively, the plate-like member is another printed wiring board different from the printed wiring board. In other words, by increasing the number of stacked printed wiring boards (number of stacked sheets) where the parts located on the leeward side of the cooling air are mounted, the mounted parts located on the leeward side are separated from the board surface of the printed wiring board. It is mounted at a high position, and the cooling air can be supplied uniformly to each mounted component, effectively cooling the mounted component.

上述したように本発明に係る実装部品の冷却方法によれば、冷却風の風上側から風下側に向かって実装部品とプリント配線板との間に挟着される板状部材の板厚を増加させているので、風下側に位置する実装部品ほど、プリント配線板の板面からの高い位置に実装されるので、各実装部品を効果的に冷却することができる。したがって、本発明に係る実装部品の冷却方法は、冷却風の気流方向に対して実装部品を斜めになるようにプリント配線板に実装する必要もなく、プリント配線板の面積の増大を抑え、更には部品の実装密度を高めることができるとともに、引いては本発明を適用したプリント配線板を組み込んだ装置を小形化することが可能となる。
また本発明の実装部品の冷却方法は、価格の高い低損失の実装部品を使う必要がなく、それ故、システムのコストアップを抑えることができる。さらに本発明の実装部品の冷却方法は、半導体部品などの実装部品の温度を低減させることで発生損失を低下させることができ、引いては装置を高効率化させることが可能になる等の実用上多大なる効果を奏する。 As described above, according to the mounted component cooling method of the present invention, the plate thickness of the plate-like member sandwiched between the mounted component and the printed wiring board is increased from the windward side of the cooling air toward the leeward side. Since the mounting components located on the leeward side are mounted at higher positions from the surface of the printed wiring board, each mounting component can be effectively cooled. Therefore, the mounting component cooling method according to the present invention does not require mounting the mounting component on the printed wiring board so as to be inclined with respect to the airflow direction of the cooling air, and suppresses an increase in the area of the printed wiring board. In addition to increasing the mounting density of components, it is possible to downsize a device incorporating a printed wiring board to which the present invention is applied.
In addition, the mounted component cooling method of the present invention does not require the use of expensive and low-loss mounted components, and therefore can suppress an increase in system cost. Furthermore, the mounted component cooling method of the present invention can reduce the generated loss by reducing the temperature of the mounted component such as a semiconductor component, and thus can be used to increase the efficiency of the apparatus. There is a great effect.

以下、本発明の実施一実施形態に係る実装部品の冷却方法について図１，２の各図面を参照しながら説明する。これらの図中、図３と同一の符号を付した部分は同一物を表わし、基本的な構成は図３に示す従来のものと同様であるので、その説明を省略する。尚、図１，２は、本発明の一実施形態に係る実装部品の冷却方法について説明するための図であって、これらの図によって本発明が限定されるものではない。
＜実施例１＞
さて、図１は、本発明の実施例１に係る実装部品の冷却方法を説明するために描かれたプリント配線板に部品が実装された状態を示す断面図である。この図において１０ａ，１０ｂは、それぞれ実装部品１ｂ，１ｃと、基板３に設けられた配線導体２（プリント配線板）との間に挟着される板状部材である。ちなみに複数の実装部品１ａ，１ｂ，１ｃは、例えばＪＥＤＥＣ ＴＯ−２５２パッケージのような部品である。具体的には、実装部品がＭＯＳＦＥＴであり、ＴＯ−２５２パッケージであれば、そのドレイン等がこのパッケージの裏面の金属部位と接続されている。
一般にこのように構成されたＭＯＳＦＥＴは、プリント配線板の基板３上に設けられた配線導体２（この場合は、サーマルＰＡＤである）にパッケージ裏面の金属部位を密着するように取り付けて、配線導体２との導通を兼ねながら、作動時に生じた熱を配線導体２および基板３を介して空間に放散している。 Hereinafter, a mounting component cooling method according to an embodiment of the present invention will be described with reference to FIGS. In these drawings, the portions denoted by the same reference numerals as those in FIG. 3 represent the same items, and the basic configuration is the same as that of the conventional one shown in FIG. 1 and 2 are views for explaining a mounting component cooling method according to an embodiment of the present invention, and the present invention is not limited to these drawings.
<Example 1>
FIG. 1 is a cross-sectional view showing a state in which components are mounted on a printed wiring board drawn to explain a cooling method for mounted components according to Embodiment 1 of the present invention. In this figure, reference numerals 10a and 10b denote plate-like members sandwiched between the mounting components 1b and 1c and the wiring conductor 2 (printed wiring board) provided on the substrate 3, respectively. Incidentally, the plurality of mounting components 1a, 1b, and 1c are components such as a JEDEC TO-252 package, for example. Specifically, if the mounted component is a MOSFET and the TO-252 package, its drain and the like are connected to the metal part on the back surface of this package.
In general, the MOSFET configured in this manner is attached so that the metal part on the back surface of the package is in close contact with the wiring conductor 2 (in this case, the thermal PAD) provided on the substrate 3 of the printed wiring board. 2, heat generated during operation is dissipated into the space via the wiring conductor 2 and the substrate 3.

また本発明の実施例１に係る実装部品の冷却方法において板状部材１０ａ，１０ｂは、冷却風の風下側に位置する実装部品ほど、プリント配線板の板面からの高さ（板厚方向）を高くして、各実装部品に冷却風が均等に与えられるようにしている。
つまり冷却風の最も風上側に位置する実装部品１ａは、実装部品１ａとプリント配線板（配線導体２または基板３）との間に板状部材を挟着しない。次いでこの実装部品１ａの風下側に位置する実装部品１ｂは、風上側に配置された実装部品１ａよりもプリント配線板の面上からの高さがより高い位置になるように実装部品１ｂとプリント配線板（配線導体２、基板３）との間に挟着する板状部材１０ａの厚みを調整した上で実装される。
同様にこの実装部品１ｂよりも更に冷却風の風下側に位置する実装部品１ｃは、風上側に位置する実装部品１ｂよりもプリント配線板の面上からの高さがより高い位置になるように実装部品１ｃとプリント配線板との間に挟着する板状部材１０ｂの厚みを調整した上で実装される。
かくして本発明は、実装部品とプリント配線板との間に挟着される板状部材の厚みを調整して冷却風の風下側に位置する実装部品ほど、プリント配線板の面上からの高さが高くなるようにしているので、各実装部品１ａ，１ｂ，１ｃに冷却風を均等に与えることができ、高い冷却効果を得ることができる。 Further, in the mounting component cooling method according to the first embodiment of the present invention, the plate-like members 10a and 10b have a height from the plate surface of the printed wiring board (plate thickness direction) as the mounting component is located on the leeward side of the cooling air. The cooling air is given evenly to each mounted component.
That is, the mounting component 1a located on the uppermost side of the cooling air does not sandwich a plate-like member between the mounting component 1a and the printed wiring board (wiring conductor 2 or substrate 3). Next, the mounting component 1b positioned on the leeward side of the mounting component 1a is printed with the mounting component 1b so that the height from the surface of the printed wiring board is higher than that of the mounting component 1a disposed on the leeward side. It is mounted after adjusting the thickness of the plate-like member 10a sandwiched between the wiring boards (wiring conductor 2, substrate 3).
Similarly, the mounting component 1c located further on the leeward side of the cooling air than the mounting component 1b is positioned higher in height from the surface of the printed wiring board than the mounting component 1b located on the upwind side. It mounts, after adjusting the thickness of the plate-shaped member 10b pinched | interposed between the mounting component 1c and a printed wiring board.
Thus, the present invention adjusts the thickness of the plate-like member sandwiched between the mounting component and the printed wiring board so that the mounting component located on the leeward side of the cooling air has a higher height from the surface of the printed wiring board. Therefore, the cooling air can be evenly applied to the mounting components 1a, 1b, and 1c, and a high cooling effect can be obtained.

さらに本発明は、上述した板状部材１０ａ，１０ｂに例えば銅またはアルミニウム等の熱伝導特性に優れた金属導体を用いることが望ましい。本発明は、このような熱伝導特性に優れた板状部材を実装部品とプリント配線板との間に挟着することで、実装部品が生じた熱を板状部材によってプリント配線板に伝達することができ、より効果的に実装部品を冷却することができる。
＜実施例２＞
次に本発明の実施例２に係る実装部品の冷却方法について、図２に示すプリント配線板に実装部品が実装された状態を表す断面図を参照しながら説明する。この実施例２が上述した実施例１と異なる点は、板状部材に代えて、プリント配線板の積層数（積層枚数）を変えて、冷却風の風下側に位置する実装部品にも均等に冷却風が与えられるようにしたところにある。
すなわち本発明の実施例２に係る冷却方法は、冷却風の風下側に実装される実装部品ほどプリント配線基板の積層数（積層枚数）を増加させ、部品をプリント配線板の面上から高い所に位置づけて効果的に冷却風が与えられるようにしている。
つまり冷却風の最も風上側に位置する実装部品１ａは、一枚のプリント配線板上（配線導体２および基板３）に実装される。次いでこの実装部品１ａの風下側に位置する実装部品１ｂは、プリント配線板をさらに一枚以上積み重ね、風上側に位置する実装部品１ａよりも高い位置に実装されるようにプリント配線板の厚みを調整する（図２では、分かり易くするために一枚のプリント配線基板（配線導体２および基板３）を積み重ねている）。 Further, in the present invention, it is desirable to use a metal conductor having excellent heat conduction characteristics such as copper or aluminum for the plate-like members 10a and 10b. In the present invention, a plate-like member having excellent heat conduction characteristics is sandwiched between a mounting component and a printed wiring board, so that heat generated by the mounting component is transmitted to the printed wiring board by the plate-like member. It is possible to cool the mounted component more effectively.
<Example 2>
Next, a mounting component cooling method according to the second embodiment of the present invention will be described with reference to a cross-sectional view showing a state in which the mounting component is mounted on the printed wiring board shown in FIG. The difference between the second embodiment and the first embodiment described above is that, instead of the plate-like member, the number of stacked printed wiring boards (the number of stacked layers) is changed so that the mounting components located on the leeward side of the cooling air are also equal. It is in the place where cooling air was given.
That is, the cooling method according to the second embodiment of the present invention increases the number of stacked printed wiring boards (the number of stacked layers) as the mounted component is mounted on the leeward side of the cooling air, and places the component higher from the surface of the printed wiring board. The cooling air can be effectively given.
That is, the mounting component 1a located on the uppermost side of the cooling air is mounted on one printed wiring board (wiring conductor 2 and substrate 3). Next, the mounting component 1b located on the leeward side of the mounting component 1a is further stacked one or more printed wiring boards, and the thickness of the printed wiring board is set so as to be mounted at a position higher than the mounting component 1a located on the upwind side. (In FIG. 2, one printed wiring board (wiring conductor 2 and board 3) is stacked for easy understanding).

さらにこの実装部品１ｂよりも風下側に位置する実装部品１ｃは、風上側に位置する実装部品１ｂよりもより高い所に位置づけられるようにプリント配線板（配線導体２、基板３）をさらに一枚以上積み重ねて実装される。
かくして本発明に係る実装部品の冷却方法は、冷却風の風下側に位置する実装部品ほど、プリント配線板の板面からの高さが高くなるようにプリント配線板の厚み（積層数、積層枚数）を増やしているので、各実装部品に冷却風を均等に与えることができ、高い冷却効果を得ることができる。
尚、本発明に係る実装部品の冷却方法は、上記した実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々変更を加えてもかまわない。
例えば本発明は、上述した実施例１および実施例２を適宜組みあわせて、風上側に位置する部品の実装高さを低くし、風下側に位置する実装部品の高さが高くなるように位置づければ、上述した各実施例と同様の効果を得ることができる。
勿論、本発明は、発熱量の少ない部品を実装する箇所では実装される部品の高さを低く抑えてプリント配線板に実装する一方、発熱量の多い部品がある箇所では各実装部品に冷却風が均等に与えられるようにプリント配線板に設けられた配線導体との間に挟着される板状部材の板厚を増したり、プリント配線板の積層数（積層枚数）を適宜増したりして調整すればよい。このように本発明の実装部品の冷却方法は、各実装部品に冷却風を均等に与えることができ、高い冷却効果を得ることができる等の実用上多大なる効果を得ることができる。 Furthermore, one more printed wiring board (wiring conductor 2, board 3) is mounted so that the mounting component 1c located on the leeward side of the mounting component 1b is positioned higher than the mounting component 1b located on the leeward side. Stacked and mounted.
Thus, according to the cooling method of the mounted component according to the present invention, the thickness of the printed wiring board (the number of stacked layers and the number of stacked layers) is set so that the mounted component located on the leeward side of the cooling air has a higher height from the surface of the printed wiring board. ) Is increased, cooling air can be evenly applied to each mounted component, and a high cooling effect can be obtained.
The mounting component cooling method according to the present invention is not limited to the above-described embodiment, and various modifications may be made without departing from the scope of the present invention.
For example, the present invention is positioned so that the mounting height of the component located on the leeward side is lowered and the height of the mounting component located on the leeward side is increased by appropriately combining the first and second embodiments described above. Then, the same effects as those of the above-described embodiments can be obtained.
Of course, according to the present invention, in a place where a part with a small amount of heat generation is mounted, the height of the mounted part is kept low and mounted on a printed wiring board. The thickness of the plate-like member sandwiched between the wiring conductors provided on the printed wiring board and the number of printed wiring boards (the number of laminated sheets) is increased as appropriate. Adjust it. As described above, the cooling method for mounted components of the present invention can provide cooling air uniformly to each mounted component, and can obtain practically great effects such as a high cooling effect.

本発明の実施例１に係る実装部品の冷却方法を示す図。The figure which shows the cooling method of the mounting components which concern on Example 1 of this invention. 本発明の実施例２に係る実装部品の冷却方法を示す図。The figure which shows the cooling method of the mounted components which concerns on Example 2 of this invention. 従来のプリント配線板おける実装部品の冷却方法を示す図。The figure which shows the cooling method of the mounting components in the conventional printed wiring board.

符号の説明Explanation of symbols

１ａ，１ｂ，１ｃ 実装部品
２ 配線導体
３ 基板
１０ａ，１０ｂ 板状部材 1a, 1b, 1c Mounting component 2 Wiring conductor 3 Substrate 10a, 10b Plate member

Claims (4)

複数の実装部品をプリント配線板の一方の面に実装した実装部品の冷却方法であって、
複数の前記実装部品は、該実装部品をそれぞれ冷却する冷却気流の風上から風下に向かって該実装部品と前記プリント配線板との間に挟着される板状部材の板厚を増加させて実装したことを特徴とする実装部品の冷却方法。 A cooling method for a mounted component in which a plurality of mounted components are mounted on one surface of a printed wiring board,
The plurality of mounted components increase the plate thickness of the plate-like member sandwiched between the mounted component and the printed wiring board from the windward side of the cooling airflow that cools each of the mounted components. A method for cooling a mounted component, characterized by being mounted. 前記板状部材は、金属導体であることを特徴とする請求項１に記載の実装部品の冷却方法。   The method for cooling a mounted component according to claim 1, wherein the plate-like member is a metal conductor. 前記金属導体は、銅またはアルミニウムであることを特徴とする請求項２に記載の実装部品の冷却方法。   The method for cooling a mounted component according to claim 2, wherein the metal conductor is copper or aluminum. 前記板状部材は、前記プリント配線板と異なる別のプリント配線板であることを特徴とする請求項１に記載の実装部品の冷却方法。   The method for cooling a mounted component according to claim 1, wherein the plate-like member is another printed wiring board different from the printed wiring board.
JP2007332015A 2007-12-25 2007-12-25 Cooling method for mounted parts Expired - Fee Related JP4858428B2 (en)

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JP2017004999A (en) * 2015-06-04 2017-01-05 富士電機株式会社 Thermistor mounting device and thermistor component
US20170273220A1 (en) * 2016-03-18 2017-09-21 Nec Corporation Electronic apparatus and server

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JPH07254794A (en) * 1994-03-16 1995-10-03 Fujitsu Ltd Cooling structure
JP2002270973A (en) * 2001-03-09 2002-09-20 Denso Corp Component mounting structure using radiator plate
JP2004327813A (en) * 2003-04-25 2004-11-18 Toyota Industries Corp Semiconductor device

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JPH07254794A (en) * 1994-03-16 1995-10-03 Fujitsu Ltd Cooling structure
JP2002270973A (en) * 2001-03-09 2002-09-20 Denso Corp Component mounting structure using radiator plate
JP2004327813A (en) * 2003-04-25 2004-11-18 Toyota Industries Corp Semiconductor device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017004999A (en) * 2015-06-04 2017-01-05 富士電機株式会社 Thermistor mounting device and thermistor component
US20170273220A1 (en) * 2016-03-18 2017-09-21 Nec Corporation Electronic apparatus and server
JP2017168779A (en) * 2016-03-18 2017-09-21 日本電気株式会社 Electronic device and server
US10292312B2 (en) 2016-03-18 2019-05-14 Nec Corporation Electronic apparatus and server

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